WO2013129880A1 - Low-temperature dryable conductive paste and method for manufacturing smd micro-fuse using same - Google Patents

Abstract

The present invention relates to a low-temperature dryable conductive paste and a method for manufacturing a surface-mount devices (SMD) micro-fuse using the same, wherein: a low-temperature dryable conductive paste which can withstand temperatures between 100℃ to 300℃ is manufactured by changing drying conditions of an Ag conductive paste (a flake type Ag powder resin + a polyester binder resin + a solvent (2-(2-ethoxyethoxy) ethyl icetate) fuse-element (3), on a fuse substrate (1) formed for the purpose of electrical contact of a simple structure; environmental problems due to conventional uses of lead and asbestos in a coating manner using a printing method on a metal mask can be solved; equipment costs can be minimized by using the conductor paste fuse-element (3) rather than a wire in a manner differentiated from wire bonding used in a semiconductor fabrication process; electrical characteristics can be standardized by adjusting the size of the fuse-element (3), thereby improving productivity and facilitating mass production.

Description

Low-temperature dry paste and method for producing SMD-fuse using same

The present invention relates to a low temperature, dry conductive paste and a method for producing a surface-mount devices (SMD) micro-fuse using the same.

More specifically, silver (Ag) conductive paste (flakes of silver (Ag) powder resin + polyester binder resin + solvent (2- (2-ethoxyethoxy) in a fuse substrate formed for the purpose of simple electrical contact. Low-temperature, dry-type conductive paste soluble body that withstands ethyl acetate (Fuse-Element) under 100 ℃ ~ 300 ℃ by changing drying conditions. The present invention relates to a conductive paste and a method for manufacturing a micro-fuse using a surface-mount devices (SMD) using the same.

In general, the conductive paste is a composite material composed of a conductive metal powder, a binder polymer resin, a solvent and other additives.

In recent years, the conductive paste has consistently manufactured chip components, which are portable circuits, and components to wirings on one board according to the densification of electronic products. It is used in radios, cameras, etc.

However, the fuse-element inside the Surface-Mount Devices (SMD) micro-fuse has a severe environmental problem caused by excessive lead in the process of connecting with external circuits, so the EU restricts the use of certain dangerous substances. It requires the RoHS Restriction of Hazardous Substances and the REACH-Registration, Evaluation, Authorization & Restriction of Chemicals, and nowadays uses wire bonding methods applied in semiconductor manufacturing processes.

However, due to the limited size of fuse-elements, there are limitations in the automated system for standardization and manufacturing, which requires material technology that meets the needs of the Surface-Mount Devices (SMD) micro-fuse market. In the trend, eco-friendly eco-materials are needed to protect and preserve the environment.

The present invention is to solve the above problems.

Specifically, the present invention provides a low-temperature and dry conductive paste capable of automating production and mass production while maintaining the electrical characteristics of a surface-mounted device (SMD) micro-fuse, and manufacturing a surface-mounted device (SMD) micro-fuse using the same. The purpose is.

In addition, in order to prevent damages such as heat and pressure that may be affected by the low-temperature and dry-type conductive paste from the outside, slimming and simplified low-temperature and drying type by applying a thermosetting epoxy resin ink (Ink) having good heat resistance and electrical insulation. An object of the present invention is to manufacture a conductive paste and a surface-mount devices (SMD) micro-fuse using the same.

In addition, manufacturing a SMD (Surface-Mount Devices) micro-fuse using a printing method on a metal mask using a low-temperature, dry-type conductive paste soluble material different from the conventional wire bonding method. The purpose is.

In addition, an object of the present invention is to manufacture a SMD (Surface-Mount Devices) micro-fuse having various electrical characteristics by controlling the size of the low-temperature and dry type conductive paste soluble material (Fuse-Element).

In order to achieve the above object, the method for producing a low temperature and dry conductive paste soluble material (Fuse-Element) of the present invention, after mixing a conductive metal + binder resin and a solvent and firstly dried in a NIR dryer, and then again in a reflow dryer It is characterized by drying.

In addition, an object of the present invention is to apply a conductive paste soluble substance (Fuse-Element) to the fuse substrate using a metal mask, and then apply a thermosetting epoxy resin (Ink) to dry and then cut using a cutter Surface Mount Devices (SMD) is achieved by a method for producing a micro-fuse.

The present invention is a low-temperature, dry-type conductive paste for SMD (Surface-Mount Devices) micro-fuse that is different from the tin film etching and wire bonding methods used in the conventional semiconductor manufacturing process. By using it, the expensive equipment is unnecessary, so the investment cost is low, and the increase rate of material cost according to the size of the product can be relatively lowered.

In addition, it is possible to manufacture the product of desired standard to increase the value of quality. Also, it uses low-temperature, dry-type conductive paste soluble material for SMD-Surface-Mount Devices (SMD) using eco-friendly materials. It can contribute to the expansion of European exports by satisfying the Restriction of Hazardous Substances (RoHS) and the REACH-Registration, Evaluation, Authorization & Restriction of Chemicals.

Lastly, manufacturing method is not difficult, so it is possible to manufacture SMD (Surface-Mount Devices) micro-fuse having desired electrical characteristics by controlling the effect of productivity and workability improvement and controlling the size of low-temperature and dry conductive paste soluble material (Fuse-Element). can do.

1 is a plan view of a SMD (Surface-Mount Devices) micro-fuse using a low temperature, dry conductive paste prepared in an optimal drying condition according to an embodiment of the present invention.

FIG. 2 is a flow chart illustrating a manufacturing method of Surface-Mount Devices (SMD) micro-fuse using a low temperature and dry conductive paste according to one embodiment of the present invention.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

The following examples are specific examples of the present invention, but are not limited thereto even though there are certain and limiting expressions.

In the process of description, the size and shape of the components shown in the drawings may be exaggerated for convenience. In addition, terms of the components may also vary according to the intention of the inventor.

In order to achieve the above object, the present invention, a fuse substrate formed for the purpose of simple electrical contact, commercially available silver (Ag) conductive paste, thermosetting epoxy ink having good heat resistance and electrical insulation to prevent damage from the outside ( Complete with Ink).

In order to use a conductive paste using silver (Ag) metal powder as SMD (Surface-Mount Devices) ultra-fuse-element, the temperature change, that is, the drying conditions may be changed to withstand the temperature below 100 ° C to 300 ° C. Low temperature, dry conductive paste is prepared.

Standardized SMD (Furniture-Mount Devices) micro-fuse is manufactured by varying the electrical characteristics using low-temperature, dry-type conductive paste prepared by optimization of drying conditions.

The present invention provides the following low-temperature and dry conductive paste and a method of manufacturing SMD (Surface Mount Devices) micro-fuse using the same.

The low temperature and dry conductive paste soluble element optimized for fuse boards designed for simple electrical contact is printed using a metal mask to prevent damage from heat and pressure that may be affected from the outside. In order to prevent the heat-resistant epoxy resin ink (Ink) with good heat resistance and electrical insulation to dry and then manufacture a SMD (Surface-Mount Devices) micro-fuse using a cutter.

FIG. 2 is a flowchart illustrating a manufacturing method of Surface-Mount Devices (SMD) micro-fuse using a low temperature and dry conductive paste according to an embodiment of the present invention.

As described above, the conductive paste soluble material (Fuse-Element) material is prepared and printed using a metal mask, the soluble material (Fuse-Element) is cured, and then again applied by thermosetting epoxy resin ink (Ink) The process of curing the ink and cutting it.

Planetary Centrifugal Mixer is used to uniformly mix three components, namely conductive metal powder, binder polymer resin, and solvent, which are suitable for low temperature and dry conductive paste for SMD-Surface-Mount Devices (SMD). .

In a state in which a large amount of the conductive material (Bulk), the conductivity is almost no difference between Al, Ag, Au, Cu, Ni, etc., but the oxidation of the surface, cost, processing state, etc. in the process of manufacturing the metal powder is limited.

Therefore, low-temperature and dry-type conductive pastes are manufactured using silver (Ag) metal powder having high electrical conductivity, high thermal conductivity, low contact resistance, poor oxidation, and good dimensional stability, and use SMD (Surface-Mount Devices) Micro-Fuses are prepared.

That is, the mixed raw materials are printed on the patterned substrate using a mixer, and firstly dried in a NIR dryer, and then dried in a reflow dryer. Drying temperature 100 ℃ ~ 200 ℃ in the first drying, drying temperature 200 ℃ ~ 300 ℃ in the second drying. The drying time is preferably 30 minutes to 2 hours for primary drying and 5 to 30 minutes for secondary drying. That is, primary drying is performed for a long time at low temperature, and secondary drying is performed for a short time at high temperature.

<Example>

Referring to the drawings or diagrams shown in the present invention in detail.

Table 1 is a table showing the drying conditions of the conductive paste according to a preferred embodiment of the present invention in order to prepare the drying conditions of the conductive paste in an optimal state, drying by setting the dryer, drying temperature, drying time suitable for the conductive paste and then conductive paste The dry state (degree of spread and color) of the is shown in a table.

Example 1

Example 1 of Table 1 was dried for 1 hour and a half at a drying temperature of 150 ℃ in a NIR dryer, and then dried for 8 minutes at a drying temperature of 270 ℃ in a reflow dryer to prepare a conductive paste.

Comparative example 1, 2, 3, 4

Referring to Comparative Examples 1 to 4 of Table 1 in detail.

Comparative Example 1 was dried in a dryer convection oven, drying temperature 150 ℃, drying time 30 minutes. Comparative Example 2 is a convection oven, drying temperature 150 ℃, drying time 1hr, Comparative Example 3 is a convection oven, drying temperature 200 ℃, drying time 30 minutes, Comparative Example 4 dryer Reflow, drying temperature 270 ℃, drying time 8 Drying in minutes was poor.

Table 1

	Example-1	Comparative Example-1	Comparative Example-2	Comparative Example-3	Comparative Example-4
dryer	NIR → Reflow	Convection Oven	Convection Oven	Convection Oven	Reflow
Drying temperature	150 ℃ → 200 ℃	150 ℃	150 ℃	200 ℃	200 ℃
Drying time	1.5hr → 8min	30min	1hr	30min	8min
aridity	Good	Not dry	Not dry	Not dry	Dried bubble
compatibility	Good	Bad	Bad	Bad	Bad

Table 2 is a table showing the electrical characteristics according to the rated current of Example 1.

TABLE 2

Rated Current (A)	Rated voltage (V)	Resistance (R)	Rate current test	Opening Time Test	Surface temperature (℃)
4	63 V	14 ~ 16mΩ	fitness	fitness	fitness
5	63 V	12 ~ 14mΩ	fitness	fitness	fitness
6	63 V	10 ~ 12mΩ	fitness	fitness	fitness
8	63 V	5 ~ 7mΩ	fitness	fitness	fitness
10	63 V	5 ~ 6mΩ	fitness	fitness	fitness

1 is a plan view of a SMD (Surface-Mount Devices) micro-fuse using a low-temperature, dry conductive paste prepared under optimal drying conditions, 100 ℃ ~ 300 ℃ to the fuse substrate (1) designed for electrical contact Low temperature, dry conductive paste (flake-like silver (Ag) powder resin + polyester binder resin + solvent (2- (2-ethoxyethoxy) ethyl acetate)) which can withstand the following In order to protect heat, pressure, etc., which may be affected by the outside after applying it with a mask, ink (Ink) is a thermosetting resin which is generally a heat-resistant resin that has good heat resistance and electrical insulation and can be formed into a pressure resistant product by filling with a filler. Use a case (4) that can be used to prevent damage.

<Description of the Drawings>

1: fuse board

2: terminal pad

3: soluble

* 4: Case

The present invention uses a tin film etching method and a wire bonding method, which are used in a conventional semiconductor manufacturing process, as a low-temperature, dry-type conductive paste for surface-mount devices (SMDs) and micro-fuses. By using it, the expensive equipment is unnecessary, so the investment cost is low, and the increase rate of material cost according to the size of the product can be relatively lowered.

In addition, it is possible to manufacture the product of desired standard to increase the value of quality. Also, it uses low-temperature, dry-type conductive paste soluble material for SMD-Surface-Mount Devices (SMD) using eco-friendly materials. It can contribute to the expansion of European exports by satisfying the Restriction of Hazardous Substances (RoHS) and the REACH-Registration, Evaluation, Authorization & Restriction of Chemicals.

Claims (11)

1. A method for producing a low temperature and dry conductive paste soluble material (Fuse-Element) characterized in that the conductive metal, binder resin and a solvent are mixed and then dried at a low temperature.
2. The production method according to claim 1, wherein the drying temperature of primary drying is 100 ° C to 300 ° C.
3. The method of claim 1, wherein the secondary drying temperature is 200 ℃ to 300 ℃.
4. The method of claim 1, wherein the drying time of the primary drying is 30 minutes to 2 hours.
5. The method according to claim 1, wherein the drying time of the secondary drying is 5 to 30 minutes.
6. The method of claim 1, wherein the conductive metal is flake-shaped silver (Ag).
7. SMD (Surface Mount Devices) micro-fuse characterized by applying a conductive paste soluble substance (Fuse-Element) to the fuse substrate using a metal mask, applying a thermosetting epoxy resin ink, drying and cutting using a cutter Manufacturing method.
8. Surface Mount Devices (SMD) micro-fuse having a rated voltage range AC / DC 32V to 250V manufactured by the manufacturing method of claim 7.
9. 9. The Surface Mount Devices (SMD) micro-fuse according to claim 8, wherein the rated current ranges from 1 A to 15 A.
10. The Surface Mount Devices (SMD) micro-fuse of claim 8, wherein the surface temperature satisfies 95 ° C. or less.
11. The Surface Mount Devices (SMD) micro-fuse according to claim 8, wherein the specification range includes 0402 size to 6251 size.

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