WO2013009151A3 - 검사방법 - Google Patents

검사방법 Download PDF

Info

Publication number
WO2013009151A3
WO2013009151A3 PCT/KR2012/005636 KR2012005636W WO2013009151A3 WO 2013009151 A3 WO2013009151 A3 WO 2013009151A3 KR 2012005636 W KR2012005636 W KR 2012005636W WO 2013009151 A3 WO2013009151 A3 WO 2013009151A3
Authority
WO
WIPO (PCT)
Prior art keywords
measurement
area
measurement area
reference data
data
Prior art date
Application number
PCT/KR2012/005636
Other languages
English (en)
French (fr)
Other versions
WO2013009151A2 (ko
Inventor
조수용
Original Assignee
주식회사 고영테크놀러지
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 고영테크놀러지 filed Critical 주식회사 고영테크놀러지
Priority to CN201280034275.6A priority Critical patent/CN103649675B/zh
Priority to US14/232,480 priority patent/US10706521B2/en
Priority to JP2014520142A priority patent/JP5908585B2/ja
Publication of WO2013009151A2 publication Critical patent/WO2013009151A2/ko
Publication of WO2013009151A3 publication Critical patent/WO2013009151A3/ko

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G01B11/2513—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object with several lines being projected in more than one direction, e.g. grids, patterns
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/56—Cameras or camera modules comprising electronic image sensors; Control thereof provided with illuminating means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Image Analysis (AREA)
  • Image Processing (AREA)
  • Spectrometry And Color Measurement (AREA)

Abstract

기판을 검사하기 위하여, 먼저 기판 상에 측정영역을 설정하고, 측정영역에 대한 기준 데이터를 획득한다. 이어서, 측정영역에 대한 측정 데이터를 컬러별로 획득하고, 측정영역에 대하여 획득된 기준 데이터 및 컬러별 측정 데이터를 이용하여 조명조건을 설정한다. 다음으로, 측정영역에 대하여 특징객체를 설정하고, 특징객체에 대응하는 기준 데이터와 설정된 조명조건에 따른 특징객체에 대응하는 측정 데이터를 비교하여, 기준 데이터와 측정 데이터 사이의 왜곡량을 획득한다. 이어서, 왜곡량을 보상하여 측정영역 내의 검사영역을 설정한다. 이에 따라, 왜곡을 보상한 정확한 검사영역을 설정할 수 있다.
PCT/KR2012/005636 2011-07-13 2012-07-13 검사방법 WO2013009151A2 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201280034275.6A CN103649675B (zh) 2011-07-13 2012-07-13 检查方法
US14/232,480 US10706521B2 (en) 2011-07-13 2012-07-13 Inspection method
JP2014520142A JP5908585B2 (ja) 2011-07-13 2012-07-13 検査方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020110069301A KR101642897B1 (ko) 2011-07-13 2011-07-13 검사방법
KR10-2011-0069301 2011-07-13

Publications (2)

Publication Number Publication Date
WO2013009151A2 WO2013009151A2 (ko) 2013-01-17
WO2013009151A3 true WO2013009151A3 (ko) 2013-04-04

Family

ID=47506757

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2012/005636 WO2013009151A2 (ko) 2011-07-13 2012-07-13 검사방법

Country Status (5)

Country Link
US (1) US10706521B2 (ko)
JP (1) JP5908585B2 (ko)
KR (1) KR101642897B1 (ko)
CN (1) CN103649675B (ko)
WO (1) WO2013009151A2 (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101447968B1 (ko) * 2013-04-16 2014-10-13 주식회사 고영테크놀러지 기판 검사를 위한 기준평면 설정방법 및 기준평면을 이용한 기판 검사방법
KR101474859B1 (ko) * 2013-09-12 2014-12-30 주식회사 고영테크놀러지 기판 검사를 위한 기준 데이터 생성방법
JP6665203B2 (ja) * 2015-05-21 2020-03-13 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． ビデオシーケンスからのパルス信号の決定
KR101893823B1 (ko) * 2016-10-04 2018-08-31 주식회사 고영테크놀러지 기판 검사장치 및 이를 이용한 기판의 왜곡 보상 방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006099758A (ja) * 2004-09-06 2006-04-13 Omron Corp 基板検査方法および基板検査装置
KR20080002044A (ko) * 2006-06-30 2008-01-04 삼성전자주식회사 검사 영역 설정 방법
KR20100108877A (ko) * 2009-03-30 2010-10-08 주식회사 고영테크놀러지 검사영역의 설정방법
KR20110052956A (ko) * 2009-11-13 2011-05-19 주식회사 고영테크놀러지 3차원 형상 측정장치

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5085517A (en) * 1989-10-31 1992-02-04 Chadwick Curt H Automatic high speed optical inspection system
US5129009A (en) * 1990-06-04 1992-07-07 Motorola, Inc. Method for automatic semiconductor wafer inspection
US5495535A (en) * 1992-01-31 1996-02-27 Orbotech Ltd Method of inspecting articles
TW401008U (en) * 1993-04-21 2000-08-01 Omron Tateisi Electronics Co Visual inspection support device and substrate inspection device
US5517234A (en) * 1993-10-26 1996-05-14 Gerber Systems Corporation Automatic optical inspection system having a weighted transition database
US6539106B1 (en) * 1999-01-08 2003-03-25 Applied Materials, Inc. Feature-based defect detection
JP2001283194A (ja) * 2000-03-28 2001-10-12 Sony Corp 回路基板の外観検査方法及び回路基板の外観検査装置
JP4411738B2 (ja) * 2000-04-04 2010-02-10 株式会社ニコン 表面検査装置
EP1358623B1 (en) * 2000-12-15 2011-03-16 Kla Tencor Corporation Method and apparatus for inspecting a substrate
JP4014379B2 (ja) * 2001-02-21 2007-11-28 株式会社日立製作所 欠陥レビュー装置及び方法
JP2003097931A (ja) * 2001-09-21 2003-04-03 Olympus Optical Co Ltd 光学検査方法及びその装置
JP3448041B2 (ja) * 2001-09-26 2003-09-16 株式会社東芝 パターン欠陥検査装置
JP3878033B2 (ja) * 2002-02-28 2007-02-07 シーケーディ株式会社 三次元計測装置
JP3729154B2 (ja) * 2002-05-10 2005-12-21 株式会社日立製作所 パターン欠陥検査方法及びその装置
JP3823073B2 (ja) * 2002-06-21 2006-09-20 株式会社日立ハイテクノロジーズ 電子線を用いた検査方法及び検査装置
JP2004317155A (ja) 2003-04-11 2004-11-11 Ckd Corp 検査装置
US7522762B2 (en) * 2003-04-16 2009-04-21 Inverness Medical-Biostar, Inc. Detection, resolution, and identification of arrayed elements
JP2005291760A (ja) * 2004-03-31 2005-10-20 Anritsu Corp プリント基板検査装置
WO2006006562A1 (ja) * 2004-07-12 2006-01-19 Nikon Corporation 露光条件の決定方法、露光方法、露光装置、及びデバイス製造方法
JP4485904B2 (ja) * 2004-10-18 2010-06-23 株式会社日立ハイテクノロジーズ 検査装置及び検査方法
JP4736764B2 (ja) * 2005-01-11 2011-07-27 オムロン株式会社 基板検査装置並びにその検査ロジック設定方法および検査ロジック設定装置
JP4778755B2 (ja) * 2005-09-09 2011-09-21 株式会社日立ハイテクノロジーズ 欠陥検査方法及びこれを用いた装置
US8103087B2 (en) * 2006-01-20 2012-01-24 Hitachi High-Technologies Corporation Fault inspection method
JP2007192743A (ja) * 2006-01-20 2007-08-02 Toshiba Corp 画像取り込み方法並びに検査方法及びその装置
JP4728144B2 (ja) * 2006-02-28 2011-07-20 株式会社日立ハイテクノロジーズ 回路パターンの検査装置
JP2008084054A (ja) * 2006-09-28 2008-04-10 Oki Electric Ind Co Ltd 基板外観検査装置
JP5294445B2 (ja) * 2007-10-23 2013-09-18 芝浦メカトロニクス株式会社 円盤状基板の検査装置及び検査方法
KR100902170B1 (ko) * 2008-05-19 2009-06-10 (주)펨트론 표면형상 측정장치
JP5174535B2 (ja) * 2008-05-23 2013-04-03 株式会社日立ハイテクノロジーズ 欠陥検査方法及びその装置
JP5045591B2 (ja) 2008-07-23 2012-10-10 オムロン株式会社 検査領域の領域設定データの作成方法および基板外観検査装置
SG164292A1 (en) * 2009-01-13 2010-09-29 Semiconductor Technologies & Instruments Pte System and method for inspecting a wafer
JP2010237210A (ja) * 2009-03-30 2010-10-21 Koh Young Technology Inc 検査方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006099758A (ja) * 2004-09-06 2006-04-13 Omron Corp 基板検査方法および基板検査装置
KR20080002044A (ko) * 2006-06-30 2008-01-04 삼성전자주식회사 검사 영역 설정 방법
KR20100108877A (ko) * 2009-03-30 2010-10-08 주식회사 고영테크놀러지 검사영역의 설정방법
KR20110052956A (ko) * 2009-11-13 2011-05-19 주식회사 고영테크놀러지 3차원 형상 측정장치

Also Published As

Publication number Publication date
JP2014527160A (ja) 2014-10-09
JP5908585B2 (ja) 2016-04-26
KR20130008750A (ko) 2013-01-23
WO2013009151A2 (ko) 2013-01-17
US10706521B2 (en) 2020-07-07
US20140168419A1 (en) 2014-06-19
CN103649675B (zh) 2016-10-12
CN103649675A (zh) 2014-03-19
KR101642897B1 (ko) 2016-07-26

Similar Documents

Publication Publication Date Title
WO2013040063A3 (en) Determining design coordinates for wafer defects
WO2012169903A3 (en) Method and apparatus for automatically calibrating vehicle parameters
EP3663373A4 (en) HIGH PERFORMANCE REPAIR TAPE FOR A BACK PANEL OF A PHOTOVOLTAIC MODULE AND MANUFACTURING METHOD FOR IT
EP3493311A4 (en) MEMBRANE ELECTRODES ARRANGEMENT, METHOD FOR PRODUCING THE SAME AND FUEL CELL THEREFOR
WO2013003679A3 (en) Method and system for webpage regression testing
WO2011130288A3 (en) Method and apparatus for providing enhanced interference management at restricted access points
WO2012170414A3 (en) Test equipment calibration
WO2013012185A3 (en) Apparatus and method for beam locking in a wireless communication system
WO2012166713A3 (en) Automatic monitoring and adjustment of a solar panel array
WO2014018461A3 (en) Sky polarization sensor for absolute orientation determination
WO2014158327A3 (en) Advanced calibration for analyte sensors
WO2011015928A3 (fr) Procede de traitement d'image pour corriger une image cible en fonction d'une image de reference et dispositif de traitement d'image correspondant
EP3540785A4 (en) SOLAR CELL, MANUFACTURING METHOD THEREOF, AND SOLAR MODULE
WO2014116405A3 (en) Inspection instrument auto-configuration
MX340339B (es) Metodos de transferencia de calibracion para un instrumento de pruebas.
EP3907806A4 (en) METHOD OF MAKING AN ALL-SOLID-SOLID BATTERY, AND ALL-SOLID-STATE BATTERY MANUFACTURED USING THE SAME
WO2016094583A3 (en) Biomarkers of oocyte quality
WO2013009151A3 (ko) 검사방법
MY176284A (en) Image correction method and apparatus using creation of feature points
EP4039796A4 (en) METHOD FOR PRODUCING COMPOSITION FOR CELL CULTURE, COMPOSITION FOR CELL CULTURE OBTAINED THEREBY, AND CELL CULTURE METHOD USING SAME
EP3868863A4 (en) CELL CULTURE SUBSTRATE, METHOD FOR PREPARING A CELL CULTURE SUBSTRATE, AND METHOD FOR PREPARING SPHEROIDS
WO2009120817A3 (en) Inelastic background correction for a pulsed-neutron instrument
WO2013087431A3 (en) Device manufacturing method and associated lithographic apparatus, inspection apparatus, and lithographic processing cell
EP3735602A4 (en) END CAP, ARRANGEMENT, AND METHOD FOR IMPROVING ACCURACY IN ALIGNMENT OF FIBER END CAP FIXINGS
EP3392939A4 (en) ELECTROLYTIC MEMBRANE, PROCESS FOR PRODUCING THE SAME, AND MEMBRANE-ELECTRODE ASSEMBLY WITH ELECTROLYTIC MEMBRANE FOR FUEL CELL

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12811588

Country of ref document: EP

Kind code of ref document: A2

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 14232480

Country of ref document: US

ENP Entry into the national phase

Ref document number: 2014520142

Country of ref document: JP

Kind code of ref document: A

122 Ep: pct application non-entry in european phase

Ref document number: 12811588

Country of ref document: EP

Kind code of ref document: A2