WO2017215372A1 - 一种印制电路板结构及风扇插箱 - Google Patents

一种印制电路板结构及风扇插箱 Download PDF

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Publication number
WO2017215372A1
WO2017215372A1 PCT/CN2017/083759 CN2017083759W WO2017215372A1 WO 2017215372 A1 WO2017215372 A1 WO 2017215372A1 CN 2017083759 W CN2017083759 W CN 2017083759W WO 2017215372 A1 WO2017215372 A1 WO 2017215372A1
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Prior art keywords
printed circuit
circuit board
fan
disposed
components
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PCT/CN2017/083759
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English (en)
French (fr)
Inventor
刘京
焦军立
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中兴通讯股份有限公司
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Publication of WO2017215372A1 publication Critical patent/WO2017215372A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present disclosure relates to the technical field of printed circuit board structure design, and more particularly to a printed circuit board structure and a fan header.
  • 100G is the main transmission medium of optical cable.
  • the 100G system has been commercialized by major operators.
  • the system above 100G can further increase the network capacity and reduce the transmission cost per bit on the basis of 100G.
  • the fan box As an example, its overall layout consists of three parts, one is a fan fan to achieve heat dissipation requirements; the other is a fan control board, assuming that the fan box uses six fans, and six fans are divided into two groups. Each group of 3 fans is controlled for speed control; the third is a box housing for fixing fans and fan control boards.
  • the size of the fan control board in the entire fan enclosure is limited by the structure heat dissipation area.
  • the fan needs to be in the heat dissipation area as much as possible. Control, and finally achieve one-to-one control of each fan, which will add more control circuits, the device on the fan control board will increase greatly, but the fan saves space for the fan and is placed perpendicular to the fan.
  • the layout space of the control board is limited by the entire space. More control devices are placed on the fan control board, and the fans cannot be separately controlled.
  • the present disclosure provides a printed circuit board structure that is coupled to a pod housing of a fan pod, including components for controlling each fan in the pod housing,
  • the printed circuit board structure also includes:
  • the printed circuit board structure further includes: a connecting device for connecting the adjacent first printed circuit board and the second printed circuit board.
  • connecting device comprises:
  • connection sockets disposed on opposite sides of the first printed circuit board
  • connection plug disposed at a position corresponding to the two connection sockets on the second printed circuit board, and the connection plugs are connected in one-to-one correspondence with the connection socket.
  • connection socket is soldered to the first printed circuit board
  • connection plug is soldered to the second printed circuit board
  • the connecting device is a pin connector.
  • first printed circuit board is disposed near a first surface of the second printed circuit board and a portion of the component is disposed, and the second printed circuit board is adjacent to the The second surface of the first printed circuit board is also provided with a portion of the components.
  • the component disposed on the first surface of the first printed circuit board and the component disposed on the second surface of the second printed circuit board are on the first printed circuit board
  • the space between the single board and the second printed circuit board is staggered.
  • the two surfaces of the first printed circuit board and the two surfaces of the second printed circuit board are component placement surfaces.
  • the area of the first printed circuit board is larger than the area of the second printed circuit board, and the first printed circuit board is provided with a backplane connected to the backplane. socket.
  • An embodiment of the present disclosure further provides a fan insertion box including a box housing and a plurality of fans disposed in the box housing, and further comprising a printed circuit board structure as described above, the printed circuit A board structure is coupled to the pod housing, and the printed circuit board structure includes components that control each fan within the pod housing.
  • the printed circuit board structure includes at least two printed circuit board boards disposed in parallel, the components are disposed on the printed circuit board, and at least some components are located in the phase. Adjacent to the space between the two printed circuit board veneers.
  • the printed circuit board structure of the embodiment of the present disclosure includes at least two printed circuit board boards arranged in parallel, and components for controlling the fan can be disposed on any one of the boards and adjacent to the two printed circuit board boards. In the space between the two, the number of components on the printed circuit board is greatly increased, and the fans in the fan box can be controlled one by one to meet the requirements of precise heat dissipation.
  • FIG. 1 is a first schematic structural view of a printed circuit board structure according to an embodiment of the present disclosure
  • FIG. 2 is a second schematic structural view of a printed circuit board structure according to an embodiment of the present disclosure
  • FIG. 3 is a schematic structural diagram of a fan insertion box according to an embodiment of the present disclosure.
  • the embodiment of the present disclosure provides a printed circuit board structure and a fan insertion box, which solves the problem that the fan control board in the related art fan insertion box is limited by the entire space, and it is difficult to place more PCB devices on the fan control board. This in turn causes a problem that the fans in the fan box cannot be controlled one by one.
  • the printed circuit board structure of the embodiment of the present disclosure is connected to the box housing 6 of the fan box, and is configured to be used for each of the box housings 6
  • the component 4 that the fan 7 controls, the printed circuit board structure further includes:
  • the printed circuit board structure may be disposed at the bottom of the box housing 6, and the front and back sides of each of the printed circuit board boards are component arrangement surfaces, and adjacent two printed circuit board boards There is space for accommodating components, and components can be placed on the front and back sides of any printed circuit board, which greatly increases the component layout space on the surface of the printed circuit board.
  • the printed circuit board structure includes at least two printed circuit board boards disposed in parallel, and the component is disposed on the printed circuit board, and at least partially The device is located in the space between two adjacent printed circuit board boards.
  • the printed circuit board structure of the embodiment of the present disclosure includes at least two printed circuit board boards arranged in parallel, and components for controlling the fan can be disposed on any one of the boards and adjacent to the two printed circuit board boards. In the space between the two, the number of components on the printed circuit board is greatly increased, and the fans in the fan box can be controlled one by one to meet the requirements of precise heat dissipation.
  • the above printed circuit board structure further includes: a connecting device 3 for connecting adjacent first printed circuit board veneers 1 and second printed circuit board veneers 2.
  • the above printed circuit board structure comprises two printed circuit board boards arranged in parallel, and the two printed circuit board boards are respectively the first printed circuit board single board 1 and the first Two printed circuit board veneers 2.
  • the first printed circuit board veneer 1 and the second printed circuit board veneer 2 are connected by a connecting device 3.
  • the connecting device 3 includes two connecting sockets 31 disposed on opposite sides of the first printed circuit board veneer 1 and disposed on the second printed circuit board veneer 2 corresponding to the two connecting sockets 31.
  • the connection plug 32 is located at a position, and the connection plug 32 is connected to the connection socket 31 in one-to-one correspondence.
  • the connection socket 31 is soldered to the first printed circuit board veneer 1, and the connection plug 32 is soldered to the second printed circuit board veneer 2.
  • the connection socket 31 and the connection plug 32 in the connection device 3 are detachably connected, which can greatly increase the maintainability of the entire system, and can be easily disassembled and repaired after a failure.
  • the connecting device 3 can be a pin connector, and two pin connector sockets (female plugs) are placed on the two sides of the second printed circuit board 2 with a predetermined distance from the edge, for example, 10 mm. a predetermined distance from the edge of the first printed circuit board veneer 1 , such as a position of 15 mm, a pin connector is placed, and the other side is The size of the two printed circuit board veneers 2 and the size of the pin connector socket determine the position at which the pin connector is placed, and finally, the first printed circuit board veneer 1 and the second printed circuit board veneer 2 are stacked Putting together, the connection of the first printed circuit board veneer 1 and the second printed circuit board veneer 2 is realized by the connection of the pin connector socket and the pin plug. In addition, the pin connector can ensure a large enough current to pass, meet the flow requirements, and the two connectors are in a symmetrical position, which can improve the reliability of the entire board.
  • the above connector can be selected in a range not only to select a pin connector but also to select other types of connectors.
  • the fan can be miniaturized, the number of fans can be increased, and one-to-one precise control can be realized, thereby further improving the heat dissipation requirement in the entire area.
  • both surfaces of the first printed circuit board veneer 1 and the two surfaces of the second printed circuit board veneer 2 are component placement surfaces, and components may be disposed on the first printed circuit
  • the arrangement surface of any component of the board single board 1 and the second printed circuit board board 2 greatly increases the arrangement space of components.
  • the first printed circuit board veneer 1 is provided with a part of the component 4 near the first surface of the second printed circuit board veneer 2, and the second printed circuit board A part of the component 4 is also disposed on the second surface of the single board 2 adjacent to the first printed circuit board.
  • the component 4 disposed on the first surface of the first printed circuit board veneer 1 and the component 4 disposed on the second surface of the second printed circuit board veneer 2 are in the A space between the printed circuit board veneer 1 and the second printed circuit board veneer 2 is staggered.
  • the components between the two printed circuit boards are arranged in a staggered manner, which can eliminate the excessive height caused by the use of the lamination method, and make full use of the longitudinal space of the first printed circuit board veneer, and Conducive to the overall layout of the fan, and the selection of the appropriate connector between the two printed circuit boards according to the height of the highest component to ensure the highest component placement space.
  • the area of the first printed circuit board veneer 1 in the embodiment of the present disclosure is larger than the area of the second printed circuit board veneer 2 (the length of the first printed circuit board veneer 1 is greater than The length of the second printed circuit board veneer 2), and the first printed circuit board veneer 1 is provided with a backplane connection socket 5 connected to the backplane.
  • the first printed circuit board 1 implements a main function such as a single board electrical signal control process
  • the second printed circuit board 2 can place a power supply and the like, and convert the converted power supply.
  • the signal is connected to the first printed circuit board veneer 1.
  • the second printed circuit board veneer 2 adopts a double-sided patch manner, and the back surface (near the surface of the first printed circuit board veneer) is placed with a higher device, the front side (away from the first printed circuit board sheet)
  • the surface of the board can be placed on a normal height device, and the height of the components disposed on the back side can be based on the height of the backplane connection socket of the first printed circuit board and the height of the connector between the two printed circuit boards. decided together.
  • Two pin connector sockets (female plugs) are placed on both sides of the second printed circuit board 2 from the edge of the board 2, which can ensure a large enough current to meet the flow requirements, and the two pin connectors
  • the socket is in a symmetrical position, which can effectively improve the reliability of the entire board.
  • the first printed circuit board 1 can realize single-board electrical signal processing, and control each fan. For example, speed control of each fan can be realized.
  • the first printed circuit board veneer 1 adopts a double-sided patch form, and the front surface (near the surface of the second printed circuit board veneer 2) can be placed with a higher device, and the device with a back surface of less than 2 mm is placed to avoid insertion. The case is contacted to cause a short circuit, and a pin connector is placed at a distance of 15 mm from the edge of the first printed circuit board veneer 1 and the other side is sized according to the size of the second printed circuit board veneer 2 and the pin The size of the connector socket determines where the pin connector is placed.
  • the highest device between the two printed circuit board boards needs to be designed to avoid, and the highest device in the first printed circuit board single board 1 and the second printed circuit board single board 2 is placed in a staggered manner, which can fully utilize two
  • the space between the printed circuit board boards can reduce the overall height and prevent the height of the backplane connection socket on the first printed circuit board 1 , wherein the first printed circuit board 1 passes
  • the backplane connection socket is connected to the backplane to enable communication between the first printed circuit board board 1 and the other boards through the backplane, and the backplane connection socket is the highest device on the first printed circuit board board 1.
  • the two printed circuit board boards are stacked together, and the two printed circuit board boards (the first printed circuit board single board 1 and the second printed circuit board single board 2) use pin connectors.
  • a socket female portion
  • the first printed circuit board veneer 1 is soldered with a pin portion, and the two portions can be freely separated, greatly increasing the whole
  • the maintainability of the system can be disassembled and repaired after a fault, and the height of the pin connector can be selected based on the highest device on the two printed circuit board boards.
  • the printed circuit board structure of the embodiment of the present disclosure increases the function of the single-board device by increasing the space in the longitudinal direction of the panel. Compared with the related art, the board is increased without changing the length of the board.
  • the purpose of the circuit device is to achieve the purpose of individually controlling each fan to meet the requirements of precise heat dissipation, and the use of detachable connecting devices facilitates later technical maintenance.
  • An embodiment of the present disclosure further provides a fan insertion box, as shown in FIG. 3, including a box housing 6 and a plurality of fans 7 disposed in the box housing, further including a printed circuit as described above
  • a fan insertion box as shown in FIG. 3, including a box housing 6 and a plurality of fans 7 disposed in the box housing, further including a printed circuit as described above
  • a board structure, the printed circuit board structure is coupled to the pod housing 6, and the printed circuit board structure includes components 4 that control each fan 7 within the pod housing 6.
  • the printed circuit board structure and the fan insertion box of the embodiment of the present disclosure comprise at least two printed circuit board boards arranged in parallel, the components are disposed on the printed circuit board, and at least some components are Located in the space between two adjacent printed circuit board veneers.
  • the printed circuit board structure of the embodiment of the present disclosure includes at least two printed circuit board boards arranged in parallel, and components for controlling the fan can be disposed on any one of the boards and adjacent to the two printed circuit board boards. In the space between the two, the number of components on the printed circuit board is greatly increased, and the fans in the fan box can be controlled one by one to meet the requirements of precise heat dissipation.
  • the printed circuit board structure and the fan insertion box of the embodiment of the present disclosure comprise at least two printed circuit board boards arranged in parallel, and the components for controlling the fan can be disposed on any one of the boards and adjacent to the two boards. Space between boards The number of components on the printed circuit board is greatly increased, and the fans in the fan box can be controlled one by one to meet the requirements of precise heat dissipation.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Combinations Of Printed Boards (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种印制电路板结构及风扇插箱，用以解决风扇插箱中的风扇控制单板受到整个空间限制，难以在风扇控制单板上放置较多的PCB器件，进而导致不能对风扇插箱中的风扇进行一一控制的问题。所述印制电路板结构包括：至少两个平行设置的印制电路板单板（1、2），元器件（4）设置于印制电路板单板上，且部分元器件（4）位于相邻两个所述印制电路板单板（1、2）之间的空间内，增加了印制电路板单板（1，2）上的元器件数量，进而可以对风扇插箱中的风扇（7）进行一一控制，满足精确散热的需求。

Description

一种印制电路板结构及风扇插箱 技术领域
本公开涉及印制电路板结构设计的技术领域，特别是指一种印制电路板结构及风扇插箱。
背景技术
随着数据通信业务的不断增长，网络数据呈现几何倍数巨涨，而海量数字媒体内容已经引发了互联网流量出现十倍甚至百倍的急速增长，这些数据不断地涌现，直接导致了骨干网的流量每年正以50％～80％的速度飞速增长。目前100G是以光缆作为主要的传输介质，100G系统已经在各大运营商商用，100G以上的系统能够在100G的基础上进一步提升网络容量并降低每比特传输成本，随着单板整个功耗的提高，对子架的散热提出更高的要求，如何精确的散热，如何实现风扇的精确控制，这些都将成为传输设备考虑的一个方面。
以风扇插箱为例，它的整体布局由三部分构成，一是风扇风机，实现散热要求；二是风扇控制单板，假定该风扇插箱使用6个风扇，6个风扇分为两组，每组3个风扇，进行控制调速处理；三是插箱壳体，用于固定风扇和风扇控制单板。
为了实现区域内降低单板温度的效果，整个风扇插箱中风扇控制单板的尺寸大小受到结构散热区域的限制，但为了保证散热效果，以及精确散热的要求，需要风扇尽量多的在散热区域进行控制，最终对各个风扇实现一对一控制，这样会增加更多的控制电路，风扇控制单板上面的器件会有大幅度增加，但风扇为节约风扇的使用空间，垂直于风扇进行放置，使得控制单板的布局空间受到整个空间的限制，在风扇控制单板上放置较多的控制器件，进而不能对各个风扇分别进行控制。
发明内容
本公开的目的在于提供一种印制电路板结构及风扇插箱，用以解决相关技术风扇插箱中的风扇控制单板受到整个空间限制，难以在风扇控制单板上放置较多的PCB器件，进而导致不能对风扇插箱中的风扇进行一一控制的问题。
为了实现上述目的，本公开提供了一种印制电路板结构，与风扇插箱的插箱壳体连接，包括用于对所述插箱壳体内的每个风扇进行控制的元器件，所述印制电路板结构还包括：
至少两个平行设置的印制电路板单板，所述元器件设置于所述印制电路板单板上，且至少部分所述元器件位于相邻两个所述印制电路板单板之间的空间内。
其中，上述印制电路板结构，还包括：用于连接相邻的第一印制电路板单板和第二印制电路板单板的连接器件。
其中，所述连接器件包括：
设置于第一印制电路板单板的相对两侧的两个连接插座；
设置于第二印制电路板单板上、对应于两个所述连接插座的位置处的连接插头，且所述连接插头与所述连接插座一一对应连接。
其中，所述连接插座与所述第一印制电路板单板焊接，所述连接插头与所述第二印制电路板单板焊接。
其中，所述连接器件为插针连接器。
其中，所述第一印制电路板单板靠近所述第二印制电路板单板的第一表面设置有部分的所述元器件，且所述第二印制电路板单板靠近所述第一印制电路板单板的第二表面也设置有部分的所述元器件。
其中，设置于所述第一印制电路板单板的第一表面的元器件与设置于所述第二印制电路板单板的第二表面的元器件在所述第一印制电路板单板和所述第二印制电路板单板之间的空间内错列分布。
其中，所述第一印制电路板单板的两个表面和所述第二印制电路板单板的两个表面均为元器件布置面。
其中，所述第一印制电路板单板的面积大于所述第二印制电路板单板的面积，且所述第一印制电路板单板上设置有与背板连接的背板连接插座。
本公开的实施例还提供了一种风扇插箱，包括插箱壳体及设置于所述插箱壳体内的多个风扇，还包括如上所述的印制电路板结构，所述印制电路板结构与所述插箱壳体连接，且所述印制电路板结构包括对所述插箱壳体内的每个风扇进行控制的元器件。
本公开实施例具有以下有益效果：
本公开实施例的上述方案，印制电路板结构包括至少两个平行设置的印制电路板单板，所述元器件设置于所述印制电路板单板上，且至少部分元器件位于相邻两个所述印制电路板单板之间的空间内。本公开实施例的印制电路板结构包括至少两个平行设置的印制电路板单板，控制风扇的元器件可设置于其中任一单板上及相邻两个印制电路板单板之间的空间内，大大增加了印制电路板单板上的元器件数量，进而可以对风扇插箱中的风扇进行一一控制，满足精确散热的需求。
附图说明
图1为本公开实施例的印制电路板结构的第一结构示意图；
图2为本公开实施例的印制电路板结构的第二结构示意图；
图3为本公开实施例的风扇插箱的结构示意图。
附图标记说明：
1-第一印制电路板单板，2-第二印制电路板单板，3-连接器件，31-连接插座，32-连接插头，4-元器件，5-背板连接插座，6-插箱壳体，7-风扇。
具体实施方式
为使本公开要解决的技术问题、技术方案和优点更加清楚，下面将结合具体实施例及附图进行详细描述。
本公开的实施例提供了一种印制电路板结构及风扇插箱，解决了相关技术风扇插箱中的风扇控制单板受到整个空间限制，难以在风扇控制单板上放置较多的PCB器件，进而导致不能对风扇插箱中的风扇进行一一控制的问题。
本公开实施例的印制电路板结构，如图1、图2及图3所示，与风扇插箱的插箱壳体6连接，包括用于对所述插箱壳体6内的每个风扇7进行控制的元器件4，所述印制电路板结构还包括：
至少两个平行设置的印制电路板单板，所述元器件4设置于所述印制电路板单板上，且至少部分所述元器件4位于相邻两个所述印制电路板单板之间的空间内。
这里，上述印制电路板结构可设置于插箱壳体6的底部，每个印制电路板单板的正面和反面均为元器件布置面，且相邻两个印制电路板单板之间存在用于容纳元器件的空间，可将元器件设置于任一印制电路板的正面和反面，大大增加了印制电路板单板表面的元器件布置空间。
本公开实施例的印制电路板结构，印制电路板结构包括至少两个平行设置的印制电路板单板，所述元器件设置于所述印制电路板单板上，且至少部分元器件位于相邻两个所述印制电路板单板之间的空间内。本公开实施例的印制电路板结构包括至少两个平行设置的印制电路板单板，控制风扇的元器件可设置于其中任一单板上及相邻两个印制电路板单板之间的空间内，大大增加了印制电路板单板上的元器件数量，进而可以对风扇插箱中的风扇进行一一控制，满足精确散热的需求。
进一步地，如图1所示，上述印制电路板结构，还包括：用于连接相邻的第一印制电路板单板1和第二印制电路板单板2的连接器件3。
在本公开的具体实施例中，假定上述印制电路板结构包括两个平行设置的印制电路板单板，两个印制电路板单板分别为第一印制电路板单板1和第二印制电路板单板2。第一印制电路板单板1和第二印制电路板单板2通过连接器件3连接。该连接器件3包括：设置于第一印制电路板单板1的相对两侧的两个连接插座31；设置于第二印制电路板单板2上、对应于两个所述连接插座31的位置处的连接插头32，且所述连接插头32与所述连接插座31一一对应连接。所述连接插座31与所述第一印制电路板单板1焊接，所述连接插头32与所述第二印制电路板单板2焊接。该连接器件3中的连接插座31和连接插头32为可拆卸连接，可大大增加整个系统的可维修性，在出现故障后可以方便地进行拆卸维修。
另外，该连接器件3可为插针连接器，在第二印制电路板单板2两侧分别距离边缘预设距离，如10mm位置处，放置两个插针连接器插座(母头插头)，在第一印制电路板单板1的一侧距边缘预定距离，如15mm位置处，放置一个插针连接头，另外一侧根据第 二印制电路板单板2的大小以及插针连接器插座的尺寸决定放置插针连接头的位置，最终，将第一印制电路板单板1和第二印制电路板单板2叠放在一起，通过插针连接器插座与插针插头的连接，实现第一印制电路板单板1和第二印制电路板单板2的连接。另外，该插针连接器可以保证足够大的电流通过，满足通流要求，且两个连接器处于对称位置，能够提高整个单板可靠性。
另外，上述连接器可以选择的范围不仅仅是选择插针连接器也可以选择其他类型的连接器形式。在印制电路板元器件布置空间增大的基础上，还可以将风扇小型化，增加风扇数量，实现一对一精确控制，进一步提升整个区域内的散热需求。
进一步地，上述第一印制电路板单板1的两个表面和上述第二印制电路板单板2的两个表面均为元器件布置面，元器件可设置于上述第一印制电路板单板1和第二印制电路板单板2的任一元器件布置面上，大大增加了元器件的布置空间。
如图1所示，所述第一印制电路板单板1靠近所述第二印制电路板单板2的第一表面设置有部分的元器件4，且所述第二印制电路板单板2靠近所述第一印制电路板单板1的第二表面也设置有部分的元器件4。优选地，设置于所述第一印制电路板单板1的第一表面的元器件4与设置于所述第二印制电路板单板2的第二表面的元器件4在所述第一印制电路板单板1和所述第二印制电路板单板2之间的空间内错列分布。
这里，两个印制电路板之间的元器件采用错列分布的方式，可以消除使用叠层方式造成的高度过高的情况，充分利用了第一印制电路板单板的纵向空间，更有利于风扇整体的布局，且两个印制电路板之间根据最高元器件的高度选择适当的连接器进行连接，可保证最高元器件的放置空间。
另外，如图1所示，本公开实施例中的第一印制电路板单板1的面积大于第二印制电路板单板2的面积(第一印制电路板单板1的长度大于第二印制电路板单板2的长度)，且所述第一印制电路板单板1上设置有与背板连接的背板连接插座5。
在本公开的具体实施例中，第一印制电路板单板1实现单板电信号控制处理等主要功能，第二印制电路板单板2可放置电源等器件，并将转换后的电源信号接入第一印制电路板单板1。
示例性的，第二印制电路板单板2采用双面贴片的方式，背面(靠近第一印制电路板单板的表面)放置较高器件，正面(远离第一印制电路板单板的表面)可以放置正常高度器件，设置于背面的元器件的高度可以根据第一印制电路板单板的背板连接插座的高度和两个印制电路板单板之间连接器的高度共同决定。第二印制电路板单板2两侧分别距边缘10mm处放置两个插针连接器插座(母头插头)，可以保证足够大的电流通过，满足通流要求，且两个插针连接器插座处于对称位置，可有效提高整个单板的可靠性。
第一印制电路板单板1可实现单板电信号处理，对各个风扇进行控制，示例性的，可以实现对每个风扇的调速控制。第一印制电路板单板1采用双面贴片形式，正面(靠近第二印制电路板单板2的表面)可以放置较高器件，背面放置小于2mm的器件，避免与插 箱壳体接触以发生短路现象，在第一印制电路板单板1一侧距边缘15mm处放置一个插针连接头，另外一侧根据第二印制电路板单板2的大小以及插针连接器插座的尺寸决定放置插针连接头的位置。
上述两个印制电路板单板之间的最高器件需要进行避让设计，第一印制电路板单板1和第二印制电路板单板2中的最高器件错列放置，可以充分利用两块印制电路板单板之间的空间，能够降低整体的高度，防止超过第一印制电路板单板1上的背板连接插座的高度，其中，第一印制电路板单板1通过背板连接插座与背板连接，以实现第一印制电路板单板1通过背板与其他单板的通讯，且背板连接插座为第一印制电路板单板1上的最高器件。
最后是将两块印制电路板单板叠放在一起，两块印制电路板单板(第一印制电路板单板1和第二印制电路板单板2)使用插针连接器连接，在第二印制电路板单板2上面焊接有插座(母头部分)，第一印制电路板单板1上面焊接有插针部分，两个部分可以随意进行分开，大大增加了整个系统的可维修性，在出现故障后可以进行拆卸维修，且该插针连接器的高度可以根据两个印制电路板单板上面的最高器件来进行选择。
本公开实施例的印制电路板结构，通过增加面板纵向的使用空间的方式，实现增加单板器件的功能，与相关技术相比，在不改变单板长度的情况下，达到了增加单板电路器件的目的，进而实现对各个风扇进行单独控制的目的，满足精确散热的要求，另外使用可拆卸的连接器件方便后期进行技术维修。
本公开的实施例还提供了一种风扇插箱，如图3所示，包括插箱壳体6及设置于所述插箱壳体内的多个风扇7，还包括如上所述的印制电路板结构，所述印制电路板结构与所述插箱壳体6连接，且所述印制电路板结构包括对所述插箱壳体6内的每个风扇7进行控制的元器件4。
需要说明的是，上述方法实施例中所有实现方式均适用于该风扇插箱的实施例中，也能达到相同的技术效果。
本公开实施例的印制电路板结构及风扇插箱，包括至少两个平行设置的印制电路板单板，所述元器件设置于所述印制电路板单板上，且至少部分元器件位于相邻两个所述印制电路板单板之间的空间内。本公开实施例的印制电路板结构包括至少两个平行设置的印制电路板单板，控制风扇的元器件可设置于其中任一单板上及相邻两个印制电路板单板之间的空间内，大大增加了印制电路板单板上的元器件数量，进而可以对风扇插箱中的风扇进行一一控制，满足精确散热的需求。
以上所述仅为本公开的较佳实施例而已，并不用以限制本公开，凡在本公开的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本公开的保护范围之内。
工业实用性
本公开实施例的印制电路板结构及风扇插箱，包括至少两个平行设置的印制电路板单板，控制风扇的元器件可设置于其中任一单板上及相邻两个印制电路板单板之间的空间 内，大大增加了印制电路板单板上的元器件数量，进而可以对风扇插箱中的风扇进行一一控制，满足精确散热的需求。

Claims (10)

  1. 一种印制电路板结构，与风扇插箱的插箱壳体连接，包括用于对所述插箱壳体内的每个风扇进行控制的元器件，其中，所述印制电路板结构还包括：
    至少两个平行设置的印制电路板单板，所述元器件设置于所述印制电路板单板上，且至少部分所述元器件位于相邻两个所述印制电路板单板之间的空间内。
  2. 根据权利要求1所述的印制电路板结构，其中，还包括：用于连接相邻的第一印制电路板单板和第二印制电路板单板的连接器件。
  3. 根据权利要求2所述的印制电路板结构，其中，所述连接器件包括：
    设置于所述第一印制电路板单板的相对两侧的两个连接插座；
    设置于所述第二印制电路板单板上、对应于两个所述连接插座的位置处的连接插头，且所述连接插头与所述连接插座一一对应连接。
  4. 根据权利要求3所述的印制电路板结构，其中，所述连接插座与所述第一印制电路板单板焊接，所述连接插头与所述第二印制电路板单板焊接。
  5. 根据权利要求2所述的印制电路板结构，其中，所述连接器件为插针连接器。
  6. 根据权利要求2所述的印制电路板结构，其中，所述第一印制电路板单板靠近所述第二印制电路板单板的第一表面设置有部分的所述元器件，且所述第二印制电路板单板靠近所述第一印制电路板单板的第二表面也设置有部分的所述元器件。
  7. 根据权利要求6所述的印制电路板结构，其中，设置于所述第一印制电路板单板的第一表面的元器件与设置于所述第二印制电路板单板的第二表面的元器件在所述第一印制电路板单板和所述第二印制电路板单板之间的空间内错列分布。
  8. 根据权利要求2所述的印制电路板结构，其中，所述第一印制电路板单板的两个表面和所述第二印制电路板单板的两个表面均为元器件布置面。
  9. 根据权利要求2所述的印制电路板结构，其中，所述第一印制电路板单板的面积大于所述第二印制电路板单板的面积，且所述第一印制电路板单板上设置有与背板连接的背板连接插座。
  10. 一种风扇插箱，包括插箱壳体及设置于所述插箱壳体内的多个风扇，其中，还包括如权利要求1-9任一项所述的印制电路板结构，所述印制电路板结构与所述插箱壳体连接，且所述印制电路板结构包括对所述插箱壳体内的每个风扇进行控制的元器件。
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