WO2013053199A1 - 混光发光二极管封装结构 - Google Patents

混光发光二极管封装结构 Download PDF

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Publication number
WO2013053199A1
WO2013053199A1 PCT/CN2012/001319 CN2012001319W WO2013053199A1 WO 2013053199 A1 WO2013053199 A1 WO 2013053199A1 CN 2012001319 W CN2012001319 W CN 2012001319W WO 2013053199 A1 WO2013053199 A1 WO 2013053199A1
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Prior art keywords
led chip
light
ceramic substrate
led
mixing
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PCT/CN2012/001319
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English (en)
French (fr)
Inventor
陈烱勋
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Chen Jeong-Shiun
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Publication of WO2013053199A1 publication Critical patent/WO2013053199A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/20—Controlling the colour of the light
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2113/00—Combination of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements

Definitions

  • the invention relates to a light emitting diode package structure, in particular to respectively fixing and variably driving at least two light emitting diode chips to achieve a light mixing function of at least two light emitting diode chips.
  • Light-emitting diodes are currently widely used sources such as display backlights, illumination sources, signage sources, decorative sources or billboards. Different light-emitting diodes can produce different color lights, such as red, green, blue and white light-emitting diodes, which can generate red, green, blue and white light, respectively.
  • the spectrum of the light-emitting diode is significantly different from the spectrum of the natural light similar to the black body radiation. Therefore, the light emitted by the light-emitting diode causes an unnatural visual perception of the human eye, especially when used as a light source for illumination. General LEDs are not suitable for lighting applications.
  • CRI Color Rendering Index
  • CCT Correlated Color Temperature
  • the color rendering index is the relative difference between the color displayed by the object under the illumination of the light source to be measured and the color of the reference light source (such as sunlight), and the lower the CRI value, the more distorted the color is.
  • the CRI of the sun is 100
  • the fluorescent lamp is 60-85
  • the phosphor white LED is 60-90
  • the two-color white LED is between 10-60.
  • Correlated color temperature is a reference to a source that is not blackbody radiation, such as a fluorescent lamp or LED, which emits a specific color of black light at a specific color that produces the same specific color as blackbody radiation.
  • blackbody radiation such as a fluorescent lamp or LED
  • the CCT of the display is D65, which means that the red light (R), green light (G), and blue light (B) of the display are white light that is the same as the white light emitted by the black body radiation at 6500 °K.
  • the LED light source needs to have a higher CRI, and for different application fields, the LED light source needs to have a specific CCT value.
  • the prior art solution is to formulate an appropriate dose of phosphor in the encapsulant to adjust the final emitted light (CRI) and correlated color temperature (CCT) of the LED, but the phosphor will reduce the brightness performance.
  • CRI final emitted light
  • CCT correlated color temperature
  • the illuminating characteristics cannot be arbitrarily changed. Therefore, there is a need for a light-mixing LED package structure that provides an elastically variable electrical mixing function to solve the above-mentioned problems of the prior art. Summary of the invention
  • a main object of the present invention is to provide a light-mixing light emitting diode package structure, including a ceramic substrate, a first light emitting diode (LED) chip, a second LED chip, a first driving unit, a second driving unit, and an encapsulant, wherein the first The LED chip, the second LED chip, the first driving unit and the second driving unit are disposed on the ceramic substrate, and the ceramic substrate has an electrical connection line, the encapsulant comprises a phosphor, and the encapsulant encapsulates the first LED respectively emitting different color lights a chip and a second LED chip, the first driving unit fixedly drives the first LED chip to generate fixed emission light with a fixed spectrum and brightness, and the second driving unit fluctuates to drive the second LED chip to generate a movable variable spectrum and brightness
  • the variable emission light, the fixed emission light and the variable emission light can be mixed to form a desired final emission light.
  • the first LED chip can be a blue LED chip for generating blue light
  • the second LED chip can be a red LED chip for generating red light. Therefore, the red light LED chip can be controlled by the second driving unit. The light, in turn, is mixed with the fixed blue light produced by the blue LED chip to achieve the desired light mixing effect.
  • the light-mixing light-emitting diode package structure of the invention can maintain the overall original brightness, and the LED light source with the required correlated color temperature and color rendering index is mixed by the electric driving means to adjust the variation of the emitted light, that is, the electric light is used to achieve the light mixing.
  • the effect rather than the use of chemical mixing, increases the flexibility in practical use while improving operational reliability.
  • Another object of the present invention is to provide a light-mixing LED package structure, which can further include a third LED chip and a third driving unit, and the third LED chip is independently driven by the third driving unit, thereby generating a difference from the first The LED chip and the second LED chip emit light, and the emitted light of the first LED chip and the second LED chip can be mixed to generate a desired final emitted light.
  • FIG. 1 is a schematic view showing a package structure of a light-mixing light emitting diode of the present invention
  • FIG. 2 is a schematic view showing a package structure of a light-mixing light emitting diode according to another embodiment of the present invention. detailed description
  • FIG. 1 a schematic diagram of a package structure of a light-mixing light emitting diode of the present invention.
  • the dimming light emitting diode package structure includes a ceramic substrate 10, a first light emitting diode (LED) chip 21, a second LED chip 22, a first driving unit 31, a second driving unit 32, and an encapsulant 40 for generating a device.
  • the final emitted light of the correlated color temperature (CCT) and the color rendering index (CRI) is required, wherein the first light emitting diode (LED) chip 21, the second LED chip 22, the first driving unit 31, and the second driving unit 32 are disposed on the ceramic substrate.
  • the ceramic substrate has an electrical connection line (not shown).
  • the first LED chip 21 and the second LED chip 22 can respectively emit light of different color lights.
  • the encapsulant 40 is made of a transparent material, such as silica gel or epoxy resin, and further includes a phosphor, and the encapsulant 40 covers the first LED chip 21 and the second LED chip 22 and is attached to the ceramic substrate 10, thereby providing Isolated protection.
  • the first driving unit 31 is electrically connected to the first LED chip 21, and fixedly drives the first LED chip 21 to generate fixed emission light L1 having a fixed spectrum and brightness
  • the second driving unit 32 is electrically connected to the second LED chip 22. And driving the second LED chip 22 to generate the variable emission light L2 having a variable spectrum and brightness, and the color of the variable emission light L2 is different from the color of the fixed emission light L1.
  • the fixed emission light L1 generated by the first LED chip 21 and the variable emission light L2 generated by the second LED chip 22 pass through the encapsulant 40 and are mixed to form a desired final emitted light.
  • the first driving unit 31 can drive the first LED chip 21 by a fixed current
  • the second driving unit 32 can drive the second LED chip 22 with an adjustable varying current.
  • the fixed emission light L1 and the variable emission light L2 can be mixed to form a final emission light having a desired CCT and CRI value, that is, the fluctuation current of the second driving unit 32 is based on the CCT and CRI values of the last emitted light and It is determined in accordance with the fixed emission light L1 of the first LED chip 21.
  • a blue LED chip is selected as the first LED chip 21, and a red LED chip is used as the second LED chip 22.
  • the fixed blue light and the variable red light are mixed to form a final emitted light, and it is noted that
  • the first LED chip 21 and the second LED chip 22 of the invention may be other LED chips that emit different colors of light, that is, the first LED chip 21 and the second LED chip 22 may be a red LED chip, a green LED chip, and a blue LED. Any two of the chips.
  • FIG. 2 a schematic diagram of a light-mixing LED package structure according to another embodiment of the present invention is shown.
  • another embodiment of the present invention is similar to the embodiment of FIG. 1.
  • the main difference is that another embodiment of the present invention further includes a third LED chip 23 and a third driving unit 33, wherein The three LED chips 23 are independently driven by the third driving unit 33 and can be fixed driving or variable driving.
  • the first LED chip 21 is a blue LED chip
  • the second LED chip 22 is a red LED chip
  • the third LED chip 23 is a green LED chip.
  • the third driving unit 33 can drive the third LED chip 23 by a fixed driving or a varying current to drive or variably drive.
  • the invention is characterized in that the light-mixing light-emitting diode package structure uses an electrical means to achieve a light-mixing effect, instead of a chemical light mixing means for adjusting the dose of the phosphor, thereby avoiding the problem of using an excessive amount of phosphor to reduce the brightness, and further It can maintain the original or preset brightness and achieve the required CCT and CRI, so as to increase the flexibility of the LED light source in practical use, and further improve the reliability of the overall operation.
  • the driving unit can be adjusted in the magnitude of the driving current to expand the color rendering range of the final emitted light.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)

Abstract

公开了一种混光发光二极管封装结构，包括：安置于陶瓷基板（10）上的第一LED芯片（21）、第二LED芯片（22）、第一驱动单元（31）、第二驱动单元（32）以及封装胶（40），其中陶瓷基板（10）具有电气连接线路，封装胶（40）包括荧光粉，且封装胶（40）包覆分别发射不同色光的第一LED芯片（21）及第二LED芯片（22），第一驱动单元（31）固定驱动第一LED芯片（21）以产生具有固定光谱及亮度的固定发射光（L1），而第二驱动单元（32）变动驱动第二LED芯片（22）以产生具可变光谱及亮度的变动发射光（L2），固定发射光（L1）及变动发射光（L2）经混光后形成所需的最后发射光。由此可增加实际应用的弹性，同时改善操作可靠度。

Description

混光发光二极管封装结构
技术领域
本发明涉及一种发光二极管封装结构， 尤其是分别固定及变动驱动至少 二发光二极管芯片而达成至少二发光二极管芯片的混光功能。 背景技术
发光二极管是目前应用相当广泛的光源， 比如应用于显示器背光源、 照 明光源、 标示用光源、 装饰用光源或广告板。 不同的发光二极管可产生不同 的色光， 比如红光、 绿光、 蓝光及白光发光二极管可分别产生红光、 绿光、 蓝光及白光。 但是， 发光二极管的光谱与类似于黑体辐射的自然光的光谱有 显著的差异性，因此，发光二极管的发射光会使人眼产生不自然的视觉感知， 尤其是当作照明用的光源时， 所以一般的发光二极管不适合照明应用。
目前最常用以量化光源特性的参数为演色性指数 (Color Rendering Index, CRI)及相关色温 (Correlated Color Temperature, CCT)。
演色性指数 (CRI)是对象在待测光源照射下显示的颜色与其在参考光源 (比如太阳光)照射下的颜色两者的相对差异， 而 CRI值越低， 所呈现的颜色 越失真，而太阳光的 CRI为 100，荧光灯为 60-85，荧光粉白光 LED为 60-90， 双色白光 LED在 10-60间。
相关色温 (CCT)是指针对不是黑体辐射的光源， 例如荧光灯或 LED, 其 发射光的特定颜色比照黑体辐射可产生相同特定颜色时的黑体辐射温度。 例 如显示器的 CCT为 D65是指显示器的红光 (R)、 绿光 (G)、 蓝光 (B)经混光后 所呈现的白光是相同于黑体辐射在 6500°K所呈现的白光。
因此， 为达到自然光的特性， LED光源需具有愈高的 CRI， 而针对不同 应用领域， LED光源需具有特定的 CCT值。 在现有技术中， 现有技术的解 决方式， 是在封装胶中调配适当剂量的荧光粉以调节发光二极管的最后发射 光的 (CRI)及相关色温 (CCT)， 但是荧光粉会降低亮度表现， 且无法随意变更 发光特性， 因此， 需要一种混光发光二极管封装结构， 提供可弹性变化的电 气混光功能， 以解决上述现有技术的问题。 发明内容
本发明的主要目的在提供一种混光发光二极管封装结构， 包括陶瓷基 板、 第一发光二极管 (LED)芯片、 第二 LED芯片、 第一驱动单元、 第二驱动 单元以及封装胶， 其中第一 LED芯片、 第二 LED芯片、 第一驱动单元及第 二驱动单元安置于陶瓷基板上， 且陶瓷基板具有电气连接线路， 封装胶包含 荧光粉，且封装胶包覆分别发射不同色光的第一 LED芯片及第二 LED芯片， 第一驱动单元固定驱动第一 LED 芯片以产生具固定光谱及亮度的固定发射 光， 而第二驱动单元变动驱动第二 LED 芯片以产生具可动变光谱及亮度的 变动发射光， 固定发射光及变动发射光可经混光后形成所需的最后发射光。
第一 LED芯片可为用以产生蓝光的蓝光 LED芯片，而第二 LED芯片可 为用以产生红光的红光 LED芯片， 因此， 可由第二驱动单元控制红光 LED 芯片所产生的变动红光， 进而与蓝光 LED芯片所产生的固定蓝光进行混光， 以达到所需的混光效应。
本发明的混光发光二极管封装结构可维持整体原有亮度下， 藉电气驱动 手段以调节变动发射光而混光出具所需相关色温及演色性指数的 LED光源， 亦即利用电气手段达到混光效应， 而非使用化学混光的手段， 因而增加实际 使用上的弹性， 同时可改善操作可靠度。
本发明的另一目的在提供一种混光发光二极管封装结构， 可进一步包括 第三 LED芯片及第三驱动单元， 且第三 LED芯片是由第三驱动单元独立驱 动， 藉以产生不同于第一 LED芯片及第二 LED芯片的发射光， 而可与第一 LED芯片及第二 LED芯片的发射光经混光而产生所需的最后发射光。 附图说明
图 1显示本发明混光发光二极管封装结构的示意图； 以及
图 2显示本发明另一实施例混光发光二极管封装结构的示意图。 具体实施方式
以下配合附图对本发明的实施方式做更详细的说明， 使以熟悉本领域技 术人员在研读本说明书后能据以实施。
参考图 1， 本发明混光发光二极管封装结构的示意图。 如图 1所示， 本 发明的混光发光二极管封装结构包括陶瓷基板 10、 第一发光二极管 (LED)芯 片 21、 第二 LED芯片 22、 第一驱动单元 31、 第二驱动单元 32以及封装胶 40, 用以产生具所需相关色温 (CCT)及演色性指数 (CRI)的最后发射光， 其中 第一发光二极管 (LED)芯片 21、 第二 LED芯片 22、 第一驱动单元 31以及第 二驱动单元 32安置于陶瓷基板 10上，且陶瓷基板具有电气连接线路 (图中未 显示)。
第一 LED芯片 21及第二 LED芯片 22可分别发射不同色光的发射光。 封装胶 40是由透明材料构成， 比如硅胶或环氧树脂， 并进一步包含荧光粉， 且封装胶 40包覆第一 LED芯片 21及第二 LED芯片 22， 并附着在陶瓷基板 10上， 藉以提供隔绝保护作用。
第一驱动单元 31 电气连接至第一 LED芯片 21， 并固定驱动第一 LED 芯片 21， 以产生具固定光谱及亮度的固定发射光 Ll， 而第二驱动单元 32电 气连接至第二 LED芯片 22， 并变动驱动第二 LED芯片 22以产生具可变动 光谱及亮度的变动发射光 L2,且变动发射光 L2的颜色不同于固定发射光 L1 的颜色。 第一 LED芯片 21所产生的固定发射光 L1及第二 LED芯片 22所 产生的变动发射光 L2穿透封装胶 40后混光形成所需的最后发射光。具体而 言， 第一驱动单元 31可藉固定电流驱动第一 LED芯片 21， 而第二驱动单元 32是用可调节的变动电流以驱动第二 LED芯片 22。 因此， 固定发射光 L1 及变动发射光 L2可经混光后形成具有所需 CCT及 CRI值的最后发射光，即， 第二驱动单元 32的变动电流是依据最后发射光的 CCT及 CRI值以及配合第 一 LED芯片 21的固定发射光 L1而决定。
例如， 选取蓝光 LED芯片当作第一 LED芯片 21， 以红光 LED芯片当 作第二 LED芯片 22， 而固定蓝光以及变动红光经混光后形成最后发射光， 而要注意的是， 本发明的第一 LED芯片 21及第二 LED芯片 22可为其它发 射相互不同色光的 LED芯片，即第一 LED芯片 21及第二 LED芯片 22可为 红光 LED芯片、 绿光 LED芯片及蓝光 LED芯片中的任意其中之二。
参考图 2， 本发明另一实施例混光发光二极管封装结构的示意图。 如图 2所示， 本发明的另一实施例是类似于图 1的实施例， 其主要差异在于， 本 发明的另一实施例进一步包括第三 LED芯片 23及第三驱动单元 33，其中第 三 LED芯片 23是由第三驱动单元 33独立驱动， 可为固定驱动或变动驱动， 藉以产生不同于第一 LED芯片 21及第二 LED芯片 22所产生的发射光的另 一发射光 L3， 且该另一发射光 L3进一步与第一 LED芯片 21的固定发射光 L1及第二 LED芯片 22的变动发射光 L2穿透封胶层 40而混光以产生所需的 最后发射光。 比如， 第一 LED芯片 21为蓝光 LED芯片， 第二 LED芯片 22 为红光 LED芯片， 而第三 LED芯片 23为绿光 LED芯片。 此外， 第三驱动 单元 33可藉提供固定电流或变动电流以固定驱动或变动驱动第三 LED芯片 23。
本发明的特点在于， 混光发光二极管封装结构是利用电气手段达到混光 效应， 而非藉调配荧光粉剂量的化学混光手段， 因此， 可避免使用过量的荧 光粉而降低亮度的问题， 进而能保持原有或预设的亮度， 并达到所需的 CCT 及 CRI，藉以增加 LED光源在实际使用上的弹性， 同时可进一步改善整体操 作的可靠度。 此外， 可藉驱动单元调节驱动电流大小而扩大最后发射光的演 色性范围。
以上所述仅为用以解释本发明的较佳实施例， 并非企图据以对本发明做 任何形式上的限制， 因此， 凡有在相同的创作精神下所作有关本发明的任何 修饰或变更， 皆仍应包括在本发明的权利要求的保护范畴。

Claims

权利要求
1.一种混光发光二极管封装结构， 其特征在于， 该混光发光二极管封装 结构包括：
一陶瓷基板， 具有电气连接线路；
一第一发光二极管 LED芯片， 安置于该陶瓷基板上；
一第二 LED芯片， 安置于该陶瓷基板上；
一第一驱动单元， 安置于该陶瓷基板上， 且电气连接至该第一 LED 芯 片， 用以固定驱动该第一 LED 芯片以产生具固定光谱及亮度的一固定发射 光；
一第二驱动单元， 安置于该陶瓷基板上， 且电气连接至该第二 LED 芯 片， 用以变动驱动该第二 LED 芯片以产生具可变动光谱及亮度的一变动发 射光， 且该变动发射光的颜色是不同于该固定发射光的颜色； 以及
一封装胶， 由透明材料构成， 且包含荧光粉， 该封装胶包覆该第一 LED 芯片及该第二 LED芯片， 并附着在该陶瓷基板上， 该第一 LED芯片所产生 的固定发射光及该第二 LED 芯片所产生的变动发射光穿透该封装胶而混光 形成一最后发射光。
2.如权利要求 1所述的混光发光二极管封装结构， 其特征在于， 该第一 驱动单元提供固定电流以固定驱动该第一 LED 芯片， 而该第二驱动单元提 供变动电流以变动驱动该第二 LED芯片。
3.如权利要求 1所述的混光发光二极管封装结构， 其特征在于， 该封装 胶的透明材料包括硅胶或环氧树脂。
4.如权利要求 1所述的混光发光二极管封装结构， 其特征在于， 该第一 LED芯片及该第二 LED芯片为一红光 LED芯片、 一绿光 LED芯片及一蓝 光 LED芯片中的任意其中之二。
5.—种混光发光二极管封装结构， 其特征在于， 该混光发光二极管封装 结构包括：
一陶瓷基板， 具有电气连接线路；
一第一 LED芯片， 安置于该陶瓷基板上；
一第二 LED芯片， 安置于该陶瓷基板上； 一第三 LED芯片， 安置于该陶瓷基板上；
一第一驱动单元， 安置于该陶瓷基板上， 且电气连接至该第一 LED 芯 片， 用以固定驱动该第一 LED 芯片以产生具固定光谱及亮度的一固定发射 光；
一第二驱动单元， 安置于该陶瓷基板上， 且电气连接至该第二 LED 芯 片， 用以变动驱动该第二 LED 芯片以产生具可变动光谱及亮度的一变动发 射光， 且该变动发射光的颜色是不同于该固定发射光的颜色；
一第三驱动单元， 安置于该陶瓷基板上， 且电气连接至该第三 LED 芯 片， 用以固定或变动驱动该第三 LED 芯片以产生具固定或可变动光谱及亮 度的一另一发射光， 且该另一发射光的颜色是不同于该固定发射光及该变动 发射光的颜色； 以及
一封装胶， 由透明材料构成， 且包含荧光粉， 该封装胶包覆该第一 LED 芯片、 该第二 LED芯片及该第三 LED芯片， 并附着在该陶瓷基板上， 该第 一 LED芯片所产生的固定发射光、 该第二 LED芯片所产生的变动发射光及 该第三 LED 芯片所产生的该另一发射光穿透该封装胶而混光形成一最后发 射光。
6.如权利要求 5所述的混光发光二极管封装结构， 其特征在于， 该第一 驱动单元提供固定电流以固定驱动该第一 LED 芯片， 该第二驱动单元提供 变动电流以变动驱动该第二 LED 芯片， 而该第三驱动单元提供固定电流或 变动电流以固定驱动或变动驱动该第三 LED芯片。
7.如权利要求 5所述的混光发光二极管封装结构， 其特征在于， 该封装 胶的透明材料包括硅胶或环氧树脂。
8.如权利要求 5所述的混光发光二极管封装结构， 其特征在于， 该第一 LED芯片为一红光 LED芯片， 而该第二 LED芯片及该第三 LED芯片分别 为选取自一绿光 LED芯片及一蓝光 LED芯片的其中之一，且该第二 LED芯 片及该第三 LED芯片互不相同。
PCT/CN2012/001319 2011-10-09 2012-09-27 混光发光二极管封装结构 WO2013053199A1 (zh)

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CN103196049A (zh) * 2013-03-06 2013-07-10 深圳市晶台光电有限公司 一种采用一体化cob封装工艺的led灯板
CN104282672A (zh) * 2013-07-03 2015-01-14 云光科技股份有限公司 可调整色温的发光二极管封装结构
CN104077975A (zh) * 2014-07-18 2014-10-01 广东威创视讯科技股份有限公司 发光二极管显示屏及封装结构

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