WO2013181896A1 - 用于表面贴装的led支架及制造方法、led灯 - Google Patents

用于表面贴装的led支架及制造方法、led灯 Download PDF

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Publication number
WO2013181896A1
WO2013181896A1 PCT/CN2012/083509 CN2012083509W WO2013181896A1 WO 2013181896 A1 WO2013181896 A1 WO 2013181896A1 CN 2012083509 W CN2012083509 W CN 2012083509W WO 2013181896 A1 WO2013181896 A1 WO 2013181896A1
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WO
WIPO (PCT)
Prior art keywords
led
package
substrate member
substrate
metal substrate
Prior art date
Application number
PCT/CN2012/083509
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English (en)
French (fr)
Inventor
李漫铁
屠孟龙
谢振胜
Original Assignee
深圳雷曼光电科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority claimed from CN 201220264869 external-priority patent/CN202736970U/zh
Priority claimed from CN2012101846564A external-priority patent/CN102738366A/zh
Application filed by 深圳雷曼光电科技股份有限公司 filed Critical 深圳雷曼光电科技股份有限公司
Publication of WO2013181896A1 publication Critical patent/WO2013181896A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Definitions

  • the invention relates to a light-emitting diode bracket structure, in particular to an LED bracket for surface mounting, a manufacturing method thereof and an LED lamp.
  • LED Light Emitting Diode, light-emitting diodes
  • SMD Surface Mounted Device, surface mount device
  • Figure 1 is a schematic cross-sectional view of a prior art LED holder.
  • the horizontal portion of the portion of the metal substrate 1000 is embedded in the package body 1001.
  • On the upper side of the metal substrate 1000 there is a cup 1002.
  • the cup 1002 is filled with an encapsulant (not labeled).
  • the metal substrate 1000 includes a first substrate member 201 and a second substrate member 202 respectively connected to the positive and negative electrodes of the power source and embedded in the package 1001.
  • the LED chip 1003 is disposed on the second substrate member 202, and the LED chip 1003 is a gold wire.
  • 1004 connects the first substrate member 201, and another gold wire 1004 connects the second substrate member 202.
  • An LED bracket for surface mounting comprising:
  • the metal substrate includes a first substrate member and a second substrate member, each of the first substrate member and the second substrate member including a horizontally extending portion, a vertical extending portion, and a lead;
  • the package body completely covers a horizontal direction extending portion of the metal substrate and at least partially covers the vertical direction extending portion, the surface of the package body located on the upper side of the horizontal direction extending portion forms a cup, and the cup is inside the cup Filled with encapsulant.
  • the pins extend from a side of the package away from the cup.
  • the vertical direction extension comprises at least one bending unit, the package body completely covering the bending unit.
  • the package completely covers the vertical extension.
  • the vertical direction extension and the lead are U-shaped, and the package completely covers the vertical extension.
  • the horizontally extending portion or the vertically extending portion is provided with a protrusion or a groove.
  • the package is made of PPA material and the package is injection molded.
  • the first substrate member and the second substrate member have a symmetrical structure, and the pins of the first substrate member are used to connect the positive pole of the power source, and the pins of the second substrate member are used for connection. Negative power supply.
  • An LED lamp is also provided.
  • An LED lamp comprising:
  • the LED holder for surface mounting described above, wherein the LED chip is disposed on the LED holder.
  • a method of manufacturing an LED mount for surface mounting is also provided.
  • a method for manufacturing a surface mount LED bracket includes the following steps:
  • Forming materials of the first substrate member and the second substrate member are respectively stamped or cast to form a first substrate member and a second substrate member of the metal substrate, the first substrate member and the second substrate member each including a level of interconnection a direction extension and a vertical extension;
  • Injection molding forms a package body and forms a cup on the upper side of the metal substrate, and the package body completely covers the horizontal direction extension portion and at least partially covers the vertical direction extension portion.
  • the method includes:
  • a portion of the vertical direction extension that is not covered by the package is bent to form a lead.
  • the step of bending the portion in which the vertical direction extension is not covered by the package to form a pin comprises:
  • a portion of the vertical direction extension that is not covered by the package is bent to form a pin of a U-shaped structure.
  • the step of separately stamping or casting the first substrate member and the second substrate member to form the interconnected horizontally extending portion and the vertical extending portion includes:
  • the vertical direction extension is stamped or cast cast to form a bending unit.
  • the method includes:
  • the package is completely covered with the horizontal extension and completely covers the bending unit.
  • the LED lamp including the above-described LED holder for surface mounting manufactured by the above-described method for manufacturing a surface mount LED holder has at least the following advantages as compared with the conventional LED lamp:
  • the moisture can be effectively blocked or the moisture can be stopped inside.
  • the structure of the LED bracket is improved, and most or all of the metal substrate is covered in the package, and only a certain area is reserved as a pin, thereby reducing the contact area between the moisture and the metal substrate.
  • the metal substrate is bent in a part of the package body, so that when the LED holder encounters thermal expansion and contraction, the metal substrate does not generate displacement relative to the LED chip, and the path of moisture along the metal substrate enters the interior of the cup holder of the LED holder. The twists and turns increase the path and block the penetration of moisture.
  • the metal substrate is led out from the bottom of the package.
  • the adhesive or solder contacts the bottom of the package and further seals the opening of the package to prevent moisture from entering from the bottom of the package.
  • the inside of the package can effectively prevent moisture from entering from the side.
  • FIG. 1 is a schematic cross-sectional view of a prior art LED holder
  • FIG. 2 is a schematic cross-sectional view of an LED holder for surface mounting according to an embodiment
  • Figure 3 is a top plan view of the LED mount for surface mounting shown in Figure 2;
  • FIG. 4 is a schematic cross-sectional view of a surface mount LED holder according to another embodiment
  • FIG. 5 is a schematic cross-sectional view of a surface mount LED holder according to another embodiment
  • FIG. 6 is a flow chart showing a method of manufacturing a surface mount LED holder according to an embodiment
  • FIG. 7 is a flow chart of a method of manufacturing a surface mount LED holder according to another embodiment
  • FIG. 8 is a flow chart of a method of manufacturing a surface mount LED holder according to another embodiment.
  • FIG. 2 is a schematic cross-sectional view showing a first embodiment of a surface mount LED holder according to an embodiment.
  • the LED holder of the present embodiment includes a metal substrate 1 and a package 2.
  • the metal substrate 1 further includes a first substrate member 11 and a second substrate member 12, each of which includes a horizontal direction extending portion 100, a vertical direction extending portion 101, and a pin 102, wherein The horizontal direction extending portion 100, the vertical direction extending portion 101, and the lead pins 102 are connected end to end in order. Further, the horizontal direction extending portion 100, the vertical direction extending portion 101, and the lead pins 102 are formed by pressing or casting.
  • the metal substrate 1 may be a copper or aluminum alloy substrate.
  • the surface of the package 2 on the upper side of the horizontally extending portion 101 is formed with a cup 3 which is filled with an encapsulant 4.
  • the encapsulant 4 seals the cup 3 .
  • the package 2 completely covers the horizontal extension 100 of the metal substrate 1, and the package 2 completely covers the vertical extension 101.
  • the pin 102 penetrates the package 2, that is, the pin 102 passes through the bottom surface of the package 2. Out.
  • FIG. 3 is a plan view of the first embodiment of the LED bracket for surface mounting shown in FIG. 2.
  • the region of the first substrate member 11 located inside the bowl 3 includes the first region 110, and the first region 110 is connected to the positive electrode of the power source through the pin 102 of the first substrate member 11; the region of the second substrate member 12 located inside the cup 3
  • the second region 120, the third region 121, and the fourth region 122 are included, and the second region 120, the third region 121, and the fourth region 122 are respectively connected to the negative pole of the power source through the pins 102 of the second substrate member 12.
  • the first region 110, the second region 120, the third region 121, and the fourth region 122 are isolated from each other by an insulating material.
  • a red LED chip (not shown), a green LED chip (not shown), and a green LED chip (not shown) may be respectively disposed in the second region 120, the third region 121, and the fourth region 122.
  • a blue LED chip (not shown), one end of each of the gold wires of each color LED chip is connected to its region as its negative electrode, and the other end is connected to the first region 110 as its positive electrode.
  • the color of the LED chip can be selected, such as red or green light or blue light or white light, and is not limited herein.
  • the package 2 completely covers the horizontal extending portion 100 of the metal substrate 1, and the package 2 completely covers the vertical extending portion 101, and the metal is facilitated by extending the contact path between the metal substrate 1 and the package 2.
  • the substrate 1 is tightly coupled with the package 2, and under the influence of thermal expansion and contraction, the metal substrate 1 is not easily displaced relative to the LED chip (not shown), and the gold wire connected to the metal substrate 1 is not Easy to disconnect.
  • the range of the moisture inlet is reduced, which can effectively prevent moisture from entering the bowl 3, thereby prolonging the service life of the LED holder and the LED device.
  • the pin 102 penetrates the package 2 and passes through the bottom surface of the package 2. Solder or bond with LED luminaires and LED screens via pins 102.
  • the open end is also located at the bottom of the package 2.
  • the adhesive or solder contacts the bottom of the package 2, and the pin is further sealed.
  • the gap between the 102 and the package 2 prevents moisture from entering the inside of the package 2 from the bottom of the package 2.
  • FIG. 4 is a schematic cross-sectional view of a second embodiment of an LED mount for surface mounting.
  • the LED holder of the present embodiment includes the metal substrate 21 and the package 22 which are identical or similar to those of the first embodiment, and are distinguished by:
  • the respective vertical extensions 2101 of the first substrate member 211 and the second substrate member 212 included in the metal substrate 21 include at least one bending unit 300. Further, the package body 22 completely covers the respective horizontal direction extensions 2100 of the first substrate member 211 and the second substrate member 212, and the package body 22 completely covers the respective vertical portions of the first substrate member 211 and the second substrate member 212.
  • the bending unit 300 is provided at one end of the vertical extending portion 2101 near the horizontal extending portion 2100.
  • the other portion of the vertical direction extension 2101 except the bending unit 300 is not covered by the package 22, and the pin 2102 is also not covered by the package 22.
  • the vertical direction extension 2101 can include a plurality of bending units 300, and the vertical direction extensions 2101 are in a zigzag shape. Also, the vertical direction extending portion 2101 is completely covered by the package body 22.
  • the vertical direction extending portion 2101 includes at least one bending unit 300, the package body 22 completely covers the horizontal direction extending portion 2100, and the package body 22 completely covers the bending unit 300, which is limited in the LED bracket.
  • the contact path between the metal substrate 21 and the package body 22 is extended within the region, which facilitates the tight bonding of the metal substrate 21 and the package body 22.
  • the LED substrate 21 is less likely to generate relative LED chips under the influence of thermal expansion and contraction.
  • the displacement of the metal chip connected to the metal substrate 21 by the LED chip is not easily broken.
  • moisture enters the inside of the cup 23 it is possible to enter through the metal substrate 21 for a long distance upward, which can effectively prevent moisture from entering the inside of the cup 23, thereby prolonging the service life of the LED holder and the LED device. .
  • FIG. 5 is a schematic cross-sectional view of a third embodiment of an LED mount for surface mounting.
  • the LED holder of the present embodiment includes the metal substrate 31 and the package 32 which are identical or similar to those of the first embodiment. The difference is:
  • the vertical direction extending portion 3101 and the lead 3102 have a U-shaped structure, and the package body 32 completely covers the horizontal extension portions 3100 of the first substrate member 311 and the second substrate member 312, and the package body 32 completely covers the vertical direction. Department 3101.
  • the vertical extending portion 3101 and the lead 3102 are disposed in a U-shaped configuration, and the side of the lead 3102 adjacent to the package 32 is in contact with the outer side of the package 32.
  • the principle is still to extend the contact path between the metal substrate 31 and the package body 32, and to facilitate the tight bonding of the metal substrate 31 and the package body 32.
  • the metal substrate 31 is not easy to generate relative LED chips.
  • the displacement of the (not shown), the gold wire connected to the metal substrate 31 by the LED chip is not easily broken.
  • the range of the moisture inlet is reduced, which can effectively prevent moisture from entering the inside of the cup 33, thereby prolonging the service life of the LED holder and the LED device.
  • the metal substrate is a copper or aluminum alloy substrate.
  • one or more protrusions or grooves may be provided in the horizontal extension portion or the vertical direction extension portion, and the additional protrusion or groove increases the surface area of the metal substrate, which is equivalent to extending the metal.
  • the contact path between the substrate and the package has an effect of improving the bonding between the metal substrate and the package.
  • the package may be a PPA (poly(p-phenylene terephthalamide) material, and the package is injection molded.
  • first substrate member and the second substrate member may be designed as a symmetrical structure, and the first substrate member and the second substrate member adopt a symmetrical structure design to reduce the mold and thereby reduce the production cost.
  • first substrate member and the second substrate member are symmetrically distributed in the package body, when the metal substrate is thermally expanded and contracted, the forces between the first substrate member and the second substrate member and the sealing body can cancel each other, and The relative displacement between the metal substrate and the LED chip is reduced to some extent, and the gold wire connected to the metal substrate 31 of the LED chip is prevented from being disconnected.
  • the pins of the first substrate member are used for connecting the positive pole of the power source
  • the pins of the second substrate member are used for connecting the negative pole of the power source.
  • the first substrate member and the second substrate member may also be designed as an asymmetric structure, first The pins of the substrate member can also be used to connect the negative pole of the power supply, and the pins of the second substrate member can be used to connect the positive pole of the power supply, depending on the specific needs.
  • the package completely covers the horizontal extension portion of each of the first substrate member and the second substrate member in the metal substrate and at least partially covers the vertical direction extension portion, and the pin penetrates the package body to extend the contact path between the metal substrate and the package body And can reduce the moisture inlet range, so that moisture does not easily enter the inside of the cup, so that the metal substrate does not cause displacement relative to the LED chip due to the tensile force generated by the package under the influence of thermal expansion and contraction, and can effectively
  • the gold wire of the LED chip (not shown) is prevented from being disconnected from the metal substrate, thereby prolonging the life of the LED bracket.
  • an LED lamp comprising the LED mount for surface mounting of any of the above embodiments.
  • the LED chip is disposed on the LED bracket.
  • the LED chip is disposed on the first substrate member, the positive electrode of the LED chip is connected to the first substrate member, and the negative electrode of the LED chip is connected to the second substrate member; or the LED chip is disposed on the second substrate member, and the positive electrode of the LED chip is connected to the first substrate member, and the LED The negative electrode of the chip is connected to the second substrate member.
  • the package completely covers the horizontal extension of each of the first substrate member and the second substrate member of the metal substrate and at least partially covers the vertical extension portion, and the pin penetrates the package body to extend the metal substrate and
  • the contact path of the package reduces the moisture inlet range, so that moisture does not easily enter the inside of the cup, so that the package and the metal substrate are not displaced by thermal expansion and contraction, and the gold wire of the LED chip can be effectively avoided. Disconnected from the metal substrate to extend the life of the LED holder, thereby extending the life of the LED lamp.
  • a method of manufacturing an LED mount for surface mounting is also provided.
  • FIG. 6 is a flow chart of a first embodiment of a method for manufacturing a surface mount LED holder.
  • the method for manufacturing a surface mount LED holder of the present embodiment includes the following steps:
  • Step S11 preparing a first substrate member and a second substrate member of the metal substrate to prepare a material.
  • the preparation material is a unitary structure, and the preparation material of the overall structure is divided into two by cutting before forming the first substrate member and the second substrate member.
  • Step S12 stamping or casting the preparation materials of the first substrate member and the second substrate member respectively to form a first substrate member and a second substrate member of the metal substrate, the first substrate member and the second substrate member each including a horizontal direction connected to each other An extension and a vertical extension.
  • step S13 the package body is injection molded and the cup is formed on the upper side of the metal substrate, and the package body completely covers the horizontal direction extending portion and at least partially covers the vertical direction extending portion.
  • the horizontal extension portion and the vertical direction extension portion are connected to each other on the first substrate member and the second substrate member of the metal substrate, and the package body completely covers the horizontal direction extension portion and at least partially covers the vertical portion.
  • the direction extending portion can extend the contact path between the metal substrate and the package body, and reduce the moisture inlet range, so that moisture does not easily enter the inside of the cup, so that it is difficult for the package body and the metal substrate to be displaced due to thermal expansion and contraction. It can effectively prevent the gold wire of the LED chip from being disconnected from the metal substrate, and prolong the service life of the LED bracket and the LED device.
  • FIG. 7 is a flow chart of a second embodiment of a method for manufacturing a surface mount LED holder.
  • the steps of the method for manufacturing the surface mount LED holder of the present embodiment include steps S21 to S23 which are the same as or similar to those in the first embodiment, except that it further includes:
  • step S24 the portion of the vertical direction extension that is not covered by the package is bent to form a pin.
  • the bending of the pins is generally also carried out by means of stamping or casting, and of course, other methods can be used, and there is no limitation here.
  • the portion in which the vertical direction extending portion is not covered by the package may be bent.
  • the side of the U-shaped structure near the package contacts the surface of the package.
  • the portion in which the vertical direction extending portion is not covered by the package body is bent to form a pin of the U-shaped structure, and the contact path between the metal substrate and the package body can be extended, and moisture can be blocked from entering. It can completely solve the moisture entering the inside of the cup from the side of the LED bracket, and does not affect the production, and can be fully compatible with the existing equipment and process.
  • FIG. 8 is a flow chart of a third embodiment of a method of manufacturing a surface mount LED holder. This embodiment includes the following steps:
  • Step S31 preparing a first substrate member and a second substrate member of the metal substrate to prepare a material.
  • Step S32 stamping or casting the preparation materials of the first substrate member and the second substrate member respectively to form a first substrate member and a second substrate member of the metal substrate, the first substrate member and the second substrate member each including a horizontal direction connected to each other
  • the extension portion and the vertical direction extension portion, and the vertical direction extension portion is stamped or cast to form at least one bending unit.
  • step S33 the package body is injection molded and the cup is formed on the upper side of the metal substrate, and the package body completely covers the horizontal extension portion and completely covers the bending unit.
  • the contact path between the metal substrate and the package body is extended within a limited area of the LED holder, which contributes to the tight bonding of the metal substrate and the package body, and the LED bracket Under the influence of thermal expansion and contraction, the metal substrate is not easy to produce displacement relative to the LED chip, and the gold wire connected to the metal substrate by the LED chip is not easily broken.
  • moisture enters the inside of the cup it is possible to enter through the long distance of the side metal substrate, which can effectively prevent moisture from entering the inside of the cup, thereby prolonging the service life of the LED holder and the LED device.
  • the above-mentioned LED bracket and LED lamp for surface mounting have at least the following advantages:
  • the metal substrate is led out from the bottom of the package.
  • the adhesive or solder contacts the bottom of the package 2, and further seals the opening of the package 2 to prevent moisture from being encapsulated.
  • the bottom of the body 2 enters the inside of the package 2, and moisture can be effectively prevented from entering from the side.

Abstract

一种用于表面贴装的LED支架、其制造方法以及LED灯。支架包括金属基板（1，21，31）和封装体（2，22，32）。金属基板（1，21，31）包括第一基板件（11，211，311）和第二基板件（12，212，312）。第一基板件（11，211，311）和第二基板件（12，212，312）均包括依次相连的水平方向延伸部（100，2100，3100）、竖直方向延伸部（101，2101，3101）以及引脚（102，2102，3102）。封装体（2，22，32）完全覆盖金属基板（1，21，31）的水平方向延伸部（100，2100，3100）并且至少部分覆盖竖直方向延伸部（101，2101，3101）。封装体（2，22，32）位于水平方向延伸部（100，2100，3100）上侧的表面形成碗杯（3，23，33），碗杯（3，23，33）内填充有封装胶（4）。本表面贴装的LED支架能够防止金属基板受热胀冷缩影响而产生的位移，防止湿气进入碗杯内部，延伸LED寿命。

Description

用于表面贴装的LED支架及制造方法、LED灯
【技术领域】
本发明涉及一种发光二极管支架结构，特别涉及一种用于表面贴装的LED支架及制造方法、LED灯。
【背景技术】
随着LED（Light Emitting Diode，发光二极管）照明技术的日益发展，LED在人们日常生活中的应用也越来越广泛。目前LED一般采用SMD（Surface Mounted Device，表面贴装器件）支架结构。
参阅图1，图1是现有技术LED支架的截面示意图。部分金属基板1000的水平部分埋设于封装体1001内，在金属基板1000上侧有碗杯1002，碗杯1002中填充封装胶（未标示）。其中，金属基板1000包括分别连接电源正极和负极并埋设于封装体1001内的第一基板件201和第二基板件202，LED芯片1003设置于第二基板件202上，LED芯片1003一金线1004连接第一基板件201，另一金线1004连接第二基板件202。
然而，由于金属基板1000与封装体1001的接触路径太短，导致湿气很容易顺着金属基板1000与封装体1001之间的缝隙进入碗杯内部，并且，在LED芯片1003长时间发光时，受热胀冷缩影响，金属基板1000与封装体1001之间可能产生位移，金线1004容易从金属基板1000上断开，从而形成电路断开，造成产品失效。
【发明内容】
基于此，有必要提供一种能够有效防止金属基板受热胀冷缩影响产生位移，并且能够有效防止湿气进入碗杯内部，延长LED支架的使用寿命的用于表面贴装的LED支架。
一种用于表面贴装的LED支架，包括：
金属基板和封装体；
所述金属基板包括第一基板件和第二基板件，所述第一基板件和第二基板件均包括依次相连的水平方向延伸部、竖直方向延伸部以及引脚；
其中，所述封装体完全覆盖金属基板的水平方向延伸部并且至少部分覆盖所述竖直方向延伸部，所述封装体位于水平方向延伸部上侧的表面形成碗杯，并且所述碗杯内填充有封装胶。
在其中一实施方式中，所述引脚从所述封装体远离所述碗杯的一侧延伸出。
在其中一实施方式中，所述竖直方向延伸部包括至少一弯折单元，所述封装体完全覆盖弯折单元。
在其中一实施方式中，所述封装体完全覆盖所述竖直方向延伸部。
在其中一实施方式中，所述竖直方向延伸部与引脚呈U型结构，并且所述封装体完全覆盖竖直方向延伸部。
在其中一实施方式中，所述水平方向延伸部或竖直方向延伸部设有凸起或凹槽。
在其中一实施方式中，所述封装体采用PPA材料，并且所述封装体为注塑成型。
在其中一实施方式中，所述第一基板件和第二基板件为对称结构，且所述第一基板件的引脚用于连接电源正极，所述第二基板件的引脚用于连接电源负极。
还提供一种LED灯。
一种LED灯，包括：
LED芯片；
上述述的用于表面贴装的LED支架，所述LED芯片设于所述LED支架上。
还提供一种用于表面贴装的LED支架的制造方法。
一种用于表面贴装的LED支架的制造方法，包括如下步骤：
准备金属基板的第一基板件和第二基板件制备材料；
将所述第一基板件和第二基板件的制备材料分别冲压或铸造形成金属基板的第一基板件和第二基板件，所述第一基板件和第二基板件均包括相互连接的水平方向延伸部和竖直方向延伸部；
注塑形成封装体以及在所述金属基板上侧形成碗杯，并使所述封装体完全覆盖水平方向延伸部以及至少部分覆盖竖直方向延伸部。
在其中一实施方式中，在所述注塑形成封装体以及在金属基板上侧形成碗杯，并使封装体完全覆盖水平方向延伸部以及至少部分覆盖竖直方向延伸部的步骤之后，包括：
将所述竖直方向延伸部未被封装体覆盖的部分进行弯折以形成引脚。
在其中一实施方式中，在所述将竖直方向延伸部未被封装体覆盖的部分进行弯折以形成引脚的步骤中，包括：
将所述竖直方向延伸部未被封装体覆盖的部分进行弯折以形成U型结构的引脚。
在其中一实施方式中，在所述将第一基板件和第二基板件分别冲压或铸塑铸造形成相互连接的水平方向延伸部和竖直方向延伸部的步骤中，包括：
将所述竖直方向延伸部冲压或铸塑铸造形成一弯折单元。
在其中一实施方式中，在所述使封装体完全覆盖水平方向延伸部以及部分覆盖竖直方向延伸部的步骤中，包括：
使所述封装体完全覆盖水平方向延伸部以及完全覆盖弯折单元。利用上述用于表面贴装的LED支架的制造方法制造的含有上述用于表面贴装的LED支架的LED灯与传统的LED灯相比，至少具有以下优点：
首先，能有效将湿气挡之于外，或者是使湿气在其内部停止流动。
其次，改进LED支架的结构，把金属基板大部分或全部区域覆盖于封装体中，只需预留一定面积区域作为引脚即可，减少湿气与金属基板的接触面积。
再次，将金属基板在封装体内部分区域进行弯折，使LED支架遇到热胀冷缩时，金属基板不产生相对LED芯片的位移，并且湿气沿金属基板进入LED支架的碗杯内部的路径曲折，增长了路径，能够阻挡湿气的渗透。
而且，金属基板从封装体底部导出，当进行粘接或焊接封装体的时候，粘胶或焊料与封装体的底部相接触，并进一步密封封装体的开口，防止湿气从封装体的底部进入到封装体的内部，可以有效防止湿气从侧面进入。
【附图说明】
图1是现有技术LED支架的截面示意图；
图2为一实施方式的用于表面贴装的LED支架的截面示意图；
图3为图2所示用于表面贴装的LED支架的俯视图；
图4为另一实施方式的用于表面贴装的LED支架的截面示意图；
图5为另一实施方式的用于表面贴装的LED支架的截面示意图；
图6为一实施方式的用于表面贴装的LED支架的制造方法的流程图；
图7为另一实施方式的用于表面贴装的LED支架的制造方法的流程图；
图8为另一实施方式的用于表面贴装的LED支架的制造方法的流程图。
【具体实施方式】
为了便于理解本发明，下面将参照相关附图对本发明进行更全面的描述。附图中给出了本发明的较佳实施方式。但是，本发明可以以许多不同的形式来实现，并不限于本文所描述的实施方式。相反地，提供这些实施方式的目的是使对本发明的公开内容理解的更加透彻全面。
需要说明的是，当元件被称为“固定于”另一个元件，它可以直接在另一个元件上或者也可以存在居中的元件。当一个元件被认为是“连接”另一个元件，它可以是直接连接到另一个元件或者可能同时存在居中元件。本文所使用的术语“垂直的”、“水平的”、“左”、“右”以及类似的表述只是为了说明的目的，并不表示是唯一的实施方式。
除非另有定义，本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体的实施方式的目的，不是旨在于限制本发明。本文所使用的术语“及／或”包括一个或多个相关的所列项目的任意的和所有的组合。
请参阅图2，图2为一实施方式的用于表面贴装的LED支架的第一实施方式的截面示意图。本实施方式的LED支架包括：金属基板1和封装体2。
金属基板1进一步包括第一基板件11和第二基板件12，第一基板件11和第二基板件12各自均包括水平方向延伸部100、竖直方向延伸部101以及引脚102，其中，水平方向延伸部100、竖直方向延伸部101以及引脚102依次首尾连接。并且水平方向延伸部100、竖直方向延伸部101以及引脚102通过冲压或铸造等方式成型。金属基板1可以为铜或者铝合金基板。
封装体2位于水平方向延伸部101上侧的表面形成有碗杯3，碗杯3内填充有封装胶4。封装胶4将碗杯3进行密封。
其中，封装体2完全覆盖金属基板1的水平方向延伸部100，并且封装体2完全覆盖竖直方向延伸部101，引脚102穿透封装体2，即引脚102自封装体2的底面穿出。
参阅图3，图3为图2所示用于表面贴装的LED支架第一实施方式的俯视图。
第一基板件11位于碗杯3内部的区域包括第一区域110，并且第一区域110通过第一基板件11的引脚102连接到电源正极；第二基板件12位于碗杯3内部的区域包括第二区域120、第三区域121以及第四区域122，并且第二区域120、第三区域121以及第四区域122通过第二基板件12的引脚102分别连接到电源负极。第一区域110、第二区域120、第三区域121以及第四区域122通过绝缘材料相互隔离。在实现全色彩显示时，碗杯3中，第二区域120、第三区域121以及第四区域122中可以分别设置红光LED芯片（图未示）、绿光LED芯片（图未示）以及蓝光LED芯片（图未示），各色彩LED芯片的金线一端各自连接到其所在区域作为其负极，另一端均连接到第一区域110作为其正极。当然，视具体需求而定，在碗杯3中可以仅设置一颗LED芯片，该LED芯片的颜色可自选，比如为红光或者绿光或者蓝光或者白光等，此处不作过多限制。
本实施方式中，封装体2完全覆盖金属基板1的水平方向延伸部100，并且封装体2完全覆盖竖直方向延伸部101，通过延长金属基板1与封装体2的接触路径，有助于金属基板1与封装体2的紧密结合，LED支架在热胀冷缩影响下，金属基板1不容易产生相对LED芯片（图未示）的位移，LED芯片连接到金属基板1上的金线就不容易断开。同时湿气入口的范围得到减小，能够有效防止湿气进入碗杯3内，进而延长LED支架及LED器件的使用寿命。并且，引脚102穿透封装体2，从封装体2的底面穿出。通过引脚102与LED灯具、LED屏幕进行焊接或粘接。由于引脚102从封装体2的底部引出，则开口端也位于封装体2的底部，当进行粘接或焊接的时候，粘胶或焊料与封装体2的底部相接触，并进一步密封引脚102与封装体2之间的间隙，防止湿气从封装体2的底部进入到封装体2的内部。
参阅图4，图4为用于表面贴装的LED支架第二实施方式的截面示意图。本实施方式的LED支架包括与第一实施方式中结构和功能相同或相似的金属基板21和封装体22，其区别之处在于：
金属基板21包括的第一基板件211、第二基板件212中各自的竖直方向延伸部2101包括至少一弯折单元300。进一步地，封装体22完全覆盖第一基板件211、第二基板件212中各自的水平方向延伸部2100，并且封装体22完全覆盖第一基板件211、第二基板件212中各自的竖直方向延伸部2101的弯折单元300。
具体在本实施方式中，弯折单元300设于竖直方向延伸部2101靠近水平方向延伸部2100的一端。竖直方向延伸部2101中除弯折单元300的另一部分未被封装体22覆盖，引脚2102也未被封装体22覆盖。
可以理解，竖直方向延伸部2101可以包括多个弯折单元300，则竖直方向延伸部2101呈锯齿状。并且，竖直方向延伸部2101被封装体22完全覆盖。
在本实施方式中，竖直方向延伸部2101包括至少一弯折单元300，封装体22完全覆盖水平方向延伸部2100，并且封装体22完全覆盖该弯折单元300，通过在LED支架中有限的区域之内延长金属基板21与封装体22的接触路径，有助于金属基板21与封装体22的紧密结合，LED支架在热胀冷缩影响下，金属基板21不容易产生相对LED芯片（图未示）的位移，LED芯片连接到金属基板21上的金线就不容易断开。另外，并且湿气如果要进入碗杯23内部，就要通过金属基板21向上的较长距离才有可能进入，能够有效阻止湿气进入碗杯23内部，进而延长LED支架及LED器件的使用寿命。
参阅图5，图5为用于表面贴装的LED支架第三实施方式的截面示意图。本实施方式的LED支架包括与第一实施方式中结构和功能相同或相似的金属基板31和封装体32。其区别在于：
竖直方向延伸部3101与引脚3102呈U型结构，封装体32完全覆盖第一基板件311、第二基板件312中各自的水平方向延伸部3100，并且封装体32完全覆盖竖直方向延伸部3101。
具体在本实施方式中，将竖直方向延伸部3101与引脚3102设置成呈U型结构，且引脚3102靠近封装体32的一侧与封装体32的外侧相接触。其原理仍然为通过延长金属基板31与封装体32的接触路径，有助于金属基板31与封装体32的紧密结合，LED支架在热胀冷缩情况下，金属基板31不容易产生相对LED芯片（图未示）的位移，LED芯片连接到金属基板31上的金线就不容易断开。同时湿气入口的范围得到减小，能够有效防止湿气进入碗杯33内部，进而延长LED支架及LED器件的使用寿命。
在上述实施方式中，金属基板是铜或者铝合金基板。并且，在水平方向延伸部或竖直方向延伸部可以设有一个或多个凸起或凹槽（图未示），增设的凸起或凹槽即增加金属基板的表面积，也相当于延长金属基板与封装体的接触路径，对金属基板和封装体的结合性有提高作用。并且，封装体可以采用PPA（聚对苯二酰对苯二胺）材料，并且封装体通过注塑成型。
值得注意的是，第一基板件和第二基板件可以设计为对称结构，第一基板件和第二基板件采用对称结构设计能够减少模具从而降低生产成本。并且，第一基板件与第二基板件对称分布在封装体内，金属基板发生热胀冷缩的时候，第一基板件及第二基板件与封胶体之间的受力能够相互抵消，能够在一定程度上减小金属基板与LED芯片之间发生相对位移，防止LED芯片连接到金属基板31上的金线断开。
进一步地，第一基板件的引脚用于连接电源正极，第二基板件的引脚用于连接电源负极，当然，第一基板件和第二基板件也可以设计为非对称结构，第一基板件的引脚也可以用于连接电源负极，第二基板件的引脚可以用于连接电源正极，视具体需求而定。
综合上述实施方式所述，可知：
封装体完全覆盖金属基板中第一基板件和第二基板件各自的水平方向延伸部以及至少部分覆盖竖直方向延伸部，同时引脚穿透封装体，能够延长金属基板与封装体的接触路径，并能够减小湿气入口范围，使得湿气不容易进入到碗杯内部，从而金属基板不会因为封装体在热胀冷缩影响下产生的拉力而导致产生相对LED芯片的位移，能够有效避免LED芯片（图未示）的金线与金属基板断开，进而能够延长LED支架的寿命。
还提供一种LED灯，LED灯包括及上述任一项实施方式的用于表面贴装的LED支架。LED芯片设于LED支架上。
LED芯片设置于第一基板件，LED芯片的正极连接第一基板件，LED芯片的负极连接第二基板件；或者LED芯片设置于第二基板件，LED芯片的正极连接第一基板件，LED芯片的负极连接第二基板件。
上述LED灯具中，封装体完全覆盖金属基板中第一基板件和第二基板件各自的水平方向延伸部以及至少部分覆盖竖直方向延伸部，同时引脚穿透封装体，能够延长金属基板与封装体的接触路径，减小湿气入口范围，使得湿气不容易进入到碗杯内部，使得封装体与金属基板之间不会因为热胀冷缩产生位移，能够有效避免LED芯片的金线与金属基板断开，延长LED支架的使用寿命，进而延长LED灯的使用寿命。
还提供一种用于表面贴装的LED支架的制造方法。
参阅图6，图6为用于表面贴装的LED支架的制造方法第一实施方式的流程图。本实施方式的用于表面贴装的LED支架的制造方法包括如下步骤：
步骤S11，准备金属基板的第一基板件和第二基板件制备材料。
当然，一般该制备材料为一块整体结构，在形成第一基板件和第二基板件之前，通过切割的方式将该整体结构的制备材料一分为二。步骤S12，将第一基板件和第二基板件的制备材料分别冲压或铸造形成金属基板的第一基板件和第二基板件，第一基板件和第二基板件均包括相互连接的水平方向延伸部和竖直方向延伸部。
步骤S13，注塑形成封装体以及在金属基板上侧形成碗杯，并使封装体完全覆盖水平方向延伸部以及至少部分覆盖竖直方向延伸部。
具体在实施方式中，在金属基板的第一基板件和第二基板件上形成相互连接的水平方向延伸部和竖直方向延伸部，且封装体完全覆盖水平方向延伸部以及至少部分覆盖竖直方向延伸部，能够延长金属基板与封装体的接触路径，减小湿气入口范围，使得湿气不容易进入到碗杯内部，使得封装体与金属基板之间难以因为热胀冷缩产生位移，能够有效避免LED芯片的金线与金属基板断开，延长LED支架及LED器件的使用寿命。
参阅图7，图7为用于表面贴装的LED支架的制造方法第二实施方式的流程图。本实施方式的用于表面贴装的LED支架的制造方法的步骤包括与第一实施方式中相同或相似的步骤S21至步骤S23，其不同之处在于，其进一步包括：
步骤S24，将竖直方向延伸部未被封装体覆盖的部分进行弯折以形成引脚。
当然，引脚的弯折一般也通过冲压或铸造的方式进行，当然也可以通过其它方式，此处不作过多限制。
值得注意的是，在步骤S24中，即在将竖直方向延伸部未被封装体覆盖的部分进行弯折以形成引脚时，可以将竖直方向延伸部未被封装体覆盖的部分进行弯折以形成U型结构的引脚。并且，U型结构的引脚靠近封装体的一侧与封装体的表面相接触。
在本实施方式中，将竖直方向延伸部未被封装体覆盖的部分进行弯折以形成U型结构的引脚，能够延长金属基板与封装体之间的接触路径，可以阻挡湿气进入，能完全解决湿气从LED支架的侧面进入碗杯内部，并且不影响生产，能完全兼容现有的设备及工艺制程。
参阅图8，图8为用于表面贴装的LED支架的制造方法的第三实施方式的流程图。本实施方式包括以下步骤：
步骤S31，准备金属基板的第一基板件和第二基板件制备材料。
步骤S32，将第一基板件和第二基板件的制备材料分别冲压或铸造形成金属基板的第一基板件和第二基板件，第一基板件和第二基板件均包括相互连接的水平方向延伸部和竖直方向延伸部，并且将竖直方向延伸部经冲压或铸造形成至少一个弯折单元。
步骤S33，注塑形成封装体以及在金属基板上侧形成碗杯，并使封装体完全覆盖水平方向延伸部以及完全覆盖弯折单元。
本实施方式，通过在竖直方向延伸部形成弯折单元，使得在LED支架中有限的区域之内延长金属基板与封装体的接触路径，有助于金属基板与封装体的紧密结合，LED支架在热胀冷缩影响下，金属基板不容易产生相对LED芯片的位移，LED芯片连接到金属基板上的金线就不容易断开。另外，并且湿气如果要进入碗杯内部，就要通过侧面金属基板向上的较长距离才有可能进入，能够有效阻止湿气进入碗杯内部，进而延长LED支架及LED器件的使用寿命。
综上所述，上述用于表面贴装的LED支架及LED灯至少具有如下优点：
（1）能有效将湿气挡之于外，或者是使湿气在其内部停止流动；
（2）改进LED支架的结构，把金属基板大部分或全部区域覆盖于封装体中，只需预留一定面积区域作为引脚即可，减少湿气与金属基板的接触面积；
（3）将金属基板在封装体内部分区域进行弯折，使LED支架遇到热胀冷缩时，金属基板不产生相对LED芯片的位移，并且湿气沿金属基板进入LED支架的碗杯内部的路径曲折，增长了路径，能够阻挡湿气的渗透；
（4）金属基板从封装体底部导出，当进行粘接或焊接封装体2的时候，粘胶或焊料与封装体2的底部相接触，并进一步密封封装体2的开口，防止湿气从封装体2的底部进入到封装体2的内部，可以有效防止湿气从侧面进入。
以上所述实施方式仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对本发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。

Claims (14)

  1. 一种用于表面贴装的LED支架，其特征在于，包括：
    金属基板（1）和封装体（2）；
    所述金属基板（1）包括第一基板件（11）和第二基板件（12），所述第一基板件和第二基板件（12）均包括依次相连的水平方向延伸部（100）、竖直方向延伸部（101）以及引脚（102）；
    其中，所述封装体（2）完全覆盖金属基板（1）的水平方向延伸部（100）并且至少部分覆盖所述竖直方向延伸部（101），所述封装体（2）位于水平方向延伸部（100）上侧的表面形成碗杯（3），并且所述碗杯（3）内填充有封装胶（4）。
  2. 根据权利要求1所述的用于表面贴装的LED支架，其特征在于，所述引脚（102）从所述封装体（2）远离所述碗杯（3）的一侧延伸出。
  3. 根据权利要求1所述的用于表面贴装的LED支架，其特征在于，所述竖直方向延伸部（2101）包括至少一弯折单元（300），所述封装体（22）完全覆盖弯折单元（300）。
  4. 根据权利要求1所述的用于表面贴装的LED支架，其特征在于，所述封装体（2）完全覆盖所述竖直方向延伸部（101）。
  5. 根据权利要求1所述的用于表面贴装的LED支架，其特征在于，所述竖直方向延伸部（3101）与引脚（3102）呈U型结构，并且所述封装体（2）完全覆盖竖直方向延伸部（101）。
  6. 根据权利要求1所述的用于表面贴装的LED支架，其特征在于，所述水平方向延伸部（100）或竖直方向延伸部（101）设有凸起或凹槽。
  7. 根据权利要求1所述的用于表面贴装的LED支架，其特征在于，所述封装体（2）采用PPA材料，并且所述封装体（2）为注塑成型。
  8. 根据权利要求1所述的用于表面贴装的LED支架，其特征在于，所述第一基板件（11）和第二基板件（12）为对称结构，且所述第一基板件（11）的引脚（102）用于连接电源正极，所述第二基板件（12）的引脚（102）用于连接电源负极。
  9. 一种LED灯，其特征在于，包括：
    LED芯片；
    如权利要求1-8任意一项所述的用于表面贴装的LED支架，所述LED芯片设于所述LED支架上。
  10. 一种用于表面贴装的LED支架的制造方法，其特征在于，包括如下步骤：
    准备金属基板的第一基板件和第二基板件制备材料；
    将所述第一基板件和第二基板件的制备材料分别冲压或铸造形成金属基板的第一基板件和第二基板件，所述第一基板件和第二基板件均包括相互连接的水平方向延伸部和竖直方向延伸部；
    注塑形成封装体以及在所述金属基板上侧形成碗杯，并使所述封装体完全覆盖水平方向延伸部以及至少部分覆盖竖直方向延伸部。
  11. 根据权利要求10所述的用于表面贴装的LED支架的制造方法，其特征在于，在所述注塑形成封装体以及在金属基板上侧形成碗杯，并使封装体完全覆盖水平方向延伸部以及至少部分覆盖竖直方向延伸部的步骤之后，包括：
    将所述竖直方向延伸部未被封装体覆盖的部分进行弯折以形成引脚。
  12. 根据权利要求11所述的用于表面贴装的LED支架的制造方法，其特征在于，在所述将竖直方向延伸部未被封装体覆盖的部分进行弯折以形成引脚的步骤中，包括：
    将所述竖直方向延伸部未被封装体覆盖的部分进行弯折以形成U型结构的引脚。
  13. 根据权利要求10所述的用于表面贴装的LED支架的制造方法，其特征在于，在所述将第一基板件和第二基板件分别冲压或铸造形成相互连接的水平方向延伸部和竖直方向延伸部的步骤中，包括：
    将所述竖直方向延伸部冲压或铸造形成至少一个弯折单元。
  14. 根据权利要求13所述的用于表面贴装的LED支架的制造方法，其特征在于，在所述使封装体完全覆盖水平方向延伸部以及部分覆盖竖直方向延伸部的步骤中，包括：
    使所述封装体完全覆盖水平方向延伸部以及完全覆盖弯折单元。
PCT/CN2012/083509 2012-06-06 2012-10-25 用于表面贴装的led支架及制造方法、led灯 WO2013181896A1 (zh)

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