WO2013053601A3 - Optoelektronisches bauelement und leuchtstoffe - Google Patents

Optoelektronisches bauelement und leuchtstoffe Download PDF

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Publication number
WO2013053601A3
WO2013053601A3 PCT/EP2012/069003 EP2012069003W WO2013053601A3 WO 2013053601 A3 WO2013053601 A3 WO 2013053601A3 EP 2012069003 W EP2012069003 W EP 2012069003W WO 2013053601 A3 WO2013053601 A3 WO 2013053601A3
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WO
WIPO (PCT)
Prior art keywords
group
optoelectronic component
combinations
luminescent substances
primary radiation
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PCT/EP2012/069003
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English (en)
French (fr)
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WO2013053601A2 (de
Inventor
Alexander Baumgartner
Frank Jermann
Stefan Lange
Tim Fiedler
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Osram Opto Semiconductors Gmbh
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Application filed by Osram Opto Semiconductors Gmbh filed Critical Osram Opto Semiconductors Gmbh
Priority to JP2014529033A priority Critical patent/JP5944508B2/ja
Priority to DE112012004264.6T priority patent/DE112012004264A5/de
Priority to US14/349,751 priority patent/US20140284649A1/en
Priority to CN201280050433.7A priority patent/CN103857767B/zh
Priority to KR1020147009431A priority patent/KR101989642B1/ko
Publication of WO2013053601A2 publication Critical patent/WO2013053601A2/de
Publication of WO2013053601A3 publication Critical patent/WO2013053601A3/de

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
    • C09K11/7774—Aluminates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77347—Silicon Nitrides or Silicon Oxynitrides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77348—Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H01L33/504—Elements with two or more wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)

Abstract

Ein optoelektronisches Bauelement umfasst eine Schichtenfolge (1) mit einem aktiven Bereich, der elektromagnetische Primärstrahlung emittiert und ein Konversionsmaterial, das im Strahlengang der elektromagnetischen Primärstrahlung angeordnet ist und zumindest teilweise die elektromagnetische Primärstrahlung in eine elektromagnetische Sekundärstrahlung konvertiert. Das Konversionsmaterial umfasst einen ersten Leuchtstoff (6- 1) mit der allgemeinen Zusammensetzung A3B5O12, wobei A aus einer Gruppe ausgewählt ist, die Y, Lu, Gd und Ce und Kombinationen daraus umfasst, und wobei B eine Kombination aus Al und Ga umfasst; und einen zweiten Leuchtstoff (6-2), der aus einer Gruppe ausgewählt ist, die M1AlSiN3•Si2N2O, M3AlSiN3, M4-Al-Si-N System, M5-Al-Si-N System und M2Si5N8 umfasst, wobei M eine Kombination aus Ca, Sr, Ba und Eu umfasst, M1 aus einer Gruppe ausgewählt ist, die Sr, Ca, Mg, Li, Eu und Kombinationen daraus umfasst, M3 aus eine Gruppe ausgewählt ist, die Sr, Ca, Mg, Li, Eu und Kombinationen daraus umfasst, M4 zumindest Ca und M5 zumindest Ca oder Ba oder Sr umfasst.
PCT/EP2012/069003 2011-10-12 2012-09-26 Optoelektronisches bauelement und leuchtstoffe WO2013053601A2 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2014529033A JP5944508B2 (ja) 2011-10-12 2012-09-26 オプトエレクトロニクス部品
DE112012004264.6T DE112012004264A5 (de) 2011-10-12 2012-09-26 Optoelektronisches Bauelement und Leuchtstoffe
US14/349,751 US20140284649A1 (en) 2011-10-12 2012-09-26 Optoelectronic component and phosphors
CN201280050433.7A CN103857767B (zh) 2011-10-12 2012-09-26 光电子器件和发光材料
KR1020147009431A KR101989642B1 (ko) 2011-10-12 2012-09-26 광전자 소자 및 발광 물질

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102011115879.4 2011-10-12
DE102011115879A DE102011115879A1 (de) 2011-10-12 2011-10-12 Optoelektronisches Bauelement und Leuchtstoffe

Publications (2)

Publication Number Publication Date
WO2013053601A2 WO2013053601A2 (de) 2013-04-18
WO2013053601A3 true WO2013053601A3 (de) 2013-05-30

Family

ID=47040678

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2012/069003 WO2013053601A2 (de) 2011-10-12 2012-09-26 Optoelektronisches bauelement und leuchtstoffe

Country Status (7)

Country Link
US (1) US20140284649A1 (de)
JP (1) JP5944508B2 (de)
KR (1) KR101989642B1 (de)
CN (1) CN103857767B (de)
DE (2) DE102011115879A1 (de)
TW (1) TWI538982B (de)
WO (1) WO2013053601A2 (de)

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DE102013207448A1 (de) * 2013-04-24 2014-10-30 Osram Opto Semiconductors Gmbh Konverterelement, Baugruppe, Hintergrundbeleuchtung und Anzeigevorrichtung
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KR102214065B1 (ko) * 2014-02-20 2021-02-09 엘지전자 주식회사 산 질화물 형광체, 그 제조 방법 및 이를 이용한 발광 소자 패키지
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KR102213650B1 (ko) * 2014-04-18 2021-02-08 대주전자재료 주식회사 산질화물계 형광체 및 이를 이용한 백색 발광 장치
KR20160017849A (ko) * 2014-08-06 2016-02-17 서울바이오시스 주식회사 고출력 발광 장치 및 그 제조 방법
KR102100193B1 (ko) * 2014-11-10 2020-04-13 엘지전자 주식회사 발광 장치
JP2016204616A (ja) * 2015-04-28 2016-12-08 デンカ株式会社 赤色蛍光体及び発光装置
EP3135746B1 (de) 2015-08-28 2019-05-29 Nichia Corporation Verfahren zur herstellung von fluoreszierendem nitridmaterial
KR102532154B1 (ko) * 2016-04-01 2023-05-15 엘지전자 주식회사 형광체 및 이를 이용한 발광 소자 패키지
JP6460056B2 (ja) 2016-06-30 2019-01-30 日亜化学工業株式会社 窒化物蛍光体の製造方法
CN111834498B (zh) 2019-04-19 2022-01-25 开发晶照明（厦门）有限公司 发光二极管的外延发光结构
US11424393B2 (en) 2019-04-19 2022-08-23 Kaistar Lighting (Xiamen) Co., Ltd. Light-emitting diode and light-emitting module

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Also Published As

Publication number Publication date
TWI538982B (zh) 2016-06-21
DE102011115879A1 (de) 2013-04-18
KR20140082694A (ko) 2014-07-02
WO2013053601A2 (de) 2013-04-18
CN103857767B (zh) 2017-04-05
CN103857767A (zh) 2014-06-11
DE112012004264A5 (de) 2014-07-10
TW201331342A (zh) 2013-08-01
JP5944508B2 (ja) 2016-07-05
JP2014529912A (ja) 2014-11-13
KR101989642B1 (ko) 2019-06-14
US20140284649A1 (en) 2014-09-25

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