WO2013081109A1 - Dispositif de correction de défaut et procédé de correction de défaut - Google Patents

Dispositif de correction de défaut et procédé de correction de défaut Download PDF

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Publication number
WO2013081109A1
WO2013081109A1 PCT/JP2012/081095 JP2012081095W WO2013081109A1 WO 2013081109 A1 WO2013081109 A1 WO 2013081109A1 JP 2012081095 W JP2012081095 W JP 2012081095W WO 2013081109 A1 WO2013081109 A1 WO 2013081109A1
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Prior art keywords
defect
needle
correction
size value
correction apparatus
Prior art date
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PCT/JP2012/081095
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English (en)
Japanese (ja)
Inventor
博明 大庭
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Ntn株式会社
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Publication date
Application filed by Ntn株式会社 filed Critical Ntn株式会社
Priority to CN201280058501.4A priority Critical patent/CN103959108A/zh
Publication of WO2013081109A1 publication Critical patent/WO2013081109A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/72—Repair or correction of mask defects
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/7065—Defects, e.g. optical inspection of patterned layer for defects
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G01N2021/8861—Determining coordinates of flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G01N2021/8874—Taking dimensions of defect into account
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N2021/9513—Liquid crystal panels
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/201—Filters in the form of arrays
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133512—Light shielding layers, e.g. black matrix
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84—Inspecting
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Definitions

  • the present invention relates to a defect correction apparatus and a defect correction method, and more particularly to a defect correction apparatus and a defect correction method for correcting defects in a black matrix portion and a colored portion of a color filter.
  • Patterns, circuits, and the like are formed on substrates used in flat panel displays such as liquid crystal displays, PDPs (Plasma Display Panels), organic EL (Electro Luminescence) displays, and SEDs (Surface-conduction Electron-emitter Displays).
  • a circuit pattern is formed on a semiconductor wafer which is a semiconductor substrate.
  • a color filter which is a component part of a liquid crystal display, is formed with a lattice pattern (a material such as chromium, chromium oxide and resin) and a colored portion (hereinafter also referred to as a color filter portion or a CF portion) called a black matrix. .
  • a lattice pattern a material such as chromium, chromium oxide and resin
  • a colored portion hereinafter also referred to as a color filter portion or a CF portion
  • black defects and white defects may occur.
  • black defects occur due to the black matrix protruding to the color filter portion (no color at this stage).
  • white defects occur due to the lack of part of the black matrix.
  • black defects occur due to color mixing, and white defects occur due to color loss.
  • black defects are corrected with laser light, or ink is applied to the tip of the needle and the white ink is filled by attaching the applied ink to the substrate. It has been.
  • the defect correction apparatus includes an imaging unit and an image processing unit, calculates a range of defects to be corrected by image processing or the like, the calculated correction range, and the actual defect location that was shot It is configured so that the operator can compare. The operator can operate the defect correction apparatus so that the calculated correction range is within an appropriate correction range based on the actual defect location.
  • the number of times of ink application by the needle is determined by the application pitch and the vertical and horizontal size of the defect.
  • the larger the coating pitch the smaller the number of coatings.
  • the larger the coating diameter the larger the coating pitch. If the defect correction work is made more efficient, the defect can be corrected in a shorter time as the number of times of the ink application work by the needle is smaller, and the time efficiency is better.
  • Patent Document 1 a case of correcting a defect of 120 ( ⁇ m) ⁇ 120 ( ⁇ m) using a needle having a coating diameter of 55 ( ⁇ m) (application pitch is 50 ( ⁇ m)) is considered. . Since the application pitch of this needle is 50 ( ⁇ m), according to the “ink application position calculation” in paragraph 0174 of Patent Document 1, a total of 9 times of ink application is required 3 times ⁇ 3 times. On the other hand, when a needle having a coating diameter of 80 ( ⁇ m) (with a coating pitch of 75 ( ⁇ m)) is used, the correction can be completed in a total of four coating times of 2 ⁇ 2.
  • the ink application range is also increased. If the ink application range is large, the ink may be applied to a portion that should not be corrected at the time of correction work. For this reason, there is a possibility that the time required for the correction work becomes long instead of re-correction.
  • an object of the present invention is to provide a defect correction apparatus that enables an efficient correction work according to a defect.
  • the defect correction apparatus is for correcting a defect of a substrate.
  • the defect correcting device includes a plurality of needles having different coating diameters for correcting defects, an image processing unit for detecting a defective portion of the substrate, and a defect size indicating a size of the defect based on the detected image of the defective portion.
  • a calculation unit that calculates a value, a selection unit that selects a needle having an application diameter to be used for correction according to the calculated defect size value, and a correction processing unit that corrects a defect using the needle having the selected application diameter And comprising.
  • the selection unit stores a needle information table in which each of the plurality of needles is associated with a defect size value for which each needle is to be used, and selection is associated with the calculated defect size value.
  • the selected needle may be selected from the needle information table.
  • the image processing unit includes a determination unit that determines whether the defect portion is generated in the black matrix or the color filter opening, and the calculation unit is configured to determine the defect portion according to the determination result of the determination unit. May occur in the black matrix, the defect size value may be calculated by a calculation method corresponding to the generated site.
  • the image processing unit determines whether the site of the occurrence location is a long side portion or a short side portion of the black matrix when the defect location occurs in the black matrix, and the calculation unit determines whether the defect location is a determination unit.
  • the defect size value may be calculated based on the line width of the part depending on whether the part corresponding to the occurrence part is the long side part or the short side part.
  • the calculation unit may calculate the defect size value based on the minimum value of the sides of the rectangle circumscribing the defect part when the determination unit determines that the defect part is generated in the black matrix.
  • the calculation unit may calculate an average of the vertical and horizontal sizes of the rectangle surrounding the detected defect portion as the defect size value.
  • the calculation unit may calculate the defect size value based on the major axis length and minor axis length of an ellipse equivalent to the detected defect location.
  • the correction processing unit stores an overlap amount for correcting the ink application range for each ink, and uses the overlap amount of the ink corresponding to the needle to determine the application diameter of the needle selected by the selection unit. It is good also as correcting and determining the application position of a needle
  • correction processing unit may include a cutting laser irradiation unit and a grouping unit for grouping cut locations.
  • the substrate may be a substrate used for a flat panel display.
  • the substrate may be a color filter.
  • a method for a defect repair apparatus to repair a defect in a substrate includes a plurality of needles having different application diameters.
  • a method for correcting a defect on a substrate includes a step in which a defect correction device detects a defect location based on an image of the substrate taken by a camera, and a size of the defect based on the detected image of the defect location.
  • the defect correction apparatus calculates the size of the defect that is within the correction range as the defect size value, and selects a needle having a coating diameter suitable for correction according to the calculation result. Therefore, it can correct using the needle
  • FIG. 1 is a diagram showing an overall configuration of a defect correction apparatus 100 according to an embodiment of the present invention.
  • 3 is a perspective view showing the main parts of an observation optical system 31 and an ink application mechanism 34.
  • FIG. 3 is a diagram showing the main parts of an observation optical system 31 and an ink application mechanism 34.
  • FIG. 3 is a diagram showing the main parts of an observation optical system 31 and an ink application mechanism 34.
  • FIG. 3 is a diagram showing the main parts of an observation optical system 31 and an ink application mechanism 34.
  • It is a functional block diagram which shows the structure of the defect correction apparatus 100 of this invention. It is a figure which shows the needle information table. It is a figure which shows the application diameter of a needle
  • FIG. 4 is a flowchart showing a process for correcting a defect by the defect correcting apparatus 100. It is a flowchart which shows the process which calculates a defect size value. It is a figure which shows the rectangle circumscribed to the defect detected based on the extraction result of the defect by the image process part 21.
  • FIG. It is a figure which shows the relationship between the defect which generate
  • FIG. 1 is a diagram showing an overall configuration of a defect correction apparatus 100 according to an embodiment of the present invention.
  • the defect correction apparatus 100 includes a correction head unit composed of an observation optical system 31, a CCD camera 32, a cutting laser device 33, an ink application mechanism 34, and an ink curing light source 35, and a substrate to be corrected. 5, a Z-axis table 36 that moves in the direction perpendicular to the liquid crystal color filter substrate (Z-axis direction), an X-axis table 37 that mounts the Z-axis table 36 and moves in the X-axis direction, and a substrate 5.
  • a Y-axis table 38 that is moved in the Y-axis direction
  • a control computer 39 that controls the operation of the entire apparatus
  • a monitor 40 that displays images taken by the CCD camera 32
  • an operation panel 41 for inputting a command from.
  • the observation optical system 31 observes the surface state of the substrate 5 and the state of the correction ink applied by the ink application mechanism 34.
  • An image observed by the observation optical system 31 is converted into an electrical signal by the CCD camera 32 and displayed on the monitor 40.
  • the cutting laser device 33 removes unnecessary portions on the substrate 5 by irradiating them with laser light via the observation optical system 31.
  • the ink application mechanism 34 corrects the white defect generated on the substrate 5 by applying correction ink.
  • the ink curing light source 35 includes, for example, a CO2 laser, and cures the correction ink applied by the ink application mechanism 34 by irradiating it with laser light.
  • This apparatus configuration is an example.
  • a Z-axis table 36 on which an observation optical system 31 and the like are mounted is mounted on an X-axis table 37, and an X-axis table 37 is further mounted on a Y-axis table 38.
  • a configuration called a gantry system that allows the 36 to move in the XY directions may be used, and the Z-axis table 36 on which the observation optical system 31 and the like are mounted can be moved relative to the correction target substrate 5 in the XY directions. Any configuration is possible.
  • FIG. 2 is a perspective view showing the main parts of the observation optical system 31 and the ink application mechanism 34.
  • 3A, FIG. 3B, and FIG. 3C are views showing the main part from the direction A in FIG. 2 and showing the ink application operation.
  • the defect correcting apparatus includes a movable plate 42, a plurality of (for example, five) objective lenses 2 having different magnifications, and a plurality (for applying different color inks). For example, five coating units 43 are provided.
  • the movable plate 42 is provided between the lower end of the observation barrel 31a of the observation optical system 31 and the substrate 5 so as to be movable in the X-axis direction and the Y-axis direction.
  • the movable plate 42 is formed with five through holes 42a corresponding to the five objective lenses 2, respectively.
  • the five through holes 42a are arranged at predetermined intervals in the Y-axis direction.
  • Each objective lens 2 is fixed to the lower surface of the movable plate 42 so that its optical axis coincides with the center line of the corresponding through hole 42a.
  • the optical axis of the observation barrel 31a and the optical axis of each objective lens 2 are arranged in the Z-axis direction perpendicular to the X-axis direction and the Y-axis direction.
  • the five coating units 43 are fixed to the lower surface of the movable plate 42 at a predetermined interval in the Y-axis direction. Each of the five coating units 43 is disposed adjacent to the five objective lenses 2.
  • the defect correction apparatus 100 can correct a defect using a needle having a desired application diameter among a plurality of needles by using, for example, a mechanism as shown in FIG. 2 as the ink application mechanism 34.
  • FIG. 4 is a functional block diagram showing the configuration of the defect correction apparatus 100 of the present invention.
  • FIG. 4 mainly illustrates components for selecting a needle having a coating diameter corresponding to the size of the defect, shows a partial configuration of the defect correction apparatus 100 shown in FIG. The illustration of this configuration is omitted.
  • control computer 39 includes a control unit 22 and an image processing unit 21.
  • the control unit 22 includes a storage unit 23, a CPU (Central Processing Unit) (not shown), and the like.
  • a CPU Central Processing Unit
  • the control unit 22 functions as a control computer 39 by reading and executing a program stored in the storage unit 23.
  • the storage unit 23 stores a needle information table 24.
  • the needle information table 24 indicates which needle should be selected for each defect size in order to select a needle for ink application. Details will be described later with reference to the drawings.
  • the image processing unit 21 specifies a defect position by performing image processing on a defect image observed by the observation optical system 31 and converted into an electric signal by the CCD camera 32.
  • control unit 22 includes a calculation unit 25 and a selection unit 26 as shown in FIG.
  • the control unit 22 calculates a defect size value indicating the size of the defect based on the defect location detected by the image processing unit 21.
  • the control unit 22 selects a needle for ink application by the selection unit 26. This process will be described later.
  • the control unit 22 controls the ink application mechanism 34 and the like of the correction processing unit 50 so that ink application or the like is performed with the needle selected in this way.
  • the correction processing unit 50 includes an ink application mechanism 34, a cutting laser device 33, and the like.
  • the ink application mechanism 34 has a plurality of needles (needle 34 ⁇ / b> A, needle 34 ⁇ / b> B, needle 34 ⁇ / b> C,...), Selects a needle in accordance with instructions from the control computer 39, and selects the selected needle.
  • the defect correction process is executed in accordance with the instruction of the control computer 39.
  • FIG. 5A shows a needle information table 24, which shows for each needle used for application, predetermined information about the needle and how large the defect size is suitable for the needle.
  • One piece of information in the needle information table 24 includes a needle 51, an ink color 52, a coating diameter 53, a coating pitch 54, a defect size lower limit 55, and a defect size upper limit 56.
  • the needle 51 is an area for storing information for identifying the needle.
  • the ink color 52 is an area indicating which color of the color filter is used for each needle indicated by the needle 51.
  • the color types indicated by the ink color 52 correspond to the openings of the pixels constituting the color filter, and are generally three colors of red, green, and blue which are the three primary colors. However, it may be a single color or four or more colors.
  • the needle A is a needle corresponding to red ink, and is used for correcting a defect in the red opening of the color filter.
  • the application diameter 53 indicates the diameter value of the ink when applied with the needle indicated by the needle 51.
  • the unit is ⁇ m.
  • the application pitch 54 indicates the distance from the center of the adjacent application position when application is continuously performed at a plurality of locations with the needle indicated by the needle 51. That is, it indicates how far the distance can be continuously applied using a needle.
  • FIG. 5B is a diagram showing the coating diameter.
  • FIG. 5C is a diagram showing a coating pitch.
  • the circle shown in FIG. 5B imitates the shape of ink applied using a needle.
  • the diameter of the ink applied by the needle is the application diameter.
  • ink is applied once to a dummy substrate and the measured value is used as the application diameter.
  • the distance between the centers of the respective inks when the ink is continuously applied by the needle is defined as the application pitch.
  • the coating pitch a value experimentally obtained from the properties of the ink based on the coating diameter is used.
  • the defect size lower limit 55 and the defect size upper limit 56 are data used in the needle selection process by the control unit 22, and indicate how large the needle is suitable for the defect. A needle is selected based on the defect size lower limit 55 and the defect size upper limit 56 in accordance with the defect size value obtained by the process of calculating the size of the defect described later.
  • the needle A is used for defect correction of the opening of the red pixel, and the defect size value indicating the size of the defect is determined to be smaller than 75 ( ⁇ m) by the calculation of the control unit 22. Indicates the needle to be used in the case.
  • the defect size lower limit 55 and the defect size upper limit 56 have the same value (75 ⁇ m).
  • the control unit 22 indicates the defect size value calculated by the processing described later as the defect size lower limit 55. This is because it is determined whether the value is equal to or greater than the value to be selected, and the needle is selected when the determination condition is satisfied.
  • FIG. 6 is a diagram showing the relationship between the black matrix portion, the color filter portion, and the picture element in the color filter.
  • the color filter to be modified includes a plurality of picture elements.
  • a pixel element start DS and a pixel element end DE exist at the intersections of the black matrix portions formed vertically and horizontally. Further, the beginning DS of the picture element is referred to as a color filter position.
  • the image processing unit 21 specifies the position of this color filter. In addition, the range from the start DS of the picture element to the end DE of the picture element, which is surrounded by a square in FIG.
  • a picture element usually has a plurality of pixels.
  • a set of pixels having a value of 1 in a picture element is a color filter portion of the picture element (indicated by a color filter portion CF in the figure), and a set of pixels having a value of 0 (hatched portion in the figure) is a black matrix of the picture element. (Shown as black matrix BM in the figure).
  • each pixel of each picture element has one of RGB (Red, Green, Blue) different from each other, and is repeatedly formed at a constant period.
  • FIG. 7 is a flowchart showing a process for correcting a defect by the defect correcting apparatus 100.
  • the defect correction apparatus 100 detects the defect by controlling the image processing unit 21 and the like by the control computer 39 and corrects the defect by the correction processing unit 50.
  • the control computer 39 detects a defect on the substrate by the image processing unit 21 (step S701).
  • the processing for detecting defects on the substrate is performed by image processing and is described in detail in Patent Document 1 (Japanese Patent Application Laid-Open No. 2008-3503) and the like, and thus description thereof is omitted.
  • the control computer 39 calculates a defect size value indicating the size of the detected defect by the control unit 22 (step S703).
  • the processing in step S703 will be described in detail later.
  • the control computer 39 determines a needle of an appropriate size by the control unit 22 with reference to the needle information table 24 in accordance with the calculated defect size value (step S705).
  • the processing in step S705 will be described in detail later.
  • the control computer 39 executes defect correction processing by the correction processing unit 50 using the determined needle (step S707).
  • a method of determining the ink application position based on the application pitch and the like for the detected defect will be described later.
  • FIG. 8 is a flowchart showing a process for calculating the defect size value.
  • the control unit 22 acquires the coordinates of the vertices of the rectangle circumscribing the detected defect based on the defect extraction result by the image processing unit 21, and the vertical size H and the horizontal size W of the rectangle based on the difference between the vertices. Is acquired (step S801).
  • FIG. 9 is a diagram illustrating a rectangle circumscribing the defect detected based on the defect extraction result by the image processing unit 21. Since the method for determining the rectangle circumscribing the defect and the method for obtaining the coordinates of the vertex are described in detail in Patent Document 1 and the like, description thereof will be omitted.
  • the control unit 22 determines whether the defect occurrence location extracted by the image processing unit 21 is a pixel opening or a black matrix (step S803). Note that, when the defect is extracted by the image processing unit 21, it is determined whether the defect occurrence place is a pixel opening or a black matrix. This determination process will be described later with reference to FIG.
  • step S803 when it is determined that the defect occurrence location is the opening of the pixel, the control unit 22 calculates the defect size value D by the following equation (1) (step S805).
  • Defect size value D Min (W, H) (2) Min () is a function that outputs the minimum value among the values listed in parentheses (in this example, W and H). In other words, in this embodiment, when the defect occurs in the black matrix, the control unit 22 outputs the smaller value of W and H as the defect size value.
  • the control unit 22 stores the calculated defect size value D in the storage unit 23 (step S809).
  • the defect size value D is calculated based on Equation (2).
  • FIG. 10 is a diagram showing the relationship between the defects generated in the black matrix and the application diameter of the needles used for defect correction.
  • ink is applied and the missing portions are filled and corrected.
  • the ink protrudes into the color filter portion and becomes a black defect in the color filter portion.
  • the white defect 65b when the white defect 65b is corrected with a needle having a coating diameter that matches the longer vertical and horizontal sizes, the amount of ink that protrudes to the pixels such as the R pixel 62 and the G pixel 63 becomes larger.
  • the defect when the defect is corrected with a needle having a coating diameter that matches the shorter one of the vertical and horizontal sizes of the defect, such as the white defect 65c, the amount of ink protruding to the pixels such as the G pixel 63 and the B pixel 64 becomes small.
  • white defect 65a and white defect 65b in FIG. 10 when the line width of the black matrix is different between the short side and the long side, it is determined whether the defect occurs on the short side or the long side.
  • a needle having a coating diameter close to the line width of each of the short side and the long side may be used.
  • the line width of the short side is wider than the long side. For this reason, a thicker needle is used for white defects occurring on the short side (white defect 65a in the figure), and a black matrix is used for white defects occurring on the long side (white defect 65b in the figure).
  • a needle having a thinner coating diameter may be used in accordance with the line width.
  • the extraction range is a range of (xi, yi) to (xi + px, yi + py) when the pixel pitch is (px, py).
  • the pixel pitch (px, py) is given in advance.
  • a rectangle circumscribing the collection of dots having a value of 1 is obtained, and the center coordinates are set to (rcx, rcy) and the vertical and horizontal sizes are set to (rw, rh). Further, a range of one pixel is defined.
  • the upper left corner coordinates of the pixel are (rcx-px / 2, rcy-py / 2) from (rcx, rcy) and the pixel pitch (px, py), and (px, py) from this coordinate toward the lower right This range is defined as one pixel.
  • a set of dots having a value of 1 is interpreted as an opening, and a set of dots having a value of 0 is interpreted as a black matrix.
  • the black matrix dot group is divided into (1) a group of short side dots, (2) a group of long side dots, and (3) a group of other dots.
  • a collection of dots other than the long side portion and the short side portion corresponds to R at the corner portion of the black matrix.
  • FIG. 11 is a diagram illustrating an extraction result of each part of the pixel.
  • (1) the short side is interpreted as a set of values 0 in contact with the upper and lower sides of the opening. That is, a set of dots having a value of 0 in which the horizontal coordinate ranges from rcx-px / 2 to rcx + px / 2 and the vertical coordinate ranges from rcy-py / 2 to rcy-rh / 2, and the horizontal direction is A group of dots with a value of 0 in the same range and having a vertical coordinate in the range of rcy + rh / 2 to rcy + py / 2 is interpreted as a group of dots on the short side.
  • a set of long-side dots has a vertical coordinate of rcy-py / of zero-valued dots excluding the short-side portion extracted as in (1) above.
  • 2 to rcy + py / 2 in the horizontal coordinate range of rcx-px / 2 to rcx-rw / 2 in the range of 0 the vertical direction is the same range and the horizontal coordinate is rcx + rw / 2 ⁇
  • each part in FIG. 11 is held using the upper left coordinates (xs, ys) of the search target S shown in “Generation of mask image of color filter portion” in Patent Document 1 as the origin. Since each position of the search target S on the binarized input image b (x, y) is detected by pattern matching, pixels are plotted by plotting each part in FIG. 11 with the coordinates of the detected position as the origin. A mask image of each part is generated.
  • FIG. 12A, FIG. 12B, FIG. 12C, and FIG. 12D are diagrams showing mask images of each part of the pixel.
  • four types of images corresponding to the arrangement of the pixels of the binarized input image b (x, y) are created as shown in FIGS. 12A, 12B, 12C, and 12D.
  • the image shown in FIG. 12A is the opening mask image
  • the image shown in FIG. 12B is the short side mask image
  • the image shown in FIG. 12C is the long side mask image
  • the image shown in FIG. 12D is the remaining mask image. Call.
  • each part in FIG. 11 is held with the upper left coordinates (xs, ys) of the search target S shown in “Generation of mask image of color filter section” in Patent Document 1 as the origin. Since each position of the search target S on the binarized input image b (x, y) is detected by pattern matching, if each part of FIG. 11 is plotted with the coordinates of the detected position as the origin, FIG. Four types of images shown in FIGS. 12B, 12C, and 12D can be created.
  • step S703 the defect size value calculation method can be switched according to whether the defect occurrence location is an opening or a black matrix as described above.
  • FIG. 13 is a flowchart illustrating a process in which the control unit 22 determines a needle according to the defect size value D.
  • control unit 22 reads the defect size value D calculated in step S703 from the storage unit 23 (step S901).
  • the control unit 22 narrows down the needles used for the correction based on the color of the ink for correcting the defect.
  • the control unit 22 refers to the ink color 52 in the needle information table 24, and extracts a record that matches the ink color (for example, red) used for correction from the needle information table 24 (step S903).
  • step S905 When it is determined in step S905 that the lower limit value ⁇ the upper limit value, the control unit 22 has the defect size value D equal to or larger than the lower limit value indicated by the defect size lower limit 55 of the record and the defect size upper limit value of the record. It is determined whether it is less than the upper limit indicated by 56 (step S907).
  • step S907 If it is determined in step S907 that the defect size value D is not less than the lower limit value and less than the upper limit value (YES in step S907), the control unit 22 applies the needle indicated in this record to the ink application for defect correction. A needle for use is determined (step S909). If it is determined in step S907 that the conditional expression is not satisfied (NO in step S907), the control unit 22 determines whether there are any other uncompared records selected in step S903 (step S913). .
  • step S913 if there is a record that has not been compared with the defect size value D (YES in step S913), the control unit 22 repeats the process of step S905 using that record as a comparison target. If there is no record that is not compared with the defect size value D in step S913, one of the needles narrowed down in step S903 is determined as an ink application needle (step S915).
  • step S905 the control unit 22 determines whether the defect size value D is equal to or greater than the lower limit value indicated by the defect size lower limit 55 of the record (step S911).
  • step S911 If an affirmative determination is made in step S911 (YES in step S911), the control unit 22 proceeds to step S909, and the needle indicated in the record relating to this determination is used as an ink application needle for defect correction. Determination is made (step S909).
  • step S911 when the conditional expression is not satisfied (NO in step S911), the control unit 22 determines whether there are any other uncompared records selected in step S903 (step S913). Subsequent processing is the same as described above.
  • the above operation will be specifically described. It is assumed that the defect size value D of the defect to be corrected is 100 ( ⁇ m), and the defect in the red pixel is corrected.
  • the control unit 22 refers to the needle information table 24 and narrows the needles based on the ink color (red) (step S903).
  • the control unit 22 refers to the defect size lower limit 55 and the defect size upper limit 56 concerning the needle A (step S905).
  • step S905 since the lower limit value ⁇ the upper limit value in this case, the process proceeds to step S907, and the control unit 22 determines whether the defect size value D is greater than or equal to the lower limit value and less than the upper limit value (step S907).
  • step S911 in the case of the needle B, in order to satisfy the conditional expression (YES in step S911), the control unit 22 determines the needle B as a needle for ink application (step S909).
  • the ink application position by the needle and the cut position by the laser light are “ink application position calculation” in paragraph 0174 of Patent Document 1 and “laser light irradiation position (cut position) calculation” in paragraph 0227. Similarly, it is determined based on a rectangle circumscribing the defect.
  • a method for determining the ink application position will be described. Since the needle to be used is determined for each correction location, the control unit 22 refers to the needle information table 24 in FIG. 5A and acquires the application pitch p of the needle. In addition, the overlap amount r (%) is registered in advance for each ink. The overlapping amount r is an adjustment parameter for coping with the fact that the ink application range gradually changes and affects the correction range.
  • FIGS. 14A, 14B, and 14C are schematic diagrams illustrating the overlapping amount r.
  • 14A, 14B, and 14C show that the smaller the overlap amount r, the smaller the range in which ink is effectively applied.
  • the original coating diameter of the needle is indicated by a circle.
  • a rectangle indicates a rectangle circumscribing the defect portion.
  • the ink is applied in a range narrower than the original application diameter.
  • the ink used for correction gradually changes in viscosity after ink replacement, and may not reach all the defects at the time of ink application. In that case, white defects remain at the corners of the defects, and it is necessary to remove and apply the ink again, resulting in a reduction in work efficiency.
  • a parameter r that can be adjusted to ensure a certain amount of overlap between the applied ink and the periphery of the defect is provided as the overlap amount r.
  • this parameter may be held in the needle information table 24 of FIG. 5A.
  • the center coordinates (xst, yst) of the application circle at the start of application and the center coordinates (xed, yed) of the application circle at the end of application are determined as follows.
  • the offset amount ⁇ is calculated by the calculation formula shown in Formula (3).
  • ⁇ ⁇ (DI ⁇ r) / 100 ⁇ / 2 Expression (3)
  • (xst, yst) and (xed, yed) are determined. For example, when the coordinates of the upper left vertex of the rectangle circumscribing the defect shown in FIG. 9 are (xA, yA) and the coordinates of the diagonal vertex are (xC, yC), (xst, yst) is (xA + ⁇ , yA + ⁇ ) and (xed, yed) become (xC ⁇ , yC ⁇ ).
  • the cutting position is determined according to the procedure shown in “Laser beam irradiation position (cut position) calculation” in paragraph 0227 of Patent Document 1.
  • the position determined by the above procedure is set as a temporary cut position, and the cut portion is grouped so that the laser cut is completed as few times as possible.
  • FIG. 15 is a diagram illustrating grouping of cut locations. It is assumed that the temporary cut position is obtained as shown in FIG. Here, the portion where the illustrated lattice is shown darkly corresponds to the cut portion.
  • the grid is scanned from the upper left corner to search for the first cut site (in the figure, site A is the first cut site). Next, scan until a discontinuous point is found in either direction from the first cut part, and detect the part immediately before the discontinuous point.
  • site B The front side is designated as site B).
  • ⁇ ⁇ ⁇ From the first cut site (site A) to the site just before the discontinuity (site B), for each site, a new scan is performed until a discontinuity is found. In the figure, scanning is performed from the portion A in the vertical direction. This process is performed for each part up to the part B, and the part immediately before the discontinuous point found in the forefront is obtained in a new scan. In the figure, the part C corresponds.
  • the vertical and horizontal positions of the part A are (iA, jA), and the horizontal position iB of the part B and the vertical position jC of the part C are recognized as a group and grouped.
  • the cutting position is set by adjusting the slit size (Sx, Sy) to the vertical and horizontal size of the rectangle. calculate.
  • the defect size value D is calculated by a predetermined formula based on the rectangle circumscribing the defect.
  • the present invention is not limited to this, and a feature amount obtained by analyzing an image can be used as the defect size value D.
  • the length of the main axis length or the sub axis length of an ellipse equivalent to a defect can be used.
  • FIG. 16A, FIG. 16B, and FIG. 16C are diagrams showing calculation of defect size values using ellipses equivalent to defects.
  • FIG. 16A is a diagram illustrating a shape of a defect.
  • white areas are defined as defects.
  • FIG. 16B is a diagram showing an ellipse equivalent to the shape of the defect. Also, the coordinates of the pixels (dots) constituting the white area are (x, y).
  • the primary moment in the X direction (the total value of the X coordinates of the white dots in the figure) is expressed by the following formula 1.
  • the primary moment in the Y direction (the total value of the Y coordinates of white dots in the figure) is expressed by the following formula 2.
  • the secondary moment in the X direction (the total value of the squares of the X coordinates of white dots in the figure) is expressed by the following formula 3.
  • the secondary moment in the Y direction (the total value of the squares of the Y coordinates of white dots in the figure) is expressed by the following formula 4.
  • the main axis length L M the sub axis length L S , and ⁇ of the ellipse equivalent to the defect are calculated by the following equations 8 to 10.
  • FIG. 16C is a diagram showing a circumscribed rectangle for a similar defect. Comparing FIG. 16B with FIG. 16C, when the slit laser device 33 irradiates the laser beam, if the slit has a ⁇ rotation mechanism, the laser is irradiated in accordance with the elliptical shape, so that other than defects. It is possible to reduce the irradiation of the laser beam to this portion.
  • the area of the defect shown in the image may be used.
  • the defect correction apparatus 100 may not be able to detect the defect accurately. Therefore, in such a case, the operator may input the defect size value D by operating while looking at the monitor.
  • the present invention is used as an apparatus for correcting defects in substrates such as liquid crystal displays, PDPs, organic EL displays, and SEDs.

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Abstract

La présente invention porte sur un dispositif de correction de défaut qui comporte une pluralité d'aiguilles d'application et peut réaliser des opérations de correction efficaces selon des défauts dans un substrat. Un dispositif de correction de défaut (100) comporte : un mécanisme d'application d'encre (34) qui comprend une pluralité d'aiguilles, pour lesquelles les diamètres d'application diffèrent, pour corriger des défauts ; une unité de traitement d'image (21) qui détecte des positions de défaut dans le substrat ; une unité de calcul (25) qui calcule des valeurs de dimension de défaut qui représentent la dimension de défauts sur la base d'images pour des positions de défaut qui ont été détectées ; une unité de sélection (26) qui sélectionne une aiguille ayant un diamètre d'application qui devrait être utilisée pour une correction selon la valeur de dimension de défaut qui a été calculée ; et une unité de traitement de correction (50) qui corrige le défaut à l'aide d'une aiguille ayant un diamètre d'application qui a été sélectionné.
PCT/JP2012/081095 2011-12-02 2012-11-30 Dispositif de correction de défaut et procédé de correction de défaut WO2013081109A1 (fr)

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CN104103543B (zh) * 2014-08-01 2019-11-22 上海华力微电子有限公司 晶圆缺陷尺寸校正方法
CN115053258A (zh) * 2020-11-30 2022-09-13 京东方科技集团股份有限公司 一种显示面板的检测方法、装置及系统

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JP2004013133A (ja) * 2002-06-12 2004-01-15 Dainippon Printing Co Ltd カラーフィルタの欠陥修正方法
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JPH09318556A (ja) * 1996-03-28 1997-12-12 Aisin Seiki Co Ltd 欠陥検査装置
JP2004013133A (ja) * 2002-06-12 2004-01-15 Dainippon Printing Co Ltd カラーフィルタの欠陥修正方法
JP2007123534A (ja) * 2005-10-27 2007-05-17 Sony Corp 配線パターンの欠陥修正方法及び欠陥修正装置
JP2009151261A (ja) * 2007-11-27 2009-07-09 Lasertec Corp 欠陥修正装置、欠陥修正方法、及びパターン基板の製造方法
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JP2010247394A (ja) * 2009-04-14 2010-11-04 Toppan Printing Co Ltd 印刷装置

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