WO2013087677A1 - Contact souple, connecteur enfichable et carte de circuits imprimés - Google Patents
Contact souple, connecteur enfichable et carte de circuits imprimés Download PDFInfo
- Publication number
- WO2013087677A1 WO2013087677A1 PCT/EP2012/075193 EP2012075193W WO2013087677A1 WO 2013087677 A1 WO2013087677 A1 WO 2013087677A1 EP 2012075193 W EP2012075193 W EP 2012075193W WO 2013087677 A1 WO2013087677 A1 WO 2013087677A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- spring contact
- recess
- width
- basic shape
- contact according
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2442—Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
Definitions
- the invention relates to a spring contact, a connector and a printed circuit board.
- Such spring contacts are needed to make a conductive connection between a conductor connected to the spring contact or a conductor track and a contact point.
- Spring contacts are used for example in connectors or on printed circuit boards.
- EP 1 523 069 A1 shows an arcuate metallic contact spring which is arranged on a carrier plate.
- Metallic contact springs are usually produced in stamping and bending technology. This technology reaches its limits, especially for very small components.
- DE 197 17 882 A1 discloses a spring contact, which are made of a metallizable plastic. The metallizable plastic is provided in a chemical process with a conductive coating, such as a copper alloy.
- the metallic, conductive coating is often detached from the surface and / or damaged. As a result, the conductive connection between the contact points can be interrupted.
- the object of the invention is to propose a spring contact, which is versatile and has a long life.
- the object is achieved by a spring contact according to claim 1 or 2, a connector according to claim 9 and a circuit board according to claim 10.
- the spring contact is fixed at one end to a basic form, for example a printed circuit board or a plug connector, and is electrically conductively connected to a conductor track.
- the second end is inclined away from the basic shape and can be moved elastically towards or away from the basic shape.
- the spring contact has resilient properties.
- An alternative embodiment of the spring contact is fixed at both ends to the basic shape.
- the middle area is resilient from the basic shape.
- All embodiments of the spring contact consist of a metallizable plastic, which is at least partially provided with a conductive, metallic coating.
- the metallic coating will form a defined trace (with a trace width) on the surface of the spring contact.
- the conductive coating provides a conductive connection between a contact pad on the base mold and another contact pad which is contacted by the second end of the spring contact.
- the metallizable plastic consists of a material that can be processed using the MID technique.
- the MID (Molded Interconnection Devices) technology is mainly used to create complex, 3-dimensional trace structures on components that provide circuit board functionality.
- LDS liquid crystal polymers
- LCP Liquid Crystal Polymer
- Irradiation with a laser selectively activates the areas on which printed conductor structures are to be formed.
- Irradiation with the laser activates metal (eg palladium) that is chemically bound in the polymer, forming metal nuclei on the surface.
- metal eg palladium
- a conductive metal layer is subsequently formed by electroless, chemical deposition on the metal nuclei formed.
- the first copper layer essentially serves the conductivity.
- even more metallic layers can be deposited. These additional layers also serve for mechanical stability and corrosion protection.
- the metallizable plastic can be made in a two-component injection molding process.
- a metallizable thermoplastic for example a palladium-doped plastic
- a tool whereby the surface to be provided with a conductive coating is imaged.
- the areas between and around these surfaces are encapsulated with a non-metallisable thermoplastic, whereby the workpiece - here the spring contact- receives its final shape.
- the selective metallization of the surfaces to be provided with a conductive coating takes place in an electrolytic bath by means of a galvanic process.
- a metallic substance preferably copper or a copper alloy, adheres to the doping.
- other metal compounds can be applied in further steps.
- At least one trench-shaped depression is provided in the plastic body through which the conductor runs at least partially.
- a second trench-shaped depressions is introduced between the first end and the second end of the spring contact. This is special advantageous if more complex bending lines are created by mechanical stress.
- the recess has substantially the shape of a cuboid or cuboid.
- the depression is ideally positioned at the same distance from the first and second end, ie approximately in the middle. In this area, the material experiences the strongest stress.
- the surfaces averaging away from the bottom of the depression form an angle with an orthogonal of the bottom.
- this angle is between 5 ° and 75 °.
- the angle is between 15 ° and 45 °.
- Fig. 1 is a perspective view of a first embodiment of a
- Fig. 3 is a sectional view of a section of the spring contact in the region of the recess and
- Fig. 4 is a schematic sectional view of an alternative embodiment of the spring contact.
- FIG. 1 shows a perspective view of a first embodiment of a spring contact 1.
- the first end A of the spring contact 1 is fixed to a basic shape 2 (eg, a connector or a printed circuit board).
- the second end B is vertically spaced from this basic shape 2 and can be resiliently moved toward or away from it. As a rule, a force in the direction of the arrow 5 is exerted on the second end.
- a conductor track 3 is introduced, which is connected at one end to a conductor track 3 on the base mold 2.
- the trace 3 at the second end B of the spring contact is later in contact with a contact point (not shown), for.
- a contact point (not shown), for.
- a recess 4 with a width 41 and a length 22 is introduced.
- the recess 4 has a substantially parallelepiped shape.
- the depth T of the recess is dependent on the neutral fiber of the selected material, as described above.
- FIG. 3 shows an alternative form of recess which can be used in all the embodiments of the spring contact listed.
- the alternative depression has essentially the shape of a squaring.
- the surfaces 6, 7 which are angled away from the bottom 8 of the depression each include an angle ⁇ 1, a 2 with an orthogonal 9 of the bottom 8.
- FIG. 4 shows the schematic illustration of an alternative embodiment of the spring contact 1 '.
- Both ends A, B are fixed on the basic shape 2.
- a force is exerted in the direction of the arrow 5 'on the central region of the spring contact V.
- the spring contact V comprises two recesses 4, which are each arranged between an end A, B and the point of application of the force.
- a conductor is not shown here for illustrative reasons.
- the neutral fiber of the (plastic) basic body represents that part of the plastic basic body which experiences a lower mechanical stress under a bending load. In other words, the portion of the body which substantially corresponds to the neutral phase remains substantially free of deformation.
- the length of the strip 3 within the recess 4 corresponds to the length 42 of the recess 4.
- the width 41 of the recess 4 is wider than the width 31 of the conductor 3. In other words, the conductor 3 does not fill the entire width 41 of the recess 4 off.
- sections of the depression 4 can thus optionally be present, which are not covered by the conductor track 3. Thus, the conductor does not reach the edge of the depression. This is advantageous, since thus the mechanical stress on the conductor track is reduced.
- the basic form 2 may be part of a connector or a printed circuit board or may be connected to a connector or a printed circuit board.
- the spring contact according to the invention for a connector or a printed circuit board has a recess with a first width and a conductor track with a second width.
- the conductor also extends along the spring contact through the depression.
- the first width of the recess can be greater than the second width of the conductor track.
- the recess preferably extends into the region of a neutral fiber of the spring contact.
- the neutral fiber represents that area of the spring contact which remains essentially free of deformation during a bending stress.
- the invention also relates to a connector having at least one spring contact for generating an electrical connection.
- the spring contact is at one end to a basic shape, i. H. Part of the connector, fixed.
- the second end of the spring contact test is resiliently inclined away from the basic shape.
- On the surface of the spring contact is conductive material z. B. applied in the form of a conductor. Between the first and second end of the spring contact a trench-shaped depression is provided.
- the invention also relates to a printed circuit board with at least one spring contact for generating an electrical connection.
- the spring contact is fixed at one end to a basic shape and a second end of the spring contact is resiliently inclined away from the basic shape.
- On the surface of the spring contact is conductive material z. B. applied in the form of a conductor. Between the first and second end of the spring contact a trench-shaped depression is provided. LIST OF REFERENCE NUMBERS
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Contacts (AREA)
Abstract
L'invention concerne un contact souple qui est destiné à créer une liaison électrique et qui est relié par une extrémité à une forme de base, dont la deuxième extrémité s'éloigne élastiquement de la forme de base et sur la surface duquel est appliqué un matériau conducteur sous la forme d'au moins une piste conductrice. L'invention concerne en outre un contact souple qui est fixé par ses deux extrémités à une forme de base et dont la partie centrale s'éloigne élastiquement de la forme de base. Pour augmenter la stabilité de ces contacts souples, au moins un évidement en forme de tranchée est ménagé entre la première extrémité et la deuxième extrémité.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102011056261.3 | 2011-12-12 | ||
DE201110056261 DE102011056261B4 (de) | 2011-12-12 | 2011-12-12 | Federkontakt |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2013087677A1 true WO2013087677A1 (fr) | 2013-06-20 |
Family
ID=47504875
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2012/075193 WO2013087677A1 (fr) | 2011-12-12 | 2012-12-12 | Contact souple, connecteur enfichable et carte de circuits imprimés |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE102011056261B4 (fr) |
WO (1) | WO2013087677A1 (fr) |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19717882A1 (de) | 1997-04-28 | 1998-11-05 | Cherry Mikroschalter Gmbh | Schaltungsträger in Form eines spritzgegossenen Kunststoffverbindungsteils (MID) |
WO1999038232A1 (fr) * | 1998-01-23 | 1999-07-29 | Kinetrix, Inc. | Petit contacteur pour sondes de verification, mise sous boitier des puces et autres |
US20020053463A1 (en) | 1998-01-23 | 2002-05-09 | Alexander H. Slocum | Robust, small scale electrical contactor |
DE10132092A1 (de) | 2001-07-05 | 2003-01-23 | Lpkf Laser & Electronics Ag | Leiterbahnstrukturen und Verfahren zu ihrer Herstellung |
EP1523069A1 (fr) | 2003-10-10 | 2005-04-13 | Hirschmann Electronics GmbH & Co. KG | Ressort de contact pour amplificateur d'antenne |
US20050130462A1 (en) | 2003-12-15 | 2005-06-16 | Palo Alto Research Center, Incorporated | Stressed metal contact with enhanced lateral compliance |
US20060087032A1 (en) * | 2004-10-27 | 2006-04-27 | Sriram Muthukumar | Compliant interconnects for semiconductors and micromachines |
US20070269997A1 (en) | 1999-07-30 | 2007-11-22 | Formfactor, Inc. | Electronic components with plurality of contoured microelectronic spring contacts |
DE102007005654A1 (de) * | 2007-01-31 | 2008-08-07 | Hirschmann Car Communication Gmbh | Verbesserte Vorrichtung zur Kontaktierung einer Antennenstruktur auf einem elektrisch nicht leitfähigen Fahrzeugteil eines Fahrzeuges mit einem elektronischen Gerät |
US7649145B2 (en) | 2004-06-18 | 2010-01-19 | Micron Technology, Inc. | Compliant spring contact structures |
-
2011
- 2011-12-12 DE DE201110056261 patent/DE102011056261B4/de active Active
-
2012
- 2012-12-12 WO PCT/EP2012/075193 patent/WO2013087677A1/fr active Application Filing
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19717882A1 (de) | 1997-04-28 | 1998-11-05 | Cherry Mikroschalter Gmbh | Schaltungsträger in Form eines spritzgegossenen Kunststoffverbindungsteils (MID) |
WO1999038232A1 (fr) * | 1998-01-23 | 1999-07-29 | Kinetrix, Inc. | Petit contacteur pour sondes de verification, mise sous boitier des puces et autres |
US20020053463A1 (en) | 1998-01-23 | 2002-05-09 | Alexander H. Slocum | Robust, small scale electrical contactor |
US20070269997A1 (en) | 1999-07-30 | 2007-11-22 | Formfactor, Inc. | Electronic components with plurality of contoured microelectronic spring contacts |
DE10132092A1 (de) | 2001-07-05 | 2003-01-23 | Lpkf Laser & Electronics Ag | Leiterbahnstrukturen und Verfahren zu ihrer Herstellung |
EP1523069A1 (fr) | 2003-10-10 | 2005-04-13 | Hirschmann Electronics GmbH & Co. KG | Ressort de contact pour amplificateur d'antenne |
US20050130462A1 (en) | 2003-12-15 | 2005-06-16 | Palo Alto Research Center, Incorporated | Stressed metal contact with enhanced lateral compliance |
US7649145B2 (en) | 2004-06-18 | 2010-01-19 | Micron Technology, Inc. | Compliant spring contact structures |
US20060087032A1 (en) * | 2004-10-27 | 2006-04-27 | Sriram Muthukumar | Compliant interconnects for semiconductors and micromachines |
DE102007005654A1 (de) * | 2007-01-31 | 2008-08-07 | Hirschmann Car Communication Gmbh | Verbesserte Vorrichtung zur Kontaktierung einer Antennenstruktur auf einem elektrisch nicht leitfähigen Fahrzeugteil eines Fahrzeuges mit einem elektronischen Gerät |
Also Published As
Publication number | Publication date |
---|---|
DE102011056261A1 (de) | 2013-06-13 |
DE102011056261B4 (de) | 2013-09-19 |
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