WO2013082828A1 - 液晶显示装置及其led封装结构 - Google Patents

液晶显示装置及其led封装结构 Download PDF

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Publication number
WO2013082828A1
WO2013082828A1 PCT/CN2011/083923 CN2011083923W WO2013082828A1 WO 2013082828 A1 WO2013082828 A1 WO 2013082828A1 CN 2011083923 W CN2011083923 W CN 2011083923W WO 2013082828 A1 WO2013082828 A1 WO 2013082828A1
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WO
WIPO (PCT)
Prior art keywords
light
wall
sidewall
emitting
bottom wall
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Ceased
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PCT/CN2011/083923
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English (en)
French (fr)
Inventor
唐国富
俞刚
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Priority to US13/381,079 priority Critical patent/US8814378B2/en
Publication of WO2013082828A1 publication Critical patent/WO2013082828A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
    • G02B6/0031—Reflecting element, sheet or layer
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0073—Light emitting diode [LED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a liquid crystal display device and an LED package structure thereof.
  • the liquid crystal display device includes a backlight module.
  • the backlight module includes a light source module and a light guide plate.
  • the light source module is disposed on the light incident surface of the light guide plate, wherein the light source module adopts a conventional Light-emitting diode (Light Emitting Diode, LED).
  • LED lights have a range of viewing angles, such as elliptical LED lights. As shown in FIG. 1, when the angle of view of the elliptical LED lamp 11 is 120°, when the LED lamps 11 are linearly arranged on the light guide plate 12, there is a blind spot between the adjacent two LED lamps 11 due to the limitation of the viewing angle range.
  • the light guide plate 12 located in the blind spot of the light has no light passing through, and the corresponding area of the light emitting blind area is relatively dark, and other areas illuminated by the LED light 11 are brighter.
  • There is a clear phenomenon of light and dark alternating which leads to the phenomenon of light and dark separation between the light entering the liquid crystal display device (Hot Spot), resulting in poor light mixing.
  • the Hot can be eliminated.
  • the Spot problem causes the LED light 11 to have a smaller viewing angle range, resulting in a decrease in light utilization.
  • the present invention provides a liquid crystal display device and an LED package structure thereof to solve the above problems.
  • the technical problem to be solved by the present invention is to provide a liquid crystal display device and an LED package structure thereof, which can eliminate the Hot Spot phenomenon.
  • a technical solution adopted by the present invention is to provide an LED package structure including an LED chip and a frame for accommodating the LED chip, the frame body comprising a bottom wall, a first sidewall, and a light exiting wall, wherein
  • the LED chip is disposed on the bottom wall, the first sidewall is obliquely disposed in the light emitting direction of the LED chip, and is inclined at an oblique angle with respect to the bottom wall, the light emitting wall is disposed between the first sidewall and the bottom wall, and the light emitting wall is perpendicular to the bottom
  • the wall and the light-emitting wall are provided with a light-emitting hole, and the light emitted by the LED chip is reflected by the first sidewall and then exits from the light-emitting hole.
  • the material for the light-emitting wall is made of silicone grease or epoxy resin.
  • a technical solution adopted by the present invention is to provide an LED package structure including an LED chip and a frame for accommodating the LED chip, the frame body comprising a bottom wall, a first sidewall, and a light exiting wall, wherein The LED chip is disposed on the bottom wall, and the first sidewall is obliquely disposed in the light emitting direction of the LED chip, and the light emitted by the LED chip is reflected by the first sidewall and then emitted from the light exiting wall.
  • the first side wall is at an oblique angle with respect to the bottom wall
  • the light exiting wall is disposed between the first side wall and the bottom wall
  • the light exiting wall is perpendicular to the bottom wall
  • the frame further includes a second side wall and a third side wall, and the second side wall and the third side wall are enclosed with the bottom wall, the first side wall and the light-emitting wall to form a frame.
  • the frame is a rectangular parallelepiped.
  • the bottom wall is located at the bottom of the frame
  • the light-emitting wall is disposed at the top of the frame
  • the first sidewall is disposed between the bottom wall and the light-emitting wall
  • the first sidewall is inclined at an angle relative to the bottom wall.
  • the frame further includes a second sidewall disposed opposite the first sidewall, and the light emitted by the LED chip is reflected by the first sidewall and then reflected by the second sidewall and the bottom wall and then exits the light exiting wall.
  • the frame further includes a third sidewall and a fourth sidewall, and the third sidewall and the fourth sidewall are formed by enclosing the bottom wall, the first sidewall, the second sidewall, and the light exiting wall. framework.
  • the frame is a rectangular parallelepiped.
  • the light-emitting wall is provided with a light-emitting hole, and the light emitted by the LED chip is reflected and then emitted through the light-emitting hole.
  • the material for the light-emitting wall is made of silicone grease or epoxy resin.
  • the housing space of the housing is filled with fluorescence.
  • a technical solution adopted by the present invention is to provide a liquid crystal display device including: a display panel; and a backlight module, the backlight module is used to provide a backlight for the display panel; and the backlight module includes a guide
  • the light panel and the light source module includes an LED package structure, and the LED package structure is disposed on the light incident surface of the light guide plate, wherein the LED package structure comprises an LED chip and a frame for accommodating the LED chip, the frame body comprises a bottom wall and a first side a wall and a light-emitting wall, wherein the LED chip is disposed on the bottom wall, and the first sidewall is obliquely disposed in the light-emitting direction of the LED chip, and the light emitted by the LED chip is reflected by the first sidewall and then exits from the light-emitting wall to the light guide plate.
  • the first side wall is at an oblique angle with respect to the bottom wall
  • the light exiting wall is disposed between the first side wall and the bottom wall
  • the light exiting wall is perpendicular to the bottom wall
  • the frame further includes a second side wall and a third side wall, and the second side wall and the third side wall are enclosed with the bottom wall, the first side wall and the light-emitting wall to form a frame.
  • the frame is a rectangular parallelepiped.
  • the bottom wall is located at the bottom of the frame
  • the light-emitting wall is disposed at the top of the frame
  • the first sidewall is disposed between the bottom wall and the light-emitting wall
  • the first sidewall is inclined at an angle relative to the bottom wall.
  • the frame further includes a second sidewall disposed opposite the first sidewall, and the light emitted by the LED chip is reflected by the first sidewall and then reflected by the second sidewall and the bottom wall and then exits the light exiting wall.
  • the frame further includes a third sidewall and a fourth sidewall, and the third sidewall and the fourth sidewall are formed by enclosing the bottom wall, the first sidewall, the second sidewall, and the light exiting wall.
  • the frame is a rectangular parallelepiped.
  • the light-emitting wall is provided with a light-emitting hole, and the light emitted by the LED chip is reflected and then emitted through the light-emitting hole.
  • the material for manufacturing the light-emitting wall is silicone grease or epoxy resin
  • the housing space of the frame is filled with fluorescence
  • the invention has the beneficial effects that the liquid crystal display device of the present invention and the LED package structure thereof are disposed on the bottom wall by the LED chip, and the first sidewall is obliquely disposed in the light emitting direction of the LED chip.
  • the light emitted by the LED chip is reflected by the first sidewall and then emitted from the light-emitting wall, thereby increasing the light-mixing distance of the LED chip, thereby avoiding the occurrence of a blind spot of illumination, and eliminating Hot. Spot phenomenon.
  • FIG. 1 is a schematic diagram of an LED package structure of a liquid crystal display device in the prior art
  • FIG. 2 is a perspective view of an LED package structure according to a first embodiment of the present invention
  • Figure 3 is a perspective view of the LED package structure of Figure 2;
  • FIG. 4 is a cross-sectional view of the LED package structure of FIG. 2;
  • FIG. 5 is a perspective view of an LED package structure according to a second embodiment of the present invention.
  • Figure 6 is a perspective view of the LED package structure of Figure 5;
  • Figure 7 is a cross-sectional view showing the LED package structure of Figure 5;
  • FIG. 8 is a perspective view of an LED package structure according to a third embodiment of the present invention.
  • Figure 9 is a perspective view of the LED package structure of Figure 8.
  • Figure 10 is a cross-sectional view showing the LED package structure of Figure 8.
  • Figure 11 is a schematic view showing the structure of a liquid crystal display device according to a preferred embodiment of the present invention.
  • FIG. 2 is a perspective view of an LED package structure according to a first embodiment of the present invention
  • FIG. 3 is a perspective view of the LED package structure of FIG. 2
  • FIG. 4 is a cross-sectional view of the LED package structure of FIG. .
  • the LED package structure 20 of the present embodiment includes an LED chip 21 and a frame 22 that houses the LED chip 21.
  • the frame 22 includes a bottom wall 221 , a first sidewall 222 , a second sidewall 223 , a third sidewall 224 , and a light exit wall 225 .
  • the LED package structure 20 also includes solder fillets 229 and wires 230.
  • the solder fillet 229 is disposed on the bottom wall 221 and includes a first partial solder fillet and a second partial solder fillet.
  • the LED chip 21 is disposed on the first partial solder fillet, and the second partial solder fillet is connected through the wire 230. . That is, the LED chip 21 is disposed on the bottom wall 221, and the first sidewall 222 is obliquely disposed in the light emitting direction of the LED chip 21, and is inclined at an oblique angle with respect to the bottom wall 221.
  • the light-emitting wall 225 is disposed between the first sidewall 222 and the bottom wall 221 and perpendicular to the bottom wall 221, wherein a light-emitting hole 226 is disposed on the light-emitting wall 225 to pass the light emitted by the LED chip 21 through the first sidewall 222. After reflection, it exits through the light exit hole 226, as shown in FIG.
  • the second sidewall 223 and the third sidewall 224 are perpendicular to the bottom wall 221 and are located on opposite sides of the bottom wall 221 such that the bottom wall 221, the first sidewall 222, the second sidewall 223, and the third sidewall 224 And the light-emitting wall 225 is enclosed to form the frame 22.
  • the bottom wall 221, the first side wall 222, the second side wall 223, the third side wall 224, and the light-emitting wall 225 are integrally formed.
  • those skilled in the art can completely form the frame 22 by the bottom wall 221, the first side wall 222, the second side wall 223, the third side wall 224, and the light-emitting wall 225 by other means.
  • the first sidewall 222 has a reflection effect.
  • the light emitted by the LED chip 21 is reflected by the first sidewall 222, the light is emitted from the light exit hole 226 of the light exit wall 225, thereby increasing the light mixing distance of the light. .
  • the light emitted by the LED chip 21 of the LED package structure 20 of the present embodiment is first reflected by the first sidewall 222, and then emitted from the light exit hole 226, thereby increasing the mixing of the LED chip 21. Light distance, avoiding blind spots, and thus eliminating Hot Spot phenomenon.
  • FIG. 5 is a perspective view of an LED package structure according to a second embodiment of the present invention
  • FIG. 6 is a perspective view of the LED package structure of FIG. 5
  • FIG. 7 is a cross-sectional view of the LED package structure of FIG. .
  • the LED package structure 30 of the second embodiment of the present invention is different from the LED package structure 20 of the first embodiment in that the outer shape of the frame 32 of the LED package structure 30 of the present embodiment is set. It is a cuboid.
  • FIG. 8 is a perspective view of an LED package structure according to a third embodiment of the present invention
  • FIG. 9 is a perspective view of the LED package structure of FIG. 8
  • FIG. 10 is a cross-sectional view of the LED package structure of FIG. .
  • the light source module 40 of the present embodiment includes an LED chip 41 and a frame 42 that houses the LED chip 41.
  • the frame 42 includes a bottom wall 421 , a first sidewall 422 , a second sidewall 423 , a third sidewall 424 , a fourth sidewall 425 , and a light exiting wall 426 .
  • the LED package structure 20 also includes solder fillets 428 and wires 429.
  • the bottom wall 421 is located at the bottom of the frame body 42
  • the solder fillet 428 is disposed on the bottom wall 421 , and includes a first portion solder fillet and a second portion solder fillet
  • the LED chip 41 is disposed on the first portion solder fillet.
  • the second portion of the solder fillet is connected by a wire 429. That is, the LED chip 41 is disposed on the bottom wall 421, and the light-emitting wall 426 is disposed at the top of the frame body 42.
  • the first sidewall 422 is disposed between the bottom wall 421 and the light-emitting wall 426, and is inclined at an oblique angle with respect to the bottom wall 421.
  • the housing 42 further includes a second sidewall 423 disposed opposite to the first sidewall 422.
  • the light-emitting wall 426 is provided with a light-emitting aperture 427.
  • the light emitted by the LED chip 41 is reflected by the first sidewall 422 and then reflected by the second sidewall 423 and the bottom wall 421, and then exits from the light-emitting aperture 427 of the light-emitting wall 426, such as Figure 10 shows.
  • the third side wall 424 and the fourth side wall 425 are both perpendicular to the bottom wall 421 and are disposed on opposite sides of the bottom wall 421 such that the bottom wall 421, the first side wall 422, the second side wall 423, and the third side The wall 424, the fourth side wall 425, and the light exiting wall 426 are enclosed to form the frame 42.
  • the frame 42 is provided with a rectangular parallelepiped. In other embodiments, those skilled in the art can fully arrange the frame 42 into other shapes.
  • the light emitted by the LED chip 41 of the LED package structure 40 of the present embodiment is reflected by the first sidewall 422 and then reflected by the reflective layer of the second sidewall 423 and the bottom wall 421. Finally, the light exit hole 427 of the light exiting wall 426 is emitted, thereby increasing the light mixing distance of the LED chip 41, thereby avoiding a blind spot of light, thereby eliminating Hot. Spot phenomenon.
  • the material for manufacturing the light-emitting wall in the LED package structure of the present invention is silicone grease or epoxy resin.
  • the housing space of the housing can be filled with fluorescence.
  • the present invention also provides a liquid crystal display device 50.
  • the liquid crystal display device 50 includes a display panel 51 and a backlight module 52 for providing a backlight for the display panel 51.
  • the backlight module 52 includes a light guide plate 521 and a light source module 522.
  • the light source module 522 includes an LED package structure, and the LED package structure is disposed on the light incident surface of the light guide plate.
  • the LED package structure includes an LED chip and a frame for accommodating the LED chip.
  • the frame body includes a bottom wall, a first sidewall, and a light exiting wall. The LED chip is disposed on the bottom wall, and the first sidewall is obliquely disposed on the light emitting direction of the LED chip.
  • the light emitted by the LED chip is reflected by the first sidewall and then emitted from the light exit wall to the light incident surface of the light guide plate 521.
  • the LED package structure may also be the structure in any of the foregoing LED package structure embodiments, and details are not described herein again.
  • the liquid crystal display device of the present invention and the LED package structure thereof are disposed on the bottom wall by the LED chip, and the first sidewall is obliquely disposed in the light emitting direction of the LED chip, so that the light emitted by the LED chip passes through the first side. After the wall is reflected, it exits from the light-emitting wall, thereby increasing the light-mixing distance of the LED chip, avoiding the occurrence of a blind spot of illumination, and eliminating Hot. Spot phenomenon.

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  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
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Abstract

一种液晶显示装置及其LED封装结构。该LED封装结构（20）包括LED芯片（21）以及收容LED芯片（21）的框体（22），框体（22）包括底壁（221，421）、第一侧壁（222，422）以及出光壁（225），其中，LED芯片（21）设置于底壁（221，421）上，第一侧壁（222，422）倾斜设置于LED芯片（21）的出光方向上，LED芯片（21）发出的光线经过第一侧壁（222，422）反射后从出光壁（225）出射。该液晶显示装置及其LED封装结构（20）增加了LED芯片（21）的混光距离，避免产生发光盲区，能够消除明暗相隔现象。

Description

液晶显示装置及其LED封装结构
【技术领域】
本发明涉及显示技术领域，特别是涉及一种液晶显示装置及其LED封装结构。
【背景技术】
目前，液晶显示装置的应用越来越普及，现有技术中液晶显示装置包括背光模组，背光模组包括光源模块以及导光板，光源模块设置在导光板的入光面，其中光源模块采用传统发光二极管（Light Emitting Diode，LED）。LED灯都具有一定的视角范围，例如椭圆形LED灯。如图1所示，椭圆形LED灯11的视角范围为120°，LED灯11在导光板12上直线排列时，相邻两个LED灯11之间由于视角范围的限制而存在发光盲区。若导光板12的入光面和LED灯11距离很近时，则位于发光盲区的导光板12无光线通过，发光盲区相应的区域相对较暗，LED灯11照射到的其他区域较亮，从而出现明显的明暗交替现象，进而导致液晶显示装置入光处出现明暗相隔现象（Hot Spot），导致混光不良。若增加导光板12与LED灯11之间的距离，虽然可以消除Hot Spot问题，但导致LED灯11的视角范围更小，使得光的利用率下降。
因此，本发明提供一种液晶显示装置及其LED封装结构，以解决上述问题。
【发明内容】
本发明主要解决的技术问题是提供一种液晶显示装置及其LED封装结构，能够消除Hot Spot现象。
为解决上述技术问题，本发明采用的一个技术方案是：提供一种LED封装结构，其包括LED芯片以及收容LED芯片的框体，框体包括底壁、第一侧壁以及出光壁，其中，LED芯片设置于底壁上，第一侧壁倾斜设置于LED芯片的出光方向上，并且相对底壁成一倾斜角度，出光壁设置在第一侧壁和底壁之间，且出光壁垂直于底壁，出光壁设置有一出光孔，LED芯片发出的光线经过第一侧壁反射后从出光孔出射。
根据本发明一优选实施例，出光壁的制造材料为硅脂或环氧树脂。
为解决上述技术问题，本发明采用的一个技术方案是：提供一种LED封装结构，其包括LED芯片以及收容LED芯片的框体，框体包括底壁、第一侧壁以及出光壁，其中，LED芯片设置于底壁上，第一侧壁倾斜设置于LED芯片的出光方向上，LED芯片发出的光线经过第一侧壁反射后从出光壁出射。
根据本发明一优选实施例，第一侧壁相对底壁成一倾斜角度，出光壁设置在第一侧壁和底壁之间，且出光壁垂直于底壁。
根据本发明一优选实施例，框体进一步包括第二侧壁和第三侧壁，第二侧壁和第三侧壁与底壁、第一侧壁以及出光壁围合形成框体。
根据本发明一优选实施例，框体为长方体。
根据本发明一优选实施例，底壁位于框体的底部，出光壁设置在框体的顶部，第一侧壁设置于底壁和出光壁之间，且第一侧壁相对底壁成一倾斜角度，框体进一步包括与第一侧壁相对设置的第二侧壁，LED芯片发出的光线经过第一侧壁反射后再经由第二侧壁和底壁反射后再从出光壁出射。
根据本发明一优选实施例，框体进一步包括第三侧壁和第四侧壁，第三侧壁和第四侧壁与底壁、第一侧壁、第二侧壁以及出光壁围合形成框体。
根据本发明一优选实施例，框体为长方体。
根据本发明一优选实施例，出光壁设置有一出光孔，LED芯片发出的光线经过反射后通过出光孔射出。
根据本发明一优选实施例，出光壁的制造材料为硅脂或环氧树脂。
根据本发明一优选实施例，框体的收容空间内填充荧光。
为解决上述技术问题，本发明采用的一个技术方案是：提供一种液晶显示装置，其包括：显示面板；以及背光模组，背光模组用于为显示面板提供背光源；背光模组包括导光板和光源模块，光源模块包括一LED封装结构，LED封装结构设置在导光板的入光面，其中，LED封装结构包括LED芯片以及收容LED芯片的框体，框体包括底壁、第一侧壁以及出光壁，其中，LED芯片设置于底壁上，第一侧壁倾斜设置于LED芯片的出光方向上，LED芯片发出的光线经过第一侧壁反射后从出光壁出射至导光板的入光面。
根据本发明一优选实施例，第一侧壁相对底壁成一倾斜角度，出光壁设置在第一侧壁和底壁之间，且出光壁垂直于底壁。
根据本发明一优选实施例，框体进一步包括第二侧壁和第三侧壁，第二侧壁和第三侧壁与底壁、第一侧壁以及出光壁围合形成框体。
根据本发明一优选实施例，框体为长方体。
根据本发明一优选实施例，底壁位于框体的底部，出光壁设置在框体的顶部，第一侧壁设置于底壁和出光壁之间，且第一侧壁相对底壁成一倾斜角度，框体进一步包括与第一侧壁相对设置的第二侧壁，LED芯片发出的光线经过第一侧壁反射后再经由第二侧壁和底壁反射后再从出光壁出射。
根据本发明一优选实施例，框体进一步包括第三侧壁和第四侧壁，第三侧壁和第四侧壁与底壁、第一侧壁、第二侧壁以及出光壁围合形成框体，框体为长方体。
根据本发明一优选实施例，出光壁设置有一出光孔，LED芯片发出的光线经过反射后通过出光孔射出。
根据本发明一优选实施例，出光壁的制造材料为硅脂或环氧树脂，框体的收容空间内填充荧光。
本发明的有益效果是：区别于现有技术的情况，本发明的液晶显示装置及其LED封装结构通过将LED芯片设置于底壁上，第一侧壁倾斜设置于LED芯片的出光方向上，以使LED芯片发出的光线经过第一侧壁反射后从出光壁出射，进而增加LED芯片的混光距离，避免产生发光盲区，能够消除Hot Spot现象。
【附图说明】
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。其中：
图1是现有技术中液晶显示装置的LED封装结构示意图；
图2是根据本发明第一实施例的LED封装结构的立体示意图；
图3是图2中LED封装结构的透视图；
图4是图2中LED封装结构的剖面示意图；
图5是根据本发明第二实施例的LED封装结构的立体示意图；
图6是图5中LED封装结构的透视图；
图7是图5中LED封装结构的剖面示意图；
图8是根据本发明第三实施例的LED封装结构的立体示意图；
图9是图8中LED封装结构的透视图；
图10是图8中LED封装结构的剖面示意图；
图11是根据本发明液晶显示装置的优选实施例的结构示意图。
【具体实施方式】
请参见图2-4，图2是根据本发明第一实施例的LED封装结构的立体示意图，图3是图2中LED封装结构的透视图，图4是图2中LED封装结构的剖面示意图。如图2-4所示，本实施例的LED封装结构20包括：LED芯片21以及收容LED芯片21的框体22。其中，框体22包括底壁221、第一侧壁222、第二侧壁223、第三侧壁224以及出光壁225。LED封装结构20还包括焊脚229以及导线230。
在本实施例中，焊脚229设置在底壁221上，并且包括第一部分焊脚以及第二部分焊脚，LED芯片21设置在第一部分焊脚上，并且通过导线230连接第二部分焊脚。即LED芯片21设置在底壁221上，第一侧壁222倾斜设置于LED芯片21的出光方向，并且相对底壁221成一倾斜角度。出光壁225设置在第一侧壁222和底壁221之间并且垂直于底壁221，其中，在出光壁225上设置一出光孔226，以使LED芯片21发出的光线经过第一侧壁222反射后通过出光孔226出射，如图4所示。
第二侧壁223和第三侧壁224垂直于底壁221，并且位于底壁221的相对两侧，以使底壁221、第一侧壁222、第二侧壁223、第三侧壁224以及出光壁225围合形成框体22。在本实施例中，底壁221、第一侧壁222、第二侧壁223、第三侧壁224以及出光壁225为一体成形。在其他实施例中，本领域的技术人员完全可以将底壁221、第一侧壁222、第二侧壁223、第三侧壁224以及出光壁225通过其他方式来形成框体22。
具体而言，第一侧壁222具有反射作用，当LED芯片21发出的光线，光线经过第一侧壁222的反射，再从出光壁225的出光孔226出射，进而增加了光线的混光距离。
区别于现有技术中LED灯11，本实施例的LED封装结构20的LED芯片21发出的光线先经过第一侧壁222反射后，再从出光孔226出射，进而增加了LED芯片21的混光距离，避免出现发光盲区，进而能够消除Hot Spot现象。
请参见图5-7，图5是根据本发明第二实施例的LED封装结构的立体示意图，图6是图5中LED封装结构的透视图，图7是图5中LED封装结构的剖面示意图。如图5-7所示，本发明第二实施例的LED封装结构30与第一实施例的LED封装结构20的主要不同之处在于：本实施例LED封装结构30的框体32的外形设置为长方体。
请参见图8-10，图8是根据本发明第三实施例的LED封装结构的立体示意图，图9是图8中LED封装结构的透视图，图10是图8中LED封装结构的剖面示意图。如图8-10所示，本实施例的光源模40包括：LED芯片41以及收容LED芯片41的框体42。其中，框体42包括底壁421、第一侧壁422、第二侧壁423、第三侧壁424、第四侧壁425以及出光壁426。LED封装结构20还包括焊脚428以及导线429。
在本实施例中，底壁421位于框体42的底部，焊脚428设置在底壁421上，并且包括第一部分焊脚以及第二部分焊脚，LED芯片41设置在第一部分焊脚上，并且通过导线429连接第二部分焊脚。即LED芯片41设置在底壁421上，出光壁426设置在框体42的顶部，第一侧壁422设置于底壁421和出光壁426之间，并且相对于底壁421成一倾斜角度，以倾斜设置于LED芯片41的出光方向，框体42进一步包括与第一侧壁422相对设置的第二侧壁423。其中，出光壁426上设置一出光孔427，LED芯片41发出的光线经过第一侧壁422反射后再经由第二侧壁423以及底壁421反射后从出光壁426的出光孔427出射，如图10所示。
第三侧壁424和第四侧壁425均垂直于底壁421，并且设置在底壁421的相对两侧，以使底壁421、第一侧壁422、第二侧壁423、第三侧壁424、第四侧壁425以及出光壁426围合形成框体42。在本实施例中，框体42设置成长方体。在其他实施例中，本领域的技术人员完全可以将框体42设置成其他形状。
区别于现有技术中LED灯11，本实施例的LED封装结构40的LED芯片41发出的光线先经过第一侧壁422反射后，再经由第二侧壁423以及底壁421的反射层反射，最后从出光壁426的出光孔427出射，进而增加了LED芯片41的混光距离，避免出现发光盲区，进而能够消除Hot Spot现象。
值得注意的是，本发明LED封装结构中出光壁的制造材料为硅脂或环氧树脂。此外，框体的收容空间内可填充荧光。
本发明还提供一种液晶显示装置50，如图8所示，液晶显示装置50包括显示面板51以及背光模组52，背光模组52用于为显示面板51提供背光源。其中，背光模组52包括导光板521以及光源模块522，光源模块522包括一LED封装结构，LED封装结构设置在导光板的入光面。LED封装结构包括LED芯片以及收容LED芯片的框体，框体包括底壁、第一侧壁以及出光壁，其中，LED芯片设置于底壁上，第一侧壁倾斜设置于LED芯片的出光方向上，LED芯片发出的光线经过第一侧壁反射后从出光壁出射至导光板521的入光面。LED封装结构还可以是前述任一LED封装结构实施例中的结构，在此不再赘述。
通过上述方式，本发明的液晶显示装置及其LED封装结构通过将LED芯片设置于底壁上，第一侧壁倾斜设置于LED芯片的出光方向上，以使LED芯片发出的光线经过第一侧壁反射后从出光壁出射，进而增加LED芯片的混光距离，避免产生发光盲区，能够消除Hot Spot现象。
以上所述仅为本发明的实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (20)

  1. 一种LED封装结构，其特征在于，所述LED封装结构包括LED芯片以及收容所述LED芯片的框体，所述框体包括底壁、第一侧壁以及出光壁，其中，所述LED芯片设置于所述底壁上，所述第一侧壁倾斜设置于所述LED芯片的出光方向上，并且相对所述底壁成一倾斜角度，所述出光壁设置在所述第一侧壁和所述底壁之间，且所述出光壁垂直于所述底壁，所述出光壁设置有一出光孔，所述LED芯片发出的光线经过所述第一侧壁反射后从所述出光孔出射。
  2. 根据权利要求1所述的LED封装结构，其特征在于，所述出光壁的制造材料为硅脂或环氧树脂。
  3. 一种LED封装结构，其特征在于，所述LED封装结构包括LED芯片以及收容所述LED芯片的框体，所述框体包括底壁、第一侧壁以及出光壁，其中，所述LED芯片设置于所述底壁上，所述第一侧壁倾斜设置于所述LED芯片的出光方向上，所述LED芯片发出的光线经过所述第一侧壁反射后从所述出光壁出射。
  4. 根据权利要求3所述的LED封装结构，其特征在于，所述第一侧壁相对所述底壁成一倾斜角度，所述出光壁设置在所述第一侧壁和所述底壁之间，且所述出光壁垂直于所述底壁。
  5. 根据权利要求4所述的LED封装结构，其特征在于，所述框体进一步包括第二侧壁和第三侧壁，所述第二侧壁和所述第三侧壁与所述底壁、第一侧壁以及出光壁围合形成所述框体。
  6. 根据权利要求5所述的LED封装结构，其特征在于，所述框体为长方体。
  7. 根据权利要求3所述的LED封装结构，其特征在于，所述底壁位于所述框体的底部，所述出光壁设置在所述框体的顶部，所述第一侧壁设置于所述底壁和所述出光壁之间，且所述第一侧壁相对所述底壁成一倾斜角度，所述框体进一步包括与所述第一侧壁相对设置的第二侧壁，所述LED芯片发出的光线经过所述第一侧壁反射后再经由所述第二侧壁和所述底壁反射后再从所述出光壁出射。
  8. 根据权利要求7所述的LED封装结构，其特征在于，所述框体进一步包括第三侧壁和第四侧壁，所述第三侧壁和所述第四侧壁与所述底壁、第一侧壁、第二侧壁以及出光壁围合形成所述框体。
  9. 根据权利要求8所述的LED封装结构，其特征在于，所述框体为长方体。
  10. 根据权利要求3所述的LED封装结构，其特征在于，所述出光壁设置有一出光孔，所述LED芯片发出的光线经过反射后通过所述出光孔射出。
  11. 根据权利要求3所述的LED封装结构，其特征在于，所述出光壁的制造材料为硅脂或环氧树脂。
  12. 根据权利要求11所述的LED封装结构，其特征在于，所述框体的收容空间内填充荧光。
  13. 一种液晶显示装置，其特征在于，所述液晶显示装置包括：
    显示面板；以及
    背光模组，所述背光模组用于为所述显示面板提供背光源；
    所述背光模组包括导光板和光源模块，所述光源模块包括一LED封装结构，所述LED封装结构设置在所述导光板的入光面，其中，所述LED封装结构包括LED芯片以 及收容所述LED芯片的框体，所述框体包括底壁、第一侧壁以及出光壁，其中，所述LED芯片设置于所述底壁上，所述第一侧壁倾斜设置于所述LED芯片的出光方向上，所述LED芯片发出的光线经过所述第一侧壁反射后从所述出光壁出射至所述导光板的入光面。
  14. 根据权利要求13所述的液晶显示装置，其特征在于，所述第一侧壁相对所述底壁成一倾斜角度，所述出光壁设置在所述第一侧壁和所述底壁之间，且所述出光壁垂直于所述底壁。
  15. 根据权利要求14所述的液晶显示装置，其特征在于，所述框体进一步包括第二侧壁和第三侧壁，所述第二侧壁和所述第三侧壁与所述底壁、第一侧壁以及出光壁围合形成所述框体。
  16. 根据权利要求15所述的液晶显示装置，其特征在于，所述框体为长方体。
  17. 根据权利要求13所述的液晶显示装置，其特征在于，所述底壁位于所述框体的底部，所述出光壁设置在所述框体的顶部，所述第一侧壁设置于所述底壁和所述出光壁之间，且所述第一侧壁相对所述底壁成一倾斜角度，所述框体进一步包括与所述第一侧壁相对设置的第二侧壁，所述LED芯片发出的光线经过所述第一侧壁反射后再经由所述第二侧壁和所述底壁反射后再从所述出光壁出射。
  18. 根据权利要求17所述的液晶显示装置，其特征在于，所述框体进一步包括第三侧壁和第四侧壁，所述第三侧壁和所述第四侧壁与所述底壁、第一侧壁、第二侧壁以及出光壁围合形成所述框体，所述框体为长方体。
  19. 根据权利要求13所述的液晶显示装置，其特征在于，所述出光壁设置有一出光孔，所述LED芯片发出的光线经过反射后通过所述出光孔射出。
  20. 根据权利要求13所述的液晶显示装置，其特征在于，所述出光壁的制造材料为硅脂或环氧树脂，所述框体的收容空间内填充荧光。
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