WO2012150798A3 - In-line heat treatment device - Google Patents

In-line heat treatment device Download PDF

Info

Publication number
WO2012150798A3
WO2012150798A3 PCT/KR2012/003408 KR2012003408W WO2012150798A3 WO 2012150798 A3 WO2012150798 A3 WO 2012150798A3 KR 2012003408 W KR2012003408 W KR 2012003408W WO 2012150798 A3 WO2012150798 A3 WO 2012150798A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
heat treatment
treatment device
transferring
present
Prior art date
Application number
PCT/KR2012/003408
Other languages
French (fr)
Korean (ko)
Other versions
WO2012150798A2 (en
Inventor
이병일
Original Assignee
주식회사 테라세미콘
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020110041935A external-priority patent/KR20120124192A/en
Priority claimed from KR1020110050943A external-priority patent/KR101258629B1/en
Application filed by 주식회사 테라세미콘 filed Critical 주식회사 테라세미콘
Priority to CN201280020758.0A priority Critical patent/CN103503123A/en
Priority to JP2014509242A priority patent/JP2014519187A/en
Publication of WO2012150798A2 publication Critical patent/WO2012150798A2/en
Publication of WO2012150798A3 publication Critical patent/WO2012150798A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Tunnel Furnaces (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Waste-Gas Treatment And Other Accessory Devices For Furnaces (AREA)

Abstract

Disclosed is an in-line heat treatment device. The in-line heat treatment device according to the present invention has a plurality of heaters which are respectively installed in a plurality of furnaces, wherein each of the plurality of the heaters is controlled independently. Thus, since the temperature of each furnace and the temperature difference between mutually neighboring furnaces linearly change by forming a slow grade along the transferring direction of a substrate, there are no concerns regarding damage which may be caused by thermal shocks or thermal stress. Furthermore, the in-line heat treatment device according to the present invention enables the substrate to be lifted up when being transferred such that there is no friction between the substrate and components for transferring the substrate. Thus, since the generation of particles caused by the friction is prevented, there is no damage to the substrate due to the particles. In addition, the in-line treatment device according to the present invention prevents the components for transferring the substrate from being worn out by friction, thereby precisely transferring the substrate. Therefore, there are no errors during a heat treatment process for the substrate. Consequently, according to the present invention, productivity and reliability of the heat treatment process for the substrate are improved.
PCT/KR2012/003408 2011-05-03 2012-05-02 In-line heat treatment device WO2012150798A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201280020758.0A CN103503123A (en) 2011-05-03 2012-05-02 In-line heat treatment device
JP2014509242A JP2014519187A (en) 2011-05-03 2012-05-02 In-line heat treatment equipment

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR1020110041935A KR20120124192A (en) 2011-05-03 2011-05-03 In-line type heat treatment apparatus and method for controlling temperature of the same
KR10-2011-0041935 2011-05-03
KR1020110050943A KR101258629B1 (en) 2011-05-27 2011-05-27 In-line type heat treatment apparatus and method for transporting substrate of the same
KR10-2011-0050943 2011-05-27

Publications (2)

Publication Number Publication Date
WO2012150798A2 WO2012150798A2 (en) 2012-11-08
WO2012150798A3 true WO2012150798A3 (en) 2013-03-21

Family

ID=47108124

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2012/003408 WO2012150798A2 (en) 2011-05-03 2012-05-02 In-line heat treatment device

Country Status (4)

Country Link
JP (1) JP2014519187A (en)
CN (1) CN103503123A (en)
TW (1) TW201310498A (en)
WO (1) WO2012150798A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107256841B (en) * 2017-05-31 2020-07-03 武汉华星光电技术有限公司 Quick thermal annealing machine
CN107887308A (en) * 2017-12-01 2018-04-06 合肥芯欣智能科技有限公司 Full-automatic multi-functional processing equipment

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08316185A (en) * 1995-05-15 1996-11-29 Japan Storage Battery Co Ltd Ultraviolet treatment apparatus
KR100459957B1 (en) * 1996-09-13 2005-01-17 동경 엘렉트론 주식회사 Substrate processing system
KR20060095371A (en) * 2005-02-28 2006-08-31 주식회사 비아트론 Apparatus for heat treatment of semiconductor thin film
KR100897850B1 (en) * 2007-06-18 2009-05-15 세메스 주식회사 Apparatus for processing a substrate

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3933524B2 (en) * 2002-05-30 2007-06-20 東京エレクトロン株式会社 Substrate processing equipment
KR101015597B1 (en) * 2004-05-12 2011-02-17 주식회사 비아트론 Apparatus for Heat Treatment of Semiconductor device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08316185A (en) * 1995-05-15 1996-11-29 Japan Storage Battery Co Ltd Ultraviolet treatment apparatus
KR100459957B1 (en) * 1996-09-13 2005-01-17 동경 엘렉트론 주식회사 Substrate processing system
KR20060095371A (en) * 2005-02-28 2006-08-31 주식회사 비아트론 Apparatus for heat treatment of semiconductor thin film
KR100897850B1 (en) * 2007-06-18 2009-05-15 세메스 주식회사 Apparatus for processing a substrate

Also Published As

Publication number Publication date
JP2014519187A (en) 2014-08-07
WO2012150798A2 (en) 2012-11-08
CN103503123A (en) 2014-01-08
TW201310498A (en) 2013-03-01

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