WO2013007449A1 - Procédé d'implantation de composants sur une carte de circuits imprimés - Google Patents

Procédé d'implantation de composants sur une carte de circuits imprimés Download PDF

Info

Publication number
WO2013007449A1
WO2013007449A1 PCT/EP2012/060418 EP2012060418W WO2013007449A1 WO 2013007449 A1 WO2013007449 A1 WO 2013007449A1 EP 2012060418 W EP2012060418 W EP 2012060418W WO 2013007449 A1 WO2013007449 A1 WO 2013007449A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
hole
electronic component
housing
Prior art date
Application number
PCT/EP2012/060418
Other languages
German (de)
English (en)
Inventor
Ronny Ludwig
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Publication of WO2013007449A1 publication Critical patent/WO2013007449A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention relates to a method for assembling a printed circuit board, a method for providing a torque sensor and a printed circuit board.
  • Terminal pins are mounted on a surface of a circuit board in SMD mounting for surface mount device mounting and fixed thereto by soldering. If the arranged in the chip housing block executes only electronic functions and z. B. is designed as a microcontroller or ASIC, the SMD mounting is sufficient.
  • a chip for carrying out micromechanical, optical or magnetic field-sensitive functions is arranged in the chip housing, however, the position of the chip housing on the printed circuit board is important. For such applications, it may be necessary to position the chip housing taking into account all three spatial directions.
  • Circuit boards are used to implement circuit arrangements that can perform different tasks.
  • a printed circuit board which is equipped with a chip housing, in which a sensor element is arranged, is formed as a component of a sensor arrangement.
  • a sensor arrangement for detecting a difference angle is known from the document DE 10 2005 031 086 A1.
  • the sensor arrangement comprises at least one magnetic field-sensitive sensor element, with which the magnetic field information of a magnetic circuit with a magnetic pole wheel and ferromagnetic Rings is evaluable.
  • teeth of the rings extend in the radial direction and are provided for the radial tapping of the magnetic field information of the magnetic pole wheel.
  • a housing developed for standard SMD mounting has at least one electronic component which has Gull Wing connection pins or connection pins, for example, SOP (small outline package), SSOP (shrink small outline package), TSOP (thin small outline package), for example, according to the SO design for integrated circuit packages which have a small outline (SO).
  • TSSOP thin-shrink small outline package
  • a housing developed for standard SMD mounting has at least one electronic component which has Gull Wing connection pins or connection pins, for example, SOP (small outline package), SSOP (shrink small outline package), TSOP (thin small outline package), for example, according to the SO design for integrated circuit packages which have a small outline (SO).
  • TSSOP thin-shrink small outline package
  • the at least one hole may be formed either as an opening or as a cavity.
  • a hole formed as an opening traverses a body of the circuit board.
  • the opening formed as a hole may also be referred to as a passage, tunnel or channel. If the at least one hole is formed as a cavity, it is provided that this hole, starting from one side, ie, either from the front or the back, extends into a body of the circuit board, but this only partially, but not completely traverses.
  • a hole formed as a cavity may also be referred to as a depression on one side of the circuit board. Since a printed circuit board has at least one hole, this can mean that a printed circuit board in design can have at least one opening and at least one cavity.
  • the at least one hole in the printed circuit board is generally formed slightly larger than the body of the at least one electronic component.
  • the size of the at least one hole is adapted to the shape and / or the length of the pins (leads) which are attached to the electronic component and / or to the housing.
  • the on-board solder contacts also referred to as solder pads (footprints), are designed and structured such that no or only a minimum distance is maintained between one end of a solder pad and a free cut of the at least one hole.
  • Typical maximum distances between a solder contact, which is usually made of copper, and a milling edge of the at least one hole amount to a maximum of 0.05 mm. Such accuracies can be safely adhered to in a production of a printed circuit board by a modern milling machine with appropriate design of the circuit board.
  • a first end of a terminal pin which is attached to the block and / or a housing of the block, arranged in the hole.
  • a second end of the terminal pin is disposed on a solder contact on the surface of the circuit board and connected to the soldering contact by soldering, wherein between the second end and the soldering contact, a solder joint is formed.
  • housings for electronic components usually deliver these to a belt.
  • the manufacturer must put the housing for the reverse and thus reverse assembly already reversed in the belt, as a standard SMD mounter, which arranges the housing in the circuit board, the housing is not in the scope of the invention intended direction can turn.
  • a storage height is to be considered, which differs from a conventional storage height in an SMD installation.
  • a solder paste and, for example, a reflow soldering as soldering are then carried out in the usual way.
  • An embodiment of the populated printed circuit board according to the invention can be used for a torque sensor, for example for a steering system of a motor vehicle.
  • the circuit board is usually arranged edgewise between two rings of metal, wherein the rings are formed as components of a magnetic flux unit.
  • the distance between these rings is very small.
  • the two rings are arranged coaxially with a first shaft, which in turn is arranged coaxially to a second shaft, wherein both shafts rotate about a common axis of rotation.
  • On the second shaft a multipole wheel of magnets is arranged. A magnetic flux of the multipole wheel is amplified between the two rings.
  • a magnetic-field-sensitive area of the module within the printed circuit board which includes a Hall sensor, an AMR sensor for measuring an anisotropic magnetically sensitive effect or a GMR sensor for measuring a giant magnetoresistance as a magnetic field-sensitive sensor element, is usually exactly in the middle between the two rings to position.
  • the positioning of the device is possible in the embodiment provided in the reverse assembly of the module in the hole of the circuit board. Since the distance between the rings is very small, a high magnetic flux can be generated between the rings and detected by the sensor element.
  • the positioning of the printed circuit board centrally between the rings and / or a displacement in the direction of the outer larger ring allows an ideal central positioning of the magnetic field-sensitive sensor element for a circulation counting function on a back side of the printed circuit board.
  • the printed circuit board equipped with the at least one module has a low height and can thus be used space-saving for new applications.
  • An at least partially embedded arrangement of the module within the circuit board is inexpensive to implement and independent of a manufacturer of the circuit board.
  • a lateral footprint of the device in the plane of the circuit board is the same as conventional circuit boards in which the device is mounted on a surface of the circuit board.
  • the printed circuit board with at least one module arranged in at least one hole can be used for micromechanical, optical or magnetic-field-sensitive applications.
  • the component can be embodied as a silicon chip or sensor element or can have at least one silicon chip and / or at least one sensor element.
  • the circuit board according to the invention is to be equipped by at least one step of the presented method according to the invention.
  • the torque sensor provided according to the invention has a populated printed circuit board according to the invention.
  • FIG. 1 shows a schematic representation of details of a populated printed circuit board known from the prior art.
  • FIG. 2 shows a schematic representation of details of a first embodiment of a printed circuit board according to the invention.
  • FIG. 3 shows a schematic representation of a first example of a torque sensor, which comprises a second embodiment of a printed circuit board according to the invention.
  • FIG. 4 shows a schematic representation of first details of a second example of a torque sensor from various perspectives, which comprises a third embodiment of a printed circuit board according to the invention.
  • FIG. 5 shows a schematic representation of second details of the second example of the torque sensor from FIG. 4 from different perspectives.
  • FIG. 6 shows a schematic representation of third details of the second example of the torque sensor from FIG. 4 from different perspectives.
  • FIG 7 shows a schematic representation of details of the third embodiment of the circuit board according to the invention of the torque sensor of Figure 4 from different perspectives.
  • Figure 8 shows a schematic representation of details of a fourth embodiment of a circuit board according to the invention from different perspectives.
  • Figure 9 shows a schematic representation of details of a fifth embodiment of a circuit board according to the invention from different perspectives.
  • FIG. 10 shows a schematic representation of a sixth embodiment of a printed circuit board according to the invention.
  • FIG. 1 a shows a schematic representation of a known from the prior art circuit arrangement 2, which is implemented by a printed circuit board 4, on the surface of a housing 6 of an electronic component is attached.
  • This housing 6 comprises curved terminal pins 8, which are also referred to as Gull Wing Leads because of their wing-like shape.
  • FIG. 1 b A height of the known from the prior art assembled printed circuit board 4, wherein the height from the bottom of the circuit board 4 extends to an upper side of the housing 6 is indicated in Figure 1 a by a double arrow 12.
  • FIG. 2a The first embodiment of the circuit board 16 according to the invention for implementing a circuit arrangement 14 is shown schematically in FIG. 2a.
  • FIG. 2b shows a detail from FIG. 2a.
  • the circuit board 16 according to the invention has the same height as the circuit board 4 of the prior art.
  • the circuit board 16 has a hole 18 formed as an opening, within which a housing 20 of an electronic component is partially arranged. In this case, a larger portion of the housing 20 is disposed within and a smaller portion outside the hole 18.
  • the housing 20 of the electronic component of the first embodiment of the circuit arrangement 14 according to the invention has the same height as the housing 6 from FIG. Furthermore, in FIG. 2, two curved connecting pins 22 of the housing 20, also designed as gull-wing leads, are shown.
  • first ends 24 of the terminal pins 22 fixed to the housing 20 are disposed within the hole 18, whereas second ends 26 of the terminal pins 22 outside of the hole 18 and on a surface of the circuit board 16 are arranged.
  • the second ends 26 are fastened via solder joints 28 on the surface of the printed circuit board 16.
  • a height of the first embodiment of the populated printed circuit board 16 according to the invention is indicated in FIG. 2a by a double arrow 30 and extends Here, from a bottom of the circuit board 16 to the second ends 26 of the connecting pins 22 of the upside-mounted housing 20 of the electronic component.
  • Printed circuit board 4 and the height of the first embodiment of the assembled printed circuit board 16 according to the invention shows that the first embodiment of the assembled printed circuit board 16 according to the invention is substantially flatter than the populated printed circuit board 4 known from the prior art.
  • the housing 6 from FIG. 1 is designed as a TSSOP housing (Thin Shrink Small Outline Plastic Package).
  • the height of the assembled printed circuit board 4 is at a 0.8 mm thick printed circuit board 4 about 1, 9 to 2.0 mm.
  • the height of the first embodiment of the populated printed circuit board 16 according to the invention in a 0.8 mm thick printed circuit board 16 is approximately 1, 1 to 1, 2 mm.
  • the coverage of the pins 22 with the solder joints 28 on the circuit board 16 is, for example. 0.4 to 0.5 mm per side.
  • the second embodiment of the printed circuit board 38 according to the invention for implementing a circuit arrangement 32 shown schematically in FIG. 3 is embodied here as a component of a torque sensor 34 for a first shaft 36.
  • the second embodiment of the assembled printed circuit board 38 also has a hole 40 formed as an opening. The trained as an opening
  • Hole 40 may be prepared by drilling through or through the circuit board 38. be presented. Within the hole 40 is at least partially an electronic component 42 with a housing 44 and disposed within the housing 44 magnetic field-sensitive sensor element 46, which is designed here as a Hall sensor, respectively.
  • the electronic module 42 comprises pins 48, of which only two are shown in FIG. These pins 48 have here two bends or bends and are formed in profile largely stepped. First ends of these pins 48 are here attached to the housing 44 of the electronic module 42, partially disposed within the housing 44 and connected to the magnetic field-sensitive sensor element 46. Furthermore, these first ends of the pins 48 are also arranged within the hole 40 of the circuit board 38 after the positioning of the block 42.
  • Second ends of the terminal pins 48 are arranged outside of the hole 40 on a surface of the printed circuit board 38 designated here as the upper side (front side) and connected to the printed circuit board 38 via soldered connections on the surface of the printed circuit board 38.
  • a surface of the printed circuit board 38 designated here as the upper side (front side) and connected to the printed circuit board 38 via soldered connections on the surface of the printed circuit board 38.
  • the bottom (back) of the circuit board 38 surface of the circuit board 38 are in addition
  • a magnetic flux is amplified by a first inner ring 52 and a second outer ring 54 as components of the torque sensor 34.
  • the first inner ring 52 has a smaller radius than the second outer ring 54.
  • Both rings 52, 54 are arranged coaxially with the first shaft 36 and formed of a metal, usually a ferromagnetic metal.
  • the torque of the first shaft 36 is usually determined by a relative angle of rotation, the first shaft 36 has a second, not shown in Figure 3 shaft having the same axis of rotation as the first shaft 36. It is envisaged that a magnetic pole wheel is fastened to the second shaft, wherein the first shaft 36 is connected to the second shaft via a torsion bar. A rotation of the first shaft 36 relative to the second shaft to the common axis of rotation is determined based on a position of a magnetic field generated by the magnetic pole on the second shaft, which is amplified by the two rings 52, 54 of the torque sensor 34 between the two rings 52, 54 and detected by the magnetic field-sensitive sensor element 46.
  • FIGS 4a, 4b and 4c show a second example of a torque sensor 60 from different perspectives. Further details of this torque sensor 60 are shown in the following figures 5 to 7 from different perspectives.
  • This torque sensor 60 comprises a so-called magnetic flux unit 62 (details in FIG. 6) which, like the first example of the torque sensor 34, has two rings 80, 82 of different radii arranged coaxially with one another.
  • FIG. 4 shows a sensor unit 64 (details in FIG. 5) and a fastening element 66, which comprises fastening arms 69, via which the fastening element 66 and a sensor unit 64 fastened thereto can be fastened in a rotationally fixed manner to a component (not shown).
  • the torque sensor 60 has the sensor unit 64 shown in FIG. 5 for implementing a circuit arrangement 68, a populated printed circuit board 72 with a plug module 70 attached thereto. It is provided that an electronic component 76 is at least partially disposed within a hole 74 of the printed circuit board 72.
  • the inner ring 80 and the outer ring 82 of the magnetic flux unit 62 of the torque sensor 60 are shown schematically. Both rings 80, 82 have fingers 84 for amplifying a magnetic field.
  • the third embodiment of the assembled printed circuit board 72 is arranged between the two rings 80, 82 of the magnetic flux unit 62 and thus of the torque sensor 60.
  • the two rings 80, 82 conduct a magnetic flux of the magnetic field.
  • the assembled printed circuit board 72 is arranged vertically between the two rings 80, 82 and fixed to the sensor unit 64, which can rotate about a slide bearing relative to the magnetic flux unit 62.
  • FIG. 7 Details of the printed circuit board 72 for implementing the circuit arrangement 68 are shown schematically in FIG. 7 from different perspectives. It can be seen that the module 76 is arranged in a hole formed as an opening 74 of the printed circuit board 72 and attached via the wing-shaped terminal pins 86 with the circuit board 72. As can be seen in particular from FIGS. 7e and 7f, the connection pins 86 are bent twice and have a largely stepped profile.
  • First ends of the terminal pins 86 are here attached to the package 76 and disposed within the hole 74. Second ends of the terminal pins 86 are fixed on a surface of the circuit board 72 via solder joints on the circuit board 72.
  • the module 76 which is thus likewise arranged between the two rings 80, 82, comprises at least one magnetic field-sensitive sensor element designed as a Hall sensor, with which a so-called index function for counting revolutions of at least one shaft can also be realized.
  • the magnetic flux unit 62 is arranged on a first shaft, not shown. On a second shaft, not shown, a multi-pole magnetic ring in the immediate vicinity of and / or below the magnetic flux unit 62 is arranged. Both shafts are axially connected to each other with a torsion bar.
  • the assembled circuit board 72 is oriented perpendicular and / or axially to a rotational axis of the shaft, wherein only that part of the circuit board 72, within which the module 76 is disposed between the rings 80, 82 is arranged.
  • the fastener 66 includes a lid with an anti-rotation pin which prevents the sensor unit 64 from rotating with at least one of the shafts.
  • the magnetic flux in the flux-conducting rings 80, 82 changes. This change is detected by the at least one magnetic field-sensitive sensor element.
  • the degree of change in the magnetic flux corresponds to the torsion of the two waves to each other. This can also be determined for angles larger than 360 °.
  • FIG. 8 A fourth embodiment of the populated printed circuit board 102 according to the invention for implementing a circuit arrangement 100 is shown schematically in FIG. 8 from different perspectives, namely in plan view (FIG. 8a and FIG. 8c) and in sectional view (FIG. 8b).
  • the printed circuit board 102 here has two holes 106, 108 formed as through holes.
  • both electronic components 1 10, 1 12 have here in profile step-shaped connection pins 1 14, 1 16. Furthermore, for both electronic components 1 10, 1 12 provided that first ends 1 18, 120 of the pins 1 14, 1 16, which are attached to the blocks 1 12, 1 10, are disposed within the holes 106, 108. In contrast, second ends 122, 124 of the pins 1 14, 1 16 outside of the holes 106, 108 are arranged.
  • FIGS. 8b and 8c each show a plug-in module 128 of the printed circuit board 102 from different perspectives.
  • FIGS. 9a and 9b A fifth embodiment of the populated printed circuit board 132 according to the invention for implementing a circuit arrangement 130 is shown in FIGS. 9a and 9b
  • the printed circuit board 132 has two holes 134, 136 formed as cavities. This means that the cavities formed as holes 134, 136 on one side by walls 157, 159 are limited and the circuit board 132, in contrast to openings not penetrate.
  • a first hole 134 is opened toward a back side of the circuit board 132 and terminated and / or bounded toward a front side of the circuit board 132 by a wall 159 which at the same time forms a portion of the front side of the circuit board 132.
  • a second hole 136 is oriented inversely as the first hole 134. Accordingly, the second hole 136 is opened toward the front of the circuit board 132 and closed and / or bounded to the back of the circuit board 132 by a wall 157, which at the same time a portion of the back of the circuit board
  • a first electronic component 138 is disposed in the first hole 134 and a second electronic component 140 is disposed in the second hole 136.
  • Both electronic components 138, 140 here have step-shaped connection pins 142, 144 in profile.
  • first ends 146, 148 of the connection pins 142, 144 which are fastened to the components 138, 140, are arranged within the holes 134, 136.
  • second ends 150, 152 are arranged outside the holes 134, 136.
  • FIGS. 9b and 9c each show a plug-in module 156 of the circuit arrangement 130 from different perspectives.
  • the printed circuit board 162 for implementing a circuit 160 is shown schematically in FIG. Like the printed circuit board 132 from FIG. 9, the printed circuit board 162 also has a hole 164 formed as a cavity, which encloses a wall 166, via which the cavity 164 formed as a cavity is bounded towards an underside of the printed circuit board 162.
  • the cavity-formed hole 164 is provided on an upper surface of the circuit board 162 by depth milling.
  • connection pins 170 which are fastened to a housing 172 of the module 168.
  • a sensor element 174 is disposed on a first shield 182 which is connected to first ends 176 of the terminal pins 170.
  • the first ends 176 of the terminal pins 170 bent here are disposed within the hole 164.
  • second ends 178 of the connection pins 170 are arranged on the upper side of the printed circuit board 162 and are connected on the upper side of the printed circuit board 162 to solder contacts of the printed circuit board 162 via solder joints.
  • FIG. 10 shows that a second grounded shield 180 is arranged on the lower side of the printed circuit board 162 in the region of the hole 164.
  • the first shield 182 is disposed within the housing 172 of the package 168.
  • the first shield 182 is also grounded and disposed between the top of the circuit board 162 and the magnetic field sensitive sensor element 174.
  • the magnetic-field-sensitive sensor element 174 is thus arranged between two shields 180, 182, wherein these shields 180, 182 are made of metal, for example copper, and are plate-shaped. Through the shields 180, 182, the magnetic field sensitive sensor element 174 for better electromagnetic compatibility (EMC) protected.
  • EMC electromagnetic compatibility
  • the hole 164 formed as a cavity in FIG. 10 may be provided, for example, with printed circuit boards 162 which have a thicker base material. By limiting the cavity formed as a hole 164 via the wall 166 to a surface and / or opposite side of the circuit board 162, a stability of the circuit board 162, for example. against vibrations, improved.
  • the package 168 is partially disposed inside and outside the hole 164.
  • Circuit arrangement 14, 32, 68, 100, 130, 160 is inserted into the printed circuit board 16, 38, 72, 102, 132, 162 by a material-removing method, for example milling or drilling, on at least one surface of the printed circuit board 16, 38, 72. 102, 132, 162 at least one hole 18, 40, 74, 106, 108, 134, 136, 164 introduced.
  • a material-removing method for example milling or drilling
  • This at least one hole 18, 40, 74, 106, 108, 134, 136, 164 may pass as one from top to front and bottom of the circuit board 16, 38, 72, 102, 132, 162, respectively be formed extending opening. Accordingly, a body of the circuit board of the hole 18, 40, 74, 106, 108, 134, 136, 164 which is formed as an opening channel or tunnel-shaped and can also be referred to as a passage, completely traversed.
  • the at least one hole 18, 40, 74, 106, 108, 134, 136, 164 is also possible to form the at least one hole 18, 40, 74, 106, 108, 134, 136, 164 as a cavity.
  • the hole 18, 40, 74, 106, 108, 134, 136, 164 on one of the two sides of the circuit board 16, 38, 72, 102,
  • 132, 162 either on the top or the bottom, opened to the outside and / or oriented in the direction of the top or bottom.
  • a cavity is formed as a depression on the underside or top of the circuit board.
  • the at least one electronic module 42, 76, 110, 16, 138, 140, 168 is at least partially within the at least one
  • Holes 18, 40, 74, 106, 108, 134, 136, 164 arranged. This may mean that the at least one electronic component 42, 76, 110, 112, 138, 140, 168 completely within the at least one hole 18, 40, 74, 106, 108, 134, 136, 164 or partially within the at least one hole 18, 40, 74, 106, 108, 134, 136, 164 is arranged. If the at least one electronic component
  • the at least one electronic component 42, 76, 110, 112, 138, 140, 168 and / or a housing 20, 44, 172 of the at least one electronic component 42, 76, 110, 112, 138, 140, 168 at least one
  • Terminal pin 22, 48, 86, 1 14, 1 16, 142, 144, 170 has, for example, the wing-shaped and thus as a so-called Gull Wing pin 22, 48, 86, 1 14, 1 16, 142, 144, 170 may be formed.
  • Such a wing-shaped connection pin 22, 48, 86, 14, 16, 142, 144, 170 can have at least one bend or at least one bend, generally two bends or two bends, and usually be step-shaped in profile.
  • 122, 124, 150, 152, 178 of the connecting pin 22, 48, 86, 1 14, 1 16, 142, 144, 170 is adapted to the at least one electronic module 42, 76, 1 10, 1 12, 138, 140 168 to connect with another electronic component.
  • solder 162 and connected to this soldering contact by soldering to provide a solder joint.
  • the assembled printed circuit board 16, 38, 72, 102, 132, 162 provided in this way can, in one application, be embodied as a component of a torque sensor 34, 60 which has two rings 52, 54, 80, 82 coaxial with a shaft 36.
  • the assembled printed circuit board 16, 38, 72, 102, 132, 162 as a component of the torque sensor 34, 60 and thus to provide the torque sensor 34, 60, the assembled printed circuit board 16, 38, 72, 102, 132, 162 between the two Rings 52, 54, 80, 82 arranged.
  • the at least one electronic component 42, 76, 110, 112, 138, 140, 168 has at least one sensor element 46, 172 designed as a magnetic field-sensitive sensor element 46, 172, wherein the at least one sensor element 46, 172 between the two rings 52, 54, 80, 82 is arranged.
  • the at least one sensor element 46, 172 can be shielded by at least one metal shielding 180, 182, wherein the at least one sensor element 46, 172 can be arranged between two shields 180, 182.
  • the at least one shield 180, 182 may be arranged on a surface of the printed circuit board 16, 38, 72, 102, 132, 162 in the region of the hole 18, 40, 74, 106, 108, 134, 136, 164. It is also possible that at least a shield 180, 182 within the housing 20, 44, 172 of the at least one electronic module 42, 76, 1 10, 1 12, 138, 140, 168 to be arranged.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Steering Mechanism (AREA)

Abstract

L'invention concerne un procédé destiné à l'implantation de composants sur une carte de circuits imprimés (38). Au moins une surface de la carte de circuits imprimés (38) comporte au moins un trou (40) à l'intérieur duquel est disposé au moins en partie un composant électronique (42) à des fins d'implantation de composants sur la carte de circuits imprimés (38).
PCT/EP2012/060418 2011-07-13 2012-06-01 Procédé d'implantation de composants sur une carte de circuits imprimés WO2013007449A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102011079050A DE102011079050A1 (de) 2011-07-13 2011-07-13 Verfahren zum Bestücken einer Leiterplatte
DE102011079050.0 2011-07-13

Publications (1)

Publication Number Publication Date
WO2013007449A1 true WO2013007449A1 (fr) 2013-01-17

Family

ID=46208047

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2012/060418 WO2013007449A1 (fr) 2011-07-13 2012-06-01 Procédé d'implantation de composants sur une carte de circuits imprimés

Country Status (2)

Country Link
DE (1) DE102011079050A1 (fr)
WO (1) WO2013007449A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012106908A1 (de) * 2012-07-30 2014-01-30 Zf Lenksysteme Gmbh Drehmomentsensoreinrichtung für ein lenksystem
DE102017111824A1 (de) * 2017-05-30 2018-12-06 Infineon Technologies Ag Package mit einer Komponente, die auf der Träger-Ebene verbunden ist

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09116252A (ja) * 1995-10-19 1997-05-02 Nittetsu Semiconductor Kk 集積回路装置の実装構造
JPH10135397A (ja) * 1996-10-30 1998-05-22 New Japan Radio Co Ltd 表面実装型半導体装置の実装方法
WO2007003468A1 (fr) * 2005-07-04 2007-01-11 Robert Bosch Gmbh Dispositif capteur pour saisir un angle differentiel
WO2008128016A2 (fr) * 2007-04-13 2008-10-23 World Properties Inc. Cartes de circuit imprimé à partie centrale métallique pour applications de diode électroluminescente et procédés de fabrication de celles-ci
US20090146274A1 (en) * 2007-12-06 2009-06-11 Samsung Electronics Co., Ltd. Integrated circuit packages includng sinuous lead frames
DE102008063863A1 (de) * 2008-12-19 2010-07-01 Martin Schneider Elektronisches Bauteil mit aufgenommenem elektronischen Bauelement
US20110085310A1 (en) * 2009-10-09 2011-04-14 Cachia Joseph M Space saving circuit board

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09116252A (ja) * 1995-10-19 1997-05-02 Nittetsu Semiconductor Kk 集積回路装置の実装構造
JPH10135397A (ja) * 1996-10-30 1998-05-22 New Japan Radio Co Ltd 表面実装型半導体装置の実装方法
WO2007003468A1 (fr) * 2005-07-04 2007-01-11 Robert Bosch Gmbh Dispositif capteur pour saisir un angle differentiel
DE102005031086A1 (de) 2005-07-04 2007-01-18 Robert Bosch Gmbh Sensoranordnung zur Erfassung eines Differenzwinkels
WO2008128016A2 (fr) * 2007-04-13 2008-10-23 World Properties Inc. Cartes de circuit imprimé à partie centrale métallique pour applications de diode électroluminescente et procédés de fabrication de celles-ci
US20090146274A1 (en) * 2007-12-06 2009-06-11 Samsung Electronics Co., Ltd. Integrated circuit packages includng sinuous lead frames
DE102008063863A1 (de) * 2008-12-19 2010-07-01 Martin Schneider Elektronisches Bauteil mit aufgenommenem elektronischen Bauelement
US20110085310A1 (en) * 2009-10-09 2011-04-14 Cachia Joseph M Space saving circuit board

Also Published As

Publication number Publication date
DE102011079050A1 (de) 2013-01-17

Similar Documents

Publication Publication Date Title
EP2530475B1 (fr) Dispositif de mesure d'un courant électrique passant dans un câble électrique
DE10222118B4 (de) Drehmomentsensor und elektrisches Servolenkungssystem mit Drehmomentsensor
DE102007054905B4 (de) Rotationswinkelsensoren und Drosseleinrichtungen
EP2638373B1 (fr) Agencement de capteurs pour détecter un couple
DE102007007840B4 (de) Rotationserfassungsvorrichtung
DE102004047991A1 (de) Rotationswinkelsensoren
DE102006032780A1 (de) Elektromotorischer Antrieb mit einem rotorseitig angeordneten Drehgeber
DE102012206959A1 (de) Magneterfassungsvorrichtung
DE112017004193T5 (de) Positionserfassungsvorrichtung
DE112014001242T5 (de) Sensor und Verfahren zur Herstellung eines Sensors
DE4219923C2 (de) Magnet-Sensor
DE19853637C2 (de) Drehzahlsensor
WO2013007449A1 (fr) Procédé d'implantation de composants sur une carte de circuits imprimés
DE10357809B4 (de) Magnetische Erfassungsvorrichtung und Verfahren zu dessen Herstellung
DE102012202179B4 (de) Magnetfeldsensor und Verfahren zum Herstellen eines Magnetfeldsensors
DE102020111626A1 (de) Magnetsensorvorrichtung und verfahren zur herstellung desselben
DE10256709B4 (de) Haltestruktur für eine elektronische Komponente und Verfahren zum Herstellen einer Haltestruktur für eine elektronische Komponente
DE102007041334A1 (de) Leiterplatte für bürstenlose Gleichstrommotore
DE102006050177A1 (de) Magnetfeldsensor
DE112017004215T5 (de) Positionserfassungsvorrichtung
DE102005015822B4 (de) Sensoranordnung
DE10328207A1 (de) Stromsensor für ein Steuergerät
DE112017004228T5 (de) Positionserfassungsvorrichtung
EP2332396A1 (fr) Boîtier pour un circuit électrique
WO2019038285A1 (fr) Composant de capteur, ensemble de prémontage pour un composant de capteur et procédé de fabrication d'un composant de capteur

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12725419

Country of ref document: EP

Kind code of ref document: A1

122 Ep: pct application non-entry in european phase

Ref document number: 12725419

Country of ref document: EP

Kind code of ref document: A1