WO2013007122A1 - 一种成像盒芯片、成像盒和成像设备 - Google Patents

一种成像盒芯片、成像盒和成像设备 Download PDF

Info

Publication number
WO2013007122A1
WO2013007122A1 PCT/CN2012/074575 CN2012074575W WO2013007122A1 WO 2013007122 A1 WO2013007122 A1 WO 2013007122A1 CN 2012074575 W CN2012074575 W CN 2012074575W WO 2013007122 A1 WO2013007122 A1 WO 2013007122A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
imaging cartridge
imaging
electrical contact
slot
Prior art date
Application number
PCT/CN2012/074575
Other languages
English (en)
French (fr)
Inventor
丁励
Original Assignee
珠海艾派克微电子有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 珠海艾派克微电子有限公司 filed Critical 珠海艾派克微电子有限公司
Publication of WO2013007122A1 publication Critical patent/WO2013007122A1/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G21/00—Arrangements not provided for by groups G03G13/00 - G03G19/00, e.g. cleaning, elimination of residual charge
    • G03G21/16—Mechanical means for facilitating the maintenance of the apparatus, e.g. modular arrangements
    • G03G21/18—Mechanical means for facilitating the maintenance of the apparatus, e.g. modular arrangements using a processing cartridge, whereby the process cartridge comprises at least two image processing means in a single unit
    • G03G21/1875—Mechanical means for facilitating the maintenance of the apparatus, e.g. modular arrangements using a processing cartridge, whereby the process cartridge comprises at least two image processing means in a single unit provided with identifying means or means for storing process- or use parameters, e.g. lifetime of the cartridge
    • G03G21/1878—Electronically readable memory
    • G03G21/1882—Electronically readable memory details of the communication with memory, e.g. wireless communication, protocols
    • G03G21/1885—Electronically readable memory details of the communication with memory, e.g. wireless communication, protocols position of the memory; memory housings; electrodes

Definitions

  • Imaging cartridge chip Imaging cartridge chip, imaging cartridge and imaging device
  • the present invention relates to the field of imaging technology, and in particular to an imaging cartridge chip, an imaging cartridge, and an imaging device. Background technique
  • An imaging cartridge (such as an ink cartridge) for imaging is mounted on an existing imaging device (such as a printer), and the ink is contained in the imaging cartridge and the imaging cartridge chip is mounted thereon, and is mainly used for storing, for example, an imaging cartridge model, a production date. And the information such as the remaining amount of ink, the imaging cartridge chip generally includes a substrate, a memory, and an electrical contact, wherein the electrical contact and the memory are electrically conductive.
  • the electrical contacts included in the imaging cartridge chip mounted on the imaging cartridge are in contact with the electrical contacts on the imaging device such that the imaging device and the memory of the imaging cartridge are electrically connected through the electrical contacts, thereby Normal communication is performed to ensure normal imaging operations.
  • the ink contained in the imaging cartridge may leak into the imaging cartridge for various reasons. If the ink flows between the two electrical contacts of the imaging cartridge chip, the conductivity of the ink will cause the imaging cartridge.
  • the two electrical contacts of the chip are shorted.
  • the electrical contact portion 2 is disposed on the substrate 1, and the leaked ink 3 in the imaging cartridge may cause the two electrical contacts 2 to be short-circuited, which may cause the imaging device to be burnt out or cause
  • the imaging cartridge chip cannot be recognized by the imaging device and cannot be subjected to an imaging operation.
  • Embodiments of the present invention provide an imaging cartridge chip, an imaging cartridge, and an image forming apparatus that prevent an image forming apparatus from being burnt out due to ink leakage or an imaging operation impossible.
  • Embodiments of the present invention provide an imaging cartridge chip including a substrate and at least two electrical contacts; the electrical contact portion is disposed on one side of the substrate, and has an angle of an angle of an electrical contact portion on the substrate And a slot is provided between the at least two electrical contacts; the ⁇ is greater than 0 degrees, and the slot between the at least two electrical contacts prevents shorting of the two electrical contacts.
  • An embodiment of the present invention provides an imaging cartridge, wherein the imaging cartridge is provided with an imaging cartridge chip, and the imaging cartridge chip includes a substrate and at least two electrical contacts;
  • the electrical contact portion is disposed on one surface of the substrate, in a direction of an angle of the substrate on the side where the electrical contact portion is disposed, and a slot is disposed between the at least two electrical contacts; the ⁇ is greater than At 0 degrees, the slot between the at least two electrical contacts prevents shorting of the two electrical contacts.
  • An embodiment of the present invention provides an imaging device, including an imaging cartridge and an imaging device, wherein the imaging cartridge is provided with an imaging cartridge chip, and the imaging cartridge chip includes a substrate and at least two electrical contacts;
  • the electrical contact portion is disposed on one side of the substrate, and has a slot angle on the substrate at an angle ⁇ with respect to a side where the electrical contact portion is disposed, and a slot is disposed between the at least two electrical contacts, where the ⁇ is greater than At 0 degrees, the slot between the at least two electrical contacts prevents shorting of the two electrical contacts; the electrical contacts provided on the imaging device are in contact with the electrical contacts of the imaging cartridge chip.
  • a slot is provided in the direction of the substrate at an angle ⁇ with respect to one surface on which the electrical contact portion is provided, and between the at least two electrical contacts.
  • FIG. 1 is a schematic structural view of an imaging cartridge chip in the prior art
  • FIG. 2a is a view showing one side of an electrical contact portion of an imaging cartridge chip according to an embodiment of the present invention
  • FIG. 2b is a view showing another embodiment of an imaging cartridge chip provided with an electrical contact portion according to an embodiment of the present invention
  • FIG. 4 is a side view of another imaging cartridge chip according to an embodiment of the present invention
  • Figure 5 is a partial structural view showing another embodiment of the imaging cartridge mounted to the image forming apparatus in the embodiment of the present invention.
  • FIGS. 6(A) to (D) are process diagrams of mounting an imaging cartridge to an image forming apparatus in an embodiment of the present invention. detailed description
  • An imaging device includes an imaging cartridge and an imaging device.
  • the imaging cartridge is mounted on the imaging device, and the ink is contained in the imaging cartridge and the imaging cartridge chip 100 is mounted thereon, and is mainly used for storing, for example, an imaging cartridge model. Information such as date of manufacture and amount of ink remaining. among them:
  • An imaging cartridge chip 100 includes: a substrate 10 and at least two electrical contacts 11 .
  • a view of one side of the imaging cartridge chip 100 on which the electrical contact portion 11 is disposed is shown in FIG. 2 a , and FIG. 2 a
  • the substrate 10 is provided with three electrical contacts 11 ( 1 ), 11 ( 2 ) and 11 ( 3 ) as an example.
  • the electrical contact portion 11 is disposed on one surface of the substrate 10 on the substrate 10 in a direction at which the one side of the electrical contact portion 11 is disposed at an angle of ⁇ , and between the at least two electrical contact portions 11 is provided with a slot 12, wherein ⁇ is greater than The slot 12 between 0 degrees and at least two electrical contacts 11 prevents shorting of the two electrical contacts 11.
  • the shape of the electrical contact portion 11 may be circular or rectangular or even irregular, and the like, and is not limited to the shape shown in Fig. 2.
  • the electrical contacts 11 of the imaging cartridge chip 100 mounted on the imaging cartridge are in contact with the electrical contacts provided on the imaging device, thereby causing the imaging device and the imaging cartridge chip 100 on the imaging cartridge to perform Communication to perform normal imaging operations.
  • one or more slots 12 may be disposed between the at least two electrical contacts 11 , the specific number is not limited; and as shown in FIG. 2 a , only one slot is provided on the substrate 10 . 12, and the slot 12 is located between every two electrical contacts 11, such as the lower portion 12 ( 2 ) of the slot between the electrical contacts 11 ( 2 ) and 11 ( 3 ), and the left end 12 of the slot ( 3) Between the electrical contacts 11 ( 1 ) and 11 ( 3 ), the right end 12 ( 1 ) of the slot is located between the electrical contacts 11 ( 1 ) and 11 ( 2 ). This reduces the number of punching of the imaging cartridge chip 100.
  • the number of slots 12 and the hollow area provided on the imaging cartridge chip 100 cannot be too large, and it is necessary to prevent the electrical contact portion of the imaging device from being punctured around the electrical contact portion 11 of the imaging cartridge chip 100, thereby ensuring the imaging box.
  • the stability of the electrical contact 11 in the chip 100 cannot be too large, and it is necessary to prevent the electrical contact portion of the imaging device from being punctured around the electrical contact portion 11 of the imaging cartridge chip 100, thereby ensuring the imaging box.
  • the slot 12 in the substrate 10 may be cylindrical, and the axial line of the slot 12 may be at an angle to the side of the substrate 10 where the electrical contact portion 11 is disposed, such as vertical, etc.; the slot 12 in the substrate 10 It may also be in the shape of a mesa, and the hollow area of one side of the slot 12 on which the electrical contact portion 11 is disposed on the substrate 10 is larger than the hollow area on the other side of the substrate 10.
  • the slot 12 on the substrate 10 may have any other shape.
  • Slot 12 on substrate 10 The hollow surface of the substrate 10 may be of any shape, such as a square shape, a circular shape or an irregular shape.
  • the slot 12 in the substrate 10 may be a through hole or a blind hole having a relatively deep depth.
  • a groove is disposed on the substrate 10 at an angle of an angle with respect to a side where the electrical contact portion 11 is disposed, and between the at least two electrical contacts 11 Hole 12.
  • the slot 12 is provided with a hollow surface on one side of the electrical contact portion on the substrate 10, and can intersect any adjacent surface of the substrate 10 on which one side of the electrical contact portion is disposed, so that the substrate 10 Providing a groove on an adjacent surface of one side of the electrical contact portion, if the adjacent surface is a surface close to a horizontal surface on the substrate 10 of the imaging cartridge chip 100 after the imaging cartridge is mounted to the image forming apparatus, when the ink drops into the slot At 12 o'clock, the ink flows out of the imaging cartridge chip 100 along the slot 12 by gravity, which prevents ink from remaining on the substrate 10, thereby preventing corrosion of the substrate 10 by the ink.
  • Another imaging cartridge device includes an imaging cartridge and an imaging device.
  • the imaging cartridge is mounted on the imaging device, and the ink is contained in the imaging cartridge and the imaging cartridge chip 200 is mounted thereon, and is mainly used for storage.
  • Information such as the imaging cartridge model, date of manufacture, and ink remaining. among them:
  • the structure of the imaging cartridge chip 200 is similar to the structure of the imaging cartridge chip 100 in the embodiment shown in FIG. 2.
  • the slot provided on the substrate in the imaging cartridge chip 200 of the embodiment may be cylindrical, and the axis of the slot is
  • the electrical contact portion on the substrate may be at an angle, such as vertical; the slot on the substrate may also be in the shape of a table, and the hollowed-out area of the slot on which the electrical contact portion is disposed on the substrate is larger than the hollowed-out area on the other side of the substrate;
  • the upper slot can also be in any other shape.
  • the slotted holes in the substrate may have any shape on the hollow surface of one side of the substrate, and may be, for example, square, circular or irregular.
  • the electrical contact portion of the imaging device in this embodiment includes a probe 20, one end of which is fixed to the imaging device (not shown in the drawing) through the probe holder 21, when the imaging cartridge After being mounted to the imaging device, the other end of the probe 20 in the imaging device is in contact with the electrical contact portion of the imaging cartridge chip 200.
  • the probe 20 in the imaging device is elastic and elastic.
  • the electrical contacts of the imaging cartridge chip 200 in the imaging cartridge are aligned with the probe 20 and along the probe 20 and Directional movement of the imaging device (as indicated by the dashed arrow in Figure 3), at which point the probe 20 is compressed, sufficient Good contact of the electrical contacts of the imaging cartridge chip 200 with the probes 20 in the imaging device is ensured, thereby ensuring communication between the imaging device and the imaging cartridge chip.
  • the slot is provided between the at least two electrical contacts of the imaging cartridge chip, the ink leaking from the imaging cartridge is broken between the electrical contacts, so that short circuits of the two electrical contacts are not formed, preventing The image forming apparatus caused by ink leakage is burned out or the image forming operation cannot be performed.
  • the hollow surface of one side of the electrical contact portion is disposed on the substrate, and may intersect any adjacent surface of the substrate on which the electrical contact portion is disposed, if the adjacent surface is mounted on the imaging cartridge.
  • Still another imaging cartridge device provided by an embodiment of the present invention includes an imaging cartridge and an imaging device.
  • the imaging cartridge is mounted on the imaging device, and the ink is contained in the imaging cartridge and the imaging cartridge chip 300 is mounted thereon, and is mainly used for storage.
  • Information such as the imaging cartridge model, date of manufacture, and ink remaining. among them:
  • the imaging cartridge chip 300 substrate 30 and the at least two electrical contacts 31, the electrical contact portion 31 of the present embodiment are disposed on one side 30(a) of the substrate 30, and disposed on the substrate 30.
  • the electrical contact portion 31 - the surface 30 ( a ) is in the direction of the angle ⁇ , and between the at least two electrical contacts 31 is provided with a slot 32, wherein ⁇ is greater than 0 degrees, and at least two electrical contacts 31
  • the slot 32 between the two prevents the short circuit of the two electrical contacts 31.
  • the slot 32 of the substrate 30 is in the shape of a table, and the slot 32 is provided with an electrical contact portion 31 on the substrate 30.
  • the hollow area of the surface 30 (a) is larger than that on the other side of the substrate 30.
  • the hollowed out area of (b), the hollowed surface 32 of the substrate 30 on either side of the substrate 30 may have any shape, such as a square shape, a circular shape or an irregular shape.
  • the slot 32 in the substrate 30 may be a through hole or a blind hole having a relatively deep depth.
  • the slot 32 of the embodiment is provided with a hollow surface of the electrical contact portion 30 ( a ) on the substrate 30, and can intersect any adjacent surface 30 ( c ) of the substrate 30 on one side of the electrical contact portion. If the adjacent face 30(c) is a surface close to the horizontal plane on the substrate of the imaging cartridge chip 300 after the imaging cartridge is mounted to the image forming apparatus, the ink will follow the groove under the action of gravity when the ink drops into the slot. The holes flow out of the imaging cartridge chip 300 to prevent ink from remaining on the substrate, thereby preventing corrosion of the substrate by the ink.
  • the electrical contact portion of the image forming apparatus in this embodiment includes a folding pressure spring piece 40, which One end of the folding spring reed 40 is fixed to an image forming apparatus (not shown) by a compression spring seat 41, and the other end of the folding pressure spring 40 is not connected to other members.
  • the top of the folding press spring 40 in the image forming apparatus comes into contact with the electrical contact portion 31 (the portion filled with oblique lines in Fig. 5) of the image forming cartridge chip 300 provided on the image forming cartridge.
  • the imaging cartridge will move in a direction parallel to the compression spring seat 41 (the direction of the dotted arrow in FIG. 6), Until the top of the folded compression spring 40 in the image forming apparatus passes through the slot 32 of the imaging cartridge chip 300 provided on the imaging cartridge, and reaches the electrical contact portion 31 of the imaging cartridge chip 300 (the obliquely filled portion in Fig. 6) And in sufficient contact with the electrical contact portion 31, thereby ensuring communication between the imaging device and the imaging cartridge chip 300.
  • the slot 32 provided in the imaging cartridge chip 300 disconnects the ink leaked from the imaging cartridge between the two electrical contacts 31, so that the short circuit of the two electrical contacts 31 is not formed, preventing ink leakage.
  • the imaging device burns out or cannot perform an imaging operation.
  • the imaging cartridge in the embodiment is mounted to the image forming apparatus, it is required to run in a direction parallel to the compression spring seat 41, that is, parallel to the imaging cartridge chip 300, if the slot 32 is disposed on the substrate 30.
  • the hollow contact area of the electrical contact portion 31 - face 30 ( a ) is larger than the hollow area of the other surface 30 ( b ) of the substrate 30, so that the top portion of the folded spring reed 40 moves along the inclined surface during the mounting process, and the fold is formed.
  • the unfixed end of the compression spring 40 is not affected, thereby facilitating the mounting of the imaging cartridge to the image forming apparatus.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Ink Jet (AREA)
  • Studio Devices (AREA)

Abstract

一种成像盒芯片（100），包括基板（10）和至少两个电接触部（11），所述电接触部（11）设置在所述基板（10）的一面，在所述基板（10）上与设置电接触部（11）一面呈α角度的方向上，且在至少两个电接触部（11）之间设置有槽孔（12），所述α大于0度。当成像盒容纳的显影剂泄露到成像盒芯片的两个电接触部之间时，显影剂在槽孔间被断开，从而防止了两个电接触部之间的短路。

Description

一种成像盒芯片、 成像盒和成像设备
本申请要求于 2011 年 7 月 14 日提交中国专利局、 申请号为 201110196585.5 , 发明名称为 "一种成像盒芯片、 成像盒和成像设备" 的中国 专利申请优先权， 其全部内容通过引用结合在本申请中。
技术领域
本发明涉及成像技术领域， 特别涉及成像盒芯片、 成像盒和成像设备。 背景技术
在现有的成像装置（比如打印机）上都安装有用于成像的成像盒（比如墨 盒）， 在成像盒中容纳墨水且其上安装有成像盒芯片， 主要用于储存如成像盒 型号、 生产日期和墨水剩余量等信息， 成像盒芯片一般包括基板、 存储器和电 接触部， 其中电接触部和存储器是电导通的。
当成像盒安装在成像装置后，成像盒上安装的成像盒芯片中包括的电接触 部和成像装置上的电接触部相接触，使得成像装置和成像盒的存储器通过电接 触部导通， 从而进行正常通信来保证正常的成像操作。
但是在实际的应用中， 成像盒中容纳的墨水会因各种原因泄露到成像盒 夕卜，如果墨水流到成像盒芯片的两个电接触部之间， 由于墨水的导电性将致使 成像盒芯片的两个电接触部短路。 例如图 1所示的成像盒芯片中， 电接触部 2 设置在基板 1上， 成像盒中泄露的墨水 3可能会使得两个电接触部 2短路， 这样 可能导致成像装置被烧坏，或导致成像盒芯片不能被成像装置识别而不能进行 成像操作。
发明内容
本发明实施例提供成像盒芯片、成像盒和成像设备， 防止了墨水泄露导致 的成像装置烧坏或不能进行成像操作。
本发明实施例提供一种成像盒芯片， 包括基板和至少两个电接触部； 所述电接触部设置在所述基板的一面，在所述基板上与设置电接触部一面 呈 α角度的方向上，且在至少两个电接触部之间设置有槽孔； 所述 α大于 0度， 所述至少两个电接触部之间的槽孔防止了所述两个电接触部的短路。
本发明实施例提供一种成像盒， 所述成像盒上设置有成像盒芯片， 所述成 像盒芯片包括基板和至少两个电接触部； 所述电接触部设置在所述基板的一面，在所述基板上与设置电接触部一面 呈 α角度的方向上，且在至少两个电接触部之间设置有槽孔； 所述 α大于 0度， 所述至少两个电接触部之间的槽孔防止了所述两个电接触部的短路。
本发明实施例提供一种成像设备， 包括成像盒和成像装置， 所述成像盒上 设置有成像盒芯片， 所述成像盒芯片包括基板和至少两个电接触部；
所述电接触部设置在所述基板的一面，在所述基板上与设置电接触部一面 呈 α角度的方向上，且在至少两个电接触部之间设置有槽孔， 所述 α大于 0度， 所述至少两个电接触部之间的槽孔防止了所述两个电接触部的短路；所述成像 装置上设置的电接触部与所述成像盒芯片的电接触部接触。
本发明实施例的成像盒上设置的成像盒芯片中，在基板上与设置电接触部 一面呈 α角度的方向上， 且在至少两个电接触部之间设置有槽孔。这样当成像 盒容纳的墨水流到成像盒芯片的两个电接触部之间时，由于在两个电接触部之 间设置有槽孔，会将墨水在槽孔间被断开，从而不会形成这两个电接触部的短 路， 防止了墨水泄露导致的成像装置烧坏或不能进行成像操作。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施 例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地， 下面描述 中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲， 在不付 出创造性劳动性的前提下， 还可以根据这些附图获得其他的附图。
图 1是现有技术中成像盒芯片的结构示意图；
图 2a是本发明实施例提供的一种成像盒芯片设置电接触部一面的视图； 图 2b是本发明实施例提供的另一种成像盒芯片设置电接触部一面的视图； 图 3是本发明实施例中成像盒安装到成像装置后的部分结构示意图； 图 4是本发明实施例提供的另一种成像盒芯片的侧视图；
图 5是本发明实施例中另一种成像盒安装到成像装置后的部分结构示意 图；
图 6 ( A )到 （D )是本发明实施例中成像盒安装到成像装置的过程图。 具体实施方式
下面将结合本发明实施例中的附图 ,对本发明实施例中的技术方案进行清 楚、 完整地描述， 显然， 所描述的实施例仅仅是本发明一部分实施例， 而不是 全部的实施例。基于本发明中的实施例， 本领域普通技术人员在没有作出创造 性劳动前提下所获得的所有其他实施例， 都属于本发明保护的范围。
本发明实施例一种成像设备， 包括成像盒和成像装置， 成像盒安装到成像 装置上， 而在成像盒中容纳墨水且其上安装有成像盒芯片 100, 主要用于储存 如成像盒型号、 生产日期和墨水剩余量等信息。 其中：
本发明实施例提供的一种成像盒芯片 100, 包括： 基板 10和至少两个电接 触部 11 , 该成像盒芯片 100设置电接触部 11一面的视图如图 2a所示， 图 2a中以 在基板 10—面设置有 3个电接触部 11 ( 1 )、 11 ( 2 )和 11 ( 3 )为例说明。
电接触部 11设置在基板 10的一面，在基板 10上与设置电接触部 11一面呈 α 角度的方向上， 且在至少两个电接触部 11之间设置有槽孔 12 , 其中 α是大于 0 度的， 且至少两个电接触部 11之间的槽孔 12能防止这两个电接触部 11的短路。 其中电接触部 11的形状可以是圓形或矩形甚至是不规则形状等，并不限制于图 2中所示的形状。
这样， 在成像盒安装到成像装置后， 成像盒上安装的成像盒芯片 100的电 接触部 11和成像装置上设置的电接触部接触，从而使得成像装置和成像盒上的 成像盒芯片 100进行通信， 来执行正常的成像操作。
可以理解的是， 在至少两个电接触部 11之间可以设置一个或多个槽孔 12 , 具体的数量并不限制； 且也可以如图 2a所示， 在基板 10上只设置一个槽孔 12, 而这一个槽孔 12位于每两个电接触 11之间， 比如槽孔的下部 12 ( 2 )位于电接 触部 11 ( 2 )和 11 ( 3 )之间， 而槽孔的左端 12 ( 3 )位于电接触部 11 ( 1 )和 11 ( 3 )之间， 槽孔的右端 12 ( 1 )位于电接触部 11 ( 1 )和 11 ( 2 )之间。 这样减 少了对成像盒芯片 100的打孔次数。但是在成像盒芯片 100上设置的槽孔 12数量 和镂空面积不能太大， 需要防止成像盒芯片 100中电接触部 11周围被挖孔后被 成像装置的电接触部顶断， 保证了成像盒芯片 100中电接触部 11的稳定性。
另夕卜，基板 10上的槽孔 12可以呈柱形， 且槽孔 12的轴心线与基板 10上设置 电接触部 11一面可以呈一定角度， 比如垂直等； 基板 10上的槽孔 12还可以呈台 形，且槽孔 12在基板 10上设置电接触部 11一面的镂空面积大于在基板 10另一面 的镂空面积； 基板 10上的槽孔 12还可以呈其它任意形状。 基板 10上的槽孔 12 在基板 10—面的镂空面可以是任意的形状， 比如可以呈方形， 圓形或不规则形 等。 另外基板 10上的槽孔 12可以是通孔， 也可以是深度比较深的盲孔等。
可见， 本发明实施例的成像盒上设置的成像盒芯片 100中， 在基板 10上与 设置电接触部 11一面呈 α角度的方向上，且在至少两个电接触部 11之间设置有 槽孔 12。 这样当成像盒容纳的墨水 13流到成像盒芯片 100的两个电接触部 11之 间时， 由于在两个电接触部 11之间设置有槽孔 12, 会将墨水 13在槽孔 12间被断 开，从而不会形成这两个电接触部 11的短路， 防止了墨水泄露导致的成像装置 烧坏或不能进行成像操作。
需要说明的是，如图 2b所示，槽孔 12在基板 10上设置电接触部一面的镂空 面， 可以与基板 10上设置电接触部一面的任一相邻面相交， 使得在基板上 10 设置电接触部一面的相邻面上开有凹槽 ,如果该相邻面是在成像盒安装到成像 装置后， 成像盒芯片 100的基板 10上接近水平面的面， 则当墨水滴到槽孔 12时， 墨水会在重力的作用下沿着槽孔 12流出成像盒芯片 100 , 可以防止墨水残留在 基板 10上， 从而防止了墨水对基板 10的腐蚀。
本发明实施例提供的另一种成像盒设备， 包括成像盒和成像装置， 成像盒 安装到成像装置上， 而在成像盒中容纳墨水且其上安装有成像盒芯片 200, 主 要用于储存如成像盒型号、 生产日期和墨水剩余量等信息。 其中：
成像盒芯片 200的结构与图 2所示实施例中成像盒芯片 100的结构类似， 本 实施例的成像盒芯片 200中基板上设置的槽孔可以呈柱形， 且槽孔的轴心线与 基板上设置电接触部一面可以呈一定角度， 比如垂直等； 基板上的槽孔还可以 呈台形，且槽孔在基板上设置电接触部一面的镂空面积大于在基板另一面的镂 空面积； 基板上的槽孔还可以呈其它任意形状。基板上的槽孔在基板一面的镂 空面可以是任意的形状， 比如可以呈方形， 圓形或不规则形等。
参考图 3所示， 本实施例中的成像装置的电接触部包括探针 20 , 该探针 20 的一端通过探针座 21固定于成像装置（没有在图中画出）上， 当成像盒安装到 成像装置后， 成像装置中探针 20的另一端与成像盒芯片 200的电接触部接触。
可以理解， 成像装置中的探针 20是具有伸缩弹性的， 当成像盒安装到成像 装置时， 成像盒中成像盒芯片 200的电接触部会对准探针 20, 并沿着探针 20且 向成像装置的方向运动（如图 3中虚线箭头的方向）， 此时探针 20被压缩， 充分 保证了成像盒芯片 200的电接触部与成像装置中探针 20的良好接触， 从而保证 了成像装置与成像盒芯片之间的通信。由于在成像盒芯片的至少两个电接触部 之间设置有槽孔，会将成像盒泄露的墨水在电接触部之间被断开，从而不会形 成这两个电接触部的短路，防止了墨水泄露导致的成像装置烧坏或不能进行成 像操作。
需要说明的是， 本实施例槽孔在基板上设置电接触部一面的镂空面， 可以 与基板上设置电接触部一面的任一相邻面相交，如果该相邻面是在成像盒安装 到成像装置后， 成像盒芯片 200的基板上接近水平面的面， 则当墨水滴到槽孔 时， 墨水会在重力的作用下沿着槽孔流出成像盒芯片 200 , 可以防止墨水残留 在基板上， 从而防止了墨水对基板的腐蚀。
本发明实施例提供的又一种成像盒设备， 包括成像盒和成像装置， 成像盒 安装到成像装置上， 而在成像盒中容纳墨水且其上安装有成像盒芯片 300 , 主 要用于储存如成像盒型号、 生产日期和墨水剩余量等信息。 其中：
参考图 4所示的侧视图，本实施例中的成像盒芯片 300基板 30和至少两个电 接触部 31 , 电接触部 31设置在基板 30的一面 30 ( a ), 在基板 30上与设置电接触 部 31—面 30 ( a )呈 α角度的方向上， 且在至少两个电接触部 31之间设置有槽 孔 32 , 其中 α是大于 0度的， 且至少两个电接触部 31之间的槽孔 32能防止这两 个电接触部 31的短路。
需要说明的是， 本实施例中基板上 30的槽孔 32是呈台形的，且槽孔 32在基 板 30上设置电接触部 31—面 30 ( a )的镂空面积大于在基板 30另一面 30 ( b )的 镂空面积，基板 30上的槽孔 32在基板 30任一面的镂空面可以是任意的形状， 比 如可以呈方形， 圓形或不规则形等。 另外基板 30上的槽孔 32可以是通孔， 也可 以是深度比较深的盲孔等。
需要说明的是， 本实施例槽孔 32在基板 30上设置电接触部一面 30 ( a ) 的 镂空面， 可以与基板 30上设置电接触部一面的任一相邻面 30 ( c )相交， 如果 该相邻面 30 ( c )是在成像盒安装到成像装置后， 成像盒芯片 300的基板上接近 水平面的面， 则当墨水滴到槽孔时， 墨水会在重力的作用下沿着槽孔流出成像 盒芯片 300 , 可以防止墨水残留在基板上， 从而防止了墨水对基板的腐蚀。
参考图 5所示， 本实施例中的成像装置的电接触部包括折形压簧片 40 , 该 折形压簧片 40的一端通过压簧座 41固定于成像装置（图中没有画出）上， 该折 形压簧片 40的另一端不与其他部件连接。 当成像盒安装到成像装置后， 成像装 置中折形压簧片 40的顶部与成像盒上设置的成像盒芯片 300的电接触部 31 (图 5 中斜线填充的部分）接触。
可以理解， 参考图 6 ( A )到（D )所示的成像盒安装到成像装置的过程图， 成像盒会沿着平行于压簧座 41的方向 （图 6中虚线箭头的方向）运动， 直至成 像装置中的折形压簧片 40的顶部经过成像盒上设置的成像盒芯片 300的槽孔 32, 并到达该成像盒芯片 300的电接触部 31 (图 6中斜线填充的部分）， 并与电 接触部 31充分的接触， 从而保证了成像装置与成像盒芯片 300之间的通信。 其 中成像盒芯片 300上设置的槽孔 32会将成像盒泄露的墨水在两个电接触部 31之 间被断开，从而不会形成这两个电接触部的 31短路， 防止了墨水泄露导致的成 像装置烧坏或不能进行成像操作。
需要说明的是， 由于本实施例中成像盒在安装到成像装置时， 需要沿着平 行于压簧座 41的方向即平行于成像盒芯片 300的方向运行， 如果槽孔 32在基板 30上设置电接触部 31—面 30 ( a )的镂空面积大于在基板 30另一面 30 ( b )的镂 空面积， 这样在安装过程中折形压簧片 40顶部就会沿着倾斜面运动， 则折形压 簧片 40未固定的一端就不会受到影响， 从而方便了成像盒安装到成像装置上。
以上对本发明实施例所提供的成像盒芯片、成像盒和成像设备， 进行了详 实施例的说明只是用于帮助理解本发明的方法及其核心思想； 同时，对于本领 域的一般技术人员，依据本发明的思想，在具体实施方式及应用范围上均会有 改变之处， 综上所述， 本说明书内容不应理解为对本发明的限制。

Claims

1、 一种成像盒芯片， 其特征在于， 包括基板和至少两个电接触部； 所述电接触部设置在所述基板的一面，在所述基板上与设置电接触部一面 呈 α角度的方向上，且在至少两个电接触部之间设置有槽孔； 所述 α大于 0度。
2、 如权利要求 1所述的成像盒芯片， 其特征在于， 所述至少两个电接触部 之间的槽孔防止了所述两个电接触部的短路。
3、 如权利要求 1所述的成像盒芯片， 其特征在于， 所述槽孔呈台型， 所述 槽孔在基板上设置电接触部一面的镂空面积大于在基板另一面的镂空面积。
4、 如权利要求 1所述的成像盒芯片， 其特征在于， 所述槽孔呈柱形， 所述 槽孔的轴心线与所述基板上设置电接触部的一面垂直。
5、 如权利要求 1至 4任一项所述的成像盒芯片， 其特征在于， 所述槽孔在 基板上设置电接触部一面的镂空面，与所述基板上设置电接触部一面的相邻面 相交。
6、 如权利要求 1至 4任一项所述的成像盒芯片， 其特征在于， 所述槽孔在 基板一面的镂空面呈方形， 或圓形， 或不规则形。
7、 一种成像盒， 其特征在于， 所述成像盒上设置有如权利要求 1至 6任一 项所述的成像盒芯片。
8、 一种成像设备， 其特征在于， 包括成像盒和成像装置， 所述成像盒上 设置如权利要求 1或 2所述的成像盒芯片；
所述成像装置上设置的电接触部与所述成像盒芯片的电接触部接触。
9、 如权利要求 8所述的成像设备， 其特征在于， 所述成像装置的电接触部 包括折形压簧片 , 所述折形压簧片的一端通过压簧座固定于所述成像装置上； 所述成像盒安装到成像装置后，所述折形压簧片的顶部与所述成像盒芯片 的电接触部接触， 所述成像盒芯片中基板上的槽孔呈台型， 所述槽孔在基板上 设置电接触部一面的镂空面积大于在基板另一面的镂空面积。
10、 如权利要求 8所述的成像设备， 其特征在于， 所述成像装置的电接触 部包括探针， 所述探针的一端通过探针座固定于所述成像装置上；
所述成像盒安装到成像装置后，所述探针的另一端与所述成像盒芯片的电 接触部接触， 所述成像盒芯片中基板上的槽孔呈柱形， 所述槽孔的轴心线与所 述基板上设置电接触部的一面垂直。
11、 如权利要求 8至 10任一项所述的成像设备， 其特征在于， 所述槽孔在 基板上设置电接触部一面的镂空面，与所述基板上设置电接触部一面的相邻面 相交。
12、 如权利要求 8至 10任一项所述的成像设备， 其特征在于， 所述成像 盒芯片中基板上的槽孔在基板一面的镂空面呈方形， 或圓形， 或不规则形。
PCT/CN2012/074575 2011-07-14 2012-04-24 一种成像盒芯片、成像盒和成像设备 WO2013007122A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN 201110196585 CN102253636B (zh) 2011-07-14 2011-07-14 一种成像盒芯片、成像盒和成像设备
CN201110196585.5 2011-07-14

Publications (1)

Publication Number Publication Date
WO2013007122A1 true WO2013007122A1 (zh) 2013-01-17

Family

ID=44980948

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2012/074575 WO2013007122A1 (zh) 2011-07-14 2012-04-24 一种成像盒芯片、成像盒和成像设备

Country Status (2)

Country Link
CN (1) CN102253636B (zh)
WO (1) WO2013007122A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102253636B (zh) * 2011-07-14 2013-01-09 珠海艾派克微电子有限公司 一种成像盒芯片、成像盒和成像设备
CN106313902B (zh) * 2013-05-22 2017-11-21 珠海艾派克微电子有限公司 墨盒芯片短路检测方法、芯片和墨盒
CN106864040B (zh) * 2015-12-14 2018-05-25 珠海纳思达企业管理有限公司 喷墨打印机用芯片及喷墨打印机
DE202016008762U1 (de) * 2015-12-14 2019-10-09 Zhuhai Ninestar Management Co., Ltd. Chip eines Tintenstrahldruckers und Tintenstrahldrucker
CN108931910B (zh) * 2018-09-17 2021-08-03 广州众诺电子技术有限公司 安装装置、芯片组件、成像盒及成像设备
JP7427367B2 (ja) 2019-04-26 2024-02-05 キヤノン株式会社 液体吐出ヘッドおよびその製造方法
CN110426936B (zh) * 2019-07-29 2022-08-23 广州众诺电子技术有限公司 芯片安装装置以及成像盒

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002151846A (ja) * 2000-02-09 2002-05-24 Ngk Spark Plug Co Ltd 配線基板およびその製造方法
CN101694837A (zh) * 2009-10-17 2010-04-14 天水华天科技股份有限公司 一种双排引脚的四面扁平无引脚封装件及其生产方法
CN201897696U (zh) * 2010-07-01 2011-07-13 珠海艾派克微电子有限公司 一种成像设备的成像盒芯片、成像盒及成像设备
CN102253636A (zh) * 2011-07-14 2011-11-23 珠海艾派克微电子有限公司 一种成像盒芯片、成像盒和成像设备
CN202145261U (zh) * 2011-07-14 2012-02-15 珠海艾派克微电子有限公司 一种成像盒芯片、成像盒和成像设备

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1169236C (zh) * 1999-03-31 2004-09-29 精工爱普生株式会社 半导体装置的制造方法
US7149090B2 (en) * 2001-09-11 2006-12-12 Brother Kogyo Kabushiki Kaisha Structure of flexible printed circuit board
KR100452850B1 (ko) * 2002-10-17 2004-10-14 삼성전자주식회사 잉크젯 프린터의 프린트 헤드 및 그 제조방법
CN2822968Y (zh) * 2005-08-22 2006-10-04 王艾力克斯 喷墨打印机墨水盒的改良结构
CN201030680Y (zh) * 2007-01-21 2008-03-05 珠海天威技术开发有限公司 芯片及容器
CN201069516Y (zh) * 2007-08-16 2008-06-04 珠海天威技术开发有限公司 一种改进的碳粉盒

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002151846A (ja) * 2000-02-09 2002-05-24 Ngk Spark Plug Co Ltd 配線基板およびその製造方法
CN101694837A (zh) * 2009-10-17 2010-04-14 天水华天科技股份有限公司 一种双排引脚的四面扁平无引脚封装件及其生产方法
CN201897696U (zh) * 2010-07-01 2011-07-13 珠海艾派克微电子有限公司 一种成像设备的成像盒芯片、成像盒及成像设备
CN102253636A (zh) * 2011-07-14 2011-11-23 珠海艾派克微电子有限公司 一种成像盒芯片、成像盒和成像设备
CN202145261U (zh) * 2011-07-14 2012-02-15 珠海艾派克微电子有限公司 一种成像盒芯片、成像盒和成像设备

Also Published As

Publication number Publication date
CN102253636A (zh) 2011-11-23
CN102253636B (zh) 2013-01-09

Similar Documents

Publication Publication Date Title
WO2013007122A1 (zh) 一种成像盒芯片、成像盒和成像设备
JP2016038207A (ja) ポゴピン用プローブ部材
KR101919881B1 (ko) 양방향 도전성 패턴 모듈
KR20160148097A (ko) Ｐｃｒ 디바이스 및 그 제조 방법
CN110202942A (zh) 成像盒及应用于成像盒上的芯片
KR101311752B1 (ko) 반도체 테스트용 콘텍터 및 그 제조방법
US9545002B2 (en) Multilayer circuit board
KR101639737B1 (ko) 소켓 어셈블리 및 그의 제조방법
TWI635283B (zh) 雙向導電觸針、雙向導電模型模組及其製造方法
KR200388336Y1 (ko) 컨택트 프로브
CN202067977U (zh) 电连接器
TWI455222B (zh) 半導體元件堆疊結構測試方法
CN202145261U (zh) 一种成像盒芯片、成像盒和成像设备
JP6665979B2 (ja) 電気的接触子
CN210640390U (zh) 一种实现pcba板卡浮动组装的结构
KR102158507B1 (ko) 테스트 소켓 및 그 제조방법
CN102437450A (zh) 连接器、配合间隙自识别及调节系统、可靠性自识别系统
TWM532675U (zh) 電連接器
JP2007149663A (ja) コネクタおよびそのベース
WO2016127334A1 (zh) 电子元件引脚和电子元件
CN112526178A (zh) 探针及测试装置
JP5776354B2 (ja) コンタクト電極及びコンタクタ
KR20180070734A (ko) 양방향 도전성 핀 및 이를 이용한 반도체 테스트 소켓
CN102901886A (zh) 用于检测电状况的设备
CN211684194U (zh) 耗材芯片及耗材

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12811368

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 12811368

Country of ref document: EP

Kind code of ref document: A1