WO2013161419A1 - Dispositif de chauffage et de refroidissement et procédé de chauffage et de refroidissement l'utilisant - Google Patents

Dispositif de chauffage et de refroidissement et procédé de chauffage et de refroidissement l'utilisant Download PDF

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Publication number
WO2013161419A1
WO2013161419A1 PCT/JP2013/057068 JP2013057068W WO2013161419A1 WO 2013161419 A1 WO2013161419 A1 WO 2013161419A1 JP 2013057068 W JP2013057068 W JP 2013057068W WO 2013161419 A1 WO2013161419 A1 WO 2013161419A1
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Prior art keywords
temperature
heating
air flow
temperature air
low
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PCT/JP2013/057068
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English (en)
Japanese (ja)
Inventor
邦人 奥山
原田　享
靖章 桑田
明香 鶴丸
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大研医器株式会社
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Publication of WO2013161419A1 publication Critical patent/WO2013161419A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/20—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity

Definitions

  • the present invention relates to a heating / cooling apparatus and a heating / cooling method using the same.
  • a method in which a predetermined thermal history is given by alternately heating and cooling a processing target object, and a change in characteristics of the processing target object is observed.
  • a heating / cooling test using such a method for example, there is a heating / cooling test of a microchip for medical examination containing a trace amount of liquid.
  • FIG. 1 shows a schematic diagram of a conventional heating / cooling device for a microchip for medical examination, which is used in the heating / cooling test.
  • the conventional heating / cooling device is configured so that high temperature water and low temperature water are alternately switched from a constant temperature container containing high temperature water and a constant temperature container containing low temperature water to a temperature cycle stage on which a microchip containing a small amount of reaction liquid of about several ⁇ L is placed.
  • the heat history is given by supplying.
  • Patent Document 1 Such a technique is disclosed in Patent Document 1, for example.
  • the heating time and the cooling time are each about 10 seconds, and the total time required for repeated heating is a minimum of 4 minutes in total.
  • the contact surface between the temperature cycle stage and the object to be processed is accurate. Since it needs to be processed well, it is a barrier to cost reduction during mass production.
  • an object of the present invention is to provide a heating / cooling apparatus and a heating / cooling method using the same that can be implemented at low cost, high speed, and low power consumption regardless of the accuracy of the thermal contact surface.
  • the present inventors have conducted extensive research. Instead of using high-temperature water and low-temperature water for heating and cooling, the high-temperature airflow from the high-temperature airflow source and the low-temperature airflow from the low-temperature airflow source are alternately used. It has been found that a complicated mechanism design is not required by switching to, and heating and cooling of the object to be processed can be performed at high speed and with low power consumption.
  • a heating and cooling device that alternately heats and cools a processing object, and a support unit for providing the processing object, and the support Heating and cooling provided with a high-temperature air flow source that blows a high-temperature air flow onto the surface of the processing object provided on the part and a low-temperature air source that blows a low-temperature air current onto the surface of the processing object provided on the support part Device.
  • the high-temperature air flow source for blowing the high-temperature air flow is a steam generator for blowing steam.
  • the low temperature air flow source for blowing the low temperature air flow is a blower for blowing air.
  • the heating / cooling device alternately switches the blowing of the high temperature airflow from the high temperature airflow source and the blowing of the low temperature airflow from the low temperature airflow source at predetermined time intervals.
  • a control unit is provided.
  • a shutter is provided for blocking the spraying on the object.
  • the object to be treated is a small chip containing a medical trace amount liquid.
  • a support portion provided with a processing object is prepared, and a high temperature airflow from a high temperature airflow source and a low temperature airflow from a low temperature airflow source are alternately applied to the processing object on the support portion.
  • This is a heating / cooling method of switching and spraying.
  • the high-temperature air flow source that blows the high-temperature air flow is a steam generator that blows steam.
  • the low temperature air flow source for blowing the low temperature air flow is a blower for blowing air.
  • the support portion is provided horizontally, and a high-temperature airflow from the high-temperature airflow source and a low-temperature airflow from the low-temperature airflow source are sprayed onto the surface of the support portion.
  • the support portion is provided vertically, and a high temperature airflow from the high temperature airflow source and a low temperature airflow from the low temperature airflow source are sprayed onto the surface of the support portion.
  • a shutter is provided between the support and the high temperature air flow source and the cold air flow source, and when the high temperature air flow and the low temperature air flow are switched by the shutter, Block the blowing of high-temperature and low-temperature airflow onto the object to be processed.
  • the object to be treated is a small chip containing a medical trace amount liquid.
  • the present invention it is possible to provide a heating / cooling apparatus and a heating / cooling method using the same that can be implemented at low cost, high speed, and low power consumption regardless of the accuracy of the thermal contact surface.
  • the heating / cooling device 20 is a device that alternately performs heating and cooling on the processing object, and is not particularly limited as the processing object.
  • a small chip (microchip 1) containing a trace amount liquid for medical examination is employed as the processing object.
  • the microchip 1 is preferably made of quartz because it does not react with a liquid for medical examination and has good thermal conductivity. Further, the shape is not particularly limited.
  • the microchip 1 is formed in a disk shape having a diameter of about 10 mm and a thickness of about 0.3 mm, and a plurality of microchannels having a cross section of 100 ⁇ m square are formed.
  • the heat capacity is greatly reduced by setting the volume of the test solution to several microliters in total for the plurality of flow paths.
  • the heating / cooling device 20 includes a support plate 2 (support portion) for providing the microchip 1, and a steam generator 9 that blows a steam flow 8 (high-temperature airflow) onto the surface of the microchip 1 provided on the support plate 2.
  • a high-temperature air flow source and a blower 14 (a low-temperature air flow source) that blows an air flow 13 (low-temperature air flow) onto the surface of the microchip 1 provided on the support plate 2.
  • the heating / cooling device 20 includes a water supply container (not shown) that supplies water for the steam flow 8 to the steam generator 9.
  • the steam generator 9 is provided with a steam nozzle 3 through which the steam flow 8 is blown out so as to face the support plate 2.
  • An air nozzle 4 through which an air flow 13 is blown out is provided in the blower 14 so as to face the support plate 2.
  • the steam nozzle 3 and the air nozzle 4 are provided, for example, at positions separated from the support plate 2 by about 10 to 30 mm (distance X1, distance X2).
  • a steam flow is used as the high-temperature air flow and air (air) dried as the low-temperature air flow is used.
  • the air flow is not particularly limited as long as it is a predetermined high-temperature and low-temperature air flow.
  • “high temperature” and “low temperature” mean temperatures that are relative to each other, and depending on the thermal history desired to be given to the object to be processed, typically “high temperature” is 85 to 96.
  • “Cold” indicates 57-65 ° C.
  • saturated steam at 100 ° C. is used as the vapor flow 8
  • air at normal temperature is used as the air flow 13.
  • the heating / cooling device 20 includes a control panel 10 (control unit) that alternately switches the blowing of the steam flow 8 from the steam generator 9 and the blowing of the air flow 13 from the blower 14 at predetermined time intervals. Yes.
  • the control panel 10 is supplied with power from a power source 12 such as a dry battery, a portable live battery, or an AC external power source.
  • the steam generator 9 and the blower 14 are connected to the control panel 10 by electric wires and communication lines 11 and 11 ′, respectively, so that electric power is supplied and controlled.
  • the heating / cooling device 20 is configured so that the steam flow 8 and the air flow 13 are switched between the support plate 2 and the steam nozzle 3 provided in the steam generator 9 and the air nozzle 4 provided in the blower 14. And shutters 5 and 5 ′ for blocking the blowing of the air flow 13 to the microchip 1.
  • the shutter 5 is provided between the support plate 2 and the steam nozzle 3 provided in the steam generator 9 and blocks the spraying of the steam flow 8 to the microchip 1.
  • the shutter 5 ′ is provided between the support plate 2 and the air nozzle 4 provided in the blower 14 and blocks the blowing of the air flow 13 to the microchip 1.
  • the shutters 5, 5 ′ are connected to the control panel 10 by electric wires and communication lines (not shown), so that electric power is supplied and controlled.
  • the blowing of the vapor flow 8 and the air flow 13 to the microchip 1 can be started or blocked instantaneously.
  • the blower 14 it is preferable to use the shutters 5 and 5 ′ when the air flow 13 does not stop instantaneously due to a “dull” state.
  • the material for forming the shutters 5 and 5 ′ is not particularly limited, but for example, a low thermal conductivity material is preferable, and it can be formed with a Teflon (registered trademark) plate or the like.
  • thermocouple 7 is attached to the inside of the hood 6.
  • the thermocouple 7 is directly attached to the microchip 1, the temperature at the attachment location is lowered and accurate temperature measurement becomes difficult.
  • the heating / cooling device 20 is provided with the support plate 2 vertically, and the steam flow 8 from the steam generator 9 and the air flow 13 from the blower 14 are provided on the surface of the microchip 1 on the support plate 2.
  • the present invention is not limited to this. That is, the support plate 2 may be provided horizontally, and the steam flow 8 from the steam generator 9 and the air flow 13 from the blower 14 may be blown onto the surface of the microchip 1 on the support plate 2. At this time, the vapor flow 8 and the air flow 13 may be blown from the upper side to the surface of the microchip 1 on the support plate 2 or may be blown from the lower side. According to such a configuration, the temperature of the microchip 1 drops even when the distances between the vapor flow 8 and the air flow 13 and the support plate 2 are larger than when the support plate 2 is provided vertically. It is preferable because it becomes difficult.
  • FIG. 3 shows an example of the heat history of the heating and cooling method of the present embodiment.
  • the microchip 1 is installed in a portion of the support plate 2 surrounded by the hood 6. Further, the shutter 5 provided between the vapor nozzle 3 and the microchip 1 is closed, and the shutter 5 ′ provided between the air nozzle 4 and the microchip 1 is opened.
  • the steam generator 9 is started, the shutter 5 ′ is closed, the shutter 5 is opened, and the steam flow 8 is sprayed onto the microchip 1 for a predetermined time (t1).
  • the steam flow temperature (T2) at this time is measured with the thermocouple 7.
  • the microchip temperature (T1) at this time is measured with the thermocouple 7.
  • the microchip since the microchip has a small heat capacity, when the temperature is directly measured by the thermocouple 7, heat escapes and accurate temperature measurement becomes difficult. For this reason, a black body spray or the like is thinly applied to the back surface of the microchip, and the back surface temperature when heated by spraying steam on the surface is measured in a non-contact manner using infrared thermography or the like, and correlated with the temperature of the thermocouple 7.
  • the obtained value is defined as the microchip temperature (T1). (4) After repeating this pulse-like operation N times, the microchip 1 is replaced. At this time, it may be exchanged by a microchip exchange device. These operations (1) to (4) are sequentially performed on each microchip 1 in order.
  • the microchip 1 When the vapor flow 8 reaches the surface of the microchip 1, it immediately condenses and becomes fine water droplets, and the microchip 1 having a small heat capacity is rapidly heated up to the temperature T2 and maintained. If the microchip 1 is provided at a position separated from the steam generator 9 by the distance X1, it can be heated by the accompanying flow 15 at an arbitrary steam temperature of 100 ° C. or less, and a large amount of fine droplets can be blown as humid air. it can.
  • the condensed fine water droplets evaporate and the microchip 1 is cooled to the temperature T1 and maintained.
  • fine droplets on the surface of the microchip 1 can be rapidly evaporated, so that the liquid can be instantaneously cooled and adjusted to an arbitrary target temperature by adjusting the distance X2 and the cooling time t2. it can.
  • it can cool to arbitrary target temperature also by heating dry air according to the temperature which should be cooled.
  • the heating and cooling conditions can be arbitrarily adjusted by adjusting the times t1 and t2 and the distances X1 and X2 in advance with respect to the temperatures T1 and T2.
  • the distance X1 For example, by adjusting the distance X1, the amount of the accompanying flow 15 changes, and the temperature T2 of the vapor flow 8 reaching the microchip 1 can be changed. Moreover, by adjusting the distance X2, the flow velocity of the air flow 13 can be changed, and thereby the temperature T1 can be changed.
  • the cooling time t2 may be changed in order to change the cooling temperature T1.
  • the blower 14 and the steam generator 9 can be ejected and stopped in a short time, but the shutters 5 and 5 'are effective as means for starting and stopping heating and cooling instantaneously at a predetermined timing.
  • the control panel 10 controls the set temperature and the set time. By controlling the times t1 and t2 by feeding back the temperature of the thermocouple 7, it is possible to prevent the patterns of the temperatures T1 and T2 from collapsing.
  • the cooling temperature T1 is considerably lower than the heating temperature T2, it is effective to lower the humidity of the air flow 13, so that the desiccant can be attached to the air suction side of the blower 14.
  • the microchip 1, the steam nozzle 3, and the air nozzle 4 are configured to be contained in a closed space, dry air can be introduced from the outside with the blower 14 to keep the closed space at low humidity. For this reason, since the reduction of the effect of the accompanying flow 15 which cools the steam flow 8 is suppressed, it is preferable.
  • heating and cooling devices require a large amount of power and are generally connected to an external power source.
  • the heating time is shortened, and a dry battery or a portable live battery can be used as the power source 12. it can.
  • the apparatus can be made portable and can be used outside the test room or particularly outdoors.
  • Such an effect is further enhanced when the heat capacity is reduced by using a quartz microchip as the object to be processed as in this embodiment.
  • the configuration of the heating / cooling device is simplified, and it is small and inexpensive.
  • the temperature accuracy and temperature distribution in the microchip during the thermal cycle are both controlled within 0.5 ° C.
  • the thermal cycle mechanism can be driven by a 1.5V battery.
  • the manufacturing cost of the thermal cycle mechanism is set to be 5000 yen or less as of 2012.
  • Example 1 A heating / cooling test of a disk-shaped quartz chip (thickness 0.3 mm, diameter 10.4 mm) was performed using the heating / cooling apparatus having the configuration shown in FIG. 2, and the following items were evaluated.
  • A Transient change of chip back surface temperature when saturated vapor is applied to quartz chip at room temperature
  • B Transient change of chip back surface temperature in natural air cooling when heating is stopped
  • C Heating surface is changed simultaneously with stopping heating Transient change of chip back surface temperature when cooled by fan (blower)
  • D Transient change of temperature when heating and cooling (with fan) are repeated at intervals of 1 second, 3 seconds and 5 seconds
  • Black body spray (emissivity 0.94) is thinly applied to the back of the quartz chip to a thickness of 0.057 mm, and the back surface temperature when heated by spraying steam on the surface is infrared thermography (FLIR T250, frame Time: 9 Hz).
  • the edge of the quartz chip is sandwiched between two 1 mm thick Teflon (registered trademark) sheets with a 9.8 mm diameter hole in the center, fixed vertically, and the steam generator nozzle (15 mm away from the chip) A quartz chip was heated by spraying steam in the horizontal direction with an inner diameter of 4 mm.
  • FIG. 4 shows a transient change in the chip back surface temperature (center part) when saturated water vapor is applied to the quartz chip for about 15 seconds.
  • FIG. 5 is a graph in which the time width at the start of heating is enlarged.
  • FIG. 6 is a graph in which the time width during cooling is enlarged.
  • About 0.3 seconds after heating starts (after steam ejection) the back of the chip is heated to 80 ° C or higher, maintains 90-92 ° C (with fan) during heating, and reaches about 65 ° C after heating is stopped You can see that it descends in 2 seconds. Rapid temperature rise is considered to be due to heating by condensation of steam, and rapid temperature drop is due to evaporation of condensed droplets.
  • the reason why the temperature during heating is about 10 ° C. lower than the saturation temperature is considered to be due to heat radiation from the back surface of the chip.
  • FIG. 7 shows the test results of the time change of the chip back surface temperature when heating (saturated steam) and cooling (fan) are repeated at intervals of 1 second
  • FIG. 8 is repeated at intervals of 3 seconds
  • FIG. 9 is repeated at intervals of 5 seconds. It can be seen that both of them are repeated up and down at a temperature range of about 40 ° C.
  • the test results show that there are few stable times in the high-temperature part and the low-temperature part respectively, but this can be adjusted by appropriately blowing high-temperature and low-temperature steam or air for a predetermined time, adjusting the blowing speed, etc. It is.
  • a heating / cooling device having a configuration in which nozzles are provided on the side rather than in the vertical direction with respect to the microchip was prepared.
  • saturated steam is ejected horizontally from the nozzle and sprayed onto the microchip surface.
  • saturated steam is ejected horizontally from the nozzle (inner diameter 3.5 mm) (heating amount 200 W), the distance from the nozzle to the tip is 10 mm, 20 mm, and 30 mm, and perpendicular to the tip surface (diameter 10 mm).
  • x represents coordinates taken downward from the upper end of the chip through the center.
  • the several curve which shows a temperature change represents the change about every 0.165 second in an order from the lower side to the upper side, respectively. From FIG. 10, it can be seen that at a distance of 10 mm, the chip temperature approaches the final temperature in about 0.5 seconds after the start of heating, and the temperature reached is relatively uniform within a radius of 4 mm.
  • a heating / cooling device having a nozzle provided below the microchip was prepared.
  • saturated vapor is ejected upward from the nozzle and sprayed onto the microchip surface.
  • Saturated steam is ejected upward from the nozzle (heating amount 200 W), and the temperature distribution in the radial direction passing through the center of the chip when the steam collides with the chip surface fixed horizontally at 10 mm, 20 mm, and 30 mm from the nozzle.
  • the several curve which shows a temperature change represents the change about every 0.165 second in an order from the lower side to the upper side, respectively.

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
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Abstract

La présente invention concerne un dispositif de chauffage et de refroidissement qui peut fonctionner à faible coût, grande vitesse et faible consommation d'énergie, indépendamment de la précision de la surface de contact thermique, ainsi qu'un procédé de chauffage et de refroidissement l'utilisant. Le dispositif de chauffage et de refroidissement (20) est doté d'un support (2) permettant de placer un objet à traiter (1), une source de courant d'air chaud (9) pour souffler un courant d'air chaud à la surface de l'objet à traiter (1) placé sur le support (2), et une source de courant d'air basse température (14) pour souffler un courant d'air basse température à la surface de l'objet à traiter (1) placé sur le support (2).
PCT/JP2013/057068 2012-04-27 2013-03-13 Dispositif de chauffage et de refroidissement et procédé de chauffage et de refroidissement l'utilisant WO2013161419A1 (fr)

Applications Claiming Priority (2)

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JP2012-103983 2012-04-27
JP2012103983A JP2013230117A (ja) 2012-04-27 2012-04-27 加熱冷却装置及びそれを用いた加熱冷却方法

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WO2013161419A1 true WO2013161419A1 (fr) 2013-10-31

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09511572A (ja) * 1994-02-01 1997-11-18 ロバート イー． フィールズ， 分子分析器および使用方法
JP2001519224A (ja) * 1997-10-07 2001-10-23 ザ パーキン−エルマー コーポレーション 流体衝突熱サイクラーのための装置
JP2008199901A (ja) * 2007-02-16 2008-09-04 Toyobo Co Ltd 熱サイクル印加装置及び熱サイクル印加方法
WO2009005001A1 (fr) * 2007-06-29 2009-01-08 Toppan Printing Co., Ltd. Appareil pour détecter/identifier un gène, appareil pour une réaction gène et incubateur
JP2011217659A (ja) * 2010-04-08 2011-11-04 Toppan Printing Co Ltd バイオチップ及び温度制御装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09511572A (ja) * 1994-02-01 1997-11-18 ロバート イー． フィールズ， 分子分析器および使用方法
JP2001519224A (ja) * 1997-10-07 2001-10-23 ザ パーキン−エルマー コーポレーション 流体衝突熱サイクラーのための装置
JP2008199901A (ja) * 2007-02-16 2008-09-04 Toyobo Co Ltd 熱サイクル印加装置及び熱サイクル印加方法
WO2009005001A1 (fr) * 2007-06-29 2009-01-08 Toppan Printing Co., Ltd. Appareil pour détecter/identifier un gène, appareil pour une réaction gène et incubateur
JP2011217659A (ja) * 2010-04-08 2011-11-04 Toppan Printing Co Ltd バイオチップ及び温度制御装置

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