WO2013136719A1 - Capteur de panneau tactile à capacité électrostatique et procédé de production associé, et dispositif d'affichage - Google Patents

Capteur de panneau tactile à capacité électrostatique et procédé de production associé, et dispositif d'affichage Download PDF

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Publication number
WO2013136719A1
WO2013136719A1 PCT/JP2013/001369 JP2013001369W WO2013136719A1 WO 2013136719 A1 WO2013136719 A1 WO 2013136719A1 JP 2013001369 W JP2013001369 W JP 2013001369W WO 2013136719 A1 WO2013136719 A1 WO 2013136719A1
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WIPO (PCT)
Prior art keywords
transparent electrode
touch panel
panel sensor
capacitive touch
extraction wiring
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PCT/JP2013/001369
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English (en)
Japanese (ja)
Inventor
保浩 檜林
吉隆 松原
宏希 後藤
港　浩一
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凸版印刷株式会社
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Publication of WO2013136719A1 publication Critical patent/WO2013136719A1/fr

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate

Definitions

  • the present invention relates to a projected capacitive touch panel sensor, a manufacturing method thereof, and a display device equipped with the projected capacitive touch panel sensor.
  • the touch panel is a constituent element of an input device that allows the operator to touch a transparent surface on the display screen with a finger or a pen to detect a touched position and input data.
  • the touch panel has been used frequently in recent years because it enables direct and intuitive input rather than key input.
  • the touch panel is often combined with a display panel such as a liquid crystal to input and output information in an integrated manner.
  • Touch panel detection methods include a resistance film method, a capacitance method, an ultrasonic method, an optical method, and the like.
  • the resistance film method which was relatively superior in terms of manufacturing cost, has been the mainstream.
  • the resistive film type touch panel having a structure in which an air layer is provided between two transparent conductive films has low optical characteristics (transmittance), and it cannot be said that durability and operating temperature characteristics are sufficient. It has been sought.
  • capacitive touch panels without moving parts have high optical characteristics (transmittance) and are superior to resistive film systems in terms of durability and operating temperature characteristics. Development is progressing toward the target (see, for example, Patent Document 1 and Patent Document 2).
  • the capacitive touch panel can be roughly classified into a surface type (surface capacitive type) and a projected type (projected capacitive type).
  • the surface type is a large type of 10 type (25.4 cm size) or more, and the surface type is 6 for portable devices.
  • Projection molds are often used for small products below the mold.
  • a surface type with a simple electrode plate structure is likely to be large, but it is difficult to detect two or more contact points simultaneously.
  • a projection type with a complicated electrode plate structure is disadvantageous for an increase in size, but two or more contact points can be detected simultaneously.
  • the projected capacitive touch panel sensor generally includes a plurality of first transparent electrodes 23 formed along a first direction of a rectangular display region on the transparent substrate 10.
  • the outer peripheral portion of the rectangular display region The lead-out wiring 20 is provided.
  • a protective layer (not shown) is formed on the touch panel sensor so as to cover almost the entire surface other than the connection portion of the extraction wiring 20 as necessary.
  • a typical example of an electronic device using a projected capacitive touch panel is a smartphone or a slate PC.
  • the conventional method for manufacturing a projected capacitive touch panel sensor includes an extraction wiring formation step (S101), a jumper portion formation step (S102), an insulating layer formation step (S103), and a transparent It includes an electrode formation step (S104) and a protective film formation step (S105).
  • an extraction wiring 20 made of a metal film is formed on the transparent substrate 10 by sputtering.
  • a molybdenum (Mo) / aluminum (Al) / molybdenum film or the like is used as the metal film.
  • the sputtering method is a method of forming a pattern by performing a protective film formation, etching, and protective film peeling after sputtering a metal film on a substrate placed in a vacuum vessel using a magnetron sputtering apparatus. It can also handle fine patterns.
  • connection part (jumper part) 21 of the 1st transparent electrode using a transparent conductive material is formed by a sputtering method.
  • transparent conductive material indium tin oxide (ITO) obtained by adding several percent of tin oxide to indium oxide is generally used.
  • the insulating layer 22 is formed by using a photolithography method so as to cover the jumper portion 21 except for a part thereof.
  • the photolithographic method is a method in which a photosensitive resin composition is applied on the transparent substrate 10 and then irradiated with ultraviolet light through a photomask corresponding to a desired insulating pattern, whereby the exposed portion of the coating film is photocrosslinked. It is a method of forming a pattern by curing and baking after removing an unexposed portion of the coating film using a developer.
  • the first transparent electrode 23 and the second transparent electrode 24 are formed by sputtering using a transparent conductive material. At this time, the first transparent electrode 23 is formed so as to be electrically connected to the jumper portion 21 and the extraction wiring 20 along the first direction.
  • the second transparent electrode 24 is formed on the insulating layer 22 without interruption in the second direction, and is formed so as to be electrically connected to the extraction wiring 20.
  • FIG. 17 which is a plan view of the intersection of the first transparent electrode 23 and the second transparent electrode 24 and FIG. 18 which is a cross-sectional view of the intersection
  • the first transparent electrode 23 is formed along the first direction.
  • the plurality of first transparent electrodes 23 and the plurality of second transparent electrodes 24 formed along the second direction are separated by the insulating layer 22 and disposed without being electrically connected, thereby providing a capacitance value. It is configured so that the changed coordinates can be determined.
  • a protective film using a transparent resin composition or an inorganic film can be formed thereon.
  • the extraction wiring 20 As a method of forming the extraction wiring 20, the first transparent electrode 23, and the second transparent electrode 24, it is possible to form a high-definition pattern of 30 ⁇ m or less by using a sputtering method. Not only is it expensive, but there are many processes and high manufacturing costs.
  • a conductive paste in which conductive fine particles such as silver are dispersed in an organic binder is printed on a substrate using a screen printing plate having a pattern corresponding to the wiring, and then the organic binder is cured by baking. This is a method of forming a pattern by shrinking or disappearing.
  • the photosensitive conductive paste used in the photolithography method burns organic matter by baking at 500-600 ° C after applying, exposing and developing a paste in which inorganic metal fine particles are dispersed in an organic matter having photosensitivity and alkali developability. And a paste in which inorganic metal fine particles are dispersed in an organic substance having photosensitivity and alkali developability at 130 to 250 ° C. after coating, exposure and development. It is classified into a thermosetting photosensitive conductive paste that forms a conductive circuit pattern as a composite of an inorganic substance and an organic substance by baking and organically curing the organic substance.
  • thermosetting photosensitive conductive paste is sometimes used for a touch panel sensor that may be formed on a film having low heat resistance. (See, for example, Patent Document 5).
  • Patent Document 4 attempts to form a high-definition pattern by containing an ultraviolet absorber, but it is sufficient to form an industrially stable pattern in a pattern of 30 ⁇ m or less. Resolution is not obtained.
  • the extraction wiring is formed by a photolithography method using a photosensitive conductive paste containing metal fine particles
  • conduction failure occurs at the connection portion between the extraction wiring 20 and the transparent electrodes 23 and 24. That is, as shown in FIG. 19, a gap 29 is formed between the metal fine particles, for example, Ag fine particles, and the transparent substrate 10 at the end of the lead-out wiring 20, and the transparent electrodes 23 and 24 are not formed by this gap. There arises a problem in that the connection portion between the lead-out wiring 20 and the transparent electrodes 23 and 24 is disconnected.
  • thermosetting photosensitive conductive paste that forms a conductive circuit pattern with a composite of an inorganic material and an organic material, it is necessary to have sufficient electrical conductivity. Therefore, it is difficult to form a high-definition pattern.
  • the present invention has been made in view of such a situation, and an object of the present invention is to provide a capacitive touch panel having a high-definition pattern of 30 ⁇ m or less and capable of being manufactured with good quality and low cost without occurrence of disconnection or peeling.
  • a sensor, a manufacturing method thereof, and a display device are provided.
  • a plurality of the first transparent electrodes are formed along the first direction so as to connect the jumper portions by the first transparent electrode or connect the first transparent electrode and the extraction wiring,
  • the extraction wiring may be formed by application by screen printing and exposure / development using a mask pattern.
  • the metal fine particles may have an average particle size of 0.05 ⁇ m or more and 3.00 ⁇ m or less.
  • the metal fine particles may be gold, silver, copper, palladium, or a mixture of at least two of these.
  • the conductor width of the extraction wiring may be 3 ⁇ m or more and 30 ⁇ m or less.
  • the connection portion between the first transparent electrode and / or the second transparent electrode and the extraction wiring, and the end of the first transparent electrode and / or the second transparent electrode are the conductive support and the extraction. You may form so that the edge part of wiring may be covered.
  • the overlapping width of the first transparent electrode and / or the second transparent electrode and the conductive support may be 1 ⁇ m or more.
  • the conductive support may be formed only in a connection region between the first transparent electrode and / or the second transparent electrode and the extraction wiring.
  • the connection region may be in a region where a decorative layer and an insulating layer are selectively formed on the outer peripheral portion of the display region on the transparent substrate.
  • a plurality of second transparent electrodes formed along the direction of the first transparent electrode, and the first transparent electrode and the second transparent electrode are overlapped between the first transparent electrode and the second transparent electrode.
  • An insulating layer and a lead-out line disposed on the outer periphery of the display area, and the first transparent electrode and the second transparent electrode are electrically connected to the connection end of the lead-out line.
  • An electrostatic capacity type touch panel sensor wherein the lead-out wiring is provided on a conductive support provided on an outer peripheral portion of the display region using a photosensitive conductive material containing metal fine particles.
  • a capacitive touch panel sensor is provided.
  • the metal fine particles may have an average particle size of 0.05 ⁇ m or more and 3.00 ⁇ m or less.
  • the metal fine particles may be gold, silver, copper, palladium, or a mixture of at least two of these.
  • the conductor width of the extraction wiring may be not less than 3 ⁇ m and not more than 30 ⁇ m.
  • the connecting portion between the first transparent electrode and / or the second transparent electrode and the extraction wiring is such that the end of the first transparent electrode and / or the second transparent electrode is the conductive support and the extraction You may form so that the edge part of wiring may be covered.
  • the overlapping width between the first transparent electrode and / or the second transparent electrode and the conductive support may be 1 ⁇ m or more.
  • the conductive support may be formed only in a connection region between the first transparent electrode and / or the second transparent electrode and the extraction wiring.
  • the connection region may be in a region where a decorative layer and an insulating layer are selectively formed on the outer periphery of the display region on the transparent substrate.
  • the conductive support may be made of the same material as the first transparent electrode or the second transparent electrode.
  • a capacitive touch panel sensor that has a high-definition pattern of 30 ⁇ m or less and has good quality and is free from disconnection or peeling. Further, by using the manufacturing method, it is possible to provide a touch panel sensor with good quality and low cost. Furthermore, a display device including the touch panel sensor can be provided.
  • the capacitive touch panel sensor of this invention it is a top view of the example which formed the decoration layer in the outer peripheral part of a display area.
  • the capacitive touch panel sensor of this invention it is sectional drawing of the example which formed the decoration layer in the outer peripheral part of a display area.
  • FIG. 6B is a cross-sectional view taken along line 6b-6b of FIG. 6A showing a lead-out wiring forming step in an embodiment of the method of manufacturing the capacitive touch panel sensor according to the present invention. It is a top view which shows the transparent electrode formation process in one Embodiment of the manufacturing method of the capacitive touch panel sensor which concerns on this invention.
  • FIG. 18 is a sectional view taken along line 13-13 in FIG. It is a figure which shows typically the disconnection of the connection part of the transparent electrode and extraction wiring of the conventional capacitive touch panel sensor.
  • capacitive touch panel sensor a manufacturing method thereof, and a display device according to the present invention will be described in detail with reference to the drawings.
  • the capacitive touch panel sensor, the manufacturing method thereof, and the display device according to the present invention are not limited to the following configurations as long as they do not exceed the gist thereof.
  • the projected capacitive touch panel sensor of this embodiment includes a transparent substrate 10, a first transparent electrode 23 and a second transparent electrode 24 provided on the transparent substrate 10, an insulating layer 22, The conductive support 25 and the extraction wiring 20 are included.
  • a plurality of first transparent electrodes 23 are formed along a first direction of a rectangular display region on the transparent substrate 10 and along a second direction intersecting the first direction.
  • a plurality of second transparent electrodes 24 are formed in the display area.
  • the first transparent electrode and the second transparent electrode are disposed in the overlapping region (intersection position) between the first transparent electrode and the second transparent electrode.
  • An insulating layer 22 is formed between the electrodes.
  • a conductive support 25 is disposed on the outer periphery of the display area. On the conductive support 25, an extraction wiring 20 is formed.
  • a protective layer (not shown) is formed to protect each element formed on the transparent substrate 10 from corrosion and scratches caused by contact.
  • This protective layer is formed so as to cover almost the entire surface of the transparent substrate 10 other than the connection portion of the extraction wiring 20 connected to a control circuit (not shown).
  • the manufacturing method of the capacitive touch panel sensor according to the present invention includes a jumper part forming step (S1), a conductive support forming step (S2), and an insulating layer forming step (S3), as shown in FIG. And an extraction wiring formation process (S4), a transparent electrode formation process (S5), and a protective film formation process (S6).
  • the jumper portion forming step (S1) is a step of forming a plurality of jumper portions 21 in the display area on the transparent substrate 10, as shown in FIG.
  • These jumper portions 21 are made of a transparent conductive material at a position where the first transparent electrodes 23, 23 are connected to each other based on the formation positions of the first transparent electrodes 23, 23 adjacent in the first direction in the display area. Formed using.
  • a sputtering method As a method for forming the jumper portion 21, it is preferable to use a sputtering method. Specifically, ITO sputtering is performed while heating at 170 ° C. by DC magnetron sputtering. Subsequently, a general positive resist (for example, SZP series manufactured by AZ Electronic Materials) is spin-coated for an etching protective film, and then prebaked on a 105 ° C. hot plate. Thereafter, proximity exposure is performed using a photomask having a desired pattern reversed, and development is performed with an alkaline aqueous solution containing sodium hydroxide and sodium carbonate.
  • a sputtering method Specifically, ITO sputtering is performed while heating at 170 ° C. by DC magnetron sputtering. Subsequently, a general positive resist (for example, SZP series manufactured by AZ Electronic Materials) is spin-coated for an etching protective film, and then preb
  • the transparent substrate 10 is a transparent substrate having a flat plate shape.
  • the transparent substrate 10 used for the projected capacitive touch panel sensor includes a film type using a resin film such as polyethylene terephthalate (PET), and a glass type using alkali-free glass, soda lime glass, or the like.
  • PET polyethylene terephthalate
  • the film type has the advantage of low manufacturing costs and is difficult to break, but the glass type is a mobile electronic device such as a smartphone due to the inferior transparency and the high resistance of the transparent electrode on the film, making it impossible to reduce the electrode part. Often used in equipment.
  • a touch panel sensor When a touch panel sensor is formed on a cover glass, aluminosilicate glass (for example, “Gollila (Corning)”, “Dragonrail (Asahi Glass))” or chemically strengthened from the viewpoint of strength and scratch resistance. It is preferable to use a special glass plate such as soda lime glass.
  • Transparent conductive material As the transparent conductive material used for the conductive support 25 formed under the connection portion (jumper portion) 21 of the first transparent electrode and the lead-out wiring 20, particularly if it can be disposed on the surface of the transparent substrate 10.
  • inorganic conductive materials such as ITO and zinc oxide (ZnO) can be used. These materials may be used alone or in combination of two or more. Among these, it is preferable to use ITO in terms of transparency and resistance value.
  • the thickness of the transparent electrode and conductive support 25 (hereinafter referred to as conductor thickness) is preferably 0.02 ⁇ m or more and 0.1 ⁇ m or less. When the conductor thickness is less than 0.02 ⁇ m, sufficient electrical characteristics cannot be obtained, and when it exceeds 0.1 ⁇ m, the visibility of the touch panel is affected.
  • the conductive support forming step (S2) is a step of forming the conductive support 25 on the outer peripheral portion of the display area as shown in FIG.
  • the conductive support 25 is disposed between the transparent substrate 10 and the extraction wiring 20 by using a transparent conductive material, thereby improving the adhesion of the extraction wiring 20 and preventing poor conduction. It is formed.
  • the conductive support 25 can be formed at the same time as the jumper portion 21 without increasing the process and material costs. By forming the conductive support 25 under the lead-out wiring 20, it is considered that the adhesion with the transparent substrate 10 is improved due to the anchoring effect.
  • the conductive support 25 As a method for forming the conductive support 25, it is preferable to use a sputtering method in the same manner as the method for forming the jumper portion 21 described above. Since the method for forming the conductive support 25 using the sputtering method is the same as the method for forming the jumper portion 21, description thereof is omitted. Since the conductive support 25 is disposed between the transparent substrate 10 and the extraction wiring 20 using a transparent conductive material in order to improve the adhesion of the extraction wiring 20 and prevent conduction failure, in principle, the arrangement of the extraction wiring is performed. It is arranged on the outer periphery of the display area.
  • the decorative layer 26 or the decorative layer 26 and an insulating layer (not shown) are provided on the outer peripheral portion of the display region, the decorative layer 26, Or since the adhesion between the extraction wiring 20 is improved by the decorative layer 26 and the insulating layer (not shown) thereon, the conductive support 25 is provided only in the connection region between the transparent electrodes 23 and 24 and the extraction wiring 20. It may be formed.
  • the decorative layer 26 can be formed using, for example, a carbon-based resist. Moreover, an insulating layer may be further formed on the decorative layer.
  • the conductive material of the conductive support 25 is not limited to a transparent conductive material, and a known conductive material can be suitably used.
  • the width of the conductive support 25 is preferably 10 ⁇ m or more and 40 ⁇ m or less. When the width of the conductive support 25 is less than 10 ⁇ m, it may be difficult to stably obtain a pattern of less than 10 ⁇ m for the etching method. In addition, if the width of the conductive support 25 exceeds 40 ⁇ m, a distance that does not interfere with an electrical signal with an adjacent wiring is required. Therefore, if the width of the conductive support 25 is widened, high definition may not be supported.
  • the width of the conductive support 25 and the width of the extraction wiring 20 are the same or the width of the conductive support 25 is wider.
  • FIG. 6B shows a mode in which the width d 1 of the conductive support 25 is wider than the width d 2 of the lead-out wiring 20. If a distance (about 5 ⁇ m) at which the electrical signal does not interfere with the adjacent wiring is provided, the wider the conductive support 25 is, the less affected by the positional deviation due to the alignment accuracy.
  • the insulating layer forming step (S3) is a step of forming the insulating layer 22 on the jumper portion 21, as shown in FIG.
  • the insulating layer 22 can be formed using a known material conventionally used for the insulating layer, and examples thereof include inorganic films such as SiO 2 and SiNx, and organic materials such as transparent resins. Since inorganic films are formed of SiO 2 or SiNx by a CVD method, a sputtering method, or the like, there is a problem that the manufacturing cost becomes high, such as an increase in energy consumption or an increase in the number of steps. Formation by photolithography using an organic material is preferably used.
  • a transparent resin composition (for example, NN901 manufactured by JSR) used for the insulating layer is applied by spin coating, and prebaking is performed on a hot plate at 80 ° C. Thereafter, proximity exposure is performed using a photomask corresponding to a desired pattern, and development is performed with an alkaline aqueous solution containing sodium hydroxide and sodium carbonate. Thereafter, post-baking is performed at 230 ° C., whereby the insulating layer 22 is formed.
  • the extraction wiring forming step (S4) is a step of forming the extraction wiring 20 on the conductive support 25 using a photosensitive conductive material containing metal fine particles, as shown in FIG. 6A.
  • a method for forming the extraction wiring 20 there are a screen printing method, an etching method, a gravure offset method, a photolithography method, and the like, but the photolithography method is preferable from the viewpoint of manufacturing cost and high definition.
  • the extraction wiring 20 having a pattern of 30 ⁇ m or less required for a touch panel sensor such as a smartphone has been simplified. It can be formed in a process.
  • the extraction wiring 20 having low resistance and excellent conductivity can be manufactured in a simplified process.
  • Printing is performed using screen printing (stainless steel 500 mesh) of a photosensitive conductive material containing fine metal particles, and pre-baking is performed as necessary to evaporate the organic solvent.
  • pre-baking a hot air circulation oven, a hot plate, or an IR oven can be used.
  • Pattern exposure is performed through a photomask corresponding to a desired extraction wiring pattern.
  • a normal high-pressure mercury lamp may be used as the exposure light source.
  • the exposure amount is preferably about 10 to 200 mJ / cm 2 from the viewpoint of tact time.
  • Development is performed following exposure. Development is carried out at 24 ° C. for 10 to 90 seconds using an alkaline aqueous solution containing sodium carbonate.
  • An arbitrary extraction wiring pattern can be obtained by performing heat treatment after development.
  • the heat treatment is performed at 230 ° C. for 30 minutes using a heat drying oven. Due to the curing shrinkage of the resin due to the heat treatment, the silver powders are brought into contact with each other to have sufficient conductivity and to improve resistance to chemicals and the like.
  • the width (conductor width) of the lead-out wiring 20 is preferably 3 ⁇ m or more and 30 ⁇ m or less. If the conductor width is less than 3 ⁇ m, it is likely to be affected by the electrical signal of the adjacent wiring, causing a crosstalk or delay of the electrical signal. On the other hand, if the conductor width exceeds 30 ⁇ m, it is not possible to obtain a sufficient effect for the demand for downsizing of mobile electronic devices.
  • Extract wiring thickness The film thickness of the extraction wiring 20 is preferably 2.5 ⁇ m or more and 5 ⁇ m or less. If the thickness of the extraction wiring 20 is less than 2.5 ⁇ m, a sufficient resistance value (conducting characteristic) may not be obtained. On the other hand, if the thickness of the extraction wiring 20 exceeds 5 ⁇ m, the bottom may not be cured at the time of photolithography, and the adhesion may be deteriorated.
  • the photosensitive conductive material used for the lead-out wiring contains at least metal fine particles, a photopolymerization initiator, a polymerizable polyfunctional monomer, an alkali-soluble resin, and a solvent, and may contain other additives as necessary. it can.
  • the photosensitive conductive material is prepared by blending metal fine particles, a photopolymerization initiator, a polymerizable polyfunctional monomer, an alkali-soluble resin, a solvent, and other additives with a predetermined composition, stirring with a stirrer, and then using a three-roll mill. It is obtained by kneading.
  • Metal fine particles Gold, silver, copper, palladium, or the like can be used as the metal fine particles used for the photosensitive conductive material. These materials may be used alone or in combination of two or more. Among these, it is preferable to use silver in terms of cost, resistance value, and stability.
  • the average particle diameter of metal fine particles is preferably 0.05 ⁇ m or more and 3 ⁇ m or less.
  • the concealability by the metal fine particles is high, so that light does not reach the bottom during exposure, and pattern formation becomes difficult.
  • the average particle diameter exceeds 3 ⁇ m, the linearity and pattern accuracy in the fine pattern are lowered, which is not preferable.
  • the shape of the silver powder as the metal fine particles includes flakes, needles, and spheres, but spherical silver powder is preferable from the viewpoint of screen printability and light scattering during exposure.
  • the amount of metal fine particles (silver powder) used is preferably 65 to 85% by mass, more preferably 70 to 80% by mass, based on the total solid content of the photosensitive conductive paste. If the addition amount of metal fine particles (silver powder) is 65% by mass or less, sufficient resistivity cannot be obtained as a wiring, and if it is 85% by mass or more, ultraviolet light does not reach the bottom during exposure and pattern formation is difficult. It becomes.
  • Photopolymerization initiator examples include 4-phenoxydichloroacetophenone, 4-t-butyl-dichloroacetophenone, diethoxyacetophenone, 1- (4-isopropylphenyl) -2-hydroxy-2-methylpropan-1-one, Acetophenone compounds such as -hydroxycyclohexyl phenyl ketone, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, Benzoin compounds such as benzyldimethyl ketal, benzophenone, benzoylbenzoic acid, methyl benzoylbenzoate, 4-phenylbenzophenone, hydroxybenzophenone, acrylated benzophenone, 4-benzoyl Benzophenone compounds such as 4′-methyldiphen
  • a sensitizer for the photopolymerization initiator can be used in combination.
  • Such sensitizers include ⁇ -acyloxy ester, acylphosphine oxide, methylphenylglyoxylate, benzyl, 9,10-phenanthrenequinone, camphorquinone, ethylanthraquinone, 4,4′-diethylisophthalo Compounds such as phenone, 3,3 ′, 4,4′-tetra (t-butylperoxycarbonyl) benzophenone, triethanolamine, methyldiethanolamine, triisopropanolamine, methyl 4-dimethylaminobenzoate, 4-dimethylaminobenzoate Ethyl acetate, isoamyl 4-dimethylaminobenzoate, 2-dimethylaminoethyl benzoate, 2-ethylhexyl 4-dimethylaminobenzoate, N, N-dimethylparatoluidine
  • polymerizable polyfunctional monomer examples include methyl (meth) acrylate, ethyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, cyclohexyl (meth) acrylate, ⁇ -carboxyl Ethyl (meth) acrylate, diethylene glycol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, triethylene glycol di (meth) acrylate, tripropylene glycol di (meth) acrylate, trimethylolpropane tri (meth) Acrylate, polyethylene glycol di (meth) acrylate, pentaerythritol tri (meth) acrylate, 1,6-hexanediol diglycidyl ether di (meth) acrylate, bis Enol A diglycid
  • Acrylic acid esters and methacrylic acid esters methylolated melamine (meth) acrylic acid esters, epoxy (meth) acrylates, urethane acrylates and other acrylic acid esters and methacrylic acid esters, (meth) acrylic acid, styrene, vinyl acetate , Hydroxyethyl vinyl ether, ethylene glycol divinyl ether, pentaerythritol trivinyl ether, (meth) acrylamide, N-hydroxymethyl (meth) Examples include acrylamide, N-vinylformamide, acrylonitrile and the like.
  • the polyfunctional urethane acrylate which has the (meth) acryloyl group obtained by making polyfunctional isocyanate react with the (meth) acrylate which has a hydroxyl group is arbitrary and is not particularly limited.
  • one type of polyfunctional urethane acrylate may be used alone, or two or more types may be used in combination. These can be used alone or in admixture of two or more.
  • the alkali-soluble resin is a linear polymer having a carboxyl group, and a polybasic carboxylic acid or a reaction product of a reaction product of (meth) acrylic copolymer resin or epoxy resin and (meth) acrylic acid or its anhydride.
  • Examples thereof include an epoxy-modified acrylate resin obtained by reacting with an anhydride.
  • the (meth) acrylic copolymer resin is a copolymer resin containing at least a (meth) acrylic monomer in its constituent components, and the (meth) acrylic monomer includes (meth) acrylic acid, methyl acrylate, ethyl acrylate, n-propyl acrylate, isopropyl acrylate, n-butyl acrylate, isobutyl acrylate, allyl acrylate, benzyl acrylate, cyclohexyl acrylate, dicyclopentanyl acrylate, glycidyl acrylate, aminoethyl acrylate, methyl methacrylate, ethyl methacrylate, n-propyl methacrylate, isopropyl Methacrylate, isopropyl methacrylate, n-butyl methacrylate, isobutyl methacrylate, allyl methacrylate, Jill methacrylate, cyclohexyl me
  • a compound having an unsaturated bond such as styrene or cyclohexylmaleimide can be used.
  • the epoxy resin used for the epoxy-modified acrylate resin phenol novolak, cresol novolak, those having bisphenol A or bisphenol F skeleton and the like are used.
  • solvent examples include cyclohexanone, ethyl cellosolve acetate, butyl cellosolve acetate, ethyl carbitol acetate, 1-methoxy-2-propyl acetate, diethylene glycol dimethyl ether, ethylbenzene, ethylene glycol diethyl ether, xylene, ethyl cellosolve, methyl-n amyl ketone, propylene glycol
  • organic solvents such as monomethyl ether and petroleum solvents, and these can be used alone or in combination.
  • the addition amount of the organic solvent is preferably in the range of 5 to 20% by mass based on the total amount of the photosensitive conductive paste.
  • a storage stabilizer in addition to the said component, in order to stabilize the time-dependent viscosity of the photosensitive electrically conductive paste, a storage stabilizer can be contained.
  • storage stabilizers include quaternary ammonium chlorides such as benzyltrimethyl chloride and diethylhydroxyamine, organic acids such as lactic acid and oxalic acid, and organic acids such as methyl ether, t-butylpyrocatechol, triethylphosphine, and triphenylphosphine. Examples thereof include phosphine and phosphite.
  • the storage stabilizer can be contained in an amount of 0.1 to 10% by mass based on the total amount of the photosensitive conductive paste.
  • a radical scavenger can be used for the photosensitive conductive material.
  • a radical scavenger has the effect of deactivating active radicals. By adding it to a photosensitive conductive material, it is possible to suppress the curing reaction in the unexposed areas caused by light scattering by silver powder. The dimensional accuracy of the wiring can be improved.
  • radical scavenger examples include hydroquinone derivatives such as hydroquinone, methylhydroquinone, methoquinone and 4-methoxynaphthol, quinone derivatives such as 1,4-benzoquinone, 2,6-dichloroquinone, p-xyloquinone and naphthoquinone, Irganox 245, Irganox 259 Hindered phenols such as Irganox 1010, Irganox 1035, Irganox 1076, Irganox 1098 (above, manufactured by BASF), Adekastab AO-30, Adekastab AO-330 (above, made by ADEKA), TINUVIN123, TINUVIN144, TINUVIN144, 70 Manufactured by BASF), ADK STAB LA-77, ADK STAB LA-57 STAB LA-67, ADK STAB LA-87 (or more, ADEKA Corporation) have hindered amines
  • the addition amount of the radical scavenger can be in the range of 0.01 to 0.1% by mass based on the total solid content of the photosensitive conductive paste. If the added amount of the radical scavenger is 0.01% by mass or less, the effect of improving the dimensional accuracy of the conductor pattern cannot be obtained, and if it is 0.1% by mass or more, pattern peeling due to insufficient crosslinking density or discoloration during thermosetting occurs. To do.
  • a surfactant can be included as the photosensitive conductive material.
  • surfactant polyoxyethylene alkyl ether sulfate, sodium dodecylbenzenesulfonate, alkali salt of styrene-acrylic acid copolymer, sodium alkylnaphthalenesulfonate, sodium alkyldiphenyletherdisulfonate, lauryl sulfate monoethanolamine, lauryl sulfate
  • Anionic surfactants such as triethanolamine, ammonium lauryl sulfate, monoethanolamine stearate, sodium stearate, sodium lauryl sulfate, monoethanolamine of styrene-acrylic acid copolymer, polyoxyethylene alkyl ether phosphate; Oxyethylene oleyl ether, polyoxyethylene lauryl ether, polyoxyethylene nonylphenyl ether, polyoxyethylene
  • Nonionic surfactants such as alkyl
  • the first transparent electrode 23 is formed along the first direction, and a plurality of second electrodes are formed along the second direction orthogonal to the first direction.
  • the 1st transparent electrode 23 is provided so that it may connect with the jumper parts 21 and 21 or the extraction wiring 20.
  • FIG. The second transparent electrode 24 is provided so as to connect the second transparent electrode 24 and the extraction wiring 20.
  • a conductive support 25 is provided between the extraction wiring 20 and the transparent substrate 10 at the connection portion between the first transparent electrode 23 and / or the second transparent electrode 24 and the extraction wiring 20. Therefore, an overlapping portion 28 between the conductive support 25 and the first transparent electrode 23 and / or the second transparent electrode 24 is formed. By forming the overlapping portion 28 as described above, disconnection between the first transparent electrode 23 and / or the second transparent electrode 24 and the extraction wiring 20 can be prevented.
  • the overlap width is preferably 1 ⁇ m or more in order to obtain sufficient conduction.
  • a sputtering method ITO sputtering is performed while heating at 170 ° C. by DC magnetron sputtering.
  • a general positive resist for example, SZP series manufactured by AZ Electronic Materials
  • proximity exposure is performed using a photomask having a desired pattern reversed, and development is performed with an alkaline aqueous solution containing sodium hydroxide and sodium carbonate.
  • the ITO film-formed transparent substrate on which the positive resist is patterned is subjected to ITO etching with an oxalic acid aqueous solution, followed by positive resist stripping using an aqueous alkali solution containing sodium hydroxide and sodium carbonate, and the first transparent electrode 23 and the first transparent electrode 23 Two transparent electrodes 24 are formed.
  • the transparent conductive material used for the first transparent electrode 23 and the second transparent electrode 24 is not particularly limited as long as it can be disposed on the surface of the transparent substrate 10, but ITO, zinc oxide ( An inorganic conductive material such as ZnO) can be used. These materials may be used alone or in combination of two or more. Among these, it is preferable to use ITO in terms of transparency and resistance value.
  • the protective film forming step (S6) is a step of forming a protective layer (not shown) for protecting each element formed on the transparent substrate 10 from corrosion and scratches caused by contact.
  • This protective layer is formed so as to cover almost the entire surface of the transparent substrate 10 other than the connection portion of the extraction wiring 20 connected to a control circuit (not shown).
  • the protective film can be formed using the same material as the insulating layer 22.
  • a transparent resin composition for example, NN901 manufactured by JSR used for the protective film is applied by spin coating, and prebaking is performed on a hot plate at 80 ° C.
  • a decorative layer can be provided between the transparent substrate and the extraction wiring on the outer peripheral portion of the display area.
  • connection portion between the transparent electrode and the lead-out wiring is not particularly limited, and can be an appropriate shape depending on the arrangement of the lead-out wiring, the presence or absence of a decorative layer, and the like.
  • the connection portion of the second transparent electrode 24 with the extraction wiring 20 can be shaped to match the width of the extraction wiring.
  • the width of the two transparent electrodes 24 may be directly used as the shape of the end portion of the connection portion.
  • 9A and 9B show a case where the decorative layer 26 is formed and the conductive support 25 is formed only for connection, but the shape of the transparent electrode is shown in FIG. 9A even when the decorative layer 26 is not provided. , B can be the same.
  • the display device of this embodiment is equipped with the above-described capacitance type touch panel sensor.
  • the above-described capacitive touch panel sensor and a display panel such as a liquid crystal panel or an organic EL panel can be combined.
  • FIG. 10 shows an example of a display device having a configuration in which the capacitive touch panel sensor not provided with the decorative layer shown in FIG. 7 and a liquid crystal panel are combined.
  • a capacitive touch panel sensor 31 of FIG. 7 is mounted above the liquid crystal panel 30, and a cover glass provided with a decorative layer is further provided as a front plate 32 above the capacitive touch panel sensor 31.
  • FIG. 11 shows an example of a display device having a configuration in which the capacitive touch panel sensor provided with the decoration layer shown in FIG. 4A and a liquid crystal panel are combined.
  • the liquid crystal panel includes, for example, an array substrate 302 in which active elements (thin film transistors and TFTs) are formed for each pixel on a glass substrate, and a color filter substrate 301 in which a color filter and a uniform transparent electrode are formed on a glass substrate as a counter substrate. Are disposed opposite to each other with the liquid crystal 304 interposed therebetween, and a polarizing plate 303 is further provided. If it is a display apparatus of this embodiment, since the above-mentioned capacitive touch panel sensor is mounted, a display apparatus having good touch panel sensor quality can be provided.
  • an acrylic resin solution was prepared by adding 1-methoxy-2-propylacetate to the resin solution so that the solid content was 30% by mass to obtain an alkali-soluble resin.
  • the weight average molecular weight of the acrylic resin was about 20,000.
  • photosensitive conductive material 1 A mixture having the following composition was stirred and mixed uniformly, dispersed using three rolls, and then filtered through a 5 ⁇ m filter to prepare photosensitive conductive material 1.
  • Photopolymerization initiator Irgacure 379 (manufactured by BASF) 3 parts
  • Sensitizer DETX-S (manufactured by Nippon Kayaku Co., Ltd.) 2 parts
  • Polymerizable polyfunctional Monomer R-684 manufactured by Nippon Kayaku Co., Ltd.) 16 parts, alkali-soluble resin 38.7 parts, radical scavenger methyl hydroquinone 0.1 part, organic solvent 1-methoxy-2-propyl acetate 8 parts, surfactant Adecanate B -940 (made by ADEKA) 0.2 parts
  • photosensitive conductive material 2 A mixture having the following composition was stirred and mixed uniformly, dispersed using three rolls, and then filtered through a 5 ⁇ m filter to prepare photosensitive conductive material 2.
  • Photopolymerization initiator Irgacure 379 (manufactured by BASF) 3 parts Sensitizer DETX-S (manufactured by Nippon Kayaku Co., Ltd.) 2 parts
  • Polymerizable polyfunctional Monomer R-684 (manufactured by Nippon Kayaku Co., Ltd.) 16 parts, alkali-soluble resin 38.7 parts, radical scavenger methyl hydroquinone 0.1 part, organic solvent 1-methoxy-2-propyl acetate 8 parts, surfactant Adecanate B -940 (made by ADEKA) 0.2 parts
  • photosensitive conductive material 3 A mixture having the following composition was stirred and mixed uniformly, dispersed using three rolls, and then filtered through a 5 ⁇ m filter to prepare photosensitive conductive material 3.
  • Photopolymerization initiator Irgacure 379 (manufactured by BASF) 3 parts
  • Sensitizer DETX-S (manufactured by Nippon Kayaku Co., Ltd.) 2 parts
  • Polymerizable polyfunctional Monomer R-684 manufactured by Nippon Kayaku Co., Ltd.) 16 parts, alkali-soluble resin 38.7 parts, radical scavenger methyl hydroquinone 0.1 part, organic solvent 1-methoxy-2-propyl acetate 8 parts, surfactant Adecanate B -940 (made by ADEKA) 0.2 parts
  • photosensitive conductive material 4 A mixture having the following composition was stirred and mixed uniformly, dispersed using three rolls, and then filtered through a 5 ⁇ m filter to prepare photosensitive conductive material 4.
  • Photopolymerization initiator Irgacure 379 (manufactured by BASF) 3 parts
  • Sensitizer DETX-S (manufactured by Nippon Kayaku Co., Ltd.) 2 parts
  • Polymerizable polyfunctional Monomer R-684 manufactured by Nippon Kayaku Co., Ltd.) 16 parts, alkali-soluble resin 38.7 parts, radical scavenger methyl hydroquinone 0.1 part, organic solvent 1-methoxy-2-propyl acetate 8 parts, surfactant Adecanate B -940 (made by ADEKA) 0.2 parts
  • photosensitive conductive material 5 A mixture having the following composition was stirred and mixed uniformly, dispersed using three rolls, and then filtered through a 5 ⁇ m filter to prepare photosensitive conductive material 5.
  • Photopolymerization initiator Irgacure 379 (manufactured by BASF) 3 parts Sensitizer DETX-S (manufactured by Nippon Kayaku Co., Ltd.) 2 parts
  • Polymerizable polyfunctional Monomer R-684 manufactured by Nippon Kayaku Co., Ltd.) 16 parts, alkali-soluble resin 38.7 parts, radical scavenger methyl hydroquinone 0.1 part, organic solvent 1-methoxy-2-propyl acetate 8 parts, surfactant Adecanate B -940 (made by ADEKA) 0.2 parts
  • photosensitive conductive material 6 A mixture having the following composition was stirred and mixed uniformly, dispersed using three rolls, and then filtered through a 5 ⁇ m filter to prepare photosensitive conductive material 6.
  • Photopolymerization initiator Irgacure 379 (manufactured by BASF) 3 parts Sensitizer DETX-S (manufactured by Nippon Kayaku Co., Ltd.) 2 parts
  • Polymerizable polyfunctional Monomer R-684 (manufactured by Nippon Kayaku Co., Ltd.) 16 parts, alkali-soluble resin 38.7 parts, radical scavenger methyl hydroquinone 0.1 part, organic solvent 1-methoxy-2-propyl acetate 8 parts, surfactant Adecanate B -940 (made by ADEKA) 0.2 parts
  • ⁇ Development adhesion test> In order to confirm the adhesion of the touch panel sensor manufactured according to the present invention with fine wires, a development adhesion test was performed. A touch panel sensor in which an extraction wiring was formed using a photomask having a line and space (L / S) of 10 ⁇ m / 20 ⁇ m, 15 ⁇ m / 20 ⁇ m, 20 ⁇ m / 20 ⁇ m, 25 ⁇ m / 20 ⁇ m, and 30 ⁇ m / 20 ⁇ m was manufactured.
  • L / S line and space
  • ⁇ High temperature and high humidity test> In order to confirm the adhesion after environmental load of the touch panel sensor manufactured according to the present invention, a high temperature and high humidity test was performed. A touch panel sensor in which an extraction wiring was formed using a photomask having a line and space (L / S) size of 30 ⁇ m / 30 ⁇ m was produced. After the touch panel sensor was put in a high-temperature and high-humidity tank at 60 ° C. and 90% RH for 200 hours, an adhesion test by a cross cut method was performed. As an adhesion test method, a test method according to JIS K 5600-5-6 (1999) was performed except that the cut was made only in the direction perpendicular to the wiring. As a judgment criterion, a case where wiring peeling does not occur is indicated by ⁇ , and a case where wiring peeling occurs is indicated by ⁇ .
  • Example 1 ITO sputtering was performed on a glass substrate while heating at 170 ° C. by a DC magnetron sputtering method. Subsequently, SZP manufactured by AZ Electronic Materials Co., Ltd. was spin-coated so as to have a film thickness of 1.0 ⁇ m as an etching protective film, and then prebaked on a 105 ° C. hot plate. Then, proximity exposure was performed using the photomask which reversed the desired 1st transparent electrode pattern, and it developed with the aqueous alkali solution containing sodium hydroxide and sodium carbonate.
  • the ITO film-formed glass substrate on which the positive resist is patterned is subjected to ITO etching with an oxalic acid aqueous solution, and then the positive resist is stripped using an alkaline aqueous solution containing sodium hydroxide and sodium carbonate to thereby make a jumper portion 21 of the first transparent electrode.
  • the conductive support 25 was formed with a film thickness of 0.03 ⁇ m.
  • the photosensitive conductive material 1 was printed on the glass substrate by a screen printing method so that the finished film thickness was 4.0 ⁇ m, and then prebaked in a hot air circulation oven.
  • the glass substrate is subjected to proximity exposure through a photomask on which a lead-out wiring pattern is formed, developed with an aqueous alkali solution containing sodium hydroxide and sodium carbonate, and then subjected to heat treatment, whereby a conductive support is obtained.
  • An extraction wiring 20 was formed on 25.
  • the width of the conductive support formed at this time is 12.3 ⁇ m, and the conductor width of the extraction wiring is 12.3 ⁇ m. It was.
  • the overlapping width of the transparent electrode and the conductive support was 50 ⁇ m.
  • Example 4 As shown in FIG. 4A and FIG. 4B, a mixture having the following composition is stirred and mixed uniformly at the periphery of the glass substrate, and then filtered through a 5 ⁇ m filter to form a carbon resist having a pigment concentration of 47%.
  • the decorative layer 25 (frame part) was formed with a film thickness of 1.5 ⁇ m.
  • Multifunctional polymerizable monomer (“OADPH80A (Molecular weight 764)” manufactured by Osaka Organic Industry Co., Ltd.) 10 parts Photoinitiator (“Irgacure OXE02” manufactured by BASF) 0.3 parts Sensitizer 4,4'-bis (diethylamino) Benzophenone (“EAB-F” manufactured by Hodogaya Chemical Co., Ltd.) 1.5 parts Cyclohexanone 140 parts Propylene glycol monomethyl ether acetate 140 parts Additive (“ADEKA Polyether G-400" manufactured by ADEKA Corporation) 5 parts
  • an insulating layer was provided on the decorative layer with NN901 manufactured by JSR.
  • a touch panel sensor having a conductive support 25 in the connection region between the transparent electrode and the extraction wiring 20 on the insulating layer and below the extraction wiring 20 was manufactured.
  • the continuity test and the high-temperature and high-humidity test were satisfactory.
  • the width of the conductive support formed at this time was 25.0 ⁇ m, and the conductor width of the extraction wiring was 20.1 ⁇ m.
  • the overlapping width between the transparent electrode and the conductive support was 60 ⁇ m.
  • ITO sputtering was performed on a glass substrate while heating at 170 ° C. by a DC magnetron sputtering method. Subsequently, SZP manufactured by AZ Electronic Materials Co., Ltd. was spin-coated so as to have a film thickness of 1.0 ⁇ m as an etching protective film, and then prebaked on a 105 ° C. hot plate. Then, proximity exposure was performed using the photomask which reversed the desired 1st transparent electrode pattern, and it developed with the aqueous alkali solution containing sodium hydroxide and sodium carbonate.
  • the ITO film-formed glass substrate on which the positive resist is patterned is subjected to ITO etching with an oxalic acid aqueous solution, and then the positive resist is stripped using an alkaline aqueous solution containing sodium hydroxide and sodium carbonate to thereby make a jumper portion 21 of the first transparent electrode.
  • the photosensitive conductive material 1 was printed on the glass substrate by a screen printing method so that the finished film thickness was 4.0 ⁇ m, and then prebaked in a hot air circulation oven.
  • the formation of the conductive support 25 under the extraction wiring 20 can prevent the occurrence of poor conduction and peeling due to the high temperature and high humidity test.
  • the average particle diameter of the silver powder is less than 0.05 ⁇ m as in Example 8
  • peeling occurs in the fine line
  • the fine line is blurred. Therefore, the average particle diameter is preferably 0.05 to 3 ⁇ m.
  • the overlapping portion was 1. It is preferably 0 ⁇ m or more.
  • the lead-out wiring 20 using a photosensitive conductive material containing metal fine particles on the conductive support 25, it has a high-definition pattern of 30 ⁇ m or less and has good quality with no disconnection or peeling. It is possible to provide a capacitive touch panel sensor that can be manufactured at low cost.

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  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
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Abstract

L'invention concerne un procédé permettant de produire un capteur de panneau tactile à capacité électrostatique, caractérisé en ce qu'il comprend : une étape de formation de cavaliers (21) permettant de former plusieurs cavaliers (21) dans une zone d'affichage sur un substrat transparent (10) suivant une première direction ; une étape de formation de support conducteur permettant de former un support conducteur (25) dans une partie périphérique extérieure de la zone d'affichage ; une étape de formation de couche d'isolation permettant de former une couche d'isolation sur les cavaliers (21) ; une étape de formation de ligne de câblage de départ permettant de former une ligne de câblage de départ sur le support conducteur (25) au moyen d'un matériau conducteur photosensible contenant des microparticules métalliques ; et une étape de formation d'électrodes transparentes permettant de former plusieurs premières électrodes transparentes (23) le long de la première direction de sorte que les cavaliers (21) puissent être connectés l'un à l'autre par le biais des premières électrodes transparentes (23) ou les premières électrodes transparentes (23) puissent être connectées à la ligne de câblage de départ (20) par le biais des premières électrodes transparentes (23), et permettant de former également plusieurs secondes électrodes transparentes (24) le long d'une seconde direction qui est perpendiculaire à la première direction de sorte que les secondes électrodes transparentes (24) puissent être connectées à la ligne de câblage de départ (20).
PCT/JP2013/001369 2012-03-12 2013-03-05 Capteur de panneau tactile à capacité électrostatique et procédé de production associé, et dispositif d'affichage WO2013136719A1 (fr)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015045325A1 (fr) * 2013-09-27 2015-04-02 デクセリアルズ株式会社 Panneau tactile capacitif incurvé et procédé pour sa réalisation
JP2016532174A (ja) * 2013-09-29 2016-10-13 ティーピーケイ タッチ ソリューションズ（シアメン）インコーポレーテッド タッチパネル

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010160670A (ja) * 2009-01-08 2010-07-22 Seiko Epson Corp タッチパネルの製造方法、タッチパネル、表示装置、及び電子機器
JP2011086122A (ja) * 2009-10-15 2011-04-28 Dainippon Printing Co Ltd 静電容量式タッチパネルセンサおよび当該タッチパネルセンサの製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010160670A (ja) * 2009-01-08 2010-07-22 Seiko Epson Corp タッチパネルの製造方法、タッチパネル、表示装置、及び電子機器
JP2011086122A (ja) * 2009-10-15 2011-04-28 Dainippon Printing Co Ltd 静電容量式タッチパネルセンサおよび当該タッチパネルセンサの製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015045325A1 (fr) * 2013-09-27 2015-04-02 デクセリアルズ株式会社 Panneau tactile capacitif incurvé et procédé pour sa réalisation
JP2015069267A (ja) * 2013-09-27 2015-04-13 デクセリアルズ株式会社 静電容量型曲面形状タッチパネル及びその製造方法
JP2016532174A (ja) * 2013-09-29 2016-10-13 ティーピーケイ タッチ ソリューションズ（シアメン）インコーポレーテッド タッチパネル

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