WO2013027550A1 - Procédé de génération de données maîtres pour l'inspection de substrats - Google Patents

Procédé de génération de données maîtres pour l'inspection de substrats Download PDF

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Publication number
WO2013027550A1
WO2013027550A1 PCT/JP2012/069592 JP2012069592W WO2013027550A1 WO 2013027550 A1 WO2013027550 A1 WO 2013027550A1 JP 2012069592 W JP2012069592 W JP 2012069592W WO 2013027550 A1 WO2013027550 A1 WO 2013027550A1
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WO
WIPO (PCT)
Prior art keywords
data
image data
inspection
master data
substrate
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Application number
PCT/JP2012/069592
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English (en)
Japanese (ja)
Inventor
博史 大池
郁夫 鈴木
Original Assignee
富士機械製造株式会社
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Filing date
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Application filed by 富士機械製造株式会社 filed Critical 富士機械製造株式会社
Publication of WO2013027550A1 publication Critical patent/WO2013027550A1/fr

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T1/00—General purpose image data processing
    • G06T1/0007—Image acquisition
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

Definitions

  • the present invention relates to a board inspection master data creation method for creating master data used when inspecting a board on which a component is mounted.
  • the board production line is equipped with an electronic component mounting machine and a board visual inspection machine.
  • the electronic component mounter mounts components on a board.
  • the board appearance inspection machine inspects the mounting state of components (for example, the orientation and position of the mounted components), the printed state of solder, and the like.
  • the board appearance inspection machine stores template data for each component type in advance.
  • an inspection area is set in advance for each component type of the component. The inspection area is set so that the reference mark of the part is included in the inspection area when the part is mounted in the correct orientation.
  • an imaging device of the substrate appearance inspection machine images a component mounted on the substrate and acquires image data.
  • the control device of the board appearance inspection machine compares the image data with a plurality of template data. That is, the component type of the component in the image data is determined. Then, the control device inspects the inspection area of the part in the image data. When the reference mark is in the inspection area, the control device determines that the orientation of the component is appropriate. On the other hand, when the reference mark is not included in the inspection area, the control device determines that the orientation of the component is inappropriate.
  • the board appearance inspection machine inspects the board based on the master data for each component type, such as template data and an inspection area.
  • Patent Document 1 discloses a method for creating library data suitable for a part type. According to the method described in this document, first, a sub-part type corresponding to the model is specified by selecting a sub-part type similar in appearance to the part of the model for which library data is to be created. Next, by referring to the image of the representative part, the user inputs the external features that are not specified for the sub part type, and the inspection rule for the sub part type is corrected according to the model. To do. In this way, the library data of the lower variation of the sub part type is registered.
  • hierarchical library data can be created by the method described in this document. This document does not disclose a method for creating master data shared by a plurality of components.
  • the substrate inspection master data creation method of the present invention has been completed in view of the above problems. It is an object of the present invention to provide a board inspection master data creation method capable of easily creating master data having a high degree of fitness.
  • the board inspection master data creation method of the present invention is used when inspecting a board on which a component is mounted, and is data for creating master data shared for a plurality of parts. It has a creation process and a verification process for inspecting the substrate and verifying the validity of the created master data.
  • creating master data includes not only the case of creating master data by editing a part image, but also the case of using the part image as master data as it is.
  • the “plural components” may be mounted on the same board or different boards.
  • master data that is shared by a plurality of parts can be created by the data creation process. Further, according to the substrate inspection master data creation method of the present invention, the validity of the created master data can be verified by the verification process. For this reason, it is possible to easily create master data having a high degree of fitness.
  • the master data is preferably shared by a plurality of components of the same component type. According to this configuration, master data can be created for each component type.
  • the data creation step includes a data collection step of collecting image data of a plurality of the parts, and at least two of the collected image data. It is better to have a screen display step for displaying data on a single screen and an editing step for creating the master data while displaying at least two pieces of the image data.
  • This configuration makes it possible to create master data while comparing multiple image data on a single screen. For this reason, it is possible to easily create master data as compared with a case where only a single image data is displayed on a single screen.
  • the result of editing any image data can be reflected in all remaining image data on a single screen.
  • the editing operation is simpler than the case of editing a plurality of image data one by one on a single screen. Also, the editing operation is simpler than the case where a plurality of image data is displayed on the screen one by one.
  • the verification step is for verification to display at least two of the collected image data on a single screen. It is better to have a configuration including a screen display process and a data comparison process for comparing the displayed plurality of image data with the master data.
  • the validity of the master data can be confirmed on the screen. In other words, the validity of the master data can be confirmed without using the master data on an actual board. Further, according to this configuration, the master data can be used for a plurality of image data on a single screen. For this reason, the validity of the master data can be confirmed from a bird's-eye view.
  • (3-2) Preferably, in the configuration of (3), after the data comparison step, there is a correction step of correcting the master data, and the correction step includes a plurality of the collected image data.
  • the master data when the master data is not valid, the master data can be corrected while comparing the image data and the master data on a single screen. Therefore, it is possible to easily correct the master data as compared with the case where only the image data or the master data is displayed on a single screen.
  • the master data is template data used for determining the identity of a component type when inspecting the board. Better.
  • the master data may be a configuration that is an inspection condition for the component when the substrate is inspected.
  • the inspection conditions such as the size and position of the inspection area can be shared among a plurality of parts.
  • FIG. 1 is a schematic diagram of a production line.
  • FIG. 2 is a block diagram of the server and the board appearance inspection machine.
  • FIG. 3 is a top view of the substrate appearance inspection machine.
  • FIG. 4 is a perspective view of the vicinity of the inspection head of the substrate appearance inspection machine.
  • FIG. 5 is a top view of a substrate on which components for teaching are mounted.
  • FIG. 6 is a schematic diagram of a screen in the screen display process of the substrate inspection master data creation method of the first embodiment.
  • FIG. 7 is a schematic view of a screen in the first stage of the editing process of the substrate inspection master data creation method.
  • FIG. 8 is a schematic diagram of a screen in the second stage of the editing process.
  • FIG. 9 is a schematic diagram of a screen in the third stage of the editing process.
  • FIG. 1 is a schematic diagram of a production line.
  • FIG. 2 is a block diagram of the server and the board appearance inspection machine.
  • FIG. 3 is a top view of the
  • FIG. 10 is a schematic diagram of a screen in the verification screen display step of the substrate inspection master data creation method.
  • FIG. 11 is a schematic diagram of a screen in the first stage of the data comparison process of the substrate inspection master data creation method.
  • FIG. 12 is a schematic diagram of a screen in the second stage of the data comparison process.
  • FIG. 13 is a schematic diagram of a screen in the second stage of the editing process of the substrate inspection master data creation method of the second embodiment.
  • FIG. 14 is a schematic diagram of a screen in the third stage of the editing process.
  • FIG. 15 is a schematic diagram of a screen in the third stage of the editing process of the substrate inspection master data creation method according to another embodiment.
  • B substrate
  • B1 imaging area
  • D1 to D8 image data
  • H background
  • L1 to L4 seek line (template data)
  • Pa1a to Pa4a reference mark
  • Pa1 to Pa8 parts
  • R inspection area ( Inspection conditions)
  • W frame
  • ⁇ D incident angle
  • ⁇ M incident angle
  • ⁇ U incident angle.
  • template data is created by flowing a teaching component-mounted board through a board visual inspection machine.
  • FIG. 1 shows a schematic diagram of a production line.
  • the production line 9 includes a server 1, a plurality of electronic component mounting machines 6, a board appearance inspection machine 7, and a reflow furnace 92.
  • the plurality of electronic component mounting machines 6, the board appearance inspection machine 7, and the reflow furnace 92 are arranged in a line from the left side (upstream side) to the right side (downstream side). A large number of components are mounted in stages on the substrate conveyed through the production line 9 by a plurality of electronic component mounting machines 6.
  • the board appearance inspection machine 7 inspects the mounting state of components on the board.
  • the reflow furnace 92 melts the cream solder interposed between the substrate and the component, and solders the component to the substrate.
  • the server 1 is electrically connected to these devices via a LAN (Local Area Network) cable.
  • LAN Local Area Network
  • Fig. 2 shows a block diagram of the server and board appearance inspection machine.
  • the server 1 includes a keyboard 11, a mouse 12, a monitor 13, and a control device 14.
  • the monitor 13 includes a screen 130.
  • the control device 14 includes an input / output interface 140, a storage unit 141, and a calculation unit 142.
  • the user can input a command to the control device 14 via the input / output interface 140 from any of the keyboard 11, mouse 12, and screen 130.
  • the storage unit 141 stores an editor for executing the substrate inspection master data creation method of the present embodiment.
  • FIG. 3 shows a top view of the substrate appearance inspection machine.
  • the substrate B is hatched.
  • the substrate appearance inspection machine 7 includes a base 72, a substrate transfer device 73, an XY robot 74, an inspection head 75, a control device 76, and an image processing device 77. ing.
  • the control device 76 includes an input / output interface 760, a storage unit 761, and a calculation unit 762.
  • the input / output interface 760 of the control device 76 and the input / output interface 140 of the control device 14 are connected so as to be capable of bidirectional communication.
  • the control device 76 includes a transfer motor 731 of the substrate transfer device 73, an X-axis motor 746 of the XY robot 74, a Y-axis motor 747, an illumination device 2 of the inspection head 75, an imaging device 3, an image processing device 77, and an input / output interface 760. Is connected through.
  • the substrate transfer device 73 is disposed on the upper surface of the base 72.
  • the substrate transfer device 73 includes a pair of front and rear conveyor belts 730f and 730r, and a transfer motor 731.
  • the conveyance motor 731 drives a pair of conveyor belts 730f and 730r.
  • the substrate B is conveyed from the left side to the right side by the conveyor belts 730f and 730r.
  • the X axis corresponds to the left-right direction
  • the Y axis corresponds to the front-rear direction
  • the Z direction corresponds to the up-down direction.
  • the XY robot 74 includes a Y-axis slide 740, an X-axis slide 741, a pair of upper and lower Y-axis lower slides 742, a pair of front and rear X-axis lower slides 743f and 743r, an X-axis ball screw portion 744, and a Y-axis ball.
  • a screw portion 745, an X-axis motor 746, and a Y-axis motor 747 are provided.
  • a pair of front and rear X-axis lower slides 743f and 743r are arranged on the upper surface of the base 72 so as to sandwich the substrate transfer device 73 from the front-rear direction.
  • the X-axis slide 741 is attached to a pair of front and rear X-axis lower slides 743f and 743r so as to be slidable in the left-right direction.
  • the X-axis ball screw portion 744 is attached to the base 72.
  • the X axis ball screw portion 744 drives the X axis slide 741.
  • the X-axis motor 746 is attached to the base 72.
  • the X axis motor 746 drives the X axis ball screw portion 744.
  • the pair of upper and lower Y-axis lower slides 742 are arranged on the X-axis slide 741.
  • the Y-axis slide 740 is attached to a pair of upper and lower Y-axis lower slides 742 so as to be slidable in the front-rear direction.
  • the Y-axis ball screw portion 745 is attached to the X-axis slide 741.
  • the Y-axis ball screw part 745 drives the Y-axis slide 740.
  • the Y axis motor 747 is attached to the X axis slide 741.
  • the Y-axis motor 747 drives the Y-axis ball screw part 745.
  • the inspection head 75 is attached to the Y-axis slide 740 so that the operator can easily attach and detach it. For this reason, for example, it is possible to easily replace a plurality of types of inspection heads 75 having different fields of view and resolution.
  • the replacement work of the inspection head 75 may be performed manually by the operator with one touch.
  • the Y-axis slide 740 may fix or release the inspection head 75 by magnetic force or negative pressure.
  • the inspection head 75 can be automatically replaced by using the X-axis and Y-axis operations of the Y-axis slide 740.
  • the plurality of types of inspection heads 75 to be exchanged are arranged in the movement range of the Y-axis slide 740 on the base 72.
  • FIG. 4 is a perspective view of the vicinity of the inspection head of the substrate visual inspection machine.
  • the inspection head 75 includes a frame 750, the illumination device 2, and the imaging device 3.
  • the frame 750 includes three upper and lower brackets 750U, 750M, and 750D. In the center of each of the brackets 750U, 750M, and 750D, a hole for passing light is formed.
  • the illuminating device 2 includes an epi-illuminator 20U, a side-lighting upper stage illuminator 20M, and a side-lighting lower stage illuminator 20D.
  • the epi-illuminator 20U is attached to the upper bracket 750U.
  • the epi-illuminator 20U includes a light source 200U, a half mirror 201U, and an optical system (not shown).
  • incident light (illumination light) 21U of the light source 200U is converted into parallel light by an optical system having a lens or the like.
  • the incident light 21U travels to the left, turns 90 ° by the half mirror 201U, and travels downward. For this reason, the imaging area B1 on the upper surface of the substrate B is illuminated from directly above by the incident light 21U.
  • the incident angle ⁇ U of the incident light 21U with respect to the imaging area B1 is 90 °.
  • the side elevation upper illuminator 20M is attached to the middle bracket 750M.
  • the side elevation upper stage illuminator 20M includes a ring-shaped light source 200M. As shown by a dotted line in FIG. 4, the imaging area B1 on the upper surface of the substrate B is illuminated from the direction of the incident angle ⁇ M ( ⁇ U) by the side-emission upper stage light (illumination light) 21M from the light source 200M.
  • the side-illumination lower stage illuminator 20D is attached to the lower bracket 750D.
  • the side-illuminated lower stage illuminator 20D includes a ring-shaped light source 200D. As shown by a dotted line in FIG. 4, the imaging area B1 on the upper surface of the substrate B is illuminated from the direction of the incident angle ⁇ D ( ⁇ M) by the side-illuminated lower stage light (illumination light) 21D from the light source 200D.
  • the light sources 200U, 200M, and 200D are all white LEDs (Light-Emitting Diode). For this reason, each of the light sources 200U, 200M, and 200D has all the three primary color components of R (red), G (green), and B (blue).
  • the imaging device 3 is attached to the upper bracket 750U.
  • the imaging device 3 is a CCD (Charge-Coupled Device) area sensor.
  • the imaging device 3 has an imaging surface on which a large number of light receiving elements are two-dimensionally arranged. The imaging device 3 images the imaging area B1 from directly above.
  • the image processing device 77 is connected to the inspection head 75.
  • the image processing device 77 processes the image data captured by the imaging device 3.
  • the image processing device 77 transmits the processed image data to the control device 76.
  • the substrate inspection master data creation method of the present embodiment includes a data creation process and a verification process.
  • the board inspection master data creation method of this embodiment is executed by the editor of the storage unit 141 of the server 1 shown in FIG.
  • the server 1 creates template data using the board appearance inspection machine 7.
  • the template data is used to search for a component to be inspected at the time of board inspection by the board appearance inspection machine 7.
  • Template data is shared for a plurality of parts of the same part type.
  • the data creation process includes a data collection process, a screen display process, and an editing process.
  • FIG. 5 shows a top view of the teaching component-mounted substrate.
  • a large number of components Pa1 to Pa8 and Pb to Pe are mounted on the substrate B. That is, five or more parts Pa1 to Pa8 and Pb to Pe are mounted at predetermined coordinates on the substrate B.
  • template data of eight parts Pa1 to Pa8 of the same part type is created on behalf of five types of parts Pa1 to Pa8 and Pb to Pe.
  • the control device 76 shown in FIG. 2 drives the XY robot 74 to move the inspection head 75 so that the imaging device 3 is arranged right above the parts Pa1 to Pa8 and Pb to Pe that are imaging targets.
  • the control device 76 shown in FIG. 2 drives the illumination device 2 and the imaging device 3, and images the parts Pa1 to Pa8 and Pb to Pe, which are imaging targets.
  • the illuminating device 2 includes an epi-illuminator 20U, a side illuminating upper stage illuminator 20M, and a side illuminating lower stage illuminator 20D.
  • the control device 76 shown in FIG. 2 has (a) incident light 21U, side-emergence upper stage light 21M, side-emergence lower stage light 21D, and (b) incident light, one by one for all components Pa1 to Pa8 and Pb to Pe. Imaging is performed with a total of four patterns of only the incident light 21U, (c) only the upper-side light 21M, and (d) only the lower-stage light 21D. By the imaging, the imaging device 3 acquires (total number of parts ⁇ 4) pieces of image data.
  • the plurality of image data is transmitted to the control device 14 of the server 1 via the image processing device 77 and the control device 76 shown in FIG.
  • a plurality of image data is stored in the storage unit 141.
  • FIG. 6 shows a schematic diagram of a screen in the screen display process of the substrate inspection master data creation method of the present embodiment.
  • the image data D1 of the part Pa1, the image data D2 of the part Pa2, the image data D3 of the part Pa3, and the image data D4 of the part Pa4 are arranged on the screen 130 vertically and horizontally.
  • a background part for example, a resist, a land pattern, adjacent parts, etc.
  • FIG. 7 shows a schematic diagram of a screen in the first stage of the editing process of the substrate inspection master data creation method of the present embodiment.
  • FIG. 8 shows a schematic diagram of a screen in the second stage of the editing process.
  • FIG. 9 shows a schematic diagram of the screen in the third stage of the editing process.
  • the user selects the contrast (brightness difference) between the components Pa1 to Pa4 and the substrate B from the four illumination patterns (a) to (d),
  • the illumination pattern is selected so that the contrast between the parts Pa1 to Pa4 and the background portion H is maximized (that is, the parts Pa1 to Pa4 are most clearly visible).
  • illumination buttons 130a to 130d are arranged corresponding to the above four illumination patterns (a) to (d).
  • the control device 14 refers to the image data D1 to D4 in the storage unit 141, and the illumination pattern of (a), that is, the drop shown in FIG. Image data D1 to D4 obtained by imaging using the incident light 21U, the side-light upper stage light 21M, and the side-light lower stage light 21D are displayed on the screen 130.
  • the control device 14 displays on the screen 130 the image data D1 to D4 that are captured using the illumination patterns (b) to (d).
  • one illumination pattern is selected from the above four illumination patterns (a) to (d). Is done.
  • the control device 14 displays on the screen 130 the image data D1 to D4 when captured using the illumination pattern.
  • the user next instructs the control device 14 to display an edge detection line (hereinafter referred to as “seek line”) as shown in FIG. That is, a seek line display button 131 is arranged on the screen 130.
  • a seek line display button 131 is arranged on the screen 130.
  • seek lines L1 to L4 are arranged for each of the image data D1 to D4. Specifically, the seek lines L1 to L4 are arranged so as to be orthogonal to the outlines of the bodies (portions excluding the leads) of the parts Pa1 to Pa4 of the image data D1 to D4. Further, the seek lines L1 to L4 are arranged so that the center in the longitudinal direction of the seek lines L1 to L4 intersects the outline.
  • the user optimizes the seek lines L1 to L4 so that they can be shared by the four parts Pa1 to Pa4 of the image data D1 to D4.
  • the seek lines L1 of the image data D2 to D4 are also clicked in synchronization.
  • the seek lines L1 of the single image data D1 it is possible to select all the seek lines L1 of the image data D1 to D4.
  • the seek line L1 of the image data D1 When the user drags the seek line L1 of the image data D1 with the mouse 12 shown in FIG. 2, not only the seek line L1 of the image data D1 but also the seek lines L1 of the image data D2 to D4 are dragged synchronously.
  • the length of the seek line L1 of all the image data D1 to D4 can be expanded or contracted by the same amount.
  • the angles of the seek lines L1 of all the image data D1 to D4 can be changed by the same amount.
  • the above editing operation is performed not only on a single seek line L1 but also on a plurality of seek lines L1 to L4 (specifically, a plurality of seek lines L1 to L4 are simultaneously selected with the mouse 12). can do.
  • the editing operation can also be performed on the seek lines L1 to L4 of the image data D2 to D4 other than the image data D1.
  • the user performs editing on the screen 130 so that the seek lines L1 to L4 are orthogonal to the outlines of the bodies of the parts Pa1 to Pa4. Further, the editing operation is performed on the screen 130 so that the center in the longitudinal direction of the seek lines L1 to L4 intersects the outline.
  • the lower edge line (part of the outline) of the part Pa1 overlaps the background portion H. For this reason, it is difficult to set the seek line L2.
  • the lower edge lines (part of the outline) of the parts Pa2 to Pa4 do not overlap the background portion H. For this reason, it is easy to set the seek line L2.
  • the user can set the seek line L2 with reference to the parts Pa2 to Pa4 of the image data D2 to D4 even if it is difficult to set the seek line L2 only with the part Pa1 of the image data D1. Can do.
  • the right edge line of the part Pa2 of the image data D2, the left edge line of the part Pa3 of the image data D3, and the upper edge line of the part Pa4 of the image data D4 are also respectively the background portion H. It overlaps with.
  • the seek lines L1, L3, and L4 can be set with reference to the parts Pa1 to Pa4 of the other image data D1 to D4.
  • the seek lines L1 to L4 are optimized so that they can be shared by the four parts Pa1 to Pa4 of the image data D1 to D4.
  • the optimized seek lines L1 to L4 are template data.
  • the template data is stored in the storage unit 141 of the control device 14 shown in FIG.
  • the verification process includes a verification screen display process and a data comparison process.
  • FIG. 10 shows a schematic diagram of a screen in the verification screen display process of the substrate inspection master data creation method of the present embodiment.
  • the image data D5 of the part Pa5 the image data D6 of the part Pa6, the image data D7 of the part Pa7, and the image data D8 of the part Pa8 are arranged on the screen 130 vertically and horizontally.
  • the component Pa5 is rotated 90 ° to the right, the component Pa7 is 180 °, and the component Pa8 is 90 ° to the left with respect to the direction of the component Pa6.
  • the control device 14 shown in FIG. 2 displays the parts Pa5 to Pa8 (that is, the image data D5 to D8) on the screen 130 in the same direction.
  • the template data is created based on the parts Pa1 to Pa4 of the same part type as the parts Pa5 to Pa8. Therefore, if the template data is valid, the calculation unit 142 determines that “four image data D5 to D8 are suitable for the template data”. On the other hand, if the template data is not valid, the calculation unit 142 determines that “the four pieces of image data D5 to D8 do not match the template data”.
  • FIG. 11 shows a schematic diagram of the screen in the first stage of the data comparison process of the substrate inspection master data creation method of the present embodiment.
  • FIG. 12 shows a schematic diagram of a screen in the second stage of the data comparison process.
  • control device 14 shown in FIG. 2 displays template data (seek lines L1 to L4) on each of the image data D5 to D8 as shown in FIG.
  • the control device 14 shown in FIG. 2 aligns the template data and the parts Pa5 to Pa8. Specifically, as shown in FIG. 12, the control device 14 determines that the parts Pa5 to Pa4 intersect the outlines of the bodies of the parts Pa5 to Pa8 so that the seek lines L1 to L4 intersect as close to orthogonal as possible. Scan template data for Pa8. Further, the control device 14 scans the template data for the parts Pa5 to Pa8 so that the position of the outline of the body of the parts Pa5 to Pa8 intersects with the center in the longitudinal direction of the seek lines L1 to L4 as much as possible. Let
  • the position of the intersection between the seek lines L1 to L4 and the body outlines of the parts Pa5 to Pa8 is determined based on the luminance of the image data D5 to D8. That is, in the image data D5 to D8, the luminance is different between the portion where the body of the parts Pa5 to Pa8 is disposed, the portion where the background portion H is disposed, and the portion where the substrate B is disposed.
  • the luminance changes remarkably between the right part and the left part of the seek line L1 with the left edge line of the body of the part Pa5 as a boundary. Based on the change in luminance, the position of the intersection of the seek line L1 and the left edge line of the body of the part Pa5 is determined.
  • the template data, the parts Pa5 to Pa8, and the seek lines L1 to L4 intersect with the outlines of the bodies of the parts Pa5 to Pa8 in a state that is as orthogonal as possible. Perform position alignment. Further, the template data and the parts Pa5 to Pa8 are aligned so that the positions of the body outlines of the parts Pa5 to Pa8 intersect as close as possible to the longitudinal center of the seek lines L1 to L4.
  • the storage unit 141 shown in FIG. 2 stores criteria for matching the template data with the parts Pa5 to Pa8.
  • the calculation unit 142 compares the determination criterion with the matching state between the template data in the image data D5 to D8 and the parts Pa5 to Pa8. Then, it is determined whether the image data D5 to D8 matches the template data or whether the image data D5 to D8 does not match the template data. That is, the difference between the part type of the template data and the part type of the parts Pa5 to Pa8 is determined.
  • the template data is created based on the parts Pa1 to Pa4 of the same part type as the parts Pa5 to Pa8. For this reason, when it is determined that the component type of the template data is the same as the component types of the components Pa5 to Pa8, the template data has validity with respect to the components Pa1 to Pa8. Become. That is, the template data is appropriate as template data for searching for parts of the same part type as the parts Pa1 to Pa8.
  • the template data is transmitted to the board appearance inspection machine 7 shown in FIG. 2 and stored in the storage unit 761.
  • the board appearance inspection machine 7 inspects the board B using the stored template data.
  • the template data has validity for the parts Pa1 to Pa4.
  • the parts Pa5 to Pa8 have no validity. That is, the template data is inappropriate as template data for searching for parts of the same part type as the parts Pa1 to Pa8.
  • the data creation process is executed again. That is, template data is recreated using, for example, parts Pa3 to Pa6.
  • template data (seek lines L1 to L4) shared by the eight parts Pa1 to Pa8 of the same part type is created by the data creation process. Can do.
  • the validity of the created template data can be verified by the verification process. For this reason, template data having a high degree of matching can be easily created.
  • template data can be created while comparing the four image data D1 to D4 on a single screen 130. Therefore, template data can be created more easily than when only a single image data D1 to D4 is displayed on a single screen 130. Specifically, even if some of the outlines of the parts Pa1 to Pa4 of the image data D1 to D4 are unclear, the seek lines L1 to L4 are based on the other image data D1 to D4 where the same portion is clear. L4 can be set.
  • the result of editing the arbitrary image data D1 is reflected on all the remaining image data D2 to D4 on the single screen 130. be able to. Therefore, the editing operation is simpler than the case where a plurality of image data D1 to D4 are edited one by one on a single screen 130. In addition, the editing operation is simpler than when a plurality of image data D1 to D4 are displayed on the screen 130 one by one.
  • the result of the editing work can be confirmed on a single screen 130. Therefore, the validity of the editing work for all the image data D1 to D4 on the screen 130 can be confirmed from a bird's-eye view.
  • the validity of the template data can be confirmed on the screen 130. That is, the validity of the template data can be confirmed without using the template data on the actual substrate B. Further, according to the verification process of the substrate inspection master data creation method of the present embodiment, template data can be used for a plurality of image data D5 to D8 on a single screen 130. For this reason, the validity of the template data can be confirmed from a bird's-eye view.
  • the data creation process can be executed again to recreate the template data.
  • Second Embodiment The difference between the board inspection master data creation method of the present embodiment and the board inspection master data creation method of the first embodiment is that the master data to be created is not template data but a board inspection. This is a part inspection area. Here, only differences will be described. In addition, FIG. 2 is used for description.
  • FIG. 13 shows a schematic diagram of the screen in the second stage of the editing process of the substrate inspection master data creation method of the present embodiment.
  • FIG. 14 shows a schematic diagram of the screen in the third stage of the editing process. Parts corresponding to those in FIGS. 8 and 9 are denoted by the same reference numerals. The processes up to the first stage of the editing process are the same as in the first embodiment (see FIGS. 5 to 7).
  • the user instructs the control device 14 shown in FIG. 2 to display the inspection area as shown in FIG. That is, the examination area display button 132 is arranged on the screen 130.
  • the control device 14 shown in FIG. 2 displays the examination area R on the screen 130 as shown in FIG. 14.
  • the inspection region R is included in the concept of “inspection conditions” of the present invention.
  • the inspection region R is used for inspecting the orientations of the parts Pa1 to Pa4 during the board inspection.
  • the inspection area R is arranged one by one for each of the image data D1 to D4. Specifically, a rectangular inspection region R is arranged so as to surround the reference marks Pa1a to Pa4a of the parts Pa1 to Pa4 of the image data D1 to D4 as much as possible.
  • the user optimizes the inspection region R so that it can be shared by the four parts Pa1 to Pa4 of the image data D1 to D4. That is, the positions of the reference marks Pa1a to Pa4a of the parts Pa1 to Pa4 of the same part type should be essentially the same. However, the positions of the reference marks Pa1a to Pa4a may be shifted between the parts Pa1 to Pa4. Even in such a case, the inspection region R is edited so that the reference marks Pa1a to Pa4a enter the inspection region R.
  • the editing work of the inspection area R of the four pieces of image data D1 to D4 is associated with each other. For example, when the user clicks the inspection area R of the image data D1 with the mouse 12 shown in FIG. 2, the inspection areas R of the image data D2 to D4 are also clicked in synchronization. As described above, by clicking the inspection region R of the single image data D1, it is possible to select all the inspection regions R of the image data D1 to D4.
  • the inspection area R of the image data D1 When the user clicks and drags and drops the inspection area R of the image data D1 with the mouse 12 shown in FIG. 2, not only the inspection area R of the image data D1, but also the inspection areas R of the image data D2 to D4 are displayed. Clicked, dragged and dropped in sync. In this way, by clicking and dragging and dropping the inspection area R of the single image data D1, all the inspection areas R of the image data D1 to D4 can be moved by the same amount. Note that the above editing operation can also be performed on the inspection region R of the image data D2 to D4 other than the image data D1.
  • the optimized inspection region R is stored in the storage unit 141 of the control device 14 shown in FIG.
  • the orientation of the part is determined based on the average luminance of the inspection region R. That is, the average luminance of the inspection region R differs between when the reference marks Pa1a to Pa4a are arranged in the inspection region R and when they are not arranged. Based on the difference in the average luminance, the orientation of the component is determined.
  • the inspection area R is appropriate as master data. In this case, the inspection area R is transmitted to the board appearance inspection machine 7 shown in FIG. 2 and stored in the storage unit 761.
  • the substrate appearance inspection machine 7 inspects the substrate B using the stored inspection region R.
  • the inspection area R is inappropriate as master data. In this case, the data creation process is executed again. That is, the inspection region R is recreated using parts of the same part type as the parts Pa1 to Pa4.
  • the substrate inspection master data creation method of the present embodiment and the substrate inspection master data creation method of the first embodiment have the same operational effects with respect to the parts having the same configuration.
  • the inspection region R can be shared by a plurality of parts Pa1 to Pa4 of the same part type.
  • the acquisition method of image data is not particularly limited.
  • the image data of the parts Pa1 to Pa8 and Pb to Pe is taken into the server 1 from the teaching board B.
  • the image data of the parts Pa1 to Pa8 and Pb to Pe may be taken into the server 1 from the board B actually being produced.
  • the image data of the components Pa1 to Pa8 and Pb to Pe may be taken into the server 1 from a plurality of substrates B of different substrate types.
  • the 6 may display a plurality of components arranged at the same coordinates on different substrates B of the same substrate type. In this way, on the same screen 130, it is possible to compare the mounting state of the components based on the coordinates. For example, the component at the coordinate ⁇ of the first board B produced, the component at the coordinate ⁇ of the second board B produced, the component at the coordinate ⁇ of the third board B produced, and the fourth board produced It can be compared with the component of the coordinate ⁇ of B. In addition, image data can be edited while comparing.
  • master data (template data (seek lines L1 to L4), inspection region R) determined to be inappropriate in the verification process was recreated.
  • the master data may be corrected.
  • the master data and the image data may be displayed on the screen 130 shown in FIG. 6, and the master data may be corrected while comparing both data. In this way, it is possible to easily correct the master data as compared with the case where only image data or master data is displayed on the single screen 130.
  • the input method for the server 1 is not particularly limited.
  • the keyboard 11, the mouse 12, and the monitor screen 130 (specifically, a touch panel) shown in FIG. 2 may be used.
  • the editor need not be stored in the server 1.
  • the editor may be stored in the storage unit 761 of the board appearance inspection machine 7. In this case, the board inspection master data creation method can be executed without using the server 1.
  • the board inspection master data creation method of the present invention may be executed by the electronic component mounting machine 6.
  • the appearance inspection of the board B may be executed by the electronic component mounting machine 6.
  • two detachable work heads may be mounted on the electronic component mounting machine 6, and one may be used as a mounting head for mounting components and the other as an inspection head for inspecting the substrate B. In this way, it is possible to acquire the image data of the component immediately after mounting. In addition, it is possible to immediately inspect a component immediately after mounting. For this reason, it is possible to reduce the number of defective substrates flowing in the subsequent process, and thus to prevent the yield from deteriorating.
  • the user has edited the master data, but may be performed by the control device 14.
  • the control device 14 may perform only a part of the editing work (for example, selection of an illumination pattern).
  • the type of master data is not particularly limited. For example, it may be data relating to the inspection of the leads of the components Pa1 to Pa8 (inspection of the degree of bending, length, thickness, etc. of the leads). Further, the captured image data D1 to D8 may be used as they are as master data without any processing. For example, although the amount of data increases, the same type of mounted components are sequentially imaged, and the total number of acquired image data including the background may be used as master data. Each image data itself may be master data. Moreover, only the characteristic part of each image data is good also as master data.
  • the acquired image data is displayed side by side on a single screen, and it becomes master data easily from multiple image data, such as those with obvious mounting defects, parts with different parts types, or imaging defects.
  • Image data that can be determined not to be obtained may be deleted. In this way, the data amount can be reduced.
  • the size, the number of arrangements, and the layout of the image data D1 to D8 on the screen 130 are not particularly limited.
  • the number of arrangement of the image data D1 to D8 may be 2, 3, 6, 8, or the like.
  • the number, angle, interval, length, thickness, etc. of the seek lines L1 to L4 are not particularly limited.
  • a plurality of seek lines L1 may be arranged side by side with respect to the left edge line of the part Pa1.
  • FIG. 15 is a schematic diagram of a screen in the third stage of the editing process of the substrate inspection master data creation method according to another embodiment.
  • the left edge line and right edge line (outline) of the bodies of the parts Pa1 to Pa4 do not overlap the background portion H.
  • the server 1 shown in FIG. 2 can reveal the seek lines L1 and L3 of the parts Pa1 to Pa4 using the frame W or the like.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Image Analysis (AREA)
  • Image Processing (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

L'objectif de cette invention est de pourvoir à un procédé de génération de données maîtres pour l'inspection de substrats qui permet de générer facilement des données maîtres applicables au plus grand nombre. Le procédé de génération de données maîtres pour l'inspection de substrats selon l'invention sert à inspecter un substrat (B) sur lequel des composants (Pa1-Pa8) sont montés, ledit procédé comprenant : une étape de génération de données consistant à générer des données maîtres communes (L1-L4) applicables à de multiples composants (Pa1-Pa8) ; et une étape de vérification consistant à inspecter le substrat (B) afin de vérifier la validité des données maîtres générées (L1-L4).
PCT/JP2012/069592 2011-08-25 2012-08-01 Procédé de génération de données maîtres pour l'inspection de substrats WO2013027550A1 (fr)

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EP3264071A4 (fr) * 2015-02-26 2018-08-01 Fuji Machine Mfg. Co., Ltd. Dispositif d'inspection et procédé d'inspection

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JPH1050786A (ja) * 1996-07-29 1998-02-20 Nec Corp 配線の良／不良判定装置及び方法
JPH11304426A (ja) * 1998-04-16 1999-11-05 Hitachi Denshi Ltd パターンマッチングによる画像の測定装置
JP2002062112A (ja) * 2000-08-21 2002-02-28 Sony Corp 位置決め装置及び位置決め方法
JP2005249615A (ja) * 2004-03-04 2005-09-15 Denso Corp 異品種混入検査方法
JP2007292488A (ja) * 2006-04-21 2007-11-08 Hitachi Ltd 外観検査装置および同装置を用いたプリント配線基板の検査方法
JP2009250707A (ja) * 2008-04-03 2009-10-29 Toyota Motor Corp マスター画像選択方法

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JP2008051781A (ja) * 2006-08-28 2008-03-06 I-Pulse Co Ltd 基板の外観検査方法および装置

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Publication number Priority date Publication date Assignee Title
JPH1050786A (ja) * 1996-07-29 1998-02-20 Nec Corp 配線の良／不良判定装置及び方法
JPH11304426A (ja) * 1998-04-16 1999-11-05 Hitachi Denshi Ltd パターンマッチングによる画像の測定装置
JP2002062112A (ja) * 2000-08-21 2002-02-28 Sony Corp 位置決め装置及び位置決め方法
JP2005249615A (ja) * 2004-03-04 2005-09-15 Denso Corp 異品種混入検査方法
JP2007292488A (ja) * 2006-04-21 2007-11-08 Hitachi Ltd 外観検査装置および同装置を用いたプリント配線基板の検査方法
JP2009250707A (ja) * 2008-04-03 2009-10-29 Toyota Motor Corp マスター画像選択方法

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