WO2012153232A3 - Module de transport de substrats, système de chargement et de déchargement et procédé de transport de substrats dans une installation de traitement de substrats - Google Patents
Module de transport de substrats, système de chargement et de déchargement et procédé de transport de substrats dans une installation de traitement de substrats Download PDFInfo
- Publication number
- WO2012153232A3 WO2012153232A3 PCT/IB2012/052184 IB2012052184W WO2012153232A3 WO 2012153232 A3 WO2012153232 A3 WO 2012153232A3 IB 2012052184 W IB2012052184 W IB 2012052184W WO 2012153232 A3 WO2012153232 A3 WO 2012153232A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- transporting
- processing installation
- module
- loading
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
L'invention concerne un module de transport de substrats d'une installation de traitement de substrats, le module de transport de substrats comportant un dispositif support sous forme d'un plateau support et/ou d'un cadre support et étant conçu pour la réception horizontale et pour le transport horizontal d'au moins un substrat plat ou d'au moins un objet de transport de substrats plat. L'invention concerne en outre un système de chargement et de déchargement d'une installation de traitement de substrats comportant un module de transport de substrats de ce type. En outre, l'invention concerne aussi un procédé de transport d'au moins un substrat plat ou d'au moins un objet de transport de substrats plat dans une installation de traitement de substrats comportant au moins un module de transport de substrats qui comprend un dispositif support sous forme d'un plateau support et/ou d'un cadre support. L'invention vise à proposer un module de transport de substrats, un système de chargement et de déchargement et un procédé de transport de substrats dans une installation de traitement de substrats qui permettent d'éviter des risques de contamination d'une partie de l'installation vers une autre partie de l'installation dans une installation de traitement de substrats en continu et de faire fonctionner de manière efficace une installation de traitement de substrats, le module de transport de substrats et le système de chargement et de déchargement correspondant étant de conception la moins onéreuse possible. À cet effet, le module de transport de substrats d'une installation de traitement de substrats du type susmentionné comprend un dispositif support doté d'éléments support présentant des parties réceptrices horizontales qui forment une réception pour le au moins un substrat plat ou le au moins un objet de transport de substrats plat et qui s'étendent dans une zone se trouvant sous le dispositif support, ledit dispositif support pouvant être couplé à un système de transport du module de transport de substrats dans l'installation de traitement de substrats. L'invention porte également sur un système de chargement et de déchargement utilisant le module de transport de substrats selon l'invention et sur un procédé correspondant.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102011050324.2 | 2011-05-12 | ||
DE201110050324 DE102011050324A1 (de) | 2011-05-12 | 2011-05-12 | Substrattransportmodul, Belade- und Entladesystem und Transportverfahren für Substrate in einer Substratbearbeitungsanlage |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2012153232A2 WO2012153232A2 (fr) | 2012-11-15 |
WO2012153232A3 true WO2012153232A3 (fr) | 2013-01-03 |
Family
ID=46124583
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IB2012/052184 WO2012153232A2 (fr) | 2011-05-12 | 2012-05-02 | Module de transport de substrats, système de chargement et de déchargement et procédé de transport de substrats dans une installation de traitement de substrats |
Country Status (3)
Country | Link |
---|---|
DE (1) | DE102011050324A1 (fr) |
TW (1) | TW201308482A (fr) |
WO (1) | WO2012153232A2 (fr) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102015120723B4 (de) * | 2015-11-30 | 2024-09-26 | VON ARDENNE Asset GmbH & Co. KG | Beschichtungsanordnung, Substratträger und Verfahren |
DE102018216878A1 (de) * | 2018-10-01 | 2020-04-02 | centrotherm international AG | Transporteinheit für paralleles Einfahren oder Ausfahren von Substratträgern, in parallele Prozessrohre und Verfahren zum gleichzeitigen Beladen von parallelen, horizontal beabstandeten Prozessrohren |
CN111471965B (zh) * | 2020-04-30 | 2024-08-23 | 苏州迈正科技有限公司 | 传送载板、真空镀膜设备及真空镀膜方法 |
CN111519169A (zh) * | 2020-05-28 | 2020-08-11 | 深圳市捷佳伟创新能源装备股份有限公司 | 顶升装置和物料加工设备 |
CN115513118A (zh) * | 2022-08-31 | 2022-12-23 | 东方日升(常州)新能源有限公司 | 一种浮动平台、载板浮动定位装置及载板上料系统 |
CN117878044B (zh) * | 2024-03-12 | 2024-06-04 | 四川富美达微电子股份有限公司 | 一种引线框架转移系统 |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1991015032A1 (fr) * | 1990-03-22 | 1991-10-03 | Surface Technology Systems Limited | Mecanismes de chargement |
DE9116285U1 (de) * | 1991-11-05 | 1992-05-27 | Leybold AG, 6450 Hanau | Vorrichtung zur Halterung und zum Transport von Substraten in Vakuumanlagen |
WO1999060611A1 (fr) * | 1998-05-20 | 1999-11-25 | Applied Komatsu Technology, Inc. | Navette de transfert de substrats in situ |
US6120609A (en) * | 1996-10-25 | 2000-09-19 | Applied Materials, Inc. | Self-aligning lift mechanism |
US6227372B1 (en) * | 1998-04-30 | 2001-05-08 | Peak International, Inc. | Component carrier tray for high-temperature applications |
US6364194B1 (en) * | 2000-02-24 | 2002-04-02 | Evenoak Limited | Soldering apparatus |
EP1197988A2 (fr) * | 2000-10-10 | 2002-04-17 | Applied Materials, Inc. | Dispositif d' élévateur pour plusieurs plaquettes et procédé |
EP1622192A1 (fr) * | 2003-05-02 | 2006-02-01 | Ishikawajima-Harima Heavy Industries Co., Ltd. | Dispositif de transfert de substrat d'un appareil de formation de couches minces |
US20070065581A1 (en) * | 2005-09-22 | 2007-03-22 | Tokyo Electron Limited | Substrate processing system and method |
EP2280410A2 (fr) * | 2009-07-31 | 2011-02-02 | Tokyo Electron Limited | Procédé d'assemblage d'un mécanisme de transfert et chambre de transfert |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6646857B2 (en) * | 2001-03-30 | 2003-11-11 | Lam Research Corporation | Semiconductor wafer lifting device and methods for implementing the same |
EP1855324A1 (fr) * | 2006-05-12 | 2007-11-14 | Applied Materials GmbH & Co. KG | Substrate de type vitroceramique |
GB2449309A (en) * | 2007-05-18 | 2008-11-19 | Renewable Energy Corp Asa | A method for exposing a solar cell wafer to a liquid |
-
2011
- 2011-05-12 DE DE201110050324 patent/DE102011050324A1/de not_active Ceased
-
2012
- 2012-05-02 WO PCT/IB2012/052184 patent/WO2012153232A2/fr active Application Filing
- 2012-05-10 TW TW101116650A patent/TW201308482A/zh unknown
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1991015032A1 (fr) * | 1990-03-22 | 1991-10-03 | Surface Technology Systems Limited | Mecanismes de chargement |
DE9116285U1 (de) * | 1991-11-05 | 1992-05-27 | Leybold AG, 6450 Hanau | Vorrichtung zur Halterung und zum Transport von Substraten in Vakuumanlagen |
US6120609A (en) * | 1996-10-25 | 2000-09-19 | Applied Materials, Inc. | Self-aligning lift mechanism |
US6227372B1 (en) * | 1998-04-30 | 2001-05-08 | Peak International, Inc. | Component carrier tray for high-temperature applications |
WO1999060611A1 (fr) * | 1998-05-20 | 1999-11-25 | Applied Komatsu Technology, Inc. | Navette de transfert de substrats in situ |
US6364194B1 (en) * | 2000-02-24 | 2002-04-02 | Evenoak Limited | Soldering apparatus |
EP1197988A2 (fr) * | 2000-10-10 | 2002-04-17 | Applied Materials, Inc. | Dispositif d' élévateur pour plusieurs plaquettes et procédé |
EP1622192A1 (fr) * | 2003-05-02 | 2006-02-01 | Ishikawajima-Harima Heavy Industries Co., Ltd. | Dispositif de transfert de substrat d'un appareil de formation de couches minces |
US20070065581A1 (en) * | 2005-09-22 | 2007-03-22 | Tokyo Electron Limited | Substrate processing system and method |
EP2280410A2 (fr) * | 2009-07-31 | 2011-02-02 | Tokyo Electron Limited | Procédé d'assemblage d'un mécanisme de transfert et chambre de transfert |
Also Published As
Publication number | Publication date |
---|---|
DE102011050324A1 (de) | 2012-11-29 |
WO2012153232A2 (fr) | 2012-11-15 |
TW201308482A (zh) | 2013-02-16 |
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