WO2012165385A1 - レーストラック形状のマグネトロンスパッタリング用磁場発生装置 - Google Patents
レーストラック形状のマグネトロンスパッタリング用磁場発生装置 Download PDFInfo
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- WO2012165385A1 WO2012165385A1 PCT/JP2012/063663 JP2012063663W WO2012165385A1 WO 2012165385 A1 WO2012165385 A1 WO 2012165385A1 JP 2012063663 W JP2012063663 W JP 2012063663W WO 2012165385 A1 WO2012165385 A1 WO 2012165385A1
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- magnetic pole
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- outer peripheral
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3266—Magnetic control means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3266—Magnetic control means
- H01J37/32669—Particular magnets or magnet arrangements for controlling the discharge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
- H01J37/3408—Planar magnetron sputtering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
Definitions
- the present invention relates to a magnetic field generator incorporated in a racetrack-shaped magnetron sputtering apparatus used for forming a thin film on a substrate surface.
- a phenomenon in which atoms and molecules constituting the target are knocked out by colliding with an inert substance such as Ar at high speed is called sputtering.
- a thin film is formed by attaching the knocked-out atoms and molecules on the substrate. can do.
- Magnetron sputtering is a technique that can increase the deposition rate of the target material on the substrate by incorporating a magnetic field inside the cathode, and that enables film formation at low temperatures because no collision of electrons with the substrate occurs. . Therefore, in order to form a thin film on the surface of a substrate such as a semiconductor IC, a flat panel display, a solar cell, or a substrate surface such as a reflective film, a magnetron sputtering method is often used.
- the magnetron sputtering apparatus includes an anode-side substrate in a vacuum chamber, a target (cathode) disposed to face the substrate, and a magnetic field generator disposed below the target.
- Glow discharge is caused by applying a voltage between the anode and cathode, ionizing inert gas (such as Ar gas of about 0.1 Pa) in the vacuum chamber, while secondary electrons emitted from the target are magnetically applied. It is captured by the magnetic field formed by the generator and causes a cycloid motion on the target surface. Since the ionization of gas molecules is promoted by the cycloid motion of electrons, the film formation rate is remarkably higher than when no magnetic field is used, and the adhesion strength of the film is large.
- the magnetic circuit device 150 used in the magnetron sputtering apparatus includes a plate-shaped or rod-shaped central magnet 160 magnetized in the height direction (direction perpendicular to the surface of the target), and a direction opposite to the central magnet 160. And a rectangular outer magnet 170 disposed around the center magnet 160 and a yoke 180 that supports the center magnet 160 and the outer magnet 170 to generate a racetrack-shaped magnetic field on the target surface (for example, JP-A-8-13640).
- a racetrack-shaped magnetic circuit provides a closed space for confining secondary electrons, increasing the sputtering efficiency. In order to create a space to confine secondary electrons, a magnetic field (horizontal component of magnetic flux density) of 10 mT or more is usually required.
- the target erosion occurs fastest in the magnetic circuit where the vertical component of the magnetic flux density is zero (shown by a broken line 190 in FIG. 22). Therefore, it is necessary to adjust the magnetic field on the target surface so that the erosion in the portion where the vertical component of the magnetic flux density is zero (simply referred to as “the vertical magnetic flux density zero portion”) is as similar as possible to the erosion in the other portions.
- the distance r at the corner portion is shorter (r ⁇ R) than the distance R from the central magnet 160 of the vertical magnetic flux density zero portion 190 in the linear portion of the magnetic circuit.
- the magnetic flux concentrates on the vertical magnetic flux density zero part at the corner.
- Japanese Patent Application Laid-Open No. 8-134640 discloses a technique for reducing the bias of the vertical magnetic flux density at the corner portion by disposing the magnet in a T shape at the corner portion, but the improvement effect is not sufficient.
- Japanese Patent Laid-Open No. 2008-156735 discloses a base member 210 made of a non-magnetic material, a rod-shaped central magnetic pole piece 220 installed on the surface thereof, and its surroundings. And a plurality of permanent magnets 240, 250 connected between the central magnetic pole piece 220 and the outer peripheral magnetic pole piece 230.
- the permanent magnets 240, 250 are horizontal.
- the magnetic field generator 200 for magnetron sputtering is magnetized in the direction and disposed so that the magnetic poles of the same polarity face the central magnetic pole piece 220, and the central magnetic pole piece 220 and the outer magnetic pole piece 230 are higher than the permanent magnets 240 and 250. Disclosure.
- the magnetic pole pieces 220 and 230 are in contact with the magnetic pole surfaces of the permanent magnets 240 and 250, the leakage magnetic flux from the permanent magnets 240 and 250 is reduced, and a desired magnetic flux is generated with a small number of permanent magnets.
- the area where the magnetic field strength (horizontal magnetic flux density of 10 mT or more) necessary for confining the inert gas excited in the plasma state can be obtained has been expanded. As a result, the erosion region of the target is expanded, and the erosion in the straight line portion and the corner portion of the magnetic circuit is made uniform.
- the magnetic field generator disclosed in Japanese Patent Application Laid-Open No. 2008-156735 has a larger target erosion region at the corner than the magnetic field generator disclosed in Japanese Patent Application Laid-Open No. 8-134640. Therefore, since the erosion in the central part (near the central magnetic pole piece 220) is small, it has been found that the erosion region needs to be expanded also in the central part of the magnetic field generator.
- Japanese Patent Laid-Open No. 1-147063 shows a concentric magnetic shunt plate 311a above a magnetic circuit composed of concentric magnets 302a, 302b, 303 as shown in FIGS. 26 (a) and 26 (b).
- a magnetic field generator for circular magnetron sputtering provided with 311b and 311c is disclosed.
- the magnetic shunt plates 311a, 311b, and 311c spread and uniformize the portion with a strong horizontal magnetic field, thereby uniforming the erosion of the target.
- the shunt plate is effective for a magnetron sputtering magnetic field generator in which the magnetization direction of the magnet is perpendicular to the target, but is described in Japanese Patent Application Laid-Open No. 2008-156735 in which the magnetization direction of the magnet is horizontal to the target.
- the magnetic flux density distribution in the vicinity of the central pole piece cannot be sufficiently widened.
- JP-A-2009-108383 uses magnets 324b and 324c arranged in a zigzag manner with respect to a support member 324a in a target device for magnetron sputtering using a cylindrical or flat target material, as shown in FIG.
- a magnetron sputtering apparatus provided with a magnet unit that generates a magnetic field inclined with respect to the longitudinal direction of the target material.
- this magnet unit is difficult to manufacture because the arrangement of the magnets 324b and 324c is complicated.
- an object of the present invention is to provide a racetrack-shaped magnetic field generator for magtron sputtering in which the erosion region is enlarged also in the central portion of the magnetic field generator and the erosion progress of the target is made uniform.
- the present inventor has developed a racetrack shape in which a plurality of horizontally magnetized permanent magnets are installed in a racetrack shape region formed by a central magnetic pole member and an outer peripheral magnetic pole member.
- the permanent magnet is tilted so that the magnetic pole surface facing the central magnetic pole member is away from the target, or (b) the permanent magnet whose magnetization direction is opposed to the target on the central magnetic pole member.
- the distance between the central magnetic pole member and the target surface is shorter than the distance between the outer peripheral magnetic pole member and the target surface, so that the erosion region can be expanded to the central portion of the magnetic field generator.
- the first racetrack-shaped magnetron sputtering magnetic field generator of the present invention for generating a magnetic field on the target surface is (a) a central magnetic pole member, an outer peripheral magnetic pole member surrounding the central magnetic pole member, and the central magnetic pole member and the outer peripheral magnetic pole member so that one magnetic pole faces the central magnetic pole member and the other magnetic pole faces the outer peripheral magnetic pole member.
- a plurality of permanent magnets installed between the outer peripheral magnetic pole member and the central magnetic pole member, the outer peripheral magnetic pole member, and a nonmagnetic base member that supports the permanent magnet;
- the racetrack shape has a straight portion and a corner portion,
- At least each permanent magnet disposed in the linear portion has a magnetization direction inclined so that a magnetic pole surface facing the central magnetic pole member is away from the target,
- At least the magnetic pole surface facing the outer peripheral magnetic pole member of each permanent magnet arranged in the linear portion has a portion that does not contact the outer peripheral magnetic pole member on the side close to the base member,
- the distance between the central magnetic pole member and the target is equal to the distance between the outer peripheral magnetic pole member and the target.
- the inclination angle of the permanent magnet disposed in the linear portion with respect to the target is 5 to 45 °.
- the plurality of permanent magnets arranged in the linear portion may be composed of at least two types of permanent magnet groups having different inclination angles.
- the permanent magnet disposed in the corner portion is magnetized in a direction parallel to the target.
- each permanent magnet disposed in the corner portion has a magnetization direction inclined so that the magnetic pole surface facing the central magnetic pole member is away from the target, (f) It is preferable that the magnetic pole surface of each permanent magnet disposed at the corner portion that faces the outer peripheral magnetic pole member has a portion that does not contact the outer peripheral magnetic pole member on the side close to the base member.
- the surfaces of the central magnetic pole member and the outer peripheral magnetic pole member facing the target are preferably parallel to the target.
- the second racetrack-shaped magnetron sputtering magnetic field generator of the present invention for generating a magnetic field on the target surface is as follows.
- the central magnetic pole member extends from the straight part of the racetrack shape to a corner part, and the second permanent magnet placed on the central magnetic pole member Among these, it is preferable that the one placed on both end portions of the central magnetic pole member is thicker than that in the linear portion.
- the third racetrack-shaped magnetron sputtering magnetic field generator of the present invention for generating a magnetic field on the target surface comprises: (a) a central magnetic pole member, an outer peripheral magnetic pole member surrounding the central magnetic pole member, a magnetization direction parallel to the target surface, one magnetic pole facing the central magnetic pole member, and the other magnetic pole being the outer periphery A plurality of permanent magnets installed between the central magnetic pole member and the outer peripheral magnetic pole member so as to face the magnetic pole member; a nonmagnetic base member that supports the central magnetic pole member, the outer peripheral magnetic pole member, and the permanent magnet; Comprising (b) The distance between the central magnetic pole member and the target surface is shorter than the distance between the outer peripheral magnetic pole member and the target surface.
- the portion where the vertical component of the magnetic flux density becomes zero (the deepest part of erosion) is approaching the center side of the magnetic field generator, so the erosion at the center of the target increases. Therefore, the erosion of the target is made more uniform. For this reason, the utilization efficiency of the target is improved.
- the magnetic field intensity required for sputtering can be adjusted by changing the inclination angle of the magnetization direction of the permanent magnet, so that one magnetic field generator is optimal for a wide variety of target materials.
- Various conditions can be set. Further, it is possible to take measures against abnormal discharge during sputtering by locally changing the tilt angle.
- optimum conditions for a wide variety of target materials can be set by adjusting the magnetization and size of the second permanent magnet. Furthermore, in the third magnetic field generator, optimum conditions for a wide variety of target materials can be set by changing the positions of the upper surfaces of the central magnetic pole member and the outer peripheral magnetic pole member.
- FIG. 1 (a) is a cross-sectional view taken along line AA of FIG.
- FIG. 1 (b) is a cross-sectional view taken along line BB of FIG. 1 (a).
- FIG. 2 (a) is a plan view showing a non-magnetic base member constituting the magnetic field generator of FIG. 1 (a).
- FIG. 2 (a) is a plan view showing a nonmagnetic base member, a central magnetic pole member, and an outer peripheral magnetic pole member constituting the magnetic field generating device of FIG. 1 (a).
- FIG. 1 (e) is a cross-sectional view taken along the line CC of FIG.
- FIG. 2 (a) is a cross-sectional view taken along line DD of FIG.
- FIG. 2 (a) is a cross-sectional view taken along line E-E of FIG.
- It is a fragmentary top view which shows another example of the corner part of the magnetic field generator of the 1st racetrack shape of this invention.
- It is a fragmentary top view which shows another example of the corner part of the magnetic field generator of the 1st racetrack shape of this invention.
- FIG. 7 (a) is a cross-sectional view taken along line FF of FIG.
- FIG. 7 (a) is a GG cross-sectional view of the bag.
- 3 is a graph showing a peak value and a zero-cross position of a horizontal component (horizontal magnetic flux density) of magnetic flux density generated on a target surface by the racetrack-shaped magnetic field generator of Example 1.
- FIG. 9 (a) is a cross-sectional view taken along line HH of FIG.
- FIG. 9 (a) is a cross-sectional view taken along line JJ of FIG.
- FIG. 9 (a) is a cross-sectional view taken along the line KK of FIG.
- It is a fragmentary top view which shows another example of the corner part of the 2nd racetrack-shaped magnetic field generator of this invention.
- FIG. 16 (a) is an LL cross-sectional view of the bag.
- FIG. 16 (a) is a cross-sectional view taken along line MM of FIG. FIG.
- 6 is a partial schematic diagram showing A-line, B-line, and D-line in the racetrack-shaped magnetic field generator of Example 2 and a portion where the vertical component of magnetic flux density on the target surface of the generated magnetic field is zero.
- 6 is a graph in which horizontal components of magnetic flux density generated on a target surface by a racetrack-shaped magnetic field generator of Example 2 and Comparative Example 1 are plotted along an A line.
- 6 is a graph in which horizontal components of magnetic flux density generated on a target surface by a magnetic field generator of Example 2 and Comparative Example 1 are plotted along a B line.
- 6 is a graph in which horizontal components of magnetic flux density generated on a target surface by the magnetic field generator of Example 2 are plotted along a D line.
- FIG. 22 is a partial schematic view showing a portion where the vertical component of the magnetic flux density on the target surface of the magnetic field generated by the conventional magnetron sputtering magnetic field generator shown in FIG. 21 becomes zero. It is a top view which shows another example of the conventional magnetic field generator for magnetron sputtering.
- FIG. 23 (a) is a cross-sectional view taken along line NN of FIG. It is a top view which shows another example of the conventional magnetic field generator for magnetron sputtering.
- FIG. 22 is a partial schematic view showing a portion where the vertical component of the magnetic flux density on the target surface of the magnetic field generated by the conventional magnetron sputtering magnetic field generator shown in FIG. 21 becomes zero.
- FIG. 23 (a) is a cross-sectional view taken along line NN of FIG. It is a top view which shows another example of the conventional magnetic field generator for magnetron sputtering.
- FIG. 22 is a partial schematic view showing a portion where the vertical component of
- FIG. 25 is a partial schematic view showing a portion where the vertical component of the magnetic flux density on the target surface of the magnetic field generated by the conventional magnetron sputtering magnetic field generator shown in FIG. 24 becomes zero.
- 1 is a cross-sectional view showing a circular magnetron sputtering magnetic field generator disclosed in JP-A-1-47063.
- FIG. 26 (a) is a plan view showing the arrangement of shunt plates in the circular magnetron sputtering magnetic field generator of FIG. 26 (a).
- FIG. 5 is a perspective view showing the arrangement of permanent magnets in a magnetron sputtering target device disclosed in Japanese Patent Laid-Open No. 2009-108383.
- the first magnetic field generator for magnetron sputtering 1 has a racetrack shape on a target surface. It generates a magnetic field and has a racetrack shape composed of a straight portion 20 and two corner portions 30 and 30.
- the first magnetic field generator 1 includes a rod-shaped central magnetic pole member 2 disposed on the nonmagnetic base member 6, and a racetrack-shaped outer periphery disposed on the nonmagnetic base member 6 so as to surround the central magnetic pole member 2.
- a magnetic pole member 3 and a plurality of permanent magnets 4 and 5 disposed on the nonmagnetic base member 6 between the central magnetic pole member 2 and the outer peripheral magnetic pole member 3 are provided.
- Both the central magnetic pole member 2 and the outer peripheral magnetic pole member 3 are preferably made of a soft magnetic material such as soft magnetic steel.
- the material of the permanent magnets 4 and 5 may be appropriately set according to the configuration of the apparatus (distance from the magnetic field generator to the target) and the required magnetic field strength.
- use rare earth magnets such as RTB anisotropic sintered magnets with R (at least one of rare earth elements such as Nd), T (Fe or Fe and Co) and B as essential components If the required magnetic flux density is not so high, a ferrite magnet may be used.
- the magnet material and dimensions may be set in accordance with the magnetic flux density required for each.
- the non-magnetic base member 6 includes a first plane 16 on both edges of the straight portion 20 and corner portions 30, 30.
- the linear portion 20 has a groove portion 17 extending inside the first flat surface portion 16.
- the groove portion 17 extends from the outer end of each first inclined surface 17b to the first plane 16, the second plane 17a extending in the center, the first inclined surfaces 17b, 17b extending on both sides of the second plane 17a.
- a hangover-like second inclined surface 17c In the illustrated example, the corner portions 30 and 30 have polygonal shapes in plan view, but are not limited.
- Each of the first inclined surfaces 17b, 17b is inclined so that the outer side (outer magnetic pole member 3 side) becomes higher, and the inclination angle ⁇ with respect to the upper surface (first plane 16) of the nonmagnetic base member 6 is as described later. It is preferably in the range of 5 to 45 °.
- the central magnetic pole member 2 has a trapezoidal shape on the lower side and a rectangular shape on the upper side.
- a rod-shaped first central magnetic pole portion 2a disposed on 17a and a second polygonal shape in plan view disposed on the first plane 16 of the corner portions 30 and 30 in contact with both ends of the first central magnetic pole portion 2a It consists of a central magnetic pole part 2b.
- the second central magnetic pole portion 2b may be integral with or separate from the first central magnetic pole portion 2a.
- the upper surface of the central magnetic pole member 2 is preferably parallel to the target surface 7a.
- the outer peripheral magnetic pole member 3 disposed on the first plane 16 of the nonmagnetic base member 6 is disposed on the linear portion 20.
- the first outer peripheral magnetic pole portion 3a having an inverted trapezoidal cross section and the second outer peripheral magnetic pole portion 3c having a rectangular cross section disposed at the edge of the first plane 16 at the corner portions 30 and 30.
- the inner inclined surface 3a ′ of the first outer peripheral magnetic pole portion 3a is on the same plane (aligned) as the second inclined surface 17c of the nonmagnetic base member 6.
- the upper surface of the outer peripheral magnetic pole member 3 is preferably parallel to the target surface 7a.
- the second outer peripheral magnetic pole portion of the outer magnetic pole member 3 3c is also semicircular or semipolygonal.
- the shape of the permanent magnet 5 at the corner portion is determined according to the shape of the second outer peripheral magnetic pole portion 3c.
- both the permanent magnet 4 arranged in the linear portion 20 and the permanent magnet 5 arranged in the corner portions 30, 30 have one magnetic pole in the central magnetic pole member 2. And the other magnetic pole faces the outer magnetic pole member 3.
- each permanent magnet 4 in the linear portion 20 are arranged so that the magnetic pole surface 4a facing the central magnetic pole member 2 is away from the target surface 7a (the magnetic pole surface 4a on the central magnetic pole member 2 side).
- the magnetization direction is inclined by an angle ⁇ with respect to the target surface 7a so that the distance to the target surface 7a is larger than the distance between the magnetic pole surface 4b on the outer magnetic pole member 3 side and the target surface 7a).
- each permanent magnet 4 has a rectangular cross section and is magnetized so that the opposing surface becomes a magnetic pole, so the inclination angle of each permanent magnet 4 is also ⁇ .
- the inclination angles ⁇ of the magnetization directions of the permanent magnets 4 arranged on both sides of the central magnetic pole member 2 are preferably the same.
- the inclination angle ⁇ with respect to the target surface 7a in the magnetization direction of the permanent magnet 4 is preferably in the range of 5 to 45 °.
- the tilt angle ⁇ is less than 5 °, the effect of moving the portion of the target surface 7a where the vertical component of the magnetic flux density is zero (also simply referred to as “the vertical magnetic flux zero portion”) to the central portion of the magnetic field generator 1 is almost achieved. I can't get it.
- the tilt angle ⁇ exceeds 45 °, a sufficient magnetic flux density may not be obtained on the target surface 7a.
- the inclination angle ⁇ is more preferably in the range of 10 to 20 °.
- the lower side surface of the first central magnetic pole portion 2a of the central magnetic pole member 2 has an angle (90 ° ⁇ ) according to the inclination angle ⁇ of the permanent magnet 4.
- the inner side surface 3a ′ of the first outer peripheral magnetic pole part 3a of the outer peripheral magnetic pole member 3 is also inclined by an angle (90 ° ⁇ ).
- the outer end surface 4b of the permanent magnet 4 facing the outer peripheral magnetic pole member 3 has a portion 4c that does not contact the outer peripheral magnetic pole member 3 on the side close to the base member 6 (downward).
- the width W m of the outer end surface 4b of the permanent magnet 4 is larger than the width W y of the inner side surface (side surface facing the permanent magnet 4) 3a ′ of the outer peripheral magnetic pole member 3.
- the width of the non-contact portion 4c of the permanent magnet 4 is preferably W m -W y .
- the portion 4 c of the permanent magnet 4 that does not contact the outer magnetic pole member 3 functions as a magnetic gap between the permanent magnet 4 and the outer magnetic pole member 3.
- the magnetic path on the target 7 side of the permanent magnet 4 is on the base member 6 side. It has a smaller magnetoresistance than the magnetic path.
- the perpendicular magnetic flux zero portion on the target surface 7a moves toward the central magnetic pole member 2, and the erosion region of the target 7 expands to the central portion of the magnetic field generator 1.
- the magnetic field strength at the target surface 7a can be adjusted by the inclination angle ⁇ of the permanent magnet 4.
- the permanent magnets 4 arranged in the straight portion 20 all have the same inclination angle ⁇ , but at least two kinds of permanent magnet groups having different inclination angles are used. It may be configured.
- the magnetic field generator 11 shown in FIG. 2 (a) ⁇ FIG 2 (c) has a region 20a having a permanent magnet 14 which is inclined by an angle theta 1, a permanent magnet 24 which is inclined by an angle theta 1 with different angles theta 2
- the regions 20b are alternately arranged.
- the position of the deepest erosion portion can be changed so that the utilization efficiency of the target 7 is improved.
- the entire magnetic field generator during sputtering may be swung up and down and / or left and right.
- the magnetization direction of the permanent magnet 5 at the corner is parallel to the target surface 7a, but in order to adjust the erosion region and magnetic field strength of the corner,
- the magnetic pole surface opposite to the second central magnetic pole portion 2b of 2 is away from the target surface 7a, and (b) the lower portion of the surface opposite to the second outer magnetic pole portion 3c (the side closer to the base member 6) is the second outer magnetic pole.
- the magnetization direction may be inclined so as not to contact the part 3c.
- the permanent magnet 5 is inclined with respect to the target surface 7a, the same inclination angle as that of the permanent magnet 4 in the linear portion 20 or a different inclination angle may be used.
- the permanent magnet 5 in the corner portion 30 is substantially trapezoidal in plan view, but the second outer peripheral magnetic pole portion 3c in the corner portion 30 is semicircular as shown in FIG. In this case, it is preferable to have a substantially fan shape in plan view. Further, as shown in FIG. 5, the permanent magnet 5 in the corner portion 30 may be rectangular in plan view.
- the number and size of the permanent magnets 5 in the corner portion 30 are not particularly limited, and may be divided into any size from the viewpoint of manufacturing or ease of assembly, and each size may be different. .
- the permanent magnet 5 in the corner portion 30 completely fills the gap between the second central magnetic pole portion 2b of the central magnetic pole member 2 and the second outer peripheral magnetic pole portion 3c of the outer magnetic pole member 3 as shown in FIG.
- the gap 8 may be provided between the adjacent permanent magnets 5 as shown in FIG.
- the gap 8 may be filled with a nonmagnetic spacer.
- the occupation area ratio of the permanent magnet 5 to the total area of the gap between the second central magnetic pole part 2b of the central magnetic pole member 2 and the second outer peripheral magnetic pole part 3c of the outer peripheral magnetic pole member 3 is preferably 30% or more.
- the part where the vertical component of the magnetic flux density is zero in the straight part 20 (The portion indicated by the broken line in the figure) is located at a distance r (r ⁇ R) from the central magnetic pole member 2, so that the erosion deepest part moves to the center side of the target, and the erosion of the target proceeds more uniformly.
- the utilization efficiency of is improved.
- the horizontal component of the magnetic flux density is the largest in the vicinity of the portion where the vertical component of the magnetic flux density is zero. Accordingly, the horizontal component of the magnetic flux density at the position where the vertical component of the magnetic flux density of the magnetic field on the target surface 7a is zero is preferably 10 ⁇ mT or more.
- Magnetic field generator for magnetron sputtering having a second racetrack shape Magnetic field generator for second magnetron sputtering 101 includes (a) a central magnetic pole member 102, an outer peripheral magnetic pole member 103 surrounding the central magnetic pole member 102, and a target. Installed between the central magnetic pole member 102 and the outer peripheral magnetic pole member 103 so as to have a magnetization direction parallel to the surface and so that one magnetic pole faces the central magnetic pole member 102 and the other magnetic pole faces the outer peripheral magnetic pole member 103.
- the second magnetron sputtering magnetic field generator 101 has a nonmagnetic base member 106 having a flat upper surface.
- the magnetization direction is parallel to the target surface 7a between the bar-shaped central magnetic pole member 102, the outer peripheral magnetic pole member 103 installed so as to surround the central magnetic pole member 102, and the central magnetic pole member 102 and the outer peripheral magnetic pole member 103.
- the top surface of the nonmagnetic base member 106 is flat, and both longitudinal ends 102a, 102a of the central magnetic pole member 102 are thin.
- the permanent magnet 104a on the central magnetic pole member 102 may be integrated or may be composed of a plurality of permanent magnets arranged in the major axis direction. If necessary, a plurality of permanent magnets 104a may be provided with an interval in the major axis direction.
- the thickness of the permanent magnet 104a on the central magnetic pole member 102 (h2 in FIG. 9B) can be appropriately adjusted according to the required magnetic field strength and the material of the magnet, but the thickness of the central magnetic pole member 102 and the thickness of the permanent magnet 104a It is preferably 5 to 50% of the total hm, more preferably 10 to 25%.
- the permanent magnet 104a is preferably provided on the central magnetic pole member 102 (on the target side), but may be disposed on the nonmagnetic base member 106 side of the central magnetic pole member 102, and the central magnetic pole member 102 is divided in the horizontal direction. You may arrange
- the magnetization direction is perpendicular to the target surface 7a on the end portion 102a of the central magnetic pole member 102,
- the permanent magnet 105a is placed so that the magnetic pole facing the target surface 7a is the same as the magnetic pole on the end 102a side of the permanent magnet 105.
- the permanent magnet 105a in the corner portion 30 is preferably thicker than the permanent magnet 104 in the straight portion 20.
- the thickness of the permanent magnet 105a is preferably 1.2 to 3 times the thickness of the permanent magnet 104.
- the permanent magnet 105 has a semi-polygonal second outer peripheral magnetic pole part 103c at the corner part 30, it is preferably substantially trapezoidal in plan view as shown in FIG.
- the second outer peripheral magnetic pole portion 103c it is preferable that the second outer peripheral magnetic pole portion 103c has a substantially fan shape in plan view as shown in FIG.
- the permanent magnet 105 in the corner portion 30 may be rectangular in plan view.
- the permanent magnet 105 may completely fill the gap between the end portion 102a and the second outer peripheral magnetic pole portion 103c, and between the adjacent permanent magnets 105 as shown in FIG. A gap 8 may be provided.
- the magnetic flux density on the target surface can be adjusted by the gap 8.
- the occupation area ratio of the permanent magnet 105 to the total area of the gap between the end portion 102a of the central magnetic pole member 102 and the second outer peripheral magnetic pole portion 103c of the outer peripheral magnetic pole member 103 is preferably 30% or more.
- the permanent magnet 105a disposed on the end 102a of the central magnetic pole member 102 preferably has the same shape as the end 102a so as to completely cover the end 102a.
- the thickness in the magnetization direction of the permanent magnet 105a can be adjusted as appropriate according to the required magnetic field strength and the magnet material, but is preferably at least the thickness of the permanent magnet 104a, more preferably 1.5 to 5 times, most preferably 2 to 3 times. preferable.
- the portion where the vertical component of the magnetic flux density becomes zero is a distance r from the central magnetic pole member 102. (R ⁇ R) and the deepest erosion part moves to the center of the target. As a result, the erosion of the target proceeds more uniformly, and the utilization efficiency of the target is improved.
- the horizontal component of the magnetic flux density at the position where the vertical component of the magnetic flux density on the target surface 7a is zero is preferably 10 ⁇ mT or more.
- the central magnetic pole member 102 protrudes toward the target 7, and the central magnetic pole member 102, the target surface 7a, Is shorter than the distance between the outer peripheral magnetic pole member 103 and the target surface 7a.
- the other configuration may be basically the same as that of the first aspect.
- the central magnetic pole member 102 in order to project the central magnetic pole member 102 toward the target 7, (a) the central magnetic pole member 102 is thicker than the outer peripheral magnetic pole member 103 or (b) the nonmagnetic base member in contact with the central magnetic pole member 102 What is necessary is just to make the upper surface part of 106 higher than another part.
- the central upper surface portion 106a of the nonmagnetic base member 106 is higher by h4, and the upper surface of the central magnetic pole member 102 is higher than the outer magnetic pole member 103 by that amount.
- the central magnetic pole member 102 By configuring the central magnetic pole member 102 with a material having a higher magnetic permeability than that of the outer peripheral magnetic pole member 103, the magnetic flux density on the central magnetic pole member 102 can be further increased, and the erosion speed at the center of the target can be further increased.
- a material having high permeability and high saturation magnetization such as permendur (Fe-Co-V) is used for the central magnetic pole member 102, and stainless steel other than austenitic series (for example, SUS430) is used for the outer magnetic pole member 103. Is used.
- a plurality of the first and second magnetic field generators of the present invention are arranged in parallel at a predetermined interval, and each magnetic field generator is moved (oscillated) to the same extent as the interval, thereby using an integrated target. And can be formed on a large substrate.
- the first and second magnetic field generators may be provided with a mechanism for adjusting the distance between the upper surface of the magnetic field generator and the target surface.
- the position (target) is 25 mm from the surface of the magnetic field generator 1 (the surface facing the target of the central magnetic pole member 2 and the outer magnetic pole member 3). Equivalent to the surface position) (a) Peak value of horizontal component of magnetic flux density and (b) Zero cross position (position where vertical component of magnetic flux density becomes zero) is obtained by magnetic field analysis and plotted against tilt angle ⁇ did. The zero cross position is indicated by a distance r from the central magnetic pole member. The results are shown in FIG.
- Example 2 Comparative Example 1 On the non-magnetic base member 106 made of Al-Mg alloy (A5052), the central magnetic pole member 102 made of ferritic stainless steel (SUS430), the outer peripheral magnetic pole member 103, and the ferrite sintered magnet (NMF- manufactured by Hitachi Metals, Ltd.) 3B, permanent magnets 104, 104a, 105 and 105a having a maximum energy product of about 4 MGOe) are arranged, and a magnetic field generator 101 (W) shown in FIGS.
- the non-magnetic base member 106 made of Al-Mg alloy (A5052), the central magnetic pole member 102 made of ferritic stainless steel (SUS430), the outer peripheral magnetic pole member 103, and the ferrite sintered magnet (NMF- manufactured by Hitachi Metals, Ltd.) 3B permanent magnets 104, 104a, 105 and 105a having a maximum energy product of about 4 MGOe) are arranged, and a magnetic field generator 101 (W) shown in FIGS.
- the magnetic flux density at the position of 25 mm from the surface of the magnetic field generator 101 (the surface facing the target) (corresponding to the position of the target surface) is obtained by magnetic field analysis, and the horizontal component is obtained along the A and B lines in FIG.
- the results are plotted in FIGS. 18 and 19, respectively.
- the magnetic flux density is obtained in the same manner, and the horizontal component thereof is shown in FIG. Plotted in FIG.
- the permanent magnet 104a is arranged on the central magnetic pole member 102, and the permanent magnet 105a is arranged at the end of the central magnetic pole member 102, so that the magnetic field in the central part of the target stands sharply. I was able to raise it.
- the position where the horizontal component of the magnetic flux density is 32 mmT changed from 30 mm to 19 mm on the A line and 44 mm to 24 mm on the B line.
- the zero cross position (position where the vertical component of the magnetic flux density becomes zero) at this time is shown by a dotted line in FIG. From these results, it can be seen that the second magnetic field generator expands the erosion region of the target toward the central magnetic pole member 102 and makes the erosion of the target uniform.
- the thickness h5 of the permanent magnet 104a on the central magnetic pole member 102 is fixed to 3 mm, and the thickness h6 of the permanent magnet 105a on the end of the central magnetic pole member 102 is set to 0 mm, 3 mm, 15 mm and 25 mm.
- the horizontal component of the magnetic flux density obtained by the same magnetic field analysis was plotted in FIG. 20 along the D line of FIG. As a result, it has been found that when the thickness h6 of the permanent magnet 105a on the end of the central magnetic pole member 102 is 3 mm, the magnetic field at the center of the target rises most steeply.
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Abstract
Description
(a) 中央磁極部材と、前記中央磁極部材を取り囲む外周磁極部材と、一方の磁極が前記中央磁極部材に対向し、他方の磁極が前記外周磁極部材に対向するように前記中央磁極部材と前記外周磁極部材との間に設置された複数の永久磁石と、前記中央磁極部材、前記外周磁極部材及び前記永久磁石を支持する非磁性ベース部材とを具備し、
(b) 前記レーストラック形状は直線部及びコーナー部を有し、
(c) 少なくとも前記直線部に配置された各永久磁石は、前記中央磁極部材に対向する磁極面が前記ターゲットから遠ざかるように傾斜した磁化方向を有し、
(d) 少なくとも前記直線部に配置された各永久磁石の前記外周磁極部材に対向する磁極面は、前記ベース部材に近い側に前記外周磁極部材に当接しない部分を有し、
(e) 前記中央磁極部材と前記ターゲットとの距離と、前記外周磁極部材と前記ターゲットとの距離とが等しい
ことを特徴とする。
(a) 中央磁極部材と、前記中央磁極部材を取り囲む外周磁極部材と、前記ターゲット表面に平行な磁化方向を有し、かつ一方の磁極が前記中央磁極部材に対向し、他方の磁極が前記外周磁極部材に対向するように前記中央磁極部材と前記外周磁極部材との間に設置された複数の第一の永久磁石と、前記中央磁極部材、前記外周磁極部材及び前記永久磁石を支持する非磁性ベース部材とを具備し、
(b) 磁化方向が前記ターゲット表面に垂直で、前記ターゲット表面に対向する磁極が前記第一の永久磁石の前記中央磁極部材に対向する磁極と同じ第二の永久磁石が前記中央磁極部材上に載置されている
ことを特徴とする。
(a) 中央磁極部材と、前記中央磁極部材を取り囲む外周磁極部材と、前記ターゲット表面に平行な磁化方向を有し、かつ一方の磁極が前記中央磁極部材に対向し、他方の磁極が前記外周磁極部材に対向するように前記中央磁極部材と前記外周磁極部材との間に設置された複数の永久磁石と、前記中央磁極部材、前記外周磁極部材及び前記永久磁石を支持する非磁性ベース部材とを具備し、
(b) 前記中央磁極部材と前記ターゲット表面との距離が前記外周磁極部材と前記ターゲット表面との距離より短い
ことを特徴とする。
図1(a)~図1(c) に示すように、第一のマグネトロンスパッタリング用磁場発生装置1はターゲット表面にレーストラック形状の磁場を発生させるもので、直線部20及び2つのコーナー部30,30からなるレーストラック形状を有している。第一の磁場発生装置1は、非磁性ベース部材6上に配置された棒状の中央磁極部材2と、中央磁極部材2を取り囲むように非磁性ベース部材6上に配置されたレーストラック形状の外周磁極部材3と、非磁性ベース部材6上で中央磁極部材2と外周磁極部材3との間に配置された複数の永久磁石4,5とを具備する。
図1(d) 及び図1(f) に示すように、非磁性ベース部材6は、直線部20の両縁部及びコーナー部30,30にある第一平面16と、直線部20において第一平面部16の内側に延在する溝部17とを有する。溝部17は中央に延在する第二平面17aと、第二平面17aの両側に延在する第一傾斜面17b,17bと、各第一傾斜面17bの外端から第一平面16まで延在するハングオーバ状の第二傾斜面17cとを有する。図示の例では各コーナー部30,30は平面視で多角形状をしているが、限定的でない。各第一傾斜面17b,17bは外側(外周磁極部材3側)が高くなるように傾斜しており、非磁性ベース部材6の上面(第一平面16)に対する傾斜角θは、後述するように5~45°の範囲にあるのが好ましい。
図1(b)~図1(f) に示すように、中央磁極部材2は、下方が台形状で上方が長方形状の断面を有し、直線部20における第二平面17a上に配置された棒状の第一中央磁極部2aと、第一中央磁極部2aの両端に接してコーナー部30,30の第一平面16上に配置された平面視で多角形状の第二中央磁極部2bとからなる。第二中央磁極部2bは第一中央磁極部2aと一体的でも別体でも良い。中央磁極部材2の上面はターゲット面7aに平行であるのが好ましい。
図1(c)~図1(f) に示すように、非磁性ベース部材6の第一平面16上に配置された外周磁極部材3は、直線部20に配置された逆台形状断面を有する第一外周磁極部3aと、コーナー部30,30における第一平面16の縁部に配置された長方形状断面を有する第二外周磁極部3cとからなる。第一外周磁極部3aの内側傾斜面3a’は非磁性ベース部材6の第二傾斜面17cと同一面上にある(整合している)。外周磁極部材3の上面はターゲット面7aに平行であるのが好ましい。
図1(a) に示すように、直線部20に配置された永久磁石4及びコーナー部30,30に配置された永久磁石5の両方とも、一方の磁極が中央磁極部材2に対向し、他方の磁極が外周磁極部材3に対向している。
直線部20における永久磁石4がターゲット面7aと平行な従来の磁場発生装置では、ターゲット面において磁束密度の垂直成分がゼロとなる部分が、平面視で図25に破線で示すような線上(中央磁極部材2から距離Rの位置)に存在する。ターゲットの浸食(エロージョン)は、磁束密度の垂直成分がゼロとなる部分で最も速く進行するので、この部分が中央磁極部材2から離れると、ターゲット中央部のエロージョン進行が遅くなる。従って、ターゲットのエロージョンは不均一になり、ターゲットの利用効率が低下する。
第二のマグネトロンスパッタリング用磁場発生装置101は、(a) 中央磁極部材102と、中央磁極部材102を取り囲む外周磁極部材103と、ターゲット表面に平行な磁化方向を有し、かつ一方の磁極が中央磁極部材102に対向し、他方の磁極が外周磁極部材103に対向するように中央磁極部材102と外周磁極部材103との間に設置された複数の永久磁石104,105と、中央磁極部材102、外周磁極部材103及び永久磁石104,105を支持する非磁性ベース部材106とを具備し、(b-1) 磁化方向がターゲット表面に垂直で、ターゲット表面に対向する磁極が永久磁石104,105の中央磁極部材102側の磁極と同じ永久磁石104a,105aが中央磁極部材102上に載置されているか、(b-2) 中央磁極部材102とターゲット表面との距離が外周磁極部材103とターゲット表面との距離より短く、もって中央磁極部材102のターゲット側の磁束密度が相対的に高いことを特徴とする。このような構造のため、ターゲットの中央部(中央磁極部材102に対向する部分)のエロージョン速度が高くなり、ターゲットの利用効率が向上している。(b-1) の場合(第一の態様)及び(b-2)の場合(第二の態様)について、それぞれ第一のマグネトロンスパッタリング用磁場発生装置1と異なる部分を詳細に説明する。従って、説明のない部分については第一のマグネトロンスパッタリング用磁場発生装置1の説明を参照されたい。
図9(a) 及び図9(b) に示すように、第一の態様による第二のマグネトロンスパッタリング用磁場発生装置101では、平坦な上面を有する非磁性ベース部材106上に、棒状の中央磁極部材102と、中央磁極部材102を取り囲むように設置された外周磁極部材103と、中央磁極部材102と外周磁極部材103との間に、磁化方向がターゲット表面7aに平行で、一方の磁極が中央磁極部材102に対向し、他方の磁極が外周磁極部材103に対向するように設置された複数の永久磁石104及び105とが配置されており、かつ磁化方向がターゲット表面7aに垂直で、ターゲット表面7aに対向する磁極が、永久磁石104,105の中央磁極部材102側の磁極と同じ永久磁石104a,105aが中央磁極部材102及びその端部102a上に載置されている。図示の第二の磁場発生装置101では、非磁性ベース部材106の上面は平坦であり、中央磁極部材102の長手方向両端部102a,102aは薄くなっている。
図15に示すように、第二の態様による第二のマグネトロンスパッタリング用磁場発生装置では、中央磁極部材102がターゲット7側に突出し、中央磁極部材102とターゲット表面7aとの距離が、外周磁極部材103とターゲット表面7aとの距離より短い。これ以外の構成は基本的に第一の態様と同じで良い。中央磁極部材102が突出することにより、中央磁極部材102に対向するターゲット表面7aにおける磁束密度は相対的に高くなり、ターゲット中央部のエロージョン速度が高くなり、もってターゲットの利用効率が高まる。
図7(a)、図7(b) 及び図7(c) に示すように、オーステナイト系ステンレス鋼(SUS304)製の非磁性ベース部材6上に、鋼板(SS400)からなる中央磁極部材2の第一中央磁極部2a及び第二中央磁極部2b、外周磁極部材3の第一外周磁極部3a及び第二外周磁極部3c、並びにR-TM-B系異方性焼結磁石(日立金属株式会社製のNMX50、最大エネルギー積:50 MGOe以上)からなる永久磁石4及び5を配置し、磁場発生装置1(W=1000 mm、L1=700 mm、L2=150 mm、a1=100 mm、b1=50 mm、c1=10 mm、d1=15.5 mm、e1=9.8 mm、f1=30 mm、Wm=20 mm、Wy=10 mm、θ=10°、g1=100 mm、h1=50 mm、i1=10 mm、j1=5 mm及びk1=8 mm)を作製した。また直線部20における永久磁石4の傾斜角θを変化させたときの、磁場発生装置1の表面(中央磁極部材2及び外周磁極部材3の前記ターゲットと対向する面)から25 mmの位置(ターゲット表面の位置に相当)における(a) 磁束密度の水平成分のピーク値、及び(b) ゼロクロス位置(磁束密度の垂直成分がゼロになる位置)を磁場解析により求め、傾斜角θに対してプロットした。前記ゼロクロス位置は中央磁極部材からの距離rで示す。結果を図8に示す。
Al-Mg系合金(A5052)製の非磁性ベース部材106上に、フェライト系ステンレス(SUS430)製の中央磁極部材102、外周磁極部材103、及びフェライト焼結磁石(日立金属株式会社製のNMF-3B、最大エネルギー積:約4 MGOe)からなる永久磁石104,104a,105及び105aを配置し、図16(a)、図16(b) 及び図16(c) に示す磁場発生装置101(W=300 mm、L1=150 mm、L2=75 mm、a2=160 mm、b2=40 mm、c2=30 mm、d2=10 mm、e2=35 mm、f2=55 mm、g2=65 mm、h5=5 mm、h6=10 mm、i2=10 mm、及びj2=15 mm)を作製した。
Claims (9)
- ターゲット表面に磁場を発生させるためのレーストラック形状のマグネトロンスパッタリング用磁場発生装置であって、
(a) 中央磁極部材と、前記中央磁極部材を取り囲む外周磁極部材と、一方の磁極が前記中央磁極部材に対向し、他方の磁極が前記外周磁極部材に対向するように前記中央磁極部材と前記外周磁極部材との間に設置された複数の永久磁石と、前記中央磁極部材、前記外周磁極部材及び前記永久磁石を支持する非磁性ベース部材とを具備し、
(b) 前記レーストラック形状は直線部及びコーナー部を有し、
(c) 少なくとも前記直線部に配置された各永久磁石は、前記中央磁極部材に対向する磁極面が前記ターゲットから遠ざかるように傾斜した磁化方向を有し、
(d) 少なくとも前記直線部に配置された各永久磁石の前記外周磁極部材に対向する磁極面は、前記ベース部材に近い側に前記外周磁極部材に当接しない部分を有し、
(e) 前記中央磁極部材と前記ターゲットとの距離と、前記外周磁極部材と前記ターゲットとの距離とが等しい
ことを特徴とする磁場発生装置。 - 請求項1に記載のレーストラック形状の磁場発生装置において、前記直線部に配置された永久磁石の前記ターゲットに対する傾斜角が5~45°であることを特徴とする磁場発生装置。
- 請求項1又は2に記載のレーストラック形状の磁場発生装置において、前記直線部に配置された複数の永久磁石は、少なくとも2種の傾斜角の異なる永久磁石群によって構成されていることを特徴とする磁場発生装置。
- 請求項1~3のいずれかに記載のレーストラック形状の磁場発生装置において、前記コーナー部に配置された永久磁石が前記ターゲットに平行な方向に磁化されていることを特徴とする磁場発生装置。
- 請求項1~3のいずれかに記載のレーストラック形状の磁場発生装置において、
(a) 前記コーナー部に配置された各永久磁石は前記中央磁極部材に対向する磁極面が前記ターゲットから遠ざかるように傾斜した磁化方向を有し、
(b) 前記コーナー部に配置された各永久磁石の前記外周磁極部材に対向する磁極面は、前記ベース部材に近い側に前記外周磁極部材に当接しない部分を有する
ことを特徴とする磁場発生装置。 - 請求項1~5のいずれかに記載のレーストラック形状のマグネトロンスパッタリング用磁場発生装置において、前記ターゲットと対向する前記中央磁極部材及び前記外周磁極部材の面が前記ターゲットと平行であることを特徴とする磁場発生装置。
- ターゲット表面に磁場を発生させるためのレーストラック形状のマグネトロンスパッタリング用磁場発生装置であって、
(a) 中央磁極部材と、前記中央磁極部材を取り囲む外周磁極部材と、前記ターゲット表面に平行な磁化方向を有し、かつ一方の磁極が前記中央磁極部材に対向し、他方の磁極が前記外周磁極部材に対向するように前記中央磁極部材と前記外周磁極部材との間に設置された複数の第一の永久磁石と、前記中央磁極部材、前記外周磁極部材及び前記永久磁石を支持する非磁性ベース部材とを具備し、
(b) 磁化方向が前記ターゲット表面に垂直で、前記ターゲット表面に対向する磁極が前記第一の永久磁石の前記中央磁極部材に対向する磁極と同じ第二の永久磁石が前記中央磁極部材上に載置されている
ことを特徴とする磁場発生装置。 - 請求項7に記載のレーストラック形状のマグネトロンスパッタリング用磁場発生装置において、前記中央磁極部材は前記レーストラック形状の直線部からコーナー部にわたって延在しており、前記中央磁極部材上に載置された前記第二の永久磁石のうち、前記直線部におけるものより前記中央磁極部材の両端部上に載置されたものの方が厚いことを特徴とする磁場発生装置。
- ターゲット表面に磁場を発生させるためのレーストラック形状のマグネトロンスパッタリング用磁場発生装置であって、
(a) 中央磁極部材と、前記中央磁極部材を取り囲む外周磁極部材と、前記ターゲット表面に平行な磁化方向を有し、かつ一方の磁極が前記中央磁極部材に対向し、他方の磁極が前記外周磁極部材に対向するように前記中央磁極部材と前記外周磁極部材との間に設置された複数の永久磁石と、前記中央磁極部材、前記外周磁極部材及び前記永久磁石を支持する非磁性ベース部材とを具備し、
(b) 前記中央磁極部材と前記ターゲット表面との距離が前記外周磁極部材と前記ターゲット表面との距離より短い
ことを特徴とする磁場発生装置。
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JP2013518083A JP5692374B2 (ja) | 2011-05-30 | 2012-05-28 | レーストラック形状のマグネトロンスパッタリング用磁場発生装置 |
CN201280025831.3A CN103562433B (zh) | 2011-05-30 | 2012-05-28 | 跑道形状的磁控溅射用磁场产生装置 |
US14/122,162 US9378934B2 (en) | 2011-05-30 | 2012-05-28 | Racetrack-shaped magnetic-field-generating apparatus for magnetron sputtering |
DE112012001988.1T DE112012001988T5 (de) | 2011-05-30 | 2012-05-28 | Racetrack-förmige Magnetfeld-erzeugende Vorrichtung für Magnetron-Sputtern |
KR1020137031145A KR20140004785A (ko) | 2011-05-30 | 2012-05-28 | 레이스트랙 형상의 마그네트론 스퍼터링용 자장 발생 장치 |
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JP (1) | JP5692374B2 (ja) |
KR (1) | KR20140004785A (ja) |
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Publication number | Priority date | Publication date | Assignee | Title |
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CN104919082A (zh) * | 2013-02-15 | 2015-09-16 | 日立金属株式会社 | 磁控管溅射用磁场生成装置 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9691533B2 (en) * | 2012-01-30 | 2017-06-27 | Mitsubishi Electric Corporation | Magnetic circuit |
CN103849846B (zh) * | 2014-03-07 | 2015-12-09 | 东莞鑫泰玻璃科技有限公司 | 磁体用调节机构 |
US20170204905A1 (en) * | 2016-01-19 | 2017-07-20 | Paranetics, Inc. | Methods and apparatus for generating magnetic fields |
JP6701455B2 (ja) * | 2017-11-01 | 2020-05-27 | 株式会社アルバック | スパッタリング装置及び成膜方法 |
AU2020223190A1 (en) | 2019-02-14 | 2021-08-12 | Paranetics, Inc. | Methods and apparatus for a magnetic propulsion system |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61147873A (ja) * | 1984-12-19 | 1986-07-05 | Kokusai Electric Co Ltd | マグネトロンスパツタリング装置 |
JPS6417861A (en) * | 1987-07-10 | 1989-01-20 | Seiko Epson Corp | Magnetron cathode for producing magneto-optical recording medium |
JPH03170668A (ja) * | 1989-11-28 | 1991-07-24 | Anelva Corp | 平板マグネトロンスパッタリング装置 |
JPH08134641A (ja) * | 1994-11-09 | 1996-05-28 | Shibaura Eng Works Co Ltd | スパッタリング装置 |
JPH11323547A (ja) * | 1998-05-18 | 1999-11-26 | Sony Corp | スパッタ成膜方法およびその装置 |
JP2008156743A (ja) * | 2006-11-30 | 2008-07-10 | Kobe Steel Ltd | 対向ターゲットスパッタ装置及び対向ターゲットスパッタ方法 |
JP2008156735A (ja) * | 2006-12-26 | 2008-07-10 | Hitachi Metals Ltd | マグネトロンスパッタリング用磁気回路 |
JP2009127109A (ja) * | 2007-11-27 | 2009-06-11 | Hitachi Metals Ltd | マグネトロンスパッタリング装置 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US71989A (en) * | 1867-12-10 | Fbancis c | ||
CH648690A5 (de) * | 1980-10-14 | 1985-03-29 | Balzers Hochvakuum | Kathodenanordnung zur abstaeubung von material von einem target in einer kathodenzerstaeubungsanlage. |
DE3727901A1 (de) * | 1987-08-21 | 1989-03-02 | Leybold Ag | Zerstaeubungskathode nach dem magnetronprinzip |
JPH01147063A (ja) | 1987-12-03 | 1989-06-08 | Ulvac Corp | マグネトロン・スパッタ装置 |
JPH01186671A (ja) * | 1988-01-14 | 1989-07-26 | Toshiba Corp | 化合物半導体装置 |
US5262028A (en) * | 1992-06-01 | 1993-11-16 | Sierra Applied Sciences, Inc. | Planar magnetron sputtering magnet assembly |
JP3798039B2 (ja) | 1994-11-12 | 2006-07-19 | キヤノンアネルバ株式会社 | スパッタ装置のマグネトロンカソード電極 |
SE511139C2 (sv) * | 1997-11-20 | 1999-08-09 | Hana Barankova | Plasmabearbetningsapparat med vridbara magneter |
KR20050053605A (ko) | 1997-12-17 | 2005-06-08 | 어낵시스 트레이딩 아크티엔게젤샤프트 | 마그네트론 스퍼터링 소스 |
US6093293A (en) * | 1997-12-17 | 2000-07-25 | Balzers Hochvakuum Ag | Magnetron sputtering source |
US20030209431A1 (en) * | 2001-04-10 | 2003-11-13 | Brown Jeffrey T. | Magnetron sputtering source with improved target utilization and deposition rate |
JP2009108383A (ja) | 2007-10-31 | 2009-05-21 | Raiku:Kk | ターゲット装置及びマグネトロンスパッタリング装置 |
-
2012
- 2012-05-28 DE DE112012001988.1T patent/DE112012001988T5/de not_active Withdrawn
- 2012-05-28 KR KR1020137031145A patent/KR20140004785A/ko not_active Application Discontinuation
- 2012-05-28 CN CN201280025831.3A patent/CN103562433B/zh not_active Expired - Fee Related
- 2012-05-28 US US14/122,162 patent/US9378934B2/en active Active
- 2012-05-28 WO PCT/JP2012/063663 patent/WO2012165385A1/ja active Application Filing
- 2012-05-28 JP JP2013518083A patent/JP5692374B2/ja active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61147873A (ja) * | 1984-12-19 | 1986-07-05 | Kokusai Electric Co Ltd | マグネトロンスパツタリング装置 |
JPS6417861A (en) * | 1987-07-10 | 1989-01-20 | Seiko Epson Corp | Magnetron cathode for producing magneto-optical recording medium |
JPH03170668A (ja) * | 1989-11-28 | 1991-07-24 | Anelva Corp | 平板マグネトロンスパッタリング装置 |
JPH08134641A (ja) * | 1994-11-09 | 1996-05-28 | Shibaura Eng Works Co Ltd | スパッタリング装置 |
JPH11323547A (ja) * | 1998-05-18 | 1999-11-26 | Sony Corp | スパッタ成膜方法およびその装置 |
JP2008156743A (ja) * | 2006-11-30 | 2008-07-10 | Kobe Steel Ltd | 対向ターゲットスパッタ装置及び対向ターゲットスパッタ方法 |
JP2008156735A (ja) * | 2006-12-26 | 2008-07-10 | Hitachi Metals Ltd | マグネトロンスパッタリング用磁気回路 |
JP2009127109A (ja) * | 2007-11-27 | 2009-06-11 | Hitachi Metals Ltd | マグネトロンスパッタリング装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104919082A (zh) * | 2013-02-15 | 2015-09-16 | 日立金属株式会社 | 磁控管溅射用磁场生成装置 |
CN104919082B (zh) * | 2013-02-15 | 2017-05-10 | 日立金属株式会社 | 磁控管溅射用磁场生成装置 |
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DE112012001988T5 (de) | 2014-02-20 |
JP5692374B2 (ja) | 2015-04-01 |
CN103562433A (zh) | 2014-02-05 |
KR20140004785A (ko) | 2014-01-13 |
JPWO2012165385A1 (ja) | 2015-02-23 |
CN103562433B (zh) | 2016-05-04 |
US9378934B2 (en) | 2016-06-28 |
US20140085024A1 (en) | 2014-03-27 |
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