WO2013042907A3 - Alvéole pour essai de semiconducteurs - Google Patents

Alvéole pour essai de semiconducteurs Download PDF

Info

Publication number
WO2013042907A3
WO2013042907A3 PCT/KR2012/007415 KR2012007415W WO2013042907A3 WO 2013042907 A3 WO2013042907 A3 WO 2013042907A3 KR 2012007415 W KR2012007415 W KR 2012007415W WO 2013042907 A3 WO2013042907 A3 WO 2013042907A3
Authority
WO
WIPO (PCT)
Prior art keywords
testing socket
semiconductor
semiconductor testing
contacted
region
Prior art date
Application number
PCT/KR2012/007415
Other languages
English (en)
Korean (ko)
Other versions
WO2013042907A2 (fr
Inventor
신종천
하동호
Original Assignee
Shin Jong Cheon
Ha Dong Ho
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=47073739&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2013042907(A3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Shin Jong Cheon, Ha Dong Ho filed Critical Shin Jong Cheon
Publication of WO2013042907A2 publication Critical patent/WO2013042907A2/fr
Publication of WO2013042907A3 publication Critical patent/WO2013042907A3/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Connecting Device With Holders (AREA)

Abstract

La présente invention concerne un alvéole pour essai de semiconducteurs comportant une partie conductrice au silicium formée dans une région où un fil pour dispositif à semiconducteur est en contact ; une partie isolante au silicium formée dans une région où le fil pour dispositif à semiconducteur n'est pas en contact, de façon à soutenir la partie conductrice au silicium, et servant de couche isolante ; et au moins une ligne isolante de renfort formée dans une région où le fil de la partie conductrice au silicium est en contact. Lorsqu'un semiconducteur est plaqué contre une surface de contact de l'alvéole pour essai de semiconducteurs, un caoutchouc au silicium de l'alvéole pour essai de semiconducteurs et des poudres conductrices sont chassés dans toutes les directions, ce qui permet de minimiser les dommages occasionnés au film de caoutchouc par le frottement de la partie de contact.
PCT/KR2012/007415 2011-09-23 2012-09-17 Alvéole pour essai de semiconducteurs WO2013042907A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020110096121A KR101179545B1 (ko) 2011-09-23 2011-09-23 반도체 검사 소켓
KR10-2011-0096121 2011-09-23

Publications (2)

Publication Number Publication Date
WO2013042907A2 WO2013042907A2 (fr) 2013-03-28
WO2013042907A3 true WO2013042907A3 (fr) 2013-05-23

Family

ID=47073739

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2012/007415 WO2013042907A2 (fr) 2011-09-23 2012-09-17 Alvéole pour essai de semiconducteurs

Country Status (3)

Country Link
KR (1) KR101179545B1 (fr)
TW (1) TWI453438B (fr)
WO (1) WO2013042907A2 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102229229B1 (ko) * 2015-06-17 2021-03-18 (주)테크윙 테스트핸들러용 인서트
KR102470315B1 (ko) * 2016-01-29 2022-11-25 (주)테크윙 테스트핸들러용 인서트
KR101849623B1 (ko) * 2016-08-18 2018-04-17 오재숙 반도체 칩 테스트용 소켓의 접지 구조체 및 이를 구비한 반도체 칩 테스트용 소켓
KR101865257B1 (ko) 2016-12-28 2018-06-07 부경대학교 산학협력단 반도체 소자 테스트용 소켓
TWI654435B (zh) 2017-10-06 2019-03-21 吳在淑 半導體晶片測試用之插座的接地結構及測試包括該接地結構之半導體晶片的插座
KR102114110B1 (ko) * 2018-08-28 2020-05-25 주식회사 이노글로벌 양방향 도전성 모듈 및 이의 제조방법
KR102036105B1 (ko) * 2018-11-06 2019-10-24 (주)티에스이 신호 전송 커넥터

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100681156B1 (ko) * 2006-01-25 2007-02-09 삼성전자주식회사 전기적 검사 장치용 소켓
KR101004296B1 (ko) * 2008-07-07 2010-12-28 주식회사 아이에스시테크놀러지 전도성 와이어를 가진 테스트 소켓
KR20110004324A (ko) * 2009-07-06 2011-01-13 리노공업주식회사 반도체 칩 검사용 소켓
KR101019721B1 (ko) * 2008-11-11 2011-03-07 주식회사 아이에스시테크놀러지 기둥형 입자를 가지는 테스트 소켓

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000065891A (ja) 1998-08-18 2000-03-03 Seiko Epson Corp 電気的特性測定装置
TWI518340B (zh) * 2009-08-27 2016-01-21 李諾工業股份有限公司 半導體晶片測試插座

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100681156B1 (ko) * 2006-01-25 2007-02-09 삼성전자주식회사 전기적 검사 장치용 소켓
KR101004296B1 (ko) * 2008-07-07 2010-12-28 주식회사 아이에스시테크놀러지 전도성 와이어를 가진 테스트 소켓
KR101019721B1 (ko) * 2008-11-11 2011-03-07 주식회사 아이에스시테크놀러지 기둥형 입자를 가지는 테스트 소켓
KR20110004324A (ko) * 2009-07-06 2011-01-13 리노공업주식회사 반도체 칩 검사용 소켓

Also Published As

Publication number Publication date
TW201319597A (zh) 2013-05-16
KR101179545B1 (ko) 2012-09-05
TWI453438B (zh) 2014-09-21
WO2013042907A2 (fr) 2013-03-28

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