WO2012167514A1 - 液晶显示器及其覆晶薄膜 - Google Patents

液晶显示器及其覆晶薄膜 Download PDF

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Publication number
WO2012167514A1
WO2012167514A1 PCT/CN2011/079166 CN2011079166W WO2012167514A1 WO 2012167514 A1 WO2012167514 A1 WO 2012167514A1 CN 2011079166 W CN2011079166 W CN 2011079166W WO 2012167514 A1 WO2012167514 A1 WO 2012167514A1
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WIPO (PCT)
Prior art keywords
groove
flip chip
liquid crystal
crystal display
adhesive layer
Prior art date
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Ceased
Application number
PCT/CN2011/079166
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English (en)
French (fr)
Inventor
廖良展
林柏伸
吴宇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Application filed by Shenzhen China Star Optoelectronics Technology Co Ltd filed Critical Shenzhen China Star Optoelectronics Technology Co Ltd
Priority to US13/379,640 priority Critical patent/US8643155B2/en
Publication of WO2012167514A1 publication Critical patent/WO2012167514A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/54—Arrangements for reducing warping-twist
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/28—Adhesive materials or arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Definitions

  • the present invention relates to the field of microelectronics, and more particularly to a liquid crystal display and a flip chip thereof.
  • liquid crystal display has a high resolution and flatness, and has a narrow screen frame area
  • COF chip on film
  • a flexible circuit board is used as a technology for packaging a chip carrier to bond a chip to a flexible circuit board circuit.
  • the flip chip 100 includes a body region 110, an input pin side 120, and an output pin side 130.
  • the body region 110 is provided with a driving IC 112.
  • the flip chip 100 is layered.
  • the structure comprises a glue bottom layer 140, an adhesive layer 150, a copper layer 160 and a green paint layer 170, the glue bottom layer 140 is located under the driving IC 112; the adhesive layer 150 is located under the glue bottom layer 140; the copper layer 160 Located below the adhesive layer 150; the green lacquer layer 170 is located below the copper layer 160.
  • the glass substrate of the bonding region is likely to be deformed or undulated with respect to the glass substrate of the unbonded region due to the action of heat and pressure, so that the glass The transmittance of the bonded region and the unbonded region on the substrate is different, resulting in a difference in brightness of the display, which affects the performance index of the liquid crystal display.
  • the invention provides a novel flip chip to solve the problem that the glass substrate of the liquid crystal display is deformed or undulated due to the thermal compression bonding of the flip chip to the glass substrate of the liquid crystal display in the prior art, so that the transmittance of the glass substrate of the liquid crystal display is caused by the transmittance. There is a difference and there is a problem that the display brightness is different.
  • one technical solution adopted by the present invention is to provide a flip chip which includes: Bottom layer
  • An adhesive layer located below the adhesive layer
  • the adhesive bottom layer is provided with a grooming structure for releasing heat and pressure.
  • the grooming structure is a trench structure in which the ends communicate with the outside.
  • the groove structure is a corrugated groove, a curved groove, a polygonal groove or a mesh groove.
  • the flip chip includes an input pin side and an output pin side, and the trench structure is disposed on the adhesive underlayer on the side of the output pin.
  • a liquid crystal display comprising a glass substrate and a flip chip film sealed with the glass substrate in a TAB manner, the flip chip comprising:
  • a glue bottom layer located below the IC
  • An adhesive layer located below the adhesive layer
  • the adhesive bottom layer is provided with a heat pressure transmission structure.
  • the adhesive underlayer of the flip-chip film disclosed in the present invention is provided with a grooming structure, so that the thermal bonding of the flip chip to the glass substrate of the liquid crystal display does not cause
  • the glass of the bonding zone is deformed or undulated, and the consistency of the bonded region and the unbonded region is ensured, so that the bonded region and the unbonded region of the glass substrate have the same transmittance, and the brightness of the display is not different.
  • FIG. 1 is a schematic top plan view of a flip chip of the prior art
  • FIG. 2 is a schematic cross-sectional structural view of the flip chip shown in FIG. 1;
  • FIG. 3 is a top plan view showing a preferred embodiment of a flip chip according to the present invention
  • 4 is a schematic cross-sectional structural view of the flip chip shown in FIG. 3.
  • the present invention provides a flip chip 200 comprising a body region 210, an output pin side 220, and an input pin side 230, wherein the body region 210 is provided with a driver IC. 212.
  • the flip chip 200 includes a sublayer 240, an adhesive layer 250, a copper layer 260, and a green lacquer layer 270 in a hierarchical structure.
  • the driver IC 212 is embedded in the surface of the adhesive layer 240; the adhesive layer 250 is located under the adhesive layer 240; the copper layer 260 is located below the adhesive layer 250; and the green paint layer 270 is located below the copper layer 260.
  • the grooming structure 242 is a trench structure in which the end portion communicates with the outside, and the trench structure is disposed on the bottom layer 220 of the output pin 220.
  • the groove structure may specifically be a corrugated groove, a curved groove, a polygonal groove or a mesh groove, etc., and the specific embodiment thereof does not constitute a limitation of the present invention.
  • the adhesive underlayer 240 is provided with the guiding structure 242, when the flip chip 200 is thermocompression bonded to the glass substrate (not shown) of the liquid crystal display, heat and pressure can be diffused in all directions through the guiding structure 242, and It does not cause deformation or undulation of the glass in the bonding region, and the consistency of the bonding region and the unbonding region is ensured, so that the bonding region and the unbonding region of the glass substrate have the same transmittance, and the brightness of the display is not different.
  • a mesh groove is provided on the entire body region of the flip chip, and a grooming structure is disposed on the glue bottom layer 240 at the output pin side 220 of the present invention.
  • the 242 is not the same.
  • the grooming structure 242 of the present invention has a small modification area for the flip chip 200, and has a simple manufacturing process and a function of releasing heat and pressure.
  • the wires electrically connected to the glass substrate of the liquid crystal display are disposed in the copper layer 260, so that the grooming structure 242 does not have any influence on the wiring.
  • the adhesive underlayer of the flip-chip film disclosed in the present invention is provided with a grooming structure, so that the bonded region is not bonded to the glass substrate of the liquid crystal display.
  • the glass is deformed or undulating, ensuring the bonding zone and The consistency of the unbonded regions is such that the bonded regions and the unbonded regions of the glass substrate have the same transmittance, and the brightness of the display is not different.

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)

Abstract

提供了一种覆晶薄膜（200），该覆晶薄膜包括胶底层（240）、驱动IC（212）、粘合剂层（250）以及铜层（260）；该驱动IC嵌于该胶底层表面；该粘合剂层位于该胶底层下方；该铜层位于该粘合剂层下方；其中该胶底层设有用于释放热量和压力的疏导结构（242）。由于覆晶薄膜的胶底层设置有疏导结构，使得将覆晶薄膜热压结合到液晶显示器的玻璃基板时，不会导致结合区的玻璃产生形变或翘曲，使得玻璃基板的结合区和未结合区具有相同的透射率。

Description

液晶显示器及其覆晶薄膜
【技术领域】
本发明涉及微电子技术领域， 特别是涉及一种液晶显示器及其覆晶 薄膜。
【背景技术】
目前， 液晶显示器（liquid crystal display, LCD )因其必须具有高的 分辨率和平整度， 又要具有窄的屏幕框架面积， 而釆用覆晶薄膜封装技 术 (Chip On Film, COF), COF是运用柔性电路板作封装芯片载体将芯片 与柔性电路板电路接合的技术。
请一并参阅图 1和图 2, 该覆晶薄膜 100包括主体区 110、 输入引 脚侧边 120以及输出引脚侧边 130,主体区 110上设有驱动 IC112,该覆 晶薄膜 100在层次结构上包括胶底层 140、 粘合剂层 150、 铜层 160以 及绿漆层 170, 该胶底层 140位于该驱动 IC 112下方； 该粘合剂层 150 位于该胶底层 140下方； 该铜层 160位于该粘合剂层 150下方； 该绿漆 层 170位于该铜层 160下方。
在将该覆晶薄膜 100热压结合到液晶显示器的玻璃基板（未示出） 时， 由于热量和压力的作用容易导致结合区的玻璃基板相对未结合区的 玻璃基板产生形变或起伏， 使得玻璃基板上的结合区和未结合区的透射 率出现差异， 而导致其显示的亮度差异， 影响液晶显示器的性能指标。
【发明内容】
本发明提供一种新型的覆晶薄膜， 以解决现有技术中将覆晶薄膜热 压结合到液晶显示器的玻璃基板时易导致结合区的玻璃产生形变或起 伏致使液晶显示器的玻璃基板因透射率出现差异而出现显示亮度有差 异的问题。
为解决上述技术问题， 本发明釆用的一个技术方案是： 提供一种覆 晶薄膜， 该覆晶薄膜包括： 胶底层；
驱动 IC, 嵌于该胶底层表面；
粘合剂层， 位于该胶底层下方； 以及
铜层， 位于该粘合剂层下方；
其中， 该胶底层设有用于释放热量和压力的疏导结构。
根据本发明一优选实施例， 该疏导结构为端部与外界相通的沟槽结 构。
根据本发明一优选实施例， 该沟槽结构为波紋槽、 曲线槽、 多边形 槽或网状槽。
根据本发明一优选实施例， 该覆晶薄膜包括输入引脚侧边和输出引 脚侧边， 该沟槽结构设于该输出引脚侧边的该胶底层上。
为解决上述技术问题， 本发明釆用的另一个技术方案是： 提供一种 液晶显示器，该液晶显示器包括玻璃基板及与该玻璃基板以 TAB方式封 装的覆晶薄膜， 该覆晶薄膜包括：
驱动 IC;
胶底层， 位于该 IC下方；
粘合剂层， 位于该胶底层下方； 以及
铜层， 位于该粘合剂层下方；
其中， 该胶底层设有热量压力输导结构。
本发明的有益效果是： 区别于现有技术的情况， 本发明公开的覆晶 薄膜的胶底层由于设置有疏导结构， 使得在将覆晶薄膜热压结合到液晶 显示器的玻璃基板时不会导致结合区的玻璃产生形变或起伏， 保证了结 合区和未结合区的一致性， 使得玻璃基板的结合区和未结合区具有相同 的透射率， 显示的亮度无差异。
【附图说明】
图 1为现有技术中一种覆晶薄膜的俯视结构示意图；
图 2为图 1所示的覆晶薄膜的截面结构示意图；
图 3为根据本发明覆晶薄膜优选实施例的俯视结构示意图； 图 4为图 3所示的覆晶薄膜的截面结构示意图。
【具体实施方式】 下面结合附图和实施例对本发明进行详细说明。
请参阅图 3 , 本发明提供了一种覆晶薄膜 200, 该覆晶薄膜 200包 括主体区 210、 输出引脚侧边 220 以及输入引脚侧边 230, 其中， 主体 区 210上设有驱动 IC 212。
请一并参阅图 4 , 该覆晶薄膜 200在层次结构上包括胶底层 240、 粘合剂层 250、 铜层 260以及绿漆层 270。
驱动 IC 212嵌于胶底层 240表面；粘合剂层 250位于胶底层 240下 方； 铜层 260位于粘合剂层 250下方； 绿漆层 270位于铜层 260下方。
其中， 输出引脚侧边 220处的胶底层 240上设置有用于释放热量和 压力的疏导结构 242 , 在本发明实施例中， 该疏导结构 242为端部与外 界相通的沟槽结构， 该沟槽结构具体可为波紋槽、 曲线槽、 多边形槽或 网状槽等， 其具体实施方式不构成对本发明的限制。
由于该胶底层 240设置有疏导结构 242 , 使得在将覆晶薄膜 200热 压结合到液晶显示器的玻璃基板（图未示出） 时， 热量和压力可通过该 疏导结构 242向各个方向扩散， 而不会导致结合区的玻璃产生形变或起 伏， 保证了结合区和未结合区的一致性， 使得玻璃基板的结合区和未结 合区具有相同的透射率， 显示的亮度无差异。
在现有技术中， 为了避免覆晶薄膜折损， 会在覆晶薄膜的整个主体 区域上设置网状沟槽， 其与本发明在输出引脚侧边 220处的胶底层 240 上设置疏导结构 242并不相同，本发明的疏导结构 242对于覆晶薄膜 200 的改动面积小， 制作工艺简单并同时具有释放热量和压力的疏导功能。
值得一提的是， 与液晶显示器的玻璃基板电连接的导线是设置在铜 层 260中的， 因此该疏导结构 242不会对线路产生任何影响。
综上所述， 本领域技术人员容易理解， 本发明公开的覆晶薄膜的胶 底层由于设置有疏导结构， 使得在将该覆晶薄膜热压结合到液晶显示器 的玻璃基板时不会导致结合区的玻璃产生形变或起伏， 保证了结合区和 未结合区的一致性， 使得玻璃基板的结合区和未结合区具有相同的透射 率， 显示的亮度无差异。
以上所述仅为本发明的示例性实施例， 并非因此限制本发明的专利 保护范围， 凡是利用本发明说明书及附图内容所作的等效结构或等效流 程变换， 或直接或间接运用在其他相关的技术领域， 均同理包括在本发 明的专利保护范围内。

Claims

权 利 要求
1、 一种覆晶薄膜， 包括：
驱动 IC;
胶底层， 位于所述驱动 IC下方；
粘合剂层， 位于所述胶底层下方； 以及
铜层， 位于所述粘合剂层下方；
其特征在于， 所述胶底层上设有热量压力输导结构。
2、 根据权利要求 1所述的覆晶薄膜， 其特征在于： 所述热量压力输导结构 为端部与外界相通的沟槽结构。
3、根据权利要求 2所述的覆晶薄膜， 其特征在于： 所述沟槽结构为波紋槽、 曲线槽、 多边形槽或网状槽。
4、 根据权利要求 1所述的覆晶薄膜， 其特征在于： 所述覆晶薄膜包括输入 引脚侧边和输出引脚侧边， 所述热量压力输导结构设于所述输入引脚侧边的所 述胶底层上。
5、一种液晶显示器， 包括玻璃基板及与所述玻璃基板以 TAB方式封装的覆 晶薄膜， 所述覆晶薄膜包括：
驱动 IC;
胶底层， 位于所述 IC下方；
粘合剂层， 位于所述胶底层下方；
铜层， 位于所述粘合剂层下方； 以及
其特征在于， 所述胶底层上设有热量压力输导结构。
6、 根据权利要求 5所述的液晶显示器， 其特征在于： 所述热量压力输导结 构为端部与外界相通的沟槽结构。
7、 根据权利要求 6所述的液晶显示器， 其特征在于： 所述沟槽结构为波紋 槽、 曲线槽、 多边形槽或网状槽。
8、 根据权利要求 5所述的液晶显示器， 其特征在于： 所述覆晶薄膜包括输 入引脚侧边和输出引脚侧边， 所述热量压力输导结构设于所述输入引脚侧边的 所述胶底层上。
PCT/CN2011/079166 2011-06-09 2011-08-31 液晶显示器及其覆晶薄膜 Ceased WO2012167514A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US13/379,640 US8643155B2 (en) 2011-06-09 2011-08-31 Liquid crystal display and chip on film thereof

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Application Number Priority Date Filing Date Title
CN201120192956.8 2011-06-09
CN201120192956.8U CN202159658U (zh) 2011-06-09 2011-06-09 覆晶薄膜

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CN202102196U (zh) * 2011-06-06 2012-01-04 深圳市华星光电技术有限公司 用于液晶面板的软板上芯片构造

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JP2009192858A (ja) * 2008-02-15 2009-08-27 Citizen Finetech Miyota Co Ltd 液晶表示装置
CN201536453U (zh) * 2009-09-24 2010-07-28 北京京东方光电科技有限公司 Cof柔性电路板
CN201764409U (zh) * 2010-09-03 2011-03-16 昆山龙腾光电有限公司 光学膜片及采用该光学膜片的背光模组和液晶显示装置
CN202102196U (zh) * 2011-06-06 2012-01-04 深圳市华星光电技术有限公司 用于液晶面板的软板上芯片构造

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