WO2012165819A3 - 발광 다이오드 어셈블리 - Google Patents

발광 다이오드 어셈블리 Download PDF

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Publication number
WO2012165819A3
WO2012165819A3 PCT/KR2012/004180 KR2012004180W WO2012165819A3 WO 2012165819 A3 WO2012165819 A3 WO 2012165819A3 KR 2012004180 W KR2012004180 W KR 2012004180W WO 2012165819 A3 WO2012165819 A3 WO 2012165819A3
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WIPO (PCT)
Prior art keywords
emitting diode
light emitting
heat
diode chip
red light
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PCT/KR2012/004180
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English (en)
French (fr)
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WO2012165819A2 (ko
Inventor
이정훈
갈대성
서원철
양영은
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서울반도체(주)
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Priority to JP2014513427A priority Critical patent/JP6235998B2/ja
Priority to US14/123,393 priority patent/US9203007B2/en
Publication of WO2012165819A2 publication Critical patent/WO2012165819A2/ko
Publication of WO2012165819A3 publication Critical patent/WO2012165819A3/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)

Abstract

발광 다이오드 어셈블리가 개시된다. 이 어셈블리는, 적색 발광 다이오드 칩과, 적색 발광 다이오드 칩에서 방출되는 광에 비해 상대적으로 단파장의 광을 방출하는 단파장 발광 다이오드 칩과, 단파장 발광 다이오드 칩에서 생성된 열을 주로 방출하는 제1 방열 멤버와, 상기 적색 발광 다이오드 칩에서 생성된 열을 주로 방출하는 제2 방열 멤버를 포함한다. 또한, 제2 방열 멤버의 열 방출 성능이 제1 방열 멤버에 비해 상대적으로 더 우수하다. 이에 따라, 적색 발광 다이오드 칩에서 방출되는 적색광의 스펙트럼 이동을 방지하여 동작 시간에 따른 색좌표 변화를 방지할 수 있다.
PCT/KR2012/004180 2011-06-01 2012-05-25 발광 다이오드 어셈블리 WO2012165819A2 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014513427A JP6235998B2 (ja) 2011-06-01 2012-05-25 発光ダイオードアセンブリ
US14/123,393 US9203007B2 (en) 2011-06-01 2012-05-25 Light emitting diode assembly

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020110052970A KR101752447B1 (ko) 2011-06-01 2011-06-01 발광 다이오드 어셈블리
KR10-2011-0052970 2011-06-01

Publications (2)

Publication Number Publication Date
WO2012165819A2 WO2012165819A2 (ko) 2012-12-06
WO2012165819A3 true WO2012165819A3 (ko) 2013-03-28

Family

ID=47260046

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2012/004180 WO2012165819A2 (ko) 2011-06-01 2012-05-25 발광 다이오드 어셈블리

Country Status (4)

Country Link
US (1) US9203007B2 (ko)
JP (1) JP6235998B2 (ko)
KR (1) KR101752447B1 (ko)
WO (1) WO2012165819A2 (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5963001B2 (ja) * 2013-03-28 2016-08-03 東芝ライテック株式会社 照明装置
TWI556478B (zh) * 2014-06-30 2016-11-01 億光電子工業股份有限公司 發光二極體裝置
US10203096B2 (en) * 2017-06-28 2019-02-12 Conservation Technology of Illinois LLC Powering and fastening a light emitting diode or chip-on-board component to a heatsink
CN107331658B (zh) * 2017-07-27 2018-09-25 旭宇光电（深圳）股份有限公司 多腔体植物照明led封装结构
US10615321B2 (en) 2017-08-21 2020-04-07 Seoul Semiconductor Co., Ltd. Light emitting device package

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100703218B1 (ko) * 2006-03-14 2007-04-09 삼성전기주식회사 발광다이오드 패키지
US20090161354A1 (en) * 2007-12-21 2009-06-25 Foxsemicon Integrated Technology, Inc. Lighting emitting diode lamp
JP2009194213A (ja) * 2008-02-15 2009-08-27 Sanyo Electric Co Ltd 電子部品
KR100982994B1 (ko) * 2008-10-15 2010-09-17 삼성엘이디 주식회사 Ｌｅｄ 패키지 모듈

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4645071B2 (ja) * 2003-06-20 2011-03-09 日亜化学工業株式会社 パッケージ成型体およびそれを用いた半導体装置
JP2005191135A (ja) * 2003-12-24 2005-07-14 Kawaguchiko Seimitsu Co Ltd 半導体パッケージ
JP2006108517A (ja) * 2004-10-08 2006-04-20 Citizen Watch Co Ltd Ｌｅｄ接続用基板及びそれを用いた照明装置及びそれを用いた表示装置
JP2006128512A (ja) * 2004-10-29 2006-05-18 Ngk Spark Plug Co Ltd 発光素子用セラミック基板
JP4670323B2 (ja) * 2004-11-19 2011-04-13 ソニー株式会社 発光装置及びこれを用いた液晶表示装置用バックライト装置、照明装置
JP5010203B2 (ja) * 2006-07-31 2012-08-29 パナソニック株式会社 発光装置
JP4689637B2 (ja) * 2007-03-23 2011-05-25 シャープ株式会社 半導体発光装置
JP5431688B2 (ja) * 2007-06-29 2014-03-05 ソウル セミコンダクター カンパニー リミテッド マルチｌｅｄパッケージ
KR100877877B1 (ko) * 2007-08-28 2009-01-13 엘지이노텍 주식회사 발광 소자
JP2009117536A (ja) * 2007-11-05 2009-05-28 Towa Corp 樹脂封止発光体及びその製造方法
JP5388441B2 (ja) * 2007-11-08 2014-01-15 キヤノン株式会社 発光制御装置及び発光制御方法
CN101463986B (zh) * 2007-12-21 2011-01-05 富士迈半导体精密工业（上海）有限公司 发光二极管灯具
JP2009283214A (ja) * 2008-05-21 2009-12-03 Toshiba Lighting & Technology Corp Ｌｅｄ照明装置
JP4544361B2 (ja) * 2008-11-26 2010-09-15 日亜化学工業株式会社 発光装置
JP2010212508A (ja) * 2009-03-11 2010-09-24 Sony Corp 発光素子実装用パッケージ、発光装置、バックライトおよび液晶表示装置
EP2462797B1 (en) * 2009-08-07 2019-02-27 Showa Denko K.K. Multicolor LED lamp for use in plant cultivation, illumination appratus and plant cultivation method
US9039216B2 (en) * 2010-04-01 2015-05-26 Lg Innotek Co., Ltd. Light emitting device package and light unit having the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100703218B1 (ko) * 2006-03-14 2007-04-09 삼성전기주식회사 발광다이오드 패키지
US20090161354A1 (en) * 2007-12-21 2009-06-25 Foxsemicon Integrated Technology, Inc. Lighting emitting diode lamp
JP2009194213A (ja) * 2008-02-15 2009-08-27 Sanyo Electric Co Ltd 電子部品
KR100982994B1 (ko) * 2008-10-15 2010-09-17 삼성엘이디 주식회사 Ｌｅｄ 패키지 모듈

Also Published As

Publication number Publication date
WO2012165819A2 (ko) 2012-12-06
KR101752447B1 (ko) 2017-07-05
KR20120134202A (ko) 2012-12-12
US9203007B2 (en) 2015-12-01
JP6235998B2 (ja) 2017-11-22
JP2014517528A (ja) 2014-07-17
US20150034979A1 (en) 2015-02-05

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