WO2013102296A1 - Étiquettes électroniques et procédés de fabrication associés - Google Patents

Étiquettes électroniques et procédés de fabrication associés Download PDF

Info

Publication number
WO2013102296A1
WO2013102296A1 PCT/CN2012/070016 CN2012070016W WO2013102296A1 WO 2013102296 A1 WO2013102296 A1 WO 2013102296A1 CN 2012070016 W CN2012070016 W CN 2012070016W WO 2013102296 A1 WO2013102296 A1 WO 2013102296A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
electronic tag
antenna
semiconductor chip
release surface
Prior art date
Application number
PCT/CN2012/070016
Other languages
English (en)
Inventor
Po Man LEUNG
Original Assignee
Itw Graphics Asia Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Itw Graphics Asia Limited filed Critical Itw Graphics Asia Limited
Priority to PCT/CN2012/070016 priority Critical patent/WO2013102296A1/fr
Publication of WO2013102296A1 publication Critical patent/WO2013102296A1/fr

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07758—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
    • G06K19/0776—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag the adhering arrangement being a layer of adhesive, so that the record carrier can function as a sticker
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls

Definitions

  • the application relates to electronic tags and methods for manufacturing the same.
  • An electronic tag known as a Radio-Frequency Identification (RFID) tag, has been widely used for identifying or tracing an object to which the electronic tag is to be attached.
  • RFID Radio-Frequency Identification
  • Figure la shows a known electronic tag 1, including an insulation substrate 2, an adhesive layer 4, a content layer 3, and a release paper 5.
  • the content layer 3 is located between the adhesive layer 4 and the release paper 5 and includes an antenna 31 and a semiconductor chip 32 electrically coupled to the antenna 31.
  • the semiconductor chip 32 is used to store the information for identifying or tracing an object, and the antenna 31 is used to transmit the information via RF signals.
  • the release paper 5 may be released from the adhesive layer 4 so that the insulation substrate 2 and the content layer 3 of the electronic tag 1 can be attached to the object through the adhesive layer 4.
  • Figure lb shows another known electronic tag 1 ', including a release paper 5', an adhesive layer 4', an insulation substrate 2', and a content layer 3'.
  • the adhesive layer 4' is located between the release paper 5' and the insulation substrate 2'.
  • the content layer 3' includes an antenna 31 ' and a semiconductor chip 32' electrically coupled to the antenna 3 .
  • the release paper 5' should be released from the adhesive layer 4' so that the insulation substrate 2' and the content layer 3' can be attached to the object through the adhesive layer 4'.
  • US Patent Application 2010/0018640 discloses a method for applying a marking onto a substrate surface by using a transfer method.
  • the chip and the antenna are formed on the cover film sheet, and a transfer layer is formed on the chip and the antenna.
  • US Patent 5,902,437 discloses a resonant tag label which is used in an electronic identification system.
  • the label includes a carrier film, a breakcoat, a plate, a dielectric coating, a conductor plate, and a spiral antenna pattern, and an adhesive layer.
  • an electronic tag includes a substrate having a release surface and at least one content layer.
  • the content layer includes a semiconductor chip storing information for identifying an object to which the tag is to be attached, and an antenna electrically coupled to the semiconductor chip for transmitting the information; and an adhesive layer.
  • the semiconductor chip and the antenna are directly and releasably formed on the release surface of the substrate.
  • the adhesive layer is directly formed on the semiconductor chip and the antenna.
  • an electronic tag includes a substrate having a release surface, and at least one content layer releasably attached to the release surface of the substrate.
  • the content layer includes a semiconductor chip storing information for identifying an object to which the tag is to be attached, and a conductor with a hot-melt adhesive agent. The conductor is electrically coupled to the semiconductor chip for transmitting the information.
  • a method for manufacturing an electronic tag includes providing a substrate having a release surface, forming an antenna directly on the release surface of the substrate, arranging a semiconductor chip directly on the release surface of the substrate, electrically coupling the semiconductor chip to the antenna, and applying a hot-melt adhesive agent directly on the antenna and the semiconductor chip to form an adhesive layer on the semiconductor chip and the antenna.
  • the semiconductor chip includes information for identifying an object to which the tag is to be attached, and the antenna is configured to transmit the information via RF signals.
  • a method for manufacturing an electronic tag includes providing a substrate having a release surface, forming a conductor with hot-melt adhesive agent on the release surface of the substrate, and arranging a semiconductor chip on the release surface of the substrate and electrically coupling the semiconductor chip to the conductor.
  • the semiconductor chip includes information for identifying an object to which the tag is to be attached, and the conductor is configured to transmit the information through RF signals.
  • Figure la is a diagrammatic cross-sectional, elevational view of a conventional electronic tag and Figure lb is a diagrammatic cross-sectional, elevational view of another conventional electronic tag;
  • Figure 2 is a plan view of an electronic tag according to at least one embodiment of the present application.
  • Figure 3 is a diagrammatic cross-sectional view taken along line A-A of an electronic tag as shown in Figure 2 according to at least one embodiment of the present application;
  • Figure 4 illustrates a process for applying the electronic tag as shown in Figure 3 to an object according to at least one embodiment of the present application
  • Figure 5 illustrates a plan view of an electronic tag according to at least one embodiment of the present application
  • Figure 6 is a diagrammatic cross-sectional view taken along line A-A of an electronic tag as shown in Figure 2 according to at least one embodiment of the present application;
  • Figure 7 is a flow chart illustrating the steps for manufacturing an electronic tag according to at least one embodiment of the present application.
  • Figure 8 is a diagrammatic cross-sectional view taken along line A-A of an electronic tag as shown in Figure 2 according to at least one embodiment of the present application;
  • Figure 9 illustrates a process for applying the electronic tag as shown in Figure 7 to an object according to at least one embodiment of the present application
  • Figure 10 is a flow chart illustrating the steps for manufacturing an electronic tag according to at least one embodiment of the present application.
  • Figure 11 illustrates a roll of the electronic tag according to at least one embodiment of the present application.
  • Figure 2 illustrates an electronic tag 100 according to at least one embodiment of the present application.
  • Figure 3 is a diagrammatic cross-sectional view taken along line A-A of an electronic tag as shown in figure 2 according to at least one embodiment.
  • the electronic tag 100 includes a substrate 20 having a release surface 201; a content layer 30 releasably attached to the release surface 201 of the substrate 20.
  • the content layer 30 includes an antenna 310, a semiconductor chip 320 electrically coupled to the antenna 310, and an adhesive layer 330 formed on the antenna 310 and the semiconductor chip 320.
  • the semiconductor chip 320 is used to store the information/content or data for identifying or tracing an object.
  • the antenna 310 is used to transmit the information through F signals.
  • one content layer 30 is shown in figure 2. It is understood that more than one content layer 30 (as shown in figure 11) can be releasably attached to the release surface 201 of the substrate 20.
  • the semiconductor chip 320 and the antenna 310 are directly and releasably formed on the release surface 201 of the substrate 20, and the adhesive layer 330 is directly formed on the semiconductor chip 320 and the antenna 310.
  • the structure of the electronic tag 100 is simple.
  • the substrate 20 may be removable from the tag 100 and only the content layer 30 is attached to the object over the adhesive layer 330.
  • the substrate 20 is a release paper having the release surface 201.
  • the content layer 30 attached to the release surface 201 can be easily removed from the release surface 201 of the release paper.
  • the release paper for example, is made of non-permeable smooth insulated material.
  • the adhesive layer 330 comprises a layer of hot-melt adhesive agent.
  • the adhesive layer 330 is a low-temperature hot-melt adhesive agent coated on the surface of the antenna 310 and the surface of the chip 320.
  • the adhesive layer 330 instead of coating on the whole surface of the substrate, is only coated on the surface of the antenna 310 and the chip 320, both the cost and the weight of the tag could be reduced.
  • the adhesive layer 330 has a thickness of 8 - 20 micrometers.
  • the layer 330 is not adhesive in a normal temperature, no release paper is required to cover the adhesive layer 330. The adhesiveness of the adhesive layer 330 will be recovered once it is heated.
  • the hot-melt adhesive agent is at least one selected from A (an acrylic resin), B (a polyurethane resin), C (polyester), and D (polyvinyl chloride).
  • A an acrylic resin
  • B a polyurethane resin
  • C polyyester
  • D polyvinyl chloride
  • the ratio range by weight of the materials is based on the object to be attached and identified. For example, if the object is a golf club coated with a polyurethane resin, the hot-melt adhesive agent includes an acrylic resin of 15-25% (w/w) and a polyurethane resin of 75-85% (w/w).
  • other adhesives can be used in the adhesive layer.
  • the electronic tag 100 when applying the electronic tag 100 to an object 50, the electronic tag 100 is heated by a heating device (not shown), such as a heat transfer printer, to a preset temperature so that the adhesive layer 330 is in a melt and adhesive state. Then, the electronic tag 100 is pressed on the object 50. The content layer 30 is transfer-printed to a surface of the object 50 through the adhesive layer 330. After that, the substrate 20 is released from the content layer 30. Since the release surface of the substrate 20 will not be adhered by materials attached thereto, the substrate 20 may be easily released from the content layer 30 after the layer 30 is attached to the object. In this way, the substrate 20 is removed from the tag 100 and only the content layer 30 is attached to the object to be identified through the adhesive layer 330.
  • a heating device not shown
  • a heat transfer printer such as a heat transfer printer
  • the antenna 310 of the content layer 30 is formed by printing conductive ink on the release surface 201 of the substrate 20.
  • the conductive ink substantively consists of A (pure silver ink), B (an auxiliary curing agent) and C (a diluent solvent).
  • the ratio range by weight of A, B and C is A of about 80-88% (corresponding to the conductivity of the conductive ink), B of about 2-5% (corresponding to the strength of the conductive ink), and C of about 10-15%) (corresponding to the viscosity of the conductive ink).
  • the ratio by weight of A, B and C is about 88%, 2% and 10%), respectively.
  • the antenna 310 is formed with any suitable shapes, such as a spirality, a rectangle, an L-shape, a circuit, a capsule, or the like.
  • the semiconductor chip 320 of the content layer 30 is electrically coupled to the antenna 310 of the content layer 30.
  • the semiconductor chip 320 is at least unitized to store the information/contents or data for identifying or tracing the object.
  • the stored information or data is transmitted by the antenna 310 through RF signals.
  • the content layer 30 is attached to the object 50 through the adhesive layer 330 coated on the antenna 310 and the semiconductor chip 320.
  • the information transmitted by the antenna 31 of the tag 100 is received by a reader (not shown), so that the reader can identify or trace the object attached with the content layer 30.
  • the electronic lag 100 is a passive electronic lag 100.
  • the reader When using, the reader will activate the chip 320 such that the data or information stored therein can be transmitted to the reader by the antenna 310.
  • the electronic lag 100 is an active electronic lag 100.
  • the content layer 30 further comprises a power source 350 connected to the chip 320.
  • the power source 350 may be a battery or a bank of batteries, or other photoelectric transducer.
  • the adhesive layer 330 is also coated on the power source 350.
  • the content layer 30 further includes a patterned frame 340 releasably attached to the release surface 201 of the substrate.
  • the patterned frame 340 is disposed adjacent to the antenna 310 and the semiconductor chip 320.
  • the patterned frame 340 is a bar code.
  • the patterned frame 340 includes numbers, characters or drawings.
  • the patterned frame 340 is a visible pattern or logo which may be readable with the naked eye, such as, characters like "ITW".
  • the patterned frame 340 is formed by printing non-conductive ink on release surface 201 of the substrate.
  • the adhesive layer 330 is also coated on the patterned frame 340.
  • the electronic tag 100 when applying the electronic tag 100 to an object 50, the electronic tag 100 is heated by a heating device (not shown) so that the adhesive layer 330 is in a melt and adhesive state. Then, the antenna 310, the semiconductor chip 320, the patterned frame 340, and the power source 350 of the content layer 30 are pressed on and transfer-printed to the object 50 through the adhesive layer 330. After that, the substrate 20 is removed from the content layer 30. In this way, the antenna 310, the chip 320, the patterned frame 340, and the power source 350 can be transfer-printed to the object simultaneously so that the processing is simplified and the cost is reduced.
  • Figure 6 illustrates an electronic tag 100' according to at least one embodiment of the present application.
  • the electronic tag 100' as shown in figure 6 is similar to the tag 100 shown in figure 3, except that the substrate 20' of the tag 100' is different from the substrate 20 of the tag 100.
  • the substrate 20' of the electronic tag 100' includes a flexible film 220; and a release layer 210 situated on the flexible film 220.
  • the release layer 210 has a release surface 201.
  • the content layer 30 is releasably attached to the release surface 201 of release layer 210 of the substrate 20'.
  • the release layer 210 is formed by applying release agent on the flexible film.
  • the flexible film has a small thickness and a light weight, such as a polymer film or a rubber film, in particular, polyethylene terephthalate (PET), a polyvinyl (PE) film, a polyvinylchlorid (PVC) film or a polypropylene film.
  • PET polyethylene terephthalate
  • PE polyvinyl
  • PVC polyvinylchlorid
  • Figure 7 is a flow chart illustrating the method 700 for manufacturing an electronic tag according to at least one embodiment of the present application.
  • the method 700 for manufacturing the electronic tag includes providing a substrate having a release surface in step 701; forming an antenna on the release surface of the substrate in step 702; arranging a semiconductor chip on the release surface of the substrate and electrically coupling the semiconductor chip to the antenna in step 703; and applying a hot-melt adhesive agent directly on the antenna and the semiconductor chip to form an adhesive layer on the semiconductor chip and the antenna in step 704.
  • the semiconductor chip comprises information for identifying or tracing an object to which the tag is to be attached, and the antenna is configured to transmit the information through RF signals.
  • step 702 may be performed by printing conductive ink on the release surface of the substrate to form the antenna.
  • FIG. 8 illustrates an electronic tag 100" according to at least one embodiment of the present application.
  • the electronic tag 100" includes a substrate 20 having a release surface 201; and at least one content layer 30' releasably attached to the release surface 201 of the substrate 20.
  • the content layer 30' includes a conductor 310 with a hot-melt adhesive agent and a semiconductor chip 320 electrically coupled to the conductor 310.
  • the semiconductor chip 320 is used to store the information or data for identifying or tracing an object.
  • the conductor 310 is used to transmit the information through RF signals.
  • the semiconductor chip 320 and the conductor 310 are directly and releasably formed on the release surface 201 of the substrate 20. Since the conductor 310 is provided with a hot-melt adhesive agent, no separate adhesive layer is required in this embodiment. Thus, the cost and the weight of the tag could be reduced.
  • the conductor 310 is an antenna formed by printing conductive ink mixed with the adhesive agent on the release surface of the substrate.
  • a certain amount of adhesive agent and thinning solvent are added into the conductive ink.
  • the adhesive agent added to the conductive ink has a high performance, such as a hot-melt adhesive.
  • the mixing ratio by weight is conductive ink about 38-42% (w/w), hot melt adhesive about 28-32%> (w/w), and thinning solvent about 26-34% (w/w).
  • the mixing ratio by weight is conductive ink about 40% (w/w), hot melt adhesive about 30%> (w/w), and thinning solvent about 30%> (w/w).
  • the hot-melt adhesive is at least one selected from A (an acrylic resin), B (a polyurethane resin), C (polyester), and D (polyvinyl chloride).
  • A an acrylic resin
  • B a polyurethane resin
  • C polyyester
  • D polyvinyl chloride
  • the ratio range by weight of the materials is based on the object to be attached and identified.
  • the hot-melt adhesive includes an acrylic resin of about 15-25% (w/w) and a polyurethane resin of about 75-85%) (w/w).
  • other adhesives can be used in the adhesive layer.
  • the conductive ink is selected with a high conductive property so that the conductive property of the electronic tag is not affected by the incorporation of the adhesive agent.
  • the conductive ink is at least one selected from A (pure silver ink), B (an auxiliary curing agent) and C (a diluent solvent).
  • the ratio range by weight of A, B and C is A of about 80-88% (corresponding to the conductivity of the conductive ink), B of about 2-5% (corresponding to the strength of the conductive ink), and C of about 10-15%) (corresponding to the viscosity of the conductive ink).
  • the ratio by weight of A, B and C is about 88%, 2% and 10%>, respectively.
  • the thinning solvent is at least one selected from Cyclohexanone and Tetrahydrofurfuryl alcohol.
  • the electronic tag when applying the electronic tag as shown in figure 8 to an object 50, the electronic tag is heated by a heating device (not shown), such as a heat transfer printer, so that the adhesive agent contained in the conductor 310 is in a melt and adhesive state. Then, the electronic tag is pressed on the object 50. The content layer 30' is transfer-printed to a surface of the object 50 through the conductor 310 containing the adhesive agent. After that, the substrate 20 is removed from the content layer 30'. According to this embodiment, since the adhesive agent is contained in the conductor 310, no separate adhesive layer is required to be coated on the content layer. Therefore the cost of the tag is reduced.
  • a heating device such as a heat transfer printer
  • FIG. 10 is a flow chart illustrating the method 1000 for manufacturing an electronic tag according to at least one embodiment of the present application.
  • the method 1000 for manufacturing the electronic tag includes providing a substrate having a release surface in step 1001; forming a conductor with adhesive agent on the release surface in step 1002; and arranging a semiconductor chip on the release surface of the substrate and electrically coupling the semiconductor chip to the antenna in step 1003.
  • the semiconductor chip comprises information for identifying or tracing an object to which the tag is to be attached, and the antenna is configured to transmit the information through RF signals.
  • step 1002 is performed by mixing the hot-melt adhesive agent and thinning solvent into conductive ink; and printing the mixed conductive ink with the hot-melt adhesive agent and the thinning solvent on the release surface of the substrate to form the antenna.
  • the substrate 20 or substrate 20' of the electronic tap has a shape of a strip.
  • a plurality of content layers 30 are arranged on the substrate 20 along a length direction (->) of the substrate.
  • the substrate 20 or 20' is wound as a roll.
  • the content layers 30 are disposed on the substrate 20 or 20' with an equal interval between each two adjacent content layers.
  • the electronic tap is attached to an object by using a heat transfer printer.
  • the roll of the electronic tap is mounted onto the transfer printer (not shown) so that a content layer faces an object.
  • the transfer printer is preheated to a preset temperature under which the hot-melt adhesive agent is in a melt state.
  • the content layer 30 is transfer-printed to the object through the adhesive agent in the melt state.
  • the content layer is released from the substrate 20 or 20'.
  • the substrate is rolled by the transfer printer so that a next content layer faces a next object. If required, the above steps can be repeated so that a plurality of content layers 30 arranged on the substrate 20 or 20 'can be attached to a plurality of objects, respectively.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

La présente invention concerne des étiquettes électroniques et des procédés de fabrication associés. L'étiquette électronique comporte un substrat pourvu d'une surface de détachement et d'au moins une couche de contenu. Ladite au moins une couche de contenu comprend une puce semi-conductrice conçue pour mémoriser des informations d'identification d'un objet auquel l'étiquette doit être fixée, une antenne couplée électriquement à la puce semi-conductrice et permettant de transmettre les informations, ainsi qu'une couche adhésive. La puce semi-conductrice et l'antenne sont formées directement et de manière détachable sur la surface de détachement du substrat. La couche adhésive est formée directement sur la puce semi-conductrice et l'antenne.
PCT/CN2012/070016 2012-01-04 2012-01-04 Étiquettes électroniques et procédés de fabrication associés WO2013102296A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2012/070016 WO2013102296A1 (fr) 2012-01-04 2012-01-04 Étiquettes électroniques et procédés de fabrication associés

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2012/070016 WO2013102296A1 (fr) 2012-01-04 2012-01-04 Étiquettes électroniques et procédés de fabrication associés

Publications (1)

Publication Number Publication Date
WO2013102296A1 true WO2013102296A1 (fr) 2013-07-11

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3026599A1 (fr) * 2014-11-28 2016-06-01 Gemalto Sa Procédé de fabrication de dispositifs électroniques avec information de personnalisation

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080180255A1 (en) * 2007-01-25 2008-07-31 Michael James Isabell RFID tag
US20080180217A1 (en) * 2007-01-25 2008-07-31 Avery Dennison Corporation RFID tag
CN101334856A (zh) * 2007-06-28 2008-12-31 兄弟工业株式会社 标记带、rfid标签、标记带卷和rfid电路元件盒子
JP2010079801A (ja) * 2008-09-29 2010-04-08 Brother Ind Ltd 無線タグラベル

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080180255A1 (en) * 2007-01-25 2008-07-31 Michael James Isabell RFID tag
US20080180217A1 (en) * 2007-01-25 2008-07-31 Avery Dennison Corporation RFID tag
CN101334856A (zh) * 2007-06-28 2008-12-31 兄弟工业株式会社 标记带、rfid标签、标记带卷和rfid电路元件盒子
JP2010079801A (ja) * 2008-09-29 2010-04-08 Brother Ind Ltd 無線タグラベル

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3026599A1 (fr) * 2014-11-28 2016-06-01 Gemalto Sa Procédé de fabrication de dispositifs électroniques avec information de personnalisation
WO2016083403A1 (fr) 2014-11-28 2016-06-02 Gemalto Sa Procede de fabrication de dispositifs electroniques avec information de personnalisation

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