WO2013086692A1 - 一种抛光装置 - Google Patents

一种抛光装置 Download PDF

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Publication number
WO2013086692A1
WO2013086692A1 PCT/CN2011/083918 CN2011083918W WO2013086692A1 WO 2013086692 A1 WO2013086692 A1 WO 2013086692A1 CN 2011083918 W CN2011083918 W CN 2011083918W WO 2013086692 A1 WO2013086692 A1 WO 2013086692A1
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Prior art keywords
polishing
ultrasonic transducer
polishing liquid
workpiece
housing
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PCT/CN2011/083918
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English (en)
French (fr)
Inventor
王君林
王绍治
刘健
马占龙
张玲花
Original Assignee
中国科学院长春光学精密机械与物理研究所
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Application filed by 中国科学院长春光学精密机械与物理研究所 filed Critical 中国科学院长春光学精密机械与物理研究所
Priority to PCT/CN2011/083918 priority Critical patent/WO2013086692A1/zh
Publication of WO2013086692A1 publication Critical patent/WO2013086692A1/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Definitions

  • the present invention relates to a polishing apparatus for performing a polishing treatment on a surface of a workpiece to be processed. Background technique
  • the conventional polishing method and the polishing device add a polishing liquid between the surface of the workpiece to be polished and the polishing disk, and the relative sliding of the polishing disk and the surface of the workpiece is utilized to realize the surface of the workpiece by the mechanochemical and physical effects of the polishing liquid and the surface of the workpiece. Polishing, and this often requires repeated iterations, and multiple corrections of the surface shape can ultimately achieve the desired optical surface.
  • the polishing disk is worn and has poor controllability.
  • the polishing based Vibrations of Liquid uses fluid as a polishing tool, and because of the geometrical adaptive ability of the fluid, good processing flatness can be obtained.
  • the polishing energy is provided by ultrasonic vibration. When ultrasonic vibration propagates in the liquid, a complex nonlinear phenomenon called "cavitation" occurs, and the cavitation bubble locally generates very high temperature and pressure, while the asymmetric air This will cause high-speed microjets.
  • the fluid molecules or the fine abrasive particles suspended therein are driven by this action to impact the surface of the workpiece, thereby achieving material removal.
  • the principle of the fluid vibration polishing device is: the whole workpiece is placed in a tank containing a polishing liquid, and an ultrasonic transducer is fixed outside the groove, and the transducer emits ultrasonic waves to drive the liquid to generate ultrasonic vibration.
  • the disadvantage of this method is: the whole workpiece is placed in the ultrasonic ultrasonic vibration field, all points on the surface of the workpiece will be removed, and the removal amount of each point is difficult to control, which also makes the current fluid vibration polishing not suitable as a surface shape. Correction method. Summary of the invention
  • the present invention provides a polishing apparatus according to the present invention, which can partially remove a workpiece, and can control the dwell time of each point by controlling the numerical control machine tool. That is, the surface shape can be corrected.
  • the polishing apparatus provided by the present invention has simple operation, low energy consumption, and short preparation time, thereby improving processing efficiency.
  • a polishing apparatus includes: a housing, ultrasonic transduction
  • the ultrasonic transducer is disposed in the housing and detachably coupled to the housing;
  • the connector is configured to be detachably coupled to the ultrasonic transducer, and
  • the connecting member is further arranged to connect the polishing device to an actuator of the numerical control machine tool;
  • the housing is provided with a polishing liquid inlet and a polishing liquid outlet, and the polishing liquid inlet is connected with the polishing liquid inlet connecting member, and the polishing liquid passes through
  • the polishing liquid inlet connecting member enters the casing, and the polishing liquid flows through the polishing liquid outlet to the surface of the workpiece to be polished, and the workpiece to be polished is polished.
  • it further includes a horn that is detachably coupled to the ultrasonic transducer at a lower portion of the ultrasonic transducer.
  • the position of the polishing liquid inlet is set to be lower in the vertical direction than the ultrasonic transducer.
  • a screw is connected between the housing and the ultrasonic transducer, and a sealing ring is disposed between the housing and the ultrasonic transducer.
  • the polishing liquid inlet connection is screwed to the polishing liquid inlet of the housing.
  • the ultrasonic transducer is a magnetostrictive transducer or a piezoelectric transducer.
  • the housing is a solid structure or a hollow structure or a knot comprising a vibration absorbing interlayer.
  • the diameter of the polishing liquid outlet is between 0.1 mm and 50 mm.
  • the present invention also provides a method for polishing a workpiece to be processed by the polishing apparatus of the present invention, comprising the steps of: connecting the polishing apparatus to an actuator of a numerically controlled machine tool, and the polishing apparatus and the apparatus The surface of the workpiece is adjusted to be at an angle; the polishing liquid outlet of the polishing device is slowly brought close to the surface of the workpiece to a certain distance; and the polishing liquid is supplied to the inner cavity of the housing of the polishing device to be polished.
  • the liquid fills the inner cavity of the casing and flows out from the polishing liquid outlet to the surface of the workpiece; the ultrasonic transducer is controlled to emit ultrasonic waves of a certain frequency and amplitude; and the polishing device is driven by the actuator of the numerical control machine tool A trajectory movement is predetermined to polish the workpiece to be processed.
  • the distance between the polishing liquid outlet and the surface of the workpiece to be processed is between 0.1 mm and 1000 mm.
  • the polishing apparatus provided in accordance with the present invention has at least one of the following advantageous effects:
  • the polishing apparatus of the present invention can perform partial polishing of the workpiece to facilitate control of the standing of each polishing point. The time is left to correct the surface shape while reducing the surface roughness of the workpiece.
  • the polishing apparatus has simple operation, low energy consumption, short preparation time, and improved processing efficiency.
  • FIG. 1 is a schematic illustration of a polishing apparatus in accordance with the present invention. detailed description
  • Figure 1 is a schematic illustration of a polishing apparatus in accordance with the present invention.
  • a polishing apparatus comprising: a housing 5, an ultrasonic transducer 3, a connector 1; an ultrasonic transducer 3 disposed within the housing 5 and detachably coupled to the housing 5, such as by a threaded connection
  • the connector 1 is arranged to be detachably connected to the ultrasonic transducer 3, for example by means of a screw 2, and the connector 1 is also arranged to connect the polishing device to the actuator of the numerically controlled machine tool;
  • the housing 5 is arranged There is a polishing liquid inlet and a polishing liquid outlet, and the polishing liquid inlet is connected to the polishing liquid inlet connection member 6, for example, by screwing, the polishing liquid enters the housing through the polishing liquid inlet connection member 6, and the polishing liquid passes through the polishing The liquid outlet flows to the surface of the workpiece 8 to be polished, and the workpiece 8 is polished.
  • the connector 1 can be a variety of taper shanks that are connected to the machine tool spindle, or can be interface members that are adapted to be coupled to other actuators.
  • the material of the connecting member 1 is a hard aluminum alloy.
  • the casing 5 can be made into a hollow structure for absorbing ultrasonic vibration energy, and the casing 1 can be made into a solid structure or a structure including a vibration absorbing interlayer.
  • the material of the casing 5 may be a metal material, for example, a hard aluminum alloy, and the material of the casing 5 may also be a polymer material.
  • the polishing liquid outlet is a circular hole having a diameter of between 0.1 mm and 50 mm, and according to the embodiment shown in Fig. 1, the diameter is 5 mm.
  • the position at which the polishing liquid inlet is disposed is at a position lower than the ultrasonic transducer 3 in the vertical direction.
  • a horn 7 is also included, and the horn 7 is detachably coupled to the ultrasonic transducer 3 at the lower portion of the ultrasonic transducer 3, such as a threaded connection.
  • the horn 7 can be used to change the amplitude.
  • the horn 7 can also be omitted.
  • a dense connection between the housing 5 and the ultrasonic transducer 3 is provided.
  • the sealing ring 4 may be an O-ring.
  • the ultrasonic transducer 3 is cylindrical, and the 0-ring is disposed on the outer cylindrical surface of the ultrasonic transducer 3.
  • the ultrasonic transducer 3 is a magnetostrictive transducer or a piezoelectric transducer.
  • the ultrasonic transducer 3 emits ultrasonic waves at frequencies between 20 kHz and 50 kHz.
  • the present invention provides a method of polishing a workpiece to be processed by the above-described polishing apparatus, comprising the steps of: connecting the polishing apparatus to an actuator of a numerically controlled machine tool, and the polishing apparatus and the workpiece to be processed The surface is adjusted to a certain angle, for example, 60°; the polishing liquid outlet of the polishing device is slowly brought close to the surface of the workpiece to a certain distance, for example, 10 mm; and the polishing liquid is supplied to the inner cavity of the housing of the polishing device.
  • the actuator drives the polishing device to move along a predetermined trajectory to polish the workpiece to be processed.
  • the distance between the polishing liquid outlet and the surface of the workpiece to be processed is between 0.1 mm and 1000 mm.
  • the distance from the bottom end of the horn 7 to the outlet of the polishing liquid is adjusted between 0.5 mm and 300 mm.
  • the angle of ultrasonic wave divergence is large, and when the distance is large, the angle of ultrasonic wave divergence is small.
  • the angle between the polishing device and the surface of the part to be machined 8 is adjusted from 0 ° to 90 °.
  • the polishing device can also be angled to the horizontal direction, which is adjusted from 0° to 180°.
  • the polishing liquid used may be silica, cerium oxide, diamond polishing liquid or magnetorheological fluid.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Abstract

一种抛光装置，包括壳体（5）、超声换能器（3）和连接件（1）。所述超声换能器设置在所述壳体内，以及与所述壳体可拆卸地连接；所述连接件设置成与所述超声换能器可拆卸地连接，以及所述连接件还被设置成将所述抛光装置与数控机床的执行机构相连接；所述壳体设置有抛光液入口以及抛光液出口，抛光液入口与抛光液入口连接件（6）相连接，抛光液通过所述抛光液入口连接件进入所述壳体内，抛光液通过所述抛光液出口流到待加工件（8）表面，对待加工件进行抛光。这种抛光装置操作简单，能耗低，提高了加工效率。

Description

一种抛光装置 技术领域
本发明涉及一种抛光装置， 其用于对待加工件的表面进行抛光处理。 背景技术
在光学加工领域，需要对光学元件进行抛光处理。传统的抛光方法以 及抛光装置是在被抛光工件表面和抛光盘之间加入抛光液，利用抛光盘与 工件表面的相对滑动，借助于抛光液与工件表面的机械化学和物理作用实 现对工件表面的抛光，而这往往需要多次反复进行，经多次面形误差的修 正， 才能最终获得符合要求的光学表面。在传统的抛光方法中， 抛光盘会 磨损且控制性较差。
流体振动抛光 (polishing based Vibrations of Liquid)是以流体作为抛光 工具， 由于流体具有几何形状的自适应能力， 因此可以获得很好的加工平 整度。抛光能量由超声振动提供， 当超声振动在液体中传播时， 将发生一 种称为 "空化"的复杂非线性现象， 而空化泡局部将产生非常高的温度和 压强， 同时非对称空化会引发高速的微射流。流体分子或悬浮在其中的微 细磨粒在这种作用的驱使下冲击工件表面， 从而实现材料的去除。
目前流体振动抛光装置的原理是： 将工件整体放入含有抛光液的槽 中，槽外侧固定有超声换能器，换能器发出超声波从而驱动液体产生超声 振动。这种方式的缺点是： 将工件整体放入流体超声振动场中， 工件表面 所有点都会有去除，而各点的去除量难以控制，这样也使得目前的流体振 动抛光不适合作为一种面形修正方法。 发明内容
为了解决上述问题的至少一个方面，本发明提出一种抛光装置，根据 本发明所提供的抛光装置，其可以对工件进行局部去除，通过对数控机床 的控制可以对各点的驻留时间进行控制即可以修正面形，此外，本发明所 提供的抛光装置操作简单， 能耗低， 准备时间短， 从而提高了加工效率。
具体地， 根据本发明所提供的抛光装置， 其包括： 壳体、 超声换能 器、连接件； 所述超声换能器设置在所述壳体内， 以及与所述壳体可拆卸 地连接；所述连接件设置成与所述超声换能器可拆卸地连接， 以及所述连 接件还被设置成将所述抛光装置与数控机床的执行机构相连接；所述壳体 设置有抛光液入口以及抛光液出口，抛光液入口与抛光液入口连接件相连 接，抛光液通过所述抛光液入口连接件进入所述壳体内，抛光液通过所述 抛光液出口流到待加工件表面， 对待加工件进行抛光。
优选地， 其还包括变幅杆， 所述变幅杆在所述超声换能器下部与所 述超声换能器可拆卸地连接。
优选地， 所述抛光液入口设置的位置在竖直方向上处于比超声换能 器低的位置。
优选地， 所述壳体与所述超声换能器之间通过螺纹连接， 以及所述 壳体与所述超声换能器之间设置密封圈。
优选地， 所述抛光液入口连接件与所述壳体的抛光液入口通过螺纹 连接。
优选地， 所述超声换能器为磁致伸缩换能器或压电换能器。
优选地， 所述壳体为实心结构或者中空结构或者包括吸振夹层的结 优选地， 所述抛光液出口的直径处于 0.1mm-50mm之间。
另外一个方面， 本发明还提供一种利用本发明的抛光装置对待加工 件进行抛光的方法，其包括以下歩骤：将所述抛光装置与数控机床的执行 机构连接，将所述抛光装置与所述待加工件表面调整成一定角度；将所述 抛光装置的抛光液出口缓缓靠近所述待加工件的表面至一定距离;供给抛 光液至所述抛光装置的壳体的内腔，使抛光液充满所述壳体的内腔并且由 所述抛光液出口流出至所述待加工件表面；控制超声换能器发出一定频率 和幅度的超声波；由数控机床的执行机构带动所述抛光装置沿预定轨迹运 动以对所述待加工件进行抛光。
优选地， 所述抛光液出口与所述待加工件的表面之间的距离处于 0.1 mm- 1000mm之间。
根据本发明所提供的抛光装置具有如下有益效果的至少一个方面： 利用本发明的抛光装置可以对工件进行局部抛光，便于控制各抛光点的驻 留时间， 从而在降低工件表面粗糙度的同时修正面形， 另外， 本抛光装置 的操作简单， 能耗低， 准备时间短， 提高了加工效率。 附图说明
图 1为根据本发明的抛光装置的示意图。 具体实施方式
下面结合附图对本发明进行具体说明：图 1为根据本发明的抛光装置 的示意图。
根据本发明的抛光装置， 其包括： 壳体 5、 超声换能器 3、 连接件 1 ; 超声换能器 3设置在壳体 5内， 以及与壳体 5可拆卸地连接，例如通过螺 纹连接； 连接件 1设置成与超声换能器 3可拆卸地连接， 例如利用螺钉 2 将两者连接，以及连接件 1还被设置成将抛光装置与数控机床的执行机构 相连接；壳体 5设置有抛光液入口以及抛光液出口，抛光液入口与抛光液 入口连接件 6相连接，例如通过螺纹连接，抛光液通过所述抛光液入口连 接件 6进入所述壳体内，抛光液通过所述抛光液出口流到待加工件 8表面， 对待加工件 8进行抛光。
根据本发明的优选的实施方式， 连接件 1 可以是与机床主轴相连接 的各类锥柄， 也可以是适于与其他执行机构相连接的接口件。优选地， 连 接件 1的材料为硬铝合金。
如图 1所示， 可以将壳体 5制成中空结构用来吸收超声振动能量， 可以将壳体 1制成实心结构或者包括吸振夹层的结构。壳体 5的材料可以 为金属材料， 例如， 硬铝合金， 壳体 5的材料也可以是高分子材料。根据 本发明的优选的实施方式，抛光液出口为圆形孔，直径处于 0.1mm-50mm 之间， 根据如图 1所示的实施方式， 其直径为 5mm。 如图 1所示， 抛光 液入口设置的位置在竖直方向上处于比超声换能器 3低的位置。
根据本发明的优选地实施方式， 如图 1所示， 还包括变幅杆 7， 变幅 杆 7在超声换能器 3下部与超声换能器 3可拆卸地连接， 例如螺纹连接。 可以利用变幅杆 7来改变振幅， 当然， 也可以不使用变幅杆 7。
根据本发明的优选地实施方式， 壳体 5与超声换能器 3之间设置密 封圈 4， 可以为 O型密封圈， 当壳体 5旋紧时， 0型密封圈受到挤压而产 生密封效果。 这里的超声换能器 3为圆柱形， 则 0型密封圈设置在超声 换能器 3的外圆柱表面。
根据本发明的优选地实施方式， 超声换能器 3 为磁致伸缩换能器或 压电换能器。 超声换能器 3发出的超声的频率在 20kHz-50kHz之间。
此外， 本发明提供一种利用上述的抛光装置对待加工件进行抛光的 方法， 其包括以下歩骤： 将所述抛光装置与数控机床的执行机构连接， 将 所述抛光装置与所述待加工件表面调整成一定角度， 例如 60° ； 将所述 抛光装置的抛光液出口缓缓靠近所述待加工件的表面至一定距离， 例如 10mm; 供给抛光液至所述抛光装置的壳体的内腔， 使抛光液充满所述壳 体的内腔并且由所述抛光液出口流出至所述待加工件表面;控制超声换能 器发出一定频率和幅度的超声波，例如振动频率处于 20kHz; 由数控机床 的执行机构带动所述抛光装置沿预定轨迹运动以对所述待加工件进行抛 光。
根据本发明的优选的实施方式， 抛光液出口与所述待加工件的表面 之间的距离处于 O.lmm-lOOOmm之间。
此外，变幅杆 7底端到抛光液出口的距离在 0.5mm-300mm之间调整， 距离小时， 超声波发散角度较大， 距离大时， 超声波发散角度较小。抛光 装置与待加工件 8表面所成的角度在 0 ° ~90 ° 范围内调整。 抛光装置也 可以与水平方向成一定的角度， 该角度在 0° -180 ° 范围内调整。所使用 的抛光液可以为二氧化硅、 氧化铈、 金刚石抛光液或磁流变液。
尽管已经示出和描述了本发明的实施例， 对于本领域的普通技术人 员而言，可以理解在不脱离本发明的原理和精神的情况下可以对这些实施 例进行变化， 本发明的范围由所附权利要求及其等同物限定。

Claims

1. 一种抛光装置， 其包括：
壳体、 超声换能器、 连接件；
所述超声换能器设置在所述壳体内， 以及与所述壳体可拆卸地连接; 所述连接件设置成与所述超声换能器可拆卸地连接， 以及所述连接 件还被设置成将所述抛光装置与数控机床的执行机构相连接；
所述壳体设置有抛光液入口以及抛光液出口， 抛光液入口与抛光液 入口连接件相连接， 抛光液通过所述抛光液入口连接件进入所述壳体内， 抛光液通过所述抛光液出口流到待加工件表面， 对待加工件进行抛光。
2. 根据权利要求 1所述的抛光装置，
其还包括变幅杆， 所述变幅杆在所述超声换能器下部与所述超声换 能器可拆卸地连接。
3. 根据权利要求 1所述的抛光装置， 其中，
所述抛光液入口设置的位置在竖直方向上处于比超声换能器低的位 置。
4. 根据权利要求 1所述的抛光装置， 其中，
所述壳体与所述超声换能器之间通过螺纹连接， 以及所述壳体与所 述超声换能器之间设置密封圈。
5. 根据权利要求 1所述的抛光装置， 其中，
所述抛光液入口连接件与所述壳体的抛光液入口通过螺纹连接。
6. 根据权利要求 1所述的抛光装置， 其中，
所述超声换能器为磁致伸缩换能器或压电换能器。
7. 根据权利要求 1所述的抛光装置， 其中，
所述壳体为实心结构或者中空结构或者包括吸振夹层的结构。
8. 根据权利要求 1所述的抛光装置， 其中，
所述抛光液出口的直径处于 0.1mm-50mm之间。
9. 一种利用权利要求 1-7任一项所述的抛光装置对待加工件进行抛 光的方法， 其包括以下歩骤： 将所述抛光装置与数控机床的执行机构连接， 将所述抛光装置与所 述待加工件表面调整成一定角度；
将所述抛光装置的抛光液出口缓缓靠近所述待加工件的表面至一定 距离；
供给抛光液至所述抛光装置的壳体的内腔， 使抛光液充满所述壳体 的内腔并且由所述抛光液出口流出至所述待加工件表面；
控制超声换能器发出一定频率和幅度的超声波；
由数控机床的执行机构带动所述抛光装置沿预定轨迹运动以对所述 待加工件进行抛光。
10. 根据权利要求 8所述的方法， 其中，
所述抛光液出口与所述待加工件的表面之间的距离处于 0.1 mm- 1000mm之间。
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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05162071A (ja) * 1991-12-11 1993-06-29 Juki Corp 研削砥石のドレッシング方法および装置
JP2001038594A (ja) * 1999-07-29 2001-02-13 Olympus Optical Co Ltd 光学素子研磨方法及び光学素子研磨装置
CN201020638Y (zh) * 2007-04-10 2008-02-13 哈尔滨工大奥瑞德光电技术有限公司 超声振动磨削复合加工工具
CN201109052Y (zh) * 2007-12-04 2008-09-03 陈玉峰 聚能式超声波研磨去毛刺装置
CN101417401A (zh) * 2008-11-28 2009-04-29 太原理工大学 一种复杂表面光整加工设备及工艺
CN201625897U (zh) * 2010-04-02 2010-11-10 绍兴文理学院 一种抛光机
CN202028985U (zh) * 2011-01-06 2011-11-09 河南科技大学 用于陶瓷滚子的抛光加工装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05162071A (ja) * 1991-12-11 1993-06-29 Juki Corp 研削砥石のドレッシング方法および装置
JP2001038594A (ja) * 1999-07-29 2001-02-13 Olympus Optical Co Ltd 光学素子研磨方法及び光学素子研磨装置
CN201020638Y (zh) * 2007-04-10 2008-02-13 哈尔滨工大奥瑞德光电技术有限公司 超声振动磨削复合加工工具
CN201109052Y (zh) * 2007-12-04 2008-09-03 陈玉峰 聚能式超声波研磨去毛刺装置
CN101417401A (zh) * 2008-11-28 2009-04-29 太原理工大学 一种复杂表面光整加工设备及工艺
CN201625897U (zh) * 2010-04-02 2010-11-10 绍兴文理学院 一种抛光机
CN202028985U (zh) * 2011-01-06 2011-11-09 河南科技大学 用于陶瓷滚子的抛光加工装置

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