WO2013157378A1 - Circuit connection material, and manufacturing method for assembly using same - Google Patents

Circuit connection material, and manufacturing method for assembly using same Download PDF

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Publication number
WO2013157378A1
WO2013157378A1 PCT/JP2013/059950 JP2013059950W WO2013157378A1 WO 2013157378 A1 WO2013157378 A1 WO 2013157378A1 JP 2013059950 W JP2013059950 W JP 2013059950W WO 2013157378 A1 WO2013157378 A1 WO 2013157378A1
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WO
WIPO (PCT)
Prior art keywords
resin
adhesive layer
polyvinyl acetal
polymerization initiator
cationic
Prior art date
Application number
PCT/JP2013/059950
Other languages
French (fr)
Japanese (ja)
Inventor
芳人 田中
亮太 相崎
Original Assignee
デクセリアルズ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by デクセリアルズ株式会社 filed Critical デクセリアルズ株式会社
Priority to KR1020147031952A priority Critical patent/KR102036570B1/en
Priority to CN201380020499.6A priority patent/CN104508062B/en
Publication of WO2013157378A1 publication Critical patent/WO2013157378A1/en

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    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • H01L2224/832—Applying energy for connecting
    • H01L2224/83201—Compression bonding
    • H01L2224/83203—Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
    • H01L2224/83862—Heat curing
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/83905—Combinations of bonding methods provided for in at least two different groups from H01L2224/838 - H01L2224/83904
    • H01L2224/83907—Intermediate bonding, i.e. intermediate bonding step for temporarily bonding the semiconductor or solid-state body, followed by at least a further bonding step
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/921—Connecting a surface with connectors of different types
    • H01L2224/9211—Parallel connecting processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Definitions

  • the present invention relates to a circuit connection material in which conductive particles are dispersed, and a method of manufacturing a mounting body using the circuit connection material.
  • Circuit connection materials such as anisotropic conductive film (ACF) in which conductive particles are dispersed are mainly classified into cation curable type, anion curable type for epoxy resin, and radical curable type for acrylic resin.
  • ACF anisotropic conductive film
  • anion curable type for epoxy resin anion curable type for epoxy resin
  • radical curable type for acrylic resin a cationic curing type circuit connecting material is used from the viewpoint of low-temperature curability and adhesive strength (for example, see Patent Document 1).
  • the present invention has been proposed in view of such conventional circumstances, and provides a circuit connection material having excellent low-temperature curability and a method of manufacturing a mounting body using the circuit connection material.
  • the present inventors have made a two-layer structure in which an ACF layer having conductive particles and an NCF (Non-Conductive Film) layer made of an insulating resin are laminated, and at least a polyvinyl acetal resin is formed on the ACF layer. It has been found that the low temperature curability is improved by blending.
  • NCF Non-Conductive Film
  • the circuit connecting material according to the present invention includes a first adhesive layer containing a polyvinyl acetal resin, a cationic polymerizable resin, a cationic polymerization initiator, and conductive particles, a cationic polymerizable resin, and a cationic And a second adhesive layer containing a polymerization initiator.
  • the manufacturing method of the mounting body according to the present invention includes a first adhesive layer containing a polyvinyl acetal resin, a cationic polymerizable resin, a cationic polymerization initiator, and conductive particles, and a cationic polymerizable resin.
  • a pressing step of placing a second electronic component on the material and pressing the second electronic component from the upper surface of the second electronic component with a crimping head.
  • the mounting body according to the present invention includes a first adhesive layer containing a polyvinyl acetal resin, a cationic polymerizable resin, a cationic polymerization initiator, and conductive particles, a cationic polymerizable resin, and a cationic polymerization.
  • the electrode of the first electronic component and the electrode of the second electronic component are electrically connected by a circuit connecting material having a second adhesive layer containing an initiator. .
  • high capture efficiency of conductive particles can be obtained even when pressure bonding is performed at a low temperature, and low-temperature curability can be improved.
  • the circuit connection material in the present embodiment has excellent particle trapping properties due to a two-layer structure in which a first adhesive layer containing conductive particles and a second adhesive layer are laminated. .
  • the first adhesive layer contains a polyvinyl acetal resin, a cationic polymerizable resin, a cationic polymerization initiator, and conductive particles.
  • the polyvinyl acetal resin is synthesized by an acetalization reaction between polyvinyl alcohol (PVA: polyvinyl alcohol) and an aldehyde as shown in the following chemical formula (1).
  • PVA polyvinyl alcohol
  • Polyvinyl butyral resin which is one of polyvinyl acetal resins, is synthesized by a butyralization reaction between polyvinyl alcohol and butyraldehyde. However, since it is not completely butyralized, as shown in the following chemical formula (2), an acetyl group and A hydroxyl group remains.
  • the polyvinyl acetal resin represented by the polyvinyl butyral resin is affected by thermal and mechanical properties and melt viscosity depending on the degree of polymerization and the ratio of the structure such as acetal group (butyral group), acetyl group, and hydroxyl group. .
  • the polyvinyl acetal resin in the present embodiment has a hydroxyl group, it can activate cationic polymerization and improve low temperature curability.
  • the hydroxyl group ratio of the polyvinyl acetal resin is preferably 20 mol% or more and 40 mol% or less, and more preferably 30 mol% or more and 40 mol% or less.
  • the hydroxyl group ratio of the polyvinyl acetal resin is within the above range, the low temperature curability can be improved.
  • the viscosity of the polyvinyl acetal resin at normal temperature is preferably 50 mPa ⁇ s or more and 200 mPa ⁇ s or less.
  • the viscosity of the polyvinyl acetal resin at room temperature is within the above range, it prevents adhesion to SUS at room temperature, improves film properties, suppresses the increase in temporary bonding temperature, and improves temporary bonding properties. Can do.
  • the glass transition temperature (Tg) of the polyvinyl acetal resin is preferably 50 ° C. or higher and 100 ° C. or lower, and more preferably 80 ° C. or higher and 100 ° C. or lower.
  • Tg glass transition temperature
  • the content of the polyvinyl acetal resin is preferably 5 to 30 parts by mass with respect to 100 parts by mass in total of the resin components of the first adhesive layer.
  • the content of the polyvinyl acetal resin is within the above range, excellent low-temperature curability, temporary stickability, and film properties can be obtained.
  • cationic polymerizable resins examples include monofunctional epoxy compounds such as ethylene oxide, propylene oxide, butylene oxide, styrene oxide, phenyl glycidyl ether, and butyl glycidyl ether; bisphenol A type epoxy resins, bisphenol F type epoxy resins, and phenol novolac type epoxy resins.
  • Heterocyclic epoxy resins such as alicyclic epoxy resins, triglycidyl isocyanate, and hydantoin epoxy; Aliphatic epoxy resins such as hydrogenated bisphenol A type epoxy resin, propylene glycol diglycidyl ether, pentaerythritol-polyglycidyl ether; Epoxy resin obtained by reaction of an aliphatic, aliphatic or cycloaliphatic carboxylic acid with epichlorohydrin; spiro ring-containing epoxy resin; o-allyl-sulfur A glycidyl ether type epoxy resin which is a reaction product of a novolac compound and epichlorohydrin; a glycidyl ether type epoxy resin which is a reaction product of a diallyl bisphenol compound having an allyl group at the ortho position of each hydroxyl group of bisphenol A and epichlorohydrin; Diglycidyl ether type epoxy resins of Schiff compounds, stilbene compounds and
  • the cationic polymerization initiator is one in which a cationic species causes the epoxy group at the end of the epoxy resin to open and self-crosslinks the epoxy resins.
  • cationic polymerization initiators include onium salts such as aromatic sulfonium salts, aromatic diazonium salts, iodonium salts, phosphonium salts, and selenonium salts.
  • an aromatic sulfonium salt is suitable as a cationic polymerization initiator because of its excellent reactivity at low temperatures and a long pot life.
  • the conductive particles for example, metal particles such as nickel, gold, and copper, those obtained by applying gold plating to resin particles, and those obtained by applying an insulating coating to the outermost layer of particles obtained by applying gold plating to resin particles are used. be able to.
  • the average particle diameter of the conductive particles is preferably 1 to 20 ⁇ m from the viewpoint of conduction reliability.
  • silane coupling agent epoxy, amino, mercapto sulfide, ureido, and the like can be used. Thereby, the adhesiveness in the interface of an organic material and an inorganic material can be improved.
  • an inorganic filler silica, talc, titanium oxide, calcium carbonate, magnesium oxide and the like can be used, and the kind of the inorganic filler is not particularly limited. Depending on the content of the inorganic filler, the fluidity can be controlled and the particle capture rate can be improved. Further, a rubber component or the like may be appropriately used for the purpose of relaxing the stress of the joined body.
  • the second adhesive layer contains a cationic polymerizable resin and a cationic polymerization initiator. Since the cationic polymerizable resin and the cationic polymerization initiator are the same as those of the first epoxy resin, description thereof is omitted. Moreover, it is preferable to add a silane coupling agent as another additive composition similarly to the 1st epoxy resin. Moreover, you may add an inorganic filler, a rubber component, etc.
  • the second adhesive layer may contain a polyvinyl acetal resin.
  • the content of the polyvinyl acetal resin may be less than the content of the polyvinyl acetal resin in the first adhesive layer.
  • the circuit connecting material having such a configuration has a two-layer structure of a first adhesive layer and a second adhesive layer, and the polyvinyl acetal resin is contained in the first adhesive layer. Even when pressure bonding is performed at a low temperature, high capture efficiency of the conductive particles can be obtained, and excellent low-temperature curability can be obtained.
  • the method for manufacturing a circuit connecting material in the present embodiment is a method in which the first adhesive layer and the second adhesive layer are bonded together, a step of creating the first adhesive layer, It has the process of creating an adhesive bond layer, and the process of affixing a 1st adhesive bond layer and a 2nd adhesive bond layer.
  • an adhesive composition containing a cationic polymerizable resin and a cationic polymerization initiator is dissolved in a solvent, and conductive particles are added.
  • a solvent toluene, ethyl acetate or the like, or a mixed solvent thereof can be used.
  • the release substrate is, for example, a laminate in which a release agent such as silicone is applied on a substrate such as PET (Poly Ethylene Terephthalate), OPP (Oriented Polypropylene), PMP (Poly-4-methylpentene-1), PTFE (Polytetrafluoroethylene), etc. Consists of structure.
  • the resin composition applied on the release substrate is dried by a heat oven, a heat drying apparatus or the like.
  • a first adhesive layer having a thickness of about 5 to 50 ⁇ m can be obtained.
  • an adhesive composition containing a cationic polymerizable resin and a cationic polymerization initiator is dissolved in a solvent as in the case of the first adhesive layer. And after adjusting the resin composition of a 2nd adhesive bond layer, this can be apply
  • the first adhesive layer and the second adhesive layer are attached and laminated to form an anisotropy having a two-layer structure.
  • a conductive film is produced.
  • the first adhesive layer and the second adhesive layer are attached and manufactured.
  • the present invention is not limited to this, and one adhesive layer is formed. Then, the resin composition of the other adhesive layer may be applied and dried.
  • the manufacturing method of the mounting body in the present embodiment includes a temporary pasting step in which the first adhesive layer side of the circuit connection material described above is temporarily pasted on the electrode of the first electronic component, and a second on the circuit connection material. And a pressing step of pressing the electronic component from the upper surface of the second electronic component with a crimping head. Thereby, it is possible to obtain a mounting body in which the electrode of the first electronic component and the electrode of the second electronic component are electrically connected.
  • Examples of the first electronic component include IZO coated glass in which a glass substrate is coated with an IZO (Indium / Zinc / Oxide) film, and SiNx coated glass in which a glass substrate is coated with a SiNx (silicon nitride) film.
  • Examples of the second electronic component include a COF (Chip On Film) and an IC (Integrated Circuit).
  • a polyvinyl acetal resin, a cationic polymerizable resin, a cationic polymerization initiator, a first adhesive layer containing conductive particles, a cationic polymerizable resin, and a cationic polymerization initiator By using a circuit connection material having a two-layer structure in which a second adhesive layer contained is laminated, high capture efficiency of conductive particles can be obtained even when cured at a low temperature, and excellent connection reliability is obtained. be able to.
  • Example> Examples of the present invention will be described below.
  • an anisotropic conductive film having a two-layer structure in which an ACF layer containing a polyvinyl acetal resin and an NCF layer are laminated is produced, and a mounted body is produced using the anisotropic conductive film.
  • Property, low-temperature curability, temporary sticking property, and film property were evaluated.
  • the present invention is not limited to these examples.
  • Example 1 (Preparation of anisotropic conductive film) 15 parts by mass of phenoxy resin (product name: YP-70, manufactured by Tohto Kasei Co., Ltd.), 15 parts by mass of epoxy resin (product name: YD-019, manufactured by Tohto Kasei Co., Ltd.), and epoxy resin (product name: EP828, manufactured by JER) ) 35 parts by weight, special polyvinyl acetal resin (product name: BX-1, manufactured by Sekisui Chemical Co., Ltd., hydroxyl group: 33 ⁇ 3 mol%, viscosity: 80 to 130 mPa ⁇ s (20 ° C.), glass transition temperature (Tg): 90 parts) and 2 parts by weight of a silane coupling agent (product name: A187, manufactured by Momentive Performance Materials Japan GK) and a cationic polymerization initiator (product name: SI-60L, Sanshin Chemical) 30 parts by weight of conductive particles (product name: AUL704, manufactured by Se
  • phenoxy resin product name: YP-70, manufactured by Tohto Kasei Co., Ltd.
  • 20 parts by mass of epoxy resin product name: YD-019, manufactured by Tohto Kasei Co., Ltd.
  • epoxy resin product name: EP828, manufactured by JER
  • 35 parts by mass, 2 parts by mass of a silane coupling agent product name: A187, manufactured by Momentive Performance Materials Japan GK
  • a cationic polymerization initiator product name: SI-60L, manufactured by Sanshin Chemical Co., Ltd.
  • the aforementioned ACF layer and NCF layer were laminated at a roll temperature of 45 ° C. using a roll laminator to produce an anisotropic conductive film having a two-layer structure with an ACF layer and an NCF layer.
  • the ACF layer side of the anisotropic conductive film slit to a width of 1.5 mm was temporarily attached to a glass substrate for evaluation.
  • an evaluation IC chip was mounted from the NCF layer side of the anisotropic conductive film and temporarily fixed.
  • a sheet made of polytetrafluoroethylene with a heat tool of 1.5 mm width and a thickness of 100 ⁇ m as a buffer material conditions of 150 ° C. or 160 ° C., 3 MPa, 5 seconds (tool speed 10 mm / sec, stage temperature 40 ° C.)
  • the mounting body was manufactured by pressure bonding.
  • Table 1 shows the evaluation results of Example 1.
  • the DSC peak temperature of the anisotropic conductive film was 102 ° C., and was found to have excellent reactivity.
  • the maximum value of the conduction resistance value of the mounted body crimped at 160 ° C. was 1.2 ⁇ , and the minimum value was 0.3 ⁇ .
  • bonded on 150 degreeC conditions was 1.1 ohm, and the minimum value was 0.2 ohm, and it turned out that low-temperature curability improved.
  • the lower limit of the temperature which can be transferred at the time of temporary pressure bonding is 50 ° C., and it was found that the film has excellent temporary stickability. It was also found that the anisotropic conductive film did not adhere to the stainless steel at room temperature and had excellent film properties.
  • Example 2 instead of the special polyvinyl acetal resin, polyvinyl butyral resin (product name: BM-1, manufactured by Sekisui Chemical Co., Ltd., hydroxyl group: about 34 mol%, viscosity: 60 to 100 mPa ⁇ s (20 ° C.), glass transition temperature (Tg): 67
  • the anisotropic conductive film was produced in the same manner as in Example 1 except that the ACF layer was produced using (° C.), and a mounted body was produced.
  • Table 1 shows the evaluation results of Example 2.
  • the DSC peak temperature of the anisotropic conductive film was 102 ° C., and was found to have excellent reactivity.
  • the maximum value of the conduction resistance value of the mounted body crimped at 160 ° C. was 1.3 ⁇ , and the minimum value was 0.3 ⁇ .
  • bonded on 150 degreeC conditions was 1.2 ohms, and the minimum value was 0.2 ohms, and it turned out that low-temperature curability improved.
  • the lower limit of the temperature which can be transferred at the time of temporary pressure bonding is 50 ° C., and it was found that the film has excellent temporary stickability. It was also found that the anisotropic conductive film did not adhere to the stainless steel at room temperature and had excellent film properties.
  • Example 3 7.5 parts by weight of a special polyvinyl acetal resin, polyvinyl butyral resin (product name: BM-1, manufactured by Sekisui Chemical Co., Ltd., hydroxyl group: about 34 mol%, viscosity: 60 to 100 mPa ⁇ s (20 ° C.), glass transition temperature ( An anisotropic conductive film was produced in the same manner as in Example 1 except that the ACF layer was produced with Tg): 67 ° C. being 7.5 parts by mass, and a mounting body was produced.
  • BM-1 polyvinyl butyral resin
  • Tg glass transition temperature
  • Table 1 shows the evaluation results of Example 3.
  • the DSC peak temperature of the anisotropic conductive film was 102 ° C., and it was found that the anisotropic conductive film had excellent reactivity.
  • the maximum value of the conduction resistance value of the mounted body crimped at 160 ° C. was 1.2 ⁇ , and the minimum value was 0.3 ⁇ .
  • bonded on 150 degreeC conditions was 1.1 ohms, and the minimum value was 0.2 ohms, and it turned out that low-temperature curability improved.
  • the lower limit of the temperature which can be transferred at the time of temporary pressure bonding is 50 ° C., and it was found that the film has excellent temporary stickability. It was also found that the anisotropic conductive film did not adhere to the stainless steel at room temperature and had excellent film properties.
  • Table 1 shows the evaluation results of Comparative Example 2.
  • the DSC peak temperature of the anisotropic conductive film was 102 ° C., and it was found that the anisotropic conductive film had excellent reactivity.
  • the maximum value of the conduction resistance value of the mounted body crimped at 160 ° C. was 1.2 ⁇ , and the minimum value was 0.3 ⁇ .
  • the maximum value of the conduction resistance value of the mounted body crimped at 150 ° C. was 1.3 ⁇ , and the minimum value was 0.3 ⁇ .
  • the lower limit of the temperature which can be transferred at the time of temporary pressure bonding is 50 ° C., and it was found that the film has excellent temporary stickability.
  • since there was adhesion of the anisotropic conductive film to stainless steel at normal temperature it turned out that film property is inferior to an Example.
  • Table 1 shows the evaluation results of Comparative Example 3.
  • the DSC peak temperature of the anisotropic conductive film was 102 ° C., and was found to have excellent reactivity.
  • the maximum value of the conduction resistance value of the mounted body crimped at 160 ° C. was 1.2 ⁇ , and the minimum value was 0.3 ⁇ .
  • the maximum value of the conduction resistance value of the mounted body crimped at 150 ° C. was 1.3 ⁇ , and the minimum value was 0.3 ⁇ .
  • the lower limit of the temperature which can be transferred at the time of temporary pressure bonding was 60 ° C., and it was found that the temporary sticking property was inferior to that of the example. It was also found that the anisotropic conductive film did not adhere to the stainless steel at room temperature and had excellent film properties.
  • low-temperature curability is improved by blending a special polyvinyl acetal resin or polyvinyl butyral resin in the ACF layer in an anisotropic conductive film having a two-layer structure in which an ACF layer and an NCF layer are laminated.
  • a special polyvinyl acetal resin or polyvinyl butyral resin in the ACF layer in an anisotropic conductive film having a two-layer structure in which an ACF layer and an NCF layer are laminated.

Abstract

Provided are a circuit connection material, which has a superior low temperature curability, and a manufacturing method for an assembly using same. The circuit connection material has a two-layer structure in which a first adhesive layer comprising a polyvinyl acetal resin, a cationic polymerizing resin, a cationic polymerization initiator and conductive particles, and a second adhesive layer comprising a cationic polymerizing resin and a cationic polymerization initiator are laminated. A high conductive particle capture efficiency is thereby obtained even when fixed by applying pressure at a low temperature and low temperature curability is improved.

Description

回路接続材料、及びこれを用いた実装体の製造方法CIRCUIT CONNECTION MATERIAL, AND METHOD FOR PRODUCING MOUNTING BODY USING THE SAME
　本発明は、導電性粒子が分散された回路接続材料、及びそれを用いた実装体の製造方法に関する。
　本出願は、日本国において２０１２年４月１９日に出願された日本特許出願番号特願２０１２－９５５２２を基礎として優先権を主張するものであり、この出願を参照することにより、本出願に援用される。 The present invention relates to a circuit connection material in which conductive particles are dispersed, and a method of manufacturing a mounting body using the circuit connection material.
This application claims priority on the basis of Japanese Patent Application No. 2012-95522 filed in Japan on April 19, 2012, and is incorporated herein by reference. Is done.
　導電性粒子が分散された異方性導電フィルム（ＡＣＦ：Anisotropic Conductive Film）などの回路接続材料は、主に、エポキシ樹脂に対するカチオン硬化型、アニオン硬化型、アクリル樹脂に対するラジカル硬化型などに分類される。これらの中でも、特にＣＯＧ（Chip on Glass）の分野では、低温硬化性、接着力の観点から、カチオン硬化型の回路接続材料が使用される（例えば、特許文献１参照。）。 Circuit connection materials such as anisotropic conductive film (ACF) in which conductive particles are dispersed are mainly classified into cation curable type, anion curable type for epoxy resin, and radical curable type for acrylic resin. The Among these, particularly in the field of COG (Chip-on-Glass), a cationic curing type circuit connecting material is used from the viewpoint of low-temperature curability and adhesive strength (for example, see Patent Document 1).
特開２０１１－１８１５２５号公報JP 2011-181525 A
　カチオン硬化型の回路接続材料は、硬化性の高い開始剤や硬化性の高いエポキシ樹脂を選定することで、低温硬化性の向上を図ることが試みられるが、仮貼り性と膜性のバランスを考慮すると配合に制約がある。 For cationic curing type circuit connection materials, it is attempted to improve low-temperature curability by selecting a highly curable initiator or a highly curable epoxy resin. Considering there are restrictions on the formulation.
　本発明は、このような従来の実情に鑑みて提案されたものであり、優れた低温硬化性を有する回路接続材料、及びこれを用いた実装体の製造方法を提供する。 The present invention has been proposed in view of such conventional circumstances, and provides a circuit connection material having excellent low-temperature curability and a method of manufacturing a mounting body using the circuit connection material.
　本件発明者は、鋭意検討を行った結果、導電性粒子を有するＡＣＦ層と絶縁性樹脂からなるＮＣＦ（Non Conductive Film）層とが積層された２層構造とし、少なくともＡＣＦ層にポリビニルアセタール樹脂を配合することにより、低温硬化性が改善されることを見出した。 As a result of intensive studies, the present inventors have made a two-layer structure in which an ACF layer having conductive particles and an NCF (Non-Conductive Film) layer made of an insulating resin are laminated, and at least a polyvinyl acetal resin is formed on the ACF layer. It has been found that the low temperature curability is improved by blending.
　すなわち、本発明に係る回路接続材料は、ポリビニルアセタール樹脂と、カチオン重合性樹脂と、カチオン重合開始剤と、導電性粒子とを含有する第１の接着剤層と、カチオン重合性樹脂と、カチオン重合開始剤とを含有する第２の接着剤層とを有することを特徴とする。 That is, the circuit connecting material according to the present invention includes a first adhesive layer containing a polyvinyl acetal resin, a cationic polymerizable resin, a cationic polymerization initiator, and conductive particles, a cationic polymerizable resin, and a cationic And a second adhesive layer containing a polymerization initiator.
　また、本発明に係る実装体の製造方法は、ポリビニルアセタール樹脂と、カチオン重合性樹脂と、カチオン重合開始剤と、導電性粒子とを含有する第１の接着剤層と、カチオン重合性樹脂と、カチオン重合開始剤とを含有する第２の接着剤層とを有する回路接続材料の第１の接着剤層側を第１の電子部品の電極上に仮貼りする仮貼工程と、前記回路接続材料上に第２の電子部品を配置し、該第２の電子部品の上面から圧着ヘッドにて押圧する押圧工程とを有することを特徴とする。 Moreover, the manufacturing method of the mounting body according to the present invention includes a first adhesive layer containing a polyvinyl acetal resin, a cationic polymerizable resin, a cationic polymerization initiator, and conductive particles, and a cationic polymerizable resin. A temporary pasting step of temporarily pasting the first adhesive layer side of the circuit connecting material having a second adhesive layer containing a cationic polymerization initiator on the electrode of the first electronic component, and the circuit connection And a pressing step of placing a second electronic component on the material and pressing the second electronic component from the upper surface of the second electronic component with a crimping head.
　また、本発明に係る実装体は、ポリビニルアセタール樹脂と、カチオン重合性樹脂と、カチオン重合開始剤と、導電性粒子とを含有する第１の接着剤層と、カチオン重合性樹脂と、カチオン重合開始剤とを含有する第２の接着剤層とを有する回路接続材料によって、第１の電子部品の電極と、第２の電子部品の電極とが電気的に接続されてなることを特徴とする。 Further, the mounting body according to the present invention includes a first adhesive layer containing a polyvinyl acetal resin, a cationic polymerizable resin, a cationic polymerization initiator, and conductive particles, a cationic polymerizable resin, and a cationic polymerization. The electrode of the first electronic component and the electrode of the second electronic component are electrically connected by a circuit connecting material having a second adhesive layer containing an initiator. .
　本発明によれば、低温で圧着した場合でも導電性粒子の高い捕捉効率が得られ、低温硬化性を改善することができる。 According to the present invention, high capture efficiency of conductive particles can be obtained even when pressure bonding is performed at a low temperature, and low-temperature curability can be improved.
　以下、本発明の実施の形態について、図面を参照しながら下記順序にて詳細に説明する。
１．回路接続材料及びその製造方法
２．実装体及びその製造方法
３．実施例 Hereinafter, embodiments of the present invention will be described in detail in the following order with reference to the drawings.
1. 1. Circuit connection material and manufacturing method thereof 2. Mounted body and manufacturing method thereof Example
　＜１．回路接続材料及びその製造方法＞
　本実施の形態における回路接続材料は、導電性粒子を含有する第１の接着剤層と、第２の接着剤層とが積層された２層構造により、優れた粒子捕捉性を有するものである。 <1. Circuit connection material and manufacturing method thereof>
The circuit connection material in the present embodiment has excellent particle trapping properties due to a two-layer structure in which a first adhesive layer containing conductive particles and a second adhesive layer are laminated. .
　第１の接着剤層は、ポリビニルアセタール樹脂と、カチオン重合性樹脂と、カチオン重合開始剤と、導電性粒子とを含有する。 The first adhesive layer contains a polyvinyl acetal resin, a cationic polymerizable resin, a cationic polymerization initiator, and conductive particles.
　ポリビニルアセタール樹脂は、下記化学式（１）に示すように、ポリビニルアルコール（ＰＶＡ：polyvinyl alcohol）とアルデヒドとのアセタール化反応によって合成される。 The polyvinyl acetal resin is synthesized by an acetalization reaction between polyvinyl alcohol (PVA: polyvinyl alcohol) and an aldehyde as shown in the following chemical formula (1).
Figure JPOXMLDOC01-appb-C000001
Figure JPOXMLDOC01-appb-C000001
　また、ポリビニルアセタール樹脂の一つであるポリビニルブチラール樹脂は、ポリビニルアルコールとブチルアルデヒドとのブチラール化反応によって合成されるが、完全にブチラール化しないため、下記化学式（２）に示すようにアセチル基及び水酸基が残る。 Polyvinyl butyral resin, which is one of polyvinyl acetal resins, is synthesized by a butyralization reaction between polyvinyl alcohol and butyraldehyde. However, since it is not completely butyralized, as shown in the following chemical formula (2), an acetyl group and A hydroxyl group remains.
Figure JPOXMLDOC01-appb-C000002
Figure JPOXMLDOC01-appb-C000002
　このようにポリビニルブチラール樹脂に代表されるポリビニルアセタール樹脂は、重合度や、アセタール基（ブチラール基）、アセチル基、水酸基などの組織の割合により、熱的・機械的性質、溶融粘度が左右される。 Thus, the polyvinyl acetal resin represented by the polyvinyl butyral resin is affected by thermal and mechanical properties and melt viscosity depending on the degree of polymerization and the ratio of the structure such as acetal group (butyral group), acetyl group, and hydroxyl group. .
　本実施の形態におけるポリビニルアセタール樹脂は、水酸基を有するため、カチオン重合を活性化させ、低温硬化性を向上させることができる。具体的なポリビニルアセタール樹脂の水酸基率は、２０ｍｏｌ％以上４０ｍｏｌ％以下であることが好ましく、３０ｍｏｌ％以上４０ｍｏｌ％以下であることがより好ましい。ポリビニルアセタール樹脂の水酸基率が、上記範囲内であることにより、低温硬化性を向上させることができる。 Since the polyvinyl acetal resin in the present embodiment has a hydroxyl group, it can activate cationic polymerization and improve low temperature curability. Specifically, the hydroxyl group ratio of the polyvinyl acetal resin is preferably 20 mol% or more and 40 mol% or less, and more preferably 30 mol% or more and 40 mol% or less. When the hydroxyl group ratio of the polyvinyl acetal resin is within the above range, the low temperature curability can be improved.
　また、ポリビニルアセタール樹脂の常温における粘度は、５０ｍＰａ・ｓ以上２００ｍＰａ・ｓ以下であることが好ましい。ポリビニルアセタール樹脂の常温における粘度が、上記範囲内であることにより、常温でのＳＵＳへの付着を防止し、膜性を向上させるとともに、仮貼り温度の上昇を抑え、仮貼り性を向上させることができる。なお、ポリビニルアセタール樹脂の粘度は、エタノール／トルエン＝１／１の５％溶液又は１０％溶液を溶剤とし、測定温度２０℃で回転粘度計（ＢＭ型）を用いて測定したものである。 The viscosity of the polyvinyl acetal resin at normal temperature is preferably 50 mPa · s or more and 200 mPa · s or less. When the viscosity of the polyvinyl acetal resin at room temperature is within the above range, it prevents adhesion to SUS at room temperature, improves film properties, suppresses the increase in temporary bonding temperature, and improves temporary bonding properties. Can do. The viscosity of the polyvinyl acetal resin was measured using a rotational viscometer (BM type) at a measurement temperature of 20 ° C. with a 5% or 10% solution of ethanol / toluene = 1/1 as a solvent.
　また、ポリビニルアセタール樹脂のガラス転移温度（Ｔｇ）は、５０℃以上１００℃以下であることが好ましく、８０℃以上１００℃以下であることがより好ましい。ポリビニルアセタール樹脂のガラス転移温度（Ｔｇ）が、上記範囲内であることにより、圧着時の流動性を抑え、導電性粒子の捕捉性を向上させることができる。 The glass transition temperature (Tg) of the polyvinyl acetal resin is preferably 50 ° C. or higher and 100 ° C. or lower, and more preferably 80 ° C. or higher and 100 ° C. or lower. When the glass transition temperature (Tg) of the polyvinyl acetal resin is within the above range, the fluidity at the time of pressure bonding can be suppressed and the trapping property of the conductive particles can be improved.
　また、ポリビニルアセタール樹脂の含有量は、第１の接着剤層の樹脂成分の合計１００質量部に対して５～３０質量部であることが好ましい。ポリビニルアセタール樹脂の含有量が、上記範囲内であることにより、優れた低温硬化性、仮貼り性、及び膜性を得ることができる。 In addition, the content of the polyvinyl acetal resin is preferably 5 to 30 parts by mass with respect to 100 parts by mass in total of the resin components of the first adhesive layer. When the content of the polyvinyl acetal resin is within the above range, excellent low-temperature curability, temporary stickability, and film properties can be obtained.
　カチオン重合性樹脂としては、エチレンオキシド、プロピレンオキシド、ブチレンオキシド、スチレンオキシド、フェニルグリシジルエーテル、ブチルグリシジルエーテル等の１官能性エポキシ化合物；ビスフェノールＡ型エポキシ樹脂、ビスフェノールＦ型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、脂環式エポキシ樹脂、トリグリシジルイソシアネート、ヒダントインエポキシ等の含複素環エポキシ樹脂；水添ビスフェノールＡ型エポキシ樹脂、プロピレングリコールジグリシジルエーテル、ペンタエリスリトール－ポリグリシジルエーテル等の脂肪族系エポキシ樹脂；芳香族、脂肪族もしくは脂環式のカルボン酸とエピクロルヒドリンとの反応によって得られるエポキシ樹脂；スピロ環含有エポキシ樹脂；ｏ－アリル－フェノールノボラック化合物とエピクロルヒドリンとの反応生成物であるグリシジルエーテル型エポキシ樹脂；ビスフェノールＡのそれぞれの水酸基のオルト位にアリル基を有するジアリルビスフェノール化合物とエピクロルヒドリンとの反応生成物であるグリシジルエーテル型エポキシ樹脂；シッフ系化合物、スチルベン化合物およびアゾベンゼン化合物のジグリシジルエーテル型エポキシ樹脂；（１，１，１，３，３，３－ヘキサフルオロ－２－ヒドロキシイソプロピル）シクロヘキサンとエピクロルヒドリンとの反応生成物等の含フッ素脂環式、芳香環式エポキシ樹脂等を用いることができる。これらの中でも、特にビスフェノールＡ型エポキシ樹脂、フェノキシ樹脂等のカチオン重合性樹脂を単独又は混合して用いることが好ましい。 Examples of cationic polymerizable resins include monofunctional epoxy compounds such as ethylene oxide, propylene oxide, butylene oxide, styrene oxide, phenyl glycidyl ether, and butyl glycidyl ether; bisphenol A type epoxy resins, bisphenol F type epoxy resins, and phenol novolac type epoxy resins. Heterocyclic epoxy resins such as alicyclic epoxy resins, triglycidyl isocyanate, and hydantoin epoxy; Aliphatic epoxy resins such as hydrogenated bisphenol A type epoxy resin, propylene glycol diglycidyl ether, pentaerythritol-polyglycidyl ether; Epoxy resin obtained by reaction of an aliphatic, aliphatic or cycloaliphatic carboxylic acid with epichlorohydrin; spiro ring-containing epoxy resin; o-allyl-sulfur A glycidyl ether type epoxy resin which is a reaction product of a novolac compound and epichlorohydrin; a glycidyl ether type epoxy resin which is a reaction product of a diallyl bisphenol compound having an allyl group at the ortho position of each hydroxyl group of bisphenol A and epichlorohydrin; Diglycidyl ether type epoxy resins of Schiff compounds, stilbene compounds and azobenzene compounds; fluorine-containing products such as reaction products of (1,1,1,3,3,3-hexafluoro-2-hydroxyisopropyl) cyclohexane and epichlorohydrin Alicyclic and aromatic cyclic epoxy resins can be used. Among these, cation polymerizable resins such as bisphenol A type epoxy resins and phenoxy resins are preferably used alone or in combination.
　カチオン重合開始剤は、カチオン種がエポキシ樹脂末端のエポキシ基を開環させ、エポキシ樹脂同士を自己架橋させるものである。このようなカチオン重合開始剤としては、芳香族スルホニウム塩、芳香族ジアゾニウム塩、ヨードニウム塩、ホスホニウム塩、セレノニウム塩等のオニウム塩を挙げることができる。特に、芳香族スルホニウム塩は、低温での反応性に優れ、ポットライフが長いため、カチオン重合開始剤として好適である。 The cationic polymerization initiator is one in which a cationic species causes the epoxy group at the end of the epoxy resin to open and self-crosslinks the epoxy resins. Examples of such cationic polymerization initiators include onium salts such as aromatic sulfonium salts, aromatic diazonium salts, iodonium salts, phosphonium salts, and selenonium salts. In particular, an aromatic sulfonium salt is suitable as a cationic polymerization initiator because of its excellent reactivity at low temperatures and a long pot life.
　導電性粒子は、例えば、ニッケル、金、銅等の金属粒子、樹脂粒子に金めっき等を施したもの、樹脂粒子に金めっきを施した粒子の最外層に絶縁被覆を施したもの等を用いることができる。また、導電性粒子の平均粒径は、導通信頼性の観点から、１～２０μｍとすることが好ましい。 As the conductive particles, for example, metal particles such as nickel, gold, and copper, those obtained by applying gold plating to resin particles, and those obtained by applying an insulating coating to the outermost layer of particles obtained by applying gold plating to resin particles are used. be able to. The average particle diameter of the conductive particles is preferably 1 to 20 μm from the viewpoint of conduction reliability.
　また、その他の添加組成物として、シランカップリング剤を添加することが好ましい。シランカップリング剤としては、エポキシ系、アミノ系、メルカプト・スルフィド系、ウレイド系などを用いることができる。これにより、有機材料と無機材料の界面における接着性を向上させることができる。また、無機フィラーを添加させてもよい。無機フィラーとしては、シリカ、タルク、酸化チタン、炭酸カルシウム、酸化マグネシウム等を用いることができ、無機フィラーの種類は特に限定されるものではない。無機フィラーの含有量により、流動性を制御し、粒子捕捉率を向上させることができる。また、ゴム成分なども接合体の応力を緩和させる目的で、適宜使用してもよい。 Moreover, it is preferable to add a silane coupling agent as another additive composition. As the silane coupling agent, epoxy, amino, mercapto sulfide, ureido, and the like can be used. Thereby, the adhesiveness in the interface of an organic material and an inorganic material can be improved. Moreover, you may add an inorganic filler. As the inorganic filler, silica, talc, titanium oxide, calcium carbonate, magnesium oxide and the like can be used, and the kind of the inorganic filler is not particularly limited. Depending on the content of the inorganic filler, the fluidity can be controlled and the particle capture rate can be improved. Further, a rubber component or the like may be appropriately used for the purpose of relaxing the stress of the joined body.
　また、第２の接着剤層は、カチオン重合性樹脂と、カチオン重合開始剤とを含有する。カチオン重合性樹脂、及びカチオン重合開始剤は、第１のエポキシ樹脂と同様であるため、説明を省略する。また、その他の添加組成物として、第１のエポキシ樹脂と同様に、シランカップリング剤を添加することが好ましい。また、無機フィラー、ゴム成分などを添加してもよい。 The second adhesive layer contains a cationic polymerizable resin and a cationic polymerization initiator. Since the cationic polymerizable resin and the cationic polymerization initiator are the same as those of the first epoxy resin, description thereof is omitted. Moreover, it is preferable to add a silane coupling agent as another additive composition similarly to the 1st epoxy resin. Moreover, you may add an inorganic filler, a rubber component, etc.
　また、第１の接着剤層と同様、第２の接着剤層にポリビニルアセタール樹脂を含有させても構わない。この場合、ポリビニルアセタール樹脂の含有量を第１の接着剤層のポリビニルアセタール樹脂の含有量よりも少なくすればよい。 Also, like the first adhesive layer, the second adhesive layer may contain a polyvinyl acetal resin. In this case, the content of the polyvinyl acetal resin may be less than the content of the polyvinyl acetal resin in the first adhesive layer.
　このような構成からなる回路接続材料は、第１の接着剤層と第２の接着剤層との２層構造を有し、第１の接着剤層にポリビニルアセタール樹脂が含有されているため、低温で圧着した場合でも導電性粒子の高い捕捉効率が得られ、優れた低温硬化性を得ることができる。 The circuit connecting material having such a configuration has a two-layer structure of a first adhesive layer and a second adhesive layer, and the polyvinyl acetal resin is contained in the first adhesive layer. Even when pressure bonding is performed at a low temperature, high capture efficiency of the conductive particles can be obtained, and excellent low-temperature curability can be obtained.
　次に、前述した回路接続材料が膜状に形成された異方性導電フィルムの製造方法について説明する。本実施の形態における回路接続材料の製造方法は、第１の接着剤層と、第２の接着剤層とを貼り合わせるものであり、第１の接着剤層を作成する工程と、第２の接着剤層を作成する工程と、第１の接着剤層と第２の接着剤層とを貼り付ける工程とを有する。 Next, a method for manufacturing an anisotropic conductive film in which the above-described circuit connecting material is formed into a film will be described. The method for manufacturing a circuit connecting material in the present embodiment is a method in which the first adhesive layer and the second adhesive layer are bonded together, a step of creating the first adhesive layer, It has the process of creating an adhesive bond layer, and the process of affixing a 1st adhesive bond layer and a 2nd adhesive bond layer.
　第１の接着剤層を作成する工程では、カチオン重合性樹脂と、カチオン重合開始剤とを含有する接着剤組成物を溶剤に溶解させ、導電性粒子を添加する。溶剤としては、トルエン、酢酸エチルなど、又はこれらの混合溶剤を用いることができる。第１の接着剤層の樹脂組成物を調整後、バーコーター、塗布装置などを用いて剥離基材上に塗布する。 In the step of creating the first adhesive layer, an adhesive composition containing a cationic polymerizable resin and a cationic polymerization initiator is dissolved in a solvent, and conductive particles are added. As the solvent, toluene, ethyl acetate or the like, or a mixed solvent thereof can be used. After adjusting the resin composition of the first adhesive layer, it is applied onto the release substrate using a bar coater, a coating device or the like.
　剥離基材は、例えば、シリコーンなどの剥離剤をＰＥＴ（Poly Ethylene Terephthalate）、ＯＰＰ（Oriented Polypropylene）、ＰＭＰ（Poly-4-methylpentene－1）、ＰＴＦＥ（Polytetrafluoroethylene）などの基材上に塗布した積層構造からなる。 The release substrate is, for example, a laminate in which a release agent such as silicone is applied on a substrate such as PET (Poly Ethylene Terephthalate), OPP (Oriented Polypropylene), PMP (Poly-4-methylpentene-1), PTFE (Polytetrafluoroethylene), etc. Consists of structure.
　次に、剥離基材上に塗布された樹脂組成物を熱オーブン、加熱乾燥装置などにより乾燥させる。これにより、厚さ５～５０μｍ程度の第１の接着剤層を得ることができる。 Next, the resin composition applied on the release substrate is dried by a heat oven, a heat drying apparatus or the like. As a result, a first adhesive layer having a thickness of about 5 to 50 μm can be obtained.
　また、第２の接着剤層を作成する工程は、第１の接着剤層と同様、カチオン重合性樹脂と、カチオン重合開始剤とを含有する接着剤組成物を溶剤に溶解させる。そして、第２の接着剤層の樹脂組成物を調整後、これを剥離基材上に塗布し、溶剤を揮発させることにより、第２の接着剤層を得ることができる。 Also, in the step of creating the second adhesive layer, an adhesive composition containing a cationic polymerizable resin and a cationic polymerization initiator is dissolved in a solvent as in the case of the first adhesive layer. And after adjusting the resin composition of a 2nd adhesive bond layer, this can be apply | coated on a peeling base material, and a 2nd adhesive bond layer can be obtained by volatilizing a solvent.
　次の第１の接着剤層と第２の接着剤層とを貼り付ける工程では、第１の接着剤層と第２の接着剤層とを貼り付けて積層し、２層構造の異方性導電フィルムを作製する。 In the next step of attaching the first adhesive layer and the second adhesive layer, the first adhesive layer and the second adhesive layer are attached and laminated to form an anisotropy having a two-layer structure. A conductive film is produced.
　なお、上述の実施の形態では、第１の接着剤層と第２の接着剤層とを貼り付けて製造することとしたが、これに限られるものではなく、一方の接着剤層を形成した後、他方の接着剤層の樹脂組成物を塗布し、乾燥させて製造してもよい。 In the above-described embodiment, the first adhesive layer and the second adhesive layer are attached and manufactured. However, the present invention is not limited to this, and one adhesive layer is formed. Then, the resin composition of the other adhesive layer may be applied and dried.
　＜２．実装体の製造方法＞
　次に、上述した回路接続材料を用いた実装体の製造方法について説明する。本実施の形態における実装体の製造方法は、上述した回路接続材料の第１の接着剤層側を第１の電子部品の電極上に仮貼りする仮貼工程と、回路接続材料上に第２の電子部品を配置し、第２の電子部品の上面から圧着ヘッドにて押圧する押圧工程とを有する。これにより、第１の電子部品の電極と、第２の電子部品の電極とが電気的に接続されてなる実装体を得ることができる。 <2. Manufacturing method of mounting body>
Next, the manufacturing method of the mounting body using the circuit connection material mentioned above is demonstrated. The manufacturing method of the mounting body in the present embodiment includes a temporary pasting step in which the first adhesive layer side of the circuit connection material described above is temporarily pasted on the electrode of the first electronic component, and a second on the circuit connection material. And a pressing step of pressing the electronic component from the upper surface of the second electronic component with a crimping head. Thereby, it is possible to obtain a mounting body in which the electrode of the first electronic component and the electrode of the second electronic component are electrically connected.
　第１の電子部品としては、ガラス基板にＩＺＯ（Indium Zinc Oxide）膜がコーティングされたＩＺＯコーティングガラス、ガラス基板にＳｉＮｘ（シリコン窒化）膜がコーティングされたＳｉＮｘコーティングガラスなどが挙げられる。また、第２の電子部品としては、ＣＯＦ（Chip On Film）、ＩＣ（Integrated Circuit）などが挙げられる。 Examples of the first electronic component include IZO coated glass in which a glass substrate is coated with an IZO (Indium / Zinc / Oxide) film, and SiNx coated glass in which a glass substrate is coated with a SiNx (silicon nitride) film. Examples of the second electronic component include a COF (Chip On Film) and an IC (Integrated Circuit).
　本実施の形態では、ポリビニルアセタール樹脂と、カチオン重合性樹脂と、カチオン重合開始剤と、導電性粒子とを含有する第１の接着剤層と、カチオン重合性樹脂と、カチオン重合開始剤とを含有する第２の接着剤層とが積層された２層構造の回路接続材料を用いることにより、低温で硬化させた場合でも導電性粒子の高い捕捉効率が得られ、優れた接続信頼性を得ることができる。 In the present embodiment, a polyvinyl acetal resin, a cationic polymerizable resin, a cationic polymerization initiator, a first adhesive layer containing conductive particles, a cationic polymerizable resin, and a cationic polymerization initiator. By using a circuit connection material having a two-layer structure in which a second adhesive layer contained is laminated, high capture efficiency of conductive particles can be obtained even when cured at a low temperature, and excellent connection reliability is obtained. be able to.
　＜３．実施例＞
　以下、本発明の実施例について説明する。本実施例では、ポリビニルアセタール樹脂を含有するＡＣＦ層とＮＣＦ層とを積層させた２層構造の異方性導電フィルムを作製し、この異方性導電フィルムを用いて実装体を作製し、反応性、低温硬化性、仮貼り性、及び膜性の評価を行った。なお、本発明はこれらの実施例に限定されるものではない。 <3. Example>
Examples of the present invention will be described below. In this example, an anisotropic conductive film having a two-layer structure in which an ACF layer containing a polyvinyl acetal resin and an NCF layer are laminated is produced, and a mounted body is produced using the anisotropic conductive film. Property, low-temperature curability, temporary sticking property, and film property were evaluated. The present invention is not limited to these examples.
　反応性、低温硬化性、仮貼り性、及び膜性の評価は、次のように行った。 Evaluation of reactivity, low-temperature curability, temporary sticking property, and film property was performed as follows.
　［反応性の評価］
　示差走査熱量計ＤＳＣ２００（セイコー電子工業）を用い、試料１０ｍｇを、３０℃から２５０℃まで１０℃／ｍｉｎで昇温させたときの発熱ピークを測定した。 [Evaluation of reactivity]
Using a differential scanning calorimeter DSC200 (Seiko Electronics Co., Ltd.), an exothermic peak was measured when 10 mg of a sample was heated from 30 ° C. to 250 ° C. at 10 ° C./min.
　［低温硬化性］
　１５０℃の温度条件又は１６０℃の温度条件で圧着した実装体について、デジタルマルチメータ（デジタルマルチメータ７５５５、横河電機社製）を用いて４端子法にて電流１ｍＡを流したときの各ピンの導通抵抗を測定し、最大値及び最小値を求めた。 [Low temperature curability]
Each pin when a current of 1 mA is passed by a four-terminal method using a digital multimeter (Digital Multimeter 7555, manufactured by Yokogawa Electric Corporation) for a mounting body that is crimped at a temperature condition of 150 ° C. or 160 ° C. The conduction resistance was measured and the maximum and minimum values were determined.
　［仮貼り性の評価］
　評価用ガラス基板（ＩＺＯ（Indium Zinc Oxide）２５０ｎｍコーティングガラス）上に、１．５ｍｍ幅にスリットされた異方性導電フィルムを１．５ｍｍ幅のツールの仮圧着機にて２ＭＰａ－１ｓｅｃの条件で仮圧着し、転着可能な温度の下限値を求めた。 [Evaluation of temporary sticking properties]
An anisotropic conductive film slit to 1.5 mm width on a glass substrate for evaluation (IZO (Indium Zinc Oxide) 250 nm coated glass) was applied under a condition of 2 MPa-1 sec with a temporary crimping machine of a 1.5 mm width tool. Temporary pressure bonding was performed, and the lower limit of the transferable temperature was determined.
　［膜性の評価］
　常温で異方性導電性フィルムをステンレス板（ＳＵＳ３０４）に貼り付け、引き剥がしたときのステンレス板への樹脂の付着の有無を調べた。なお、ステンレスは、異方性導電フィルムのテープを引き回すロールの材料である。 [Evaluation of film properties]
An anisotropic conductive film was attached to a stainless steel plate (SUS304) at room temperature, and the presence or absence of the resin adhering to the stainless steel plate when it was peeled off was examined. Stainless steel is a material for a roll for drawing a tape of an anisotropic conductive film.
　［実施例１］
　（異方性導電フィルムの作製）
　フェノキシ樹脂（品名：ＹＰ－７０、東都化成社製）を１５質量部と、エポキシ樹脂（品名：ＹＤ－０１９、東都化成社製）を１５質量部と、エポキシ樹脂（品名：ＥＰ８２８、ＪＥＲ社製）を３５質量部と、特殊ポリビニルアセタール樹脂（品名：ＢＸ－１、積水化学工業社製、水酸基：３３±３ｍｏｌ％、粘度：８０～１３０ｍＰａ・ｓ（２０℃）、ガラス転移温度（Ｔｇ）：９０℃）を１５質量部と、シランカップリング剤（品名：Ａ１８７、モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社製）を２質量部と、カチオン重合開始剤（品名：ＳＩ－６０Ｌ、三新化学社製）を１０質量部とで構成された組成物中に、３０質量部の導電性粒子（品名：ＡＵＬ７０４、積水化学工業社製）を分散させた。これをＰＥＴフィルム上にバーコーターを用いて塗布し、オーブンで乾燥させ、厚さ８μｍのＡＣＦ層を作製した。 [Example 1]
(Preparation of anisotropic conductive film)
15 parts by mass of phenoxy resin (product name: YP-70, manufactured by Tohto Kasei Co., Ltd.), 15 parts by mass of epoxy resin (product name: YD-019, manufactured by Tohto Kasei Co., Ltd.), and epoxy resin (product name: EP828, manufactured by JER) ) 35 parts by weight, special polyvinyl acetal resin (product name: BX-1, manufactured by Sekisui Chemical Co., Ltd., hydroxyl group: 33 ± 3 mol%, viscosity: 80 to 130 mPa · s (20 ° C.), glass transition temperature (Tg): 90 parts) and 2 parts by weight of a silane coupling agent (product name: A187, manufactured by Momentive Performance Materials Japan GK) and a cationic polymerization initiator (product name: SI-60L, Sanshin Chemical) 30 parts by weight of conductive particles (product name: AUL704, manufactured by Sekisui Chemical Co., Ltd.) were dispersed in a composition composed of 10 parts by weight. This was applied onto a PET film using a bar coater and dried in an oven to produce an ACF layer having a thickness of 8 μm.
　フェノキシ樹脂（品名：ＹＰ－７０、東都化成社製）を３０質量部と、エポキシ樹脂（品名：ＹＤ－０１９、東都化成社製）を２０質量部と、エポキシ樹脂（品名：ＥＰ８２８、ＪＥＲ社製）を３５質量部と、シランカップリング剤（品名：Ａ１８７、モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社製）を２質量部と、カチオン重合開始剤（品名：ＳＩ－６０Ｌ、三新化学社製）を１０質量部とで構成された組成物をＰＥＴフィルム上にバーコーターを用いて塗布し、オーブンで乾燥させ、厚さ１６μｍのＮＣＦ層を作製した。 30 parts by mass of phenoxy resin (product name: YP-70, manufactured by Tohto Kasei Co., Ltd.), 20 parts by mass of epoxy resin (product name: YD-019, manufactured by Tohto Kasei Co., Ltd.), and epoxy resin (product name: EP828, manufactured by JER) ), 35 parts by mass, 2 parts by mass of a silane coupling agent (product name: A187, manufactured by Momentive Performance Materials Japan GK), and a cationic polymerization initiator (product name: SI-60L, manufactured by Sanshin Chemical Co., Ltd.) ) Was applied onto a PET film using a bar coater and dried in an oven to produce a 16 μm thick NCF layer.
　前述のＡＣＦ層とＮＣＦ層とをロールラミネータを用いて、ロール温度４５℃にてラミネートし、ＡＣＦ層とＮＣＦ層と２層構造の異方性導電フィルムを作製した。 The aforementioned ACF layer and NCF layer were laminated at a roll temperature of 45 ° C. using a roll laminator to produce an anisotropic conductive film having a two-layer structure with an ACF layer and an NCF layer.
　（実装体の作製）
　異方性導電フィルムを用いて評価用ＩＣチップ（バンプサイズ：３０×８５μｍ、ピッチ：５０μｍ、金バンプ高さｈ＝１５μｍ）と評価用ガラス基板（ＩＴＯパターン、ガラス厚みｔ＝０．７ｍｍ）とを接合した。 (Production of mounting body)
IC chip for evaluation using an anisotropic conductive film (bump size: 30 × 85 μm, pitch: 50 μm, gold bump height h = 15 μm) and glass substrate for evaluation (ITO pattern, glass thickness t = 0.7 mm) Were joined.
　先ず、１．５ｍｍ幅にスリットされた異方性導電フィルムのＡＣＦ層側を評価用ガラス基板に仮貼りした。次に、異方性導電フィルムのＮＣＦ層側から評価用ＩＣチップを搭載し、仮固定した。その後、ヒートツール１．５ｍｍ幅で、緩衝材として１００μｍ厚みのポリテトラフルオロエチレンからなるシートを用い、１５０℃又は１６０℃、３ＭＰａ、５秒間（ツールスピード１０ｍｍ／ｓｅｃ、ステージ温度４０℃）の条件で圧着を行い、実装体を作製した。 First, the ACF layer side of the anisotropic conductive film slit to a width of 1.5 mm was temporarily attached to a glass substrate for evaluation. Next, an evaluation IC chip was mounted from the NCF layer side of the anisotropic conductive film and temporarily fixed. Then, using a sheet made of polytetrafluoroethylene with a heat tool of 1.5 mm width and a thickness of 100 μm as a buffer material, conditions of 150 ° C. or 160 ° C., 3 MPa, 5 seconds (tool speed 10 mm / sec, stage temperature 40 ° C.) The mounting body was manufactured by pressure bonding.
　（評価結果）
　表１に、実施例１の評価結果を示す。異方性導電フィルムのＤＳＣピーク温度は１０２℃であり、優れた反応性を有することが分かった。１６０℃の条件で圧着した実装体の導通抵抗値の最大値は１．２Ω、最小値は０．３Ωであった。また、１５０℃の条件で圧着した実装体の導通抵抗値の最大値は１．１Ω、最小値は０．２Ωであり、低温硬化性が向上したことが分かった。また、仮圧着時の転着可能な温度の下限値は５０℃であり、優れた仮貼り性を有することが分かった。また、常温でのステンレスへの異方性導電性フィルムの付着は無く、優れた膜性を有することが分かった。 (Evaluation results)
Table 1 shows the evaluation results of Example 1. The DSC peak temperature of the anisotropic conductive film was 102 ° C., and was found to have excellent reactivity. The maximum value of the conduction resistance value of the mounted body crimped at 160 ° C. was 1.2Ω, and the minimum value was 0.3Ω. Moreover, the maximum value of the conduction resistance value of the mounting body crimped | bonded on 150 degreeC conditions was 1.1 ohm, and the minimum value was 0.2 ohm, and it turned out that low-temperature curability improved. Moreover, the lower limit of the temperature which can be transferred at the time of temporary pressure bonding is 50 ° C., and it was found that the film has excellent temporary stickability. It was also found that the anisotropic conductive film did not adhere to the stainless steel at room temperature and had excellent film properties.
　［実施例２］
　特殊ポリビニルアセタール樹脂に代えて、ポリビニルブチラール樹脂（品名：ＢＭ－１、積水化学工業社製、水酸基：約３４ｍｏｌ％、粘度：６０～１００ｍＰａ・ｓ（２０℃）、ガラス転移温度（Ｔｇ）：６７℃）を用いてＡＣＦ層を作製した以外は、実施例１と同様に異方性導電フィルムの作製し、実装体を作製した。 [Example 2]
Instead of the special polyvinyl acetal resin, polyvinyl butyral resin (product name: BM-1, manufactured by Sekisui Chemical Co., Ltd., hydroxyl group: about 34 mol%, viscosity: 60 to 100 mPa · s (20 ° C.), glass transition temperature (Tg): 67 The anisotropic conductive film was produced in the same manner as in Example 1 except that the ACF layer was produced using (° C.), and a mounted body was produced.
　（評価結果）
　表１に、実施例２の評価結果を示す。異方性導電フィルムのＤＳＣピーク温度は１０２℃であり、優れた反応性を有することが分かった。１６０℃の条件で圧着した実装体の導通抵抗値の最大値は１．３Ω、最小値は０．３Ωであった。また、１５０℃の条件で圧着した実装体の導通抵抗値の最大値は１．２Ω、最小値は０．２Ωであり、低温硬化性が向上したことが分かった。また、仮圧着時の転着可能な温度の下限値は５０℃であり、優れた仮貼り性を有することが分かった。また、常温でのステンレスへの異方性導電性フィルムの付着は無く、優れた膜性を有することが分かった。 (Evaluation results)
Table 1 shows the evaluation results of Example 2. The DSC peak temperature of the anisotropic conductive film was 102 ° C., and was found to have excellent reactivity. The maximum value of the conduction resistance value of the mounted body crimped at 160 ° C. was 1.3Ω, and the minimum value was 0.3Ω. Moreover, the maximum value of the conduction | electrical_connection resistance value of the mounting body crimped | bonded on 150 degreeC conditions was 1.2 ohms, and the minimum value was 0.2 ohms, and it turned out that low-temperature curability improved. Moreover, the lower limit of the temperature which can be transferred at the time of temporary pressure bonding is 50 ° C., and it was found that the film has excellent temporary stickability. It was also found that the anisotropic conductive film did not adhere to the stainless steel at room temperature and had excellent film properties.
　［実施例３］
　特殊ポリビニルアセタール樹脂を７．５質量部とし、ポリビニルブチラール樹脂（品名：ＢＭ－１、積水化学工業社製、水酸基：約３４ｍｏｌ％、粘度：６０～１００ｍＰａ・ｓ（２０℃）、ガラス転移温度（Ｔｇ）：６７℃）を７．５質量部としてＡＣＦ層を作製した以外は、実施例１と同様に異方性導電フィルムの作製し、実装体を作製した。 [Example 3]
7.5 parts by weight of a special polyvinyl acetal resin, polyvinyl butyral resin (product name: BM-1, manufactured by Sekisui Chemical Co., Ltd., hydroxyl group: about 34 mol%, viscosity: 60 to 100 mPa · s (20 ° C.), glass transition temperature ( An anisotropic conductive film was produced in the same manner as in Example 1 except that the ACF layer was produced with Tg): 67 ° C. being 7.5 parts by mass, and a mounting body was produced.
　（評価結果）
　表１に、実施例３の評価結果を示す。異方性導電フィルムのＤＳＣピーク温度は１０２℃であり、優れた反応性を有することが分かった。１６０℃の条件で圧着した実装体の導通抵抗値の最大値は１．２Ω、最小値は０．３Ωであった。また、１５０℃の条件で圧着した実装体の導通抵抗値の最大値は１．１Ω、最小値は０．２Ωであり、低温硬化性が向上したことが分かった。また、仮圧着時の転着可能な温度の下限値は５０℃であり、優れた仮貼り性を有することが分かった。また、常温でのステンレスへの異方性導電性フィルムの付着は無く、優れた膜性を有することが分かった。 (Evaluation results)
Table 1 shows the evaluation results of Example 3. The DSC peak temperature of the anisotropic conductive film was 102 ° C., and it was found that the anisotropic conductive film had excellent reactivity. The maximum value of the conduction resistance value of the mounted body crimped at 160 ° C. was 1.2Ω, and the minimum value was 0.3Ω. Moreover, the maximum value of the conduction resistance value of the mounting body crimped | bonded on 150 degreeC conditions was 1.1 ohms, and the minimum value was 0.2 ohms, and it turned out that low-temperature curability improved. Moreover, the lower limit of the temperature which can be transferred at the time of temporary pressure bonding is 50 ° C., and it was found that the film has excellent temporary stickability. It was also found that the anisotropic conductive film did not adhere to the stainless steel at room temperature and had excellent film properties.
　［比較例１］
　フェノキシ樹脂（品名：ＹＰ－７０、東都化成社製）を３０質量部と、エポキシ樹脂（品名：ＹＤ－０１９、東都化成社製）を２０質量部と、エポキシ樹脂（品名：ＥＰ８２８、ＪＥＲ社製）を３５質量部と、シランカップリング剤（品名：Ａ１８７、モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社製）を２質量部と、カチオン重合開始剤（品名：ＳＩ－６０Ｌ、三新化学社製）を１０質量部とで構成された組成物中に、３０質量部の導電性粒子（品名：ＡＵＬ７０４、積水化学工業社製）を分散させてＡＣＦ層を作製した以外は、実施例１と同様に異方性導電フィルムの作製し、実装体を作製した。 [Comparative Example 1]
30 parts by mass of phenoxy resin (product name: YP-70, manufactured by Tohto Kasei), 20 parts by mass of epoxy resin (product name: YD-019, manufactured by Tohto Kasei), and epoxy resin (product name: EP828, manufactured by JER) ), 35 parts by mass, 2 parts by mass of a silane coupling agent (product name: A187, manufactured by Momentive Performance Materials Japan GK), and a cationic polymerization initiator (product name: SI-60L, manufactured by Sanshin Chemical Co., Ltd.) ) Was dispersed in 10 parts by mass in the same manner as in Example 1 except that 30 parts by mass of conductive particles (product name: AUL704, manufactured by Sekisui Chemical Co., Ltd.) were dispersed to prepare an ACF layer. An anisotropic conductive film was prepared and a mounting body was prepared.
　（評価結果）
　表１に、比較例１の評価結果を示す。異方性導電フィルムのＤＳＣピーク温度は１０６℃であり、実施例よりも反応性が劣ることが分かった。１６０℃の条件で圧着した実装体の導通抵抗値の最大値は１．３Ω、最小値は０．３Ωであった。また、１５０℃の条件で圧着した実装体の導通抵抗値の最大値は５．３Ω、最小値は１．８Ωであり、１５０℃の条件では導通が不十分であった。また、仮圧着時の転着可能な温度の下限値は５０℃であり、優れた仮貼り性を有することが分かった。また、常温でのステンレスへの異方性導電性フィルムの付着は無く、優れた膜性を有することが分かった。 (Evaluation results)
Table 1 shows the evaluation results of Comparative Example 1. The DSC peak temperature of the anisotropic conductive film was 106 ° C., and it was found that the reactivity was inferior to the examples. The maximum value of the conduction resistance value of the mounted body crimped at 160 ° C. was 1.3Ω, and the minimum value was 0.3Ω. Moreover, the maximum value of the conduction resistance value of the mounted body crimped at 150 ° C. was 5.3Ω, and the minimum value was 1.8Ω, and the conduction was insufficient under the condition of 150 ° C. Moreover, the lower limit of the temperature which can be transferred at the time of temporary pressure bonding is 50 ° C., and it was found that the film has excellent temporary stickability. It was also found that the anisotropic conductive film did not adhere to the stainless steel at room temperature and had excellent film properties.
　［比較例２］
　フェノキシ樹脂（品名：ＹＰ－７０、東都化成社製）を３０質量部と、エポキシ樹脂（品名：ＹＤ－０１９、東都化成社製）を２０質量部と、エポキシ樹脂（品名：ＥＰ８２８、ＪＥＲ社製）を４５質量部と、シランカップリング剤（品名：Ａ１８７、モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社製）を２質量部と、カチオン重合開始剤（品名：ＳＩ－６０Ｌ、三新化学社製）を１５質量部とで構成された組成物中に、３０質量部の導電性粒子（品名：ＡＵＬ７０４、積水化学工業社製）を分散させてＡＣＦ層を作製した以外は、実施例１と同様に異方性導電フィルムの作製し、実装体を作製した。 [Comparative Example 2]
30 parts by mass of phenoxy resin (product name: YP-70, manufactured by Tohto Kasei Co., Ltd.), 20 parts by mass of epoxy resin (product name: YD-019, manufactured by Tohto Kasei Co., Ltd.), and epoxy resin (product name: EP828, manufactured by JER) ), 45 parts by mass, 2 parts by mass of a silane coupling agent (product name: A187, manufactured by Momentive Performance Materials Japan GK), and a cationic polymerization initiator (product name: SI-60L, manufactured by Sanshin Chemical Co., Ltd.) ) Was dispersed in a composition composed of 15 parts by mass, and 30 parts by mass of conductive particles (product name: AUL704, manufactured by Sekisui Chemical Co., Ltd.) were dispersed to produce an ACF layer. An anisotropic conductive film was prepared and a mounting body was prepared.
　（評価結果）
　表１に、比較例２の評価結果を示す。異方性導電フィルムのＤＳＣピーク温度は１０２℃であり、優れた反応性を有することが分かった。１６０℃の条件で圧着した実装体の導通抵抗値の最大値は１．２Ω、最小値は０．３Ωであった。また、１５０℃の条件で圧着した実装体の導通抵抗値の最大値は１．３Ω、最小値は０．３Ωであった。また、仮圧着時の転着可能な温度の下限値は５０℃であり、優れた仮貼り性を有することが分かった。また、常温でのステンレスへの異方性導電性フィルムの付着が有ったため、実施例よりも膜性が劣ることが分かった。 (Evaluation results)
Table 1 shows the evaluation results of Comparative Example 2. The DSC peak temperature of the anisotropic conductive film was 102 ° C., and it was found that the anisotropic conductive film had excellent reactivity. The maximum value of the conduction resistance value of the mounted body crimped at 160 ° C. was 1.2Ω, and the minimum value was 0.3Ω. Moreover, the maximum value of the conduction resistance value of the mounted body crimped at 150 ° C. was 1.3Ω, and the minimum value was 0.3Ω. Moreover, the lower limit of the temperature which can be transferred at the time of temporary pressure bonding is 50 ° C., and it was found that the film has excellent temporary stickability. Moreover, since there was adhesion of the anisotropic conductive film to stainless steel at normal temperature, it turned out that film property is inferior to an Example.
　［比較例３］
　フェノキシ樹脂（品名：ＹＰ－７０、東都化成社製）を４５質量部と、エポキシ樹脂（品名：ＹＤ－０１９、東都化成社製）を１０質量部と、エポキシ樹脂（品名：ＥＰ８２８、ＪＥＲ社製）を３５質量部と、シランカップリング剤（品名：Ａ１８７、モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社製）を２質量部と、カチオン重合開始剤（品名：ＳＩ－６０Ｌ、三新化学社製）を１５質量部とで構成された組成物中に、３０質量部の導電性粒子（品名：ＡＵＬ７０４、積水化学工業社製）を分散させてＡＣＦ層を作製した以外は、実施例１と同様に異方性導電フィルムの作製し、実装体を作製した。 [Comparative Example 3]
45 parts by mass of phenoxy resin (product name: YP-70, manufactured by Tohto Kasei Co., Ltd.), 10 parts by mass of epoxy resin (product name: YD-019, manufactured by Tohto Kasei Co., Ltd.), and epoxy resin (product name: EP828, manufactured by JER) ), 35 parts by mass, 2 parts by mass of a silane coupling agent (product name: A187, manufactured by Momentive Performance Materials Japan GK), and a cationic polymerization initiator (product name: SI-60L, manufactured by Sanshin Chemical Co., Ltd.) ) Was dispersed in a composition composed of 15 parts by mass, and 30 parts by mass of conductive particles (product name: AUL704, manufactured by Sekisui Chemical Co., Ltd.) were dispersed to produce an ACF layer. An anisotropic conductive film was prepared and a mounting body was prepared.
　（評価結果）
　表１に、比較例３の評価結果を示す。異方性導電フィルムのＤＳＣピーク温度は１０２℃であり、優れた反応性を有することが分かった。１６０℃の条件で圧着した実装体の導通抵抗値の最大値は１．２Ω、最小値は０．３Ωであった。また、１５０℃の条件で圧着した実装体の導通抵抗値の最大値は１．３Ω、最小値は０．３Ωであった。また、仮圧着時の転着可能な温度の下限値は６０℃であり、実施例よりも仮貼り性が劣ることが分かった。また、常温でのステンレスへの異方性導電性フィルムの付着は無く、優れた膜性を有することが分かった。 (Evaluation results)
Table 1 shows the evaluation results of Comparative Example 3. The DSC peak temperature of the anisotropic conductive film was 102 ° C., and was found to have excellent reactivity. The maximum value of the conduction resistance value of the mounted body crimped at 160 ° C. was 1.2Ω, and the minimum value was 0.3Ω. Moreover, the maximum value of the conduction resistance value of the mounted body crimped at 150 ° C. was 1.3Ω, and the minimum value was 0.3Ω. Moreover, the lower limit of the temperature which can be transferred at the time of temporary pressure bonding was 60 ° C., and it was found that the temporary sticking property was inferior to that of the example. It was also found that the anisotropic conductive film did not adhere to the stainless steel at room temperature and had excellent film properties.
Figure JPOXMLDOC01-appb-T000003
Figure JPOXMLDOC01-appb-T000003
　表１に示すように、ＡＣＦ層とＮＣＦ層とが積層された２層構造の異方性導電フィルムにおいて、ＡＣＦ層に特殊ポリビニルアセタール樹脂やポリビニルブチラール樹脂を配合することにより、低温硬化性を向上させることができることが分かった。また、仮貼り性及び膜性も優れていることが分かった。 As shown in Table 1, low-temperature curability is improved by blending a special polyvinyl acetal resin or polyvinyl butyral resin in the ACF layer in an anisotropic conductive film having a two-layer structure in which an ACF layer and an NCF layer are laminated. I found out that Moreover, it turned out that temporary sticking property and film property are also excellent.

Claims (6)

  1. 　ポリビニルアセタール樹脂と、カチオン重合性樹脂と、カチオン重合開始剤と、導電性粒子とを含有する第１の接着剤層と、
    　カチオン重合性樹脂と、カチオン重合開始剤とを含有する第２の接着剤層と
    　を有する回路接続材料。     A first adhesive layer containing a polyvinyl acetal resin, a cationic polymerizable resin, a cationic polymerization initiator, and conductive particles;
    A circuit connecting material comprising: a cationic polymerizable resin; and a second adhesive layer containing a cationic polymerization initiator.
  2. 　前記ポリビニルアセタール樹脂の常温における粘度は、５０ｍＰａ・ｓ以上２００ｍＰａ・ｓ以下である請求項１に記載の回路接続材料。 The circuit connection material according to claim 1, wherein the polyvinyl acetal resin has a viscosity at room temperature of 50 mPa · s to 200 mPa · s.
  3. 　前記ポリビニルアセタール樹脂のガラス転移温度（Ｔｇ）は、５０℃以上１００℃以下である請求項１又は２に記載の回路接続材料。 The circuit connection material according to claim 1 or 2, wherein a glass transition temperature (Tg) of the polyvinyl acetal resin is 50 ° C or higher and 100 ° C or lower.
  4. 　前記ポリビニルアセタール樹脂の水酸基率は、２０ｍｏｌ％以上４０ｍｏｌ％以下である請求項１に記載の回路接続材料。 The circuit connecting material according to claim 1, wherein the polyvinyl acetal resin has a hydroxyl group ratio of 20 mol% or more and 40 mol% or less.
  5. 　ポリビニルアセタール樹脂と、カチオン重合性樹脂と、カチオン重合開始剤と、導電性粒子とを含有する第１の接着剤層と、カチオン重合性樹脂と、カチオン重合開始剤とを含有する第２の接着剤層とを有する回路接続材料の第１の接着剤層側を第１の電子部品の電極上に仮貼りする仮貼工程と、
    　前記回路接続材料上に第２の電子部品を配置し、該第２の電子部品の上面から圧着ヘッドにて押圧する押圧工程と
    　を有する実装体の製造方法。     A second adhesive containing a polyvinyl acetal resin, a cationic polymerizable resin, a cationic polymerization initiator, a first adhesive layer containing conductive particles, a cationic polymerizable resin, and a cationic polymerization initiator. A temporary pasting step of temporarily pasting the first adhesive layer side of the circuit connecting material having the agent layer on the electrode of the first electronic component;
    A mounting method comprising: a pressing step of disposing a second electronic component on the circuit connection material and pressing the second electronic component from the upper surface of the second electronic component with a pressure-bonding head.
  6. 　ポリビニルアセタール樹脂と、カチオン重合性樹脂と、カチオン重合開始剤と、導電性粒子とを含有する第１の接着剤層と、カチオン重合性樹脂と、カチオン重合開始剤とを含有する第２の接着剤層とを有する回路接続材料によって、第１の電子部品の電極と、第２の電子部品の電極とが電気的に接続されてなる実装体。 A second adhesive containing a polyvinyl acetal resin, a cationic polymerizable resin, a cationic polymerization initiator, a first adhesive layer containing conductive particles, a cationic polymerizable resin, and a cationic polymerization initiator. A mounting body in which an electrode of a first electronic component and an electrode of a second electronic component are electrically connected by a circuit connecting material having an agent layer.
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