Classifications

• • G—PHYSICS
  • G11—INFORMATION STORAGE
  • G11C—STATIC STORES
  • G11C5/00—Details of stores covered by group G11C11/00
  • G11C5/06—Arrangements for interconnecting storage elements electrically, e.g. by wiring
• • G—PHYSICS
  • G06—COMPUTING OR CALCULATING; COUNTING
  • G06F—ELECTRIC DIGITAL DATA PROCESSING
  • G06F12/00—Accessing, addressing or allocating within memory systems or architectures
  • G06F12/02—Addressing or allocation; Relocation
  • G06F12/08—Addressing or allocation; Relocation in hierarchically structured memory systems, e.g. virtual memory systems
  • G06F12/10—Address translation
• • G—PHYSICS
  • G06—COMPUTING OR CALCULATING; COUNTING
  • G06F—ELECTRIC DIGITAL DATA PROCESSING
  • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
  • G06F13/14—Handling requests for interconnection or transfer
  • G06F13/16—Handling requests for interconnection or transfer for access to memory bus
• • G—PHYSICS
  • G06—COMPUTING OR CALCULATING; COUNTING
  • G06F—ELECTRIC DIGITAL DATA PROCESSING
  • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
  • G06F13/38—Information transfer, e.g. on bus
  • G06F13/42—Bus transfer protocol, e.g. handshake; Synchronisation
• • G—PHYSICS
  • G11—INFORMATION STORAGE
  • G11C—STATIC STORES
  • G11C5/00—Details of stores covered by group G11C11/00
  • G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
  • G11C5/04—Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
• • G—PHYSICS
  • G11—INFORMATION STORAGE
  • G11C—STATIC STORES
  • G11C5/00—Details of stores covered by group G11C11/00
  • G11C5/06—Arrangements for interconnecting storage elements electrically, e.g. by wiring
  • G11C5/063—Voltage and signal distribution in integrated semi-conductor memory access lines, e.g. word-line, bit-line, cross-over resistance, propagation delay
• • G—PHYSICS
  • G11—INFORMATION STORAGE
  • G11C—STATIC STORES
  • G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
  • G11C7/02—Arrangements for writing information into, or reading information out from, a digital store with means for avoiding parasitic signals
• • G—PHYSICS
  • G11—INFORMATION STORAGE
  • G11C—STATIC STORES
  • G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
  • G11C7/10—Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
• • G—PHYSICS
  • G11—INFORMATION STORAGE
  • G11C—STATIC STORES
  • G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
  • G11C7/22—Read-write [R-W] timing or clocking circuits; Read-write [R-W] control signal generators or management 
  • G11C7/222—Clock generating, synchronizing or distributing circuits within memory device
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
  • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
  • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
  • H01L25/065—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00
  • H01L25/0657—Stacked arrangements of devices
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
  • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
  • H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
  • H01L25/105—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being integrated devices of class H10
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
  • H10D99/00—Subject matter not provided for in other groups of this subclass
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/10—Bump connectors; Manufacturing methods related thereto
  • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
  • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
  • H01L2224/161—Disposition
  • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
  • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
  • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/481—Disposition
  • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
  • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
  • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
  • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
  • H01L2225/03—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes
  • H01L2225/04—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices not having separate containers
  • H01L2225/065—All the devices being of a type provided for in the same main group of the same subclass of class H10
  • H01L2225/06503—Stacked arrangements of devices
  • H01L2225/0651—Wire or wire-like electrical connections from device to substrate
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
  • H01L2225/03—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes
  • H01L2225/10—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices having separate containers
  • H01L2225/1005—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices having separate containers the devices being integrated devices of class H10
  • H01L2225/1011—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices having separate containers the devices being integrated devices of class H10 the containers being in a stacked arrangement
  • H01L2225/1017—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices having separate containers the devices being integrated devices of class H10 the containers being in a stacked arrangement the lowermost container comprising a device support
  • H01L2225/1023—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices having separate containers the devices being integrated devices of class H10 the containers being in a stacked arrangement the lowermost container comprising a device support the support being an insulating substrate
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
  • H01L2225/03—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes
  • H01L2225/10—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices having separate containers
  • H01L2225/1005—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices having separate containers the devices being integrated devices of class H10
  • H01L2225/1011—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices having separate containers the devices being integrated devices of class H10 the containers being in a stacked arrangement
  • H01L2225/1047—Details of electrical connections between containers
  • H01L2225/1058—Bump or bump-like electrical connections, e.g. balls, pillars, posts
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
  • H01L2924/151—Die mounting substrate
  • H01L2924/153—Connection portion
  • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
  • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
  • H01L2924/181—Encapsulation
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
  • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

Definitions

• the invention is related to packaged integrated circuits, and more particularly, to a stacked package-on-package integrated circuit having a logic chip in electrical communication with a memory chip.
• CPU central processing unit
• memory inter-chip interface is very important for system performance and power.
• the data traffic between a CPU and local memory increases, pushing up the inter-chip interface speed for high data bandwidth.
• a high-speed inter-chip interface often suffers from clock jitter and clock- to- signal skews.
• Figure 1 is a simplified cross-sectional view of a stacked POP (Package- On-Package) system comprising two memory chips (dice) labeled 102 and 104, and a logic chip (die) labeled 106.
• the logic chip 106 comprises a CPU (not shown), where memory chips 102 and 104 are part of the memory hierarchy available to the CPU.
• the memory chips 102 and 104 are electrically connected to the logic chip 106.
• Wires 107 electrically connect the memory chips to contact pads (not shown) on the package substrate 108, and vias (not shown) in the package substrate 108 provide electrical connection to the package balls 110.
• Package balls 110 provide electrical connection to the logic chip 106 by way of interconnects (not shown) on the package substrate 112 and by way of the package balls 114.
• Package balls 116 are electrically connected to the package balls 114 by way of vias (not shown) in the package substrate 112 so that the logic chip 106 may be electrically connected to other packaged integrated circuits by way of a printed circuit board (not shown).
• Many mobile systems have multiple memory channels, where it is common for each memory channel interface to have a 32-bit I/O (Input/Output) width. The physical implementation of this interface is segmented across the dice in a stacked package. This distributed segmentation feature is illustrated in Figure 2, which abstracts the memory- to-CPU interface in the POP system of Figure 1.
• the plane labeled 202 represents a memory chip
• the plane labeled 204 represents a logic chip.
• An inter-chip interface on the memory chip 202 is segmented into two structures labeled 206 and 208.
• This inter-chip interface includes interconnects for a clock signal, command signals, power rails, ground rails, address signals, write data signals, and read data signals, for example.
• the corresponding inter-chip interface on the logic chip 204 is segmented in the same way as on the memory chip, and is abstracted by the two structures labeled 210 and 212.
• the line labeled 214 abstracts the interconnects between the structures 206 and 210
• the line labeled 216 abstracts the interconnects between the structures 208 and 212. Accordingly, the lines 214 and 216 will be referred to as interconnects.
• the structures in the cross-sectional view of Figure 1 corresponding to the combination of the interconnects 214 and 216 are the wires 107, the vias within the package substrate 108, the package balls 110, the interconnects on the package substrate 112, and the package balls 114.
• a reason for physically segmenting the inter-chip interface is because of constraints imposed by the layout of die pads and package balls.
• the functional unit 218 abstracts the clock source and set of drivers to drive the inter-chip interface. For proper operation, the clock source represented by the functional unit 218 must maintain the same clock phase over the two portions of the inter-chip interface, even though these two portions of the inter-chip interface are physically placed near opposite ends of the logic chip 204.
• Exemplary embodiments of the invention are directed to systems and method for a stacked package-on-package system having a memory die and a logic die, where the memory die comprises a first memory and a second memory, each operated independently of the other, and each having an inter-chip interface electrically connected to the logic die.
• a stacked package-on-package system comprises a first die and a second die.
• the first die comprises a plurality of memory cells configured into a first memory and a second memory.
• the second die comprises a central processing unit; a bus coupled to the central processing unit; a memory management unit coupled to the bus; a first clock source coupled to the memory management unit to provide a first clock signal to the first memory; and a second clock source coupled to the memory management unit to provide a second clock signal to the second memory; wherein the first and second clock sources are independent of each other.
• a method for a memory management unit to access physical memory on a memory semiconductor die.
• the method includes translating addresses in an address space into either physical addresses in a first physical address space or physical addresses in a second physical address space, wherein the sizes of the first and second physical address spaces are each one-half the size of the address space; writing data having a physical address in the first physical address space only to a first memory on the memory semiconductor die; writing data having a physical address in the second physical address space only to a second memory on the memory semiconductor die; reading data having a physical address in the first physical address space only from the first memory on the memory semiconductor die; and reading data having a physical address in the second physical address space only from the second memory on the memory semiconductor die.
• a computer readable non-transitory medium has instructions stored thereon that when executed by a processor perform a method.
• the method comprises translating addresses in an address space into either physical addresses in a first physical address space or physical addresses in a second physical address space, wherein the sizes of the first and second physical address spaces are each one-half the size of the address space; writing data having a physical address in the first physical address space only to a first memory on a memory semiconductor die; writing data having a physical address in the second physical address space only to a second memory on the memory semiconductor die; reading data having a physical address in the first physical address space only from the first memory on the memory semiconductor die; and reading data having a physical address in the second physical address space only from the second memory on the memory semiconductor die.
• a stacked package-on-package system comprises a first die; a second die; a first memory formed in the first die; a second memory formed in the first die; and a memory management means for managing memory reads and writes, where the memory management means is formed in the second die.
• the memory management means translates addresses in an address space into either physical addresses in a first physical address space or physical addresses in a second physical address space, wherein the sizes of the first and second physical address spaces are each one-half the size of the address space; writes data having a physical address in the first physical address space only to the first memory; writes data having a physical address in the second physical address space only to the second memory; reads data having a physical address in the first physical address space only from the first memory; and reads data having a physical address in the second physical address space only from the second memory.
• Figure 1 is a cross-sectional view of a conventional stacked package-on-package system for integrated circuits.
• Figure 2 is an abstraction of a conventional memory-to-CPU inter-chip interface.
• Figure 3 illustrates a logical view of a memory-to-CPU inter-chip interface according to an embodiment.
• Figure 4 illustrates another logical view of a memory-to-CPU inter-chip interface according to an embodiment.
• Figure 5 is a flow diagram illustrating a method of address translation, as well as writing and reading data, according to an embodiment.
• Figure 6 illustrates a wireless communication network employing an embodiment.
• Figure 3 illustrates a memory-to-CPU inter-chip interface according to an embodiment.
• the plane labeled 302 abstracts a logic chip (die), which includes a CPU (not shown).
• the plane labeled 304 abstracts a memory chip.
• the memory chip 304 illustrated in Figure 3 consists of a single die, the memory cells on this single die are logically partitioned into two parts labeled 306 and 308. These two parts of the memory may share the same ground and power buses, but their signal lines for commands, read data, write data, and clock signals are separate from each other.
• the chips 302 and 304 are packaged into a stacked package-on-package system. Other chips may be stacked onto these two chips and integrated into the same package system, but for ease of illustration only two chips are shown in Figure 3.
• the structure labeled 310 abstracts the inter-chip interface for the memory part 306 comprising various interconnects for command signals, read data signals, write data signals, and a clock signal.
• the structure labeled 312 abstracts the inter-chip interface for the memory part 308 comprising various interconnects for command signals, read data signals, write data signals, and a clock signal.
• the structure labeled 314 abstracts the part of the inter-chip interface on the logic chip 302 that is electrically connected to the inter-chip interface 310 on the memory chip 304.
• the structure labeled 316 abstracts the part of the inter-chip interface on the logic chip 302 that is electrically connected to the inter-chip interface 312 on the memory chip 304.
• the functional unit labeled 318 represents a clock source, a set of drivers, and a logic block on the logic chip 302.
• the functional unit 318 provides a clock signal, command signals, read data signals, and write data signals to the memory part 306 by way of interchip interfaces 314 and 310.
• the line 320 represents the electrical interconnects between the inter-chip interfaces 314 and 310.
• the functional unit labeled 322 represents a clock source, a set of drivers, and a logic block on the logic chip 302.
• the functional unit 322 provides a clock signal, command signals, read data signals, and write data signals to the memory part 308 by way of interchip interfaces 316 and 312.
• the line 324 represents the electrical interconnects between the inter-chip interfaces 316 and 312.
• the signals provided by functional units 318 and 322 are independent of each other.
• the clock signals provided by the clock sources in these two functional units are independent of each other.
• Each clock source need only drive its associated interface, where each interface is electrically independent of the other.
• Each inter-chip interface illustrated in the embodiment of Figure 4 is electrically independent, and need not be distributed on opposite sides of a package system as in other kinds of inter-chip interfaces. This helps in mitigating clock jitter and skew for better system level timing margin.
• FIG. 4 is a logical representation of the embodiment of Figure 3, showing a CPU 402 and a memory management unit 404 connected to each other by way of a system bus 406.
• the total memory size of the memory chip 304 is 1 GB. If a single inter-chip interface were used, then the number of address lines would be 20.
• each inter-chip interface 314 and 316 has 19 address lines, for a total of 38 address lines.
• Shortening signal path length provides several improvements. For example, fewer buffers need to be introduced, resulting in less clock signal jitter. Shorter signal path lengths introduce less clock signal skew. Also, smaller buffers may be utilized and there is less overall capacitance for each signal line, which helps to reduce power consumption in both the CPU and the memory. Embodiments are expected to achieve higher clock frequencies because of less clock signal jitter, skew, and power consumption.
• the memory parts 306 and 308, and their corresponding interfaces may be symmetrically laid out in the memory semiconductor die represented by the memory chip 304.
• the dashed line 304S representing a line of symmetry in the memory chip 304 dividing the memory semiconductor die represented by the memory chip 304 into a left half 304L and a right half 304R
• the memory part 306 lies in the left half 304L
• the memory part 308 lies in the right half 304R.
• the functional units 318 and 322, and their corresponding interfaces may be symmetrically laid out in the memory semiconductor die represented by the logic chip 302.
• the functional unit 318 lies in the left half 302L and the functional unit 322 lies in the right half 302R.
• the CPU 402 sees the same address space whether two inter-chip interfaces are implemented, or a single inter-chip interface is used.
• the memory management unit 404 hides the implementation of the inter-chip interface.
• the memory management unit translates a particular address so that the translated address is driven on either interface 314 or interface 316, but not both.
• FIG. 5 is a flow diagram illustrating the above-described method of address translation, as well as writing and reading data, according to an embodiment.
• the MMU 404 translates addresses in the address space seen by the CPU 402 into either physical addresses in a first physical address space or physical addresses in a second physical address space.
• the sizes of the first and second physical address spaces are each one-half the size of the address space seen by the CPU 402.
• step 504 when the MMU 404 is writing data having a physical address in the first physical address space, the data is written only to a first memory on the memory chip 304.
• the first memory may be the memory part 306.
• step 506 when the MMU 404 is writing data having a physical address in the second physical address space, the data is written only to a second memory on the memory chip 304.
• the second memory may be the memory part 308.
• step 508 when the MMU 404 is reading data having a physical address in the first physical address space, the data is read only from the first memory on the memory chip 304.
• step 510 when the MMU 404 is reading data having a physical address in the second physical address space, the data is read only from the second memory on the memory chip 304.
• Figure 5 is a flow diagram illustrating a procedure that may be carried out by the MMU 404 under instructions stored in a memory.
• the memory may be the memory part 306 or 308, or it may be memory integrated with the MMU 404. Such memory may be referred to as a non-transitory computer readable memory having instructions stored thereon.
• Embodiments may find widespread application in numerous communication systems, such as a cellular phone network.
• Figure 6 illustrates a cellular phone network 602 comprising the base stations 604A, 604B, and 604C.
• Figure 6 shows a communication device, labeled 606, which may be a mobile cellular communication device such as a so-called smart phone, a tablet, or some other kind of communication device suitable for a cellular phone network.
• the communication device 606 need not be mobile.
• the communication device 606 is located within the cell associated with the base station 604C.
• the arrows 608 and 610 pictorially represent the uplink channel and the downlink channel, respectively, by which the communication device 606 communicates with the base station 604C.
• Embodiments may be used in data processing systems associated with the communication device 606, or with the base station 604C, or both, for example.
• Figure 6 illustrates only one application among many in which the embodiments described herein may be employed.
• a software module may reside in RAM memory, flash memory, ROM memory, EPROM memory, EEPROM memory, registers, hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art.
• An exemplary storage medium is coupled to the processor such that the processor can read information from, and write information to, the storage medium. In the alternative, the storage medium may be integral to the processor.
• an embodiment of the invention can include a computer readable media embodying a method for reading and writing data with an inter-chip memory interface structure as described previously. Accordingly, the invention is not limited to illustrated examples and any means for performing the functionality described herein are included in embodiments of the invention.

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• 2013
  • 2013-01-29 US US13/752,427 patent/US9448947B2/en active Active
  • 2013-05-31 JP JP2015515261A patent/JP6105720B2/ja active Active
  • 2013-05-31 CN CN201380028442.0A patent/CN104335279B/zh active Active
  • 2013-05-31 IN IN2115MUN2014 patent/IN2014MN02115A/en unknown
  • 2013-05-31 WO PCT/US2013/043714 patent/WO2013181603A2/en active Application Filing
  • 2013-05-31 EP EP13729562.2A patent/EP2856466B1/en active Active
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