CN107887308A - Full-automatic multi-functional processing equipment - Google Patents

Full-automatic multi-functional processing equipment Download PDF

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Publication number
CN107887308A
CN107887308A CN201711251547.9A CN201711251547A CN107887308A CN 107887308 A CN107887308 A CN 107887308A CN 201711251547 A CN201711251547 A CN 201711251547A CN 107887308 A CN107887308 A CN 107887308A
Authority
CN
China
Prior art keywords
chamber
crane
full
package cavity
mechanical pump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201711251547.9A
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Chinese (zh)
Inventor
王莹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HEFEI ZHILING INTELLIGENT TECHNOLOGY Co.,Ltd.
Original Assignee
Hefei Core Intelligent Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hefei Core Intelligent Technology Co Ltd filed Critical Hefei Core Intelligent Technology Co Ltd
Priority to CN201711251547.9A priority Critical patent/CN107887308A/en
Publication of CN107887308A publication Critical patent/CN107887308A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

The invention discloses a kind of full-automatic multi-functional processing equipment, is related to semiconductor manufacturing facility technical field, including workbench, and workbench is fixed with thermal processing chamber, activation release chamber, package cavity and excessive chamber successively;First crane, water circulation system and the first mechanical pump are installed in hot processing chamber room;The second crane and the second mechanical pump are installed in activation release chamber;3rd mechanical pump and a molecular pump are installed in package cavity;Track, the first crane, the second crane form track linked system.The present invention is heat-treated, activated the fully-automatic equipment of release, encapsulation, high sealing environment and high vacuum working environment by integrating product.While product turnover is greatly reduced, working environment needed for production is ensure that, substantially increases production efficiency, saves enterprise's production cost.

Description

Full-automatic multi-functional processing equipment
Technical field
The invention belongs to technical field of semiconductors, more particularly to a kind of full-automatic multi-functional processing equipment.
Background technology
With the continuous development of semicon industry, increasing product needs to be heat-treated in process of production, stable The requirement such as gaseous environment, high-cleanness, high, high sealing environment and high vacuum environment.At present the present situation of most enterprise is production equipment Function is single, so as to cause complex production process.The excessive circulation of product will certainly cause product yield to decrease, dangerous Coefficient increases, and the relatively low increase production cost of production efficiency.R & D design integrates the fully-automatic equipment of numerous production functions, It is the direction that existing semicon industry is badly in need of capturing.
The content of the invention
It is an object of the invention to provide full-automatic multi-functional processing equipment, is heat-treated by collecting product, activation discharges, envelope The fully-automatic equipment that dress, high sealing environment and high vacuum working environment are integrated, solves existing production equipment function list One, so as to cause complex production process, cause product yield to decrease, danger coefficient increase the problems such as.
In order to solve the above technical problems, the present invention is achieved by the following technical solutions:
The present invention is full-automatic multi-functional processing equipment, including workbench, the workbench are fixed with hot processing chamber successively Room, activation release chamber, package cavity and excessive chamber;The thermal processing chamber, activation release chamber, package cavity, excessively Connected between chamber by vacuum valve;Lead between the thermal processing chamber, activation release chamber, package cavity, excessive chamber Track is crossed to be linked;First crane, water circulation system and the first mechanical pump are installed in the hot processing chamber room;It is described to swash Second crane and the second mechanical pump are installed in release chamber living;3rd mechanical pump and one point are installed in the package cavity Sub- pump;The track, the first crane, the second crane form track linked system.
Further, the thermal processing chamber, activation release chamber, package cavity and excessive chamber are respectively provided with one Observation window.
Further, the thermal processing chamber Single port and excessive chamber mouth are respectively arranged with door.
Further, it is described that video acquisition device excessively is installed outside the observation window of chamber.
The invention has the advantages that:
1st, the present invention is heat-treated by collecting product, activation discharges, encapsulate, high sealing environment and high vacuum working environment are The fully-automatic equipment of one.While product turnover is greatly reduced, working environment needed for production is ensure that, is greatly improved Production efficiency, save enterprise's production cost.
2nd, the present invention has function diversification, and product turnover is in high stable environment, the reduction human factor of high degree Infringement to product quality, production efficiency is high, steady quality.
Certainly, any product for implementing the present invention it is not absolutely required to reach all the above advantage simultaneously.
Brief description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, used required for being described below to embodiment Accompanying drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for ability For the those of ordinary skill of domain, on the premise of not paying creative work, it can also be obtained according to these accompanying drawings other attached Figure.
Fig. 1 is the full-automatic multi-functional processing equipment schematic diagram of the present invention;
Fig. 2 is Fig. 1 side view.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.It is based on Embodiment in the present invention, those of ordinary skill in the art are obtained all other under the premise of creative work is not made Embodiment, belong to the scope of protection of the invention.
In the description of the invention, it is to be understood that term " perforate ", " on ", " under ", " thickness ", " top ", " in ", Indicating position or the position relationship such as " length ", " interior ", " surrounding ", it is for only for ease of the description present invention and simplifies description, without It is that the component of instruction or hint meaning or element must have specific orientation, with specific azimuth configuration and operation, therefore not It is understood that as limitation of the present invention.
Refer to shown in Fig. 1-2, the present invention is a kind of full-automatic multi-functional processing equipment, including workbench 1, workbench 1 Thermal processing chamber 2, activation release chamber 4, package cavity 5 and excessive chamber 6 are fixed with successively;Thermal processing chamber 2, activation release Connected between chamber 4, package cavity 5, excessive chamber 6 by vacuum valve 3;Thermal processing chamber 2, activation release chamber 4, encapsulation Linked between chamber 5, excessive chamber 6 by track;First crane, water circulation system are installed in thermal processing chamber 2 With the first mechanical pump;Second crane and the second mechanical pump are installed in activation release chamber 4;Is provided with package cavity 5 Three mechanical pumps and a molecular pump;Track, the first crane, the second crane form track linked system.
Wherein, thermal processing chamber 2, activation release chamber 4, package cavity 5 and excessively chamber 6 are respectively provided with an observation Window 9.
Wherein, the Single port of thermal processing chamber 2 and the Single port of excessive chamber 6 are respectively arranged with door 7.
Wherein, video acquisition device is installed, video acquisition device is arranged on outside one outside the observation window 9 of excessive chamber 6 In shell, video acquisition device is connected with a wireless communication module, and the data message that video acquisition device gathers is passed through into channel radio Letter module is sent to terminal device.A supporting plate 8 is also equipped with excessive chamber 6, supporting plate 8 is fixed with the rail coordinated with track side by side Road wheel.
Thermal processing chamber:This chamber is mainly used in the heat treatment requirements of product, and crane is provided with chamber and is used to place production Product.This chamber can meet the product demand of low vacuum equipped with mechanical pump, and be provided with water-cooling system to meet the needs of cooling. When product is heat-treated, the display meeting real-time display related data such as chamber interior vacuum, temperature at present is manipulated.
Activation release chamber:This chamber is mainly used in the related process such as Product Activation, release, and chamber is interior to be provided with crane For placing product.This chamber can meet the product demand of low vacuum equipped with mechanical pump.When activating release, display is manipulated Understand the real-time display related data such as chamber interior vacuum at present.
Package cavity:This chamber is mainly used for the encapsulation of product, and package platforms and sealed in unit are provided with chamber.This Chamber can meet that product is low, the different demands of high vacuum working environment equipped with mechanical pump and molecular pump.In encapsulation, manipulation Display understands the real-time display related data such as chamber interior vacuum, temperature at present.
Excessive chamber:This chamber is mainly used for the over effect taken out at the end of production.
Track linked system:The system is mainly used for the transmission of product between each chamber, and track lifts with each chamber Frame is linked the turnover for realizing product between each chamber.
Vacuum valve device:The present apparatus is mainly used for isolation and UNICOM between each chamber.
In the description of this specification, the description of reference term " one embodiment ", " example ", " specific example " etc. means At least one implementation of the present invention is contained in reference to specific features, structure, material or the feature that the embodiment or example describe In example or example.In this manual, identical embodiment or example are not necessarily referring to the schematic representation of above-mentioned term. Moreover, specific features, structure, material or the feature of description can close in any one or more embodiments or example Suitable mode combines.
Present invention disclosed above preferred embodiment is only intended to help and illustrates the present invention.Preferred embodiment is not detailed All details are described, it is only described embodiment also not limit the invention.Obviously, according to the content of this specification, It can make many modifications and variations.This specification is chosen and specifically describes these embodiments, is to preferably explain the present invention Principle and practical application so that skilled artisan can be best understood by and utilize the present invention.The present invention is only Limited by claims and its four corner and equivalent.

Claims (4)

1. full-automatic multi-functional processing equipment, including workbench (1), it is characterised in that:
The workbench (1) is fixed with thermal processing chamber (2), activation release chamber (4), package cavity (5) and excessive chamber successively Room (6);
The thermal processing chamber (2), activation release chamber (4), package cavity (5), excessive chamber pass through vacuum valve between (6) (3) connect;The thermal processing chamber (2), activation release chamber (4), package cavity (5), excessive chamber pass through track between (6) Linked;
The first crane, water circulation system and the first mechanical pump are installed in the thermal processing chamber (2);
The second crane and the second mechanical pump are installed in the activation release chamber (4);
The 3rd mechanical pump and a molecular pump are installed in the package cavity (5);
The track, the first crane, the second crane form track linked system.
2. full-automatic multi-functional processing equipment according to claim 1, it is characterised in that the thermal processing chamber (2), swash Release chamber (4), package cavity (5) and excessive chamber (6) living are respectively provided with an observation window (9).
3. full-automatic multi-functional processing equipment according to claim 1, it is characterised in that the thermal processing chamber (2) one Port and excessive chamber (6) Single port are respectively arranged with door (7).
4. full-automatic multi-functional processing equipment according to claim 1, it is characterised in that the sight of the excessively chamber (6) Examine and video acquisition device is installed outside window (9).
CN201711251547.9A 2017-12-01 2017-12-01 Full-automatic multi-functional processing equipment Pending CN107887308A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201711251547.9A CN107887308A (en) 2017-12-01 2017-12-01 Full-automatic multi-functional processing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201711251547.9A CN107887308A (en) 2017-12-01 2017-12-01 Full-automatic multi-functional processing equipment

Publications (1)

Publication Number Publication Date
CN107887308A true CN107887308A (en) 2018-04-06

Family

ID=61772716

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201711251547.9A Pending CN107887308A (en) 2017-12-01 2017-12-01 Full-automatic multi-functional processing equipment

Country Status (1)

Country Link
CN (1) CN107887308A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102122609A (en) * 2009-12-10 2011-07-13 奥博泰克Lt太阳能公司 Auto-sequencing inline processing apparatus
CN103503123A (en) * 2011-05-03 2014-01-08 泰拉半导体株式会社 In-line heat treatment device
CN104078384A (en) * 2013-03-27 2014-10-01 泰拉半导体株式会社 In-line type heat treatment apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102122609A (en) * 2009-12-10 2011-07-13 奥博泰克Lt太阳能公司 Auto-sequencing inline processing apparatus
CN103503123A (en) * 2011-05-03 2014-01-08 泰拉半导体株式会社 In-line heat treatment device
CN104078384A (en) * 2013-03-27 2014-10-01 泰拉半导体株式会社 In-line type heat treatment apparatus

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TA01 Transfer of patent application right

Effective date of registration: 20200915

Address after: Room 508, R&D Center Building, China (Hefei) International Intelligent Voice Industry Park, 3333 Xiyou Road, Hefei High-tech Zone, 230000, Anhui Province

Applicant after: HEFEI ZHILING INTELLIGENT TECHNOLOGY Co.,Ltd.

Address before: 230000, Hefei province high tech Zone, 2800 innovation Avenue, 298 innovation industry park, H2 building, room two, Anhui

Applicant before: HEFEI XINXIN INTELLIGENT TECHNOLOGY Co.,Ltd.

TA01 Transfer of patent application right
RJ01 Rejection of invention patent application after publication

Application publication date: 20180406

RJ01 Rejection of invention patent application after publication