WO2013099893A1

WO2013099893A1 - Etching method for glass substrate

Info

Publication number: WO2013099893A1
Application number: PCT/JP2012/083556
Authority: WO
Inventors: 彰久佐伯; 橋本　隆志; 道治江田
Original assignee: 日本電気硝子株式会社
Priority date: 2011-12-28
Filing date: 2012-12-26
Publication date: 2013-07-04
Also published as: TW201331140A; JP2013136487A; JP5790494B2

Abstract

At least a central part (Gc) of a glass substrate (G) in the transverse direction is mounted on a transport roller (R1) extending in a longitudinal direction. Both sides jut out in the transverse direction from the transport roller (R1), and in a state where these parts that jut out bend downward, the pair of end surfaces (Ga) and edge parts (Gb) are immersed in an etching fluid (L).

Description

Etching method of glass substrate

The present invention relates to a method for etching a glass substrate, and more particularly to a technique for efficiently etching the periphery of an end face of a glass substrate.

As is well known, thinning of FPD glass substrates has been promoted with the increasing demand for weight reduction of mobile terminals and the like that have been rapidly spreading in recent years. This kind of thin glass substrate has flexibility as its main characteristic, and it has been studied to use this characteristic for a curved display or the like in the near future.

By the way, when a thin glass substrate as described above is curved, if a microcrack is present at the end surface of the substrate or the edge connected to the end surface, a fatal adverse effect is exerted on the substrate. More specifically, as the curvature of the substrate increases (the curvature increases), the tensile stress acting on the portion of the curved substrate that becomes the convex surface gradually increases. At this time, if there are micro cracks on the end face or edge of the substrate, stress concentration is likely to occur at the tip of the micro crack, so that the crack progresses from the micro crack and causes damage or breakage of the substrate. It was.

It has been found that such micro cracks are mainly generated when a small area substrate is cut out from a large area substrate in the glass substrate manufacturing process. However, it has been difficult to effectively prevent the occurrence of microcracks when performing a laser cleaving method or the like that has been conventionally used for cutting glass substrates. Therefore, after cutting the substrate, it is usual to take measures against the above-mentioned problems by etching the end face and the edge of the substrate using the techniques disclosed in Patent Documents 1 and 2 below. It has become.

In Patent Document 1, an end face of a glass substrate supported by a plurality of transport rollers and an edge portion continuous with the end face are provided with a film of an etching solution formed by surface tension in a pair of grooves that are opened in a laterally opposed manner. A technique for performing etching by passing the film is disclosed.

Patent Document 2 discloses a technique for performing etching by immersing an end surface to be etched of a glass substrate and an edge portion connected to the end surface in an etchant contained in a container.

JP 2009-125643 A JP 2010-26133 A

According to the techniques disclosed in Patent Documents 1 and 2, the edge surface of the glass substrate and the edge of the edge connected to the edge surface are removed, or the bent contour shape of the minute crack is changed to a rounded contour shape. Can be deformed. For this reason, it becomes possible to suppress the occurrence of stress concentration at the tip of the notch of the microcrack.

However, in the technique disclosed in Patent Document 1, a glass substrate is placed in a posture along a horizontal plane on a transport roller, and a groove for forming a film of an etching solution is derived from the posture of such a glass substrate. Has a problem as shown below because it is open sideways.

That is, if the groove forming the etching solution film is opened sideways, it is difficult to prevent the leakage of the etching solution from the inside of the groove. May be induced by the flow of the etchant leaking from the groove and may flow out to a portion that is not an object of etching. When such a situation occurs, glass powder or the like may remain on the surface of the substrate as particles when drying the substrate in the subsequent process, which may contaminate the substrate, which is one of the factors that degrade the quality of the substrate. It was.

On the other hand, since the technique disclosed in Patent Document 2 is configured such that the glass substrate is held in a posture along the vertical plane and only the lower end and the edge thereof are immersed in the etching solution, particularly the production of the glass substrate. A big problem is introduced from the viewpoint of efficiency.

That is, according to the etching method disclosed in this document, the glass substrate can be etched only one by one even though there are a plurality of end faces and edges to be etched. For this reason, in order to etch a plurality of locations on the glass substrate, the operation becomes extremely troublesome and complicated, and the time required for the operation is unduly prolonged, and the production efficiency of the substrate is remarkably deteriorated. .

The present invention made in view of the above circumstances has as a technical problem to suppress the deterioration of the quality of the substrate and improve the production efficiency when etching the glass substrate.

In order to solve the above-mentioned problems, the present invention is a glass substrate etching method in which a pair of end faces parallel to the longitudinal direction of the glass substrate and the edges of the front and back surfaces connected to these end faces are immersed in an etching solution for etching. In the method, at least a central portion in the horizontal direction of the glass substrate is placed on a support member extending in the vertical direction, and the glass member protrudes from both sides in the horizontal direction. It is characterized in that the pair of end faces and edges in a state of bending downward are immersed in the etching solution. Here, “immersing in the etching solution” includes not only the case of being immersed in the etching solution but also the case of being wet without being immersed.

According to such a method, the glass substrate protrudes from the support member to both sides in the lateral direction and is bent downward, and a pair of parallel end surfaces and edge portions of the front and back surfaces connected to these end surfaces (hereinafter referred to as the end surfaces). The end face and the edge are collectively referred to as an end face). Under such a state, there is no possibility that the etching solution flows out from the end surface portion of the glass substrate toward the central portion (portion not to be etched). Thereby, when drying a board | substrate, the situation where the glass powder etc. which were produced at the time of the cutting | disconnection of a substrate remain | survive as a particle in the center part of a board | substrate and a board | substrate is contaminated can be avoided appropriately. Accordingly, it is possible to suppress the deterioration of the substrate quality. In addition, since the pair of end surface portions protruding from the support member in the lateral direction can be simultaneously etched, the production efficiency of the substrate can be improved.

In the above method, it is preferable that the supporting member supports only the central portion in the lateral direction of the glass substrate from below. In this case, the support member may support only the central portion in the horizontal direction of the glass substrate and may be the only support member extending in the vertical direction, or a plurality of the support members arranged in a row apart from each other in the vertical direction. It may be a set of support members.

In this case, since the contact surface of the glass substrate with the support member is only one place in the horizontal direction, the substrate is hardly damaged.

In the above method, the support member is preferably a transport means for transporting the glass substrate in the vertical direction.

In this way, it becomes possible to continuously etch the end face portions of a plurality of glass substrates, and the production efficiency of the substrates can be further increased.

In the above method, it is preferable that an end surface support having a support surface for supporting the end surface of the glass substrate is provided, and the end surface portion of the glass substrate is immersed in an etching solution in a state where the end surface of the glass substrate is supported on the support surface.

In this way, the pair of end surfaces parallel to the vertical direction of the glass substrate are supported by the end surface support body, thereby making it possible to regulate the lateral movement of the end surface portion of the substrate and dropping the substrate from the transport path. It is possible to carry it stably without causing it.

In the above method, the end surface portion of the glass substrate may be immersed in the etching solution by dropping the etching solution on the support surface of the end surface support.

In this way, an etching solution film can be formed on the support surface of the end surface support, and the end surface portion can be etched by passing the film through the end surface portion of the substrate and immersing the film in the etching solution. It becomes possible.

In the above method, the end surface support and the edge of the glass substrate may be immersed in the etching solution by forming the end surface support with a porous material and immersing a part thereof in the etching solution.

In this case, the end surface support is formed of a porous material and a part of the end surface support is immersed in the etching solution, so that the etchant impregnated in the end surface support is supported by the end face support by capillary action. Start from the surface. Thereby, the end surface portion of the glass substrate is immersed and etching can be performed.

In the above method, the end surface support may be an end surface support roller partly immersed in an etching solution.

If it does in this way, the support surface which supports the end surface of the board | substrate in an end surface support roller is a peripheral surface (support surface) of a roller with rotation of a roller because a part of roller is immersed in etching liquid. In this case, the etching solution is always attached. Thereby, the roller can etch the end surface portion of the substrate by the etching solution attached to the support surface while transporting the substrate along the transport path. Also, since the peripheral speed of the support surface of the roller and the speed of conveying the end face of the substrate in the vertical direction can be made the same, it becomes possible to prevent sliding between the two as much as possible. The problem of scratches on the end face is less likely to occur.

In the above method, a plurality of auxiliary support rollers for supporting the glass substrate are provided between the conveying means and the end surface of the glass substrate, and the arrangement positions of the plurality of auxiliary support rollers are shifted to the end surface side. Accordingly, the diameter may be reduced.

In this way, particularly when a thin glass substrate is transported, it is possible to suppress the substrate from being excessively bent and to increase the curvature of the substrate at the central portion of the substrate placed on the transport means. It is possible to prevent the occurrence of large tensile stress. Moreover, the fear which arises by providing an auxiliary | assistant support roller is eliminated exactly as follows. That is, most of the load due to the substrate is applied to the transport means that supports the center of the substrate, and the load applied to the auxiliary support roller is smaller than that of the transport means. On the surface, the risk of scratches and the like can be reduced as much as possible.

In the above method, a pressing member for pressing the glass substrate downward may be provided between the conveying means and the end surface of the glass substrate.

In this way, even when etching is performed on a glass substrate that has a large thickness and is not easily bent, the above-described effects can be achieved by providing the pressing member. In particular, when the relation between the thickness of the substrate and the lateral length of the substrate is (the lateral length of the substrate / the thickness of the substrate) <2000, the flexibility of the substrate is difficult to be exerted. Is preferred.

In the above method, the etching solution is preferably contained in a pair of bowl-shaped containers extending in the vertical direction.

In this way, it becomes unnecessary to use an unnecessarily large amount of etching solution, so that the production cost can be reduced.

In the above method, the etching solution is preferably supplied from one end of the bowl-shaped container and discharged from the other end of the bowl-shaped container.

In this way, it becomes possible to etch the end face of the substrate with a fresh etchant at all times, and the time required for the etching can be shortened, so that the production efficiency of the substrate can be further improved.

In the above method, it is preferable that the etching solution is mainly composed of hydrofluoric acid or ammonium hydrofluoride.

In this way, the time required for etching can be suitably reduced. For this reason, it is possible to further improve the production efficiency of the substrate.

As described above, according to the present invention, when etching is performed on a glass substrate, it is possible to suppress degradation of the quality of the substrate and improve production efficiency.

It is a top view which shows the etching apparatus used for the etching method of the glass substrate which concerns on 1st embodiment of this invention. It is sectional drawing which shows the etching apparatus used for the etching method of the glass substrate which concerns on 1st embodiment of this invention. It is a side view which shows the etching method of the glass substrate which concerns on 1st embodiment of this invention. It is sectional drawing which shows the etching method of the glass substrate which concerns on 2nd embodiment of this invention. It is sectional drawing which shows the etching method of the glass substrate which concerns on 3rd embodiment of this invention. It is sectional drawing which shows the etching method of the glass substrate which concerns on 4th embodiment of this invention. It is sectional drawing which shows the etching method of the glass substrate which concerns on 5th embodiment of this invention. It is a perspective view which shows the etching apparatus used for the etching method of the glass substrate which concerns on 6th embodiment of this invention.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a plan view showing an etching apparatus used in the glass substrate etching method according to the first embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along line AA of FIG.

As shown in each of these drawings, the etching apparatus 1 includes a plurality of transport rollers R1 which are transport means for transporting a glass substrate G (hereinafter simply referred to as a substrate G) in the vertical direction, and an etching solution for etching the substrate G. It is comprised with a pair of bowl-shaped container T which accommodates L, and several end surface support roller R2 which is an end surface support body which supports the end surface Ga of the board | substrate G. As shown in FIG.

The plurality of transport rollers R1 are provided in a straight line along the central portion Gc of the substrate G, support the central portion Gc in the lateral direction (width direction) of the substrate G, and rotate by the operation of a driving mechanism (not shown). Thus, it is possible to continuously transport the plurality of substrates G in the V direction (vertical direction). Further, the contact surface of the transport roller R1 with the substrate G is formed in a curved surface.

The pair of bowl-shaped containers T are provided to be spaced apart from the plurality of transport rollers R1 in parallel in the lateral direction and open upward. Moreover, the height position is located below compared with the conveyance roller R1. Further, in the bowl-shaped container T, an etching solution L containing ammonium hydrofluoride as a main component flows in the V direction.

The end surface support roller R2 rotates in the bowl-shaped container T via a shaft attached to the side wall of the bowl-shaped container T, and a part thereof is immersed in the etching solution L accommodated in the bowl-shaped container T. ing. Further, a conical support surface R2a that supports the end face Ga of the substrate G is formed. The support surface R2a gradually increases in diameter from the inner side to the outer side of the end surface support roller R2.

Next, a glass substrate etching method using the etching apparatus 1 will be described with reference to FIG. 3, which is a view of the etching apparatus 1 viewed from the direction B shown in FIG. In this glass substrate etching method, the portion indicated by cross-hatching in FIGS. 1 to 3, that is, the end surface Ga of the substrate G and the edge portion Gb of the front and back surfaces connected to the end surface Ga are continuously etched. In FIG. 3, the conveyance roller R1 is not shown. A plurality of substrates G are continuously conveyed in the V direction.

When the substrate G is transported in the V direction by the transport roller R1, the end surface support roller R2 that supports the end surface Ga of the substrate G is shown in FIG. 3 due to friction between the end surface Ga and the support surface R2a. Rotate in the W direction (idle). For this reason, the support surface R2a is configured such that a part of the end surface support roller R2 is immersed in the etching liquid L, and the intrusion into the etching liquid L and escape from the etching liquid L with the rotation of the end surface support roller R2. repeat. Thereby, the end surface support roller R2 etches the end surface Ga of the substrate G and the edge portion Gb connected to the end surface Ga by the etching liquid L attached to the support surface R2a while transporting the substrate G in the V direction.

According to such a method, only the central portion Gc and the end surface Ga in the lateral direction of the substrate G are supported by the transport roller R1 and the end surface support roller R2. For this reason, it is possible to reduce as much as possible the possibility of scratches or the like occurring in the portion of the substrate G that protrudes laterally from the transport roller R1, and effectively suppresses the degradation of the quality of the substrate G. Etching can be performed in the obtained state.

Further, since the portion protruding laterally from the transport roller R1 is bent downward due to gravity, it is not an object of etching the substrate G from the end face Ga of the substrate G or the edge portion Gb connected to the end face Ga. There is no risk of the etchant L flowing out toward the part. As a result, when the substrate G is dried, it is possible to appropriately avoid a situation in which glass powder or the like generated when the substrate G is cut remains as particles on the substrate G and the substrate G is contaminated. Furthermore, since the relative speed between the peripheral speed of the support surface R2a of the end surface support roller R2 and the transport speed of the end surface Ga of the substrate G becomes substantially zero, it becomes possible to prevent sliding between the two as much as possible. The problem that scratches or the like occur on the end face Ga of the substrate G is less likely to occur. Therefore, it is possible to further suppress the quality deterioration of the substrate G.

In addition, since the pair of end faces Ga and edge Gb in the substrate G can be etched simultaneously, the production efficiency of the substrate G can be improved. Further, since the end surface Ga of the substrate G is supported by the end surface support roller R2, the lateral movement of the substrate G can be restricted, so that the substrate G can be transported stably. Further, since the etching solution L is contained in the bowl-shaped container T, it is not necessary to use an unnecessarily large amount of the etching solution L, so that the production cost can be reduced.

FIG. 4 is a cross-sectional view showing an etching apparatus 1 used in the glass substrate etching method according to the second embodiment of the present invention. In FIG. 4, the same components as those in the etching apparatus 1 used in the glass substrate etching method according to the first embodiment are denoted by the same reference numerals, and redundant description is omitted. The same applies to third to sixth embodiments described later.

The difference between the etching apparatus 1 used for the glass substrate etching method according to the second embodiment and the etching apparatus 1 used for the glass substrate etching method according to the first embodiment described above is that the end face support The etching jig S is used instead of the end support roller R2, and the etching liquid supply source (not shown) for dropping the etching liquid L on the support surface Sa of the etching jig S is provided. It is.

According to the glass substrate etching method using this etching apparatus 1, a film of the etchant L can be formed on the support surface Sa of the etching jig S, and the film is formed on the end surface Ga and the edge Gb of the substrate G. Can be etched, and the end face Ga and the edge Gb can be etched.

FIG. 5 is a cross-sectional view showing an etching apparatus 1 used in the glass substrate etching method according to the third embodiment of the present invention.

The difference between the etching apparatus 1 used for the glass substrate etching method according to the third embodiment and the etching apparatus 1 used for the glass substrate etching method according to the first embodiment described above is the end face support. As described above, the plate-like body H is used instead of the end face support roller R2. This plate-like body H is formed of a porous material.

According to the etching method of the glass substrate using this etching apparatus 1, since the plate-like body H is formed of a porous material, the etching solution L impregnated in the plate-like body H is removed by a capillary phenomenon. Ascend in the body H. The rising etching solution L oozes from the support surface Ha of the plate-like body H, so that the end face Ga and the edge Gb of the substrate G are immersed and etching can be performed.

Here, in the glass substrate etching method according to the first to third embodiments, the thickness of the substrate G to be etched is preferably 0.7 mm or less, more preferably 0.5 mm or less. And most preferably 0.3 mm or less. The length of the substrate G in the lateral direction is preferably 1500 mm or more.

FIG. 6 is a cross-sectional view showing an etching apparatus 1 used in the glass substrate etching method according to the fourth embodiment of the present invention.

The difference between the etching apparatus 1 used for the glass substrate etching method according to the fourth embodiment and the etching apparatus 1 used for the glass substrate etching method according to the first embodiment described above is the end face support roller. The point that R2 is not provided and the point that a plurality of auxiliary support rollers R3 that support the substrate G are provided between the transport roller R1 and the end face Ga of the substrate G. The auxiliary support roller R3 has a smaller diameter as it is provided on the end face Ga side, and is provided in parallel with the transport roller R1.

The glass substrate etching method using this etching apparatus 1 is an etching method for a particularly thin substrate G, and is preferably used for a substrate G having a thickness of 0.1 mm or less. According to such a method, even when the thin substrate G is transported, it is possible to suppress the substrate G from being bent excessively, and at the central portion Gc of the substrate G placed on the transport roller R1. The generation of a large tensile stress due to the increase in the curvature of the substrate G can be prevented.

FIG. 7 is a sectional view showing an etching apparatus 1 used in the glass substrate etching method according to the fifth embodiment of the present invention.

The difference between the etching apparatus 1 used for the glass substrate etching method according to the fifth embodiment and the etching apparatus 1 used for the glass substrate etching method according to the first embodiment described above is that the end face support roller Between the point where R2 is not provided and between the transport roller R1 and the end face Ga of the substrate G, a pressing roller R4 which is a pressing member for pressing the substrate G downward is provided. The pressing roller R4 can move up and down along the Z direction shown in FIG.

The glass substrate etching method using this etching apparatus 1 is to etch a thick substrate G, and in particular, the thickness of the substrate G and the lateral length of the substrate G (the lateral length of the substrate G). / Thickness of the substrate G) <2000 is preferably used. According to such a method, even when etching is performed on the thick substrate G, the end face Ga and the edge portion Gb of the substrate G can be favorably bent downward.

FIG. 8 is a perspective view showing an etching apparatus 2 used in the glass substrate etching method according to the sixth embodiment of the present invention.

The etching apparatus 2 includes a carriage 10 that is a means for transporting the substrate G, and a bowl-like container T that is the same as the etching apparatus 1 used in the glass substrate etching method according to the first to fifth embodiments (not shown). Yes.

The carriage 10 is formed with a support portion D that supports the central portion Gc of the substrate G. Further, the contact surface of the support portion D with the substrate G is formed in a curved surface and is provided with a plurality of vent holes P. By applying a negative pressure by a negative pressure source (not shown), the substrate G is It can be held by suction.

According to the etching method of the glass substrate using this etching apparatus 2, the contact surface with the substrate G in the support portion D is formed in a curved surface, so that it acts on the substrate G by a negative pressure source (not shown). By adjusting the magnitude of the negative pressure, it is possible to adjust the degree of bending of the substrate G. Thereby, it is possible to etch the substrate G having various thicknesses using the etching apparatus 2.

Here, in the above first to sixth embodiments, the width of the edge Gb of the substrate G to be etched is preferably 1.0 mm or less.

The glass substrate etching method according to the present invention is not limited to the glass substrate etching method according to each of the above embodiments. In the first to fifth embodiments, the transport roller R1 is used as the transport means for transporting the substrate G. However, a carriage 10 as shown in the sixth embodiment may be used. A conveyor or the like including a plurality of vent holes P formed in the support portion D of the carriage 10 and a negative pressure source that applies a negative pressure to the vent holes P may be used. Moreover, the bowl-shaped container T does not need to be longer than the vertical length of the substrate G as shown in the above embodiment, and it is sufficient if it has a length about half the vertical length of the substrate G. is there. Furthermore, the bowl-shaped container T is not necessarily provided, and both the pair of end faces Ga and the edge Gb to be etched are used by using a single container having a lateral width longer than the lateral length of the substrate G. You may make it soak in the etching liquid L accommodated in the container. Furthermore, the direction of the flow of the etching solution L flowing in the bowl-shaped container T may be opposite to the V direction described in the first embodiment. As the etching solution L, hydrofluoric acid, hydrochloric acid, sodium hydroxide, or the like can be used in addition to the main component of ammonium hydrofluoride used in the above embodiment. Further, the shapes of the end surface support roller R2, the etching jig S, and the plate-like body H may be appropriately changed in consideration of the bending state of the substrate G and the like. In addition, in each of the above embodiments, the length in the vertical direction of the substrate G to be etched is longer than the length in the horizontal direction. However, the length is not limited to this, and the length in the horizontal direction is longer than the length in the vertical direction. It may be longer.

DESCRIPTION OF SYMBOLS 1 Etching apparatus 2 Etching apparatus R1 Conveyance roller R2 End surface support roller R2a Support surface G Glass substrate Ga End surface of G substrate Gb Edge of substrate Gc Central part of substrate T Bowl-shaped container L Etching solution V Transport direction of substrate W End surface support roller Rotation direction S Etching jig Sa Support surface Y Etching liquid dropping direction H Plate body Ha Support surface R3 Auxiliary support roller R4 Press roller Z Direction of movement of the press roller 10 Dolly D Support part P Vent

Claims

A glass substrate etching method in which etching is performed by immersing a pair of end faces parallel to the longitudinal direction of the glass substrate and edges of front and back surfaces connected to these end faces in an etching solution,
At least a central portion in the horizontal direction of the glass substrate is placed on the support member extending in the vertical direction, protruding from the support member to both sides in the horizontal direction, and the protruding portions are bent downward. A glass substrate etching method, wherein the pair of end faces and edges in a state are immersed in the etching solution.
The method for etching a glass substrate according to claim 1, wherein the supporting member supports only the central portion in the lateral direction of the glass substrate from below.
The method for etching a glass substrate according to claim 1 or 2, wherein the supporting member is a conveying means for conveying the glass substrate in the longitudinal direction.
An end surface support having a support surface for supporting the end surface of the glass substrate is provided, and the end surface and the edge of the glass substrate are immersed in an etching solution in a state where the end surface of the glass substrate is supported on the support surface. The method for etching a glass substrate according to any one of claims 1 to 3.
The glass substrate etching method according to claim 4, wherein the end surface and the edge of the glass substrate are immersed in an etching solution by dropping an etching solution onto the supporting surface of the end surface support.
5. The glass according to claim 4, wherein the end face support is formed of a porous material and a part thereof is immersed in the etching solution, whereby the end surface and the edge of the glass substrate are immersed in the etching solution. Substrate etching method.
The glass substrate etching method according to claim 4, wherein the end surface support is an end surface support roller partly immersed in the etching solution.
A plurality of auxiliary support rollers for supporting the glass substrate are provided between the conveying means and the end surface of the glass substrate, and the arrangement positions of the plurality of auxiliary support rollers shift to the end surface side. The glass substrate etching method according to any one of claims 3 to 7, wherein the diameter of the glass substrate is reduced accordingly.
The method for etching a glass substrate according to any one of claims 3 to 8, wherein a pressing member for pressing the glass substrate downward is provided between the conveying means and an end surface of the glass substrate.
10. The method for etching a glass substrate according to claim 1, wherein the etching solution is contained in a pair of bowl-shaped containers extending in the longitudinal direction.
The method for etching a glass substrate according to claim 10, wherein the etching solution is supplied from one end of the bowl-shaped container and discharged from the other end of the bowl-shaped container.
12. The method for etching a glass substrate according to claim 1, wherein the etching solution contains hydrofluoric acid or ammonium hydrofluoride as a main component.