WO2012171468A1 - 组合式照明装置 - Google Patents

组合式照明装置 Download PDF

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Publication number
WO2012171468A1
WO2012171468A1 PCT/CN2012/076938 CN2012076938W WO2012171468A1 WO 2012171468 A1 WO2012171468 A1 WO 2012171468A1 CN 2012076938 W CN2012076938 W CN 2012076938W WO 2012171468 A1 WO2012171468 A1 WO 2012171468A1
Authority
WO
WIPO (PCT)
Prior art keywords
lighting device
intermediate sleeve
module
snap
lamp body
Prior art date
Application number
PCT/CN2012/076938
Other languages
English (en)
French (fr)
Inventor
陈明允
洪作财
Original Assignee
东莞巨扬电器有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN2011201995235U external-priority patent/CN202118611U/zh
Priority claimed from CN2011201994872U external-priority patent/CN202118609U/zh
Priority claimed from CN201120199524XU external-priority patent/CN202165851U/zh
Priority claimed from CN2011201995220U external-priority patent/CN202118610U/zh
Priority claimed from CN201120199525U external-priority patent/CN202140839U/zh
Application filed by 东莞巨扬电器有限公司 filed Critical 东莞巨扬电器有限公司
Priority to EP12800273.0A priority Critical patent/EP2722577A4/en
Priority to JP2014515047A priority patent/JP2014518433A/ja
Priority to US14/126,378 priority patent/US9285095B2/en
Publication of WO2012171468A1 publication Critical patent/WO2012171468A1/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V1/00—Shades for light sources, i.e. lampshades for table, floor, wall or ceiling lamps
    • F21V1/14—Covers for frames; Frameless shades
    • F21V1/146—Frameless shades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
    • F21V17/164—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting the parts being subjected to bending, e.g. snap joints
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • F21V23/002—Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/04—Arrangement of electric circuit elements in or on lighting devices the elements being switches
    • F21V23/0442—Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by means of a sensor, e.g. motion or photodetectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/04—Arrangement of electric circuit elements in or on lighting devices the elements being switches
    • F21V23/0442—Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by means of a sensor, e.g. motion or photodetectors
    • F21V23/0471—Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by means of a sensor, e.g. motion or photodetectors the sensor detecting the proximity, the presence or the movement of an object or a person
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/30—Elongate light sources, e.g. fluorescent tubes curved
    • F21Y2103/33—Elongate light sources, e.g. fluorescent tubes curved annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to the field of lighting technology, and more particularly to a combined lighting device that utilizes a snap-fit structure for engagement.
  • a general light bulb basically includes at least a lamp cover, a lamp body, a lamp cap, and a light-emitting module. If the light bulb is a multi-function light bulb, it is necessary to provide more components in the light bulb. Generally, the components in the bulb are joined by means of screwing or glue bonding. However, since each component in the bulb is a small-volume component, it is difficult to screw or dispense. The assembly time is long and the production efficiency is low.
  • the material of the glue itself is susceptible to high temperature and deforms and melts, so that the components that are originally fixed by the glue are displaced and damaged, and the reliability is low.
  • the main object of the present invention is to provide a combined lighting device that allows an assembler to mount a lamp body and a lamp cap module by means of a mating latching mechanism formed on the lamp body and the lamp cap module.
  • Direct card assembly not only easy to assemble, but also improve assembly efficiency and improve product reliability.
  • Another object of the present invention is to provide a combined lighting device, which allows an assembler to directly assemble and assemble a lamp body and an induction and driving module by a matching locking mechanism formed on the lamp body and the sensing module. It also improves assembly efficiency and product reliability.
  • the technical solution provided by the present invention is to provide a combined lighting device comprising a lamp body having a receiving hole and an intermediate sleeve disposed in the receiving hole, wherein the intermediate sleeve has a first a latching structure; a base module having a second latching structure; and an LED lighting module disposed on the lamp body; wherein the second latching structure of the base module and the intermediate sleeve
  • the first snap-fit structures are assembled to each other.
  • the combined lighting device further comprises a transparent lamp cover, and the transparent lamp cover covers the light emitting module and is connected to the lamp body.
  • the lamp body includes a light cup, the inner surface of the light cup defines the receiving hole, the intermediate sleeve is disposed in the receiving hole, and the first engaging structure is formed at one end of the intermediate sleeve And the second latching structure is assembled with the second latching structure; wherein the first latching structure is a latching slot, the second latching structure is a latching bump, and the latching latch is latched Connect the slot to the card.
  • the combined lighting device further includes an inductive and driving module
  • the sensing and driving module comprises a first circuit board, an inductive device, a driving integrated chip and a transformer, and the sensing device and the driving integrated device
  • the chip and the transformer are disposed on the first circuit board; wherein at least a portion of the first circuit board is disposed in the intermediate sleeve.
  • the lamp body further comprises a heat dissipating block, the two ends of the heat dissipating block respectively abut the inner side surface of the lamp cup and the driving integrated chip and/or the transformer on the first circuit board.
  • the lamp body further comprises a silicone gasket, the silicone gasket is sandwiched between the heat dissipation block and the driving integrated chip, and/or the silicone gasket is sandwiched between the heat dissipation block and the transformer. between.
  • the intermediate sleeve further has a third snap-fit structure
  • the induction and drive module further includes a joint assembly having a fourth snap-fit structure, the fourth snap-fit structure of the joint assembly and the middle
  • the third latching structure of the sleeve is assembled with each other; wherein the sensing device is a microwave
  • the sensing and driving module when the sensing component is coupled to the sensing device; or when the sensing device is a human body infrared (PIR) sensing component, the sensing and driving module further includes a hood, and the bonding component is coupled to the Hood.
  • PIR human body infrared
  • the third snap-fit structure is formed at the other end of the end portion of the intermediate sleeve to be assembled with the fourth snap-fit structure on the joint assembly; wherein the third card
  • the connecting structure is a fastening leg, and the fourth clamping structure is a fastening position, and the fastening pin is stuck in the fastening position.
  • the base module comprises a base inner tube, a conductor outer casing and a conductive element.
  • the conductor outer casing is sleeved on an outer surface of the inner sleeve of the base, and the conductive element is inserted into a bottom surface of the inner tube of the base.
  • the lamp body further includes a first conductive pin and a second conductive pin, and the first conductive pin and the first end of the second conductive pin are electrically connected to the first circuit board respectively The two electrodes; wherein the conductor shell is screwed to the inner tube of the lamp cap, and the second end of the first conductive pin protrudes into the A gap between the conductor housing and the inner tube of the lamp cap electrically connects the second end of the first conductive pin to the conductor housing.
  • the lamp body further includes a first conductive pin and a second conductive pin, and the first conductive pin and the first end of the second conductive pin are electrically connected to the first circuit board respectively
  • the conductive element is disposed at a bottom of the inner tube of the base, and the conductive element is at least partially exposed outside the inner tube of the base, so that the second end of the second conductive pin is inserted
  • the connection hole is electrically connected to the conductive element.
  • the light emitting module has a second circuit board, and the height of the second circuit board near the central portion is greater than the height near the edge portion.
  • the lamp body further comprises a high thermal conductivity alloy heat sink, and the light emitting module is disposed on the high thermal conductivity alloy heat sink of the lamp body.
  • a further preferred embodiment of the present invention provides a combined lighting device, comprising: a lamp body having a receiving hole and an intermediate sleeve disposed in the receiving hole, wherein the intermediate sleeve has a first a card-connecting structure; an LED lighting module disposed on the lamp body; and a sensing and driving module comprising: a sensing device and a bonding component, the bonding component having a second carding structure; wherein the component of the bonding component The two snap-fit structure and the first snap-fit structure of the intermediate sleeve are assembled with each other.
  • the combined lighting device further comprises a transparent lamp cover, and the transparent lamp cover covers the light emitting module and is connected to the lamp body.
  • the lamp body includes a light cup, the inner surface of the light cup defines the receiving hole, the intermediate sleeve is disposed in the receiving hole, and the first engaging structure is formed at one end of the intermediate sleeve And the second latching structure of the bonding component is assembled with each other; wherein, when the sensing device is a microwave (wave) sensing component, the bonding component is coupled to the sensing device; or, the sensing device is a human body infrared (PIR), the sensing and driving module further includes a hood, and the bonding component is coupled to the hood; wherein the first fastening structure is a fastening leg, and the second fastening structure is fastened Bit, and the buckle pin is stuck in the buckle position.
  • the sensing device is a microwave (wave) sensing component
  • the bonding component is coupled to the sensing device
  • the sensing device is a human body infrared (PIR)
  • the sensing and driving module further includes a hood, and the bonding component is
  • the combined lighting device further includes a base module, the intermediate sleeve has a third snap-fit structure, the base module has a fourth snap-fit structure, and the fourth snap-fit structure of the base module The third snap-fit structure of the lamp body is engaged with each other.
  • the third snap-fit structure is formed at the other end of the end portion of the intermediate sleeve to be assembled with the fourth snap-fit structure of the base module; wherein the third snap-fit
  • the structure is a card slot
  • the fourth card structure is a latching bump
  • the latching bump is latched in the latching slot.
  • a further preferred embodiment of the present invention provides a combined lighting device, comprising: a lamp body having a receiving hole and an intermediate sleeve disposed in the receiving hole, wherein the intermediate sleeve has a first The latching structure and the second latching structure are respectively disposed at opposite ends of the intermediate sleeve; an LED lighting module is disposed on the lamp body; and an sensing and driving module includes a sensing device and a combined component,
  • the bonding assembly has a third latching structure to be assembled with the first latching structure; and a base module having a fourth latching structure to be assembled with the second latching structure.
  • the combined lighting device of the present invention can easily assemble the lamp body and the lamp cap module and/or the sensing and driving module by the engaging mechanism formed on the lamp body and the lamp cap module and/or the sensing and driving module. It is directly assembled and assembled without the need of screwing or glue bonding. It is not only easy to assemble, but also has high assembly efficiency, short assembly time and improved reliability.
  • Figure 1 is a perspective view of a combined lighting device of the present invention:
  • Fig. 2 is an overall perspective exploded view showing the first embodiment of the combined lighting device of the present invention.
  • Fig. 3 is a partially exploded perspective view showing the first embodiment of the combined lighting device of the present invention.
  • 4 is a cross-sectional view of the first embodiment of the combined lighting device of the present invention taken along the A-A axis.
  • ⁇ is a schematic cross-sectional view of the other direction of the A-A axis
  • Figure 6 is another perspective exploded view of the first embodiment of the combined lighting device of the present invention.
  • Figure 7 is a schematic perspective view of the second embodiment of the combined lighting device of the present invention.
  • Figure 8 is a perspective view of a second embodiment of the combined lighting device of the present invention.
  • Figure 9 is a perspective view showing a third embodiment of the combined lighting device of the present invention.
  • Figure 10 is a cross-sectional view showing a first embodiment of the combined lighting device of the present invention.
  • Figure 11 is an exploded perspective view showing a third embodiment of the combined lighting device of the present invention. detailed description
  • FIG. 1 is a perspective view of a combined lighting device of the present invention
  • FIG. 2 is an overall perspective exploded view of the first embodiment of the combined lighting device of the present invention
  • the combined lighting device 1 of the present invention comprises a lamp body 11, a lamp cap module 15, an LED lighting module 13, and a transparent lamp cover 17.
  • the lamp head module 15 is disposed at one end of the lamp body 11, and the transparent lamp cover 17
  • the LED light-emitting module 13 is covered, so that the transparent light cover 17 and the LED light-emitting module 13 are disposed at the other end of the lamp body 11 with respect to the base module 15.
  • the lamp body 11 includes a lamp cup 110 and an intermediate sleeve 113.
  • the inner side surface of the lamp cup 110 defines a receiving hole 111 for the intermediate sleeve 113 to pass through.
  • FIG. 3 is a partially exploded perspective view of a first embodiment of a combined lighting device of the present invention
  • FIG. 4 is a cross-sectional view of the first embodiment of the combined lighting device of the present invention taken along line AA of FIG.
  • the intermediate sleeve 113 has a first engaging structure 113a
  • the base module 15 has a second engaging structure 15a
  • the first engaging structure 113a and the second engaging structure 15a are correspondingly coupled to each other.
  • the first snap-fit structure 113a of the intermediate sleeve 113 is a snap-fit slot
  • the second snap-fit structure 15a of the base module 15 is a snap-fit bump. Therefore, if the assembler wants to connect the base module 15 to the lamp body 11, it is only necessary to perform a simple corresponding pressing on the base module 15 or the lamp body 11, that is, the second latching structure 15a of the base module 15 can be The first snap-fit structure 113a of the intermediate sleeve 113 of the lamp body 11 is fixed.
  • first latching structure 113a is a latching slot
  • second latching structure 15a is a latching bump
  • the combined lighting device 1 of the present invention further includes an inductive and driving module 19, and the sensing and driving module 19 includes a first circuit board 190, an inductive device 191, a driving integrated chip 192, a transformer 193, and a The component 194 is coupled, and the sensing device 191, the driving integrated chip 192, and the transformer 193 are all disposed on the first circuit board 190. Furthermore, at least a portion of the first circuit board 190 is disposed in the intermediate sleeve 113, whereby the assembly is limited to avoid assembly limitations due to the problem of the volume of the first circuit board 190 itself. As a result, the availability of space is greatly improved, making the installation of components more flexible.
  • the intermediate sleeve 113 has a first engaging structure 113a to be coupled to the second engaging structure 15a of the base module 15.
  • the intermediate sleeve 113 further has a third latching structure 113b, and the third latching structure 113b and the first latching structure 113a are preferably disposed at opposite ends of the intermediate sleeve 113, respectively.
  • the coupling assembly 194 has a fourth snap-fit structure 194a, and the fourth snap-fit structure 194a of the combination assembly 194 and the third snap-fit structure 113b of the intermediate sleeve 113 are coupled to each other.
  • the sensing device 191 is a human body. Infrared (PIR) sensing element; In the embodiment of the invention applying the second sensing device, the sensing device 191 is a microwave sensing element.
  • PIR Infrared
  • FIG. 6 is another perspective exploded view of the first embodiment of the combined lighting device of the present invention, and please refer to Figures 2 and 6 in combination.
  • the sensing device 191 is a human body infrared (PIR) sensing element. Therefore, the sensing and driving module 19 further includes a hood 197 for shielding the human body infrared sensing element 191 by the hood 197, so that the human body infrared sensing element 191 can be prevented from being disturbed by the light or heat of the light emitting module 13.
  • PIR human body infrared
  • the top end of the transparent lamp cover 17 is formed with an opening 17a, and the hood 197 is disposed through the opening 17a for better detection of the field of view, and the top end of the hood 197 is provided with a lens 197a. .
  • the hood 197 may be assembled with the coupling assembly 194 or may be integrally formed with the coupling assembly 194 as shown in this embodiment.
  • the fourth snap-fit structure 194a of the joint assembly 194 and the third snap-fit structure 113b of the intermediate sleeve 113 of the lamp body 11 are assembled to each other such that the hood 197 is coupled to the intermediate sleeve 113 by the joint assembly 194.
  • the third engaging structure 113b is a fastening leg
  • the fourth fastening structure 194a is a fastening position, wherein the assembler can easily buckle the buckle by a pushing action. Pick up.
  • the third fastening structure 113b is a fastening leg
  • the fourth fastening structure 194a is a fastening position, which is only an example, and the actual implementation manner is not limited thereto.
  • the outer surface of the lamp cup 110 is formed with a plurality of heat dissipation fins, and the lamp cup 110 is preferably made of a metal material and assists in heat dissipation by heat conduction.
  • the lamp body 11 further includes a heat dissipating block 115. The two ends of the heat dissipating block 115 respectively abut the inner side surface of the lamp cup 110 and the driving integrated chip 192 and/or the transformer 193 on the first circuit board 190 to help drive the integrated chip 192. And the transformer 193 performs a heat dissipation operation.
  • the intermediate sleeve 113 is provided with at least one through hole 113c on the side of the intermediate sleeve 113 for the heat dissipation block 115 to pass through the through hole 113c. Both ends of the heat sink block 115 respectively abut the lamp cup 110 and drive the integrated chip 192 and/or the transformer 193.
  • the lamp body 11 further includes a silicone gasket 118, and the heat dissipation block 115 can be in indirect contact with the component to be dissipated through the silicone gasket 118.
  • the silicone gasket 118 can be sandwiched between the heat dissipation block 115 and the driving integrated chip 192 and/or the transformer 193; wherein, because the silicone gasket 118 is flexible and easy to conduct heat, it can be attached to Different levels of driver integrated chip 192 and/or transformer 193 and/or other components.
  • the base module 15 includes a base inner tube 151, a conductor housing 153, and a conductive member 155.
  • the conductor housing 153 is sleeved on the outer surface of the inner tube 151 of the base, and the conductive member 155 is inserted into the inner tube of the base. A bottom surface of 151.
  • the inner tube 151 of the lamp cap is an insulating material, and after the conductor shell 153 and the conductive member 155 are respectively coupled with the inner tube 151 of the cap, the conductor shell 153 and the conductive member 155 can be used as two electrical contacts electrically connected to a power source.
  • the lamp body 11 further includes a first conductive pin 116 and a second conductive pin 117.
  • the first ends of the first conductive pin 116 and the second conductive pin 117 are electrically connected to the first circuit.
  • the second ends of the first conductive pin 116 and the second conductive pin 117 are described next.
  • the second end of the first conductive pin 116 extends into the gap between the conductor housing 153 and the inner tube 151 of the base, since the conductor housing 153 is sleeved in the inner tube 151 of the base, that is, the conductor housing 153 is used as an electrical contact.
  • the second end of the first conductive pin 116 is electrically connected to the conductor housing 153.
  • the conductive element 155 is disposed through a connecting hole 151a defined by the bottom of the inner tube 151 of the lamp cap, so that the conductive element 155 is at least partially exposed outside the inner tube 151 of the lamp cap as another electrical contact.
  • the second end of the second conductive pin 117 is inserted into the connecting hole 151a to be electrically connected to the conductive element 155.
  • the first conductive pin 116 and the second conductive pin are electrically connected by abutting the conductor housing 153 and the conductive member 155 respectively, which is more convenient to assemble, without using a soldering tool, and further capable of Increase production efficiency and reduce costs.
  • any electrical connection between the first circuit board 190 and the conductor housing 153 and the conductive member 155 can be used as an alternative to the present invention, and is not limited to the foregoing embodiments.
  • FIG. 7 is a schematic perspective view of a second embodiment of a combined lighting device according to a second embodiment of the present invention.
  • FIG. 8 is a perspective view of a second embodiment of the combined lighting device of the present invention.
  • the combined lighting device 2 includes a lamp body 21, a light emitting module 23, an induction and driving module 29, a lamp head module 27, and a transparent lamp cover 28. Since the structure and function of the lamp body 21, the light-emitting module 23 and the lamp cap module 27 are similar to those of the previous embodiment, they will not be described in detail herein.
  • the sensing and driving module 29 includes an inductive device 291 and a first circuit board 290.
  • this embodiment uses different sensing devices 291, so that there must be a corresponding structural change with other components in the installation.
  • the first circuit board 290 in this embodiment is a driving circuit board.
  • the sensing device 291 is a microwave sensing element including an upper cover 291a, an antenna module 291b, an amplifying circuit board 291c, and a lower cover 291d.
  • the antenna module 291b and the amplifying circuit board 291c are combined with each other, and the antenna module 291b and the amplifying circuit board 291c are interposed between the upper cover case 291a and the lower cover case 291d.
  • the upper cover 291a is a combined component.
  • the amplifying circuit board 291c of the sensing device 291 has a male connector 2910.
  • the first circuit board 290 has a female connector slot 2900.
  • the male connector connector 2910 and the female connector slot 2900 cooperate with each other to enlarge the sensing device 291.
  • the circuit board 291c is electrically connected to the first circuit board 290.
  • the connection manner is only an example, and those skilled in the art can also use other methods of card bonding or soldering, which are not limited herein.
  • the combined illumination device 2 can control the flashing of the illumination module 23 by the microwave sensing element to determine whether the surrounding environment is moving or not, to achieve the energy saving effect.
  • the lamp body 21 of the combined lighting device 2 of the present embodiment includes an intermediate sleeve 213.
  • the upper cover 291a has a fourth snap-fit structure 2911 and is coupled to the third snap-fit structure 213b of the intermediate sleeve 213 to connect the sensing device 291 and the intermediate sleeve 213 to each other.
  • the third latching structure 213b of the intermediate sleeve 213 and the fourth latching structure 2911 of the upper cover shell 291a respectively form corresponding hooks and slots, and the corresponding structural design. , there are no restrictions here.
  • FIG. 9 is a perspective view of a third embodiment of a combined lighting device of the present invention
  • FIG. 10 is a cross-sectional view of a third embodiment of the combined lighting device of the present invention
  • FIG. 11 is a third embodiment of the combined lighting device of the present invention. Schematic diagram of the decomposition.
  • the combined lighting device 3 includes a lamp body 31, an LED lighting module 33 and an sensing and driving module 39. Similar to the arrangement of the first two embodiments, in the present embodiment, the lamp body 31 has an intermediate sleeve 313 and can be received in a receiving hole 311 defined by the lamp body 31.
  • the intermediate sleeve 313 has a first engaging structure 313b and a second engaging structure (not shown) formed at opposite ends of the intermediate sleeve 313 to respectively engage with the coupling assembly 394 of the sensing and driving module 39.
  • the third snap-fit structure 394a and the fourth snap-fit structure (not shown) on the base module 35 are coupled to each other.
  • the LED lighting module 33 includes a second electric power provided with a plurality of LED lighting elements 331
  • the circuit board 330, and the second circuit board 330 in addition to being disposed as a flat flat plate, may be modified such that the height of the second circuit board 330 near the central portion is greater than the height near the edge portion. In other words, by forming a height difference to increase the range of the illumination angle of the second circuit board 330 and increasing the illumination brightness, this is also a possible implementation. Further, the second circuit board 330 is swelled from the edge portion toward the central portion at an angle of 5 degrees to obtain an optimum illumination range and brightness.
  • the lamp body 31 includes a lamp cup 310.
  • the lamp cup 310 includes a high thermal conductivity alloy heat sink 310a and an aluminum heat sink 310b.
  • the alloy heat sink 310a is connected to the top of the aluminum heat sink 310b, and the aluminum heat sink 310b is The appearance is a radial fin set for good heat dissipation.
  • a mounting plane 310c is formed on the other side of the alloy heat sink 310a with respect to the aluminum heat sink 310b, and the second circuit board 330 can be quickly placed in a conductive manner by the second circuit board 330 by being disposed on the mounting plane 310c. The heat generated by 330 is dissipated.
  • the alloy heat sink 310a and the aluminum heat sink 310b may be integrally formed or assembled in an assembled manner.
  • the alloy heat sink 310a can be made of an aluminum alloy heat sink made of a free aluminum alloy material, or a magnesium-lithium alloy heat sink made of a magnesium-lithium alloy material, or an aluminum made of an aluminum-magnesium alloy material.
  • the sensing and driving module 39 further includes a photo sensor 395, and the photo sensor 395 is adjacent to the sensing device 391.
  • the function of the photo sensor 395 is to detect ambient light to determine that if the ambient environment is insufficient in the light source, the signal can be sent to the first circuit board 390 and the LED light-emitting element 331 can be controlled to supplement the light. action.
  • the combined lighting device of the present invention allows the assembler to directly snap-fit the lamp body and the lamp cap module by using a matching latching mechanism formed on the lamp body and the lamp cap module, without the need for use.
  • the screwing or glue bonding makes the assembly man-hours shorter and the reliability is improved.

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Abstract

一种组合式照明装置，包括灯体（11）、灯头模块（15）以及LED发光模块（13）。LED发光模块（13）设置于灯体（11）上，且灯体（11）具有收纳孔（111）与设置于收纳孔（111）内的中间套筒（113）。中间套筒（113）包括第一卡接结构（113a）。灯头模块（15）具有第二卡接结构（15a）。第二卡接结构（15a）与第一卡接结构（113a）适合相互组接。以此结构，制造者能以卡合方式来取代螺丝螺接或胶水黏合方式。

Description

技术领域
本发明关于照明技术领域， 尤其是涉及一种利用卡接结构作卡合的组合 式照明装置。 龍
一般的灯泡基本上至少包括有灯罩、 灯体、 灯头以及发光模块等部件， 倘若灯泡为一多功能灯泡， 则势必要在灯泡内设置更多的元件。 一般而言， 在灯泡内的各个元件之间是利用螺丝螺接或者胶水黏合等连接方式作接合， 然而， 由于灯泡内的各个元件皆是小体积的元件， 使得螺接或点胶不易， 因 此造成组装的工时长， 且生产效率低下。
此外， 若灯泡使用一段时间后产生高热， 由于胶水本身的物质特性， 易 受高温影响而变形融化，而使得原本以胶水固接的各个元件产生位移及损坏， 可靠度低。
有鉴于此， 提供一种照明装置， 其能减省使用螺丝以及胶水的使用， 且 能使得组装上又能方便及省时， 此乃为业界亟待解决的问题。 发明内容
针对现有技术存在的不足， 本发明的主要目的在于提供一种组合式照明 装置， 令组装者可藉由形成于灯体及灯头模块上的相配合的卡接机构， 将灯 体与灯头模块直接卡接组装， 不但组装简单方便， 提高了组装的效率， 且提 高了产品的可靠度。
本发明的另一目的在于提供一种组合式照明装置， 令组装者可藉由形成 于灯体及感应模块上的相配合的卡接机构， 将灯体与感应及驱动模块直接卡 接组装， 亦一并提高组装的效率以及产品的可靠度。
为实现上述目的， 本发明采用的技术方案是提供一种组合式照明装置包 括一灯体， 具有一收纳孔与设置于该收纳孔内的一中间套筒， 其中， 该中间 套筒具有第一卡接结构； 一灯头模块， 具有第二卡接结构； 以及一 LED发光 模块， 设置于该灯体上； 其中， 该灯头模块的该第二卡接结构与该中间套筒 的该第一卡接结构相互组接。
较佳地， 所述组合式照明装置更包括一透明灯罩， 该透明灯罩罩设该发 光模块， 并与该灯体连接。
较佳地， 该灯体包括一灯杯， 该灯杯的内侧表面界定该收纳孔， 该中间 套筒穿设于该收纳孔， 且该中间套筒的一端部形成有该第一卡接结构， 以与 该灯头模块的该第二卡接结构相互组接； 其中， 该第一卡接结构为卡接槽， 该第二卡接结构为卡接凸块， 且该卡接凸块卡掣于该卡接槽。
较佳地， 所述组合式照明装置更包括一感应及驱动模块， 该感应及驱动 模块包括一第一电路板、 一感应装置、 一驱动集成芯片以及一变压器， 且该 感应装置、 该驱动集成芯片以及该变压器设置于该第一电路板上； 其中， 该 第一电路板的至少一部分穿设于该中间套筒内。
较佳地， 该灯体更包括散热块， 该散热块的两端分别抵触该灯杯的内侧 表面以及该第一电路板上的该驱动集成芯片及 /或该变压器。
较佳地， 该中间套筒的侧边开设有一穿孔， 以供该散热块穿设于其中。 较佳地， 该灯体更包括硅胶垫片， 该硅胶垫片被夹设于该散热块与该驱 动集成芯片之间， 及 /或该硅胶垫片被夹设于该散热块与该变压器之间。
较佳地， 该中间套筒更具有第三卡接结构， 该感应及驱动模块更包括一 结合组件， 该结合组件具有第四卡接结构， 该结合组件的该第四卡接结构与 该中间套筒的该第三卡接结构相互组接； 其中， 于该感应装置为微波
( Microwave ) 感应元件时， 该结合组件结合于该感应装置； 抑或， 于该感 应装置为人体红外线 （PIR ) 感应元件时， 该感应及驱动模块更包括一遮光 罩， 且该结合组件结合于该遮光罩。
较佳地，该第三卡接结构形成于相对于该中间套筒的该端部的另一端部， 以与该结合组件上的该第四卡接结构相互组接； 其中， 该第三卡接结构为扣 接脚， 该第四卡接结构为扣接位， 且该扣接脚卡掣于该扣接位。
较佳地， 该灯头模块包括一灯头内管、 一导体外壳以及一导电元件， 该 导体外壳环套于该灯头内套的外侧表面， 且该导电元件插设于该灯头内管的 一底面。
较佳地， 该灯体更包括一第一导电接脚以及一第二导电接脚， 该第一导 电接脚以及该第二导电接脚的第一端分别电连接于该第一电路板的该两电 极； 其中， 该导体外壳螺接于该灯头内管， 第一导电接脚的第二端伸入于该 导体外壳与该灯头内管的缝隙， 使该第一导电接脚的第二端与该导体外壳电 性连接。
较佳地， 该灯体更包括一第一导电接脚以及一第二导电接脚， 该第一导 电接脚以及该第二导电接脚的第一端分别电连接于该第一电路板的该两电 极； 其中， 该导电元件设置于该灯头内管的底部所界定的一连接孔， 该导电 元件至少部分显露于该灯头内管外， 使该第二导电接脚的第二端插入于该连 接孔且与该导电元件电性连接。
较佳地， 该发光模块具有一第二电路板， 且该第二电路板靠近中央部分 的高度大于靠近边缘部分的高度。
较佳地， 该灯体更包括一高热导率的合金散热片， 且该发光模块设置于 该灯体的该高热导率的合金散热片上。
本发明的再一较佳作法， 是提供一种组合式照明装置， 包括： 一灯体， 具有一收纳孔与设置于该收纳孔内之一中间套筒， 其中， 该中间套筒具有第 一卡接结构； 一 LED发光模块， 设置于该灯体上； 以及一感应及驱动模块， 包括一感应装置与一结合组件， 该结合组件具有第二卡接结构； 其中， 该结 合组件的该第二卡接结构与该中间套筒的该第一卡接结构相互组接。
较佳地， 所述组合式照明装置更包括一透明灯罩， 该透明灯罩罩设该发 光模块， 并与该灯体连接。
较佳地， 该灯体包括一灯杯， 该灯杯的内侧表面界定该收纳孔， 该中间 套筒穿设于该收纳孔， 且该中间套筒的一端部形成有该第一卡接结构， 以与 该结合组件的该第二卡接结构相互组接； 其中， 于该感应装置为微波 (Microwave ) 感应元件时， 该结合组件结合于该感应装置； 抑或， 于该感 应装置为人体红外线 （PIR ) 感应元件时， 该感应及驱动模块更包括一遮光 罩， 且该结合组件结合于该遮光罩； 其中， 该第一卡接结构为扣接脚， 该第 二卡接结构为扣接位， 且该扣接脚卡掣于该扣接位。
较佳地， 所述组合式照明装置更包括一灯头模块， 该中间套筒具有第三 卡接结构， 该灯头模块具有第四卡接结构， 且该灯头模块的该第四卡接结构 与该灯体的该第三卡接结构相互卡接。
较佳地，该第三卡接结构形成于相对于该中间套筒的该端部的另一端部， 以与该灯头模块的该第四卡接结构相互组接； 其中， 该第三卡接结构为卡接 槽， 该第四卡接结构为卡接凸块， 且该卡接凸块卡掣于该卡接槽。 本发明的再一较佳作法， 是提供一种组合式照明装置， 包括： 一灯体， 具有一收纳孔与设置于该收纳孔内的一中间套筒， 其中， 该中间套筒具有第 一卡接结构与第二卡接结构， 分设于该中间套筒的相对两端部； 一 LED发光 模块， 设置于该灯体上； 一感应及驱动模块， 包括一感应装置与一结合组件， 该结合组件具有第三卡接结构， 以与该第一卡接结构相互组接； 以及一灯头 模块， 具有第四卡接结构， 以与该第二卡接结构相互组接。
本发明组合式照明装置藉由形成于灯体与灯头模块和 /或感应及驱动模 块上的相配合的卡接机构，令组装者可轻易地将灯体与灯头模块和 /或感应及 驱动模块直接卡接组装， 而毋需使用螺丝螺接或者胶水黏合， 不但组装简单 方便， 组装效率高， 组装工时短， 且可靠度提高。 附图说明
图 1 为本发明组合式照明装置的立体:
图 2 为本发明组合式照明装置的第一 ^施例的整体立体分解示意图。 图 3 为本发明组合式照明装置的第一 ^施例的部分立体分解示意图。 图 4 为本发明组合式照明装置的第一实施例过 A - A轴线的剖面示意图。
为本发明组合式照明装置的第一; ^施例过 A-A轴线的另一方向的 剖面示意图
图 6 : 为本发明组合式照明装置的第一实施例的另一部分立体分解示意 图 7 : 为本发明组合式照明装置的第二 ：施例的整体立体分解示意图。 图 8 : 为本发明组合式照明装置的第二 ：施例的立体示意图。
图 9 : 为本发明组合式照明装置的第三 ：施例的立体示意图。
图 10 : 为本发明组合式照明装置的第 Ξ ^施例的剖面示意图。
图 11 : 为本发明组合式照明装置的第三 ^施例的分解示意图。 具体实施方式
请先参阅图 1以及图 2， 图 1为本发明组合式照明装置的立体示意图； 图 2为本发明组合式照明装置的第一实施例的整体立体分解示意图。 本发明 的组合式照明装置 1包括一灯体 11、 一灯头模块 15、 一 LED发光模块 13 以及一透明灯罩 17。 其中， 灯头模块 15设置于灯体 11的一端， 而透明灯罩 17罩设 LED发光模块 13，故透明灯罩 17与 LED发光模块 13则是相对于灯 头模块 15设置于灯体 11的另一端。再者， 灯体 11包括一灯杯 110以及一中 间套筒 113， 灯杯 110的内侧表面界定有一收纳孔 111， 以供中间套筒 113 穿设于其中。
图 3为本发明组合式照明装置的第一实施例的部分立体分解示意图， 图 4为本发明组合式照明装置的第一实施例过图 1的 A-A轴线的剖面示意图， 图 5为本发明组合式照明装置的第一实施例过图 1的 A-A轴线的另一方向的 剖面示意图； 并请合并参阅图 1至图 5。 其中， 中间套筒 113具有第一卡接 结构 113a， 灯头模块 15具有第二卡接结构 15a， 且第一卡接结构 113a与第 二卡接结构 15a为彼此相应配合。 举例而言， 于本实施例中， 中间套筒 113 的第一卡接结构 113a为卡接槽， 灯头模块 15的第二卡接结构 15a为卡接凸 块。 故若组装者欲将灯头模块 15组接于灯体 11上时， 仅需对灯头模块 15 或灯体 11执行简单的相对应推压， 即能使灯头模块 15的第二卡接结构 15a 卡接于灯体 11的中间套筒 113的第一卡接结构 113a， 完成固接。
当然，上述第一卡接结构 113a为卡接槽，第二卡接结构 15a为卡接凸块， 仅为一举例， 实际实施方式并不以此为限。
进一步而言， 本发明的组合式照明装置 1更包括一感应及驱动模块 19， 感应及驱动模块 19包括一第一电路板 190、 一感应装置 191、 一驱动集成芯 片 192、一变压器 193以及一结合组件 194， 且感应装置 191、 驱动集成芯片 192以及变压器 193皆设置于第一电路板 190上。 再者， 第一电路板 190的 至少一部分穿设于中间套筒 113内， 藉此设置， 则能避免因第一电路板 190 本身体积的问题而导致组装上受限。 如此一来， 使得空间上的可利用性大幅 地提高， 使得元件的装设更具灵活性。
承上所述， 中间套筒 113具有第一卡接结构 113a， 以与灯头模块 15的 第二卡接结构 15a相互组接。 除此之外， 中间套筒 113更具有一第三卡接结 构 113b，而第三卡接结构 113b与第一卡接结构 113a较佳为分别设置于中间 套筒 113的相对两端。 再者， 结合组件 194具有第四卡接结构 194a， 且结合 组件 194的第四卡接结构 194a与中间套筒 113的第三卡接结构 113b相互组 接。
于此需特别说明者为， 接下来将分别对两种不同的感应装置作实施例的 说明。 于本发明应用的第一种感应装置的实施例中， 感应装置 191为一人体 红外线 （PIR ) 感应元件； 于本发明应用第二种感应装置的实施例中， 感应 装置 191为一微波 （Microwave ) 感应元件。
图 6 为本发明组合式照明装置的第一实施例的另一部分立体分解示意 图， 并请合并参阅图 2以及图 6。 其中， 于本发明的第一实施例中， 感应装 置 191为一人体红外线 （PIR ) 感应元件。 因此， 感应及驱动模块 19更包括 一遮光罩 197， 藉遮光罩 197以围绕遮蔽人体红外线感应元件 191， 如此一 来即能避免人体红外线感应元件 191受到发光模块 13的光线或热能干扰。 其中， 为因应遮光罩 197的设置， 透明灯罩 17的顶端形成有一开孔 17a， 且 遮光罩 197穿设于开孔 17a， 藉以获得更好的侦测视野， 而遮光罩 197顶端 设置有一透镜 197a。
遮光罩 197可以与结合组件 194相互组接， 或者可以采用类似本实施例 所示与结合组件 194一体成形。 其中， 结合组件 194的第四卡接结构 194a 与灯体 11的中间套筒 113的第三卡接结构 113b相互组接， 以使遮光罩 197 藉由结合组件 194以连接至中间套筒 113。于此实施例中，第三卡接结构 113b 为扣接脚， 第四卡接结构 194a为扣接位， 其中， 组装者可藉由一推压动作而 轻易地使扣接脚卡掣于扣接位。
当然，上述第三卡接结构 113b为扣接脚，第四卡接结构 194a为扣接位， 仅为一举例， 实际实施方式并不以此为限。
接下来针对本发明组合式照明装置 1的散热手段作说明，请再参阅图 2、 图 4以及图 5。 其中， 灯杯 110外侧表面环绕形成有多个散热鳍片， 且灯杯 110较佳为金属材料所制成， 并以热传导的方式协助散热。 再者， 灯体 11更 包括散热块 115， 散热块 115的两端分别抵触灯杯 110的内侧表面以及第一 电路板 190上的驱动集成芯片 192及 /或变压器 193，以帮助驱动集成芯片 192 及变压器 193执行散热动作。 但由于中间套筒 113套设第一电路板 190， 故 于一较佳实施例中， 中间套筒 113的侧边开设有至少一穿孔 113c， 以供散热 块 115穿设于穿孔 113c， 以供散热块 115的两端分别抵触至灯杯 110以及驱 动集成芯片 192及 /或变压器 193。 除此之外， 灯体 11更包括硅胶垫片 118， 散热块 115可透过硅胶垫片 118与待散热元件间接接触。 举例而言， 硅胶垫 片 118可被夹设于散热块 115与驱动集成芯片 192及 /或变压器 193之间；其 中， 由于硅胶垫片 118为可挠且易导热的特性， 故能贴附于高低不同的驱动 集成芯片 192及 /或变压器 193及 /或其它元件上。 于本实施例中， 灯头模块 15包括一灯头内管 151、 一导体外壳 153以及 一导电元件 155， 导体外壳 153环套于灯头内管 151的外侧表面， 且导电元 件 155插设于灯头内管 151的一底面。 灯头内管 151为一绝缘物质， 导体外 壳 153以及导电元件 155分别与灯头内管 151作结合后， 导体外壳 153以及 导电元件 155即能作为与一电源作电性连接的两电性接点使用。
进一步而言， 灯体 11更包括一第一导电接脚 116以及一第二导电接脚 117，第一导电接脚 116以及第二导电接脚 117的第一端分别电性连接于第一 电路板 190的两电极 190a。
再者， 接下来针对第一导电接脚 116以及第二导电接脚 117的第二端作 说明。 其中， 由于导体外壳 153套合于灯头内管 151， 即以导体外壳 153作 为一电性接点， 故第一导电接脚 116的第二端伸入于导体外壳 153与灯头内 管 151的缝隙， 使第一导电接脚 116的第二端与导体外壳 153电性连接。
除此之外， 导电元件 155穿设于灯头内管 151的底部所界定的一连接孔 151a, 藉使导电元件 155至少部分显露于灯头内管 151外， 以作为另一电性 接点， 故第二导电接脚 117的第二端插入于连接孔 151a， 以与导电元件 155 电性连接。
藉由上述设置， 第一导电接脚 116与第二导电接脚藉由分别抵接至导体 外壳 153与导电元件 155而实行电性连接， 组装上更为方便， 无须使用焊接 工具， 且进一步能提高生产效率并降低成本。
当然， 只要能达到于第一电路板 190与导体外壳 153、 导电元件 155之 间实行一电性连接， 皆为本发明可予以使用的替代手段， 而不以前述实施方 式为限。
请参阅图 7， 其为本发明组合式照明装置的第二实施例的整体立体分解 示意图， 图 8为本发明组合式照明装置的第二实施例的立体示意图； 并请合 并参阅图 7及图 8。 于本实施例中， 组合式照明装置 2包括一灯体 21、 一发 光模块 23、 一感应及驱动模块 29、 一灯头模块 27以及一透明灯罩 28。 由于 灯体 21、 发光模块 23以及灯头模块 27的结构及功能上相似于前一实施例， 故于此不再详细赘述。
本实施例中， 感应及驱动模块 29包括一感应装置 291 以及一第一电路 板 290。 本实施例与前一实施例最主要的不同在于本实施例使用不同的感应 装置 291， 故会连带影响与其它元件于装设上必须有相应的结构改变。 举例 而言， 本实施例里的第一电路板 290即为一驱动电路板。
进一步而言， 感应装置 291为一微波 （Microwave ) 感应元件， 其包括 一上盖壳 291a、 一天线模块 291b、 一放大电路板 291c以及一下盖壳 291d。 天线模块 291b与放大电路板 291c相互组接， 且上盖壳 291a与下盖壳 291d 之间再夹设天线模块 291b与放大电路板 291c。 于此需特别说明者为， 上盖 壳 291a即为一结合组件。
接下来介绍感应装置 291与第一电路板 290的电性连接方式。 其中， 感 应装置 291的放大电路板 291c具有一阳性插接头 2910， 第一电路板 290具 有一阴性插接槽 2900， 阳性插接头 2910与阴性插接槽 2900互相配合， 以使 感应装置 291的放大电路板 291c与第一电路板 290呈电性连接。 当然， 此 连接方式仅为一例举，熟知本技术领域者亦可以采用其它方式的卡接或焊接， 于此不作限制。 藉此设置， 组合式照明装置 2即能以微波感应元件判断周围 环境是否有人走动的感测结果，来控制发光模块 23的闪灭， 以达到节能的效 果。
本实施例的组合式照明装置 2的灯体 21包括一中间套筒 213。 其中， 上 盖壳 291a具有第四卡接结构 2911， 并与中间套筒 213的第三卡接结构 213b 相互组接， 以使感应装置 291与中间套筒 213相互组接。 相似地， 于此实施 例中， 中间套筒 213 的第三卡接结构 213b与上盖壳 291a的第四卡接结构 2911亦分别形成相对应的卡勾及卡槽， 诸如此类相对应的结构设计， 于此不 作限制。
图 9为本发明组合式照明装置的第三实施例的立体示意图，图 10为本发 明组合式照明装置的第三实施例的剖面示意图，图 11为本发明组合式照明装 置的第三实施例的分解示意图。
请先参考图 10， 于本实施例中， 组合式照明装置 3包括一灯体 31、 一 LED发光模块 33与一感应及驱动模块 39。 相似于前两个实施例的设置， 于 本实施例中， 灯体 31具有一中间套筒 313并可容纳于由灯体 31所界定的一 容纳孔 311 内。 其中， 中间套筒 313具有第一卡接结构 313b与第二卡接结 构 （图未示）， 分别形成于中间套筒 313 的相对两端， 以分别与感应及驱动 模块 39的结合组件 394上的第三卡接结构 394a以及灯头模块 35上的第四卡 接结构 （图未示） 相互组接。
再者， LED发光模块 33包括设置有多个 LED发光元件 331的一第二电 路板 330， 而第二电路板 330除了为平直的平板设置外， 亦可被改变制作为， 第二电路板 330靠近中央部分的高度大于靠近边缘部分的高度。 换句话说， 即藉由形成一高度差， 以增大第二电路板 330的光照角度的范围， 并提升照 射亮度， 此亦为一种可能的实施方式。 进一步而言， 第二电路板 330以倾斜 5 度的角度， 自靠近边缘部分朝靠近中央部分隆起， 以获得最佳的光照范围 及亮度。
并请再参考图 9至图 11。 灯体 31包括一灯杯 310， 灯杯 310包括一高 热导率的合金散热片 310a以及铝散热器 310b ; 其中， 合金散热片 310a连接 设置于铝散热器 310b的顶部， 而铝散热器 310b的外观呈放射状鳍片组， 以 达到良好散热效果。 再者， 一安装平面 310c形成于合金散热片 310a相对于 铝散热器 310b的另一面， 且第二电路板 330藉由设置于安装平面 310c上， 便能够以传导的方式快速将第二电路板 330所产生的热散出。
于此须说明者为，合金散热片 310a与一铝散热器 310b可以是一体成型， 也可改以组装方式结合。较佳者， 合金散热片 310a可以选用自由铝合金材料 所制成的铝合金散热片， 抑或由镁锂合金材料所制成的镁锂合金散热片， 抑 或由铝镁合金材料所制成的铝镁合金散热片等等具有高导热系数的合金材料 中的任一者。
另外， 于本实施例中， 感应及驱动模块 39更包括一光感测器 395， 光感 测器 395邻设于感测装置 391。 其中， 光感测器 395的功用是用来侦测环境 光，以判别若周围环境处于光源不足的情况下，可送出信号至第一电路板 390 而后续进行控制 LED发光元件 331作补光的动作。
综上所述， 本发明组合式照明装置藉由形成于灯体及灯头模块上的相配 合的卡接机构， 令组装者可轻易地将灯体及灯头模块直接卡接组装， 而毋需 使用螺丝螺接或者胶水黏合， 使得组装工时缩短， 且可靠度提高。
以上所述仅为本发明的较佳实施例， 并非用以限定本发明的权利要求范 围， 因此凡其它未脱离本发明所揭示的精神下所完成的等效改变或修饰， 均 应包含于本发明的范围内。

Claims

权利要求书
1、 一种组合式照明装置， 包括：
一灯体， 具有一收纳孔与设置于该收纳孔内的一中间套筒； 其中， 该中 间套筒具有第一卡接结构；
一灯头模块， 具有第二卡接结构； 以及
一 LED发光模块， 设置于该灯体上；
其中， 该灯头模块的该第二卡接结构与该中间套筒的该第一卡接结构相 互组接。
2、 如权利要求 1所述的组合式照明装置， 更包括一透明灯罩， 该透明灯 罩罩设该发光模块， 并与该灯体连接。
3、 如权利要求 2所述的组合式照明装置， 其中该灯体包括一灯杯， 该灯 杯的内侧表面界定该收纳孔， 该中间套筒穿设于该收纳孔， 且该中间套筒的 一端部形成有该第一卡接结构，以与该灯头模块的该第二卡接结构相互组接; 其中， 该第一卡接结构为卡接槽， 该第二卡接结构为卡接凸块， 且该卡接凸 块卡掣于该卡接槽。
4、 如权利要求 3所述的组合式照明装置， 更包括一感应及驱动模块， 该 感应及驱动模块包括一第一电路板、 一感应装置、 一驱动集成芯片以及一变 压器，且该感应装置、该驱动集成芯片以及该变压器设置于该第一电路板上； 其中， 该第一电路板的至少一部分穿设于该中间套筒内。
5、 如权利要求 4所述的组合式照明装置， 其中该灯体更包括散热块， 该 散热块的两端分别抵触该灯杯的内侧表面以及该第一电路板上的该驱动集成 芯片及 /或该变压器。
6、如权利要求 5所述的组合式照明装置，其中该中间套筒的侧边开设有 一穿孔， 以供该散热块穿设于其中。
7、 如权利要求 5所述的组合式照明装置， 其中该灯体更包括硅胶垫片， 该硅胶垫片被夹设于该散热块与该驱动集成芯片之间，及 /或该硅胶垫片被夹 设于该散热块与该变压器之间。
8、如权利要求 4所述的组合式照明装置，其中该中间套筒更具有第三卡 接结构， 该感应及驱动模块更包括一结合组件， 该结合组件具有第四卡接结 构，该结合组件的该第四卡接结构与该中间套筒的该第三卡接结构相互组接； 其中， 于该感应装置为微波感应元件时， 该结合组件结合于该感应装置； 抑 或， 于该感应装置为人体红外线感应元件时， 该感应及驱动模块更包括一遮 光罩， 且该结合组件结合于该遮光罩。
9、如权利要求 8所述的组合式照明装置，其中该第三卡接结构形成于相 对于该中间套筒的该端部的另一端部， 以与该结合组件上的该第四卡接结构 相互组接； 其中， 该第三卡接结构为扣接脚， 该第四卡接结构为扣接位， 且 该扣接脚卡掣于该扣接位。
10、 如权利要求 4所述的组合式照明装置， 其中该灯头模块包括一灯头 内管、 一导体外壳以及一导电元件， 该导体外壳环套于该灯头内套的外侧表 面， 且该导电元件插设于该灯头内管的一底面。
11、如权利要求 10所述的组合式照明装置，其中该灯体更包括一第一导 电接脚以及一第二导电接脚， 该第一导电接脚以及该第二导电接脚的第一端 分别电连接于该第一电路板的该两电极； 其中， 该导体外壳螺接于该灯头内 管， 第一导电接脚的第二端伸入于该导体外壳与该灯头内管的缝隙， 使该第 一导电接脚的第二端与该导体外壳电性连接。
12、 如权利要求 10所述的组合式照明装置， 其中该灯体更包括一第一 导电接脚以及一第二导电接脚， 该第一导电接脚以及该第二导电接脚的第一 端分别电连接于该第一电路板的该两电极； 其中， 该导电元件设置于该灯头 内管的底部所界定的一连接孔， 该导电元件至少部分显露于该灯头内管外， 使该第二导电接脚的第二端插入于该连接孔且与该导电元件电性连接。
13、 如权利要求 1所述的组合式照明装置， 其中该发光模块具有一第二 电路板， 且该第二电路板靠近中央部分的高度大于靠近边缘部分的高度。
14、 如权利要求 1所述的组合式照明装置， 其中该灯体更包括一高热导 率的合金散热片，且该发光模块设置于该灯体的该高热导率的合金散热片上。
15、 一种组合式照明装置， 包括：
一灯体， 具有一收纳孔与设置于该收纳孔内的一中间套筒； 其中， 该中 间套筒具有第一卡接结构；
一 LED发光模块， 设置于该灯体上； 以及
一感应及驱动模块， 包括一感应装置与一结合组件， 该结合组件具有第 其中， 该结合组件的该第二卡接结构与该中间套筒的该第一卡接结构相 互组接。
16、 如权利要求 15 所述的组合式照明装置， 更包括一透明灯罩， 该透 明灯罩罩设该发光模块， 并与该灯体连接。
17、 如权利要求 16所述的组合式照明装置， 其中该灯体包括一灯杯， 该灯杯的内侧表面界定该收纳孔， 该中间套筒穿设于该收纳孔， 且该中间套 筒的一端部形成有该第一卡接结构， 以与该结合组件的该第二卡接结构相互 组接； 其中， 于该感应装置为微波感应元件时， 该结合组件结合于该感应装 置； 抑或， 于该感应装置为人体红外线感应元件时， 该感应及驱动模块更包 括一遮光罩， 且该结合组件结合于该遮光罩； 其中， 该第一卡接结构为扣接 脚， 该第二卡接结构为扣接位， 且该扣接脚卡掣于该扣接位。
18、 如权利要求 17所述的组合式照明装置， 更包括一灯头模块， 该中 间套筒具有第三卡接结构， 该灯头模块具有第四卡接结构， 且该灯头模块的 该第四卡接结构与该灯体的该第三卡接结构相互卡接。
19、 如权利要求 18所述的组合式照明装置， 其中该第三卡接结构形成 于相对于该中间套筒的该端部的另一端部， 以与该灯头模块的该第四卡接结 构相互组接； 其中， 该第三卡接结构为卡接槽， 该第四卡接结构为卡接凸块， 且该卡接凸块卡掣于该卡接槽。
20、 一种组合式照明装置， 包括：
一灯体， 具有一收纳孔与设置于该收纳孔内的一中间套筒； 其中， 该中 间套筒具有第一卡接结构与第二卡接结构，分设于该中间套筒的相对两端部; 一 LED发光模块， 设置于该灯体上； 一感应及驱动模块， 包括一感应装置与一结合组件， 该结合组件具有第 三卡接结构， 以与该第一卡接结构相互组接； 以及
一灯头模块， 具有第四卡接结构， 以与该第二卡接结构相互组接。
PCT/CN2012/076938 2011-06-14 2012-06-14 组合式照明装置 WO2012171468A1 (zh)

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Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014517486A (ja) * 2011-06-14 2014-07-17 東莞巨揚電器有限公司 遮光構造を有する発光ダイオード電球
CN202868630U (zh) * 2012-09-29 2013-04-10 东莞巨扬电器有限公司 散热模块及具有散热模块的组合式照明装置
KR102015911B1 (ko) * 2012-11-12 2019-08-29 엘지전자 주식회사 조명장치
US11221110B2 (en) * 2013-03-13 2022-01-11 Smartbotics, Inc. LED light bulb construction and manufacture
US9151451B2 (en) * 2013-09-09 2015-10-06 Amphenol Ltw Technology Co., Ltd. LED bulb and lamp head assembly with positioning structures
US9488331B2 (en) * 2014-04-17 2016-11-08 Streamlight, Inc. Portable light with selectable optical beam forming arrangement
AU2015202768B2 (en) * 2014-05-22 2019-02-07 Gooee Limited Sensor Arrangements
US9488352B2 (en) * 2014-05-28 2016-11-08 Technical Consumer Products, Inc. Radio frequency (RF) signal pathway for a lamp antenna
US10203103B2 (en) 2016-02-08 2019-02-12 Cree, Inc. LED luminaire having enhanced thermal management
US10234127B2 (en) * 2016-02-08 2019-03-19 Cree, Inc. LED luminaire having enhanced thermal management
CN205909093U (zh) * 2016-07-26 2017-01-25 中山市尊宝实业有限公司 一种交流led灯泡
CN106439750A (zh) * 2016-11-30 2017-02-22 南京路特软件有限公司 一种带有e27灯座的led红外感应灯
CN206918825U (zh) * 2017-04-25 2018-01-23 漳州立达信光电子科技有限公司 一种分体式筒灯

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201420982Y (zh) * 2009-06-22 2010-03-10 光碁科技股份有限公司 非抛弃可换修的环保多功能模块式led灯具
CN101680613A (zh) * 2007-05-23 2010-03-24 夏普株式会社 照明装置
CN201535459U (zh) * 2009-09-29 2010-07-28 东莞巨扬电器有限公司 一种感应式led灯泡
CN201706279U (zh) * 2010-06-04 2011-01-12 深圳市旭翔光电科技有限公司 Led照明灯泡及其散热座
CN201706282U (zh) * 2010-06-04 2011-01-12 深圳市旭翔光电科技有限公司 高密度多封装体集成led灯
CN201787542U (zh) * 2010-11-24 2011-04-06 宁波同泰电气股份有限公司 Led灯的内外循环对流式散热结构
CN102062315A (zh) * 2010-11-09 2011-05-18 侯山春 人体自动感应led灯
CN202118609U (zh) * 2011-06-14 2012-01-18 东莞巨扬电器有限公司 一种快速散热的led灯泡
CN202118610U (zh) * 2011-06-14 2012-01-18 东莞巨扬电器有限公司 一种组装式led灯泡
CN202118607U (zh) * 2011-06-14 2012-01-18 东莞巨扬电器有限公司 一种免焊接电极的led灯泡
CN202140839U (zh) * 2011-06-14 2012-02-08 东莞巨扬电器有限公司 一种组装式led灯泡
CN202165851U (zh) * 2011-06-14 2012-03-14 东莞巨扬电器有限公司 一种组装式led灯泡

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3781538A (en) * 1972-07-26 1973-12-25 P Brudy Emergency warning lamp
US5577835A (en) * 1995-01-24 1996-11-26 Huang; Peter PL lamp holder
FR2914732A1 (fr) * 2007-04-06 2008-10-10 Olivier Paul Legendre Dispositif pour brancher un luminaire a led dans la douille equipant la vasque d'un lampadaire.
CN101509608A (zh) * 2008-02-13 2009-08-19 苏文宏 多功能侦测型led发光装置
US7806564B2 (en) * 2008-03-12 2010-10-05 Aeon Lighting Technology Inc. Connection device of an LED lamp and cooling fins
US20090296387A1 (en) * 2008-05-27 2009-12-03 Sea Gull Lighting Products, Llc Led retrofit light engine
US20100073884A1 (en) * 2008-08-15 2010-03-25 Molex Incorporated Light engine, heat sink and electrical path assembly
KR100980845B1 (ko) * 2009-12-24 2010-09-10 쎄딕(주) 냉각 유로를 갖는 엘이디 모듈
US8201983B2 (en) * 2010-06-01 2012-06-19 Young Lighting Technology Inc. Illuminating device
US10400959B2 (en) * 2010-11-09 2019-09-03 Lumination Llc LED lamp
US8487518B2 (en) * 2010-12-06 2013-07-16 3M Innovative Properties Company Solid state light with optical guide and integrated thermal guide

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101680613A (zh) * 2007-05-23 2010-03-24 夏普株式会社 照明装置
CN201420982Y (zh) * 2009-06-22 2010-03-10 光碁科技股份有限公司 非抛弃可换修的环保多功能模块式led灯具
CN201535459U (zh) * 2009-09-29 2010-07-28 东莞巨扬电器有限公司 一种感应式led灯泡
CN201706279U (zh) * 2010-06-04 2011-01-12 深圳市旭翔光电科技有限公司 Led照明灯泡及其散热座
CN201706282U (zh) * 2010-06-04 2011-01-12 深圳市旭翔光电科技有限公司 高密度多封装体集成led灯
CN102062315A (zh) * 2010-11-09 2011-05-18 侯山春 人体自动感应led灯
CN201787542U (zh) * 2010-11-24 2011-04-06 宁波同泰电气股份有限公司 Led灯的内外循环对流式散热结构
CN202118609U (zh) * 2011-06-14 2012-01-18 东莞巨扬电器有限公司 一种快速散热的led灯泡
CN202118610U (zh) * 2011-06-14 2012-01-18 东莞巨扬电器有限公司 一种组装式led灯泡
CN202118607U (zh) * 2011-06-14 2012-01-18 东莞巨扬电器有限公司 一种免焊接电极的led灯泡
CN202140839U (zh) * 2011-06-14 2012-02-08 东莞巨扬电器有限公司 一种组装式led灯泡
CN202165851U (zh) * 2011-06-14 2012-03-14 东莞巨扬电器有限公司 一种组装式led灯泡

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2722577A4 *

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