Classifications

• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/70058—Mask illumination systems
  • G03F7/70191—Optical correction elements, filters or phase plates for controlling intensity, wavelength, polarisation, phase or the like
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B17/00—Systems with reflecting surfaces, with or without refracting elements
  • G02B17/02—Catoptric systems, e.g. image erecting and reversing system
  • G02B17/06—Catoptric systems, e.g. image erecting and reversing system using mirrors only, i.e. having only one curved mirror
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
  • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
  • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
  • G02B7/18—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
  • G02B7/181—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
  • G02B7/1815—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation with cooling or heating systems
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/70058—Mask illumination systems
  • G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
  • G03F7/70108—Off-axis setting using a light-guiding element, e.g. diffractive optical elements [DOEs] or light guides
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/70058—Mask illumination systems
  • G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
  • G03F7/70116—Off-axis setting using a programmable means, e.g. liquid crystal display [LCD], digital micromirror device [DMD] or pupil facets
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
  • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
  • G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
  • G03F7/70891—Temperature

Definitions

• German patent application DE 10 201 1 078 928.6 are incorporated by reference.
• the invention relates to an illumination optical unit for projection lithography. Furthermore, the invention relates to an optical system comprising an illumination optical unit of this type and a projection optical unit, and to a projection exposure apparatus comprising an optical system of this type and an EUV light source.
• An illumination optical unit of the type mentioned in the introduction is known from US 7,414,781, from US 2008/0192225 Al, and from DE 10 2008 021 833 B4. Further projection exposure apparatuses and components therefore are known from US 2007/0132977 Al, US 5,452,054 A and US 5,504,627 A.
• the illumination optical unit according to the invention makes possible, depending on the relative position of the two mirror devices with respect to one another, a variable predefinition of a geometry in particular of a cross section of the illumination light beam, and thus a variable illumination geometry.
• a ring beam that is to say an illumination light beam having a ring-shaped cross section, with a variably predefmable ring radius.
• the function of the illumination optical unit according to the invention can correspond to that of a zoom axicon, as is known, for example, from DE 10 2009 029 103 Al .
• a polarization mirror device comprising a conical mirror basic body ac- cording to Claim 2 is advantageous, in particular, for setting a ring beam having a variable diameter.
• the mirror basic body can have a reflective cone lateral surface.
• the mirror basic body can have a reflective lateral surface which is embodied in curved fashion also in the axial longitudinal section of the cone and which then brings about additional beam shaping.
• the curvature can be embodied in convex fashion or in concave fashion or else in mixed convex/concave fashion.
• the mirror basic body can be embodied in solid fashion, which improves heat dissipation from a reflective surface of the polarization mirror device into the mirror basic body, such that external active cooling can be dispensable.
• An active cooling device enables effective cooling particularly when the mirror basic body is heated on account of residual absorption of the illumination light.
• a liquid or a gas, for example nitrogen, can be used as cooling medium of the cooling device.
• the active cooling device can also be used for mirror basic bodies which are not configured in conical fashion.
• Guides of a coolant line according to Claim 4 and 5 have proved to be particularly suitable in conjunction with a rotationally symmetrical mirror basic body.
• a ring-shaped outer mirror basic body of the second mirror device according to Claim 6 makes it possible to guide an illumination light ring beam.
• the ring-shaped outer mirror basic body can have a conically extending inner ring mirror surface.
• the ring-shaped outer mirror basic body can be subdivided into a plurality of ring mirror surfaces which can be displace- able relative to one another in driven fashion.
• the ring mirror surface can be segmented.
• An embodiment of the polarization mirror device comprising mirror facets according to Claim 7 makes it possible to split the incident illumination light into illumination light partial beams, which can then illuminate an object to be illuminated from different directions.
• a driven tiltability by means of facet actuators according to Claim 8 ensures an additional degree of freedom for producing a variable illumina- tion.
• the tiltability of the facets besides ring beams that are predefmable in terms of their radius it is also possible to produce redistributions in an azimuthal direction, as a result of which, for example, multi- pole illuminations can be realized.
• the tiltable mirror facets can be embodied as switchable between two tilting positions.
• a tilting axis course according to Claims 9 and 10, respectively makes it possible also to use polarizing properties during the reflection at the mirror facets for the predefmition of an illumination geometry.
• small angles relative to the reference planes respectively specified are also permissible.
• a second mirror device can likewise be used for guiding illumination light partial beams.
• an illumination light guidance can be realized in which partial beams are respectively reflected from a mirror facet of the polarization mirror device and in the process polarized, if appropriate, and are subsequently reflected from one of the mirror facets of the second mirror device.
• the objective mentioned in the introduction is additionally achieved by means of an illumination optical unit comprising the features specified in Claim 13.
• the illumination optical unit according to Claim 13 need not necessarily have two mirror devices displaceable relative to one another in driven fashion.
• the polarization mirror device can be used, in particular, for converting the incident illumination light into a plurality of partial beams.
• the polarization mirror device according to Claim 13 can constitute the first po- larization mirror device of the illumination optical unit according to
• the polarization mirror device according to Claim 13 can comprise the development in the claims explained above.
• the polarization mirror device comprising the mirror facets and/or the second mirror device comprising the mirror facets can be used instead of a field facet mirror and/or instead of a pupil facet mirror of an illumination optical unit according to US 7,414,781.
• the mirror facets can be embodied as switchable between two tilting positions.
• the different variants of an illumination optical unit as discussed above can be used for producing an illumination setting, as explained below.
• the illumination setting of an illumination optical unit constitutes an illumination light intensity distribution - set by means of the illumination optical unit - in pupil plane of the illumination optical unit.
• the two mirror devices can be positioned relative to one another such that a tangentially polarized illumination setting results.
• the illumination light independently of the illumination angle, is always polarized perpendicularly to a plane of incidence of the illumination light on the ob- ject field.
• the illumination light intensity distribution in the pupil plane of the illumination optical unit is embodied in a ring-shaped fashion with a linear polarization which runs in each case tangentially with respect to a center of the ring of the illumination light intensity distribution.
• the two mirror devices can be positioned relative to one another such that a multipole setting results, that is to say an illumination setting with an illumination of the object field points from at least two pole directions.
• a multipole illumination setting are a dipole or a quadrupole setting.
• Such a multipole illumination setting can be produced, in particular, by means of an embodiment of the illumination optical unit in which at least some of the mirror facets are tiltable about at least one tilting axis by means of assigned facet actuators.
• An illumination optical unit in which the second mirror device comprises a second mirror device having a ring-shaped outer mirror basic body in the form of at least one ring supporting frame on which a plurality of mirror facets tiltable about at least one tilting axis are mounted constitutes one variant for producing such a multipole setting.
• the relative positioning of the two mirror devices can be such, during the production of the illumination setting that the poles of a multipole setting have a uniform linear polarization. Within one of the poles of the multipole setting, therefore, there is then for example a linear polarization of the illumination light in one and the same direction.
• the advantages of an optical system according to Claim 14 correspond to those which have already been explained above in connection with the illumination optical units according to the invention.
• the optical system can be part of an illumination system to which an EUV light source addition- ally belongs as well.
• the EUV light source can have a wavelength in the range of between 5 nm and 30 nm as used wavelength.
• the reflective mirror surfaces of the illumination optical unit can bear reflection coatings, which can be embodied as multilayer coatings.
• the advantages of a projection exposure apparatus according to Claim 15 correspond to those which have already been explained above with reference to the illumination system.
• the projection exposure apparatus can be used for producing a patterned component, more particularly a semiconductor component, for example a micro- or nanostructured chip. Firstly a reticle and a wafer are provided and then a structure on the reticle is projected onto a light-sensitive layer of the wafer with the aid of the projection exposure apparatus, wherein, by developing the light-sensitive layer, a micro- or nanostructure is finally produced on the wafer.
• a micro- or nanostructured component can be produced by this method.
• Figure 1 schematically shows a projection exposure apparatus for
• Figure 2 schematically shows a mirror assembly of an illumination optical unit for projection lithography comprising a first po- larization mirror device and a second mirror device, illustrated in an axial section; shows a further embodiment of a first polarization mirror device for a mirror assembly according to Figure 2 comprising a plurality of mirror facets mounted on a cone supporting frame; schematically shows a view along a rotational symmetry axis of a mirror assembly comprising a first polarization mirror device according to Figure 3 and a second mirror device comprising a ring-shaped outer mirror basic body and a plurality of mirror facets mounted thereon, wherein only two mirror facets of the first polarization mirror device and of the second mirror device, said mirror facets being assigned to one another respectively via the reflection of an illumination light partial beam, are illustrated, shows, in a view similar to Figure 4, the mirror assembly, in which a mirror facet of the polarization mirror device has been tilted into a different tilting position in comparison with Figure 4, such that this mirror facet is now assigned, via an
• Figure 8 shows the mirror assembly according to Figure 2 comprising an active cooling device
• Figure 9 shows the mirror assembly according to Figure 2 comprising a further embodiment of an active cooling device.
• a projection exposure apparatus 1 for microlithography has a light source 2 for illumination light or illumination radiation 3.
• the light source 2 is an EUV light source that generates light in a wavelength range of, for example, between 5 nm and 30 nm, in particular between 5 nm and 10 nm.
• the light source 2 can be, in particular, a light source having a wavelength of 13.5 nm or a light source having a wavelength of 6.9 nm. Other EUV wavelengths are also possible.
• An illumination optical unit 6 serves for guiding the illumination light 3 from the light source 2 toward an object field 4 in an object plane 5.
• a projection optical unit or imaging optical unit 7 By means of a projection optical unit or imaging optical unit 7, the object field 4 is imaged into an image field 8 in an image plane 9 with a predefined reduction scale.
• One of the exemplary embodiments illustrated in Figures 2 et seq. can be used for the illumination optical unit 6.
• the projection opti- cal unit 7 according to Figure 1 reduces by a factor of 4.
• reduction scales are also possible, for example 5x, 6x or 8x, or else reduction scales greater than 8x or less than 4x, e.g. 2x or lx.
• an imaging scale of 4x is suitable, in particular, since this is a conventional scale for micro- lithography and enables a high throughput in conjunction with a tenable size of a reflection mask 10, which is also designated as a reticle and carries the object to be imaged.
• the required structure size on the reflection mask 10 is large enough to keep manufacturing and qualification outlays for the reflection mask 10 within limits.
• the image plane 9 is arranged parallel to the object plane 5 in the case of the projection optical unit 7 in the embodiments according to Figures 2 et seq. An excerpt from the reflection mask 10 which coincides with the object field 4 is imaged in this case.
• the reticle 10 can be carried by a reticle holder (not illustrated).
• FIG. 1 schematically illustrates, between the reticle 10 and the projection optical unit 7, a ray beam 13 of the illumination light 3 that enters into said projection optical unit and, between the projection optical unit 7 and the substrate 1 1, a ray beam 14 of the illumination light 3 that emerges from the projection optical unit 7.
• the illumination light 3 imaged by the projection optical unit 7 is also designated as imaging light.
• a global Cartesian xyz coordinate system is indicated in the drawing, which system re- veals the respective positional relationship of the components illustrated in the figures.
• the x-direction runs perpendicular to the plane of the drawing into the latter.
• the y-direction runs toward the right, and the z-direction runs downward.
• the projection exposure apparatus 1 is of the scanner type. Both the reticle 10 and the substrate 1 1 are scanned in the y-direction during the operation of the projection exposure apparatus 1.
• a stepper type of the projection exposure apparatus 1, in which a stepwise displacement of the reticle 10 and of the substrate 1 1 in the y-direction is effected between individual exposures of the substrate 1 1 is also possible.
• Figure 2 shows a mirror assembly 15 comprising a first polarization mirror device 16 for reflection and polarization of the illumination light 3 incident along the z-direction.
• the incident illumination light 3 is unpolarized, as is indicated schematically by polarization arrows UP in Figure 2.
• the polarization mirror device 16 has a conical mirror basic body 17 and a reflective cone lateral surface 18.
• the mirror basic body 17 is embodied in solid fashion.
• a rotational symmetry axis 19 of the mirror basic body 17 runs through the cone vertex thereof along the z-axis.
• the polarization mirror device 16 as indicated schematically at 20 in Figure 2, is mechanically connected to a drive device 21, that is to say is operatively connected to the drive device 21.
• the polarization mirror device 16 can be displaced along the z-axis, that is to say along the rotational symmetry axis 19.
• a second mirror device 22 of the mirror assembly is disposed downstream of the first polarization mirror device 16.
• the second mirror device 22 reflects the illumination light 3 reflected by the first polarization mirror device 16 and polarized tangen- tially with respect to the rotational symmetry axis 19.
• the second mirror device 22 has a ring-shaped outer mirror basic body 23 with a conically extending inner ring mirror surface 24.
• the first polarization mirror device 16 has a cone angle (a) of 90°, that is to say reflects the illumination light 3 radially with respect to the z-axis.
• the illumination light 3 runs in the form of a ring beam parallel to the rotational symmetry axis 19 at a distance A.
• the ring beam 25 has a ring thickness S.
• the illumination light 3 is present in a manner polarized tangentially with respect to the rotational symmetry axis 19, as is indicated schematically by an arrow TP in Figure 2.
• the second mirror device 22 is operatively connected to a further drive device 27. With the aid of the second drive device 27, the second mirror device 22 can be displaced parallel to the rotational symmetry axis 19.
• the two mirror devices 16, 22 can be displaced between at least two relative positions, which correspondingly leads at least to two beam geometries of the illumi- nation light 3 after reflection at the second mirror device 22. If, by way of example, the polarization mirror device 16 is displaced in the negative z- direction, proceeding from the relative position according to Figure 2, with the aid of the first drive device 21, the distance between the ring beam 25 and the rotational symmetry axis 19 decreases, whereas the thickness S of the ring beam 25 remains constant.
• the rotational symmetry axis 19 of the mirror assembly 15 is also designated as the optical axis.
• a pupil facet mirror can be disposed downstream of the mirror assembly 15 in the illumination optical unit 6, as is known, for example, from WO 2006/1 1 1 319 A2. With the mirror assembly 15, different annular illuminations which differ in terms of the radius can be applied to said pupil facet mirror. This correspondingly results in corresponding annular illumination settings having, depending on the relative position of the two mirror devices 16, 22 with respect to one another, dif- ferent minimum and maximum limiting angles of an illumination angle of an illumination of the reflection mask 10.
• FIG 3 shows a further embodiment of a polarization mirror device 28, which can be used instead of the polarization mirror device 16 in the mirror assembly 15 according to Figure 2.
• the polarization mirror device 28 can be used without a downstream mirror device in the manner of the second mirror device 22 according to Figure 2 in an embodiment (not illustrated) of an illumination optical unit.
• the polarization mirror device 28 has an inner mirror basic body 29 in the form of a cone supporting frame having a conical basic shape, which is embodied as rotationally symmetrical about the rotational symmetry axis 19.
• a plurality of mirror facets 30, of which five mirror facets 30 are illustrated in Figure 3, are mounted on the cone supporting frame 29.
• the mirror facets 30 are tiltable about at least one tilting axis by means of respectively assigned facet actuators 31.
• the mirror facets 30 illustrated are arranged along a ring around the symmetry axis 19 on the cone supporting frame 29. As illustrated schematically by points in Figure 3, further mirror facets 30 lie close together on further rings respectively adjacent to one another around the symmetry axis 19 on the cone supporting frame 29.
• the mirror facets 30 not illustrated are also tiltable about at least one tilting axis by means of assigned facet actuators 31, as indicated schematically in Figure 3.
• a tilting axis of the mirror actuators 30 respectively lies in a plane containing the rotational symmetry axis 19 of the cone supporting frame 29 and runs parallel to a cone lateral surface 32 of the basic shape of the cone supporting frame 29.
• Such a tilt- ing axis is illustrated in a dashed manner at K for the mirror facet 30 1 in Figure 3.
• the mirror facets 30 can be tiltable about a further tilting axis K 2 , which runs tangentially with respect to the rotational symmetry axis 19 of the cone supporting frame 29 and parallel to a cone base surface 33 of the cone supporting frame 29.
• Such a tilting axis K 2 is illustrated for the mirror facet 30 2 in Figure 3.
• the cone lateral surface can also have a curved course, as indicated in a dashed manner at 18' in Figure 2.
• the second mirror device 35 has a ring-shaped outer mirror basic body 36 in the form of a ring supporting frame and a plurality of mirror facets 37 mounted on the ring supporting frame 36, two of said mirror facets 37, namely the mirror facets 37 1 and 37 2; being illustrated in Figure 4.
• Figure 4 also illustrates two of the mirror facets 30 of the polarization mirror device 28, namely the mirror facets 30 1 and 30 2 assigned to the mirror facets 37 l 5 37 2 of the second mirror device 35 respectively via an illumination channel for an illumination light partial beam 38.
• Figure 4 illustrates the mirror assembly 34 in a schematic view along the rotational symmetry axis 19. The illumination light 3 impinges on the polarization mirror device 28 from the observer perpendicularly to the plane of the drawing in Figure 4.
• the two partial beams 38 are reflected by the mirror facets 30i, 30 2 of the polarization mirror device 28 in each case in a radial direction with respect to the symmetry axis 19, thus resulting in a tangential polarization with respect to the symmetry axis 19, as indicated by polarization arrows TP in Figure 4.
• this tangential polarization is re- tained analogously to the explanation above concerning the mirror assembly 15 according to Figure 2.
• the discrete facet arrangement of the mirror assembly 34 according to Figure 4 generates a ring beam con- structed from discrete partial beams.
• Figure 5 shows a further tilting configuration of the mirror facets 30, 37 of the mirror assembly 34.
• the mirror facet 30 1 of the polarization mirror device 28 has then been tilted such that it deflects the partial beam 38 in a tangential direction perpendicular to a meridional plane ME comprising both the symmetry axis 19 and the midpoint of the reflection surface of the mirror facet 30i.
• the partial beam 38 is now reflected from the mirror facet 30i to a mirror facet 37i', which, as indicated by an offset arrow V in Figure 4, is arranged at a position offset approximately by 90° in the clockwise direction on the ring supporting frame 36.
• said partial beam 38 in the tilting configuration according to Figure 5 is now polarized radially with respect to the rotational symmetry axis 19, as indicated by polarization arrows RP in Figure 5.
• a ring beam instead of a ring beam it is also possible, for example, to generate an illumination light beam for generating a multipole illumination.
• a distance between the respective poles and the symmetry axis 19 or the optical axis can then be brought about independently of a tilting of the mirror facets 30, 37 by means of the displacement drive 27.
• Figure 6 shows a further variant of a mirror assembly 39, which can be used instead of the mirror assemblies 15 or 34 in the illumination optical unit 6.
• the mirror assembly 39 has a second mirror device 40 comprising a plurality of ring supporting frames 41, 42, 43, 44, which are numbered consecutively from the inner area outward with increasing radius with respect to the rotational symmetry axis 19 in Figure 6.
• the ring supporting frames 41 to 44 are displaceable axially relative to one another with the aid of a drive device 45, which is operatively connected to them, along a ring rotational symmetry axis, which coincides with the rotational symmetry axis 19 of the polarization mirror device 16.
• the ring supporting frames 41 to 44 can have inner ring mirror surfaces 46 extending circumferentially continuously in a ring-shaped fashion in the manner of the ring mirror surface 24 of the second mirror device 22 ac- cording to Figure 2, such that the ring beam generated by the mirror assembly 39 results as a superposition of different individual rings, of which three individual rings 251 , 25 2 and 25 3 are illustrated in Figure 6.
• the individual rings 251 to 25 3 then respectively form an individual distance A with respect to the rotational symmetry axis 19 and an individual ring thickness S.
• Figure 7 shows the mirror assembly 39 with a different relative position of the ring supporting frames 41 to 44 with respect to one another.
• the innermost ring supporting frame 41 is displaced in the positive z-direction by the drive device 45 to an extent such that the innermost ring supporting frame 41 now has a re- flective effect for the illumination light instead of the second- innermost ring supporting frame 42.
• the partial ring 25 3 of the ring beam 25 correspondingly has a smaller distance from the optical axis 19 in the configuration according to Figure 7 in comparison with the configuration according to Figure 6.
• a thickness S of the ring beam 25 is correspondingly increased in the configuration according to Figure 7 in comparison with the configuration according to Figure 6.
• FIG 8 shows the mirror assembly 15 comprising an active cooling device 47.
• the latter comprises a coolant line 48 in the form of two spoke lines having a radial course component with respect to the rotational symmetry axis 19.
• the coolant line 48 leads into a coolant supply line 49, which supplies the interior of the mirror basic body 17 of the polarization mirror device 16 with coolant, for example with water, some other cooling liquid or a cooling gas.
• the coolant can be fed via one of the spoke lines of the coolant line 48 illustrated in Figure 8 and the coolant can be discharged via the other of the spoke lines, to and from the inner mirror basic body 17.
• Figure 9 shows a further embodiment of an active cooling device 50, which can be used instead of the cooling device 47 according to Figure 8 and has an axial line 51 , which runs along the rotational symmetry axis 19 of the inner mirror basic body 17 and supplies the interior of the mirror basic body 17 with coolant.
• the projection exposure apparatus 1 is used as follows: firstly, the reflection mask 10 or the reticle and the substrate or the wafer 1 1 are provided. Afterward, a structure on the reticle 10 is projected onto a light-sensitive layer of the wafer 1 1 with the aid of the projection exposure apparatus. By developing the light-sensitive layer, a micro- or nanostructure is then produced on the wafer 1 1 and the microstructured component is thus produced.

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• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Health & Medical Sciences (AREA)
• Optics & Photonics (AREA)
• Toxicology (AREA)
• Environmental & Geological Engineering (AREA)
• Epidemiology (AREA)
• Public Health (AREA)
• Engineering & Computer Science (AREA)
• Atmospheric Sciences (AREA)
• Life Sciences & Earth Sciences (AREA)
• Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
• Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

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• 2011
  • 2011-07-11 DE DE102011078928A patent/DE102011078928A1/de not_active Withdrawn
• 2012
  • 2012-07-10 TW TW101124746A patent/TWI574115B/zh active
  • 2012-07-11 JP JP2014519525A patent/JP2014523136A/ja active Pending
  • 2012-07-11 WO PCT/EP2012/063520 patent/WO2013007731A1/en not_active Ceased
• 2013
  • 2013-12-19 US US14/135,540 patent/US9507269B2/en not_active Expired - Fee Related

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