TWI489933B - Heat-dissipation device and electronic apparatus - Google Patents

Description

Heat sink and electronic device

The present invention relates to a heat sink and an electronic device, and more particularly to a heat sink having a rotatable heat sink and an electronic device using the heat sink.

The server is a core computer that serves each computer in the network system, and provides functions such as a disk and a print service required by the network user, and also allows each client to share resources in the network environment with each other.

As technology advances, the amount of data processed by the server and the computational speed continue to increase, causing the heating power of the electronic components inside the server to rise. In order to prevent the electronic components from overheating, causing temporary or permanent failure of the electronic components, the server must have sufficient heat dissipation performance. In general, the heat sink that is common in servers is a heat sink. First, the heat sink is attached to a heat source of the circuit board, and is, for example, a central processing unit (CPU) or a graphic processing unit (GPU). Then, the heat sink absorbs the heat of the heat source through heat conduction, and then the heat absorbed by the heat sink is quickly taken away by the cooling airflow. However, when the direction of the cooling airflow deviates from the direction of the heat sink, the heat dissipation effect of the heat sink cannot exert a better heat dissipation effect.

The invention provides a heat dissipating device, the radiator of which can be rotated to have Better heat dissipation efficiency.

The present invention provides an electronic device in which a heat sink can be rotated to have better heat dissipation efficiency.

The invention provides a heat dissipating device suitable for an electronic device. The electronic device includes a circuit board having a heat source. The heat dissipating device comprises a first heat sink, a second heat sink, a wearing member, at least one air inlet, an air outlet and the air inlet and the air outlet. The first heat sink is fixed to the heat source, and the heat source is located in the air flow passage. The second heat sink has a plurality of fins arranged in parallel and disposed on the first heat sink and in contact with the first heat sink. The heat generated by the heat source can be transmitted to the heat sink fins of the second heat sink through the first heat sink. The penetrating member is disposed between the first heat sink and the second heat sink, wherein the second heat sink is pivoted through the through member and is rotatable relative to the first heat sink. When the second heat sink is rotated to a working position, the direction of the heat sink fins coincides with the air flow direction of the air flow passage.

In an embodiment of the invention, the piercing member has a fastening state or a desolidation state. The relative position of the first heat sink and the second heat sink is locked when the wearing member is in the tightened state. The second heat sink is rotatable relative to the first heat sink when the wear member is in a desolidated state.

In an embodiment of the invention, the piercing member has a disassembled state. The second heat sink can be unloaded from the electronic device when the wearing member is in the disassembled state.

In an embodiment of the invention, the heat dissipation device further includes a flexible heat conduction layer disposed between the first heat sink and the second heat sink and filling a gap between the first heat sink and the second heat sink, wherein the heat dissipation The thermal conductive layer can be thermally conductive Cream, thermal grease or cooling pad.

The invention also provides an electronic device comprising a circuit board having a heat source and a heat sink. The heat dissipating device comprises a first heat sink, a second heat sink, a penetrating member, at least one air inlet, an air outlet and an air flow passage between the air inlet and the air outlet. The first heat sink is fixed to the heat source, and the heat source is located in the air flow passage. The second heat sink has a plurality of fins arranged in parallel, and the second heat sink is disposed on and in contact with the first heat sink. The heat generated by the heat source can be transmitted to the heat sink fins of the second heat sink through the first heat sink. The penetrating member is disposed between the first heat sink and the second heat sink, wherein the second heat sink is pivoted through the through member and is rotatable relative to the first heat sink. When the second heat sink is rotated to a working position, the direction of the heat sink fins coincides with the air flow direction of the air flow passage.

In an embodiment of the invention, the piercing member has a fastening state or a desolidation state. The relative position of the first heat sink and the second heat sink is locked when the wearing member is in the tightened state. The second heat sink is rotatable relative to the first heat sink when the wear member is in a desolidated state.

In an embodiment of the invention, the piercing member has a disassembled state. The second heat sink can be unloaded from the electronic device when the wearing member is in the disassembled state.

In an embodiment of the present invention, the heat dissipating device further includes a flexible heat conducting layer disposed between the first heat sink and the second heat sink and filling a gap between the first heat sink and the second heat sink. The flexible thermal conductive layer is a thermal conductive paste, a thermal grease or a thermal pad. .

Based on the above, the second heat sink of the present invention can be relatively opposed by the wearing member Rotating on the first radiator. Therefore, the heat sink can be applied to different airflow directions, so that the heat sink has better heat dissipation efficiency. Thereby, the electronic device applying the heat sink can have better heat dissipation efficiency and can be applied to electronic devices of different models to reduce the production cost of the electronic device.

The above described features and advantages of the present invention will be more apparent from the following description.

1 is a schematic diagram of an electronic device according to an embodiment of the present invention. 2 is a schematic view of the second heat sink of FIG. 1 as it rotates. 3 is a perspective view of the heat sink of FIG. 2. Referring to FIG. 1 , FIG. 2 and FIG. 3 , in the embodiment, the electronic device 1 is, for example, a server, and includes a circuit board 10 having a heat source 12 and a heat sink 100 . It should be noted that, in order to simplify the view, FIG. 1, FIG. 2 and FIG. 3 omits the electronic device of the electronic device 1 and its internal components.

In addition, the circuit board 10 of the embodiment may be a motherboard assembled in the server, and the heat source 12 is, for example, a central processing unit (CPU) or a graphics processing unit (GPU) on the motherboard. After the heat sink 100 is mounted on the heat source 12, the heat sink 100 first thermally adsorbs the heat source 12, and the cooling airflow f quickly brings the heat absorbed by the heat sink 100 to the outside. It should be noted that, in order to make the view clear, the heat sink 100 of FIG. 3 omits some components.

In the above, the heat sink 100 includes a first heat sink 110, a second heat sink 120, a piercing member 130, at least one air inlet 142, an air outlet 144, and an air flow between the air inlet 142 and the air outlet 144. aisle 146. The first heat sink 110 is fixed to the heat source 12, and the heat source 12 is located in the air flow passage 146. The second heat sink 120 has a plurality of fins 122 arranged in parallel, and a plurality of channels 122a are located between the fins 122. The second heat sink 120 is disposed on the first heat sink 110 and is in contact with the first heat sink 110. The heat generated by the heat source 12 can be transmitted to the heat dissipation fins 122 of the second heat sink 120 through the first heat sink 110. The through hole 130 is disposed between the first heat sink 110 and the second heat sink 120, wherein the second heat sink 120 can be pivoted through the through hole 130, so that the second heat sink 120 can be opposite to the first heat sink 110 turns.

Specifically, the air inlet 142, the air outlet 144, and the air flow passage 146 of the present embodiment may be configured by a range in which the air guiding cover 20 is mounted on the circuit board 10. However, the present invention is not limited thereto. Accordingly, the air inlet 142 can guide the cooling airflow f to enter the airflow passage 146 in a flow direction d1 and flow to the air outlet 144, wherein the cooling airflow f can be generated by a fan (not shown) or outside air. When the second heat sink 110 is rotated to a working position, the extending direction d2 of the heat radiating fins 122 coincides with the flow direction d1 of the cooling airflow f located in the air flow passage 146.

Further, the wearing member 130 of the embodiment is, for example, a screw or a pin, and the through member 130 is embedded in the second heat sink 120 and fixed on the first heat sink 110. Therefore, the piercing member 130 has a fastening state or a debonding state. When the penetrating member 130 is in the tightened state, the relative positions of the first heat sink 110 and the second heat sink 120 are locked (as shown in FIG. 1). Conversely, when the penetrating member 130 is in the desolidated state, the second heat sink 120 is rotatable relative to the first heat sink 110 (as shown in FIG. 2). change In other words, the second heat sink 120 can be rotated with the central axis of the piercing member 130 as a rotation axis.

When the heat of the heat source 12 is conducted by the first heat sink 110 and the second heat sink 120 and transmitted to the heat sink fins 122, since the second heat sink 120 is rotatable relative to the first heat sink 110, the heat dissipation can be adjusted. The angle d2 between the extending direction d2 of the fins 122 and the flow direction d1 of the cooling airflow f is such that the extending direction d2 of the heat radiating fins 122 can be parallel to the flow direction d1 of the cooling airflow f. In other words, these passages 122a may be parallel to the flow direction d1 of the cooling airflow f. Thereby, the thermal energy on the second heat sink 120 is quickly taken away to improve the heat dissipation efficiency of the heat source 12. Therefore, the heat sink 100 has a better heat dissipation effect. In addition, since the second heat sink 120 can be rotated by the piercing member 130, it can be applied to electronic devices of different models. With this configuration, the heat sink 100 can have the advantage of sharing parts, thereby reducing the production cost of the electronic device 1 to which the heat sink 100 is applied.

In addition, the orthographic projection of the first heat sink 110 and the second heat sink 120 of the present embodiment on the circuit board 10 covers the heat source 12 . Therefore, the heat source 12 of the circuit board 10 can have a large heat conduction area, which helps to accelerate the heat dissipation speed of the heat source 12.

In addition, the through member 130 can also be removed from the first heat sink 110 and the second heat sink 120. In detail, the penetrating member 130 can have a disassembled state. When the penetrating member 130 is in the disassembled state, the second heat sink 120 may be separated from the first heat sink 110 and unloaded from the electronic device 1. Therefore, after the piercing member 130 is detached from the second heat sink 120, and the second heat sink is 120 is separated from the first heat sink 110. This makes it easy for maintenance personnel to test or replace.

Referring to FIG. 3, the heat sink 100 further includes a flexible heat conductive layer 150, such as a thermal paste, a thermal grease or a heat sink. The flexible heat conductive layer 150 is disposed between the first heat sink 110 and the second heat sink 120 and fills a gap between the first heat sink 110 and the second heat sink 120. After the first heat sink 110 adsorbs heat of the heat source 12, the flexible heat conductive layer 150 can quickly transfer heat to the second heat sink 120. Thereby, the heat dissipation effect of the heat sink 100 can also be improved.

In summary, the second heat sink of the present invention can be rotated relative to the first heat sink by the piercing member. Thereby, the extending direction of the heat dissipating fins of the second heat sink can be made to coincide with the flow direction of the cooling airflow, so that the heat dissipating device has a better heat dissipating effect. In addition, the heat sink can be applied to electronic devices of different models, which can make the heat sink have the advantage of sharing parts, thereby reducing the production cost of the electronic device. In addition, the heat dissipating device may further comprise a flexible heat conducting layer, which also contributes to improving heat dissipation efficiency and heat dissipation efficiency.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

1‧‧‧Electronic device

10‧‧‧ boards

12‧‧‧heat source

20‧‧‧wind hood

100‧‧‧heating device

110‧‧‧First radiator

120‧‧‧second radiator

122‧‧‧Heat fins

122a‧‧‧ channel

130‧‧‧ wearing parts

142‧‧‧ air inlet

144‧‧‧air outlet

146‧‧‧Air passage

150‧‧‧Flexible thermal layer

D1‧‧‧flow direction

D2‧‧‧ extending direction

f‧‧‧Cooling airflow

1 is a schematic diagram of an electronic device according to an embodiment of the present invention.

2 is a schematic view of the first heat sink of FIG. 1 when rotated.

3 is a perspective view of the heat sink of FIG. 2.

1‧‧‧Electronic device

10‧‧‧ boards

20‧‧‧wind hood

100‧‧‧heating device

120‧‧‧second radiator

122‧‧‧Heat fins

122a‧‧‧ channel

130‧‧‧ wearing parts

144‧‧‧air inlet

144‧‧‧air outlet

146‧‧‧Air passage

D1‧‧‧flow direction

D2‧‧‧ extending direction

f‧‧‧Cooling airflow

Claims (10)

A heat dissipating device is applicable to an electronic device, the electronic device comprising a circuit board having a heat source, and the heat dissipating device comprises: a first heat sink fixed to the heat source; and a second heat sink having a plurality of parallel heats a heat sink fin is disposed on the first heat sink and is in contact with the first heat sink, and heat generated by the heat source is transmitted to the heat sink fins of the second heat sink through the first heat sink; a penetrating member is disposed between the first heat sink and the second heat sink, wherein the second heat sink is pivoted via the wearing member and rotatable relative to the first heat sink; and at least one a tuyere, an air outlet, and an air flow passage between the air inlet and the air outlet, wherein the heat source is located in the air flow channel, wherein the direction of the heat dissipation fins is when the second heat sink is rotated to a working position The airflow direction of the airflow passage is uniform. The heat dissipating device of claim 1, wherein the wearing member has a fastening state or a desolidation state, and when the wearing member is in the fastening state, the first heat sink and the second The relative position of the heat sink is locked; and when the wearing member is in the desolidated state, the second heat sink is rotatable relative to the first heat sink. The heat dissipating device of claim 2, wherein the wearing member has a disassembled state, and the second heat sink can be unloaded from the electronic device when the wearing member is in the disassembled state. The heat dissipating device of claim 1, further comprising a flexible heat conducting layer disposed between the first heat sink and the second heat sink and filled between the first heat sink and the second heat sink The gap. The heat dissipation device of claim 4, wherein the flexible heat conductive layer is a thermal conductive paste, a thermal grease or a heat dissipation pad. An electronic device comprising a circuit board having a heat source; at least one air inlet, an air outlet, and an air flow passage between the air inlet and the air outlet, the heat source being located in the air flow passage; a first heat sink, Fixed to the heat source; a second heat sink having a plurality of heat dissipating fins arranged in parallel, and disposed on the first heat sink and in contact with the first heat sink, the heat generated by the heat source can pass through the first a heat sink is transmitted to the heat dissipating fins of the second heat sink; and a through hole is disposed between the first heat sink and the second heat sink, wherein the second heat sink passes the through hole And being pivoted and rotatable relative to the first heat sink, wherein when the second heat sink is rotated to a working position, the directions of the heat dissipating fins are consistent with the airflow direction of the air flow passage there. The electronic device of claim 6, wherein the wearing member has a fastening state or a desolidation state, and when the wearing member is in the fastening state, the first heat sink and the second The relative position of the heat sink is locked; and when the wearing member is in the desolidated state, the second heat sink is opposite Rotating at the first heat sink. The electronic device of claim 7, wherein the wearing member has a disassembled state, and the second heat sink can be unloaded from the electronic device when the wearing member is in the disassembled state. The electronic device of claim 6, further comprising a flexible heat conducting layer disposed between the first heat sink and the second heat sink and filled between the first heat sink and the second heat sink The gap. The electronic device of claim 9, wherein the flexible heat conductive layer is a thermal conductive paste, a thermal grease or a heat dissipation pad.