CN109686674A - A kind of wafer bonding encapsulation glove box - Google Patents
A kind of wafer bonding encapsulation glove box Download PDFInfo
- Publication number
- CN109686674A CN109686674A CN201811569989.2A CN201811569989A CN109686674A CN 109686674 A CN109686674 A CN 109686674A CN 201811569989 A CN201811569989 A CN 201811569989A CN 109686674 A CN109686674 A CN 109686674A
- Authority
- CN
- China
- Prior art keywords
- glove box
- station
- display screen
- box according
- vacuum chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
Abstract
The present invention discloses a kind of wafer bonding encapsulation glove box, it include: station, circulating fan, display screen, transfer chamber and glove box control cabinet, the station is set in glove box, the circulating fan, display screen, transfer chamber are connect with the station respectively, and the glove box control cabinet is used to carry out electrical control to glove box.The present invention, by carrying out series of parameters control to glove box inside, the processing of bonding material is carried out inside glove box, solves the problem of bonding material is easily oxidized, is easily reacted by vapor, be unable to complete binding experiments by the way that glove box is arranged on bonder.
Description
Technical field
The present invention relates to micro-system wafer bonding fields.Glove box is encapsulated more particularly, to a kind of wafer bonding.
Background technique
With the development of science and technology, size, the precision to component are proposed high request.Wafer bonding is semiconductors manufacture
The encapsulation or interconnection of multiple minisize components can be achieved on one wafer for one emerging technology in field, navigate in electronics, aviation
It, communication etc. fields have be widely applied.Wafer bonding machine can realize anode linkage, metal bonding, glass paste bonding etc..
Existing wafer bonding is studied, can realize high vacuum, low water oxygen environment in bonder chamber interior, however material
During chamber interior is transferred to from external environment, high vacuum, low water oxygen environment cannot achieve, for needing the material of these environment
Material, will be unable to complete binding experiments.
Accordingly, it is desirable to provide a kind of wafer bonding encapsulates glove box.
Summary of the invention
The purpose of the present invention is to provide a kind of wafer bondings to encapsulate glove box, solve original material be easily oxidized, easy quilt
The problems such as vapor reaction, water oxygen content limiting value is big when glove box size is too big, easy gas leakage, maintenance cost is high.
In order to achieve the above objectives, the present invention adopts the following technical solutions:
A kind of wafer bonding encapsulation glove box, comprising: station, circulating fan, display screen, transfer chamber and glove box control
Cabinet, the station are set in glove box, and the circulating fan, display screen, transfer chamber are connect with the station respectively, described
Glove box control cabinet is used to carry out electrical control to glove box.
Further, transfer station is equipped in the station, the vacuum chamber of bonder is set to the glove box side, bonding
Material reaches vacuum chamber by the transfer station.
Further, the front and back of the station is transparent toughened glass, and gloves are embedded on glass, for pair
Original material is operated.
Further, the circulating fan is set to above the station, for carrying out to the station internal environment
Cleaning.
Further, it is additionally provided with oxygen measurer in the glove box, is connect with the display screen, the display screen is for showing
Oxygen content inside the glove box.
Further, the transition indoor environment is identical as environment in the station, and the transfer chamber will be for that will be bonded
Material is transferred to inside glove box by transfer chamber.
Further, it is equipped with the vacuum chamber of bonder below the glove box and is connected to station, bonding material is by grasping
Make platform and is loaded by opening vacuum chamber upper cover to vacuum chamber.
Further, the glove box height is highly less than after the vacuum chamber upper cover is opened.
Further, pressure sensor and humidity sensor are additionally provided in the glove box, respectively with the glove box control
Cabinet connection processed, for detecting pressure and humidity in glove box.
Beneficial effects of the present invention are as follows:
Technical solution of the present invention is a series of by carrying out to glove box inside by the way that glove box is arranged on bonder
State modulator carries out the processing of bonding material inside glove box, solves bonding material and be easily oxidized, be easily anti-by vapor
The problem of answering, being unable to complete binding experiments.
Detailed description of the invention
Specific embodiments of the present invention will be described in further detail with reference to the accompanying drawing；
Fig. 1 is that a kind of wafer bonding of the embodiment of the present invention encapsulates glove box structural schematic diagram；
Fig. 2 is that another wafer bonding of the embodiment of the present invention encapsulates glove box structural schematic diagram.
Specific embodiment
In order to illustrate more clearly of the present invention, the present invention is done further below with reference to preferred embodiments and drawings
It is bright.Similar component is indicated in attached drawing with identical appended drawing reference.It will be appreciated by those skilled in the art that institute is specific below
The content of description is illustrative and be not restrictive, and should not be limited the scope of the invention with this.
As shown in Figure 1, the present invention discloses a kind of wafer bonding encapsulation glove box, comprising: station, circulating fan, display
Screen, transfer chamber and glove box control cabinet, the station are set in glove box, the circulating fan, display screen, transfer chamber difference
It is connect with the station, the glove box control cabinet is used to carry out electrical control to glove box.It is equipped with and passes in the station
Platform is sent, the vacuum chamber of bonder is set to the glove box side, and bonding material reaches vacuum chamber by the transfer station.
Bonder transfer station is placed into interior, bonder transfer station part holding ultra-high purity by the glove box station
Degree, ultralow water oxygen content.The front and back of the glove box station is all transparent toughened glass, is used on glass embedded with gloves
It is operated in original material.
The glove box circulating fan, recycles the internal environment of glove box station, improves for filtering dust
Cleanliness absorbs water oxygen and reduces water oxygen content.
It is additionally provided with oxygen measurer in glove box, is connect with the display screen, glove box display screen shows aqueous vapor inside glove box
With the content of oxygen.
The glove box transfer chamber, the making material of miniature gas cell is transferred to inside glove box by transfer chamber.From mistake
It crosses cabin to be transmitted to during glove box, the environment in transfer chamber is identical as environment in glove box.
The glove box control cabinet, the electrical control of glove box control glove box normal circulation, and case pressure is in normal model
It encloses.
As shown in Fig. 2, the invention discloses another wafer bondings to encapsulate glove box, transmission is not contained in this glove box
Platform, including glove box station, glove box circulating fan, display screen, transfer chamber, glove box control cabinet etc..
The glove box station, bonder chamber part keep ultra-high purity, ultralow water oxygen content.The gloves
The front and back of case station is all transparent toughened glass, is used to operate original material embedded with gloves on glass.The hand
Casing height is higher than the height after vacuum chamber upper cover is opened.
The glove box circulating fan will recycle the internal environment of glove box station, mention for filtering dust
High-cleanness, high absorbs water oxygen and reduces water oxygen content.
The glove box display screen, the content of display glove box inside aqueous vapor and oxygen.
The glove box transfer chamber, the making material of miniature gas cell is transferred to inside glove box by transfer chamber.From mistake
It crosses cabin to be transmitted to during glove box, the environment in transfer chamber is identical as environment in glove box.
The glove box control cabinet, the electrical control of glove box control glove box normal circulation, and case pressure is in normal model
It encloses.
It is additionally provided with pressure sensor and humidity sensor in the glove box, is connect respectively with the glove box control cabinet,
For detecting pressure and humidity in glove box.
Technical solution of the present invention is a series of by carrying out to glove box inside by the way that glove box is arranged on bonder
State modulator carries out the processing of bonding material inside glove box, solves bonding material and be easily oxidized, be easily anti-by vapor
The problem of answering, being unable to complete binding experiments.
It will be understood by those skilled in the art that embodiments herein can provide as method, apparatus (equipment) or computer
Program product.Therefore, in terms of the application can be used complete hardware embodiment, complete software embodiment or combine software and hardware
Embodiment form.Moreover, it wherein includes the meter of computer usable program code that the application, which can be used in one or more,
The computer journey implemented in calculation machine usable storage medium (including but not limited to magnetic disk storage, CD-ROM, optical memory etc.)
The form of sequence product.
The application is flow chart of the reference according to method, apparatus (equipment) and computer program product of the embodiment of the present application
And/or block diagram describes.It should be understood that each process in flowchart and/or the block diagram can be realized by computer program instructions
And/or the combination of the process and/or box in box and flowchart and/or the block diagram.It can provide these computer programs to refer to
Enable the processor of general purpose computer, special purpose computer, Embedded Processor or other programmable data processing devices to generate
One machine so that by the instruction that the processor of computer or other programmable data processing devices executes generate for realizing
The device for the function of being specified in one or more flows of the flowchart and/or one or more blocks of the block diagram.
These computer program instructions, which may also be stored in, is able to guide computer or other programmable data processing devices with spy
Determine in the computer-readable memory that mode works, so that it includes referring to that instruction stored in the computer readable memory, which generates,
Enable the manufacture of device, the command device realize in one box of one or more flows of the flowchart and/or block diagram or
The function of being specified in multiple boxes.
Obviously, the above embodiment of the present invention be only to clearly illustrate example of the present invention, and not be pair
The restriction of embodiments of the present invention may be used also on the basis of the above description for those of ordinary skill in the art
To make other variations or changes in different ways, all embodiments can not be exhaustive here, it is all to belong to this hair
The obvious changes or variations that bright technical solution is extended out are still in the scope of protection of the present invention.
Claims (9)
1. a kind of wafer bonding encapsulates glove box characterized by comprising station, circulating fan, display screen, transfer chamber and
Glove box control cabinet, the station be set to glove box in, the circulating fan, display screen, transfer chamber respectively with the operation
Platform connection, the glove box control cabinet are used to carry out electrical control to glove box.
2. glove box according to claim 1, which is characterized in that be equipped with transfer station in the station, bonder it is true
Cavity is set to the glove box side, and bonding material reaches vacuum chamber by the transfer station.
3. glove box according to claim 2, which is characterized in that the front and back of the station is transparent tempering
Glass is embedded with gloves on glass, for operating to original material.
4. glove box according to claim 2, which is characterized in that the circulating fan is set to above the station, is used
It is cleaned in the station internal environment.
5. glove box according to claim 2, which is characterized in that be additionally provided with oxygen measurer in the glove box, shown with described
Display screen connection, the display screen are used to show the oxygen content inside the glove box.
6. glove box according to claim 2, which is characterized in that environment in the transition indoor environment and the station
Identical, the transfer chamber is for bonding material to be transferred to inside glove box by transfer chamber.
7. glove box according to claim 1, which is characterized in that be equipped with the vacuum chamber of bonder simultaneously below the glove box
It is connected to station, bonding material is loaded by opening vacuum chamber upper cover to vacuum chamber by station.
8. glove box according to claim 7, which is characterized in that the vacuum chamber upper cover is highly less than the hand after opening
Casing height.
9. glove box according to claim 1, which is characterized in that be additionally provided with pressure sensor and humidity in the glove box
Sensor is connect with the glove box control cabinet respectively, for detecting pressure and humidity in glove box.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811569989.2A CN109686674A (en) | 2018-12-21 | 2018-12-21 | A kind of wafer bonding encapsulation glove box |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811569989.2A CN109686674A (en) | 2018-12-21 | 2018-12-21 | A kind of wafer bonding encapsulation glove box |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109686674A true CN109686674A (en) | 2019-04-26 |
Family
ID=66188638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811569989.2A Pending CN109686674A (en) | 2018-12-21 | 2018-12-21 | A kind of wafer bonding encapsulation glove box |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109686674A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111496850A (en) * | 2020-03-20 | 2020-08-07 | 上海谦闻智能科技有限公司 | Energy-saving device for glove box and glove box |
| WO2023069798A1 (en) * | 2021-10-22 | 2023-04-27 | Applied Materials, Inc. | Methods and apparatus for processing a substrate |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105013324A (en) * | 2015-07-08 | 2015-11-04 | 威格气体纯化科技（苏州）股份有限公司 | Oxygen removal method for glove box |
| CN106082117A (en) * | 2016-07-26 | 2016-11-09 | 中国科学院声学研究所 | The method that electrostatic bonding equipment and electrostatic bonding produce |
| CN108107707A (en) * | 2017-11-22 | 2018-06-01 | 北京无线电计量测试研究所 | A kind of atomic gas chamber and preparation method |
-
2018
- 2018-12-21 CN CN201811569989.2A patent/CN109686674A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105013324A (en) * | 2015-07-08 | 2015-11-04 | 威格气体纯化科技（苏州）股份有限公司 | Oxygen removal method for glove box |
| CN106082117A (en) * | 2016-07-26 | 2016-11-09 | 中国科学院声学研究所 | The method that electrostatic bonding equipment and electrostatic bonding produce |
| CN108107707A (en) * | 2017-11-22 | 2018-06-01 | 北京无线电计量测试研究所 | A kind of atomic gas chamber and preparation method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111496850A (en) * | 2020-03-20 | 2020-08-07 | 上海谦闻智能科技有限公司 | Energy-saving device for glove box and glove box |
| WO2023069798A1 (en) * | 2021-10-22 | 2023-04-27 | Applied Materials, Inc. | Methods and apparatus for processing a substrate |
| US11756925B2 (en) | 2021-10-22 | 2023-09-12 | Applied Materials, Inc. | Methods and apparatus for vacuum processing a substrate |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190426 |
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| RJ01 | Rejection of invention patent application after publication |