CN103258760B - Semiconductor equipment - Google Patents
Semiconductor equipment Download PDFInfo
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- CN103258760B CN103258760B CN201310143962.8A CN201310143962A CN103258760B CN 103258760 B CN103258760 B CN 103258760B CN 201310143962 A CN201310143962 A CN 201310143962A CN 103258760 B CN103258760 B CN 103258760B
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- cooling water
- pipeline
- compression air
- recirculation system
- semiconductor equipment
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Abstract
The present invention provides a kind of semiconductor equipment, including: the first compression air element, cooling water recirculation system, photoresist after bake processing chamber, the first pipeline, described first compression air element is connected with photoresist after bake processing chamber by the first pipeline；Also including: the second compression air element and the 3rd pipeline, described second compression air element is connected with described cooling water recirculation system by the 3rd pipeline.Cooling water circulation unit and the first compression air element being connected to photoresist after bake processing chamber are separated by this connected mode, water can be avoided to penetrate in processing chamber, cause the problem that silicon chip is scrapped.
Description
Technical field
The present invention relates to a kind of semiconductor fabrication process, particularly relate to a kind of semiconductor equipment.
Background technology
When semiconductor equipment carries out semiconductor technology, it is necessary to some parts in semiconductor equipment are cooled down, to guarantee that these component workings are stable, and then ensure that technique can be smoothed out.These need the parts of cooling to be generally some processing chamber, heating unit, magnetic control equipment, reflector etc..And cool down technique and compression air element generally can be adopted to provide the compression mode that air blows or cooling water circulation unit to provide cooling water circulation loop to carry out, Chinese patent application if publication number is CN1875231A discloses and a kind of uses air to carry out the chiller cooled down, and the Chinese patent application that publication number is CN201277761Y discloses a kind of semiconductor refrigeration circulated water cooling apparatus.
For cooling water circulation unit, through after a while, it is necessary to some parts of this system are replaced or keep in repair, to guarantee that cooling water circulation cell operation is stable.Before parts are replaced or keep in repair, it is necessary to the water in cooling water circulation unit is drained.Compression air can be passed into so that the water in cooling water circulation unit is gone out by compressing air extrusion in cooling water circulation unit.
For the AxcelisGPS equipment that semiconductor equipment is produced for Axcelis company, with reference to shown in Fig. 1 and Fig. 2, Fig. 1 is the structural representation of a kind of semiconductor equipment in prior art, and Fig. 2 is the rough schematic view in Fig. 1.
Described semiconductor equipment includes compression air element 100, cooling water recirculation system 200, photoresist after bake processing chamber the 110, first pipeline 11, second pipe 12, three-way valve 300 and air bleeding valve 400.
Described first pipeline 11 connects described compression air element 100 and photoresist after bake processing chamber 110.Described cooling water recirculation system 200 is used for cooling down magnetic control equipment, including cooling water circulation unit the 20, first cooling water pipeline 21 and the second cooling water pipeline 22, and water inlet (not shown).Described first cooling water pipeline 21 and described second cooling water pipeline 22 are respectively connected to two joints of described three-way valve 300, another joint of described three-way valve 300 is connected with second pipe 12 so that cooling water recirculation system 200 is connected with described compression air element 100.
Described photoresist after bake processing chamber 110 for carrying out after bake technique to photoresist after photoresist exposes.The mode of after bake technique is the silicon chip after exposing with Burdick lamp baking.Described compression air element 100 provides compression air to photoresist after bake processing chamber 110 by described first pipeline 11, for cooling down the Burdick lamp in photoresist after bake processing chamber 110, it is ensured that Burdick lamp working stability.
Described second pipe 12 is additionally provided with air bleeding valve 400.Generally, described air bleeding valve 400 is to close so that compression air element 100 and cooling water recirculation system 200 are isolated from each other, and each work alone.When cooling water recirculation system 200 is carried out part replacement by needs, first open air bleeding valve 400, compression air element 100 is made to pass into compression air from three-way valve 300 to the first cooling water pipeline 21 and the second cooling water pipeline 22, water in extruding cooling water recirculation system 200 makes water drain from water inlet, then carries out part replacement again.
And the design of above-mentioned semiconductor equipment is when air bleeding valve 400 damages, it is susceptible to cooling water recirculation system 200 seeped water to the problem in compression air element 100 by air bleeding valve 400, this can cause that moisture is compressed air element and is incorporated in photoresist after bake processing chamber 110, and then the silicon chip in infringement photoresist after bake processing chamber 110.
Summary of the invention
The problem that this invention address that is to provide a kind of semiconductor equipment, it is possible to avoid cooling water circulation unit to be seeped water to compression air element by valve, and then the scrapping of silicon chip in entrance photoresist after bake processing chamber.
For solving the problems referred to above, the present invention provides a kind of semiconductor equipment, including: the first compression air element, cooling water recirculation system, photoresist after bake processing chamber, the first pipeline, described first compression air element is connected with photoresist after bake processing chamber by the first pipeline；Also including: the second compression air element and the 3rd pipeline, described second compression air element is connected with described cooling water recirculation system by the 3rd pipeline.
Optionally, also including second pipe, described second pipe connects described first compression air element and described cooling water recirculation system.
Optionally, described 3rd pipeline is connected with described cooling water recirculation system by described second pipe.
Optionally, described second pipe has cut-off valve, be used for stoping described second pipe and described cooling water recirculation system and described 3rd pipeline communication.
Optionally, described cooling water recirculation system includes: cooling water circulation unit, the first cooling water pipeline and the second cooling water pipeline, described first cooling water pipeline and described second cooling water pipeline interconnect, and are respectively connecting to two ports of described cooling water circulation unit.
Optionally, described 3rd pipeline is directly connected with described cooling water recirculation system.
Optionally, described 3rd pipeline is connected with described first cooling water pipeline and described second cooling water pipeline by three-way valve.
Optionally, also including second pipe, one end of described second pipe connects described first compression air element, and other end end is sealed by plug.
Optionally, described 3rd pipeline includes hand-operated valve.
Optionally, described first pipeline includes electromagnetic valve.
Compared with prior art, technical scheme has the advantage that
In semiconductor equipment, described first compression air element is connected to photoresist after bake processing chamber by the first pipeline, and the second compression air element is connected to described cooling water circulation unit by the 3rd pipeline.Owing to second compresses air element individually to cooling water circulation unit offer compression air, cooling water circulation unit and the first compression air element being connected to photoresist after bake processing chamber can be separated, avoid water can penetrate into the first compression air element, and then can penetrate in photoresist after bake processing chamber, cause the problem that silicon chip is scrapped.
Accompanying drawing explanation
Fig. 1 to Fig. 2 is the structural representation of a kind of semiconductor equipment in prior art；
Fig. 3 to Fig. 4 is the structural representation of a kind of semiconductor equipment that embodiments of the invention one provide；
Fig. 5 is the schematic diagram of a kind of semiconductor equipment that embodiments of the invention two provide；
Fig. 6 is the schematic diagram of a kind of semiconductor equipment that embodiments of the invention three provide；
Fig. 7 to Fig. 8 is the schematic diagram of a kind of semiconductor equipment that embodiments of the invention four provide.
Detailed description of the invention
Shown in Fig. 1, in existing AxcelisGPS equipment, cooling water recirculation system 200 and compression air element 100 are to control whether conducting by the air bleeding valve 400 on second pipe 12.When air bleeding valve 400 is closed, both are isolated each other, each work alone.When air bleeding valve 400 is opened, compression air element 100 can pass into compression air to the first cooling water pipeline 21 of cooling water recirculation system 200 and the second cooling water pipeline 22, so that the water in cooling water recirculation system 200 is gone out by compressing air extrusion, it is simple to part replacement in cooling water recirculation system 200 or maintenance.
Air bleeding valve 400 between the use of long period, cooling water recirculation system 200 and compression air element 100 can break down, and the isolation effect of two systems is not good.At air bleeding valve 400 place, cooling water recirculation system 200 can be leaked, water penetrates in compression air element 100 by air bleeding valve 400, and penetrate in photoresist after bake processing chamber 110 along with compressing the flowing of gas in air element 100, cause silicon chip to scrap, integrated circuit technology processing procedure is produced loss greatly and destroys.
Described air bleeding valve 400 is the electromagnetic valve that semiconductor equipment is original-pack, and precise structure is complicated, and general only semiconductor equipment supplier is just provided that.Buying semiconductor equipment and using after for many years, semiconductor equipment supplier stops supplying corresponding spare part, it is also difficult to likely find the replacing valve of coupling.And the semiconductor equipment that more renews needs the costs such as huge financial resources, manpower.
For such problem, the present invention provides a kind of new semiconductor equipment.Understandable for enabling the above-mentioned purpose of the present invention, feature and advantage to become apparent from, below in conjunction with accompanying drawing, specific embodiments of the invention are described in detail.
Embodiment one
Semiconductor equipment in the present embodiment is described below in conjunction with Fig. 3 and Fig. 4, and wherein Fig. 3 is the structural representation of the semiconductor equipment in the present embodiment, and Fig. 4 is the rough schematic view of Fig. 3.
As shown in FIG., the semiconductor equipment in the present embodiment includes the first compression air element the 101, second compression air element 102, cooling water recirculation system 200, photoresist after bake processing chamber the 110, first pipeline 11, second pipe the 12, the 3rd pipeline 13.
Concrete, described first compression air element 101 and photoresist after bake processing chamber 110 are connected by described first pipeline 11, and described second compression air element 102 and cooling water recirculation system 200 are connected by the 3rd pipeline 13.
In the present embodiment, described semiconductor equipment also includes: three-way valve the 300, second valve 402 and plug 500.Described cooling water recirculation system 200 includes cooling water circulation unit the 20, first cooling water pipeline 21 and the second cooling water pipeline 22.
Concrete, described second pipe 12 adopts plug to seal away from described first one end compressing air element 101.One end of described 3rd pipeline 13 is connected to the second compression air element 102, the other end is connected by three-way valve 300 with described first cooling water pipeline 21 and described second cooling water pipeline 22, so that described second compression air element 102 and cooling water recirculation system 200 couple together.And described 3rd pipeline 13 is provided with the second valve 402.
In the present embodiment, the compression air element that described first compression air element 101 carries for semiconductor equipment, the compressed-air actuated pressure limit being provided that is 19Psi～22Psi.
In the present embodiment, described second compression air element 102 provides for factory service, and the equipment such as including air compressor, compressed air delivery pipeline, its compressed-air actuated pressure limit being provided that is 19Psi～22Psi.
In the present embodiment, described cooling water recirculation system 200 is except cooling water circulation unit the 20, first cooling water pipeline 21 and the second cooling water pipeline 22, it is also possible to include other parts, such as water inlet, water pump, cooling device, and other pipeline etc..Described cooling water recirculation system 200 is used for cooling down magnetic control equipment (MAGNETRON) and reflector (REFLECTOR) etc. needs equipment or the parts of cooling.
After bake technique after adopting Burdick lamp to carry out photoresist exposure in described photoresist after bake processing chamber 110.Carry out in process in technique, it is necessary to Burdick lamp is cooled down by compression air.
Described first valve 401 provides the valve of manufacturer's configuration originally for semiconductor equipment, is generally the electromagnetic valve of precise structure.
Described second valve 402 is hand-operated valve or electromagnetic valve, it is preferred to structure is relatively simple, with low cost, it is easy to the hand-operated valve of realization.
In the present embodiment, described semiconductor equipment connected mode rough schematic view is as shown in Figure 3.Particularly as follows:
In the present embodiment, described semiconductor equipment is in the ordinary course of things, photoresist after bake technique is carried out at described semiconductor equipment, described first compression air element 101 provides compression air, the Burdick lamp in cooling photoresist after bake processing chamber 110 by the first pipeline 11 to photoresist after bake processing chamber 110.
When needing the parts changed or keep in repair in cooling water recirculation system 200, when second valve 402 is opened, compression air in described second compression air element 102 inputs from the 3rd pipeline 13, is entered described first cooling water pipeline 21 of cooling water recirculation system 200 and described second cooling water pipeline 22 by three-way valve 300.Cooling water in described first cooling water pipeline 21 and described second cooling water pipeline 22 and other pipeline of cooling water recirculation system 200 or equipment can be squeezed back the water inlet of cooling water recirculation system 200 by compression air, thus being drained by the water in water circulation system 200, be suitable to safeguard or maintenance water circulation system 200.
In the present embodiment, utilize plug 500 to be blocked by described second pipe 12, described second pipe 12 is mutually isolated out with cooling water recirculation system 200.Thus cooling water recirculation system 200 and the first compression air element 101 being connected to photoresist after bake processing chamber 110 are separated, avoid infiltration and compress air element 101 to first, and then penetrate in photoresist after bake processing chamber 110, cause the problem that silicon chip is scrapped.
In the present embodiment, described second valve 402 can be general hand control valve, and the second compression air element 102 is also equipment common in semiconductor factory, convenient enforcement, and cost is less.
Embodiment two
Semiconductor equipment in the present embodiment is described below in conjunction with Fig. 5.
As shown in FIG., in the present embodiment, described semiconductor equipment includes the first compression air element 101, second and compresses air element the 102, first pipeline 11, second pipe the 12, the 3rd pipeline 13, cooling water recirculation system 200, photoresist after bake processing chamber 110.
Concrete, described first compression air element 101 is connected by described first pipeline 11 and photoresist after bake processing chamber 110.Described second compression air element 102 is connected to second pipe 12 by the 3rd pipeline 13, and second pipe 12 is connected to cooling water recirculation system 200.Further, described second pipe 12 one end is connected to described first compression air element 102.
Described semiconductor equipment also includes: the first three-way valve the 301, second three-way valve the 302, second valve 402 and the 3rd valve 403.Described cooling water recirculation system 200 includes cooling water circulation unit the 20, first cooling water pipeline 21 and the second cooling water pipeline 22.
Concrete, second pipe 12 is connected with the first cooling water pipeline 21 and the second cooling water pipeline 22 by the first three-way valve 301.
Further, described second pipe 12 is divided into two sections, and two interfaces being respectively connected to the second three-way valve 302 realize interconnecting, and another interface and the 3rd pipeline 13 of described second three-way valve 302 are connected.3rd pipeline 13 is provided with the second valve 402.
Described second pipe 12 is provided with the 3rd valve 403 on the first compress between air element 101 and the second three-way valve 302 one section.In the present embodiment, described 3rd valve 403 is cut-off valve, it is adaptable to stop described second pipe 12 to connect with described cooling water recirculation system 200 and described 3rd pipeline 13.
Similar with embodiment one, in the present embodiment, in the ordinary course of things, described first compression air element 101 provides compression air by the first pipeline 11 to photoresist after bake processing chamber 110 to described semiconductor equipment.
And when needing the parts changed or keep in repair in cooling water recirculation system 200, the second valve 402 can be opened, make compression air in described second compression air element 102 pass through one section of second pipe 12 between described 3rd pipeline the 13, second three-way valve the 302, second three-way valve 302 and the first three-way valve 301, and compression air is sent in cooling water recirculation system 200 by the first three-way valve 301.
In the present embodiment, described 3rd valve 403 can cut off the first compression air element 101 and cooling water recirculation system 200, the water in cooling water recirculation system 200 is avoided to penetrate in the first compression air element 101, and then the silicon chip in infringement photoresist after bake processing chamber 110.
In the present embodiment, in described semiconductor equipment, second newly-increased valve the 402, the 3rd valve the 403, second three-way valve the 302, the 3rd pipeline 13 and the second compression air element 102 are in semiconductor factory common equipment or part, solution in the present embodiment is convenient to be implemented, and cost is less.
Embodiment three
Semiconductor equipment in the present embodiment is described below in conjunction with Fig. 6.
Semiconductor equipment in the present embodiment includes the first compression air element 101, second and compresses air element the 102, first pipeline 11, second pipe the 12, the 3rd pipeline 13, cooling water recirculation system 200, photoresist after bake processing chamber 110.
Concrete, described first compression air element 101 and photoresist after bake processing chamber 110 are connected by described first pipeline 11.Second compression air element 102 is connected with described cooling water recirculation system 200 by described 3rd pipeline 13.
Described semiconductor equipment also includes: the first three-way valve the 301, second three-way valve the 302, second valve 402 and the 3rd valve 403.Described cooling water recirculation system 200 includes cooling water circulation unit the 20, first cooling water pipeline 21 and the second cooling water pipeline 22.
Described 3rd pipeline 13 is joined directly together with the first cooling water pipeline 21 or the second cooling water pipeline 22 by the second three-way valve 302 and realizes described second compression air element 102 and be connected with described cooling water recirculation system 200.In the present embodiment, described 3rd pipeline 13 is connected with the second cooling water pipeline 22.Specifically, described second cooling water pipeline 22 is divided into two sections, being respectively connected to two interfaces of the second three-way valve 302, another interface and the 3rd pipeline 13 of described second three-way valve 302 are connected.
Being additionally provided with the second valve 402 on described 3rd pipeline 13, in the present embodiment, described second valve 402 is hand control valve.
Described second pipe 12 is additionally provided with the 3rd valve 403.In the present embodiment, described 3rd valve 403 is cut-off valve, it is adaptable to stop described second pipe 12 to connect with described cooling water recirculation system 200 and described 3rd pipeline 13.
Similar with embodiment one, in the present embodiment, in the ordinary course of things, described first compression air element 101 provides compression air by the first pipeline 11 to photoresist after bake processing chamber 110 to described semiconductor equipment.
And when needing the parts changed or keep in repair in cooling water recirculation system 200, the second valve 402 can be opened, make compression air in described second compression air element 102 pass through one section of second pipe 12 between described 3rd pipeline the 13, second three-way valve the 302, second three-way valve 302 and the first three-way valve 301, and compression air is sent in cooling water recirculation system 200 by the first three-way valve 301.
In the present embodiment, described 3rd valve 403 can cut off the first compression air element 101 and cooling water recirculation system 200, the water in cooling water recirculation system 200 is avoided to penetrate in the first compression air element, and then the silicon chip in infringement photoresist after bake processing chamber 110.
Embodiment four
Semiconductor equipment in the present embodiment can have two kinds of connected modes, wherein the first connected mode is increase water induction device on the architecture basics of the semiconductor equipment described in embodiment two or embodiment three, to sense whether the water in cooling water recirculation system 200 has infiltration to compress air element 101 to first.The second connected mode is increase by the first plug 501 and the second plug 502 on the architecture basics of the semiconductor equipment described in embodiment two or embodiment three.
The present embodiment is for the semiconductor device structure basis in embodiment three:
The first connected mode is as shown in Figure 7, described first three-way valve the 301, the 3rd valve 403, second pipe 12 between the two, (in the region that broken box 9 is illustrated in Fig. 7) distribution on the second pipe 12 of the 3rd valve 403 is provided with water induction device, and water induction device is electrically connected with alarm.
The second connected mode as shown in Figure 8, connects the 3rd valve 403 place in the figure 7 and seals with the first plug 501 on second pipe 12, described first three-way valve 301 connects the joint of second pipe 12 and seals with the second plug 502 in the figure 7.
In the present embodiment, described semiconductor equipment takes the first connected mode to work in the ordinary course of things, when the water that described water induction device senses described cooling water recirculation system 200 penetrates in the region that in Fig. 7, broken box 9 is illustrated, can cause warning.At this moment can immediately take the second connected mode to work, avoid the silicon chip that causes in photoresist after bake processing chamber 110 of infiltration to scrap to wait and lose in time.
Although present disclosure is as above, but the present invention is not limited to this.Any those skilled in the art, without departing from the spirit and scope of the present invention, all can make various changes or modifications, and therefore protection scope of the present invention should be as the criterion with claim limited range.
Claims (10)
1. a semiconductor equipment, including: the first compression air element, cooling water recirculation system, photoresist after bake processing chamber, the first pipeline, described first compression air element is connected with photoresist after bake processing chamber by the first pipeline,
It is characterized in that, also include: the second compression air element and the 3rd pipeline, described second compression air element is passed through the 3rd pipeline and is connected with described cooling water recirculation system, and the other end that described first compression air element is not connected with described photoresist after bake processing chamber seals or by the mode of cut-off valve connecting tee valve to compress air element and cooling water recirculation system disconnection with second or to be connected.
2. semiconductor equipment as claimed in claim 1, it is characterised in that also include second pipe, described second pipe connects described first compression air element and described cooling water recirculation system.
3. semiconductor equipment as claimed in claim 2, it is characterised in that described 3rd pipeline is connected with described cooling water recirculation system by described second pipe.
4. semiconductor equipment as claimed in claim 3, it is characterised in that have cut-off valve on described second pipe, is used for stoping described second pipe and described cooling water recirculation system and described 3rd pipeline communication.
5. semiconductor equipment as claimed in claim 1, it is characterized in that, described cooling water recirculation system includes: cooling water circulation unit, the first cooling water pipeline and the second cooling water pipeline, described first cooling water pipeline and described second cooling water pipeline interconnect, and are respectively connecting to two ports of described cooling water circulation unit.
6. the semiconductor equipment as described in claim 1 or 5, it is characterised in that described 3rd pipeline is directly connected with described cooling water recirculation system.
7. semiconductor equipment as claimed in claim 5, it is characterised in that described 3rd pipeline is connected with described first cooling water pipeline and described second cooling water pipeline by three-way valve.
8. the semiconductor equipment as described in claim 1 or 5, it is characterised in that also include second pipe, one end of described second pipe connects described first compression air element, and other end end is sealed by plug.
9. semiconductor equipment as claimed in claim 1, it is characterised in that include hand-operated valve on described 3rd pipeline.
10. semiconductor equipment as claimed in claim 1, it is characterised in that include electromagnetic valve on described first pipeline.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310143962.8A CN103258760B (en) | 2013-04-23 | 2013-04-23 | Semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310143962.8A CN103258760B (en) | 2013-04-23 | 2013-04-23 | Semiconductor equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103258760A CN103258760A (en) | 2013-08-21 |
| CN103258760B true CN103258760B (en) | 2016-06-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310143962.8A Active CN103258760B (en) | 2013-04-23 | 2013-04-23 | Semiconductor equipment |
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| CN (1) | CN103258760B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112240728B (en) * | 2020-10-28 | 2022-04-19 | 长江存储科技有限责任公司 | Method for improving false alarm of water flow of cooling system of panel and semiconductor processing equipment |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1875231A (en) * | 2003-10-27 | 2006-12-06 | 空气操作工学株式会社 | Cooling device |
| CN201277761Y (en) * | 2008-09-29 | 2009-07-22 | 任炟 | Semiconductor refrigeration circulated water cooling apparatus |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7249628B2 (en) * | 2001-10-01 | 2007-07-31 | Entegris, Inc. | Apparatus for conditioning the temperature of a fluid |
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2013
- 2013-04-23 CN CN201310143962.8A patent/CN103258760B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1875231A (en) * | 2003-10-27 | 2006-12-06 | 空气操作工学株式会社 | Cooling device |
| CN201277761Y (en) * | 2008-09-29 | 2009-07-22 | 任炟 | Semiconductor refrigeration circulated water cooling apparatus |
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| CN103258760A (en) | 2013-08-21 |
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Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HONGLI SEMICONDUCTOR MANUFACTURE CO LTD, SHANGHAI Effective date: 20140410 |
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Effective date of registration: 20140410 Address after: 201203 Shanghai city Zuchongzhi road Pudong New Area Zhangjiang hi tech Park No. 1399 Applicant after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201203 Shanghai city Zuchongzhi road Pudong New Area Zhangjiang hi tech Park No. 1399 Applicant before: Hongli Semiconductor Manufacture Co., Ltd., Shanghai |
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