WO2012155307A1

WO2012155307A1 - Intelligent double-interface card and welding packaging technology thereof

Info

Publication number: WO2012155307A1
Application number: PCT/CN2011/001506
Authority: WO
Inventors: 王峻峰; 张耀华; 胡细斌; 王建; 张骋; 蒙建福
Original assignee: 上海一芯智能科技有限公司
Priority date: 2011-05-17
Filing date: 2011-09-05
Publication date: 2012-11-22
Also published as: CN102789589A; CN102789589B

Abstract

Disclosed is an intelligent double-interface card. The intelligent double-interface card comprises a card base, an antenna and a chip. A welding spot of the antenna of the intelligent double-interface card is embedded in the card base through a first conductive welding material, the chip is heat-sealed on the card base through an adhesive, and a pin of the chip is electrically connected to a second conductive welding material embedded in the card base, and the second conductive welding material is electrically connected with the antenna through the first conductive welding material. Bottom surfaces of the first and second conductive welding materials are electrically connected through a conductive connection board embedded in the card base. In the present invention, the antenna is not required to be picked out to be welded with the pin on the chip, so the problem of breaking the antenna is completely avoided. According to the present invention, by filling the conductive welding material in auxiliary holes, the welding of the antenna, the conductive welding material and the chip as well as the welding of the chip base plate and the card base can be completed on the same equipment, in the same workstation and by using the same welding head in a manner of heating, therefore, the production rate as well as the production yield and quality are enhanced dramatically.

Description

Intelligent dual interface card and welding and packaging process thereof

The invention relates to the technical field of intelligent dual interface card manufacturing, in particular to an intelligent double interface card and a welding and packaging process thereof. Background technique

The dual interface card is a card that combines the functions of a contact ic card and a contactless IC card. A contact IC card is similar to a telephone card and needs to be inserted into a telephone to be used. The contactless IC card is like a bus IC card, and its chip and antenna are inside the card. Because there is an antenna, when you take the bus, you can complete the card by touching it, and you don't need to touch it. The dual interface card uses a chip for both functions, configures the antenna and connects the antenna to the chip. Dual interface cards are available for both contact and non-contact machines.

At present, the process of manufacturing dual interface cards is as follows: Production of antennas, one layer, one punching, small card, one milling, one hand, one thread, one hand soldering, one chip, back bonding adhesive, one hand soldering, one hand packaging. Referring to Fig. 1, the dual interface card manufactured by the process, the antenna 1 is picked out from the slot 3 of the card base 2, soldered on the pin pad 5 of the chip 4, and the chip 4 is bonded by using the thermal head 7 The agent 6 is heat sealed in the slot 3 of the card base 2. Since the existing wire-drawing, soldering, splicing and packaging in the process of manufacturing the dual-interface card are performed manually, the speed is slow and the quality is difficult to control, especially in the process of the wire-drawing process, if the mastering is not good, the antenna is very easy to be used. Pick up, causing the product to be scrapped. In addition, since the antenna 1 is connected to the pin 5 of the chip 4, it needs to have a certain length. Therefore, during the packaging process, the antenna 1 is zigzag buried in the slot 3 of the card base 2, if the antenna 1 bending transition, it is also easy to cause the antenna 1 to lose power, affecting the performance of the final product. Summary of the invention

One of the technical problems to be solved by the present invention is to provide a smart dual interface card for the technical problems existing in the dual interface card prepared by the existing process for manufacturing a dual interface card.

The second technical problem to be solved by the present invention is that the existing thread picking, soldering, soldering and packaging existing in the process of manufacturing the dual interface card are manually performed, the speed is slow, the quality is difficult to control, and the like, and an intelligent problem is provided. Double interface card splicing and packaging process. The smart dual interface card of the first aspect of the present invention includes a card base, an antenna, and a chip, wherein the defect of the antenna is embedded in the card base through the first conductive splicing material, and the chip is bonded by The agent is heat-sealed on the card base, and the pins of the chip are electrically connected to the second conductive solder material embedded in the card base, and the second conductive solder material is electrically connected to the first conductive solder material and passes through the first conductive electrode The connecting material is electrically connected to the antenna.

A chip slot is defined in the card base, and the chip slot has a first slot for accommodating the chip back cover and a second slot for accommodating the chip substrate, and is disposed on both sides of the first slot a first conductive solder material and a second conductive solder material, wherein the first conductive solder material is located outside the second conductive solder material, and a top surface of the second conductive splicing material forms a portion of the bottom of the second slot; The pins of the chip are located on both sides of the back cover of the chip, and are respectively electrically connected to the second conductive solder materials on both sides of the first slot.

The first conductive solder material and the bottom surface of the second conductive splicing material are electrically connected by a conductive connecting plate embedded in the card base.

The first conductive solder material and the second conductive splicing material are cylindrical structures, wherein the axes of the first conductive splicing material and the second conductive splicing material are parallel to the normal direction of the card base.

The smart dual interface card soldering and packaging process according to the second aspect of the present invention comprises the following steps:

1. Step of preparing the first intermediate card base sheet

Taking a first intermediate card base sheet, drawing a plurality of first card regions on the first intermediate card base sheet, each first card region for preparing a dual interface card, in each first card region One side of the symmetric spacing is punched with two first process apertures and two second process apertures, wherein the distance between the two first process apertures is greater than the distance between the two second process apertures, and a first process aperture and a second process aperture are located on a first side of the first card area, and another first process aperture and another second process aperture are located in a second same area of the first card area side;

2, buried antenna steps

Embedding an antenna in a periphery of each of the first card regions of the first intermediate card base sheet, and crossing both ends of the antenna across the two first process holes in each of the first card regions;

3. Step of preparing a second intermediate card base sheet

Taking a second intermediate card base sheet, drawing a plurality of second card regions on the second intermediate card base sheet, each second card region corresponding to the first card region on the first intermediate card base sheet prepared in step 1. , two third process holes and two fourth workers are punched symmetrically at one side in each second card region The small hole, wherein the distance between the two third process holes is greater than the distance between the two fourth process holes, and a third process hole and a fourth process hole are located in the second card area a first same side, another third process small hole and another fourth process small hole are located on the second same side in the second card area; the positions of the two third process small holes in the second card area are respectively The positions of the first process holes in the first card area correspond to the positions of the two fourth process holes in the second card area respectively corresponding to the positions in the first card areas where the two second process holes are located;

4. Step of preparing a third intermediate card base sheet

Taking a third intermediate card base sheet, drawing a plurality of third card regions on the third intermediate card base sheet, each third card region corresponding to the first card region on the first intermediate card base sheet prepared in step 1. a first conductive connecting plate is disposed on one side of each of the third card regions, and a long hole is disposed in the second conductive connecting plate, and the second conductive connecting plate is disposed in the long hole, wherein the position of the first conductive connecting plate for placing the long hole corresponds to the first a first process small hole and a second process small hole on the first same side in the first card region of the intermediate card base sheet, and the second conductive connecting plate is disposed at the position of the long hole corresponding to the first intermediate card base Another first process small hole and another second process small hole on the second same side in the first card region of the web; and a shape-adapted first conductive connection is placed in each of the conductive connecting plate placing long holes a plate and a second conductive connecting plate;

5, the first lamination step

The second intermediate card base sheet prepared in step 3 is covered on the upper surface of the first card base sheet prepared in step 1, so that each second card area on the second intermediate card base sheet is aligned with the first a first card area on the intermediate card base sheet, and a third process hole in each second card area is aligned with the first process hole in each first card area, and the second in each second card area Aligning the four process holes with the second process hole in each of the first card areas; and covering the upper surface of the third intermediate card base prepared in step 4 on the bottom surface of the first card base piece, and The first conductive connecting plate on the third intermediate card base sheet covers a first process small hole and a second process small hole in the first same side of the first intermediate card base sheet, Two conductive connecting plates cover another first process small hole and another second process small hole on the second same side in the first card region of the first intermediate card base sheet; and finally in the third intermediate card base sheet The bottom surface is covered with a bottom card base sheet, and then the second intermediate card base sheet is A first intermediate the card web, the card web and the third intermediate bottom of the card web laminated together;

6. Filling the conductive soldering material step Depositing a first conductive solder material into each of the third process orifices and each of the first process orifices on the first card base web from each of the third process orifices on the second card base web, until the droplets are dropped Full second; a second conductive solder material is dropped from each of the fourth process holes in the fourth process hole on the second card base sheet and the second process hole on each of the first card base sheets until the drop Filling the first conductive solder material in a first process hole on the first side of the first card region of the first card base sheet and filling the first card region in the first card base sheet The second conductive solder material in a second process hole of the same side is electrically connected to both ends of the first conductive connecting plate respectively; filling the second side of the first card area of the first card base sheet a first conductive solder material in another first process aperture and a second conductive solder material in another second process aperture on the second side of the first card region of the first card base web respectively Electrical connections are formed at both ends of the second conductive connecting plate,

7, the second lamination step

The face card base sheet is covered on the upper surface of the second card base sheet and laminated to obtain a card base comprising a plurality of card bases;

8, punching a single card base step

Cutting a plurality of single card bases from the card base, wherein each card base comprises a set of antennas;

9, milling chip slot steps

Cutting a chip slot on each of the card bases, the chip slot having a first slot for accommodating the chip back cover and a second slot for accommodating the chip substrate, wherein the first slot is located between the two first conductive solder materials Between the bottom of the groove in the second slot until the second conductive solder material is exposed;

10, solder chip steps

Adhesive is adhered to the chip pin area around the back cover of the chip, and then the back surface of the chip is buckled into the chip slot, so that the chip back cover falls into the first slot, and the chip substrate portion falls into In the second slot, the two pins of the chip are in contact with the top surfaces of the two second conductive solder materials, and are heated to a prescribed temperature by the soldering tip, and the pins on the chip are soldered together with the second conductive solder material, and simultaneously utilized. The heat of the welding head welds the chip substrate and the card base together by an adhesive, and forms a dual interface card after completion.

If the surface of the antenna has an insulating varnish, in the step of burying the antenna, the antenna located in the first process hole needs to be stripped.

Since the above technical solution is used, the present invention does not need to pick out the antenna, and on the chip The pins are soldered, so there is absolutely no problem with picking up the antenna. The invention fills the conductive splicing material in the process hole, so that the antenna, the conductive splicing material and the chip are spliced, and the chip substrate and the card base are soldered simultaneously on the same device and the same workstation, using the same horn heating Finishing the welding, thus greatly increasing the production speed and product yield and quality. In addition, the invention adds a conductive connecting plate at the solder joint of the antenna, so that the strength of the antenna defect can be improved, and when the card is subjected to the bending and twisting test, the defect point of the antenna is not easily broken. DRAWINGS

FIG. 1 is a schematic view showing the state of the connection between the existing dual interface card chip and the card base.

Fig. 2 is a partial structural view showing the first intermediate card base sheet of the present invention after punching the first process small hole.

Figure 3 is a cross-sectional view taken along line A-A of Figure 2;

Fig. 4 is a partial structural view showing the first intermediate card base sheet of the present invention after punching the second process small hole.

Figure 5 is a cross-sectional view taken along line A-A of Figure 4 .

6 is a partial structural schematic view of a first intermediate card base sheet after embedding an antenna according to the present invention. Fig. 7 is a cross-sectional view taken along line A-A of Fig. 6.

Figure 8 is an enlarged schematic view of the portion I of Figure 6.

Fig. 9 is a partial structural view showing the second intermediate card base sheet of the present invention after punching the third process small hole.

Figure 10 is a cross-sectional view taken along line A-A of Figure 9.

Figure 11 is a partial structural view of the second intermediate card base sheet of the present invention after the fourth process hole is punched.

Figure 12 is a cross-sectional view taken along line A-A of Figure 11;

FIG. 13 is a partial structural view of the third intermediate card base sheet punched conductive connecting plate after the long hole is placed according to the present invention.

Figure 14 is a cross-sectional view taken along line A-A of Figure 13;

Figure 15 is a structural schematic view showing the second intermediate card base sheet, the first intermediate card base sheet, the third intermediate card base sheet and the bottom card base sheet laminated together.

Fig. 16 is a cross-sectional view taken along line AA of Fig. 15; Figure 17 is a schematic view showing the steps of filling a conductive solder material according to the present invention.

Figure 18 is a schematic view showing the state in which the face card base sheet, the second intermediate card base sheet, the first intermediate card base sheet, the third intermediate card base sheet and the bottom card base sheet are stacked together.

Figure 19 is a schematic view showing the state of the card base after the second laminating step of the present invention.

Figure 20 is a schematic view showing the structure of a single card base of the present invention.

Figure 21 is a cross-sectional view showing the chip slot of a single card base in the present invention.

Figure 22 is a front elevational view of the chip of the present invention.

Figure 23 is a schematic view of the back of the chip of the present invention

Figure 24 is a schematic view showing the welding state of the chip and the card base of the present invention. detailed description

In order to make the technical means, the creative features, the achievement of the objects and the effects of the present invention easy to understand, the embodiments of the present invention will be further described below in conjunction with the specific drawings.

The intelligent dual interface card soldering and packaging process of the invention comprises the following steps:

1. Step of preparing the first intermediate card base sheet

Referring to FIG. 2 and FIG. 3, an intermediate card base sheet 110 is taken, and a plurality of card areas 111 are drawn on the intermediate card base sheet 110, and each card area 111 is used to prepare a dual interface card. Two sides of the card area 111 are symmetrically spaced with two process holes 112, 112a; referring to Figures 4 and 5, two 113, 113a are punched symmetrically at one side in each card area 111. The distance between the two process holes 112, 112a is greater than the distance between the two process holes 113, 113a, and the process holes 112, 113 are located on the first side in the card area 111, the process holes 112a, 113a Located on the second side of the card area 111.

2, buried antenna steps

Referring to FIGS. 6-8, the antenna 200 is embedded in the periphery of each of the card regions 111 of the intermediate card base sheet 110, and both ends of the antenna 200 are respectively spanned through the process holes 112, 112a in the card region 111. If the surface of the antenna 200 has an insulating varnish, in this step, the antenna 200 located in the process holes 112, 112a needs to be stripped.

3. Step of preparing a second intermediate card base sheet

Referring to FIG. 9 and FIG. 10, an intermediate card base sheet 120 is taken, and a plurality of card regions 121 are drawn on the intermediate card base sheet 120. Each card region 121 corresponds to the intermediate card base sheet 110 prepared in step 1. The upper card area 111 is spaced apart from each other in the card area 121 by the process holes 122, 122a. The position of the process holes 122, 122a in the card area 121 and the process holes 112, 112a are in the card area 111. Corresponding to the location;

Referring to Fig. 11 and Fig. 12, two 123, 123a are punched symmetrically at one side in each card area 111, and the position of the process holes 123, 123a in the card area 121 and the process holes 113, 113a are located. The position in the card area 111 corresponds to; the distance between the two process holes 122, 122a is greater than the distance between the two process holes 123, 123a, and the process holes 122, 123 are located in the first area of the card area 121. On the side, the process apertures 122a, 123a are located on the second side of the card area 121.

4. Step of preparing a third intermediate card base sheet

Referring to Figures 13 and 14, an intermediate card base sheet 130 is taken, and a plurality of card areas 131 are drawn on the intermediate card base sheet 130. Each card area 131 corresponds to the intermediate card base sheet 110 prepared in step 1. The card area 131 is intermittently punched with a conductive connecting plate for placing the long holes 132, 132a on one side of each of the card areas 131. The position of the conductive connecting plate for placing the long holes 132 corresponds to the inside of the card area 111 of the intermediate card base sheet 110. The first same side process holes 112, 113, the conductive connecting plate is placed at the position of the long hole 132a corresponding to the second same side process hole 112a, 113a in the card area 111 of the intermediate card base sheet 110; A shape-adapted conductive connecting plates 133, 133a are placed in the long holes 132, 132a, respectively (see Figs. 15 and 16).

5, the first lamination step

Referring to Figures 15 and 16, the intermediate card base sheet 120 prepared in the step 3 is overlaid on the upper surface of the card base sheet 110 prepared in the step 1, so that each card area 121 on the intermediate card base sheet 120 is obtained. The card areas 111 on the intermediate card base sheet 110 are aligned, and the process holes 122, 122a in each of the card areas 121 are respectively aligned with the process holes 112, 112a in each of the card areas 111, each "^ area The process holes 123, 123a in the 121 are respectively aligned with the process holes 113, 113a in each of the card regions 111; and the upper surface of the intermediate card base sheet 130 prepared in the step 4 is covered on the card base 110. On the bottom surface, the conductive connecting plate 133 on the intermediate card base sheet 130 covers the first and the same process holes 112, 113 in the card region 111 of the intermediate card base sheet 110, and the conductive connecting plate 133a covers the middle. The second same side process holes 112a, 113a in the card region 111 of the card base sheet 110; finally, the bottom surface of the intermediate card base sheet 130 is covered with a bottom card base sheet 140, and then the intermediate card base The webs 120, 110, 130 and the base card web 140 are laminated together.

6. Filling the conductive soldering material step Referring to FIG. 17, a conductive splicing material 151 is dropped from the process holes 122, 112a on the process substrate holes 122, 122a and the process holes 12, 112a on the card base sheet 110, respectively. 151a, until the drop is full; the conductive solder material 152 is dropped into the process holes 123, 123a and the process holes 113, 113a on the card substrate 110 from the process holes 123, 123a on the card base 120, respectively. , 152a, until it is full.

Filling the bottom surface of the conductive solder material 151 in the process hole 12 of the first side in the card region 111 of the card base sheet 110 and the process hole filling the first side in the card region 111 of the card base sheet 110 The bottom surface of the conductive solder material 152 in 113 is electrically connected to both ends of the conductive connecting plate 133; the conductive solder material 151a in the process small hole 112a of the second side in the card region 111 of the card base sheet 110 is filled. The bottom surface and the bottom surface of the conductive solder material 152a in the process hole 113a of the second same side filled in the card region 111 of the card base sheet 110 are electrically connected to both ends of the conductive connection plate 133a, respectively. The conductive solder materials 151, 151a are located outside the conductive solder materials 152, 152a. Finally, the conductive solder materials 151, 151a, 152, 152a have a cylindrical structure parallel to the normal direction of the card base.

7, the second lamination step

Referring to Figures 18 and 19, the face card base sheet 150 is overlaid on the upper surface of the second card base web 120, and laminated to obtain a card base 000 comprising a plurality of card bases;

8, punching a single card base step

Referring to Figure 20, a plurality of individual card bases 100 are die cut from the card base 000, wherein each card base 100 includes an antenna.

9, milling chip slot steps

Referring to FIG. 21, a chip slot 101 is milled on each of the card bases 100. The chip slot 101 has a first slot 101a for receiving the chip back cover 310 and a second slot 101b for accommodating the chip substrate 320. A slot 101a is located between the conductive solder materials 152, 152a, and the bottom of the second slot 101b extends until the conductive solder material 152, 152a is exposed, so that the top surface of the conductive solder material 152, 152a forms a portion of the trench of the second slot 101b. bottom.

10, splicing chip steps

Referring to FIG. 22 to FIG. 24, the adhesive 340, 340a is adhered on the periphery of the chip back cover 310 except for the pins 330, 330a of the chip, and then the back surface of the chip is buckled into the chip slot 101, so that the chip back cover 310 is dropped. Into the first slot 101a, the chip substrate 320 partially falls into the second slot 101b. The pins 330, 330a of the chip are respectively in contact with the top surface of the conductive solder materials 152, 152a, and are heated to a predetermined temperature by the boring head 400, and the pins 330, 330a on the chip are respectively connected to the conductive splicing materials 152, 152a. Together, the chip substrate 320 and the card base 100 are soldered together by the adhesives 340, 340a by the heat of the thermal head 7 to form a dual interface card.

The above steps 1, 2, 3, and 4 of the present invention may be controlled without sequence. Alternatively, the intermediate card base sheet 120 may be prepared, and then the intermediate card base sheet 110 may be prepared or the intermediate card base sheet 130 may be prepared first, and then the intermediate card base sheets 110, 120 may be prepared.

The comparison result of the smart dual interface card soldering and packaging process of the invention and the traditional splicing and packaging process are shown in Table 1

Table 1

The scope of the present invention is not limited by the specific embodiments, which are intended to be a single example of the various aspects of the invention, and the functionally equivalent methods and components are also included within the scope of the invention. In fact, various modifications of the present invention can be readily made by those skilled in the art in light of the above description and the accompanying drawings. Such modifications are also intended to fall within the scope of the appended claims.

Claims

Rights request

A smart dual interface card, comprising a card base, an antenna and a chip, wherein the antenna is embedded in the card base through a first conductive solder material, and the chip is heat sealed to the card base by an adhesive The lead of the chip is electrically connected to the second conductive solder material embedded in the card base, and the second conductive splicing material is electrically connected to the first conductive splicing material and electrically connected to the antenna through the first conductive solder material connection.

The smart dual interface card of claim 1 , wherein a chip slot is defined in the card base, and the chip slot has a first slot for accommodating the chip back cover and a chip substrate. a second slot, a first conductive solder material and a second conductive solder material are disposed on both sides of the first slot, wherein the first conductive splicing material is located outside the second conductive solder material, and the The top surface of the second conductive splicing material forms a part of the bottom of the second slot; the pins of the chip are located on both sides of the back cover of the chip, and are respectively electrically connected to the second conductive solder material on both sides of the first slot .

The smart dual interface card according to claim 1 or 2, wherein the bottom surface of the first conductive solder material and the second conductive solder material is electrically connected through a conductive connecting plate embedded in the card base connection.

The smart dual interface card according to claim 1 or 2, wherein the first conductive splicing material and the second conductive splicing material are cylindrical structures, wherein the first conductive solder material and the second conductive The axis of the splicing material is parallel to the normal direction of the card base.

5. The intelligent dual interface card solder packaging process according to claim 1, comprising the steps of:

(1), preparing a first intermediate card base sheet step

(2), buried antenna steps Embedding an antenna in a periphery of each first card region of the first intermediate card base sheet, and crossing both end portions of the antenna across the two first process holes in each of the first card regions;

(3) Step of preparing a second intermediate card base sheet

Taking a second intermediate card base sheet, drawing a plurality of second card regions on the second intermediate card base sheet, each second card region corresponding to the first on the first intermediate card base sheet prepared in the step (1) In the card area, two third process holes and two fourth process holes are punched symmetrically at one side in each second card area, wherein the distance between the two third process holes is greater than two a distance between the four process apertures, and a third process aperture and a fourth process aperture are located on a first side of the second card region, another third process aperture and another fourth process aperture a second same side in the second card area; positions of the two third process holes in the second card area respectively correspond to positions in the first card area where the two first process holes are located, two fourth The position in the second card area where the process hole is located corresponds to the position in the first card area where the two second process holes are located, respectively;

(4) Step of preparing a third intermediate card base sheet

Taking a third intermediate card base sheet, drawing a plurality of third card regions on the third intermediate card base sheet, each third card region corresponding to the first on the first intermediate card base sheet prepared in step (1) In the card area, one side of each of the third card areas is punched with a first conductive connecting plate to place a long hole and two second conductive connecting plates to place a long hole, wherein the position of the first conductive connecting plate for placing the long hole corresponds to a first process small hole and a second process small hole on the first same side in the first card region of the first intermediate card base sheet, and the position of the second conductive connecting plate for placing the long hole corresponds to the first middle Another first process small hole and another second process small hole on the second same side in the first card region of the card base sheet; and a first shape corresponding to each of the conductive connecting plate placement long holes a conductive connecting plate and a second conductive connecting plate;

(5), the first lamination step

Covering the second intermediate card base sheet prepared in the step (3) on the upper surface of the first card base web prepared in the step (1), so that each second card region on the second intermediate card base sheet Aligning the first card area on the first intermediate card base sheet, and the third process hole in each second card area is aligned with the first process hole in each first card area, each second card The fourth process aperture in the area is aligned with the second process aperture in each first card area; and the upper surface of the third intermediate card base prepared in step (4) is overlaid on the first card base material And a first conductive connecting plate on the third intermediate card base sheet covers the first side of the first card base in the first card area a first process aperture and a second process aperture, the second conductive connection plate covering another first process aperture of the second same side in the first card area of the first intermediate card base sheet and another a second process aperture; finally, a bottom card base sheet is covered on the bottom surface of the third intermediate card base sheet, and then the second intermediate card base sheet, the first intermediate card base sheet, and the third The intermediate card base sheet and the bottom card base sheet are laminated together;

(6), step of filling conductive soldering material

Depositing a first conductive splicing material from each of the third process orifices and each of the first process orifices on the first card base web from each of the third process orifices on the second card base web until Drip; adding a second conductive solder material from each of the fourth process holes in the fourth process hole on the second card base sheet and the second process hole on each of the first card base sheets until Filling the first conductive solder material in a first process hole on the first side of the first card region of the first card base sheet and filling the first card region of the first card base sheet; The second conductive solder material in a second process hole on the first side of the first side is electrically connected to the two ends of the first conductive connecting plate respectively; filling the second side of the first card area of the first card base material a first conductive solder material in another first process aperture and a second conductive splicing material in another second process aperture on the second side of the first card region of the first card base web Electrically connecting with both ends of the second conductive connecting plate, respectively.

(7), second lamination step

(8), punching a single card base step

(9), milling chip slot steps

(10), splicing chip steps

Adhesive is adhered to the chip pin area around the back cover of the chip, and then the back surface of the chip is buckled into the chip slot, so that the chip back cover falls into the first slot, and the chip substrate portion falls into In the second slot, the two pins of the chip are in contact with the top surfaces of the two second conductive solder materials, and the soldering head is used. Heating to a predetermined temperature, the pins on the chip are spliced together with the second conductive solder material, and the chip substrate and the card base are soldered together by the bonding agent by the heat of the soldering tip, and a dual interface card is formed after completion.

The smart dual interface card soldering and packaging process according to claim 5, wherein if the antenna surface has an insulating varnish, in the step of burying the antenna, the antenna located in the first process hole is required to be performed. Paint stripping treatment.