WO2013062150A1 - Appareil d'inspection de substrat - Google Patents

Appareil d'inspection de substrat Download PDF

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Publication number
WO2013062150A1
WO2013062150A1 PCT/KR2011/007992 KR2011007992W WO2013062150A1 WO 2013062150 A1 WO2013062150 A1 WO 2013062150A1 KR 2011007992 W KR2011007992 W KR 2011007992W WO 2013062150 A1 WO2013062150 A1 WO 2013062150A1
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WO
WIPO (PCT)
Prior art keywords
substrate
inspection
unit
camera
fixing
Prior art date
Application number
PCT/KR2011/007992
Other languages
English (en)
Korean (ko)
Inventor
이순종
우봉주
이동석
Original Assignee
주식회사 쎄미시스코
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 쎄미시스코 filed Critical 주식회사 쎄미시스코
Publication of WO2013062150A1 publication Critical patent/WO2013062150A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
    • G01N21/8901—Optical details; Scanning details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
    • G01N21/892—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles characterised by the flaw, defect or object feature examined
    • G01N21/896—Optical defects in or on transparent materials, e.g. distortion, surface flaws in conveyed flat sheet or rod

Definitions

  • the present invention relates to a quality inspection apparatus for an organic light emitting diode (OLED) substrate or an LCD substrate (hereinafter, referred to as a “substrate”), and more particularly, at an edge portion of a substrate to be put into a process.
  • the present invention relates to a substrate inspection apparatus for inspecting whether cracks or chippings are present.
  • the thin film transistor liquid crystal display device includes a lower substrate on which a thin film transistor is formed, an upper substrate on which a color filter is formed, and a liquid crystal injected between the lower substrate and the upper substrate, and the process of manufacturing the liquid crystal display device is a thin film transistor. It can be divided into three parts such as (TFT) process, cell process and module process.
  • the TFT process is very similar to a semiconductor fabrication process, and is a process of arranging a thin film transistor on a substrate by repeating a deposition process, a photolithography process, and an etching process.
  • an alignment layer is formed on a TFT lower plate and an upper plate on which a color filter is formed, alignment is performed so that liquid crystals can be well aligned on the alignment layer, and then, spacers are dispersed and seal printing is performed. To adhere. After the bonding, the liquid crystal is injected into the inside by using a capillary phenomenon, and then the manufacturing process for the liquid crystal display device is finished by sealing the injection hole.
  • the module process is a step of finally determining the product quality to be delivered to the user, attaching the polarizing plate to the completed panel, mounting the driver-IC, and then printed printed circuit board (PCB) By assembling and finally assembling the backlight unit and the fixture, the liquid crystal module is completed.
  • PCB printed printed circuit board
  • OLED is manufactured by depositing an organic material in each cell between the top and bottom glass, the OLED has the advantage that can be driven at a low voltage and made thin, and has a wide viewing angle and fast response speed Unlike a normal LCD (Liquid Crystal Display), the image quality does not change even when viewed from the side, and no afterimage remains on the screen.
  • LCD Liquid Crystal Display
  • the small screen has an advantageous price competitiveness due to the image quality of LCD and simple manufacturing process.
  • OLEDs have 3 (Red, Green, Blue) color independent pixel method, color conversion method (CCM), and color filter method in the color display method.
  • CCM color conversion method
  • color filter method color filter method in the color display method.
  • low molecular OLED, polymer OLED, and driving method are used.
  • the passive matrix is divided into passive matrix and active matrix.
  • OLED is structurally simpler than LCD and plasma display panel (PDP), and it is not only thin, but also flexible, which brightens the flexible display market.
  • the equipment for manufacturing the LCD or OLED comprises a cleaning chamber, a load lock chamber, a transfer chamber and a process chamber, and the cleaning chamber removes foreign substances on the surface of the substrate when the substrate is input to the process chamber.
  • Ultrasonic cleaner USC
  • such an ultrasonic cleaner is installed in the load lock chamber, or may be configured independently of the front end side of the load lock chamber.
  • the longitudinal axis direction (length direction) and the horizontal axis direction (width direction) with respect to the edge portion of the substrate are provided.
  • Comprising a second inspection unit for inspecting the quality status for the first, first and second inspection unit is configured to be controlled by the control unit, As a result, the horizontal and vertical axes can be inspected separately two times. Therefore, when entering the first scrubber, the entire four sides of the image can be obtained, but it is impossible to inspect a part of the horizontal axis that is covered by the robot fork. It will have a technical feature to solve.
  • the first inspection unit and the second inspection unit each include a camera and an illumination unit.
  • both sides of the fixing frame is fixed to the camera included in the first inspection unit, on the upper side of the camera is formed a first fixing unit for fixing the lighting unit included in the first inspection unit, the first fixing unit
  • the first focus guide hole is formed to guide the photographing focus of the camera in the longitudinal axis direction of the substrate.
  • both sides of the cleaner head is fixed to the camera included in the second inspection unit, the second fixing portion for fixing the lighting unit to be positioned so that the lighting unit included in the second inspection unit on the lower side of the camera and
  • the second fixing part is formed with a second focus guide hole for guiding a photographing focus of the camera with respect to the horizontal axis direction of the substrate.
  • the camera included in the first inspection unit is configured to photograph the edge portion of the longitudinal axis direction of the substrate moving in the state of the light source irradiation by the illumination unit in a line scan method
  • the camera included in the second inspection unit is an illumination unit Is configured to photograph the edge portion in the horizontal axis direction of the fixed substrate moving in the state of the light source irradiation by the line scan method.
  • the lighting unit may be any one of an Xe-lamp, a halogen lamp, a high frequency fluorescent lamp, and an LED lighting device.
  • control unit controls the inspection operation of the first inspection unit in accordance with the signal of the first sensor for detecting the insertion state of the substrate at the leading end of the cleaning chamber, and controls the operation state of the cleaner head configured in the cleaning chamber.
  • the control program for controlling the inspection operation of the second inspection unit is mounted according to the signal of the second sensor to be detected.
  • control unit detects a quality defect in the horizontal and / or vertical axis directions of the substrate according to the inspection results of the first and second inspection units
  • the control unit introduces the substrate into the cleaning chamber and / or ultrasonically cleans the substrate by the cleaner head.
  • the control program for stopping the work is mounted.
  • the vertical axis direction (length direction) and the horizontal axis direction (width) Direction) which is designed to check whether the quality status in normal direction is normal, that is, crack or chipping occurred at the same time, through which the quality status of the substrate is checked in advance before the substrate is introduced into the process chamber.
  • the horizontal axis and the vertical axis can be inspected separately for two times, and part of the horizontal axis that is covered by the robot fork while obtaining an image of the entire four sides of the substrate when entering the first washing machine. It can be expected to solve the disadvantage of not being tested for.
  • FIG. 1 is a perspective view showing the structure of a substrate inspection apparatus according to an embodiment of the present invention.
  • Figure 2 is a side schematic view showing the structure of a substrate inspection apparatus in an embodiment of the present invention.
  • Figure 3 is a front schematic view showing the structure of a substrate inspection apparatus in an embodiment of the present invention.
  • Figure 4 is a plan view showing a state in which the substrate is inserted into the cleaning chamber in the embodiment of the present invention.
  • Fig. 5 is a schematic plan view of a cleaning state of a substrate fed into a cleaning chamber in an embodiment of the present invention.
  • Figure 6 is a schematic block diagram of a substrate inspection apparatus according to an embodiment of the present invention.
  • FIG. 1 is a perspective view showing a structure of a substrate inspection apparatus according to an embodiment of the present invention
  • Figure 2 is a side schematic view showing a structure of a substrate inspection apparatus according to an embodiment of the present invention
  • Figure 3 is a substrate inspection as an embodiment of the present invention The front schematic showing the structure of the device is shown.
  • FIG 4 is a plan schematic view showing a state in which a substrate is inserted into the cleaning chamber in the embodiment of the present invention
  • Figure 5 is a plan schematic view showing a cleaning state of the substrate introduced into the cleaning chamber in the embodiment of the present invention
  • Figure 6 Is a schematic block diagram of a substrate inspection apparatus according to an embodiment of the present invention.
  • a substrate inspection apparatus may be used to clean the substrate 1 before the substrate 1 is introduced into the process chamber.
  • the first and second inspection units 10 and 20 and the control unit 30 are configured in the cleaning chamber 100 including the cleaner head 120 moving from the upper surface to clean the surface of the substrate 1. And first and second sensors 41 and 42.
  • the inlet side of the cleaning chamber 100 is configured with a fixing frame 110 for fixing the first inspection unit 10, the fixing frame 110 is formed of a first focusing guide hole 112 1 fixing part 111 is configured to be coupled.
  • the first inspection unit 10 has an edge portion in a longitudinal direction (vertical axis direction) in which the substrate 1 is inserted when the substrate 1 is drawn into the cleaning chamber 100 at both ends of the fixed frame 110.
  • the camera 11 and the lighting unit 12 is configured to include.
  • the camera 11 is fixedly installed at both ends of the fixing frame 110 to be positioned at the same vertical line as the first focusing guide hole 112 of the first fixing part 111, and the lighting unit 12 is It is to be fixed to the upper surface of the first fixing part 111 to provide illumination for the camera 11 in the upper surface of the first fixing part 111.
  • the camera 11 included in the first inspection unit 10 is fixed to both side ends of the fixing frame 110, and the illumination unit included in the first inspection unit 10 is disposed at the upper side of the camera 11.
  • the first fixing part 111 to which the 12 is fixed is formed, and the first focusing part guides the photographing focus of the camera 11 in the longitudinal axis direction of the substrate 1 to the first fixing part 111.
  • the hole 112 is formed.
  • the second inspection unit 20 performs the surface cleaning with respect to the substrate 1 introduced into the cleaning chamber 100 at both sides of the cleaner head 120 as the cleaner head 120 moves. It inspects the quality state of the edge part of the width direction (horizontal axis direction) of the board
  • the camera 21 included in the second inspection unit 20 is fixed to both side ends of the cleaner head 120, but the illumination unit included in the second inspection unit 20 at the lower side of the camera 21.
  • a second fixing part 121 for fixing the lighting part 22 is formed so that the 22 is positioned, and the second fixing part 121 has the second fixing part 121 of the camera 21 in the horizontal axis direction of the substrate 1.
  • the second focus guide hole 122 for guiding the photographing focus is formed.
  • the camera 11 included in the first inspection unit 10 photographs an edge portion of the substrate 1 moving along the longitudinal axis of the substrate 1 in the state where the illumination unit 12 emits the light source.
  • the camera 21 included in the second inspection unit 20 may photograph the edge portion of the fixed substrate 1 moving in the state in which the light source is irradiated by the illumination unit 22 in the horizontal axis direction in a line scan method.
  • the lighting units 12 and 22 included in the first and second inspection units 10 and 20 may be any one of an Xe-lamp, a halogen lamp, a high frequency fluorescent lamp, and an LED lighting device.
  • the control unit 30 controls the first and second inspection units 10 and 20, and a signal of the first sensor 41 that detects the inlet state of the substrate at the leading end of the cleaning chamber 100.
  • the second sensor 42 for detecting the operation state of the cleaner head 120 is configured in the cleaning chamber 100 in accordance with the second The control program for controlling the inspection operation of the inspection unit 20 is mounted.
  • control unit 30 to the cleaning chamber 100 when the quality defect is detected in the longitudinal axis and / or the horizontal axis direction of the substrate 1 according to the inspection results of the first and second inspection unit 10, 20
  • the control program for stopping the insertion of the substrate 1 and / or the ultrasonic cleaning of the substrate 1 by the cleaner head 120 is also mounted.
  • the arrow of FIG. 4 is attached to the substrate 1 before the substrate 1 is introduced into the process chamber.
  • the first sensor 41 provided at the leading end side of the cleaning chamber 100, the sensing state of the substrate (1) after the detection
  • the signal is transmitted to the control unit 30, and accordingly the control unit 30 controls the inspection operation of the first inspection unit 10.
  • control unit 30 is, of course, the first height of the camera 11 of the first inspection unit 10 fixedly installed at both ends of the fixed frame 110 formed on the inlet side of the cleaning chamber 100. Bar to the operation control the lighting unit 12 fixed to the government 111,
  • the camera 11 receives a light source from the illumination unit 12 and moves toward the cleaning chamber 100 through the first focus guide hole 112 formed in the first fixing unit 111. That is, the edge portion in the longitudinal direction (vertical axis direction) is taken.
  • the image information photographed by the camera 11 is output to the control unit 30, and accordingly the control unit 30 analyzes the image information photographed by the camera 11 to It is to check whether the quality (eg crack / chipping present) at the edge portion in the longitudinal direction (vertical axis direction) is normal or bad.
  • the quality eg crack / chipping present
  • the cleaner head 120 formed in the cleaning chamber 100 has the arrow direction Q as shown in FIG. 2. While moving to), ultrasonic cleaning for removing foreign matter from the surface of the substrate 1 is performed.
  • the control unit 30 is the second inspection unit 20 To control the inspection operation.
  • control unit 30 is fixed to the camera 21 of the second inspection unit 20 fixedly installed at both ends of the cleaner head 120, as well as the lighting unit 22 fixed to the second fixing unit 121. To control the operation of the bar,
  • the camera 21 is provided with respect to the cleaning direction of the substrate 1 in which ultrasonic cleaning is performed through the second focusing guide hole 122 formed in the second fixing part 121 while receiving a light source from the lighting unit 22.
  • the edge part of the width direction (horizontal axis direction) is image
  • the image information photographed by the camera 21 is output to the control unit 30, and accordingly the control unit 30 analyzes the image information photographed by the camera 21 to It is possible to check whether the quality (eg crack or chipping) at the edge portion in the width direction (horizontal axis direction) is normal or bad.
  • the quality eg crack or chipping
  • the control unit 30 Is to stop the entry of the substrate 1 into the cleaning chamber 100 and / or the ultrasonic cleaning operation of the substrate 1 by the cleaner head 120.
  • the present invention checks the quality of the substrate in advance before the substrate is inserted into the process chamber, thereby preventing damage to the substrate during the process, as well as inspecting the horizontal axis and the vertical axis two times at the time of entering the primary cleaner. This solves the drawback of not inspecting the part of the horizontal axis that is covered by the robot fork while obtaining the image of the entire four sides of the substrate.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Biochemistry (AREA)
  • Immunology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Textile Engineering (AREA)
  • Nonlinear Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

La présente invention concerne un appareil d'inspection de substrat, qui est configuré en tant qu'appareil apte à inspecter simultanément si la qualité de la partie de bord d'un substrat dans la direction d'axe vertical (direction dans le sens de la longueur) et la direction d'axe horizontal (direction dans le sens de la largeur) est normale, à savoir si des fissurations ou un ébrèchement se sont produits lorsque le substrat est introduit dans un dispositif de nettoyage ultrasonore (USC) et lorsque des impuretés sont retirées de la surface du substrat par l'USC. Ainsi, la qualité d'un substrat est contrôlée avant que le substrat ne soit introduit dans une chambre de traitement afin d'empêcher un endommagement du substrat durant le traitement, et également pour permettre à des inspections séparées d'être réalisées dans deux étapes pour l'axe horizontal et l'axe vertical afin de résoudre les inconvénients d'une inspection qui ne peut pas être réalisée sur la partie de l'axe horizontal qui est recouverte par une fourche de robot dans l'état dans lequel des images sont obtenues de quatre surfaces du substrat durant l'entrée dans le premier dispositif de nettoyage.
PCT/KR2011/007992 2011-10-24 2011-10-25 Appareil d'inspection de substrat WO2013062150A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2011-0108831 2011-10-24
KR1020110108831A KR101169765B1 (ko) 2011-10-24 2011-10-24 기판 검사장치

Publications (1)

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WO2013062150A1 true WO2013062150A1 (fr) 2013-05-02

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WO (1) WO2013062150A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112326676A (zh) * 2020-10-26 2021-02-05 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 在线品检装置及其调整方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040043741A (ko) * 2002-11-19 2004-05-27 삼성전자주식회사 웨이퍼 검사 장치
JP2009236771A (ja) * 2008-03-27 2009-10-15 Nippon Electric Glass Co Ltd ガラス基板検査装置およびガラス基板検査方法
KR20100073296A (ko) * 2008-12-23 2010-07-01 주식회사 동부하이텍 웨이퍼 돌출 감지부가 구비된 인덱서
KR101046566B1 (ko) * 2010-11-05 2011-07-05 주식회사 이테크넷 기판 검사 장치 및 이를 이용한 기판 검사 방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040043741A (ko) * 2002-11-19 2004-05-27 삼성전자주식회사 웨이퍼 검사 장치
JP2009236771A (ja) * 2008-03-27 2009-10-15 Nippon Electric Glass Co Ltd ガラス基板検査装置およびガラス基板検査方法
KR20100073296A (ko) * 2008-12-23 2010-07-01 주식회사 동부하이텍 웨이퍼 돌출 감지부가 구비된 인덱서
KR101046566B1 (ko) * 2010-11-05 2011-07-05 주식회사 이테크넷 기판 검사 장치 및 이를 이용한 기판 검사 방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112326676A (zh) * 2020-10-26 2021-02-05 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 在线品检装置及其调整方法

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