WO2012144827A3 - 금속 배선이 함몰된 유연 기판의 제조방법 및 이에 따라 제조되는 유연 기판 - Google Patents

금속 배선이 함몰된 유연 기판의 제조방법 및 이에 따라 제조되는 유연 기판 Download PDF

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Publication number
WO2012144827A3
WO2012144827A3 PCT/KR2012/003012 KR2012003012W WO2012144827A3 WO 2012144827 A3 WO2012144827 A3 WO 2012144827A3 KR 2012003012 W KR2012003012 W KR 2012003012W WO 2012144827 A3 WO2012144827 A3 WO 2012144827A3
Authority
WO
WIPO (PCT)
Prior art keywords
flexible substrate
metal wiring
sacrificial layer
manufacturing
wiring embedded
Prior art date
Application number
PCT/KR2012/003012
Other languages
English (en)
French (fr)
Other versions
WO2012144827A2 (ko
Inventor
강재욱
김도근
김종국
정성훈
송명관
유대성
김창수
남기석
Original Assignee
한국기계연구원
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020120026063A external-priority patent/KR101191865B1/ko
Application filed by 한국기계연구원 filed Critical 한국기계연구원
Priority to US14/004,557 priority Critical patent/US9445504B2/en
Publication of WO2012144827A2 publication Critical patent/WO2012144827A2/ko
Publication of WO2012144827A3 publication Critical patent/WO2012144827A3/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

본 발명은 금속 배선이 함몰된 유연 기판의 제조방법 및 이에 따라 제조되는 유연 기판에 관한 것으로, 상세하게는 기판상에 물 또는 유기용매에 가용성인 고분 자, 또는 광분해성 고분자로 이루어지는 희생층을 코팅하는 단계(단계 1); 상기 단 계 1의 희생층 상부에 금속 배선을 형성시키는 단계(단계 2); 상기 단계 2의 금속 배선이 형성된 희생층 상부에 경화성 고분자를 코팅하고 경화시켜 금속 배선이 함 몰된 고분자 층을 제조하는 단계(단계 3); 및 상기 단계 1의 기판과 단계 3의 고분 자 층 사이에 존재하는 희생층만을 물 또는 유기 용매에 용해시키거나, 광분해시켜 제거하여, 상기 단계 1의 기판과 단계 3의 고분자 층을 분리시키는 단계(단계 4)를 포함하는 금속 배선이 함몰된 유연(flexible) 기판의 제조방법을 제공한다.
PCT/KR2012/003012 2011-04-20 2012-04-19 금속 배선이 함몰된 유연 기판의 제조방법 및 이에 따라 제조되는 유연 기판 WO2012144827A2 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US14/004,557 US9445504B2 (en) 2011-04-20 2012-04-19 Methods of manufacturing metal wiring buried flexible substrate and flexible substrates manufactured by the same

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
KR20110036471 2011-04-20
KR10-2011-0036471 2011-04-20
KR10-2011-0036472 2011-04-20
KR20110036472 2011-04-20
KR10-2011-0065499 2011-07-01
KR20110065499 2011-07-01
KR10-2011-0079720 2011-08-10
KR20110079720 2011-08-10
KR10-2012-0026063 2012-03-14
KR1020120026063A KR101191865B1 (ko) 2011-04-20 2012-03-14 금속 배선이 함몰된 유연 기판의 제조방법 및 이에 따라 제조되는 유연 기판

Publications (2)

Publication Number Publication Date
WO2012144827A2 WO2012144827A2 (ko) 2012-10-26
WO2012144827A3 true WO2012144827A3 (ko) 2013-03-07

Family

ID=47042054

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2012/003012 WO2012144827A2 (ko) 2011-04-20 2012-04-19 금속 배선이 함몰된 유연 기판의 제조방법 및 이에 따라 제조되는 유연 기판

Country Status (1)

Country Link
WO (1) WO2012144827A2 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114724774B (zh) * 2022-05-06 2023-11-28 嘉兴学院 一种自支撑导电薄膜及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000003944A (ja) * 1998-06-15 2000-01-07 Japan Electronic Materials Corp フレキシブル基板の製造方法
JP2005136318A (ja) * 2003-10-31 2005-05-26 Shin Etsu Polymer Co Ltd フレキシブル配線基板およびその製造方法
KR100735339B1 (ko) * 2006-12-29 2007-07-04 삼성전기주식회사 박막 캐패시터 내장형 배선 기판의 제조방법
KR20100027526A (ko) * 2008-09-02 2010-03-11 삼성전기주식회사 박막 소자 제조방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000003944A (ja) * 1998-06-15 2000-01-07 Japan Electronic Materials Corp フレキシブル基板の製造方法
JP2005136318A (ja) * 2003-10-31 2005-05-26 Shin Etsu Polymer Co Ltd フレキシブル配線基板およびその製造方法
KR100735339B1 (ko) * 2006-12-29 2007-07-04 삼성전기주식회사 박막 캐패시터 내장형 배선 기판의 제조방법
KR20100027526A (ko) * 2008-09-02 2010-03-11 삼성전기주식회사 박막 소자 제조방법

Also Published As

Publication number Publication date
WO2012144827A2 (ko) 2012-10-26

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