WO2012153232A3 - Substrate‑transporting module, loading and unloading system, and method for transporting substrates in a substrate‑processing installation - Google Patents

Substrate‑transporting module, loading and unloading system, and method for transporting substrates in a substrate‑processing installation Download PDF

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Publication number
WO2012153232A3
WO2012153232A3 PCT/IB2012/052184 IB2012052184W WO2012153232A3 WO 2012153232 A3 WO2012153232 A3 WO 2012153232A3 IB 2012052184 W IB2012052184 W IB 2012052184W WO 2012153232 A3 WO2012153232 A3 WO 2012153232A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
transporting
processing installation
module
loading
Prior art date
Application number
PCT/IB2012/052184
Other languages
German (de)
French (fr)
Other versions
WO2012153232A2 (en
Inventor
Joachim Mai
Markus BALLMANN
Danny Mueller
Thomas Schulze
Patrick LIPPOLD
Original Assignee
Roth & Rau Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Roth & Rau Ag filed Critical Roth & Rau Ag
Publication of WO2012153232A2 publication Critical patent/WO2012153232A2/en
Publication of WO2012153232A3 publication Critical patent/WO2012153232A3/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate

Abstract

The present invention relates to a substrate‑transporting module of a substrate‑processing installation, wherein the substrate‑transporting module has a carrying device in the form of a carrying panel and/or of a carrying frame and is designed for horizontally accommodating, and horizontally transporting, at least one planar substrate or at least one planar substrate‑transporting means. The invention also relates to a loading and unloading system of a substrate‑processing installation having such a substrate‑transporting module. In addition, the present invention relates to a method for transporting at least one planar substrate, or at least one planar substrate‑transporting means, in a substrate‑processing installation having at least one substrate‑transporting module which has a carrying device in the form of a carrying panel and/or of a carrying frame. The problem of the present invention is that of making available a substrate‑transporting module, a loading and unloading system, and a method for transporting substrates in a substrate‑processing installation, which make it possible to avoid contamination from one section to the next of a continuous substrate‑processing installation and which allow a substrate‑processing installation to be operated more effectively. The intention here is for the substrate‑transporting module and the corresponding loading and unloading system to be capable of being designed in as cost‑effective a manner as possible. This problem is solved, in the first instance, by a substrate‑transporting module of a substrate‑processing installation of the type in question above, wherein, from the carrying device, carrying elements with horizontally oriented bearing sections, which form a bearing means for the at least one planar substrate or the at least one planar substrate‑transporting means, extend into a region beneath the carrying device, and wherein the carrying device can be coupled to a transporting system for transporting the substrate‑transporting module in the substrate‑processing installation. The problem is solved, in addition, by a loading and unloading system which utilizes the substrate‑transporting module according to the invention and by a corresponding method.
PCT/IB2012/052184 2011-05-12 2012-05-02 Substrate‑transporting module, loading and unloading system, and method for transporting substrates in a substrate‑processing installation WO2012153232A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE201110050324 DE102011050324A1 (en) 2011-05-12 2011-05-12 Substrate transport module, loading and unloading system and transport method for substrates in a substrate processing plant
DE102011050324.2 2011-05-12

Publications (2)

Publication Number Publication Date
WO2012153232A2 WO2012153232A2 (en) 2012-11-15
WO2012153232A3 true WO2012153232A3 (en) 2013-01-03

Family

ID=46124583

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2012/052184 WO2012153232A2 (en) 2011-05-12 2012-05-02 Substrate‑transporting module, loading and unloading system, and method for transporting substrates in a substrate‑processing installation

Country Status (3)

Country Link
DE (1) DE102011050324A1 (en)
TW (1) TW201308482A (en)
WO (1) WO2012153232A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015120723A1 (en) * 2015-11-30 2017-06-01 Von Ardenne Gmbh Coating arrangement, substrate carrier and method
DE102018216878A1 (en) * 2018-10-01 2020-04-02 centrotherm international AG Transport unit for parallel retraction or extension of substrate carriers, in parallel process tubes and method for simultaneous loading of parallel, horizontally spaced process tubes
CN111471965A (en) * 2020-04-30 2020-07-31 苏州迈正科技有限公司 Conveying carrier plate, vacuum coating equipment and vacuum coating method
CN111519169A (en) * 2020-05-28 2020-08-11 深圳市捷佳伟创新能源装备股份有限公司 Jacking device and material processing equipment

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991015032A1 (en) * 1990-03-22 1991-10-03 Surface Technology Systems Limited Loading mechanisms
DE9116285U1 (en) * 1991-11-05 1992-05-27 Leybold Ag, 6450 Hanau, De
WO1999060611A1 (en) * 1998-05-20 1999-11-25 Applied Komatsu Technology, Inc. In-situ substrate transfer shuttle
US6120609A (en) * 1996-10-25 2000-09-19 Applied Materials, Inc. Self-aligning lift mechanism
US6227372B1 (en) * 1998-04-30 2001-05-08 Peak International, Inc. Component carrier tray for high-temperature applications
US6364194B1 (en) * 2000-02-24 2002-04-02 Evenoak Limited Soldering apparatus
EP1197988A2 (en) * 2000-10-10 2002-04-17 Applied Materials, Inc. Multiple wafer lift apparatus and method therefor
EP1622192A1 (en) * 2003-05-02 2006-02-01 Ishikawajima-Harima Heavy Industries Co., Ltd. Substrate transfer device of thin-film forming apparatus
US20070065581A1 (en) * 2005-09-22 2007-03-22 Tokyo Electron Limited Substrate processing system and method
EP2280410A2 (en) * 2009-07-31 2011-02-02 Tokyo Electron Limited Assembly method of transfer mechanism and transfer chamber

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6646857B2 (en) * 2001-03-30 2003-11-11 Lam Research Corporation Semiconductor wafer lifting device and methods for implementing the same
EP1855324A1 (en) * 2006-05-12 2007-11-14 Applied Materials GmbH & Co. KG Substrate made of glass ceramic
GB2449309A (en) * 2007-05-18 2008-11-19 Renewable Energy Corp Asa A method for exposing a solar cell wafer to a liquid

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991015032A1 (en) * 1990-03-22 1991-10-03 Surface Technology Systems Limited Loading mechanisms
DE9116285U1 (en) * 1991-11-05 1992-05-27 Leybold Ag, 6450 Hanau, De
US6120609A (en) * 1996-10-25 2000-09-19 Applied Materials, Inc. Self-aligning lift mechanism
US6227372B1 (en) * 1998-04-30 2001-05-08 Peak International, Inc. Component carrier tray for high-temperature applications
WO1999060611A1 (en) * 1998-05-20 1999-11-25 Applied Komatsu Technology, Inc. In-situ substrate transfer shuttle
US6364194B1 (en) * 2000-02-24 2002-04-02 Evenoak Limited Soldering apparatus
EP1197988A2 (en) * 2000-10-10 2002-04-17 Applied Materials, Inc. Multiple wafer lift apparatus and method therefor
EP1622192A1 (en) * 2003-05-02 2006-02-01 Ishikawajima-Harima Heavy Industries Co., Ltd. Substrate transfer device of thin-film forming apparatus
US20070065581A1 (en) * 2005-09-22 2007-03-22 Tokyo Electron Limited Substrate processing system and method
EP2280410A2 (en) * 2009-07-31 2011-02-02 Tokyo Electron Limited Assembly method of transfer mechanism and transfer chamber

Also Published As

Publication number Publication date
WO2012153232A2 (en) 2012-11-15
DE102011050324A1 (en) 2012-11-29
TW201308482A (en) 2013-02-16

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