WO2013005155A2 - Appareil pour traiter un article en forme de tranche - Google Patents

Appareil pour traiter un article en forme de tranche Download PDF

Info

Publication number
WO2013005155A2
WO2013005155A2 PCT/IB2012/053350 IB2012053350W WO2013005155A2 WO 2013005155 A2 WO2013005155 A2 WO 2013005155A2 IB 2012053350 W IB2012053350 W IB 2012053350W WO 2013005155 A2 WO2013005155 A2 WO 2013005155A2
Authority
WO
WIPO (PCT)
Prior art keywords
chamber
lid
wafer
process chamber
chuck
Prior art date
Application number
PCT/IB2012/053350
Other languages
English (en)
Other versions
WO2013005155A3 (fr
Inventor
Karl-Heinz Hohenwarter
Original Assignee
Lam Research Ag
Lam Research Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Ag, Lam Research Corporation filed Critical Lam Research Ag
Priority to KR1020147000452A priority Critical patent/KR102007546B1/ko
Publication of WO2013005155A2 publication Critical patent/WO2013005155A2/fr
Publication of WO2013005155A3 publication Critical patent/WO2013005155A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like

Definitions

  • the invention relates generally to an apparatus for treating a wafer-shaped article, such as a semiconductor wafer .
  • Semiconductor wafers are subjected to various surface treatment processes such as etching, cleaning, polishing and material deposition.
  • a single wafer may be supported in relation to one or more treatment fluid nozzles by a chuck associated with a rotatable carrier, as is described for example in U.S.
  • Such spin chucks may be accommodated in closed process chambers, as described for example in commonly-owned copending U.S. patent appln. Ser. No. 12/913,405, filed
  • An apparatus for processing wafer-shaped articles comprises a closed process chamber, a chuck located within the closed process chamber, and at least one process liquid dispensing device disposed within the chamber.
  • the closed process chamber comprises a lid that can be opened to position a wafer- shaped article within the closed process chamber.
  • the lid comprises a heater adapted to heat a wafer-shaped article positioned in the closed process chamber.
  • the heater comprises a plurality of infrared heating elements.
  • the infrared heating elements are individually tuneable to apply a desired heating profile to a surface of a wafer-shaped article positioned within the closed process chamber.
  • the lid is axially displaceable relative to a remaining structure of the closed process chamber while sealingly engaged with the remaining
  • the heater comprises one or a plurality of infrared heating elements, and the lid
  • the lid comprises an internal gas inlet communicating with one or more internal peripheral recesses surrounding the heater, to permit a cooling gas to be supplied adjacent a periphery of the heater.
  • the internal gas inlet is disposed in a central region of the lid, and is connected to the one or more internal peripheral recesses by a plurality of radially extending channels.
  • the heater comprises one or a plurality of infrared heating elements, and the lid
  • the apparatus comprises an internal IR shield separating the one or a plurality of infrared heating elements from the one or more internal peripheral recesses.
  • the heater is sealed within the lid so as to be protected from contact with process liquids inside the closed process chamber.
  • the lid comprises at least one gas nozzle opening on or extending beyond a downwardly facing surface of the lid, so as to supply gas into the closed process chamber.
  • the apparatus includes a drive unit for the at least one process liquid dispensing device, the drive unit being drivingly connected to the at least one dispensing device to move the at least one dispensing device from a peripheral standby position to one or more active positions in which a dispensing end of the at least one dispensing device is moved radially inwardly of the chuck, the drive unit being mounted outside of the chamber.
  • the chamber is a component of a process module for single wafer wet processing of
  • the chuck is a spin chuck having a drive shaft extending downwardly from the chamber.
  • the at least one process liquid dispensing device is operable to dispense liquid into the chamber while the lid is in the closed position.
  • the chuck is vertically movable relative to the closed process chamber, and is configured to have at least three stopping positions, these being an uppermost position for loading and unloading a wafer-shaped article from the chuck, and at least two lower positions within the chamber, each of the at least two lower positions corresponding to a distinct process level of the chamber.
  • the apparatus includes a drive mechanism that moves the lid from the closed position to the open position, the drive mechanism being adapted to displace the lid both upwardly and laterally relative to the chamber.
  • drive unit is a motor mounted on a side housing of the chamber, an output shaft of the motor passing into the side housing and driving a link that passes into the chamber and connects to the at least one liquid dispensing device.
  • the at least one process liquid dispensing device is a media supply arm pivotably mounted within the chamber and movable from a peripheral standby position to one or more active positions in which a
  • dispensing end of the media supply arm is moved radially inwardly of the chuck.
  • the media supply arm has one end pivotally connected to a link that passes through a wall of the chamber and an opposite end provided with a dispensing nozzle .
  • the lid is arranged parallel to a wafer-shaped article received on the chuck.
  • the closed process chamber comprises a plurality of superposed process levels, each of the plurality of superposed process levels having a respective gas exhaust connected thereto, wherein the gas exhausts are individually controllable.
  • the closed process chamber is mounted on an upper surface of a base plate, and the apparatus also includes a drive unit for the chuck mounted in a housing that depends from a lower surface of the base plate.
  • the drive mechanism that moves the lid from the closed position to the open position is mounted on a lower surface of a base plate, and the closed process chamber is mounted on an upper surface of the base plate.
  • Figure 1 is a perspective view of a preferred embodiment
  • Figure 2 is a view similar to Fig. 1, in which the chamber lid has been moved up and away from the module, so as to permit loading or unloading of the module;
  • Figure 3 is a perspective view of the Fig. 1 embodiment from below, showing several of the mechanisms used to operate the module;
  • Figure 4 is another perspective view of the Fig. 1 embodiment, sectioned in an axial plane, so as to illustrate internal components thereof;
  • Figure 5 is an axial cross-section of the Fig. 1 embodiment, in the same plane as that of Fig. 4 ;
  • Fig. 6 is a perspective view from above of the lid of the Fig. 1 embodiment
  • Fig. 7 is a top plan view of the lid, in which the cover is rendered in transparent form
  • Fig. 8 is a perspective view from below of the lid of the Fig. 1 embodiment
  • Fig. 9 is a cross-sectional view along the line A-A of Fig. 7;
  • Fig. 10 is a cross-sectional view along the line D-D o Fig. 7;
  • Figure 11 is an axial cross-section of the Fig. 1 embodiment in a plane that intersects the pivotal mounting of one of the media supply arms;
  • Figure 12 is a sectional view illustrating the mechanism for driving and raising and lowering the spin chuck of this embodiment
  • Figure 13 is a radial section of the Fig. 1 embodiment illustrating the media supply arms in their standby position
  • Figure 14 is a fragmentary perspective view of the pivotal mounting of one of the media supply arms
  • Figure 15 is a radial section of the Fig. 1 embodiment in which one of the media supply arms has been pivoted to its service position; and Figure 16 is a perspective view of the Fig. 1
  • a closed chamber module 10 is mounted on a base plate 15, and is constituted by a
  • the chamber module 10 is closed at its upper end by a lid 100, which seals at its outer periphery to the inner periphery of the annular upper chamber cover 32.
  • Lid 100 is secured to lid arm 22, which moves the lid 100 from the closed position shown in Fig. 1 to the open position shown in Fig. 2, and which is in turn positioned on lid support shaft 26.
  • a gas feed line 24 supplies gas to the lid 100. In practice a plurality of gas feed lines may be provided.
  • First and second drive units 52, 62 are provided for respective media supply arms to be described below, and lead to respective covers 54, 64 for the pivotal movement mechanisms for the media supply arms.
  • Reference numeral 56 denotes a lead-in for the first media supply line.
  • the closed chamber module of this embodiment has three interior levels, each of which has an associated gas exhaust, with reference numerals 82, 84 and 86 in Fig. 1 denoting the associated exhausts for the lower, middle and upper levels, respectively and 81, 83 and 85 denoting the associated lower, middle and upper gas suctions for those exhausts.
  • the closed chamber module is shown in its open position, which involves both raising the lid upwardly relative to the chamber and pivoting it about the lid support shaft 26, which accommodates the hollow shaft 18.
  • spin chuck 70 is visible, which in this embodiment is a chuck of the double-sided type. Also visible are the second media supply arm 63 in its standby position, and upper, middle and lower levels 34, 35, 36.
  • the underside of the lid 100 includes a central gas nozzle 23.
  • Motor 27 which may for example be a pneumatic cylinder, drives link 19, which in turn drives hollow shaft 18 (see Fig. 4) .
  • Motor 27 thus drives the pivotal movement of lid 100.
  • Motor 28 is a lifting motor for raising and lowering the lid 100, whereas 29 denotes a lead-in for the gas feed lines 21, 24 that are accommodated in the hollow shaft 18.
  • a spin motor 72 spins the spin chuck 70, whereas motor 76 raises and lowers spin chuck 70 via slider 74.
  • a lower chamber cover 31 accommodates the bellows of the spin chuck, as will be described below.
  • Fig. 4 the upper, middle and lower levels 34, 35 and 36 are more readily visible.
  • the structure of these levels and their respective exhausts 86, 84 and 82 may be as described in commonly-owned application WO 2004/084278 Al .
  • the gas feed line 21 for the central gas nozzle 23 an expansion bellows 75 that serves to isolate the drive mechanisms from the interior ambient of the chamber, a frame 77 that connects the chuck drive mechanism to the underside of the chamber, a non-rotating nozzle head 79 supplying the bottom nozzles of the chuck, and a non-rotating hollow shaft 78 accommodating the bottom nozzle head 79.
  • Fig. 5 shows the aforementioned components in greater detail, along with the plate 37 defining the chamber bottom, the first media supply arm 53 shown in its standby position, and the stowage area 55 for the arm 53. It will be noted that shaft 18 is rigidly secured to lid arm 22, such that the rotational and
  • Lid 100 is depicted in greater detail in Figs. 6-10.
  • a plurality of electrical connectors 122 are provided for the heating lamps 120.
  • the upper cover of lid 100 is normally optically opaque but is rendered m transparent form m Fig. 7, to reveal the infrared lamps 120 and the ribs 115, between which the channels of the cooling gas distribution network are established.
  • lid 100 includes twelve linear infra red (IR) heaters 120.
  • the IR-heaters are separately tunable, so as to achieve a desired uniformity of heating across the wafer surface. For example, if it is found out that the wafer edge is not heated fast enough the power to the outermost IR-heaters 120 is increased.
  • the tuning of the IR-heaters can be optimized by monitoring the treated wafers regarding the uniformity of heating or by monitoring the temperature increase using local thermometers .
  • the IR-heaters are preferably linear quartz rods . There is an isolative coating provided so that the IR-heaters primarily emit IR-light towards the wafer surface.
  • the chamber and the IR-heaters are separated by a transparent plate 135, e.g. made of heat resistant glass (borosilicate glass), or quartz.
  • a transparent plate 1335 e.g. made of heat resistant glass (borosilicate glass), or quartz.
  • Surrounding transparent plate 135 is an annular peripheral shield 125, which is formed of stainless steel or another material that is essentially opaque to infrared radiation. Shield 125 thus serves to focus the IR radiation onto the wafer surface and prevents the surrounding parts (e.g. the chamber walls), which are often made from a plastic material, from being excessively heated.
  • the assembly of IR heaters 120 is sealed within the lid 100 so that process liquid inside the sealed chamber cannot make contact with the IR heaters 120. This can be important for example when the process liquid is flammable, for example in the case of hot isopropyl alcohol used during drying treatments.
  • heating elements in this embodiment are linear tubes, the heating elements may alternatively be embodied as tunable spot type IR lamps or concentric annular heating elements.
  • the lid 100 in this embodiment comprises an outer plate 130 and also an inner plate 136.
  • Inner plate 136 is preferably also an IR shield. Between the outer plate and the inner plate there is a gas
  • cooling gas preferably an inert gas such as nitrogen
  • the cooling gas is introduced through feed pipe 129 and distributed to six radially arranged gas distribution chambers 133 through channels 131 that are defined by ribs 115.
  • the ribs 115 are part of the outer plate 130 and are arranged like spokes radiating from the center of lid 100.
  • Fig. 9 is a cross- section through one of the ribs 115, the gas distribution network is better seen in Fig. 10.
  • Lid 100 in this embodiment is also axially displaceable relative to lid arm 22, by virtue of its mounting thereto via a series of six rods 103 that are rigidly secured to lid 100 but whose enlarged heads 104 are captive within pockets formed in lid arm 22, and in which they may slide axially upwardly against the force of springs 105 that surround the rods 103 and that bear via their upper ends on lid arm 22 and via their lower arms on the outer cover 133 of lid 100.
  • a suitable gear motor or the like can thus vary the spacing between the lid 100 and lid arm 22, and thus the spacing between the set of IR heating elements 120 and the upper surface of a wafer positioned with the process chamber. This axial positioning thus permits further tuning of the heating profile to be applied to a wafer.
  • Reference numeral 17 denotes a pressure- equalizing chamber with the lid 100.
  • An annular seal 33 such as an O-ring or V-seal is attached to or seated in the annular upper chamber cover 32, to form a seal with the lid 100.
  • the cylindrical side surface of lid 100 is adapted to remain sealingly engaged with upper chamber 32 throughout the range of axial travel of lid 100 relative to lid arm 22.
  • the mechanism for rotating the spin chuck carrier 73 comprises a rotating hollow shaft 71 that drives the spin chuck carrier 73 in rotation, the expansion bellows 75 that shields the drive mechanisms from the interior ambient of the chamber, frame 77 connecting the chuck drive mechanism to the underside of the chamber, non- rotating nozzle head 79 supplying the bottom nozzles of the chuck, and non-rotating hollow shaft 78 accommodating the bottom nozzle head 79.
  • Non-rotating hollow shaft 90 surrounds rotating hollow shaft 71, which in turn surrounds non-rotating hollow shaft 78, these three shafts being coaxial with one another.
  • Rotary shaft seal bearing 91 seals the coaxial shafts from the chamber ambient and supports the interconnected rotary hollow shaft 78 and chuck carrier 73, whereas bearing 92 connects the non-rotating upper ring 94 with the rotating shaft 71.
  • Membrane cover 93 is fitted within lower chamber cover 31, and at its inner periphery seals against bellows 75, and at its outer periphery seals against the chamber bottom 37.
  • both media supply arms 53, 63 can move simultaneously, however alternatively approaching the centre, which can be achieved by appropriate software commands .
  • the service position can refer to any position where the dispensing end of the media supply arm is positioned above a wafer
  • FIG. 14 shows further detail of the mechanism for driving the media supply and dispense arms between their standby and service positions.
  • Cover 64 is indicated only in broken line in Fig. 14, to permit viewing the interior components of the drive mechanism.
  • cover 64 will be made of a solid material mounted in a sealed manner to the cylindrical wall 30 of the chamber, the cylindrical wall 30 having a cutout surrounded by the cover 64 to permit passage therethrough of the link 67 that carries the second media arm 63 on its distal end and which is connected to the output shaft 68 of drive unit 62 for example by a splined connection.
  • Output shaft 68 penetrates cover 64 from below via a sealed bearing, thus drive unit 62 is disposed outside the chamber and is protected from the harsh chemical environment that exists within the chamber.
  • link 67 will be pivoted over a range of motion dictated by the operating cycle of the drive unit 62, and which corresponds to displacement of the media supply arm 63 from its standby position to its service position.
  • the size of the cutout in the cylindrical chamber wall 30 is therefore sized to accommodate that range of pivotal motion.
  • Lead-in 66 connects to the second media line 61 inside the chamber.
  • Lead-in 66 may for example be a fluid coupling that traverses the cylindrical wall 30 of the chamber in a sealed manner, connecting to inlet tubing at its end outside the chamber and to second media line 61 at its end inside the chamber.
  • FIG. 14 Also visible in Fig. 14 is an interior chamber wall positioned radially inwardly of cylindrical chamber wall 30, which together with wall 30 defines the stowage area 65 for the second media supply arm 63. That interior wall is provided with a cut-out 69 to permit passage of the
  • first and second media supply arms 53 and 63 are equipped with essentially the same drive mechanisms in this embodiment, such that the
  • Fig. 15 the first media arm 53 remains in its standby position, whereas second media supply arm 63 has been pivoted to the service position, in which the downwardly depending dispense nozzle of the arm 63 is positioned above the center of the spin chuck.
  • Second media line 61 is more visible with arm 63 in its service position. That line 61 is depicted schematically in Fig. 15, but it will be seen that the length of line 61 is sufficient to accommodate the range of motion of the radially inward end of link 67, and so too its flexibility.
  • Fig. 16 corresponds to Fig. 15 and shows cover 54 in place whereas cover 64 is removed to reveal the drive linkage for media arm 63.
  • the chamber In use, the chamber will be opened to permit loading a wafer to be processed therein. This involves first
  • Shaft 18 is preferably
  • motor 27 is next actuated to drive link 19 in an arcuate range of motion about the axis of shaft 18.
  • link 19 is non-rotabably secured to shaft 18, this motion rotates shaft 18 and with it lid arm 22 and lid 100, such that the lid 100 is swung away from the opening defined by the upper annular chamber cover 32, to the position shown in Fig. 2.
  • motor 27 is itself mounted to the underside of base plate 15 via a pivot, to allow the pivotal motion of the link 19.
  • Link 19 may be splined to shaft 18 and slide relative thereto during vertical displacement of shaft 18 driven by motor 28, or link 19 may be secured fast to shaft 18, and be driven by motor 27 at its opposite end via a pivot connection on which it may slide vertically when motor 28 is operated.
  • a wafer to be processed is loaded therein.
  • Apparatus for transporting and loading wafers onto spin chucks are well known in the art.
  • motor 76 is actuated to raise the spin chuck 70 via slider 74 to a position in the vicinity of the opening defined in the upper annular chamber cover 32.
  • the spin chuck 70 may be raised to a position where it is just below the opening in cover 32, just above that opening, or flush with that opening .
  • the diameter of the opening in the upper annular cover 32 must obviously be greater than the outer diameter of a wafer to be processed in the chamber, but is preferably not of substantially greater diameter.
  • the opening in cover 32 preferably has a diameter of approximately 320mm.
  • the diameter of the opening in the upper end of the chamber should not exceed the diameter of a wafer to be processed by more than 50%, preferably by not more than 20%, and still more preferably by not more than 10%.
  • Spin chuck 70 is adapted to hold a wafer of a
  • Spin chuck 70 includes a peripheral series of gripping pins, which prevent the wafer from sliding laterally during processing.
  • a nitrogen gas flow supplied through the chuck and passing radially outwardly beneath the wafer provides the subjacent support of the wafer.
  • the gripping pins may be configured with radially inwardly-facing surfaces that hold the wafer in its working position relative to the chuck, e.g. by having a shape complementary to the
  • peripheral edge of the wafer thereby providing both lateral and subjacent support.
  • any desired combination of liquids and gases can then be supplied to the chamber interior, the liquids via media supply arms 53, 63 and the gases via lid 100.
  • one or more of the seals that seal the chamber be designed so as to permit controlled leakage of gas exteriorly of the chamber at a predetermined level of overpressure. In that way, a substantially oxygen-free atmosphere can be maintained within the chamber during processing of a wafer, while continuing to supply gas from lid 100 and/or through the shaft 78 without accumulation of excess pressure.
  • This design also permits exclusion of oxygen without the need to rely upon the use of vacuum or the maintenance of completely impervious seals.
  • the design of the media supply arms 53, 63 and their associated drive mechanisms permits the arms to be disposed inside the chamber whereas their respective drive units are mounted outside the chamber.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Weting (AREA)

Abstract

Appareil pour traiter des articles en forme de tranches, comportant une chambre de traitement fermée, un mandrin de serrage situé à l'intérieur de la chambre de traitement fermée, et au moins un dispositif distributeur de liquide de traitement monté à l'intérieur de la chambre. La chambre de traitement fermée comporte un couvercle qui peut être ouvert pour placer un article en forme de tranche à l'intérieur de ladite chambre. Le couvercle comprend un dispositif chauffant conçu pour chauffer un article en forme de tranche placé dans la chambre de traitement fermée.
PCT/IB2012/053350 2011-07-07 2012-07-02 Appareil pour traiter un article en forme de tranche WO2013005155A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020147000452A KR102007546B1 (ko) 2011-07-07 2012-07-02 웨이퍼-형상 물품을 처리하기 위한 장치

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/178,430 2011-07-07
US13/178,430 US20130008602A1 (en) 2011-07-07 2011-07-07 Apparatus for treating a wafer-shaped article

Publications (2)

Publication Number Publication Date
WO2013005155A2 true WO2013005155A2 (fr) 2013-01-10
WO2013005155A3 WO2013005155A3 (fr) 2015-08-06

Family

ID=47437509

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2012/053350 WO2013005155A2 (fr) 2011-07-07 2012-07-02 Appareil pour traiter un article en forme de tranche

Country Status (4)

Country Link
US (1) US20130008602A1 (fr)
KR (1) KR102007546B1 (fr)
TW (1) TWI569345B (fr)
WO (1) WO2013005155A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015135798A1 (fr) * 2014-03-12 2015-09-17 Von Ardenne Gmbh Ensemble de recouvrement de chambre de traitement et ensemble de chambre de traitement

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8926788B2 (en) * 2010-10-27 2015-01-06 Lam Research Ag Closed chamber for wafer wet processing
KR101501362B1 (ko) 2012-08-09 2015-03-10 가부시키가이샤 스크린 홀딩스 기판처리장치 및 기판처리방법
KR101512560B1 (ko) 2012-08-31 2015-04-15 가부시키가이샤 스크린 홀딩스 기판처리장치
KR102091291B1 (ko) 2013-02-14 2020-03-19 가부시키가이샤 스크린 홀딩스 기판 처리 장치 및 기판 처리 방법
US9719504B2 (en) * 2013-03-15 2017-08-01 Integrated Designs, L.P. Pump having an automated gas removal and fluid recovery system and method
US10043686B2 (en) * 2013-12-31 2018-08-07 Lam Research Ag Apparatus for treating surfaces of wafer-shaped articles
JP6329428B2 (ja) * 2014-05-09 2018-05-23 東京エレクトロン株式会社 基板処理装置、基板処理装置の付着物除去方法、及び記憶媒体
AU2015279923B9 (en) * 2014-06-24 2018-01-25 Virsec Systems, Inc. System and methods for automated detection of input and output validation and resource management vulnerability
WO2016041151A1 (fr) * 2014-09-16 2016-03-24 Acm Research (Shanghai) Inc. Machine à enduire avec fonction de nettoyage automatique et procédé de nettoyage automatique de machine à enduire
US20160376702A1 (en) * 2015-06-26 2016-12-29 Lam Research Ag Dual mode chamber for processing wafer-shaped articles
US10534907B2 (en) * 2016-12-15 2020-01-14 Sap Se Providing semantic connectivity between a java application server and enterprise threat detection system using a J2EE data
CN116504702B (zh) * 2023-06-26 2023-09-05 山东联高智能科技有限公司 一种半导体元件加工设备

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01134932A (ja) * 1987-11-19 1989-05-26 Oki Electric Ind Co Ltd 基板清浄化方法及び基板清浄化装置
US5464480A (en) * 1993-07-16 1995-11-07 Legacy Systems, Inc. Process and apparatus for the treatment of semiconductor wafers in a fluid
US5595241A (en) * 1994-10-07 1997-01-21 Sony Corporation Wafer heating chuck with dual zone backplane heating and segmented clamping member
US5861609A (en) * 1995-10-02 1999-01-19 Kaltenbrunner; Guenter Method and apparatus for rapid thermal processing
US6232248B1 (en) * 1998-07-03 2001-05-15 Tokyo Electron Limited Single-substrate-heat-processing method for performing reformation and crystallization
US6375746B1 (en) * 1998-07-10 2002-04-23 Novellus Systems, Inc. Wafer processing architecture including load locks
US6331212B1 (en) * 2000-04-17 2001-12-18 Avansys, Llc Methods and apparatus for thermally processing wafers
US20020096196A1 (en) * 2001-01-23 2002-07-25 Takayuki Toshima Substrate processing apparatus and substrate processing method
JP2003007664A (ja) * 2001-06-22 2003-01-10 Ses Co Ltd 枚葉式基板洗浄方法および枚葉式基板洗浄装置
US6770424B2 (en) * 2002-12-16 2004-08-03 Asml Holding N.V. Wafer track apparatus and methods for dispensing fluids with rotatable dispense arms
JP4441530B2 (ja) * 2003-03-20 2010-03-31 ラム・リサーチ・アクチエンゲゼルシヤフト ディスク形状の物体を湿式処理するための装置及び方法
US7187002B2 (en) * 2004-02-02 2007-03-06 Matsushita Electric Industrial Co., Ltd. Wafer collective reliability evaluation device and wafer collective reliability evaluation method
JP4343022B2 (ja) * 2004-05-10 2009-10-14 東京エレクトロン株式会社 基板の処理方法及び基板の処理装置
US20070289534A1 (en) * 2006-05-30 2007-12-20 Applied Materials, Inc. Process chamber for dielectric gapfill
JP5194125B2 (ja) * 2007-09-25 2013-05-08 ラム リサーチ コーポレーション シャワーヘッド電極アセンブリ用の温度制御モジュール、シャワーヘッド電極アセンブリ及びシャワーヘッド電極アセンブリの上部電極の温度を制御する方法
KR101554123B1 (ko) * 2008-03-21 2015-09-18 어플라이드 머티어리얼스, 인코포레이티드 차폐식 리드 히터 조립체
US8926788B2 (en) * 2010-10-27 2015-01-06 Lam Research Ag Closed chamber for wafer wet processing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015135798A1 (fr) * 2014-03-12 2015-09-17 Von Ardenne Gmbh Ensemble de recouvrement de chambre de traitement et ensemble de chambre de traitement

Also Published As

Publication number Publication date
US20130008602A1 (en) 2013-01-10
TW201304041A (zh) 2013-01-16
KR20140040208A (ko) 2014-04-02
WO2013005155A3 (fr) 2015-08-06
KR102007546B1 (ko) 2019-08-05
TWI569345B (zh) 2017-02-01

Similar Documents

Publication Publication Date Title
US20130008602A1 (en) Apparatus for treating a wafer-shaped article
US8926788B2 (en) Closed chamber for wafer wet processing
US10056287B2 (en) Apparatus for treating surfaces of wafer-shaped articles
US9548223B2 (en) Apparatus for treating surfaces of wafer-shaped articles
TWI455225B (zh) 多層式負戴鎖定室與傳送腔及適於接合上述的機械臂
SG180066A1 (en) Single side workpiece processing
US20130101372A1 (en) Method and apparatus for processing wafer-shaped articles
KR20080002633A (ko) 반도체공정장치
US11856655B2 (en) Substrate processing apparatus and substrate processing method
KR20200118401A (ko) 웨이퍼 형상 물품들의 액체 처리를 위한 장치
US20060141809A1 (en) Single side workpiece processing
KR20050019928A (ko) 기판 처리 용기
KR101979604B1 (ko) 기판 처리 방법
KR20240106091A (ko) 기판처리용기 및 기판처리장치
KR101520991B1 (ko) 액처리 장치 및 액처리 방법
KR101053992B1 (ko) 기판 처리 장치
KR101458963B1 (ko) 급속 열처리장치용 히터장치
KR101909180B1 (ko) 반송유닛 및 기판 처리 장치
KR101895406B1 (ko) 반송유닛 및 기판 처리 장치
KR101910910B1 (ko) 반송유닛 및 기판 처리 장치

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12808142

Country of ref document: EP

Kind code of ref document: A2

ENP Entry into the national phase

Ref document number: 20147000452

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 12808142

Country of ref document: EP

Kind code of ref document: A2