WO2013002503A3 - 발광 다이오드의 제조 방법 및 장치 - Google Patents

발광 다이오드의 제조 방법 및 장치 Download PDF

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Publication number
WO2013002503A3
WO2013002503A3 PCT/KR2012/004793 KR2012004793W WO2013002503A3 WO 2013002503 A3 WO2013002503 A3 WO 2013002503A3 KR 2012004793 W KR2012004793 W KR 2012004793W WO 2013002503 A3 WO2013002503 A3 WO 2013002503A3
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
emitting diode
manufacturing
substrate
reflective layer
Prior art date
Application number
PCT/KR2012/004793
Other languages
English (en)
French (fr)
Other versions
WO2013002503A2 (ko
Inventor
최한섭
김승규
Original Assignee
(주)큐엠씨
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020110063829A external-priority patent/KR101161731B1/ko
Priority claimed from KR1020110067924A external-priority patent/KR101091027B1/ko
Application filed by (주)큐엠씨 filed Critical (주)큐엠씨
Publication of WO2013002503A2 publication Critical patent/WO2013002503A2/ko
Publication of WO2013002503A3 publication Critical patent/WO2013002503A3/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H01L33/46—Reflective coating, e.g. dielectric Bragg reflector

Landscapes

  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Devices (AREA)
  • Dicing (AREA)

Abstract

발광 다이오드의 제조 방법으로서, 기판의 일면에 반사막이 형성된 발광 다이오드를 마련하는 공정, 상기 반사막의 일부를 제거하여 기판의 일부 영역을 노출시키는 공정, 및 상기 노출된 기판의 일부 영역을 통해 상기 기판의 내부에 레이저 빔을 집광시킴으로써 상기 기판을 스크라이빙(scribing)하는 공정을 포함하는 것을 특징으로 하는 발광 다이오드의 제조 방법을 제공한다.
PCT/KR2012/004793 2011-06-29 2012-06-18 발광 다이오드의 제조 방법 및 장치 WO2013002503A2 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2011-0063829 2011-06-29
KR1020110063829A KR101161731B1 (ko) 2011-06-29 2011-06-29 레이저 가공장치 및 가공방법
KR1020110067924A KR101091027B1 (ko) 2011-07-08 2011-07-08 발광 다이오드의 제조 방법 및 장치
KR10-2011-0067924 2011-07-08

Publications (2)

Publication Number Publication Date
WO2013002503A2 WO2013002503A2 (ko) 2013-01-03
WO2013002503A3 true WO2013002503A3 (ko) 2013-02-28

Family

ID=47424629

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2012/004793 WO2013002503A2 (ko) 2011-06-29 2012-06-18 발광 다이오드의 제조 방법 및 장치

Country Status (2)

Country Link
TW (1) TW201304194A (ko)
WO (1) WO2013002503A2 (ko)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003133565A (ja) * 2001-10-22 2003-05-09 Sanyo Electric Co Ltd 光起電力装置の製造方法、及び加工装置
KR20040063128A (ko) * 2001-10-22 2004-07-12 오리올 인코포레이티드 반사층을 갖는 다이오드 제조방법
KR20050000836A (ko) * 2003-06-25 2005-01-06 삼성전기주식회사 질화 갈륨계 발광 다이오드 소자의 제조 방법
KR20070043708A (ko) * 2004-08-18 2007-04-25 히다치 비아 메카닉스 가부시키가이샤 다층 가공물을 레이저 드릴링하는 방법
KR100984727B1 (ko) * 2010-04-30 2010-10-01 유병소 대상물 가공 방법 및 대상물 가공 장치
KR20110062884A (ko) * 2009-12-04 2011-06-10 티에스씨멤시스(주) 레이저 가공장치 및 가공방법

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003133565A (ja) * 2001-10-22 2003-05-09 Sanyo Electric Co Ltd 光起電力装置の製造方法、及び加工装置
KR20040063128A (ko) * 2001-10-22 2004-07-12 오리올 인코포레이티드 반사층을 갖는 다이오드 제조방법
KR20050000836A (ko) * 2003-06-25 2005-01-06 삼성전기주식회사 질화 갈륨계 발광 다이오드 소자의 제조 방법
KR20070043708A (ko) * 2004-08-18 2007-04-25 히다치 비아 메카닉스 가부시키가이샤 다층 가공물을 레이저 드릴링하는 방법
KR20110062884A (ko) * 2009-12-04 2011-06-10 티에스씨멤시스(주) 레이저 가공장치 및 가공방법
KR100984727B1 (ko) * 2010-04-30 2010-10-01 유병소 대상물 가공 방법 및 대상물 가공 장치

Also Published As

Publication number Publication date
TW201304194A (zh) 2013-01-16
WO2013002503A2 (ko) 2013-01-03

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