WO2013081335A1 - Broche de support permettant de supporter un substrat et appareil de traitement de substrat utilisant celle-ci - Google Patents

Broche de support permettant de supporter un substrat et appareil de traitement de substrat utilisant celle-ci Download PDF

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Publication number
WO2013081335A1
WO2013081335A1 PCT/KR2012/010012 KR2012010012W WO2013081335A1 WO 2013081335 A1 WO2013081335 A1 WO 2013081335A1 KR 2012010012 W KR2012010012 W KR 2012010012W WO 2013081335 A1 WO2013081335 A1 WO 2013081335A1
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WO
WIPO (PCT)
Prior art keywords
substrate
support
support pin
copper
supported
Prior art date
Application number
PCT/KR2012/010012
Other languages
English (en)
Korean (ko)
Inventor
박경완
이병일
Original Assignee
주식회사 테라세미콘
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020110125081A external-priority patent/KR20130059011A/ko
Priority claimed from KR1020110127649A external-priority patent/KR101317328B1/ko
Application filed by 주식회사 테라세미콘 filed Critical 주식회사 테라세미콘
Publication of WO2013081335A1 publication Critical patent/WO2013081335A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H01L21/67323—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls characterized by a material, a roughness, a coating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
    • H01L21/67343—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates characterized by a material, a roughness, a coating or the like
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs

Definitions

  • the present invention relates to a substrate support pin for preventing scratches on a substrate and a substrate processing apparatus using the same.
  • Substrate processing apparatuses are used in the manufacture of flat panel displays, and are roughly classified into vapor deposition apparatuses and annealing apparatuses.
  • the deposition apparatus is a device for forming a transparent conductive layer, an insulating layer, a metal layer, or a silicon layer, which constitute the core of a flat panel display, and deposits chemical vapor such as low pressure chemical vapor deposition (LPCVD) or plasma-enhanced chemical vapor deposition (PECVD). Physical vapor deposition apparatuses such as sputtering and the like.
  • chemical vapor such as low pressure chemical vapor deposition (LPCVD) or plasma-enhanced chemical vapor deposition (PECVD).
  • PECVD plasma-enhanced chemical vapor deposition
  • the annealing device is a device for improving the properties of the deposited film after depositing a film on the substrate, and is a heat treatment device for crystallizing or phase changing the deposited film.
  • the heat treatment apparatus includes a single substrate type for heat treating one substrate and a batch type for heat treating a plurality of substrates.
  • Single sheet heat treatment apparatus has a simple configuration, but has a disadvantage of low productivity, a batch heat treatment apparatus is frequently used for mass production.
  • a chamber is provided to provide a heat treatment space, and a support member such as a holder for supporting each of a plurality of substrates loaded into the chamber is essentially used.
  • the support member is formed with a plurality of support pins that uniformly support the entire surface of the substrate to prevent the substrate from being deformed by its own weight.
  • the present invention has been made in order to solve the problems of the prior art as described above, the object of the present invention is to prevent the occurrence of scratches on the substrate to support the substrate support pin and substrate processing using the same that can improve the reliability of the product In providing a device.
  • the support pin for a substrate support according to the present invention for achieving the above object is installed on a counterpart disposed in a chamber in which a substrate of glass material is loaded and processed, and is a support pin for supporting a substrate on which the substrate is mounted and supported.
  • a cap is formed of a silver quartz material, and a cap formed of a material having a hardness lower than that of the substrate is formed at an upper end of the support pin in contact with the substrate.
  • the substrate support support pin according to the present invention for achieving the above object is a substrate support support pin is installed on the counterpart disposed in the chamber in which the substrate of the glass material is loaded and processed, the substrate support support pin,
  • the support pin is formed of a material having a hardness lower than that of the substrate.
  • the substrate support support pin according to the present invention for achieving the above object is a substrate support support pin is installed on the counterpart disposed in the chamber in which the substrate of the glass material is loaded and processed, the substrate support support pin,
  • the support pin is formed of a quartz material, and the support pin is coated with a material lower than the hardness of the substrate.
  • a support pin for supporting a substrate and a substrate processing apparatus using the same include a support pin for supporting the substrate being covered by a cap formed of a metal material or carbon steel having a hardness lower than that of the substrate, or the hardness of the substrate ( It is coated with a metal material or carbon steel having a lower hardness, or is formed of a metal material or carbon steel having a hardness lower than the hardness of the substrate. Accordingly, since scratches are prevented from occurring on the substrate by the support pins, the reliability of the product is improved.
  • FIG. 1 is a perspective view of a substrate processing apparatus according to an embodiment of the present invention.
  • FIG. 2 is a perspective view showing any one boat portion shown in FIG.
  • FIG. 3 is an enlarged view of the boat shown in FIG.
  • FIG. 4 is a perspective view of a boat portion according to another embodiment of the present invention.
  • the treatment of the substrate refers to a concept including a process of heating and cooling a substrate, all processes for depositing a predetermined film on the substrate, annealing of the film deposited on the substrate, and all heat treatment processes for crystallization or phase change. To be understood.
  • FIG. 1 is a perspective view of a substrate processing apparatus according to an embodiment of the present invention.
  • the substrate processing apparatus includes a main body 110 formed in a substantially rectangular parallelepiped shape to form an appearance, and a chamber 110a in which the substrate 50 is processed is formed inside the main body 110. Is formed.
  • the main body 110 may be formed in various shapes according to the shape of the substrate 50 as well as the rectangular parallelepiped shape, and the chamber 110a is provided as a closed space.
  • the front surface of the main body 110 is opened so that the door 113 is installed, and the door 113 opens and closes the chamber 110a.
  • the substrate 50 is supported by an arm (not shown) of the robot, and the substrate 50 is loaded into the chamber 110a.
  • substrate 50 is processed in the state which closed the door 113 and closed the chamber 110a.
  • a supporter 120 (see FIG. 2) supporting the substrate 50, a cross support bar 130, a boat 140, a heater (not shown) for heating the substrate 50, and A cooling tube (not shown) or the like for cooling the substrate 50 is provided.
  • FIG. 2 is a perspective view showing any one boat portion shown in FIG. 1, and FIG. 3 is an enlarged view of the boat shown in FIG. 2.
  • the supporter 120 is installed inside the main body 110.
  • the supporter 120 includes a pedestal 121 contacting the bottom surface of the main body 110 forming the chamber 110a, a support 123 vertically extending from one end of the pedestal 121, and a support 123. It has a plurality of support ribs 125 which are formed to extend horizontally from the side and are stacked vertically and having a mutual interval.
  • the supporters 120 are provided in pairs opposed to each other to form a set, and the supporters 120 constituting the set are respectively installed at the front edge and the rear edge of the main body 110. And, the support ribs 125 of the supporter 120 forming a set face each other.
  • cross support bar 130 One end side and the other end side of the cross support bar 130 are fixed to and supported by the support ribs 125 of the supporter 120 that constitute the set.
  • the cross support bars 130 supported by the support ribs 125 of the supporters 120 forming each set are naturally arranged to be vertically parallel to each other.
  • each of the cross support bars 130 supported by the support ribs 125 of the supporter 120 constituting any one set is supported by the support ribs 125 of the supporter 120 constituting the other set, respectively.
  • each cross support bar 130 is positioned at the same height.
  • a locking ring 133 is formed at an outer circumferential surface of the end support side of the cross support bar 130, and a locking ring 133 is supported at the support rib 125.
  • the locking grooves 125a to be inserted and coupled are respectively formed.
  • the boat 140 has a pair of support bars 141 and a plurality of connection bars 143 interconnecting the support bars 141 disposed to face each other with a distance therebetween, and is installed on the cross support bars 130. do.
  • the front end side of the support bar 141 is provided to support each one of the cross support bar 130 located in the front, the rear end side is supported to each other cross support bar 130 located in the rear.
  • the front end portion of the support bar 141 is formed with a locking piece 145 is fixed to the cross support bar 130 located in front.
  • the shape of the locking piece 145 is formed in a semicircular shape that corresponds to the outer shape of the cross support bar 130.
  • a bar-shaped support piece 147 to be mounted and supported on the cross support bar 130 located behind is formed.
  • the support piece 147 may be formed on the connection bar 143 located on the rear end side of the pair of support bars 141.
  • the boat 140 Since the engaging piece 145 formed in a semicircular shape is supported while wrapping the upper outer surface of the cross support bar 130, and the support piece 147 is mounted and supported on the cross support bar 130, the boat 140 is firmly supported. do. In addition, since the engaging piece 145 of the boat 140 is formed in a semi-circular shape and is supported by the cross support bar 130, the boat 140 crosses the support bar 130 only by lifting the boat 140 upward. Separated from. Thus, the boat 140 can be easily separated from the cross support bar 130.
  • the support bar 141 and the connection bar 143 are provided with a plurality of support pins 149a and 149b on which the substrate 50 is mounted and supported. Since a plurality of support pins 149a and 149b are provided at the support bar 141 and the connection bar 143 at predetermined intervals, the substrate 50 is prevented from sagging due to its own weight.
  • Coupling grooves 141a and 143a are formed in the support bar 141 and the connection bar 143, respectively, and the support pins 149a and 149b are detachably coupled to the coupling grooves 141a and 143a, respectively. Then, the support pins 149a and 149b may be concentrated on a portion where the substrate 50 sags, and the position of the support pins 149a and 149b may be adjusted according to the size of the substrate 50.
  • the substrate 50 is formed of glass material.
  • the support pins 149a and 149b are formed of a quartz material having a higher hardness of the hardness of the substrate 50. For this reason, since the hardness of the support pins 149a and 149b is higher than the hardness of the board
  • the support pins 149a and 149b according to the present embodiment are provided with means for preventing scratches from occurring in the substrate 50.
  • the means may be formed by caps 149aa and 149bb formed on the upper ends of the support pins 149a and 149b in contact with the substrate 50 and having a hardness lower than that of the substrate 50. Can be prepared.
  • the caps 149aa and 149bb may have molybdenum (Mo), nickel (Ni), aluminum (Al), tungsten (W), antimony (Sb), or arsenic having a hardness lower than that of the substrate 50.
  • the caps 149aa and 149bb may be formed of oxides or nitrides of the respective metal materials.
  • the caps 149aa and 149bb may include molybdenum (Mo), nickel (Ni), aluminum (Al), tungsten (W), antimony (Sb), arsenic (As), and the like, which have a hardness lower than that of the substrate 50.
  • the caps 149aa and 149bb may be formed of an oxide or a nitride of the metal material.
  • caps 149aa and 149bb may be formed of carbon steel having a hardness lower than that of the substrate 50.
  • the means for preventing scratches on the substrate 50 may be provided by coating the support pins 149a and 149b with a material having a hardness lower than that of the support pins 149a and 149b.
  • the support pins 149a and 149b may include molybdenum (Mo), nickel (Ni), aluminum (Al), tungsten (W), antimony (Sb), and the like, which have a hardness lower than that of the substrate 50.
  • the support pins 149a and 149b may be coated by oxides or nitrides of the respective metal materials.
  • the support pins 149a and 149b include molybdenum (Mo), nickel (Ni), aluminum (Al), tungsten (W), antimony (Sb), and arsenic (As) having a hardness lower than that of the substrate 50.
  • the support pins 149a and 149b may be coated by an oxide or nitride of the metal material.
  • the support pins 149a and 149b may be coated by carbon steel having a hardness lower than that of the substrate 50.
  • the means for preventing the scratch from occurring in the substrate 50 may be provided by forming the support pins 149a and 149b itself from a metal material having a hardness lower than that of the substrate 50.
  • the support pins 149a and 149b may include molybdenum (Mo), nickel (Ni), aluminum (Al), tungsten (W), antimony (Sb), and the like, which have a hardness lower than that of the substrate 50.
  • the support pins 149a and 149b may be formed of oxides or nitrides of the respective metal materials.
  • the support pins 149a and 149b include molybdenum (Mo), nickel (Ni), aluminum (Al), tungsten (W), antimony (Sb), and arsenic (As) having a hardness lower than that of the substrate 50.
  • the support pins 149a and 149b may be formed of an oxide or nitride of the metal material.
  • the support pins 149a and 149b may be formed of carbon steel having a hardness lower than that of the substrate 50.
  • the support pins 149a and 149b according to the present exemplary embodiment are covered by caps 149aa and 149bb formed of metal or carbon steel having a hardness lower than that of the substrate 50 or the hardness of the substrate 50. It is coated with a metal material or carbon steel having a hardness lower than the hardness, or is formed with a metal material or carbon steel having a hardness lower than the hardness of the substrate 50. Accordingly, since scratches are prevented from occurring on the substrate 50 by the support pins 149a and 149b, the reliability of the product is improved.
  • FIGS. 1 to 3 are perspective views of a boat part according to another exemplary embodiment of the present invention, and illustrates only differences from FIGS. 1 to 3.
  • the cross support bar 230 is installed directly supporting the main body 210.
  • the cross support bars 230 are provided in pairs, and the pair of cross support bars 230 are positioned at the same height with respect to the lower surface of the main body 210 and are disposed in parallel to each other.
  • one cross support bar 230 is supported on both sides of the front side of the main body 210 adjacent to the door (not shown), the other cross support bar 230 on both sides of the rear side of the main body 210 Supported.
  • the left end side and the right end side of the cross support bar 230 are located outside the body 210 through the left and right sides of the body 210, and the cross support bar 230 is disposed on the left and right sides of the body 210.
  • Fixing bracket 235 for supporting is coupled.
  • the upper surface of the fixing bracket 235 is formed with a support groove 235a and a locking groove 235b in a form orthogonal to each other.
  • the lower end portion of the cross support bar 230 exposed to the outside of the main body 210 is inserted and supported in the support groove 235a formed in parallel with the cross support bar 230.
  • the locking ring 233 formed on the outer peripheral surface of the end side of the cross support bar 230 is inserted and supported in the locking groove 235b perpendicular to the cross support bar 230.
  • the cross support bar 230 Since the end side of the cross support bar 230 is inserted and supported in the support groove 235a, and the locking ring 233 is inserted and supported in the locking groove 235b, the cross support bar 230 is fixed by the bracket 235. It is firmly supported.
  • the substrate processing apparatus according to the present embodiment illustrated in FIG. 4 is configured such that the cross support bar 230 is coupled to and supported by the main body 210, and the configuration of the boat 240 is illustrated in FIGS. 1 to 3. It is the same as the structure of 140.
  • one or a plurality of substrates 50 may be mounted and supported on the boats 140 and 240 of the present invention.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

La présente invention a trait à une broche de support permettant de supporter un substrat et à un appareil de traitement de substrat utilisant celle-ci. Dans la broche de support permettant de supporter un substrat et l'appareil de traitement de substrat utilisant celle-ci selon la présente invention, la broche de support permettant de supporter un substrat est recouverte d'un capot qui est constitué d'un matériau métallique ou d'un acier au carbone doté d'une dureté inférieure à la dureté du substrat ou est constitué d'un matériau métallique ou d'un acier au carbone doté d'une dureté inférieure à la dureté du substrat. Par conséquent, il est possible d'empêcher toute éraflure sur le substrat due à la broche de support et, de la sorte, la fiabilité d'un produit est améliorée.
PCT/KR2012/010012 2011-11-28 2012-11-26 Broche de support permettant de supporter un substrat et appareil de traitement de substrat utilisant celle-ci WO2013081335A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2011-0125081 2011-11-28
KR1020110125081A KR20130059011A (ko) 2011-11-28 2011-11-28 기판 지지용 지지핀
KR10-2011-0127649 2011-12-01
KR1020110127649A KR101317328B1 (ko) 2011-12-01 2011-12-01 기판 처리 장치

Publications (1)

Publication Number Publication Date
WO2013081335A1 true WO2013081335A1 (fr) 2013-06-06

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PCT/KR2012/010012 WO2013081335A1 (fr) 2011-11-28 2012-11-26 Broche de support permettant de supporter un substrat et appareil de traitement de substrat utilisant celle-ci

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TW (1) TW201330170A (fr)
WO (1) WO2013081335A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019127627A1 (fr) * 2017-12-27 2019-07-04 深圳市华星光电技术有限公司 Dispositif de support de plaque de base pour dispositif de pulvérisation sous vide
WO2023184007A1 (fr) * 2022-03-28 2023-10-05 Spheretech Research Corp. Gabarit destiné à être utilisé dans un lpcvd

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020071971A (ko) * 2000-01-28 2002-09-13 스티그 알티피 시스템즈 게엠베하 기판 열처리 장치
KR20050081179A (ko) * 2004-02-12 2005-08-18 어플라이드 머티어리얼스, 인코포레이티드 처리 챔버
KR100600515B1 (ko) * 2005-01-20 2006-07-13 (주)상아프론테크 크로스바 설치용 연결구가 구비된 기판 적재용 카세트
KR100707788B1 (ko) * 2005-02-04 2007-04-13 주식회사 테라세미콘 박막 트랜지스터 액정표시장치 열처리방법 및 그 열처리장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020071971A (ko) * 2000-01-28 2002-09-13 스티그 알티피 시스템즈 게엠베하 기판 열처리 장치
KR20050081179A (ko) * 2004-02-12 2005-08-18 어플라이드 머티어리얼스, 인코포레이티드 처리 챔버
KR100600515B1 (ko) * 2005-01-20 2006-07-13 (주)상아프론테크 크로스바 설치용 연결구가 구비된 기판 적재용 카세트
KR100707788B1 (ko) * 2005-02-04 2007-04-13 주식회사 테라세미콘 박막 트랜지스터 액정표시장치 열처리방법 및 그 열처리장치

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019127627A1 (fr) * 2017-12-27 2019-07-04 深圳市华星光电技术有限公司 Dispositif de support de plaque de base pour dispositif de pulvérisation sous vide
WO2023184007A1 (fr) * 2022-03-28 2023-10-05 Spheretech Research Corp. Gabarit destiné à être utilisé dans un lpcvd

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