WO2013104343A1 - A water-cooling radiator - Google Patents

A water-cooling radiator Download PDF

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Publication number
WO2013104343A1
WO2013104343A1 PCT/CN2013/071805 CN2013071805W WO2013104343A1 WO 2013104343 A1 WO2013104343 A1 WO 2013104343A1 CN 2013071805 W CN2013071805 W CN 2013071805W WO 2013104343 A1 WO2013104343 A1 WO 2013104343A1
Authority
WO
WIPO (PCT)
Prior art keywords
water
cooling
cooling radiator
radiator
cooled
Prior art date
Application number
PCT/CN2013/071805
Other languages
French (fr)
Chinese (zh)
Inventor
周哲明
Original Assignee
Zhou Zheming
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhou Zheming filed Critical Zhou Zheming
Publication of WO2013104343A1 publication Critical patent/WO2013104343A1/en

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763Liquid cooling without phase change
    • H05K7/20781Liquid cooling without phase change within cabinets for removing heat from server blades
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20Indexing scheme relating to G06F1/20
    • G06F2200/201Cooling arrangements using cooling fluid

Definitions

  • the present invention relates to an electronic device, and more particularly to a heat dissipation generated by a computer device such as a server, a network device, or a PC.
  • a computer device such as a server, a network device, or a PC.
  • the water-cooling heat dissipation system used in current computer equipment includes a water storage chamber, a water pump, a water-cooling head, a heat-dissipating water tank, a water pipe, and the like, and is used by installing a water-cooling head on each of the main heat-generating components in the chassis, and using a water pipe.
  • the components are connected.
  • the disadvantage of this method is that the components are dispersed, inconvenient to install and not suitable for waterproofing.
  • the utility model provides a water-cooled radiator, the components of which are fixed in a protective casing, and Internally filled with absorbent sponge for waterproofing.
  • the advantage of this solution is that the water-cooled radiator is easy to install and has a certain waterproof function.
  • a water-cooled radiator in which a water-cooled plate, a water storage chamber, a water pump, a water pipe, a radiator, a water absorbing sponge, a fan, and a temperature-controlled speed regulator are installed in a protective casing.
  • the gap between the components is filled with a water-absorbent sponge, which can timely absorb the cooling water leaked from the water-cooled radiator.
  • the temperature controlled speed regulator is used to adjust the speed of the fan and water pump.
  • the utility model has the beneficial effects that the water-cooled heat sink is convenient to install and has a certain waterproof function.
  • FIG. 1 is a structural view of a water-cooled heat sink according to the present invention.
  • an embodiment of the present invention is a water-cooled heat sink.
  • a water-cooled radiator comprising (2) a radiator tank, (3) a water-cooled plate, (4) a fan, (5) a water storage chamber, (6) a water pump and ( 7) Water pipes, all components are installed in the (8) protective casing.
  • Water-cooled heat sink (8) The inside of the protective casing is adhered with (9) water-absorbent sponge, and (9) water-absorbent sponge is also filled in the gap between (3) water-cooled plate and (4) fan.
  • the water-cooled radiator is equipped with (10) a temperature-controlled speed regulator, (6) a water pump and (4) a fan (11) circuit connected to the (10) temperature-controlled speed regulator.

Abstract

A water-cooling radiator for electronic devices, in particular a water-cooling radiator for dissipating heat produced by computer devices, such as servers, network devices, and PCs. Disposed inside of a protective shell are a water-cooling board, a water storage chamber, a water pump, water pipes, a radiating water tank, water-absorbing sponges, fans, and a temperature-controlling rotation-speed adjuster. Spaces between different components are filled with water-absorbing sponges, and said sponges can absorb the cooling water leaked out of the water-cooling radiator in a timely manner. The temperature-controlling rotation-speed adjuster is used for adjusting the rotation speeds of the fans and the water pump. The water-cooling radiator is easy to install and is waterproof to a certain degree.

Description

说 明 书  Description
-种水冷散热器 技术领域 -Water cooling radiator
[0001] 本实用新型涉及电子设备, 特别是涉及服务器、 网络设备、 PC 等电脑设备产生的热 量的排散。  [0001] The present invention relates to an electronic device, and more particularly to a heat dissipation generated by a computer device such as a server, a network device, or a PC.
背景技术 Background technique
[0002] 目前的电脑设备中使用的水冷散热系统包括储水室、 水泵、 水冷头、 散热水箱、 水 管等部件, 其使用方式是在机箱内的各个主要发热部件上安装水冷头, 用水管将各部件连接 起来。 该方式的缺点是各部件分散, 不方便安装和不利于采取防水措施。  [0002] The water-cooling heat dissipation system used in current computer equipment includes a water storage chamber, a water pump, a water-cooling head, a heat-dissipating water tank, a water pipe, and the like, and is used by installing a water-cooling head on each of the main heat-generating components in the chassis, and using a water pipe. The components are connected. The disadvantage of this method is that the components are dispersed, inconvenient to install and not suitable for waterproofing.
实用新型内容 Utility model content
[0003] 为解决现有技术中的水冷散热系统各部件分散, 不方便安装和不利于采取防水措施 的问题, 本实用新型提供一种水冷散热器, 其部件固定在一个防护外壳内, 并在内部填充吸 水海绵防水。 该方案的优点是该水冷散热器安装方便和具有一定的防水功能。  [0003] In order to solve the problem that the components of the water-cooling heat dissipation system in the prior art are dispersed, inconvenient to install, and unfavorable to take waterproof measures, the utility model provides a water-cooled radiator, the components of which are fixed in a protective casing, and Internally filled with absorbent sponge for waterproofing. The advantage of this solution is that the water-cooled radiator is easy to install and has a certain waterproof function.
[0004] 本实用新型解决其技术问题所采用的技术方案是: [0004] The technical solution adopted by the utility model to solve the technical problem thereof is:
一种水冷散热器, 在一个防护外壳内安装有水冷板、 储水室、 水泵、 水管、 散热水箱、 吸水 海绵、 风扇和温控转速调节器。 在各部件的空隙中填充有吸水海绵, 它可以及时吸收水冷散 热器泄漏出来的冷却水。 温控转速调节器用来调节风扇和水泵的转速。 A water-cooled radiator in which a water-cooled plate, a water storage chamber, a water pump, a water pipe, a radiator, a water absorbing sponge, a fan, and a temperature-controlled speed regulator are installed in a protective casing. The gap between the components is filled with a water-absorbent sponge, which can timely absorb the cooling water leaked from the water-cooled radiator. The temperature controlled speed regulator is used to adjust the speed of the fan and water pump.
[0005] 本实用新型的有益效果是, 该水冷散热器安装方便和具有一定的防水功能。  [0005] The utility model has the beneficial effects that the water-cooled heat sink is convenient to install and has a certain waterproof function.
附图说明 DRAWINGS
[0006] 图 1是根据本实用新型的水冷散热器的结构意图。  1 is a structural view of a water-cooled heat sink according to the present invention.
[0007] 图中, 1.水冷散热器, 2.散热水箱, 3.水冷板, 4.风扇, 5.储水室, 6.水泵, 7.水管, 8. 防护外壳, 9.吸水海绵, 10.温控转速调节器, 11.电路。  [0007] In the figure, 1. water-cooled radiator, 2. cooling water tank, 3. water-cooled board, 4. fan, 5. water storage room, 6. water pump, 7. water pipe, 8. protective casing, 9. water-absorbing sponge, 10. Temperature controlled speed regulator, 11. Circuit.
具体实施方式 detailed description
[0008] 下面结合附图和实施例对本实用新型进一步说明。  The present invention will be further described below in conjunction with the accompanying drawings and embodiments.
[0009] 在图 1中, 本实用新型的实施例是一种水冷散热器。 In FIG. 1, an embodiment of the present invention is a water-cooled heat sink.
[0010] 如图 1 所示: 一种 (1 ) 水冷散热器, 包含有 (2 ) 散热水箱、 (3 ) 水冷板、 (4 ) 风 扇、 (5 ) 储水室、 (6 ) 水泵和 (7 ) 水管, 各部件都安装在 (8 ) 防护外壳内。 (1 ) 水冷散热 器的 (8 ) 防护外壳的内侧粘贴有 (9) 吸水海绵, 在 (3 ) 水冷板和 (4 ) 风扇的空隙中也填 充有 (9) 吸水海绵。 (1 ) 水冷散热器带有 (10) 温控转速调节器, (6 ) 水泵和 (4) 风扇的 ( 11 ) 电路连接到 (10) 温控转速调节器上。  [0010] As shown in Figure 1: A (1) water-cooled radiator, comprising (2) a radiator tank, (3) a water-cooled plate, (4) a fan, (5) a water storage chamber, (6) a water pump and ( 7) Water pipes, all components are installed in the (8) protective casing. (1) Water-cooled heat sink (8) The inside of the protective casing is adhered with (9) water-absorbent sponge, and (9) water-absorbent sponge is also filled in the gap between (3) water-cooled plate and (4) fan. (1) The water-cooled radiator is equipped with (10) a temperature-controlled speed regulator, (6) a water pump and (4) a fan (11) circuit connected to the (10) temperature-controlled speed regulator.

Claims

权 利 要 求 书 Claim
1.一种水冷散热器, 其特征是: 包含有水冷板、 水泵、 水管、 散热水箱、 风扇、 吸水海绵和 防护外壳, 各部件固定在所述防护外壳内, 在各部件的空隙中填充有吸水海绵。  A water-cooled heat sink comprising: a water-cooled plate, a water pump, a water pipe, a heat-dissipating water tank, a fan, a water-absorbing sponge, and a protective casing, wherein each component is fixed in the protective casing, and a space is filled in each component Water absorbent sponge.
PCT/CN2013/071805 2012-01-11 2013-02-22 A water-cooling radiator WO2013104343A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN 201220010758 CN202502452U (en) 2012-01-11 2012-01-11 Water-cooling heat radiator
CN201220010758.X 2012-01-11

Publications (1)

Publication Number Publication Date
WO2013104343A1 true WO2013104343A1 (en) 2013-07-18

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Family Applications (1)

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CN (1) CN202502452U (en)
WO (1) WO2013104343A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10386091B2 (en) 2016-01-29 2019-08-20 Robert S. Carter Water evaporative cooled refrigerant condensing radiator upgrade

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202502452U (en) * 2012-01-11 2012-10-24 周哲明 Water-cooling heat radiator
CN105553839A (en) * 2015-12-16 2016-05-04 四川迅吉科技有限责任公司 Smart home gateway device
CN105584197A (en) * 2016-03-08 2016-05-18 苏州瑞日纺织科技有限公司 Circular screen printer heat dissipation device with through hole structure
CN105584198A (en) * 2016-03-08 2016-05-18 苏州瑞日纺织科技有限公司 Heat dissipating structure of circular screen printer
CN105690983A (en) * 2016-03-08 2016-06-22 苏州瑞日纺织科技有限公司 Rotary screen printing machine with efficient heat dissipation structure
TWM574708U (en) * 2017-09-29 2019-02-21 雙鴻科技股份有限公司 Electronic device with water cooling function and water cooling module and water cooling row
CN108563307A (en) * 2018-03-29 2018-09-21 重庆佳圣商贸有限公司 Heat dissipation equipment for safeguarding computer
CN111706550B (en) * 2020-06-10 2021-11-19 江西昊仁电力设备有限公司 Installation assembly for reducing operation vibration of cross-flow cooling fan

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050013113A1 (en) * 2003-07-14 2005-01-20 Jen-Cheng Lin Cartridge assembly of a water cooled radiator
CN1655091A (en) * 2004-02-10 2005-08-17 孙福玉 Totally enclosed water-cooling computer cabinet
CN2849815Y (en) * 2005-07-25 2006-12-20 陈玟翰 Integrated shaped water cooled computer casing
CN102073361A (en) * 2010-12-30 2011-05-25 胡露露 Notebook computer radiating device
CN202502452U (en) * 2012-01-11 2012-10-24 周哲明 Water-cooling heat radiator

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050013113A1 (en) * 2003-07-14 2005-01-20 Jen-Cheng Lin Cartridge assembly of a water cooled radiator
CN1655091A (en) * 2004-02-10 2005-08-17 孙福玉 Totally enclosed water-cooling computer cabinet
CN2849815Y (en) * 2005-07-25 2006-12-20 陈玟翰 Integrated shaped water cooled computer casing
CN102073361A (en) * 2010-12-30 2011-05-25 胡露露 Notebook computer radiating device
CN202502452U (en) * 2012-01-11 2012-10-24 周哲明 Water-cooling heat radiator

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10386091B2 (en) 2016-01-29 2019-08-20 Robert S. Carter Water evaporative cooled refrigerant condensing radiator upgrade

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