WO2012157937A3 - 써미스터를 이용한 온도 측정 방법 - Google Patents

써미스터를 이용한 온도 측정 방법 Download PDF

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Publication number
WO2012157937A3
WO2012157937A3 PCT/KR2012/003790 KR2012003790W WO2012157937A3 WO 2012157937 A3 WO2012157937 A3 WO 2012157937A3 KR 2012003790 W KR2012003790 W KR 2012003790W WO 2012157937 A3 WO2012157937 A3 WO 2012157937A3
Authority
WO
WIPO (PCT)
Prior art keywords
thermistor
thermoelectric device
temperature
electrode pin
measuring temperature
Prior art date
Application number
PCT/KR2012/003790
Other languages
English (en)
French (fr)
Other versions
WO2012157937A2 (ko
Inventor
김정수
Original Assignee
주식회사 포벨
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 포벨 filed Critical 주식회사 포벨
Priority to CN201280023298.7A priority Critical patent/CN103534566B/zh
Priority to US14/117,758 priority patent/US9534960B2/en
Publication of WO2012157937A2 publication Critical patent/WO2012157937A2/ko
Publication of WO2012157937A3 publication Critical patent/WO2012157937A3/ko

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/08—Protective devices, e.g. casings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/16—Special arrangements for conducting heat from the object to the sensitive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/068—Stabilisation of laser output parameters
    • H01S5/06804—Stabilisation of laser output parameters by monitoring an external parameter, e.g. temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Thermistors And Varistors (AREA)

Abstract

본 발명은 열전소자를 이용하여 열전소자 상부에 배치되는 부품의 온도를 제어하는 모듈에 있어 열전소자 상부에 배치되는 써미스터를 이용하여 열전소자 상부의 온도를 정밀하게 측정할 수 있도록 하는 써미스터를 이용한 온도 측정 방법에 관한 것이다. 본 발명에 따른 써미스터를 이용한 온도 측정 방법은 써미스터 상부면과 전극핀을 전기적으로 연결할 때 열전소자 또는 열전소자에 부착된 징검다리 서브마운트를 경유하여 써미스터와 전극핀을 전기적으로 연결함으로써 써미스터와 전극핀 사이의 직접 적인 열교환을 억제하고, 또한 써미스터를 열전달률이 낮은 에폭시 등의 고분자 재료로 덮어줌으로써 패키지 내부의 기체에 의한 써미스터와 패키지 뚜껑 사이의 열교환을 효과적으로 억제하여 써미스터가 열전소자의 온도를 정밀하게 측정할 수 있도록 한다.
PCT/KR2012/003790 2011-05-19 2012-05-15 써미스터를 이용한 온도 측정 방법 WO2012157937A2 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201280023298.7A CN103534566B (zh) 2011-05-19 2012-05-15 利用热敏电阻测定温度的方法
US14/117,758 US9534960B2 (en) 2011-05-19 2012-05-15 Method for measuring temperature using a thermistor

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020110047213A KR101291715B1 (ko) 2011-05-19 2011-05-19 써미스터를 이용한 온도 측정 방법
KR10-2011-0047213 2011-05-19

Publications (2)

Publication Number Publication Date
WO2012157937A2 WO2012157937A2 (ko) 2012-11-22
WO2012157937A3 true WO2012157937A3 (ko) 2013-03-21

Family

ID=47177472

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2012/003790 WO2012157937A2 (ko) 2011-05-19 2012-05-15 써미스터를 이용한 온도 측정 방법

Country Status (4)

Country Link
US (1) US9534960B2 (ko)
KR (1) KR101291715B1 (ko)
CN (1) CN103534566B (ko)
WO (1) WO2012157937A2 (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104374494A (zh) * 2014-11-18 2015-02-25 中国人民解放军63655部队 一种用于热敏电阻温度系数标定的封装结构
JP6279651B2 (ja) * 2016-05-12 2018-02-14 株式会社オートネットワーク技術研究所 センサの取付構造
JP6794140B2 (ja) * 2016-05-23 2020-12-02 オプト エレクトロニクス ソリューションズ 光送信機及びこれを含む光モジュール
US10852198B2 (en) * 2018-08-24 2020-12-01 Siemens Industry, Inc. Temperature sensor of thermal monitoring system for use in power distribution systems
CN109407226B (zh) * 2018-11-23 2020-11-10 武汉电信器件有限公司 一种高速eml同轴发射组件及其制作方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05224100A (ja) * 1992-02-18 1993-09-03 Nec Corp 半導体レーザモジュール
JP2006324524A (ja) * 2005-05-19 2006-11-30 Sumitomo Electric Ind Ltd 発光モジュール
JP2009094130A (ja) * 2007-10-04 2009-04-30 Sony Corp 冷却モジュール
JP2009293986A (ja) * 2008-06-03 2009-12-17 Denso Corp 半導体装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3949609A (en) * 1972-01-31 1976-04-13 Hammerslag Julius G Resistance thermometer and disposable probe
JP3035852B2 (ja) * 1990-07-18 2000-04-24 富士通株式会社 半導体レーザモジュール
US6793389B2 (en) * 2002-02-04 2004-09-21 Delphi Technologies, Inc. Monolithically-integrated infrared sensor
JP4728745B2 (ja) * 2005-08-29 2011-07-20 株式会社東芝 熱電素子デバイス及び熱電モジュール
JP5251305B2 (ja) * 2007-08-28 2013-07-31 山里産業株式会社 温度計測器の耐熱保護ボックス及びこれを用いた温度計測装置、並びに温度計測方法
CN201188034Y (zh) * 2008-04-22 2009-01-28 宝山钢铁股份有限公司 煤堆测温装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05224100A (ja) * 1992-02-18 1993-09-03 Nec Corp 半導体レーザモジュール
JP2006324524A (ja) * 2005-05-19 2006-11-30 Sumitomo Electric Ind Ltd 発光モジュール
JP2009094130A (ja) * 2007-10-04 2009-04-30 Sony Corp 冷却モジュール
JP2009293986A (ja) * 2008-06-03 2009-12-17 Denso Corp 半導体装置

Also Published As

Publication number Publication date
CN103534566A (zh) 2014-01-22
CN103534566B (zh) 2015-12-23
KR101291715B1 (ko) 2013-07-31
KR20120129137A (ko) 2012-11-28
US20140079094A1 (en) 2014-03-20
US9534960B2 (en) 2017-01-03
WO2012157937A2 (ko) 2012-11-22

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