WO2012165819A3 - 발광 다이오드 어셈블리 - Google Patents
발광 다이오드 어셈블리 Download PDFInfo
- Publication number
- WO2012165819A3 WO2012165819A3 PCT/KR2012/004180 KR2012004180W WO2012165819A3 WO 2012165819 A3 WO2012165819 A3 WO 2012165819A3 KR 2012004180 W KR2012004180 W KR 2012004180W WO 2012165819 A3 WO2012165819 A3 WO 2012165819A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- emitting diode
- light emitting
- heat
- diode chip
- red light
- Prior art date
Links
- 239000006185 dispersion Substances 0.000 abstract 5
- 238000001228 spectrum Methods 0.000 abstract 1
- 230000009466 transformation Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014513427A JP6235998B2 (ja) | 2011-06-01 | 2012-05-25 | 発光ダイオードアセンブリ |
US14/123,393 US9203007B2 (en) | 2011-06-01 | 2012-05-25 | Light emitting diode assembly |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020110052970A KR101752447B1 (ko) | 2011-06-01 | 2011-06-01 | 발광 다이오드 어셈블리 |
KR10-2011-0052970 | 2011-06-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2012165819A2 WO2012165819A2 (ko) | 2012-12-06 |
WO2012165819A3 true WO2012165819A3 (ko) | 2013-03-28 |
Family
ID=47260046
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2012/004180 WO2012165819A2 (ko) | 2011-06-01 | 2012-05-25 | 발광 다이오드 어셈블리 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9203007B2 (ko) |
JP (1) | JP6235998B2 (ko) |
KR (1) | KR101752447B1 (ko) |
WO (1) | WO2012165819A2 (ko) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5963001B2 (ja) * | 2013-03-28 | 2016-08-03 | 東芝ライテック株式会社 | 照明装置 |
TWI556478B (zh) * | 2014-06-30 | 2016-11-01 | 億光電子工業股份有限公司 | 發光二極體裝置 |
US10203096B2 (en) * | 2017-06-28 | 2019-02-12 | Conservation Technology of Illinois LLC | Powering and fastening a light emitting diode or chip-on-board component to a heatsink |
CN107331658B (zh) * | 2017-07-27 | 2018-09-25 | 旭宇光电(深圳)股份有限公司 | 多腔体植物照明led封装结构 |
US10615321B2 (en) | 2017-08-21 | 2020-04-07 | Seoul Semiconductor Co., Ltd. | Light emitting device package |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100703218B1 (ko) * | 2006-03-14 | 2007-04-09 | 삼성전기주식회사 | 발광다이오드 패키지 |
US20090161354A1 (en) * | 2007-12-21 | 2009-06-25 | Foxsemicon Integrated Technology, Inc. | Lighting emitting diode lamp |
JP2009194213A (ja) * | 2008-02-15 | 2009-08-27 | Sanyo Electric Co Ltd | 電子部品 |
KR100982994B1 (ko) * | 2008-10-15 | 2010-09-17 | 삼성엘이디 주식회사 | Led 패키지 모듈 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4645071B2 (ja) * | 2003-06-20 | 2011-03-09 | 日亜化学工業株式会社 | パッケージ成型体およびそれを用いた半導体装置 |
JP2005191135A (ja) * | 2003-12-24 | 2005-07-14 | Kawaguchiko Seimitsu Co Ltd | 半導体パッケージ |
JP2006108517A (ja) * | 2004-10-08 | 2006-04-20 | Citizen Watch Co Ltd | Led接続用基板及びそれを用いた照明装置及びそれを用いた表示装置 |
JP2006128512A (ja) * | 2004-10-29 | 2006-05-18 | Ngk Spark Plug Co Ltd | 発光素子用セラミック基板 |
JP4670323B2 (ja) * | 2004-11-19 | 2011-04-13 | ソニー株式会社 | 発光装置及びこれを用いた液晶表示装置用バックライト装置、照明装置 |
JP5010203B2 (ja) * | 2006-07-31 | 2012-08-29 | パナソニック株式会社 | 発光装置 |
JP4689637B2 (ja) * | 2007-03-23 | 2011-05-25 | シャープ株式会社 | 半導体発光装置 |
JP5431688B2 (ja) * | 2007-06-29 | 2014-03-05 | ソウル セミコンダクター カンパニー リミテッド | マルチledパッケージ |
KR100877877B1 (ko) * | 2007-08-28 | 2009-01-13 | 엘지이노텍 주식회사 | 발광 소자 |
JP2009117536A (ja) * | 2007-11-05 | 2009-05-28 | Towa Corp | 樹脂封止発光体及びその製造方法 |
JP5388441B2 (ja) * | 2007-11-08 | 2014-01-15 | キヤノン株式会社 | 発光制御装置及び発光制御方法 |
CN101463986B (zh) * | 2007-12-21 | 2011-01-05 | 富士迈半导体精密工业(上海)有限公司 | 发光二极管灯具 |
JP2009283214A (ja) * | 2008-05-21 | 2009-12-03 | Toshiba Lighting & Technology Corp | Led照明装置 |
JP4544361B2 (ja) * | 2008-11-26 | 2010-09-15 | 日亜化学工業株式会社 | 発光装置 |
JP2010212508A (ja) * | 2009-03-11 | 2010-09-24 | Sony Corp | 発光素子実装用パッケージ、発光装置、バックライトおよび液晶表示装置 |
EP2462797B1 (en) * | 2009-08-07 | 2019-02-27 | Showa Denko K.K. | Multicolor LED lamp for use in plant cultivation, illumination appratus and plant cultivation method |
US9039216B2 (en) * | 2010-04-01 | 2015-05-26 | Lg Innotek Co., Ltd. | Light emitting device package and light unit having the same |
-
2011
- 2011-06-01 KR KR1020110052970A patent/KR101752447B1/ko active IP Right Grant
-
2012
- 2012-05-25 JP JP2014513427A patent/JP6235998B2/ja active Active
- 2012-05-25 WO PCT/KR2012/004180 patent/WO2012165819A2/ko active Application Filing
- 2012-05-25 US US14/123,393 patent/US9203007B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100703218B1 (ko) * | 2006-03-14 | 2007-04-09 | 삼성전기주식회사 | 발광다이오드 패키지 |
US20090161354A1 (en) * | 2007-12-21 | 2009-06-25 | Foxsemicon Integrated Technology, Inc. | Lighting emitting diode lamp |
JP2009194213A (ja) * | 2008-02-15 | 2009-08-27 | Sanyo Electric Co Ltd | 電子部品 |
KR100982994B1 (ko) * | 2008-10-15 | 2010-09-17 | 삼성엘이디 주식회사 | Led 패키지 모듈 |
Also Published As
Publication number | Publication date |
---|---|
WO2012165819A2 (ko) | 2012-12-06 |
KR101752447B1 (ko) | 2017-07-05 |
KR20120134202A (ko) | 2012-12-12 |
US9203007B2 (en) | 2015-12-01 |
JP6235998B2 (ja) | 2017-11-22 |
JP2014517528A (ja) | 2014-07-17 |
US20150034979A1 (en) | 2015-02-05 |
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