WO2013097746A1 - 高频信号传输装置、高频信号传输系统和基站 - Google Patents

高频信号传输装置、高频信号传输系统和基站 Download PDF

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Publication number
WO2013097746A1
WO2013097746A1 PCT/CN2012/087681 CN2012087681W WO2013097746A1 WO 2013097746 A1 WO2013097746 A1 WO 2013097746A1 CN 2012087681 W CN2012087681 W CN 2012087681W WO 2013097746 A1 WO2013097746 A1 WO 2013097746A1
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WO
WIPO (PCT)
Prior art keywords
outer conductor
conductor
frequency signal
inner conductor
signal transmission
Prior art date
Application number
PCT/CN2012/087681
Other languages
English (en)
French (fr)
Inventor
蒲涛
何平华
范一鹏
孙德文
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN2011205581582U external-priority patent/CN202384598U/zh
Priority claimed from CN201110446502.3A external-priority patent/CN102610973B/zh
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2013097746A1 publication Critical patent/WO2013097746A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/38—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts
    • H01R24/40—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency
    • H01R24/52—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency mounted in or to a panel or structure

Definitions

  • High frequency signal transmission device high frequency signal transmission system and base station
  • the present invention relates to the field of communications technologies, and in particular, to a high frequency signal transmission apparatus, a high frequency signal transmission system, and a base station.
  • a high-frequency device, and a high-frequency device and an antenna, and the like are usually connected by a cable connection or a blind plug connector.
  • the blind plug connector is a human eye.
  • Undetectable high frequency signal transmission device Due to the large power or energy loss of the cable connection method and the complicated installation, the blind units are usually connected between the structural units in the existing base station.
  • High frequencies generally refer to frequencies above 300 MHz, including but not limited to radio frequency, microwaves, and the like.
  • the blind plug connector is mainly connected by a direct electrical contact between the male and the female, but the contact retention between the inner conductor and the inner conductor and between the outer conductor and the outer conductor of the blind plug connector Insufficient, may cause high-frequency signal transmission discontinuous or non-linear, resulting in intermodulation signals, spurious intermodulation signals falling in the receiving frequency band of the base station will reduce the sensitivity of the receiver, affecting the call quality, system carrier-to-interference ratio and communication The capacity of the system.
  • Embodiments of the present invention provide a high frequency signal transmission apparatus, a high frequency signal transmission system, and a base station to reduce intermodulation signals.
  • the present invention provides a high frequency signal transmission apparatus comprising: at least one pair of pluggable first and second devices; the first device comprising a first inner conductor and a first outer conductor, The second device includes a second inner conductor and a second outer conductor;
  • the first inner conductor and the second inner conductor are correspondingly disposed, the first inner conductor and the first a first insulating medium is disposed between the two inner conductors, such that the first inner conductor and the second inner conductor constitute a first coupling structure for transmitting a high frequency signal; the first outer conductor and the first a second outer conductor is disposed correspondingly, and a second insulating medium is disposed between the first outer conductor and the second outer conductor, so that the first outer conductor and the second outer conductor are configured to transmit a high frequency signal
  • the second coupling structure is correspondingly disposed, the first inner conductor and the first a first insulating medium is disposed between the two inner conductors, such that the first inner conductor and the second inner conductor constitute a first coupling structure for transmitting a high frequency signal; the first outer conductor and the first a second outer conductor is disposed correspondingly, and a second insulating medium is disposed between the first outer conductor and the second outer conductor,
  • the present invention also provides a high frequency signal transmission system, comprising: at least two high frequency devices, wherein the at least two high frequency devices are connected by at least one high frequency signal transmission device;
  • the transmission device includes: at least one pair of pluggable first and second devices; the first device comprising a first inner conductor and a first outer conductor, the second device comprising a second inner conductor and a second outer Conductor
  • the first inner conductor and the second inner conductor are correspondingly disposed, and a first insulating medium is disposed between the first inner conductor and the second inner conductor, so that the first inner conductor and the first
  • the second inner conductor constitutes a first coupling structure for transmitting a high frequency signal; the first outer conductor and the second outer conductor are correspondingly disposed, and the first outer conductor and the second outer conductor are respectively provided with a first And an insulating medium, wherein the first outer conductor and the second outer conductor form a second coupling structure for transmitting a high frequency signal.
  • the present invention also provides a base station, including a high frequency signal transmission device or a high frequency signal transmission system;
  • the high frequency signal transmission device includes: at least one pair of pluggable first and second devices; the first device includes a first inner conductor and a first outer conductor, and the second device includes a second An inner conductor and a second outer conductor; the first inner conductor and the second inner conductor are correspondingly disposed, and a first insulating medium is disposed between the first inner conductor and the second inner conductor, so that the The first inner conductor and the second inner conductor constitute a first coupling structure for transmitting a high frequency signal; the first outer conductor and the second outer conductor are correspondingly disposed, the first outer conductor and the first a second insulating medium is disposed between the two outer conductors such that the first outer conductor and the second outer conductor constitute a second coupling structure for transmitting a high frequency signal;
  • the high frequency signal transmission system includes: at least two high frequency devices connected by at least one of the high frequency signal transmission devices.
  • the high frequency signal transmission device, the high frequency signal transmission system and the base station provided by the embodiments of the present invention, the first device and the second device of each pair of pluggable connections of the high frequency signal transmission device, between the inner conductor and the inner conductor
  • An insulating medium is disposed between the outer conductor and the outer conductor, respectively, between the inner conductor of the first device of the high-frequency signal transmission device and the upper and inner conductors of the second device, the outer conductor of the first device, and the second device
  • the outer conductors of the piece respectively form a coupling structure of indirect electrical contact, thereby reducing the intermodulation signal, and the signal transmission structure is used for transmitting high frequency signals in the base station, which can improve the sensitivity, call quality and system carrier of the base station receiver.
  • FIG. 3 is a side cross-sectional view of a high-frequency signal transmission device according to an embodiment of the present invention
  • FIG. 4 is a side cross-sectional view of a high-frequency signal transmission device according to another embodiment of the present invention
  • FIG. 6 is a side cross-sectional view of a high-frequency signal transmission device according to another embodiment of the present invention
  • FIG. 7 is a high-frequency signal transmission device according to another embodiment of the present invention
  • FIG. 8 is a schematic structural view of a second outer conductor and a filter integrated in a high frequency signal transmission system
  • FIG. 9 is a side cross-sectional view of a plurality of high frequency signal transmission devices in a high frequency signal transmission system according to an embodiment of the present invention.
  • FIG. 10 is a schematic structural diagram of one or more high-frequency signal transmission apparatuses in a high-frequency signal transmission system according to an embodiment of the present invention.
  • the technical solutions in the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention.
  • the embodiments are a part of the embodiments of the invention, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.
  • the high frequency signal transmission apparatus includes: at least one pair of pluggable first and second devices; the first device includes a first inner conductor and a first outer conductor, and the second device includes a second Inner conductor and second outer conductor; a first inner conductor and a second inner conductor are disposed correspondingly, and a first insulating medium is disposed between the first inner conductor and the second inner conductor, so that the first inner conductor and the second inner conductor form a first part for transmitting a high frequency signal a coupling structure; a first outer conductor and a second outer conductor are disposed correspondingly, and a second insulating medium is disposed between the first outer conductor and the second outer conductor, so that the first outer conductor and the second outer conductor are configured for high transmission A second coupling structure of the frequency signal.
  • the first device may be the male of the high frequency signal transmission device, and the second device may be the female; or the first device may be a high frequency signal transmission
  • the female device, the second device can be a male.
  • the first device may be connected to a high frequency device to be connected by a cable or a connector or other existing methods.
  • the first inner conductor and the first outer conductor of the first device may be electrically connected to the high frequency device, respectively.
  • the high frequency signal is input to the high frequency device, or the high frequency signal output by the high frequency device is received; similarly, the second device can be connected to another high frequency device to be connected through a cable or a connector or other existing methods, specifically Yes, the second inner conductor and the second outer conductor of the second device may be electrically connected to the high frequency device, respectively, to input a high frequency signal to the high frequency device or to receive the high frequency signal output by the high frequency device.
  • the high frequency signal involved in the embodiment of the present invention may have a frequency higher than 300 MHz, and may be a type of signal such as radio frequency or microwave.
  • the inner and outer conductors on the male are coaxial conductors
  • the inner and outer conductors on the female are also coaxial conductors.
  • the inner conductor can be located at the center of the male or female
  • the outer conductor can be a sleeve-like structure that surrounds the outer conductor.
  • the first outer conductor of the first device and the second outer conductor of the second device may be respectively grounded, and specifically, the ground layer may be respectively disposed in the first device and the second device, or the first outer conductor and the second outer conductor respectively It can be directly connected to the high frequency device to be connected, for example, the cavity wall of a device such as a filter to achieve grounding.
  • the high frequency signal transmission device provided by the embodiment of the present invention has a pluggable structure between each pair of male and female heads (ie, the first device and the second device), and specifically, the first inner conductor and the second inner conductor
  • the first outer conductor and the second outer conductor may be arranged in a pluggable structure.
  • first inner conductor and the second inner conductor are correspondingly disposed, and a first insulating medium is disposed therebetween, and the first insulating medium may be a plastic medium or a layer of insulating medium sprayed, or may be an air gap , which may also be an insulating dielectric layer and an air gap, thereby making the first inner conductor and the second inner conductor
  • a first coupling structure is formed between the inner conductors.
  • the coupling structure may be, for example, a coupling capacitor structure or a coupling transmission structure or the like.
  • the shape, size, radial distance, and coupling area of the first inner conductor and the second inner conductor may be determined according to requirements of electrical specifications of the actually connected high frequency device, for example: first inner conductor and second inner conductor
  • the radial clearance between them can be set large enough, and the axial fit length of the two can be set short enough to increase the tolerance of the system.
  • the inner conductor on the male or female head can be made into a rod-like structure that is fixed at one end and flexible at the other end around the fixed end, thereby increasing the tolerance of the system.
  • the positions of the first outer conductor and the second outer conductor are correspondingly disposed, and a second insulating medium is disposed therebetween, and the second insulating medium may also be a plastic medium or a layer of insulating medium sprayed, or
  • the air gap may also be an insulating dielectric layer and an air gap such that a second coupling structure is formed between the first outer conductor and the second outer conductor.
  • the coupling structure can also be, for example, a coupling capacitor structure or a coupling transmission structure or the like.
  • the shape, size, radial distance, and coupling area of the first outer conductor and the second outer conductor may also be determined according to actual electrical index requirements.
  • the two high frequencies connected between the first device and the second device can be realized by a coupling structure formed between the first inner conductor and the second inner conductor, a coupling structure formed between the first outer conductor and the second outer conductor High frequency signals are transmitted between devices. Since the coupling structure can realize high frequency signals without direct contact between the two conductors of the first device and the second device, signals in the electromagnetic frequency range or signals in the microwave frequency range in which the base station antenna operates can be expressed. The relatively low reactance value can ensure the impedance matching between the coaxial inner and outer conductors on the male and female ends, and reduce the intermodulation signal generated by poor contact between the conductor and the conductor.
  • the high-frequency signal transmission device may include at least one pair of pluggable first device and second device, as a feasible implementation manner, any pair of pluggable connected first devices and
  • the first inner conductor may be coupled to the first pair of pluggable first and second first conductors
  • the first outer conductor may be coupled to the other pair of pluggable contacts
  • the device is coupled to the first outer conductor of the second device; and/or, of the first device and the second device of any pair of pluggable connections, the second inner conductor may be coupled to the first of the other pair of pluggable connections
  • the device is coupled to a second inner conductor of the second device, and the second outer conductor can be coupled to the other of the pair of pluggable first and second second conductors.
  • the high frequency signal transmission device provided by the embodiment of the present invention, wherein at least one pair of pluggable first device and second device may be disposed in the same component.
  • the adjacent two pairs of pluggable first devices and the second device may not be functionally connected, but may be displayed by a third-party fastener.
  • the layout of each of the pair of pluggable first and second devices can be adjusted in accordance with the input and output positions of the high-frequency signal.
  • each pair of pluggable first device and second device can be applied to a high-frequency device to be connected, or to a treatment in a high-frequency device to be connected Connected port. Accordingly, the present invention provides a high frequency signal transmission apparatus which can be used to connect a pair of high frequency devices having one or more ports, and can also be used to connect a pair of high frequency devices.
  • an insulating medium is disposed between the inner conductor and the inner conductor, and between the outer conductor and the outer conductor.
  • a coupling structure of indirect electrical contact is formed between the inner conductor of the first device of the high frequency signal transmission device and the inner conductor of the second device, the outer conductor of the first device, and the outer conductor of the second device, thereby reducing Intermodulation signal, such a signal transmission structure is used for transmitting high frequency signals in a base station, which can improve the sensitivity of the receiver.
  • the call quality, the system carrier interference ratio, and the capacity of the communication system can be improved.
  • the above describes a coupling structure between the first inner conductor and the second inner conductor of the first device and the second device in the high-frequency signal transmission device provided by the embodiment of the present invention, and a coupling structure is formed between the first outer conductor and the second outer conductor.
  • the specific structure in which several first devices and second devices cooperate with each other is specifically given below.
  • FIG. 1 is a side cross-sectional view of a high-frequency signal transmission apparatus according to an embodiment of the present invention.
  • an input/output of a first device connected to a high-frequency device can be implemented by a cable, and can also pass Other existing methods are implemented.
  • the first device includes a first inner conductor 1 and a first outer conductor 2, and may further include a first ground layer 3;
  • the second device includes a second inner conductor 4 and a second outer conductor 5, and may further include a second ground layer 6;
  • the first outer conductor 2 and the first ground layer 3 may be made of a metal material or may be made of a printed circuit board (PCB).
  • the first outer conductor 2 and the first ground layer 3 may be an integrally formed metal plate or a PCB board, that is, the metal plate or the PCB board can be functionally used as the first outer conductor. 2, can also be used as the first ground layer 3.
  • the first outer conductor 2 and the first ground layer 3 may also be two independently formed structures, for example: two metal plates or PCB boards, two metal plates or PCB boards
  • the flat plate structure may be connected in the thickness direction, or may be connected in the extending direction of the metal plate or the PCB board to form a flat plate structure.
  • the second ground layer 6 may be disposed in a flat structure, the second outer conductor 5 is disposed on the second ground layer 6, and the second outer conductor 5 may be in a sleeve structure and disposed around the periphery of the second inner conductor 4.
  • the second ground layer 6 may also be made of a metal material or a PCB board.
  • the second insulating medium 8 between the first outer conductor 2 and the second outer conductor 5 may be disposed on the surface of the first outer conductor 2 facing the second outer conductor 5 and corresponding to the second outer conductor 5 Settings.
  • the second insulating medium 8 may be an insulating dielectric layer such as plastic or a layer of insulating medium sprayed, or may be an air gap, or may be an insulating dielectric layer and an air gap, so that the first outer conductor 2 and the second outer portion
  • the conductor 5 forms a second coupling structure, and high frequency signals between the two high frequency devices to which the first device and the second device are connected are transmitted through the first outer conductor 2 and the second outer conductor 5.
  • the first insulating medium 7 between the first inner conductor 1 and the second inner conductor 4 may be a cylinder.
  • the first insulating medium 7 may be disposed on the first inner conductor 1, and the second inner conductor 4 may be in a sleeve structure.
  • the second inner conductor 4 may be disposed around the periphery of the first insulating medium 7; as another possible implementation manner, the first insulating medium 7 may be disposed on the second inner conductor 4, and the first inner conductor 1 may be disposed around the first insulating medium 7. periphery.
  • one end of the second inner conductor 4 adjacent to the first inner conductor 1 may have a sleeve structure, and correspondingly, one end of the first inner conductor 1 adjacent to the second inner conductor 4 may be disposed as an outer diameter and a second inner portion.
  • the conductor 4 is a cylinder having an inner diameter of one end of the sleeve structure, and the first insulating medium 7 can be wrapped around the periphery of the cylinder; when the first device and the second device are plugged, the second inner conductor 4 can be enclosed At the periphery of the first insulating medium 7; or, the end of the first inner conductor 1 adjacent to the second inner conductor 4 may have a sleeve structure, and correspondingly, one end of the second inner conductor 4 adjacent to the first inner conductor 1 may be disposed as
  • the outer diameter and the first inner conductor 1 are cylindrical bodies having an inner diameter of one end of the sleeve structure, and the first insulating medium 7 may be wrapped around the outer periphery of the cylinder; when the first device and the second device are inserted, the first The inner conductor 1 may be disposed around the periphery of the first insulating medium 7.
  • the first inner conductor 1 and the second inner conductor 4 can be formed into a pluggable structure, and the first coupling structure is formed between the first inner conductor 1 and the second inner conductor 4, and the first device is realized.
  • the high frequency signal between the two high frequency devices connected to the second device is transmitted through the first inner conductor 1 and the second inner conductor 4.
  • the first inner conductor 1 and the first ground layer 3 or the first outer conductor 2 may be connected by a third insulating medium 9 to form a gap between the first inner conductor 1 and the first outer conductor 2 for forming a first transmission line transmitting a high frequency signal; and/or, the second inner conductor 4 and the second ground layer 6 or the second outer conductor 5 may also be connected by a fourth insulating medium 10 such that the second inner conductor 4 and A second transmission line for transmitting a high frequency signal is formed between the second outer conductors 5.
  • the first transmission line is the first inner conductor 1, the third insulating medium 9 and the first ground layer 3, or the first inner conductor 1, the third insulating medium 9 and the first outer conductor 2 are formed together for transmission.
  • the second transmission line is the second inner conductor 4, the fourth insulating medium 10 and the second ground layer 6, or the second inner conductor 4, the fourth insulating medium 10 and the second outer conductor 5 are formed together to transmit a high frequency signal.
  • Functional line of function is the first inner conductor 4, the fourth insulating medium 10 and the second ground layer 6, or the second inner conductor 4, the fourth insulating medium 10 and the second outer conductor 5 are formed together to transmit a high frequency signal.
  • the first inner conductor 1 can be electrically connected to a high frequency device by a cable or the like, and the connection of the first inner conductor 1 and the high frequency device serves as an input/output of a high frequency signal, and the first inner conductor A first transmission line is formed between 1 and the first outer conductor 2, and the first outer conductor 2 is connected to the first ground layer 3, so that the first inner conductor 1 and the first outer conductor 2 receive high frequency signals from the high frequency device or The high frequency signal is transmitted on the high frequency device; likewise, the second inner conductor 4 can be electrically connected to another high frequency device by a cable or the like, and the connection of the second inner conductor 4 and the high frequency device serves as an input of the high frequency signal/ Output, a second transmission line is formed between the second inner conductor 4 and the second outer conductor 5, and the second outer conductor 5 is connected to the second ground layer 6, and the second inner conductor 4 and the second outer conductor 5 are realized from the high frequency device.
  • both the first outer conductor 2 and the second outer conductor 5 can be directly electrically connected to the high frequency device through a cable or connector.
  • the high frequency device is electrically connected to the first ground layer 3 and the second ground layer 6, and the first inner conductor 1 and the first outer conductor 2 are connected to the first ground layer 3 by a probe, and the second inner conductor 4 and the second outer conductor 5 are connected to the second ground layer 6 by a probe.
  • the second outer conductor 5 may be subjected to a partial weight reduction process.
  • the outer portion of the torus of the second outer conductor 5 is dug.
  • the portion close to the second inner conductor 4 and the portion close to the first outer conductor 2 are left to reduce the weight of the entire high-frequency signal transmission device to achieve weight reduction of the high-frequency signal transmission device.
  • the first insulating medium 7 may be disposed on the first inner conductor 1 , and at least one hole 71 may be defined in the first insulating medium 7.
  • the second inner conductor 4 may be provided with at least one needle 11 , and the needle 11 is wrapped in the hole In the slot 71.
  • the second outer conductor 5 can be appropriately subjected to local weight reduction processing to reduce the weight of the entire high-frequency signal transmission device, which contributes to miniaturization of the high-frequency signal transmission device.
  • FIG. 3 is a schematic structural view of a high-frequency signal transmission device according to an embodiment of the present invention
  • FIG. 4 is a side cross-sectional view of a high-frequency signal transmission device according to another embodiment of the present invention
  • the first ground layer 3 may be a first outer conductor 2 is disposed on the first ground layer 3, and the first outer conductor 2 may be disposed in a sleeve structure; correspondingly, the second ground layer 6 is a flat structure, and the second outer conductor 5 is disposed at the first
  • the second outer conductor 5 may be disposed in a sleeve structure and disposed around the periphery of the second inner conductor 4; the first outer conductor 2 may be connected to the first ground layer 3 or the first ground layer 3
  • the body is formed by body molding.
  • the second outer conductor 5 may be connected to the second ground layer 6 or formed integrally with the second ground layer 6.
  • the first outer conductor 2 When the first device and the second device are plugged in, the first outer conductor 2 may be wholly or partially disposed around the outer periphery of the second outer conductor 5; or, the second outer conductor 5 may be all or partially enclosed in the first The outer periphery of the outer conductor 2.
  • the second insulating medium 8 may be disposed on the surface of the first outer conductor 2 facing the second outer conductor 5, and/or the second insulating medium 8 may also be disposed.
  • the second outer conductor 5 faces the surface of the first outer conductor 2 such that a second coupling structure is formed between the first outer conductor 2 and the second outer conductor 5.
  • the degree of coupling between the first outer conductor 2 and the second outer conductor 5 can be increased or decreased by adjusting the area at which the first outer conductor 2 and the second outer conductor 5 correspond.
  • first inner conductor 1 and the first ground layer 3 or the first outer conductor 2 may be connected through the third insulating medium 9 to form a first transmission line between the first inner conductor 1 and the first outer conductor 2; and/or the second inner conductor 4 and the second ground layer 6 or the second outer conductor 5 It is also possible to connect between the fourth insulating medium 10 such that a second transmission line is formed between the second inner conductor 4 and the second outer conductor 5.
  • the first insulating medium 7 between the first inner conductor 1 and the second inner conductor 4 may be provided in a cylindrical shape.
  • the first insulating medium 7 may be disposed on the first inner conductor 1, and the second inner conductor 4 may be in a sleeve structure. When the first device and the second device are plugged, the second inner conductor 4 may be enclosed. On the periphery of the first insulating medium 7; or, the first insulating medium 7 may be disposed on the second inner conductor 4, and the first inner conductor 1 may be in a sleeve structure, when the first device and the second device are plugged, first Inner conductor
  • first inner conductor 1 may be enclosed around the periphery of the first insulating medium 7.
  • a pluggable structure can be formed between the first inner conductor 1 and the second inner conductor 4.
  • one end of the second inner conductor 4 adjacent to the first inner conductor 1 may have a sleeve structure, and correspondingly, one end of the first inner conductor 1 adjacent to the second inner conductor 4 may be disposed as an outer diameter and a second inner portion.
  • the conductor 4 has an inner diameter of one end of the sleeve structure and is disposed in a cylindrical shape.
  • the first insulating medium 7 may be wrapped around the periphery of the cylinder.
  • the second inner conductor 4 When the first device and the second device are inserted, the second inner conductor 4 may be Surrounding the periphery of the first insulating medium 7; or, the end of the first inner conductor 1 adjacent to the second inner conductor 4 may have a sleeve structure, and correspondingly, the second inner conductor 4 may be adjacent to one end of the first inner conductor 1 a cylindrical body having an outer diameter and an outer diameter of the first inner conductor 1 at one end of the sleeve structure, the first insulating medium 7 may be wrapped around the outer periphery of the cylinder; when the first device and the second device are inserted, The first inner conductor 1 may be disposed around the periphery of the first insulating medium 7.
  • the first insulating medium 7 may be disposed on the first inner conductor 1, and at least one hole 71 may be defined in the first insulating medium 7.
  • the second inner conductor 4 may be provided with at least one pin 11 and a pin 11 It is wrapped in the slot 71.
  • the second outer conductor 5 can be appropriately subjected to local weight reduction treatment to reduce the weight of the entire high-frequency signal transmission device, which contributes to miniaturization of the high-frequency signal transmission device.
  • the first device and the second device are respectively connected to the high frequency device through the input/output, and the first inner conductor and the second inner device are provided for each pair of pluggable first inner and second devices.
  • a shielding material 12 may be disposed between 1 and the second inner conductor 4, for example: a high dielectric constant material may be disposed between the first inner conductor 1 and the second inner conductor 4, and likewise, the first outer conductor 2 and the second outer The shielding material 12 may also be disposed between the conductors 5, thereby improving the anti-interference ability of the first device and the second device itself, and reducing interference with the other pluggable first device and the second device, and improving the pluggable pairs. Isolation between the set first device and the second device.
  • Figure 6 is a side cross-sectional view showing a high-frequency signal transmission device according to still another embodiment of the present invention.
  • the coupling is enhanced.
  • the first outer conductor 2 is disposed on the first ground layer 3, and the first outer conductor 2 may have a double-layered sleeve structure; correspondingly, the second ground layer 6 It may be provided as a flat structure, the second outer conductor 5 is disposed on the second ground layer 6, and the second outer conductor 5 may be in a sleeve structure surrounding the periphery of the second inner conductor 4; when the first device and the second device When plugged in, the second outer conductor 5 is located between the double sleeves formed by the first outer conductor 2;
  • the first ground layer 3 can also be disposed as a flat structure, the first outer conductor 2 is disposed on the first ground layer 3, and the first outer conductor 2 can be in a sleeve structure.
  • the second ground layer 6 can be a flat structure, the second outer conductor 5 is disposed on the second ground layer 6, and the second outer conductor can be a double-layered sleeve structure and is disposed around the second inner conductor 4. Peripheral; when the first device and the second device are plugged, the first outer conductor 2 is located between the double sleeves formed by the second outer conductor 5.
  • the second insulating medium 8 may be disposed on the surface of the first outer conductor 2 facing the second outer conductor 5, and/or the second insulating medium may also be disposed in the second outer conductor 5 facing the first outer conductor 2 On the surface, a second coupling structure is formed between the first outer conductor 2 and the second outer conductor 5.
  • the degree of coupling between the first outer conductor 2 and the second outer conductor 5 can be increased or decreased by adjusting the area at which the first outer conductor 2 and the second outer conductor 5 correspond.
  • first inner conductor 1 and the first ground layer 3 or the first outer conductor 2 may also be connected through the third insulating medium 9 so as to be between the first inner conductor 1 and the first outer conductor 2 Forming a first transmission line; and/or, the second inner conductor 4 and the second ground layer 6 or the second outer conductor 5 may also be connected by a fourth insulating medium 10 such that the second inner conductor 4 and the second outer conductor A second transmission line is formed between 5.
  • the first insulating medium 7 may be disposed on the first inner conductor 1, and at least one hole 71 may be defined in the first insulating medium 7.
  • the second inner conductor 4 may be provided with at least one pin 11 and a pin 11 It is wrapped in the slot 71.
  • the second outer conductor 5 can be appropriately subjected to local weight reduction treatment to reduce the weight of the entire high-frequency signal transmission device, which contributes to miniaturization of the high-frequency signal transmission device.
  • the first insulating medium 7 may be disposed on the second inner conductor 4, and at least one hole 71 may be defined in the first insulating medium 7.
  • the first inner conductor 1 may further be provided with at least one needle 11 and a needle 11 It is wrapped in the slot 71.
  • the first outer conductor 2 can be appropriately subjected to local weight reduction treatment to reduce the weight of the entire high-frequency signal transmission device.
  • another embodiment of the present invention further provides a high-frequency signal transmission device.
  • the first outer conductor 2 and the first ground layer 3 can be an integrally formed metal plate or PCB board, that is, the metal plate or the PCB board can be functionally used as both the first outer conductor 2 and the first ground layer 3.
  • the first outer conductor 2 and the first ground layer 3 may also be two independently formed structures, for example: may be two metal plates or PCB boards, and the two metal plates or PCB boards may be connected in the thickness direction.
  • the flat structure can also be connected along the extending direction of the metal plate or the PCB to form a flat structure.
  • the side edge of the sleeve formed by the second inner conductor 4 is connected to the flat structure formed by connecting the second outer conductor 5 and the second ground layer 6.
  • the first device of the high-frequency signal transmission device and the inner conductor of the second device can be disposed inside one of the two high-frequency devices to be connected to facilitate the integrated design of the base station system.
  • the second insulating medium 8 may be disposed on the surface of the first outer conductor 2 facing the second outer conductor 5, and/or the second insulating medium 8 may also be disposed in the second outer conductor 5 facing the first outer conductor 2 on the surface.
  • the first insulating medium 7 between the first inner conductor 1 and the second inner conductor 4 may also be a cylinder, and the second inner conductor 4 is a sleeve structure; when the first device and the second device are connected The second inner conductor 4 is disposed around the periphery of the first insulating medium 7, so that the first inner conductor 1 and the second inner conductor 4 form a pluggable structure.
  • the embodiment of the present invention further provides a high-frequency signal transmission system, the high-frequency signal transmission system comprising: at least two high-frequency devices, at least two high-frequency devices Connected by at least one high frequency signal transmission device;
  • the high frequency signal transmission device comprises: at least one pair of pluggable first and second devices; the first device comprising a first inner conductor and a first outer conductor, the second device comprising a second inner conductor and a second Outer conductor
  • a first inner conductor and a second inner conductor are disposed correspondingly, and a first insulating medium is disposed between the first inner conductor and the second inner conductor, so that the first inner conductor and the second inner conductor form a first part for transmitting a high frequency signal a coupling structure;
  • a first outer conductor and a second outer conductor are disposed correspondingly, and a second insulating medium is disposed between the first outer conductor and the second outer conductor, so that the first outer conductor and the second outer conductor are configured for high transmission
  • a second coupling structure of the frequency signal is configured for high transmission
  • the high frequency device involved in this embodiment may be any active device or passive device in the base station, for example Such as: filter system, filter device, transceiver device, power amplifier device, power split device, combiner or antenna, etc., can also be any active device or passive device in the microwave device.
  • the high frequency signal transmission device connection provided by the embodiment of the present invention can be connected between these high frequency devices in the base station.
  • the high-frequency signal transmission device can be connected to the high-frequency device through a cable or various existing connection methods.
  • the first device or the second device in the high-frequency signal transmission device may be independently provided, or the first device and/or the second device may also be integrally integrated with the high-frequency device.
  • the first outer conductor or the second outer conductor may be integrally formed with a cavity wall of a high-frequency device such as a filter, and the first inner conductor or the second inner conductor may be fixed to a high-frequency device such as a filter through a medium, etc. .
  • the high-frequency device is connected to the filter C through a high-frequency signal transmission device, wherein, the second The outer conductor is integrally formed with the cavity wall of the filter.
  • the high-frequency signal transmission device transmits the high-frequency signal to the resonance unit of the filter through the second transmission line formed between the second inner conductor 4 and the second outer conductor 5.
  • the second transmission line is a functional line having a function of transmitting a high frequency signal, which is formed by the second inner conductor 4, the fourth insulating medium 10 and the second outer conductor 5.
  • each pair of pluggable first and second devices can be applied to a high-frequency device to be connected, or to a port to be connected in a high-frequency device to be connected . Accordingly, the present invention provides a high frequency signal transmission apparatus which can connect a pair of high frequency devices having one or more ports, and can connect a plurality of pairs of high frequency devices.
  • the layout of each of the pair of pluggable first devices and the second device can be adjusted according to the input and output positions of the high-frequency signals.
  • the first ground layer and the second ground layer of the high-frequency signal transmission device may use a PCB board or the like; further, each high-frequency signal transmission device or each high-frequency signal may be transmitted.
  • the first and second devices of each pair of pluggable connections in the device are separated by a ring 13 of non-metallic material such that the first and second devices of each pair of pluggable connections are not common.
  • the first inner conductor and the first outer conductor may respectively pass through the first inner conductor and the first a first transmission line formed between the outer conductors is connected to the high frequency device, or the second inner conductor and the first The two outer conductors may be connected to the high frequency device through a second transmission line formed between the second inner conductor and the second outer conductor, respectively.
  • At least one pair of pluggable first device and second device in the high frequency signal transmission device may be disposed in the same component 13, for example: On one board; or, it can be placed on the same high-frequency device, for example: set on the same filter.
  • the high-frequency signal transmission system provided by the embodiment is connected between the high-frequency devices by the high-frequency signal transmission device, the first device of the high-frequency signal transmission device, and the inner conductor and the inner conductor and the outer conductor on the second device.
  • An insulating medium is disposed between the outer conductor and the outer conductor to form a coupling structure between the inner and outer conductors on the first and second devices of the high-frequency signal transmission device, and between the outer conductor and the outer conductor, respectively. , thereby reducing the intermodulation signal.
  • Such a high-frequency signal transmission system for transmitting a high-frequency signal in a base station can improve the sensitivity of the base station receiver, the quality of the call, the system carrier-to-interference ratio, and the capacity of the communication system.
  • the embodiment of the present invention further provides a base station, including any high-frequency signal transmission device or high-frequency signal transmission system provided by the embodiment of the present invention, wherein the specific structure and function of the high-frequency signal transmission device can be referred to the present invention.
  • the high-frequency signal transmission device embodiment, the specific structure and function of the high-frequency signal transmission system can be referred to the embodiment of the high-frequency signal transmission system provided by the present invention, and details are not described herein again.
  • the base station provided by the embodiment of the present invention can improve the sensitivity, the call quality, the system carrier interference ratio, and the capacity of the communication system by using any high-frequency signal transmission device or high-frequency signal transmission system provided by the embodiments of the present invention. .

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Abstract

高频信号传输装置、高频信号传输系统和基站。高频信号传输装置包括至少一对可插拔连接的第一器件和第二器件；第一器件包括第一内导体（1）和第一外导体（2），第二器件包括第二内导体（4）和第二外导体（5）；第一内导体和第二外导体对应设置，第一内导体和第二内导体之间设有第一绝缘介质（7），构成用于传输高频信号的第一耦合结构；第一外导体和第二外导体对应设置，第一外导体和第二外导体之间设有第二绝缘介质（8），构成用于传输高频信号的第二耦合结构。该高频信号传输装置可以降低互调信号。

Description

高频信号传输装置、 高频信号传输系统和基站
本申请要求了 2011年 12月 28日提交的， 申请号为 201110446502.3 , 发 明名称为"高频信号传输装置、 高频信号传输系统和基站"的中国专利申请和 2011年 12月 28日提交的， 申请号为 201120558158.2,发明名称为"高频信号 传输装置、 高频信号传输系统和基站"的中国专利申请的优先权， 其全部内容 通过引用结合在本申请中。 技术领域
本发明涉及通信技术领域， 特别涉及一种高频信号传输装置、 高频信号 传输系统和基站。 背景技术 目前， 无线分布式基站系统中， 高频器件之间， 以及高频器件与天线等 结构单元之间通常釆用线缆连接或者盲插连接器连接， 盲插连接器是一种人 眼观察不到的高频信号传输装置。 由于线缆连接方式功率或能量损耗大并且 安装复杂， 因此， 现有的基站中的结构单元之间通常釆用盲插连接器连接。 高频通常指高于 300MHZ的频率， 包括但不限于射频、 微波等。
现有技术中， 盲插连接器主要釆用公头和母头直接电接触方式连接， 然 而这种盲插连接器的内导体与内导体之间、 外导体与外导体之间的接触保持 力不足， 可能导致高频信号传输不连续或非线性， 从而产生互调信号， 杂散 的互调信号落在基站的接收频带内会降低接收机的灵敏度， 影响通话质量、 系统载波干扰比和通信系统的容量。 发明内容 本发明实施例提供了一种高频信号传输装置、高频信号传输系统和基站， 以降低互调信号。
一方面， 本发明提供一种高频信号传输装置， 包括： 至少一对可插拔连 接的第一器件和第二器件； 所述第一器件包括第一内导体和第一外导体， 所 述第二器件包括第二内导体和第二外导体；
所述第一内导体和所述第二内导体对应设置， 所述第一内导体和所述第 二内导体之间设有第一绝缘介质， 以使所述第一内导体和所述第二内导体构 成用于传输高频信号的第一耦合结构； 所述第一外导体和所述第二外导体对 应设置， 所述第一外导体和所述第二外导体之间设有第二绝缘介质， 以使所 述第一外导体和所述第二外导体构成用于传输高频信号的第二耦合结构。
另一方面， 本发明还提供一种高频信号传输系统， 包括： 至少两个高频 器件， 所述至少两个高频器件之间通过至少一个高频信号传输装置连接； 所 述高频信号传输装置包括： 至少一对可插拔连接的第一器件和第二器件； 所 述第一器件包括第一内导体和第一外导体， 所述第二器件包括第二内导体和 第二外导体；
所述第一内导体和所述第二内导体对应设置， 所述第一内导体和所述第 二内导体之间设有第一绝缘介质， 以使所述第一内导体和所述第二内导体构 成用于传输高频信号的第一耦合结构； 所述第一外导体和所述第二外导体对 应设置， 所述第一外导体和所述第二外导体之间设有第二绝缘介质， 以使所 述第一外导体和所述第二外导体构成用于传输高频信号的第二耦合结构。
再一方面， 本发明还提供了一种基站， 包括高频信号传输装置或高频信 号传输系统；
所述高频信号传输装置， 包括： 至少一对可插拔连接的第一器件和第二 器件； 所述第一器件包括第一内导体和第一外导体， 所述第二器件包括第二 内导体和第二外导体； 所述第一内导体和所述第二内导体对应设置， 所述第 一内导体和所述第二内导体之间设有第一绝缘介质， 以使所述第一内导体和 所述第二内导体构成用于传输高频信号的第一耦合结构； 所述第一外导体和 所述第二外导体对应设置， 所述第一外导体和所述第二外导体之间设有第二 绝缘介质， 以使所述第一外导体和所述第二外导体构成用于传输高频信号的 第二耦合结构；
所述高频信号传输系统， 包括： 至少两个高频器件， 所述至少两个高频 器件之间通过至少一个所述高频信号传输装置连接。
本发明实施例提供的高频信号传输装置、 高频信号传输系统和基站， 高 频信号传输装置的每一对可插拔连接的第一器件和第二器件中， 内导体和内 导体之间、 外导体和外导体之间分别设置绝缘介质， 使高频信号传输装置的 第一器件的内导体和第二器件上和内导体之间、 第一器件的外导体和第二器 件的外导体之间分别形成非直接电接触的耦合结构， 从而降低了互调信号， 这样的信号传输结构用于基站中传输高频信号， 可以提高基站接收机的灵敏 度、 通话质量、 系统载波干扰比和通信系统的容量。 附图说明 为了更清楚地说明本发明实施例或现有技术中的技术方案， 下面将对实 施例或现有技术描述中所需要使用的附图作简单地介绍， 显而易见地， 下面 描述中的附图是本发明的一些实施例， 对于本领域普通技术人员来讲， 在不 付出创造性劳动性的前提下， 还可以根据这些附图获得其他的附图。
图 1-图 3为本发明实施例提供的高频信号传输装置的侧剖视图； 图 4为本发明另一个实施例提供的高频信号传输装置的侧剖视图； 图 5为图 4所示的高频信号传输装置与高频器件的连接结构示意图； 图 6为本发明另一个实施例提供的高频信号传输装置的侧剖视图； 图 7为本发明另一个实施例提供的高频信号传输装置的侧剖视图； 图 8为高频信号传输系统中的第二外导体与滤波器集成设置的结构示意 图；
图 9为本发明实施例提供的高频信号传输系统中多个高频信号传输装置 的侧剖视图；
图 10 为本发明实施例提供的高频信号传输系统中一个或多个高频信号 传输装置的结构示意图。 具体实施方式 为使本发明实施例的目的、 技术方案和优点更加清楚， 下面将结合本发 明实施例中的附图， 对本发明实施例中的技术方案进行清楚、 完整地描述， 显然， 所描述的实施例是本发明一部分实施例， 而不是全部的实施例。 基于 本发明中的实施例， 本领域普通技术人员在没有做出创造性劳动前提下所获 得的所有其他实施例， 都属于本发明保护的范围。
本发明实施例提供的高频信号传输装置， 包括： 至少一对可插拔连接的 第一器件和第二器件； 第一器件包括第一内导体和第一外导体， 第二器件包 括第二内导体和第二外导体； 第一内导体和第二内导体对应设置， 第一内导体和第二内导体之间设有 第一绝缘介质， 以使第一内导体和第二内导体构成用于传输高频信号的第一 耦合结构； 第一外导体和第二外导体对应设置， 第一外导体和第二外导体之 间设有第二绝缘介质， 以使第一外导体和第二外导体构成用于传输高频信号 的第二耦合结构。
对于每对可插拔连接的第一器件和第二器件， 第一器件可以是高频信号 传输装置的公头， 则第二器件可以是母头； 或者， 第一器件可以是高频信号 传输装置母头， 则第二器件可以是公头。 第一器件可以通过电缆或连接器或 其他现有方式与一个待连接的高频器件连接， 具体是， 第一器件的第一内导 体和第一外导体可以分别与高频器件电连接， 以实现向高频器件输入高频信 号， 或者接收高频器件输出的高频信号； 同样的， 第二器件可以通过电缆或 连接器或其他现有方式与另一个待连接的高频器件连接， 具体是， 第二器件 的第二内导体和第二外导体可以分别与高频器件电连接， 以实现向高频器件 输入高频信号， 或者接收高频器件输出的高频信号。 其中， 本发明实施例涉 及的高频信号， 其频率可以高于 300MHz, 具体可以是射频、 微波等类型的 信号。
公头上的内导体和外导体为同轴导体， 母头上的内导体和外导体也为同 轴导体。 例如： 内导体可以位于公头或母头的中心处， 外导体可以为套筒状 结构， 围设在内导体的外围。
第一器件中的第一外导体和第二器件中的第二外导体可以分别接地， 具 体可以在第一器件和第二器件中分别设置接地层， 或者， 第一外导体和第二 外导体可以直接连接到待连接的高频器件， 例如： 滤波器等器件的腔壁上来 实现接地。
本发明实施例提供的高频信号传输装置， 每对公头和母头 （即第一器件 和第二器件）之间为可插拔结构， 具体可以将第一内导体和第二内导体之间 设置成可插拔结构， 也可以将第一外导体和第二外导体之间设置成可插拔结 构。
其中， 第一内导体和第二内导体的位置对应设置， 二者之间设有第一绝 缘介质， 该第一绝缘介质可以是塑料介质或者喷镀的一层绝缘介质， 也可以 是空气间隙， 还可以是绝缘介质层和空气间隙， 从而使得第一内导体和第二 内导体二者之间形成第一耦合结构。 该耦合结构可以是例如： 耦合电容结构 或耦合传输结构等。 第一内导体和第二内导体的形状、 大小、 径向距离以及 形成的耦合面积均可以根据实际连接的高频器件对电气指标的要求来确定， 例如： 第一内导体和第二内导体之间的径向间隙可以设置的足够大， 二者的 轴向配合长度可以设置的足够短， 以提高系统的容差。 公头或母头上的内导 体可以做成一端固定， 另一端可绕固定端灵活浮动的杆状结构， 从而提高系 统的容差。
类似的， 第一外导体和第二外导体的位置对应设置， 二者之间设有第二 绝缘介质， 该第二绝缘介质也可以是塑料介质或者喷镀的一层绝缘介质， 也 可以是空气间隙， 还可以是绝缘介质层和空气间隙， 从而使得第一外导体和 第二外导体二者之间形成第二耦合结构。 该耦合结构同样可以是例如： 耦合 电容结构或耦合传输结构等。 第一外导体和第二外导体的形状、 大小、 径向 距离以及形成的耦合面积也可以根据实际的电气指标要求来确定。
通过第一内导体和第二内导体之间形成的耦合结构、 第一外导体和第二 外导体之间形成的耦合结构， 能够实现在第一器件和第二器件所连接的两个 高频器件之间传输高频信号。 由于耦合结构能够实现第一器件和第二器件这 两个导体之间不直接接触而传输高频信号， 因此， 对基站天线工作的电磁频 率范围内的信号或微波频率范围内的信号能够表现出相对低的电抗值， 并且 能够保证公头和母头上同轴的内外导体阻抗匹配， 降低了导体和导体之间接 触不良而产生的互调信号。
本发明实施例提供的高频信号传输装置， 可以包括至少一对可插拔连接 的第一器件和第二器件， 作为一种可行的实施方式， 任一对可插拔连接的第 一器件和第二器件中， 第一内导体可以与另一对可插拔连接的第一器件和第 二器件中的第一内导体连接， 第一外导体可以与另一对可插拔连接的第一器 件和第二器件中的第一外导体连接； 和 /或， 任一对可插拔连接的第一器件和 第二器件中， 第二内导体可以与另一对可插拔连接的第一器件和第二器件中 的第二内导体连接， 第二外导体可以与另一对可插拔连接的第一器件和第二 器件中的第二外导体连接。
作为另一种可行的实施方式， 本发明实施例提供的高频信号传输装置， 其中的至少一对可插拔连接的第一器件和第二器件， 可以设置在同一部件， 例如： 设置在同一块板上； 或者， 还可以设置在同一高频器件上， 例如： 设 置在同一滤波器上。 即， 相邻的两对可插拔连接的第一器件和第二器件之间 可以没有功能上连接的， 而是通过第三方固定件组成陈列。
高频信号传输装置中， 各对可插拔连接的第一器件和第二器件的布局可 以根据高频信号的输入、 输出位置进行调整。
本发明提供的高频信号传输装置， 每对可插拔连接的第一器件和第二器 件， 可适用于一对待连接的高频器件， 或者适用于一对待连接的高频器件中 的一对待连接的端口。 因此， 本发明提供的高频信号传输装置， 可以用于将 一对具有一个或多于一个端口的高频器件连接起来， 也可以用于将一对以上 高频器件连接起来。
本发明实施例提供的高频信号传输装置， 其中每对可插拔连接的第一器 件和第二器件中， 内导体和内导体之间、 外导体和外导体之间分别设置绝缘 介质， 使高频信号传输装置的第一器件的内导体和第二器件的内导体之间、 第一器件的外导体和第二器件的外导体之间分别形成非直接电接触的耦合结 构， 从而降低了互调信号， 这样的信号传输结构用于基站中传输高频信号， 可以提高接收机的灵敏度， 在通信系统中， 可以提高通话质量、 系统载波干 扰比和通信系统的容量。
以上描述了本发明实施例提供的高频信号传输装置中第一器件和第二器 件的第一内导体和第二内导体之间， 第一外导体和第二外导体之间形成耦合 结构。 以下具体给出几种第一器件和第二器件相互配合的具体结构。
图 1 为本发明一个实施例提供的高频信号传输装置的侧剖视图， 如图 1 所示，本实施例中，第一器件与高频器件连接的输入 /输出可以通过电缆实现， 还可以通过现有的其他方式实现。
第一器件包括第一内导体 1和第一外导体 2, 还可以进一步包括第一接 地层 3; 第二器件包括第二内导体 4和第二外导体 5 , 还可以进一步包括第二 接地层 6;
第一外导体 2和第一接地层 3均可以釆用金属材料， 也可以釆用印刷电 路板（Printed Circuit Board, PCB )制成。 作为一种可行的实施方式， 第一外 导体 2和第一接地层 3可以为一体成型的一块金属板或 PCB板， 即， 这块金 属板或 PCB板在功能上既可以作为第一外导体 2, 又可以作为第一接地层 3。 作为另一种可行的实施方式， 第一外导体 2和第一接地层 3还可以是两个独 立成型的结构， 例如： 可以是两块金属板或 PCB板， 这两块金属板或 PCB 板可以在厚度方向上连接形成平板结构，也可以沿金属板或 PCB板延展方向 连接形成平板结构。
第二接地层 6可以设置成平板结构， 第二外导体 5设置在第二接地层 6 上， 且第二外导体 5可以呈套筒结构、 围设在第二内导体 4外围。 其中， 第 二接地层 6也可以釆用金属材料或者是 PCB板。
可选的， 第一外导体 2和第二外导体 5之间的第二绝缘介质 8可以设置 在第一外导体 2中面向第二外导体 5的表面上、且与第二外导体 5对应设置。 该第二绝缘介质 8可以是塑料等绝缘介质层或者是喷镀的一层绝缘介质， 还 可以是空气间隙， 还可以是绝缘介质层和空气间隙， 从而使第一外导体 2和 第二外导体 5形成了第二耦合结构， 实现了第一器件和第二器件所连接的两 个高频器件之间高频信号通过第一外导体 2和第二外导体 5进行传输。
可选的， 第一内导体 1和第二内导体 4之间的第一绝缘介质 7可以为圓 柱体。 作为一种可行的实施方式， 第一绝缘介质 7可以设置在第一内导体 1 上， 第二内导体 4可以呈套筒结构， 当第一器件和第二器件插接时， 第二内 导体 4可以围设在第一绝缘介质 7外围； 作为另一种可行的实施方式， 第一 绝缘介质 7可以设置在第二内导体 4上， 第一内导体 1可以围设在第一绝缘 介质 7外围。
可选的， 第二内导体 4靠近第一内导体 1的一端可以呈套筒结构， 相应 的， 还可以将第一内导体 1靠近第二内导体 4的一端设置为外径和第二内导 体 4呈套筒结构的一端的内径尺寸相当的圓柱体， 第一绝缘介质 7可以包裹 在该圓柱体的外围； 当第一器件和第二器件插接时， 第二内导体 4可以围设 在第一绝缘介质 7外围； 或者， 第一内导体 1靠近第二内导体 4的一端可以 呈套筒结构， 相应的， 还可以将第二内导体 4靠近第一内导体 1的一端设置 为外径和第一内导体 1呈套筒结构的一端的内径尺寸相当的圓柱体， 第一绝 缘介质 7可以包裹在该圓柱体的外围； 当第一器件和第二器件插接时， 第一 内导体 1可以围设在第一绝缘介质 7外围。
通过以上设置， 可以使第一内导体 1和第二内导体 4之间构成可插拔结 构， 第一内导体 1和第二内导体 4之间形成了第一耦合结构， 实现了第一器 件和第二器件所连接的两个高频器件之间高频信号通过第一内导体 1和第二 内导体 4进行传输。
可选的， 第一内导体 1与第一接地层 3或第一外导体 2之间可以通过第 三绝缘介质 9连接， 以使第一内导体 1和第一外导体 2之间形成用于传输高 频信号的第一传输线； 和 /或， 第二内导体 4与第二接地层 6或第二外导体 5 之间也可以通过第四绝缘介质 10连接，以使第二内导体 4和第二外导体 5之 间形成用于传输高频信号的第二传输线。 需要说明的是， 第一传输线为第一 内导体 1、 第三绝缘介质 9与第一接地层 3 , 或者第一内导体 1、 第三绝缘介 质 9与第一外导体 2共同形成的具有传输高频信号功能的功能线。 同样， 第 二传输线为第二内导体 4、 第四绝缘介质 10与第二接地层 6, 或者第二内导 体 4、 第四绝缘介质 10与第二外导体 5共同形成的具有传输高频信号功能的 功能线。
如图 1所示， 第一内导体 1可以通过电缆或者其他方式与一高频器件电 连接， 第一内导体 1与高频器件的连接处作为高频信号的输入 /输出， 第一内 导体 1和第一外导体 2之间形成第一传输线， 第一外导体 2与第一接地层 3 连接， 实现第一内导体 1和第一外导体 2从高频器件上接收高频信号或者向 高频器件上发送高频信号； 同样， 第二内导体 4可以通过电缆或者其他方式 与另一高频器件电连接， 第二内导体 4与高频器件的连接处作为高频信号的 输入 /输出， 第二内导体 4和第二外导体 5之间形成第二传输线， 第二外导体 5与第二接地层 6连接， 实现第二内导体 4和第二外导体 5从高频器件上接 收高频信号或者向高频器件上发送高频信号。 可以理解的是， 这仅为一种可 行的实施方式， 实际上， 第一外导体 2和第二外导体 5均可以通过电缆或连 接器与和高频器件直接电连接。 或者， 还可以是高频器件与第一接地层 3和 第二接地层 6电连接， 第一内导体 1和第一外导体 2通过探针连接到第一接 地层 3上， 第二内导体 4和第二外导体 5通过探针连接到第二接地层 6上。
进一步的， 在图 1所示实施例的基础上， 还可以对第二外导体 5进行局 部减重处理， 例如如图 2所示， 将第二外导体 5的圓环体的外侧部分挖去， 保留靠近第二内导体 4的部分以及靠近第一外导体 2的部分， 以减轻高频信 号传输装置整体的重量， 以实现高频信号传输装置的轻量化。
为了增强耦合程度， 以提高高频信号的传输效率， 可选的， 如图 3所示， 第一绝缘介质 7可以设置在第一内导体 1上， 且第一绝缘介质 7中可以开设 至少一个孔槽 71 , 第二内导体 4上可以设有至少一个针 11 , 针 11被包裹于 孔槽 71中。在这种结构下，还可以适当地对第二外导体 5进行局部减重处理， 以减轻高频信号传输装置整体的重量， 利于高频信号传输装置的小型化。
图 1-图 3为本发明实施例提供的一种高频信号传输装置的可行结构， 图 4为本发明另一个实施例提供的高频信号传输装置的侧剖视图， 图 5为图 4 所示的高频信号传输装置与高频器件的连接结构示意图， 该实施例中， 为了 增加第一外导体 2和第二外导体 5耦合面的面积， 以增强耦合程度， 第一接 地层 3可以为平板结构， 第一外导体 2设置在第一接地层 3上， 且第一外导 体 2可以设置成套筒结构； 相应的， 第二接地层 6为平板结构， 第二外导体 5设置在第二接地层 6上， 第二外导体 5可以设置成套筒结构、 且围设在第 二内导体 4外围； 第一外导体 2可以与第一接地层 3连接， 或者与第一接地 层 3—体成型制成， 同样， 第二外导体 5也可以与第二接地层 6连接， 或者 与第二接地层 6—体成型制成。
当第一器件和第二器件插接时， 第一外导体 2可以全部或部分围设在第 二外导体 5的外围； 或者， 还可以是第二外导体 5全部或部分围设在第一外 导体 2的外围。
在图 4所示的高频信号传输装置结构下， 第二绝缘介质 8可以设置在第 一外导体 2中面向第二外导体 5的表面上， 和 /或， 第二绝缘介质 8还可以设 置在第二外导体 5中面向第一外导体 2的表面上， 从而使第一外导体 2和第 二外导体 5之间形成第二耦合结构。
其中， 第一外导体 2和第二外导体 5之间的耦合程度可以通过调节第一 外导体 2和第二外导体 5对应处的面积而增加或减少。 通常情况下， 第一外 导体 2和第二外导体 5对应处的面积越大， 耦合度越高； 相反， 第一外导体 2和第二外导体 5对应处的面积越小， 耦合程度越低。
与图 3所示的高频信号传输装置相类似的， 图 4所示的高频信号传输装 置中， 可选的， 第一内导体 1与第一接地层 3或第一外导体 2之间可以通过 第三绝缘介质 9连接， 以使第一内导体 1和第一外导体 2之间形成第一传输 线； 和 /或， 第二内导体 4与第二接地层 6或第二外导体 5之间也可以通过第 四绝缘介质 10连接，以使第二内导体 4和第二外导体 5之间形成第二传输线。 另外， 第一内导体 1和第二内导体 4之间的第一绝缘介质 7可以设置成 圓柱体。 可选的， 第一绝缘介质 7可以设置在第一内导体 1上， 第二内导体 4可以呈套筒结构， 当第一器件和第二器件插接时， 第二内导体 4可以围设 在第一绝缘介质 7外围； 或者， 第一绝缘介质 7可以设置在第二内导体 4上， 第一内导体 1 可以呈套筒结构， 当第一器件和第二器件插接时， 第一内导体
1可以围设在第一绝缘介质 7外围。 通过以上设置， 可以使第一内导体 1和 第二内导体 4之间构成可插拔结构。
可选的， 第二内导体 4靠近第一内导体 1的一端可以呈套筒结构， 相应 的， 还可以将第一内导体 1靠近第二内导体 4的一端设置为外径和第二内导 体 4呈套筒结构的一端的内径尺寸相当的设置为圓柱体， 第一绝缘介质 7可 以包裹在该圓柱体的外围； 当第一器件和第二器件插接时， 第二内导体 4可 以围设在第一绝缘介质 7外围； 或者， 第一内导体 1靠近第二内导体 4的一 端可以呈套筒结构， 相应的， 还可以将第二内导体 4靠近第一内导体 1的一 端设置为外径和第一内导体 1呈套筒结构的一端的内径尺寸相当的圓柱体， 第一绝缘介质 7可以包裹在该圓柱体的外围； 当第一器件和第二器件插接时， 第一内导体 1可以围设在第一绝缘介质 7外围。
可选的， 第一绝缘介质 7可以设置在第一内导体 1上， 且第一绝缘介质 7中可以开设至少一个孔槽 71 , 第二内导体 4上可以设有至少一个针 11 , 针 11被包裹于孔槽 71 中。 在这种结构下， 还可以适当地对第二外导体 5进行 局部减重处理， 以减轻高频信号传输装置整体的重量， 利于高频信号传输装 置的小型化。
可选的， 如图 5所示， 第一器件和第二器件， 分别通过输入 /输出与高频 器件连接， 对于每对可插拔设置的第一器件和第二器件中， 第一内导体 1和 第二内导体 4之间可以设置屏蔽材料 12 , 例如： 可以在第一内导体 1和第二 内导体 4之间设置高介电常数材料， 同样， 第一外导体 2和第二外导体 5之 间也可以设置屏蔽材料 12,从而提高第一器件和第二器件自身的抗干扰能力， 并且减少对其他可插拔设置的第一器件和第二器件的干扰， 提高各对可插拔 设置的第一器件和第二器件之间的隔离度。
图 6为本发明再一个实施例提供的高频信号传输装置的侧剖视图， 该实 施例中， 为了增加第一外导体 2和第二外导体 5耦合面的面积， 以增强耦合 程度， 还可以将第一接地层 3为平板结构， 第一外导体 2设置在第一接地层 3上， 且第一外导体 2可以呈双层套筒结构； 相应的， 第二接地层 6可以设 置为平板结构， 第二外导体 5设置在第二接地层 6上， 且第二外导体 5可以 呈套筒结构、 围设在第二内导体 4外围； 当第一器件和第二器件插接时， 第 二外导体 5位于第一外导体 2所呈的双层套筒之间；
可以理解的是， 与图 6相类似的， 还可以将第一接地层 3设置为平板结 构， 第一外导体 2设置在第一接地层 3上， 且第一外导体 2可以呈套筒结构； 相应的， 可以将第二接地层 6为平板结构， 第二外导体 5设置在第二接地层 6上， 且第二外导体可以呈双层套筒结构、 围设在第二内导体 4外围； 当第 一器件和第二器件插接时， 第一外导体 2位于第二外导体 5所呈的双层套筒 之间。
其中， 第二绝缘介质 8可以设置在第一外导体 2中面向第二外导体 5的 表面上， 和 /或， 第二绝缘介质还可以设置在第二外导体 5中面向第一外导体 2的表面上， 以使第一外导体 2和第二外导体 5之间形成第二耦合结构。
与图 4所示实施例类似的， 第一外导体 2和第二外导体 5之间的耦合程 度可以通过调节第一外导体 2和第二外导体 5对应处的面积而增加或减少。
另外， 可选的， 第一内导体 1与第一接地层 3或第一外导体 2之间也可 以通过第三绝缘介质 9连接， 以使第一内导体 1和第一外导体 2之间形成第 一传输线； 和 /或， 第二内导体 4与第二接地层 6或第二外导体 5之间也可以 通过第四绝缘介质 10连接，以使第二内导体 4和第二外导体 5之间形成第二 传输线。
可选的， 第一绝缘介质 7可以设置在第一内导体 1上， 且第一绝缘介质 7中可以开设至少一个孔槽 71 , 第二内导体 4上可以设有至少一个针 11 , 针 11被包裹于孔槽 71 中。 在这种结构下， 还可以适当地对第二外导体 5进行 局部减重处理， 以减轻高频信号传输装置整体的重量， 利于高频信号传输装 置的小型化。
同样， 第一绝缘介质 7还可以设置在第二内导体 4上， 且第一绝缘介质 7中可以开设至少一个孔槽 71 , 第一内导体 1上还可以设有至少一个针 11 , 针 11被包裹于孔槽 71中。 在这种结构下， 可以适当地对第一外导体 2进行 局部减重处理， 以减轻高频信号传输装置整体的重量。 为了使高频信号传输装置的结构更加紧凑， 如图 7所示， 本发明另一个 实施例还提供了一种高频信号传输装置， 该实施例中， 第一外导体 2和第一 接地层 3可以为一体成型的一块金属板或 PCB板， 即， 这块金属板或 PCB 板在功能上既可以作为第一外导体 2, 又可以作为第一接地层 3。 或者， 第一 外导体 2和第一接地层 3还可以是两个独立成型的结构， 例如： 可以是两块 金属板或 PCB板， 这两块金属板或 PCB板可以在厚度方向上连接形成平板 结构， 也可以沿金属板或 PCB板延展方向连接形成平板结构。 而将第二内导 体 4所呈的套筒侧面边缘与第二外导体 5和第二接地层 6连接形成的平板结 构连接。 在这种结构下， 高频信号传输装置的第一器件和第二器件中的内导 体可以设置在需要连接的两个高频器件的其中一个内部， 以利于基站系统的 集成设计。
其中， 第二绝缘介质 8可以设置在第一外导体 2中面向第二外导体 5的 表面上， 和 /或， 第二绝缘介质 8还可以设置在第二外导体 5中面向第一外导 体 2的表面上。
可选的， 第一内导体 1和第二内导体 4之间的第一绝缘介质 7也可以为 圓柱体， 第二内导体 4为套筒结构； 当第一器件和第二器件插接时， 第二内 导体 4围设在第一绝缘介质 7外围， 从而使第一内导体 1和第二内导体 4之 间构成可插拔结构。
以上提供了高频信号传输装置的几种可行结构， 进一步的， 本发明实施 例还提供高频信号传输系统， 该高频信号传输系统包括： 至少两个高频器件， 至少两个高频器件之间通过至少一个高频信号传输装置连接；
其中， 高频信号传输装置包括： 至少一对可插拔连接的第一器件和第二 器件； 第一器件包括第一内导体和第一外导体， 第二器件包括第二内导体和 第二外导体；
第一内导体和第二内导体对应设置， 第一内导体和第二内导体之间设有 第一绝缘介质， 以使第一内导体和第二内导体构成用于传输高频信号的第一 耦合结构； 第一外导体和第二外导体对应设置， 第一外导体和第二外导体之 间设有第二绝缘介质， 以使第一外导体和第二外导体构成用于传输高频信号 的第二耦合结构。
本实施例涉及的高频器件可以是基站中的任何有源器件或无源器件， 例 如： 滤波系统、 滤波器件、 收发设备、 功放器件、 分功器件、 合路器或天线 等， 也可以是微波设备中的任何有源器件或无源器件。 基站中的这些高频器 件之间可以釆用本发明实施例提供的高频信号传输装置连接。 高频信号传输 装置可以通过线缆或者现有的各种连接方式与高频器件连接。
可选的， 高频信号传输装置中的第一器件或第二器件可以独立设置， 或 者， 第一器件和 /或第二器件还可以与高频器件一体集成设置。 例如： 第一外 导体或第二外导体可以与滤波器等高频器件的腔壁一体成型制成， 第一内导 体或第二内导体可以通过介质固定在滤波器等高频器件上等等。
图 8所示为高频信号传输系统中的第二外导体 5与滤波器集成设置的结 构示意图， 该实施例中， 高频器件通过高频信号传输装置与滤波器 C连接， 其中， 第二外导体与滤波器的腔壁一体成型制成。 其中， 滤波器内腔中具有 一个谐振单元， 高频信号传输装置通过第二内导体 4与第二外导体 5之间形 成的第二传输线将高频信号传输到滤波器的谐振单元上。 需要说明的是， 第 二传输线为第二内导体 4、 第四绝缘介质 10与第二外导体 5共同形成的具有 传输高频信号功能的功能线。
其中， 高频信号传输装置的结构可参见前述的高频信号传输装置实施例 中的描述， 在此不再赘述。
高频信号传输装置中， 每对可插拔连接的第一器件和第二器件， 可适用 于一对待连接的高频器件， 或者适用于一对待连接的高频器件中的一对待连 接的端口。 因此， 本发明提供的高频信号传输装置， 可以将一对具有一个或 多个端口的高频器件连接起来， 可以将多对高频器件连接起来。
如图 9所示， 高频信号传输装置中， 各对可插拔连接的第一器件和第二 器件的布局可以根据高频信号的输入、 输出位置进行调整。
可选的， 为避免谐振， 高频信号传输装置的第一接地层和第二接地层可 以釆用 PCB板或者类似材料； 进一步的， 可以将各高频信号传输装置或者每 个高频信号传输装置中的各对可插拔连接的第一器件和第二器件釆用非金属 材料环 13隔开， 从而使各对可插拔连接的第一器件和第二器件不共地。
作为一种可行的实施方式， 高频信号传输装置中任一对可插拔连接的第 一器件和第二器件中， 第一内导体和第一外导体可以分别通过第一内导体和 第一外导体之间形成的第一传输线与高频器件连接， 或者， 第二内导体和第 二外导体可以分别通过第二内导体和第二外导体之间形成的第二传输线与高 频器件连接。
作为另一种可行的实施方式， 如图 10所示， 高频信号传输装置中的至少 一对可插拔连接的第一器件和第二器件， 可以设置在同一部件 13 , 例如： 设 置在同一块板上； 或者， 还可以设置在同一高频器件上， 例如： 设置在同一 滤波器上。
本实施例提供的高频信号传输系统， 高频器件之间釆用高频信号传输装 置连接， 高频信号传输装置的第一器件和第二器件上的内导体和内导体之间、 外导体和外导体之间分别设置绝缘介质， 使高频信号传输装置的第一器件和 第二器件上的内导体和内导体之间、 外导体和外导体之间分别形成非直接电 接触的耦合结构， 从而降低了互调信号。 这样的高频信号传输系统用在基站 中传输高频信号， 可以提高基站接收机的灵敏度、 通话质量、 系统载波干扰 比和通信系统的容量。
本发明实施例还提供一种基站， 包括本发明实施例提供的任意一种高频 信号传输装置或高频信号传输系统， 其中， 高频信号传输装置的具体结构和 功能可以参见本发明提供的高频信号传输装置实施例， 高频信号传输系统的 具体结构和功能可以参见本发明提供的高频信号传输系统实施例， 在此不再 赘述。 本发明实施例提供的基站， 通过本发明实施例提供的任意一种高频信 号传输装置或高频信号传输系统， 实现提高基站接收机的灵敏度、 通话质量、 系统载波干扰比和通信系统的容量。
最后应说明的是： 以上实施例仅用以说明本发明的技术方案， 而非对其 限制； 尽管参照前述实施例对本发明进行了详细的说明， 本领域的普通技术 人员应当理解： 其依然可以对前述各实施例所记载的技术方案进行修改， 或 者对其中部分技术特征进行等同替换； 而这些修改或者替换， 并不使相应技 术方案的本质脱离本发明各实施例技术方案和范围。

Claims

权利 要求
1、 一种高频信号传输装置， 其特征在于， 包括： 至少一对可插拔连接 的第一器件和第二器件； 所述第一器件包括第一内导体和第一外导体， 所述 第二器件包括第二内导体和第二外导体；
所述第一内导体和所述第二内导体对应设置， 所述第一内导体和所述第 二内导体之间设有第一绝缘介质， 以使所述第一内导体和所述第二内导体构 成用于传输高频信号的第一耦合结构； 所述第一外导体和所述第二外导体对 应设置， 所述第一外导体和所述第二外导体之间设有第二绝缘介质， 以使所 述第一外导体和所述第二外导体构成用于传输高频信号的第二耦合结构。
2、 根据权利要求 1所述的高频信号传输装置， 其特征在于， 所述第一器 件还包括第一接地层， 所述第一外导体与所述第一接地层连接； 所述第二器 件还包括第二接地层， 所述第二外导体与所述第二接地层连接。
3、 根据权利要求 2所述的高频信号传输装置， 其特征在于， 所述第一内 导体与所述第一接地层或第一外导体之间通过第三绝缘介质连接， 以使所述 第一内导体和所述第一外导体形成第一传输线； 和 /或， 所述第二内导体与所 述第二接地层或第二外导体之间通过第四绝缘介质连接， 以使所述第二内导 体和所述第二外导体之间形成第二传输线。
4、 根据权利要求 1至 3任一项所述的高频信号传输装置， 其特征在于， 所述第一绝缘介质设置在所述第一内导体上， 且所述第一绝缘介质中开设至 少一个孔槽， 所述第二内导体上设有至少一个针， 所述针在所述第一器件和 所述第二器件插接时被包裹于所述孔槽中。
5、 根据权利要求 2至 4任一项所述的高频信号传输装置， 其特征在于， 所述第一外导体和所述第一接地层连接形成平板结构；
所述第二接地层为平板结构，所述第二外导体设置在所述第二接地层上， 且所述第二外导体呈套筒结构并围设在所述第二内导体外围。
6、 根据权利要求 5所述的高频信号传输装置， 其特征在于， 所述第二绝 缘介质设置在所述第一外导体中面向所述第二外导体的表面上、 且与所述第 二外导体对应设置。
7、 根据权利要求 2至 4任一项所述的高频信号传输装置， 其特征在于， 所述第一接地层为平板结构， 所述第一外导体设置在所述第一接地层上、 且 所述第一外导体呈套筒结构；
所述第二接地层为平板结构，所述第二外导体设置在所述第二接地层上， 且所述第二外导体呈套筒结构并围设在所述第二内导体外围；
所述第一器件和所述第二器件插接时， 所述第一外导体围设在所述第二 外导体的外围， 或者， 所述第二外导体围设在所述第一外导体的外围。
8、根据权利要求 2至 4任一项所述的高频信号传输装置，其特征在于， 所述第一接地层为平板结构， 所述第一外导体设置在所述第一接地层上、 且 所述第一外导体呈双层套筒结构；
所述第二接地层为平板结构，所述第二外导体设置在所述第二接地层上， 且所述第二外导体呈套筒结构、 围设在所述第二内导体外围； 所述第一器件 和所述第二器件插接时， 所述第二外导体位于所述第一外导体所呈的双层套 筒之间；
或者， 所述第一接地层为平板结构， 所述第一外导体设置在所述第一接 地层上、 且所述第一外导体呈套筒结构； 所述第二接地层为平板结构， 所述 第二外导体设置在所述第二接地层上， 且所述第二外导体呈双层套筒结构、 围设在所述第二内导体外围； 所述第一器件和所述第二器件插接时， 所述第 一外导体位于所述第二外导体所呈的双层套筒之间。
9、 根据权利要求 1至 8任一项所述的高频信号传输装置， 其特征在于， 所述第一绝缘介质为圓柱体、 且设置在所述第一内导体上， 所述第二内导体 呈套筒结构； 所述第一器件和所述第二器件插接时， 所述第二内导体围设在 所述第一绝缘介质外围。
10、根据权利要求 1至 8任一项所述的高频信号传输装置， 其特征在于， 所述第二内导体靠近第一内导体的一端呈套筒结构， 所述第一内导体靠近第 二内导体的一端为外径与所述第二内导体呈套筒结构的一端的内径尺寸相当 的圓柱体、 且所述第一绝缘介质包裹在所述圓柱体外围； 所述第一器件和所 述第二器件插接时， 所述第二内导体围设在所述第一绝缘介质外围。
11、 根据权利要求 2至 4任一项所述的高频信号传输装置， 其特征在于， 所述第一外导体和所述第一接地层连接形成平板结构， 所述第二外导体和所 述第二接地层连接形成平板结构， 所述第二内导体所呈的套筒侧面边缘与所 述第二外导体和所述第二接地层连接形成的平板结构连接。
12、根据权利要求 1至 11任一项所述的高频信号传输装置，其特征在于， 所述第二绝缘介质设置在所述第一外导体中面向所述第二外导体的表面上 , 和 /或， 所述第二绝缘介质设置在所述第二外导体中面向所述第一外导体的表 面上。
13、根据权利要求 1至 12任一项所述的高频信号传输装置，其特征在于， 所述第一外导体和所述第二外导体之间设有屏蔽材料， 和 /或， 所述第一内导 体和所述第二内导体之间设有屏蔽材料。
14、根据权利要求 1至 13任一项所述的高频信号传输装置，其特征在于， 任一对可插拔连接的第一器件和第二器件中， 第一内导体与另一对可插拔连 接的第一器件和第二器件中的第一内导体连接， 第一外导体与另一对可插拔 连接的第一器件和第二器件中的第一外导体连接；
和 /或， 任一对可插拔连接的第一器件和第二器件中， 第二内导体与另一 对可插拔连接的第一器件和第二器件中的第二内导体连接， 第二外导体与另 一对可插拔连接的第一器件和第二器件中的第二外导体连接。
15、根据权利要求 1至 14任一项所述的高频信号传输装置，其特征在于， 所述至少一对可插拔连接的第一器件和第二器件设置在同一部件或高频器件 上。
16、 一种高频信号传输系统， 其特征在于， 包括： 至少两个高频器件， 所述至少两个高频器件之间通过至少一个如权利要求 1至 15任一项所述的高 频信号传输装置连接。
17、 根据权利要求 16所述的高频信号传输装置系统， 其特征在于， 所述 高频信号传输装置通过线缆与所述高频器件连接。
18、 根据权利要求 16或 17所述的高频信号传输系统， 其特征在于， 所 述高频信号传输装置中任一对可插拔连接的第一器件和第二器件中， 所述第 一内导体和所述第一外导体分别通过所述第一内导体和所述第一外导体之间 形成的第一传输线与所述高频器件连接， 或者， 所述第二内导体和第二外导 体分别通过所述第二内导体和所述第二外导体之间形成的第二传输线与所述 高频器件连接。
19、 根据权利要求 16至 18中任一项所述的高频信号传输系统， 其特征 在于， 所述至少两个高频器件中的任意一个为滤波设备、 功放设备、 收发设 备中的一种。
20、 根据权利要求 16至 19中任一项所述的高频信号传输系统， 其特征 在于， 所述高频信号传输装置中的第一器件或第二器件独立设置， 或者， 第 一器件和 /或第二器件与所述高频器件一体集成设置。
21、 一种基站， 其特征在于， 包括： 如权利要求 1至 15任一项所述的高 频信号传输装置， 或者包括： 如权利要求 16至 20任一项所述的高频信号传 输系统。
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