WO2013131374A1 - 背板系统 - Google Patents

背板系统 Download PDF

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Publication number
WO2013131374A1
WO2013131374A1 PCT/CN2012/083549 CN2012083549W WO2013131374A1 WO 2013131374 A1 WO2013131374 A1 WO 2013131374A1 CN 2012083549 W CN2012083549 W CN 2012083549W WO 2013131374 A1 WO2013131374 A1 WO 2013131374A1
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WO
WIPO (PCT)
Prior art keywords
backplane
power
signal
board
service
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Application number
PCT/CN2012/083549
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English (en)
French (fr)
Inventor
张小华
吴志欢
熊星
Original Assignee
华为技术有限公司
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Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2013131374A1 publication Critical patent/WO2013131374A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/189—Power distribution
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means

Definitions

  • the present invention relates to the field of communications, and in particular, to a backplane system. Background technique
  • FIG. 1A is a perspective view of a conventional backplane communication system
  • FIG. 1B is a cross-sectional view of a conventional backplane communication system.
  • the system is modular in design and includes a power module 101, a service module 102, and a backplane module 103.
  • the backplane module 103 is implemented in the system in a centralized manner.
  • the backplane module 103 also needs to implement a power flow function.
  • the system uses a 12V power bus internally. Therefore, to achieve 7200W internal power supply, the backplane module 103 needs to achieve a current capacity of 800A or more. If it is a 10000W device, it needs to achieve a current capacity of 800A or more.
  • the existing communication system directly realizes the function of signal connection and power flow through a backplane.
  • the communication system implements power-through current functions in the depth direction, the lateral direction, and the longitudinal direction by the backplane.
  • Figure 1B the front panel of the backplane needs to be placed with the single-board power connector 104 and the single-board signal connector 105.
  • the system power connector 106 needs to be placed on the back of the backplane, and the front and back connectors of the backplane are disposed. The position must be staggered, which ultimately results in a limited area of the back panel.
  • the opening area of the backplane is small, and the wind resistance of the system is very large, which directly leads to low heat dissipation capability of the system, and it is difficult to support heat dissipation of the high-power service module.
  • the current sink between the power modules The party occupies the number of layers of the backboard and the free space of the backboard, thereby further reducing the opening area of the backboard and increasing the cost of the backplane.
  • the system power of the existing blade servers, switches, routers, and the like is continuously increased, thereby causing difficulties in system power supply and heat dissipation.
  • Embodiments of the present invention provide a backplane system to solve the problem of power supply and heat dissipation of a high power server and a communication system.
  • Embodiments of the present invention provide a backplane system.
  • the system includes: one or more service boards, power modules, signal backplanes, and power backplanes;
  • the service board is disposed on one side of the signal backplane for processing of a service; the signal backplane is used for signal interconnection between the service boards or the service board and other modules Inter-signal interconnection;
  • the power module is disposed on the other side of the signal backplane, and is configured to be connected to the service board through the power backplane, and is configured to supply power to the service board by using the power backplane; a ventilation area is formed between the power backplane and the signal backplane or a ventilation hole is formed on the signal backplane; the ventilation area and the ventilation hole are formed by the signal backplane side to a duct on the other side to dissipate heat from the system;
  • the plane of the power backplane is parallel to the ventilation direction of the air duct; the signal backplane is perpendicular to a plane where the power backplane is located, and is perpendicular to a ventilation direction of the air duct.
  • the power supply backplane and the signal backplane respectively perform current transmission and data interconnection, and the power supply backplane directly completes the current combining of the plurality of power modules and the traffic to the service board.
  • the function makes the signal backplane no longer participate in the power supply function, thereby improving the heat dissipation capability of the system and the power supply capability of the system, and reducing the number of printed circuit board (PCB) layers and PCB space for the current flowing on the signal backplane.
  • PCB printed circuit board
  • the area of the signal backplane can be opened and the cost of the signal backplane is reduced, and the power supply and the signal do not interfere with each other, making the system more stable.
  • FIG. 1A is a schematic perspective view of a conventional backplane communication system
  • Figure 1B is a cross-sectional view of a conventional backplane communication system
  • FIG. 2A is a schematic perspective view of a backplane system of the present invention.
  • Figure 2B is a cross-sectional view of the backsheet system of the present invention.
  • the technical solution of the present invention will be further described in detail below through the accompanying drawings and embodiments.
  • the invention adopts a three-dimensional combined backboard design scheme, which increases the opening area of the central backplane and improves the heat dissipation capability of the system.
  • Fig. 2A is a perspective view showing the structure of a backplane system according to an embodiment of the present invention
  • Fig. 2B is a cross-sectional view showing the backplane system of the present invention.
  • the backplane system includes: a power module 201, a service board 202, a power backplane 203, and a signal backplane 204.
  • the service board 202 is disposed on one side of the signal backplane 204 for integrating services, and completing service processing, and one or more may be set.
  • the signal backplane 204 is used for signal interconnection between the service boards 202 or for signal interconnection between the service boards 202 and other modules.
  • the power module 201 is disposed at any position of the power supply area on the other side of the signal backplane 204 or a combination thereof, and is configured to be connected to the service board 202 through the power backplane 203 for powering the service board 202 through the power backplane 203. .
  • a ventilation area is formed between the power backplane 203 and the signal backplane 204, or when there is a vent hole on the signal backplane 204, a duct is formed from one side of the signal backplane 204 to the other side to dissipate heat from the system.
  • the power backplane 203 is used to access the power module 201 and transmit current, which is parallel to the system.
  • the cooling air duct is disposed, and the setting of the signal backing plate 204 satisfies a certain angle.
  • the plane of the power backplane 203 is approximately perpendicular to the plane of the signal backplane 204, that is, the power backplane 203 can be disposed approximately horizontally between any of the power module 201 and the service board 202, or a combination thereof. Parallel to the plane of the service board 202, so that the power backplane 203 occupies the least space in the airway direction, which is beneficial to improve the ventilation and heat dissipation capability of the system.
  • the positional relationship between the power backplane 203, the signal backplane 204 and the air duct ventilation direction is: the plane where the power backplane 203 is located is parallel to the ventilation direction of the air duct; the signal backplane 204 and the power backplane 203 The plane is vertical and perpendicular to the direction of ventilation of the duct.
  • the "parallel" and “vertical” in the above positional relationship are not absolute, allowing for a small deviation. That is to say, when the power backplane 203 and the signal backplane 204 are disposed, as long as they occupy as little ventilation area as possible, a better heat dissipation effect can be achieved.
  • the power backplane 203 is disposed approximately horizontally above and below the signal backplane 204.
  • Both the power backplane 203 and the signal backplane 204 can be deployed in a suspended manner. At this time, a ventilation area is formed between the power backplane 203 and the signal backplane 204, or the power backplane 203 and the signal backplane 204 can be closely phased. Connected, but the signal back plate 204 is provided with a vent hole, and the position of the vent hole may be disposed in a free area on the signal back plate 204.
  • the venting holes are provided for the air passage formed in the direction of the power backplane to be cooled by the ventilation holes to reduce the system wind resistance of the backplane system, thereby improving the heat dissipation capability of the system.
  • the method for opening the ventilation hole 204A on the signal backplane 204 is used to achieve ventilation in the system.
  • the backplane system also includes a system power connector 205, a single board power connector 206, and a single board signal connector 207.
  • the system power connector 205 and the single-board power connector 206 are located in the air channel, and can be disposed on corresponding power supply areas on either side of the power backplane 203, and are respectively connected to the front and rear ends of the power backplane 203 to implement the power module 201. Access and transfer.
  • the system power connector 205 is also connected to the power module 201, that is, the power module 201 is connected to the power backplane 203 through the system power connector 205 to complete the access and transmission of the power from the power module 201 to the power backplane 203.
  • the board power connector 206 is also connected to the service board 202, that is, the service board 202 is powered by the board.
  • the source connector 206 is coupled to the power backplane 203 to complete the access and transfer of power from the power backplane 203 to the service board 202.
  • the system power connector 205 and the single-board power connector 206 overlap in the projection area of the plane of the signal backplane 204, so that the power connector multiplex space on the front and back of the signal backplane 204 does not occupy additional backplane space.
  • the area of the openable hole on the signal backplane is increased, that is, the area of the ventilation hole is increased, thereby improving the ventilation and heat dissipation capability of the system.
  • the board signal connector 207 is connected to the signal board 204 and the service board 202, that is, the service board 202 is connected to the signal back board 204 through the board signal connector 207, and is used to implement the service in the service board 202.
  • the backplane system may include one or more power modules and one or more power backplanes, and the plurality of power modules may be distributed at any position of the power supply area of the backplane system or a combination thereof, and are in the same manner as the power module Multiple power supplies in the plane of the connected power supply backplane are placed adjacent to each other.
  • the plurality of power backplanes may be disposed approximately horizontally at an upper portion, a middle portion, a lower portion, or a combination thereof of the backplane system, and are parallel to each other, or approximately parallel to any plane in which the service boards are located or a combination thereof.
  • a plurality of power supply backplanes in the same plane are placed adjacent to each other in a direction perpendicular to the air duct. For example, high-density complex communication systems and blade server devices require a large amount of power to be deployed in multiple areas of the system.
  • the backplane system may include one or more signal backplanes, and the plurality of signal backplanes may be arranged in a combination of up and down adjacent, left and right adjacent settings, or both.
  • the backplane system includes a plurality of power modules 201 disposed at the top and bottom of the power supply area for placing the power modules, respectively.
  • a horizontal power supply backplane 203 is provided in each of the upper and lower power supply areas of the system.
  • a signal backplane 204 is vertically disposed between the two power backplanes, and the side cross-sectional view of the backplane structure of the backplane system is similar to the "work" word, referred to as the "work" type stereo backplane.
  • the backplane system of another embodiment of the present invention differs from the backplane system of the previous embodiment in that it includes only one power backplane and one signal backplane.
  • the backplane system is suitable for small and medium-sized systems, or for systems where service slots for service cards are not required to be split.
  • Power module set An area disposed near the power backplane, such as at the top, middle, or bottom of the backplane system.
  • the power access area of the power backplane and the power access area of the service board are disposed at the upper or lower part of the corresponding power backplane.
  • the power modules are collectively disposed on the top of the backplane system, and the single-board power connector and the system power connector are respectively disposed at the front and rear ends of the power supply backplane.
  • the side cross-sectional view of the backplane structure of the backplane system is similar to the "T" character, which is simply referred to as a "T" shaped stereo backplane.
  • the side sectional view of the backplane structure of the backplane system is similar to the inverted "T” word, which is simply referred to as an inverted "T" shaped stereo backplane. .
  • the backplane system of still another embodiment of the present invention differs from the backplane systems of the above two embodiments in that it includes a power backplane and two signal backplanes.
  • the power backplane is horizontally disposed in the middle of the communication system, and a signal backplane is vertically disposed at the upper and lower portions of the power backplane, respectively.
  • the power module is centrally located in the middle of the power supply area of the backplane system.
  • the single-board power connector and the system power connector are respectively disposed at the front and rear ends of the power supply backplane.
  • the side sectional view of the backplane structure of the backplane system is similar to the "+" character, which is simply referred to as the "+" shaped stereo backplane.
  • a bus bar may be further included, and as shown in Fig. 2B, the bus bar 208 is vertically disposed between adjacent power supply backplanes.
  • adjacent power supply backplanes are connected by bus bars 208 for realizing current combining in multiple power modules.
  • the bus bar 208 can be made of a conductive member such as a copper strip, an aluminum strip, a copper cable, or an aluminum cable. If the backplane system includes only one power backplane or does not need to pass through between the power backplanes, the busbars 208 are not included in the backplane system, and the power zones are independently powered.
  • a fan module 209 may also be included for providing ventilation to the backplane system through a venting area or a through hole.
  • the power required by the fan module 209 may be provided by the power module 201 contained within the backplane system or by an externally provided power source.
  • the switch module 210 may be further connected to the signal backplane 204 through another single-board signal connector 207 for implementing each service board.
  • the power module supplies power to the entire system
  • the power backplane connects the power to the system and transmits the current to the service through the system power connector and the single board power connector connected thereto. Board.
  • the currents in the multiple power modules are combined by the bus bars between adjacent power supply backplanes to achieve current flow.
  • the signal backplane transmits data on the service board to the signal backplane through the board signal connector connected thereto, so that service data signals between adjacent service boards are interconnected and communicated.
  • the fan is used to provide the wind speed to the system, and the ventilation through the ventilation area between the power backplane and the signal backplane or the through hole on the signal backplane realizes the heat dissipation of the system.
  • the stereo backplane system having the "work” type, the "T” type, the inverted “T” type or the “+” type is parallel to the horizontally disposed power supply backplane.
  • the direction of the system air duct, and the projection area of the single-board power connector and the system power connector for connecting the service board and the power module overlap on the signal backplane, so that the area that can be hollowed out on the signal backplane is increased and increased.
  • the area of the ventilating hole reduces the wind resistance of the system, thereby improving the heat dissipation capability of the system and the power supply capability of the system.
  • the horizontally disposed power backplane directly completes the current combining of the multiple power modules and the current flowing to the service board, so that the signal backplane no longer participates in the power supply function, and reduces the PCB for the current flowing on the signal backplane.
  • the number of layers and PCB space further enhances the area of the signal backplane that can be opened and reduces the cost of the signal backplane, and the power supply and signals do not interfere with each other, making the system more stable.

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本发明涉及一种背板系统。该系统包括：一个或多个业务板卡、电源模块、信号背板以及电源背板；业务板卡设置在信号背板的一侧，用于业务的处理；信号背板，用于业务板卡间的信号互连或者业务板卡与其他模块之间的信号互连；电源模块，设置在信号背板的另一侧，用于通过电源背板与业务板卡相连接，用于通过电源背板为业务板卡供电；其中，电源背板与信号背板之间形成通风区域或者信号背板上具有通风孔；通风区域和通风孔用于形成由信号背板一侧到另一侧的风道，以对系统进行散热；电源背板所在的平面与风道的通风方向平行；信号背板与电源背板所在的平面垂直，并且与风道的通风方向垂直。

Description

板系统 技术领域 本发明涉及通信领域， 尤其涉及一种背板系统。 背景技术
在 IT服务器领域， 随着半导体集成度不断提升和业务需求不断加大， 单 个系统的功耗越来越高。 以刀片服务器为例， 一台 10U高的单台设备功耗已 经达到 7200W, 并在向 10000W演进， 系统供电和散热能力逐渐成为系统设 计的关键瓶颈之一。 如何解决系统性能提升随之而来的功率提升与系统散热 及供电设计难度不断加大的矛盾， 已经成为各个设备厂商需要不断攻克的技 术难题。
图 1A是一种现有背板通信系统的立体结构示意图，图 1B是一种现有背 板通信系统的剖视图。 如图 1A和 1B所示， 该系统釆用模块化结构设计， 包 括电源模块 101、 业务模块 102和背板模块 103。 系统内部一般釆用中置的方 式实现背板模块 103 , 该背板模块 103除了完成各业务模块 102间的信号通 信， 还需要实现电源通流功能。 通常系统内部釆用 12V电源总线， 因此要实 现 7200W的系统内部供电，背板模块 103需要实现 800A以上的通电流能力， 若是 10000W的设备， 则需要实现 800A以上的通电流能力。
该现有通信系统直接通过一块背板来实现信号连接和电源通流的功能。 如图 1A所示， 该通信系统由背板实现深度方向、 横向和纵向的电源通电流 功能。 再如图 1B所示。 在这种单一背板方案下， 背板的正面需要摆放单板电 源连接器 104、单板信号连接器 105 ,背板背面需要摆放系统电源连接器 106, 并且背板正反面的连接器必须错开位置， 最终导致背板可开孔区域受限。 背 板开孔区域很小， 系统风阻就很大， 直接导致系统散热能力不高， 难以支持 大功率业务模块散热。 而且当系统有多个电源模块时， 电源模块间的电流汇 聚会占用背板的层数和背板的空余空间， 从而进一步减小背板开孔区域和增 加背板成本。 例如现有刀片服务器、 交换机、 路由器等框式电器设备为了实 现高密的业务能力， 系统功率不断提升， 从而导致系统供电和散热实现困难 的问题。
发明内容
本发明实施例提供了一种背板系统， 以解决大功率服务器和通信系统的 供电和散热问题。
本发明实施例提供了一种背板系统。该系统包括：一个或多个业务板卡、 电源模块、 信号背板以及电源背板；
所述业务板卡设置在所述信号背板的一侧， 用于业务的处理； 所述信号背板， 用于所述业务板卡间的信号互连或者所述业务板卡与 其他模块之间的信号互连；
所述电源模块， 设置在所述信号背板的另一侧， 用于通过所述电源背 板与所述业务板卡相连接， 用于通过所述电源背板为所述业务板卡供电； 其中， 所述电源背板与所述信号背板之间形成通风区域或者所述信号 背板上具有通风孔； 所述通风区域和所述通风孔用于形成由所述信号背板 一侧到另一侧的风道， 以对所述系统进行散热；
所述电源背板所在的平面与所述风道的通风方向平行； 所述信号背板与 所述电源背板所在的平面垂直， 并且与所述风道的通风方向垂直。
本发明实施例的背板系统， 釆用电源背板与信号背板分别进行电流传送 和数据互连， 由电源背板直接完成了多个电源模块的电流合路以及向业务板 卡的通流功能， 使得信号背板不再参与供电功能， 从而提升了系统的散热能 力和系统的供电能力， 并且减少了信号背板上用于通电流的印刷电路板 ( PCB )层数和 PCB空间， 进一步提升了信号背板可开孔的面积和降低了信 号背板的成本， 并且电源与信号不会相互干扰， 使得系统更加稳定。 附图说明
实施例或现有技术描述中所需要使用的附图作一简单地介绍， 显而易见 地， 下面描述中的附图是本发明的一些实施例， 对于本领域普通技术人员 来讲， 在不付出创造性劳动性的前提下， 还可以根据这些附图获得其他的 附图。
图 1A是一种现有背板通信系统的立体结构示意图；
图 1B是一种现有背板通信系统的剖视图；
图 2A是本发明的背板系统的立体结构示意图；
图 2B是本发明的背板系统的剖视图。
具体实施方式
下面通过附图和实施例， 对本发明的技术方案做进一步的详细描述。 本发明釆用将立体的组合背板设计方案， 增大了中置背板的开孔面积， 提升了系统的散热能力。
图 2A是本发明实施例的背板系统的立体结构示意图， 图 2B是本发明的 背板系统的剖视图。 如图 2A和 2B所示， 该背板系统包括： 电源模块 201 , 业务板卡 202、 电源背板 203和信号背板 204。
业务板卡 202设置在所述信号背板 204的一侧， 用于集成业务， 完成 业务的处理， 可以设置一个或多个。 信号背板 204用于业务板卡 202间的 信号互连或者业务板卡 202与其他模块之间的信号互连。 电源模块 201设 置在信号背板 204 另一侧电源区域的任一位置或其组合， 用于通过电源背 板 203与业务板卡 202相连接， 用于通过电源背板 203为业务板卡 202供 电。电源背板 203与信号背板 204之间形成通风区域，或者在信号背板 204 上具有通风孔时， 形成由信号背板 204的一侧到另一侧的风道， 以对系统 进行散热。 电源背板 203用于接入电源模块 201并传送电流， 其平行于系 统散热风道而设置，并且与信号背板 204的设置满足一定的夹角。具体地， 电源背板 203所在平面近似垂直于信号背板 204所在平面，即电源背板 203 可以近似水平设置于电源模块 201与业务板卡 202之间的任一位置或其组 合，也可以近似平行于业务板卡 202所在平面而设置，这样使电源背板 203 占用了最少的风道方向的空间， 就有利于提高系统的通风与散热能力。 由此 可见， 电源背板 203、 信号背板 204和风道通风方向三者之间的位置关系 为： 电源背板 203所在的平面与风道的通风方向平行； 信号背板 204与电源 背板 203所在的平面垂直， 并且与风道的通风方向垂直。 上述位置关系中的 "平行" 和 "垂直" 均不是绝对的， 允许有较小的偏差。 也就是说， 在设 置电源背板 203与信号背板 204时，只要尽量做到使其占用较少通风面积， 能够达到较好的散热效果即可。 优选地， 在本发明实施例中， 将电源背板 203近似水平设置于信号背板 204的上方和下方。
电源背板 203和信号背板 204均可釆用悬空设置的方法， 此时在电源 背板 203与信号背板 204之间形成通风区域， 或者电源背板 203和信号背 板 204也可以紧密相接， 但在信号背板 204上开设有通风孔， 通风孔的位 置可以设置在信号背板 204上空闲的区域。 通风孔的设置是用于沿电源背 板方向形成的风道通过通风孔通风降温， 以减小该背板系统的系统风阻， 从而提升系统的散热能力。 优选地， 本实施例中， 釆用在信号背板 204上 开设通风孔 204A的方法来实现系统内的通风。
该背板系统还包括系统电源连接器 205、 单板电源连接器 206和单板信 号连接器 207。 系统电源连接器 205和单板电源连接器 206位于风道内， 可 设置于电源背板 203任意一面的对应电源区域， 并且分别与电源背板 203的 前后两端相连接， 以实现电源模块 201 的接入和传送。 系统电源连接器 205 还与电源模块 201相连接， 即电源模块 201通过系统电源连接器 205与电源 背板 203相连接，以完成电源由电源模块 201到电源背板 203的接入和传送。 单板电源连接器 206还与业务板卡 202相连接， 即业务板卡 202通过单板电 源连接器 206与电源背板 203相连接， 以完成电源由电源背板 203到业务板 卡 202的接入和传送。 并且系统电源连接器 205和单板电源连接器 206在信 号背板 204所在平面的投影区域重叠， 这样信号背板 204正反面的电源连接 器复用空间， 不会再占用额外的背板空间， 使信号背板上可开孔的面积增大， 即增大了通风孔的面积， 进而提高了系统的通风与散热能力。 单板信号连接 器 207分别与信号背板 204和业务板卡 202相连接， 即业务板卡 202通过单 板信号连接器 207与信号背板 204相连接， 用于实现业务板卡 202中的业务 数据到信号背板 204的传送。
该背板系统可以包括一个或多个电源模块和一个或多个电源背板， 多 个电源模块可以分布在该背板系统的电源区域的任一位置或其组合，同处于 与该电源模块相连接的相应电源背板所在平面内的多个电源相邻放置。 多个 电源背板可以近似水平设置在该背板系统的上部、 中部、 下部或其组合， 并 且相互平行， 或者近似平行设置于业务板卡所在的任一平面内或其组合。 同处于同一平面内的多个电源背板沿垂直于风道的方向相邻放置。 例如， 高 密复杂的通信系统、 刀片服务器设备由于功率较大， 电源就需要部署在所述 系统的多个区域。
该背板系统可以包括一个或多个信号背板， 多个信号背板可以上下相邻 设置、 左右相邻设置或釆用这两种方式组合设置。
在本实施例中， 如图 2A所示， 该背板系统包含了多个电源模块 201 , 分 别设置在用于放置电源模块的电源区域的顶部和底部。 对应地， 在该系统的 上下两个位置的背板电源区域， 各设置了一个水平的电源背板 203。 在两个 电源背板之间竖直设置了一个信号背板 204, 此时该背板系统的背板结构的 侧剖视图类似于 "工" 字， 简称为 "工" 字型立体背板。
另外， 本发明的另一实施例的背板系统与上一实施例的背板系统的不同 在于只包含一个电源背板和一个信号背板。 该背板系统适用于中小容量的系 统， 或者适用于放置业务板卡的业务槽位不需要拆分的系统中。 电源模块集 中设置在电源背板附近的某一区域， 例如设置在该背板系统的顶部、 中部或 底部。 则电源背板的电源接入区和业务板卡的电源接入区设置在相应电源背 板的上部或下部。 本实施例中， 将电源模块集中设置在该背板系统的顶部， 单板电源连接器和系统电源连接器分别设置在电源背板上部的前后两端。 此 时该背板系统的背板结构侧剖视图类似于 "T" 字， 简称为 "T" 字型立体背 板。 本实施例中， 若将电源模块集中设置在该背板系统的底部， 则该背板系 统的背板结构侧剖视图类似于倒置的 "T" 字， 简称为倒 "T" 字型立体背板。
本发明的又一实施例的背板系统与以上两个实施例的背板系统的不同在 于包含一个电源背板和两个信号背板。 电源背板水平设置于该通信系统的中 部， 在电源背板的上部和下部分别竖直设置一个信号背板。 将电源模块集中 设置在该背板系统电源区域的中部， 单板电源连接器和系统电源连接器分别 设置在电源背板上部的前后两端。 此时该背板系统的背板结构侧剖视图类似 于 "+" 字， 简称为 "+" 字型立体背板。
在本发明的上述实施例的背板系统中，还可以包括汇流条，再如图 2B所 示， 汇流条 208竖直设置于相邻电源背板之间。 当该背板系统具有多个电源 背板， 并且多个电源背板间需要汇流时， 相邻电源背板间釆用汇流条 208连 接， 用于实现多个电源模块中的电流合路。 所述汇流条 208可釆用铜条、 铝 条、 铜线缆或铝线缆等导电部件。 如果该背板系统只包括一个电源背板或者 虽包括多个电源背板但之间不需要通流时， 则该背板系统中不包括汇流条 208, 各个电源区域独立供电。
在本发明的上述实施例的背板系统中， 还可以包括风扇模块 209 , 用于 通过通风区域或通孔给该背板系统提供通风。 风扇模块 209所需的电源可由 该背板系统内部包含的电源模块 201来提供， 也可以由外部设置的电源来提 供。
在本发明的上述实施例的背板系统中， 还可以包括交换模块 210 , 其通 过另一个单板信号连接器 207与信号背板 204相连接， 用于实现各个业务板 卡 202之间的业务的连接和交换。
以上所述的本发明实施例的背板系统工作时，电源模块给整个系统供电， 电源背板通过与其连接的系统电源连接器、 单板电源连接器将电源接入系统 并将电流传送至业务板卡。 相邻电源背板之间通过汇流条使多个电源模块中 的电流合路， 实现通流。 信号背板通过与其连接的单板信号连接器将业务板 卡上的数据传送至信号背板， 使得相邻业务板卡之间的业务数据信号之间 实现互连， 并进行通信。 当系统工作过程中， 系统风阻增大时， 利用风扇 给系统提供风速， 并通过电源背板与信号背板之间的通风区域或者信号背 板上的通孔进行通风， 实现了系统的散热。
如上所述， 本发明上述实施例的具有 "工" 字型、 "T" 字型、 倒 "T" 字型或 "+"字型的立体背板系统， 由于水平设置的电源背板平行于系统风道 方向， 并且用于连接业务板卡和电源模块的单板电源连接器和系统电源连接 器在信号背板上的投影区域重叠， 使得信号背板上可以挖空的区域增加， 增 大了通风孔的面积， 减小了系统的风阻， 从而提升了系统的散热能力和系统 的供电能力。 同时水平设置的电源背板直接完成了多个电源模块的电流合路 以及向业务板卡的通流功能， 使得信号背板不再参与供电功能， 减少了信号 背板上用于通电流的 PCB层数和 PCB空间， 进一步提升了信号背板可开孔 的面积和降低了信号背板的成本， 并且电源与信号不会相互干扰， 使得系统 更加稳定。
以上所述的具体实施方式， 对本发明的目的、 技术方案和有益效果进行 了进一步详细说明， 所应理解的是， 以上所述仅为本发明的具体实施方式而 已， 并不用于限定本发明的保护范围， 凡在本发明的精神和原则之内， 所做 的任何修改、 等同替换、 改进等， 均应包含在本发明的保护范围之内。

Claims

权 利 要 求 书
1、 一种背板系统， 其特征在于， 所述系统包括： 一个或多个业务板 卡、 电源模块、 信号背板以及电源背板；
所述业务板卡设置在所述信号背板的一侧， 用于业务的处理； 所述信号背板， 用于所述业务板卡间的信号互连或者所述业务板卡与 其他模块之间的信号互连；
所述电源模块， 设置在所述信号背板的另一侧， 用于通过所述电源背 板与所述业务板卡相连接， 用于通过所述电源背板为所述业务板卡供电； 其中， 所述电源背板与所述信号背板之间形成通风区域或者所述信号 背板上具有通风孔； 所述通风区域和所述通风孔用于形成由所述信号背板 一侧到另一侧的风道， 以对所述系统进行散热；
所述电源背板所在的平面与所述风道的通风方向平行； 所述信号背板与 所述电源背板所在的平面垂直， 并且与所述风道的通风方向垂直。
2、 根据权利要求 1 所述的系统， 其特征在于， 所述系统还包括： 系统 电源连接器， 位于所述风道内， 所述电源模块通过所述系统电源连接器与所 述电源背板相连接。
3、 根据权利要求 1 所述的系统， 其特征在于， 所述系统还包括： 单板 电源连接器， 位于所述风道内， 所述业务板卡通过所述单板电源连接器与所 述电源背板相连接。
4、 根据权利要求 1 所述的系统， 其特征在于， 所述系统还包括： 单板 信号连接器，所述业务板卡通过所述单板信号连接器与所述信号背板相连接。
5、 根据权利要求 4所述的系统， 其特征在于， 所述系统还包括： 交换 模块， 所述交换模块通过所述单板信号连接器与所述信号背板相连接。
6、 根据权利要求 1所述的系统， 其特征在于， 所述系统还包括汇流条， 竖直设置在相邻所述电源背板之间， 所述多个电源模块通过所述汇流条将电 流合路。
7、 根据权利要求 6所述的系统， 其特征在于， 所述汇流条是铜条、 4; 条、 铜线缆或铝线缆。
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