WO2013143055A1 - Dispositif d'émetteur-récepteur laser, procédé de fabrication pour celui-ci et procédé d'élargissement de plage de fonctionnement de température de celui-ci - Google Patents

Dispositif d'émetteur-récepteur laser, procédé de fabrication pour celui-ci et procédé d'élargissement de plage de fonctionnement de température de celui-ci Download PDF

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Publication number
WO2013143055A1
WO2013143055A1 PCT/CN2012/073043 CN2012073043W WO2013143055A1 WO 2013143055 A1 WO2013143055 A1 WO 2013143055A1 CN 2012073043 W CN2012073043 W CN 2012073043W WO 2013143055 A1 WO2013143055 A1 WO 2013143055A1
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WIPO (PCT)
Prior art keywords
temperature
laser
heater
software
module
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PCT/CN2012/073043
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English (en)
Chinese (zh)
Inventor
王文陆
王长虹
张振峰
Original Assignee
武汉华工正源光子技术有限公司
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Priority to PCT/CN2012/073043 priority Critical patent/WO2013143055A1/fr
Publication of WO2013143055A1 publication Critical patent/WO2013143055A1/fr

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02453—Heating, e.g. the laser is heated for stabilisation against temperature fluctuations of the environment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis

Definitions

  • Laser transceiver device method of manufacturing the same, and method for increasing the operating range of the temperature thereof
  • the present invention relates to optical fiber communication technology, and more particularly to a compact laser transceiver device, a method of fabricating the same, and a method of increasing the operating range of the temperature.
  • the compact laser transceiver device is specifically a small form-factor pluggable transceiver (SFP) and SFP+ with temperature monitoring function and controlling the temperature of the laser diode packaged in a Transmitter Optical Subassembly (TOSA).
  • SFP small form-factor pluggable transceiver
  • TOSA Transmitter Optical Subassembly
  • SFP+ compliant SFF-8431 Specifications for Enhanced Small Form Factor Pluggable Module SFP+, Revision 4.1, 6th of July 2009
  • SFP+ small form factor pluggable optical transceiver integrated module
  • ROSA Receiver Optical Subassembly
  • the data uploaded by the main board is applied to a semiconductor laser diode such as FP, DFB or VCSEL through a laser driver, and a bias current is applied and modulated, and the high-speed data signal is converted into a high-speed optical pulse signal and transmitted to the optical fiber through an industrial standard LC connector. on.
  • the optical signal transmitted through the optical fiber is converted into a high-speed electrical signal by a photon detector such as a photodetector (PIN) or an avalanche photodiode (APD) and amplified by a ring-resistance amplifier (TIA) and transmitted to the limiting amplifier.
  • a photon detector such as a photodetector (PIN) or an avalanche photodiode (APD)
  • TIA ring-resistance amplifier
  • the linear amplifier is amplified and sent to the motherboard for processing through the standard electrical interface of the SFP.
  • the Micro Control Unit (MCU) is used to monitor the laser driver and limiting amplifier, detect the transmit power of the TOSA, the received power of the ROSA, the temperature of the module, etc., and communicate with the motherboard through a standard I 2 C interface.
  • a block diagram of a typical pluggable SFP module is shown in Figure 1. As the size of the transceiver module shrinks and the port density increases, the power consumption and temperature requirements of the optical transceiver module become more and more strict. According to the requirements of the MSA, the power consumption requirements of the SFP+ module excluding SerDes are less than 1.0W in the commercial temperature range.
  • the temperature of the transceiver module is usually detected by a sensor built into the MCU or a temperature sensor mounted directly on the module board to improve accuracy.
  • a sensor built into the MCU for example, in a 3G network, an optical fiber is used to connect communication between an indoor baseband unit (BBU) and a remote radio unit (RRU).
  • BBU indoor baseband unit
  • RRU remote radio unit
  • the operating temperature of the optical transceiver module is mainly determined by TOSA and ROSA, because the characteristics of the semiconductor material used to fabricate the laser diode and photon detector vary with temperature.
  • the gain curve of a semiconductor material used as an optical gain medium in a distributed feedback laser (DFB) and the distributed grating used as a wavelength selection are highly dependent on the ambient operating temperature. And their performance varies with temperature.
  • the DFB mode of the laser is determined by the effective grating pitch of the grating, which is determined by the energy of the energy levels of the semiconductor material.
  • the temperature coefficient of the gain peak shift of the InGaAsP/InP laser diode in the 1310nm band or 1550nm band is about 0.4 to 0.6nm/°C, and the temperature of the DFB mode depending on the grating pitch change caused by the change in refractive index The coefficient is only about 0.1 nm / ° C.
  • the side mode suppression ratio (SMSR) of the DFB laser When the operating temperature exceeds a certain range, the side mode suppression ratio (SMSR) of the DFB laser will decrease, and the single mode operation state will disappear, thus seriously affecting or even interrupting communication.
  • the usual method is to design the coupling efficiency (kL) of the chip to be higher. But this in turn will increase the relative intensity noise (RIN) of the laser and is not suitable for fiber optic communication.
  • Manufacturers of laser chips typically screen chips or packaged TO-CANs to meet different temperature ranges of lasers based on temperature performance. This not only affects the yield and cost but also Sound performance. Therefore, a laser chip or laser emitter assembly (TOSA) having a wide operating temperature range such as an industrial temperature range is very expensive and performance is difficult to guarantee.
  • TOSA laser chip or laser emitter assembly
  • DWDM wavelength division multiplexing
  • XMD Type 2 package In high-density wavelength division multiplexing (DWDM) fiber-optic communications where tight wavelength control is required, higher-priced transmitter components, such as the XMD Type 2 package, are required (see: Multi-source Agreement (MSA) of 10 Gbit/ s Miniature Device (XMD), XMD04, Physical Interface of LC TOSA Type 2 Package, Rev. 1.2, January 17, 2006 ) Laser Transmitter Assembly (Model XMD-TOSA2).
  • MSA Multi-source Agreement
  • XMD 10 Gbit/ s Miniature Device
  • XMD04 Physical Interface of LC TOSA Type 2 Package
  • Rev. 1.2 January 17, 2006
  • Laser Transmitter Assembly Model XMD-TOSA2
  • a silicon-based optical base is usually placed on a small thermoelectric cooler, and a back-to-power monitor is mounted on the silicon-based optical base for wavelength-locked etalon, temperature sensor, and DFB laser diode chip.
  • a coupling lens, isolator or the like is coupled to the LC jack.
  • the wavelength of the laser diode can be controlled at the desired wavelength by monitoring and adjusting the temperature of the laser.
  • this TOSA is more difficult to fabricate, and its power consumption and cost will limit its operating temperature range and range of applications.
  • This TOSA is not suitable for use in optical transceiver modules that require low power consumption, low cost, and do not require precise wavelength control and can be applied over the industrial temperature range.
  • Mlnchino et al. introduced a method (Moriyasu Ichino, Satoshi Yoshikawa, Hirotaka Oomori, Yasuhiro Maeda, Naoki Nishiyama, Toshihiko Takayama, Toshio Mizue, Ichiro Tounai, Mitsuaki Nishie, "Small Form Factor Pluggable Optical Transceiver Module with Extremely Low Power Consumption for DWDM Applications", IEEE 2005 Electronic Components and Technology Conference, PP1044-1049.
  • Kaneshiro "Small Form Factor Transmitter optical subassembly (TOSA) having functionality for controlling the temperature, and methods of making and using the TOSA" US patent, US 7738517 B2, Jun. 15, 2010.
  • TOSA Small Form Factor Transmitter optical subassembly
  • US patent, US 7738517 B2, Jun. 15, 2010. describes a substrate that integrates a thermal controller, a heater, a temperature sensor, a monitored photon detector, an ESD protection diode and a laser diode in a TO-CAN.
  • a method of controlling the temperature of a laser diode requires a complicated design and requires a very complicated manufacturing process to integrate many additional components on the optical base in the TO-CAN, thus increasing the cost and power consumption of the TOSA and SFP.
  • the main object of the present invention is to provide a laser transceiver device, a method for fabricating the same, and a method for improving the temperature operating range thereof, which can improve an optical transceiver integrated module such as SFP or SFP+ by using a low-cost transmitter optical component.
  • the operating range of temperature is to improve an optical transceiver integrated module such as SFP or SFP+ by using a low-cost transmitter optical component.
  • a laser transceiver device includes a microprocessor, a laser diode, a heating controller, a transmitter optical component, and a receiver optical component; the optical component is integrated with a laser diode through a heater; and is externally mounted on the circuit board
  • the temperature monitoring sensor detects the temperature, or uses a temperature sensor in the microprocessor to detect the module temperature without an external temperature sensor, or monitors the operating state of the laser such as bias current and output power to detect the operating temperature of the laser without An external temperature sensor is required;
  • the microprocessor controls and monitors the performance status indicators of the transmitting end and the receiving end under the control of the software, including the temperature, voltage, laser bias current, modulation, transmission power and receiving power of the module; and monitors the module temperature and controls the transmission under the control of the software.
  • a heater built into the device;
  • the control software is used to control and monitor the performance status indicators of the transmitting end and the receiving end, including the temperature, voltage, laser biasing, modulation, transmitting power and receiving power of the module; and monitoring the module temperature under the control of the software and controlling the heating built in the transmitting device Device
  • the control circuit is used to control the microprocessor, the laser driver, the laser emitting component, the laser receiving component, and the temperature used to control the laser;
  • the driver of the laser is used to drive and modulate the laser emitter to convert the high speed electrical signal into an optical signal for transmission;
  • the optical receiver component and the limiting amplifier are used to receive the input optical signal, convert it into an electrical signal, and perform limiting amplification.
  • the heater is a heating resistor, and is integrated with a high speed laser diode to be packaged into an emitter device to increase the operating temperature of the transmitting device.
  • the temperature of the optical transceiver module is monitored using an external temperature sensor.
  • the operating temperature of the laser is determined by detecting the operating state of the laser, such as bias current and output power.
  • the detected and controlled temperature, the heating control circuit and the software are used to control the optical transceiver integrated module having the operating temperature of the light-emitting device.
  • a thin film resistor or a small-sized resistor is packaged as a heater together with a high-speed laser diode in a transmitter component TOSA such as TO-CAN;
  • a method of controlling a temperature of a laser transceiver device using a thermal control circuit
  • the software control laser transceiver module TOSA controls the heater to start or stop. If the detected temperature is lower than the set threshold, the software will start the control circuit and supply power to the heater to heat the laser diode; if the detected temperature is high At the set threshold, the software will shut down the control circuit to stop heating the laser diode.
  • a method for increasing the temperature operating range of the laser transceiver device of claim 1, comprising: a. a light emitting component TOSA integrated with a heater and a laser diode, integrated in a coaxial TO-CAN to form a low cost TOSA Heating the laser diode;
  • the microprocessor monitors the temperature of the module under the control of the software and controls the heater built in the transmitting device according to the detected temperature and a preset temperature threshold;
  • the control software is used to monitor the module temperature T and with a preset temperature threshold T. The comparison determines whether to turn on or off the heater built into the transmitter.
  • the software will turn off the power to the heater and delay the temperature of the module by a delay of ⁇ seconds; if the detected temperature ⁇ is lower than the preset temperature threshold ⁇ .
  • the software will turn on the heater to power the heating device and delay t.
  • the temperature of the module is again checked in seconds; and with the temperature threshold T. Plus the temperature offset ⁇ comparison; if ⁇ ⁇ . + ⁇ , continue to power the heater to heat the transmitter; if ⁇ > ⁇ . + ⁇ , the software will turn off the power to the heater and delay the temperature of the module by a delay of ⁇ seconds.
  • the process of controlling the temperature of the laser diode by detecting the bias current and the output power of the laser driver is specifically as follows: if the detected LD bias current Ibias is higher than a preset bias current threshold Ibias . , the software will turn off the power to the heater to stop heating the transmitting device; if the detected LD bias current is lower than the preset bias current threshold I bias . The software will turn on the heater to heat the transmitter and delay t. Seconds, an automatic power control loop is executed, and the bias current I biasN of the laser is detected and compared with a preset bias current threshold I bias . Plus hysteresis bias current ⁇ comparison; if I biasN ⁇ I bias . +AI, continue to delay t.
  • an automatic power control loop is executed to power the heater to heat the transmitting device; if I biasN > I bias . +AI, the software will turn off the power to the heater and delay for 2 seconds, perform an automatic power control loop, and then detect the bias current of the LD.
  • the invention fully utilizes the necessary resources on the laser transceiver module such as the micro control unit (MCU), the temperature sensor, etc. to achieve low cost, low process complexity, easy mass production and wide temperature working range.
  • MCU micro control unit
  • the purpose of the module is to achieve low cost, low process complexity, easy mass production and wide temperature working range.
  • the present invention controls a method of temperature of a laser diode in a TOSA, a microprocessor controlled unit under software control, a temperature sensor for detecting the temperature of the module, and a thermal control circuit for controlling the heater. If the microprocessor unit under software control detects the module temperature below the set temperature threshold, the temperature control circuit is turned on to power the heater and heat the laser diode in the TOSA; otherwise, the temperature control circuit is turned off to stop heating.
  • This temperature control loop features an on-delay that limits peak current when turning the heater on or off.
  • the TOSA has high power-current ramp efficiency at low temperatures, a lower bias current is required to maintain stable output power, and the module's electronic chip and ROSA will consume lower power, so the heating control of the SFP+ module The circuit will not increase the power consumption limit of the module.
  • Another method of controlling the temperature of the laser diode in the TOSA includes a microprocessor unit under software control, a back-to-power detector for detecting the laser diode's transmit power, and a monitor laser diode bias current circuit to detect and calculate the laser.
  • the temperature of the diode, and the thermal control circuit used to control the heater. If the temperature of the laser diode calculated by the microprocessor unit under software control is lower than the set temperature threshold according to the transmit power and the bias current, the temperature control circuit is turned on to supply power to the heater and heat the laser diode in the TOSA; The temperature control circuit stops heating.
  • the temperature control loop features an on-delay that limits peak current when turning the heater on or off.
  • TOSA has high power-current ramp efficiency at low temperatures, it requires lower The bias current maintains a stable output power, and the module's electronic chip and ROSA will consume less power, so the heating control circuit of the SFP+ module will not increase the power consumption limit of the module.
  • Figure 1 is a schematic block diagram of a conventional SFP+ laser transceiver integrated module
  • FIG. 2 is a schematic block diagram of an SFP+ transceiver integrated module with temperature controllable TOSA and temperature control circuit according to the present invention
  • Figure 3 is a working principle diagram of controlling the TOSA temperature by using a microprocessor, an analog-to-digital and digital-to-analog converter, an external temperature sensor and a high-side load switch to control the heating resistor;
  • Figure 4 is a working principle diagram of monitoring the laser diode bias current and power through the high-side load switch to control the TOSA temperature using a microprocessor, analog-to-digital and digital-to-analog converter;
  • Figure 5 is applicable to Figure 3 and Figure Schematic diagram of the heating controller in 4;
  • Figure 6 is a schematic view showing the bottom connection of a 5-pin coaxial TO-CAN having a heating resistor of the present invention
  • FIG. 7 is shown at three temperatures T. ⁇ and the relationship between the emission power of the laser diode and the bias current under T 2 ( ⁇ ! ⁇ 2 );
  • FIG. 8 is a schematic diagram of a control flow for monitoring the temperature of a laser transceiver module and adjusting the temperature of the laser diode by the method of the present invention
  • Fig. 9 is a schematic diagram showing the control flow of the laser transceiver module for monitoring the bias current and the transmission power of the laser diode and adjusting the temperature of the laser diode by the present invention. detailed description
  • the laser transceiving device of the present invention a method of manufacturing the same, and a method of increasing the operating range of the temperature thereof will be further described in detail below with reference to the accompanying drawings and embodiments of the present invention.
  • the basic idea of the invention SFP or SFP+ pluggable laser transceiver in the prior art
  • the temperature of the module is typically monitored by a temperature sensor mounted on the module's board.
  • a temperature sensor mounted on the module's board.
  • the temperature of the laser diode can be determined by detecting the temperature of the module board. If the temperature reported by the module is low, it indicates that the temperature of the emitting laser diode is also low. In this way, the microprocessor control unit (MCU) on the module can determine whether to turn on or off the thermal control circuit to control the heating resistor in the laser assembly by the temperature reported by the module.
  • MCU microprocessor control unit
  • FIG. 2 is a schematic block diagram of an SFP+ transceiver integrated module with temperature controllable TOSA and temperature control circuit according to the present invention.
  • the optical component is integrated with the laser diode through a heating controller, such as integrated in a coaxial TO-CAN to form a transceiver device; using a temperature monitoring sensor externally mounted on the circuit board to detect temperature, or utilizing a microprocessor
  • the temperature sensor detects the module temperature without an external temperature sensor, or monitors the operating state of the laser such as bias current and output power to detect the operating temperature of the laser without the need for an external temperature sensor; Control and monitor the performance status indicators of the transmitting end and the receiving end, including the temperature, voltage, laser bias current, modulation, transmitting power, and receiving power of the module; set the alarm and alarm signals of the module; communicate with the main board through I 2 C; And monitor the temperature of the module under the control of the software and control the heater built in the transmitting device; the control software is used to control and monitor the performance status indicators of the transmitting end
  • the module input electrical signal ( ⁇ +, ⁇ -) is converted into an optical signal by a laser driver modulating a laser diode in a laser emitting assembly having a heating resistor, and is coupled to the optical fiber through the optical interface of the transmitting component.
  • the bias current, modulation current, modulation phase, and cross point of the optical driver can be adjusted by the MCU, and the bias current of the laser can be monitored and reported by the MCU through analog-to-digital conversion.
  • the laser's transmit power (Tx-P) is detected by the MCU through the photodiode (PD) built into the transmitter.
  • the temperature of the module is detected by a temperature sensor and reported by the MCU's analog-to-digital (AD) converter. If the detected temperature is below the set threshold temperature, the software activates the temperature control circuit through the MCU to heat the heating resistor in the laser emitter assembly to increase the operating temperature of the laser. If the detected temperature is above the set threshold temperature, the software stops the heating by powering the heating resistor in the laser emitter assembly through the MCU shutdown temperature control circuit.
  • the operation of the receiving end is consistent with the traditional transceiver module.
  • the photodiode converts the received optical signal into an electrical signal, which is amplified by a transimpedance amplifier ( ⁇ ) and transmitted to a limiting amplifier (LA) and then transmitted to the main board.
  • the received optical power (Rx - ⁇ ) can be monitored in real time by detecting the photocurrent and reporting it through the MCU.
  • FIG 3 shows the operation of a microprocessor, analog-to-digital, and digital-to-analog converter that monitors the laser diode bias current and power through a high-side load switch to control the heating resistor to control the TOSA temperature.
  • the temperature sensor detects the temperature of the module and converts it into a digital signal that is reported to the software in the MCU through an analog-to-digital (ADC).
  • ADC analog-to-digital
  • the software compares the reported temperature with the threshold temperature stored by the electrically erasable programmable read only memory (EEPROM). If the detected temperature is above the threshold temperature, the software stops supplying the heating resistor in the TOSA through the MCU via the DAC off high side load switch.
  • EEPROM electrically erasable programmable read only memory
  • the software If the detected temperature is below the threshold temperature stored by the EEPROM, the software generates a current through the MCU via the DAC to start the high side load switch to power the heating resistor in the TOSA to increase the operating temperature of the laser diode in the TOSA.
  • FIG 4 is a schematic diagram of the operation of controlling the TOSA temperature by monitoring the laser diode bias current and power through a high-side load switch to control the TOSA temperature using a microprocessor, analog-to-digital, and digital-to-analog converter.
  • the bias current of the laser diode is monitored by the laser driver and converted into a digital signal by the analog-to-digital (ADC) in the MCU and reported to the software in the MCU.
  • ADC analog-to-digital
  • PD backlight detector
  • the software on the MCU determines the laser's transmit power based on the reported value and compares the set drive power value (P.) to adjust the laser driver's drive current to automatic power control (APC). If the power is stable, the software compares the reported bias current to a predetermined bias current stored in an electrically erasable programmable read only memory (EEPROM). If the detected bias current is higher than the predetermined bias current, the software stops powering the heating resistor in the TOSA through the MCU via the DAC off high-side load switch.
  • P. set drive power value
  • APC automatic power control
  • the software If the detected bias current is lower than the predetermined bias current stored in the EEPROM, the software generates a current through the DAC to start the high-side load switch to power the heating resistor in the TOSA to increase the operating temperature of the laser diode in the TOSA.
  • FIG. 5 is a schematic diagram of the principle of the heating controller that can be used in FIG. 3 and FIG. 4.
  • the MOSFET NTP2101P/NC
  • the MOSFET NTP2101P/NC
  • the drain (D) path energizes the resistors in the laser emitting assembly to raise the temperature of the laser.
  • HSWITCH is set to zero voltage by the MCU
  • the MOSFET NTP2101P/NC
  • Fig. 6 is a view showing the bottom wiring of a 5-pin coaxial TO-CAN having a heating resistor of the present invention.
  • the heating resistor is supplied through the pin 2 and connected to the ground of the TO-CAN.
  • the laser diode LD is connected between pins 1 and 4, and the monitor photodiode PD is connected to the ground of pin 4 and TO-CAN.
  • the specific connection method can be different, but the resistance built into the TO-CAN should be close to the LD, so that the heating effect is more obvious.
  • an electrically erasable programmable read only memory (EEPROM) in the MCU is used to store the threshold temperature T. , hysteresis temperature difference ⁇ , time delay t. And t l transceiver module standard interface parameters, manufacturers, and other information.
  • the temperature control loop is executed by the MCU under software control. First, the MCU reads the module temperature T reported by the temperature sensor and the stored temperature threshold T. Comparison. If ⁇ is greater than ⁇ .
  • the software controlled MCU will put the output port of the MCU HSWITCH is set low to turn off the control circuit to stop supplying power to the heating resistor in the TOSA, or to gradually reduce the setting of the digital-to-analog converter (DAC) on the MCU to gradually reduce the supply current to 0 amps to stop supplying power to the heating resistor. ; if T is less than T.
  • the software-controlled MCU will set the HSWITCH port high to turn on the thermal control circuit, or increase the DAC settings to gradually increase the heating current to heat the laser diode in the TOSA.
  • the MCU will delay t.
  • the second is then read through the analog-to-digital converter (ADC) to read the temperature reported by the temperature sensor.
  • ADC analog-to-digital converter
  • the software will return to wait t.
  • the second step begins to read the temperature again. If the new temperature T N read is greater than ⁇ . + ⁇ , then the software will turn the HSWITCH port low through the MCU to turn off the heating control circuit, or gradually reduce the DAC setting to reduce the heating current to 0 amps to stop heating the laser diode in the TOSA.
  • the software controlled MCU will wait for a second to read the temperature and perform the next step.
  • the APC loop and other features of the software will run as usual without further elaboration.
  • FP or DFB lasers are temperature sensitive devices, and the wavelength and transmit power of the laser are temperature dependent. When the temperature changes, the wavelength and power of the laser will change accordingly. By monitoring these characteristics, the temperature of the laser diode can be accurately determined.
  • the power of the laser is typically controlled to a constant range by an automatic power control (APC) loop. Simply put, the APC loop reads the power monitor PD whose transmit power is integrated in the TOSA and compares it to the target power. If the detected power is lower than the target power, APC increases the bias current of the laser; if the detected power is higher than the target power, APC reduces the bias current of the laser; if the detected power is within the target power setting range, The bias current does not change. Therefore, when the temperature of the laser diode changes, the bias current of the laser changes in order to maintain a constant power output.
  • APC automatic power control
  • Figure 7 shows the three temperatures T. , ⁇ 1 ? and T 2 laser diode transmission power and bias current curve.
  • the bias current of the laser will increase with increasing temperature, and the corresponding bias current at three temperatures has the following relationship I bias . ⁇ I biasl ⁇ I bias2 . Therefore, under the condition that the power of the control output of the APC is constant, if the detected bias current is low, it indicates that the temperature of the laser is also low. In this way, the MCU under software control can turn on or off the thermal control circuit to control the temperature of the laser in the TOSA based on the detected laser bias current.
  • the EEPROM will store a preset threshold bias current Ibias . , hysteresis bias current difference ⁇ , time delay t. And t l transceiver module standard interface parameters, manufacturers, and other information.
  • the threshold bias current I bias Corresponding to the target threshold temperature T of the laser. .
  • the temperature control loop is executed by the MCU under software control.
  • MCU reads the LD bias current Ibias from the laser by an analog driver (ADC), and the current threshold value I bias stored. Comparison. If I bias is greater than I bias .
  • the software-controlled MCU will set the MCU output port HSWITCH to a low level to turn off the control circuit to stop supplying power to the heating resistor in the TOSA, or gradually reduce the setting of the digital-to-analog converter (DAC) on the MCU to gradually reduce it.
  • Supply current to 0 amps stops supplying power to the heating resistor; if I bias is less than I bias .
  • the software-controlled MCU will set the HSWITCH port high to turn on the thermal control circuit, or increase the DAC settings to gradually increase the heating current to heat the laser diode in the TOSA.
  • the MCU will delay t.
  • the second starts to read the bias current I bias of the LD from the laser driver through the ADC.
  • the APC loop will adjust the bias current of the LD to maintain the output power of the laser. If the new I biasN read is less than I bias . +AI, then the software will return to the step waiting for t0 seconds, execute the APC loop, and then start reading the bias current of the laser. If the new bias current I biasN is read is greater than I bias . +AI, then the software will turn the HSWITCH port low by the MCU to turn off the heating control circuit, or gradually reduce the DAC setting to reduce the heating current to 0 amps to stop heating the laser diode in the TOSA.
  • the software controlled MCU will wait for ⁇ seconds, during which the APC loop will adjust the LD bias current to maintain the laser's output power, and then read the LD bias current I bias from the laser driver through an analog-to-digital converter (ADC). Perform the next step.
  • APC loop and other features of the software will run as usual without further elaboration. The above is only the preferred embodiment of the present invention and is not intended to limit the scope of the present invention.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Semiconductor Lasers (AREA)

Abstract

La présente invention porte sur un dispositif d'émetteur-récepteur laser, un procédé de fabrication pour celui-ci et un procédé d'élargissement de plage de fonctionnement de température de celui-ci. Un sous-ensemble d'émetteur laser faible coût TOSA est utilisé pour élargir une plage de fonctionnement de température d'un module à émetteur-récepteur laser intégré, par exemple, un SFP ou un SFP+; et un élément chauffant est utilisé pour être conditionné et intégré conjointement avec une diode laser dans un TOSA, par exemple, un TO-CAN. Par intégration d'un capteur de température sur une carte de circuits imprimés d'un SFP+, une température de fonctionnement d'un module d'émetteur laser du SFP+ est surveillée, ou par détection d'un courant de polarisation et d'une puissance de sortie d'un laser, une température de fonctionnement d'un laser TOSA est calculée, et un circuit de commande thermique et un logiciel sont utilisés pour commander l'élément chauffant dans le TOSA sur le module d'émetteur-récepteur laser. Si la température détectée est inférieure à un seuil réglé, le logiciel démarre le circuit de commande et alimente l'élément chauffant pour chauffer la diode laser. Si la température détectée est supérieure au seuil réglé, le logiciel isole le circuit de commande et arrête de chauffer de la diode laser.
PCT/CN2012/073043 2012-03-26 2012-03-26 Dispositif d'émetteur-récepteur laser, procédé de fabrication pour celui-ci et procédé d'élargissement de plage de fonctionnement de température de celui-ci WO2013143055A1 (fr)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107093839A (zh) * 2017-06-14 2017-08-25 西安域视光电科技有限公司 一种半导体激光器波长稳定系统和实现方法
CN110943787A (zh) * 2019-10-30 2020-03-31 南京奥依菲光电科技有限公司 一种智能光纤传能传感监控系统与网络
CN111880269A (zh) * 2020-08-18 2020-11-03 深圳市飞思卓科技有限公司 工业级光模块、光纤通讯设备及光纤通讯系统
CN112541319A (zh) * 2020-12-10 2021-03-23 江苏奥雷光电有限公司 一种万兆波分模块低温扩展设计方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008016511A (ja) * 2006-07-03 2008-01-24 Sumitomo Electric Ind Ltd 光通信モジュールの製造方法
US20090110014A1 (en) * 2007-10-29 2009-04-30 Frederick Miller Small form factor transmitter optical subassembly (tosa) having functionality for controlling the temperature, and methods of making and using the tosa
CN201413415Y (zh) * 2009-05-19 2010-02-24 深圳市易飞扬通信技术有限公司 一种波长可控的dwdm sfp
CN101944705A (zh) * 2010-08-23 2011-01-12 索尔思光电（成都）有限公司 一种基于dfb激光器的传输用xfp光模块工作方法
CN102298401A (zh) * 2011-05-23 2011-12-28 成都新易盛通信技术有限公司 一种长距离sfp+光模块
CN102347793A (zh) * 2011-10-28 2012-02-08 江苏奥雷光电有限公司 一种光模块的光功率可调整的方法
CN102749684A (zh) * 2012-03-26 2012-10-24 武汉华工正源光子技术有限公司 激光收发器件及其制造方法和提高其温度运作范围的方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008016511A (ja) * 2006-07-03 2008-01-24 Sumitomo Electric Ind Ltd 光通信モジュールの製造方法
US20090110014A1 (en) * 2007-10-29 2009-04-30 Frederick Miller Small form factor transmitter optical subassembly (tosa) having functionality for controlling the temperature, and methods of making and using the tosa
CN201413415Y (zh) * 2009-05-19 2010-02-24 深圳市易飞扬通信技术有限公司 一种波长可控的dwdm sfp
CN101944705A (zh) * 2010-08-23 2011-01-12 索尔思光电（成都）有限公司 一种基于dfb激光器的传输用xfp光模块工作方法
CN102298401A (zh) * 2011-05-23 2011-12-28 成都新易盛通信技术有限公司 一种长距离sfp+光模块
CN102347793A (zh) * 2011-10-28 2012-02-08 江苏奥雷光电有限公司 一种光模块的光功率可调整的方法
CN102749684A (zh) * 2012-03-26 2012-10-24 武汉华工正源光子技术有限公司 激光收发器件及其制造方法和提高其温度运作范围的方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107093839A (zh) * 2017-06-14 2017-08-25 西安域视光电科技有限公司 一种半导体激光器波长稳定系统和实现方法
CN107093839B (zh) * 2017-06-14 2024-04-09 西安炬光科技股份有限公司 一种半导体激光器波长稳定系统和实现方法
CN110943787A (zh) * 2019-10-30 2020-03-31 南京奥依菲光电科技有限公司 一种智能光纤传能传感监控系统与网络
CN111880269A (zh) * 2020-08-18 2020-11-03 深圳市飞思卓科技有限公司 工业级光模块、光纤通讯设备及光纤通讯系统
CN112541319A (zh) * 2020-12-10 2021-03-23 江苏奥雷光电有限公司 一种万兆波分模块低温扩展设计方法

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