WO2012144643A1 - Élément conducteur transparent, dispositif d'entrée, appareil électronique et procédé de fabrication pour élément conducteur transparent - Google Patents

Élément conducteur transparent, dispositif d'entrée, appareil électronique et procédé de fabrication pour élément conducteur transparent Download PDF

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Publication number
WO2012144643A1
WO2012144643A1 PCT/JP2012/060802 JP2012060802W WO2012144643A1 WO 2012144643 A1 WO2012144643 A1 WO 2012144643A1 JP 2012060802 W JP2012060802 W JP 2012060802W WO 2012144643 A1 WO2012144643 A1 WO 2012144643A1
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WIPO (PCT)
Prior art keywords
transparent
pattern portion
transparent conductive
electrode pattern
conductive element
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PCT/JP2012/060802
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English (en)
Japanese (ja)
Inventor
水野　幹久
秀俊 高橋
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ソニー株式会社
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Publication of WO2012144643A1 publication Critical patent/WO2012144643A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J29/00—Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
    • H01J29/02—Electrodes; Screens; Mounting, supporting, spacing or insulating thereof
    • H01J29/10—Screens on or from which an image or pattern is formed, picked up, converted or stored
    • H01J29/18—Luminescent screens
    • H01J29/28—Luminescent screens with protective, conductive or reflective layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/81—Anodes
    • H10K50/813—Anodes characterised by their shape
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display

Definitions

  • the present technology relates to a transparent conductive element, a manufacturing method thereof, an input device using the same, and an electronic apparatus.
  • the present invention relates to an electrode pattern of a transparent conductive element.
  • a transparent conductive film obtained by laminating a transparent thin film with low resistance on a substrate made of a transparent plastic film is widely used for applications utilizing the conductivity.
  • applications in the electric and electronic fields such as flat panel displays such as liquid crystal displays and organic electroluminescence (EL) displays, and transparent electrodes of resistive touch panels.
  • EL organic electroluminescence
  • capacitive touch panels are mounted on mobile devices such as mobile phones and portable music terminals.
  • a transparent conductive film in which a patterned transparent conductive layer is formed on the substrate surface is used.
  • a conventional transparent conductive film is used, the difference in optical characteristics between the portion having the transparent conductive layer and the removed portion is large.
  • the optical adjustment function of the laminated film depends on the wavelength, and thus it is difficult to sufficiently improve the non-visibility of the transparent conductive film. For this reason, in recent years, as a technique for improving the invisibility of the transparent conductive film, a technique replacing the above-described laminated film is desired. Further, in order to realize an input device with stable response speed and position detection accuracy as a capacitive touch panel or the like, the resistance value of the transparent conductive layer must also be considered.
  • the present technology provides a transparent conductive element excellent in non-visibility and suitable for reducing the resistance value of a transparent conductive layer, a manufacturing method thereof, an information input device and an electronic apparatus using the transparent conductive element.
  • the transparent conductive element of the present technology includes a base material, and a transparent electrode pattern portion and a transparent insulating pattern portion formed by alternately spreading in a predetermined direction on the surface of the base material, and the transparent electrode pattern
  • Each of the part and the transparent insulating pattern part has at least a conductive material part, and the conductive material parts are formed in different patterns.
  • the conductive material portion and the nonconductive portion are formed in different random patterns.
  • the transparent electrode pattern portion is formed randomly in the formation surface of the conductive material portion with the plurality of nonconductive portions spaced apart from each other, and the transparent insulating pattern portion is formed of the nonconductive portion.
  • An input device of the present technology includes a first transparent conductive element having a transparent electrode pattern portion and a transparent insulating pattern portion formed by alternately spreading on a surface of a base material in a predetermined direction, and the above-mentioned surface of the base material surface.
  • a transparent electrode pattern portion and a transparent insulating pattern portion formed by alternately spreading in a direction orthogonal to a predetermined direction, and overlapped with the first transparent conductive element as viewed from the input surface direction And a second transparent conductive element arranged in a positional relationship.
  • the transparent electrode pattern portion and the transparent insulating pattern portion in the first and second transparent conductive elements each have at least a conductive material portion, and the conductive material portions are formed in different patterns.
  • the transparent electrode pattern portion and the transparent insulating pattern portion have the conductive material portion and the non-conductive portion formed in different random patterns.
  • the device includes a display device, a first transparent conductive element, and a second transparent conductive element.
  • the 1st transparent conductive element has the transparent electrode pattern part and transparent insulating pattern part which were formed by laying alternately toward the predetermined direction in the display surface of a display apparatus.
  • the second transparent conductive element has a transparent electrode pattern portion and a transparent insulating pattern portion formed by alternately spreading in the direction orthogonal to the predetermined direction on the display surface of the display device.
  • the first and second transparent conductive elements are arranged in a positional relationship where they are overlapped when viewed from the input surface direction.
  • the transparent electrode pattern portion and the transparent insulating pattern portion in the first and second transparent conductive elements each have at least a conductive material portion, and the conductive material portions are formed in different patterns.
  • the production method of the present technology is a production of a transparent conductive element including a base material, and transparent electrode pattern portions and transparent insulating pattern portions formed by alternately spreading in a predetermined direction on the surface of the base material. Is the method. And the process of producing
  • the transparent conductive element includes a transparent electrode pattern portion and a transparent insulating pattern portion.
  • the formation pattern of the conductive material portion and the non-conductive portion is changed.
  • the invisibility between the transparent electrode pattern portion and the transparent insulating pattern portion is improved while avoiding an increase in the resistance value of the conductive material portion that becomes the conductive portion forming the actual electrode.
  • non-visibility can be improved by making each a random pattern, but by making a different random pattern, the transparent electrode pattern portion can improve the coverage of the conductive material portion, and transparent insulation It is possible to reduce the difference between the coverage of the conductive material portion of the pattern portion and the coverage of the conductive material portion of the transparent electrode pattern portion. That is, it is possible to simultaneously realize a reduction in the resistance value of the transparent electrode pattern portion and an improvement in invisibility between the transparent electrode pattern portion and the transparent insulating pattern portion.
  • the present technology there is an effect that it is possible to realize a transparent conductive element and an information input device which are excellent in invisibility and are suitable for reducing the resistance value of the transparent conductive layer. Further, by using this transparent conductive element, there is an effect that it is possible to realize an electronic device capable of high-definition display.
  • FIG. 1 is an explanatory diagram of the structure of the input device according to the embodiment of the present technology.
  • 2A to 2C are explanatory diagrams of the first transparent conductive element according to the first embodiment.
  • 3A and 3B are explanatory diagrams of the structure of the random pattern portion of the first transparent conductive element according to the first embodiment.
  • 4A to 4C are explanatory diagrams of the second transparent conductive element according to the first embodiment.
  • 5A to 5C are explanatory diagrams of the pattern of the conductive portion and the comparative example.
  • FIG. 6 is an explanatory diagram of sheet resistance with respect to the coverage of the conductive portion.
  • 7A and 7B are explanatory diagrams of the overlapping region of the first and second transparent conductive elements in the first embodiment.
  • FIG. 8A and 8B are explanatory diagrams of the first and second transparent conductive elements according to the second embodiment.
  • 9A and 9B are explanatory diagrams of overlapping regions of the first and second transparent conductive elements in the second embodiment.
  • FIG. 10 is an explanatory diagram of a pattern combination according to the second embodiment.
  • 11A and 11B are flowcharts of manufacturing methods I and II of the transparent conductive element of the embodiment.
  • 12A to 12D are explanatory diagrams of the manufacturing method I according to the embodiment.
  • 13A and 13B are explanatory diagrams of the manufacturing method II of the embodiment.
  • 14A and 14B are explanatory diagrams of the manufacturing method II of the embodiment.
  • FIG. 15 is an explanatory diagram of a random pattern forming process according to the embodiment.
  • FIG. 16 is a flowchart of random pattern formation processing according to the embodiment.
  • FIG. 17 is an explanatory diagram of a random pattern forming process according to the embodiment.
  • FIG. 18 is a flowchart of random pattern formation processing according to the embodiment.
  • FIG. 19 is an explanatory diagram of circle coordinates in random pattern formation according to the embodiment.
  • FIG. 20 is an explanatory diagram of a random pattern forming process according to the embodiment.
  • 21A and 21B are explanatory diagrams of random weighting according to the embodiment.
  • 22A to 22C are explanatory diagrams of mesh pattern formation according to the embodiment.
  • 23A to 23C are explanatory diagrams of a transparent conductive element using metal nanowires according to the embodiment.
  • FIG. 24 is an explanatory diagram of a position detection marker according to the embodiment.
  • FIG. 25A to 25C are explanatory diagrams of the silver wiring region of the embodiment.
  • 26A to 26E are explanatory diagrams of various structural examples of the input device according to the embodiment.
  • FIG. 27 is a perspective view illustrating a television (electronic device) including a display unit.
  • 28A and 28B are perspective views illustrating a digital camera (electronic device) including a display unit.
  • FIG. 29 is a perspective view illustrating a notebook personal computer (electronic device) including a display unit.
  • FIG. 30 is a perspective view illustrating a video camera (electronic device) including a display unit.
  • FIG. 31 is a perspective view of a mobile terminal device (electronic device) including a display unit.
  • FIG. 32 is an explanatory diagram of an evaluation result of the example.
  • FIG. 33 is an explanatory diagram of an evaluation result of the example.
  • FIG. 34 is an explanatory diagram of an evaluation result of the example.
  • FIG. 35A and FIG. 35B are explanatory diagrams of a random pattern according to the embodiment.
  • FIG. 36 is an explanatory diagram of a random pattern according to the embodiment.
  • Example of input device structure> ⁇ 2.
  • Transparent Conductive Element of First Embodiment Linear Pattern Electrode> ⁇ 3.
  • Transparent Conductive Element of Second Embodiment Diamond Pattern Electrode> ⁇ 4.
  • Manufacturing Method I> ⁇ 5.
  • Method for forming random pattern> ⁇ 7.
  • Position detection marker> ⁇ 9.
  • Example of electronic device structure> ⁇ 1.
  • FIG. 1 is a cross-sectional view illustrating an example of a configuration of an input device according to an embodiment of the present technology. As shown in FIG.
  • the input device 10 is provided on the display surface of the display device 4.
  • the input device 10 is bonded to the display surface of the display device 4 by, for example, a bonding layer 5.
  • the input device 10 is a so-called projected capacitive touch panel, and includes a first transparent conductive element 1 and a second transparent conductive element 2 provided on the surface of the transparent conductive element 1. .
  • the transparent conductive element 1 forms an X electrode
  • the transparent conductive element 2 forms a Y electrode.
  • the transparent conductive element 1 and the transparent conductive element 2 are bonded together via a bonding layer 6.
  • you may make it further provide the optical layers 3, such as an antireflection film, on the surface of the transparent conductive element 2 through the bonding layer 7 as needed.
  • the optical layer 3 may be a ceramic coat (overcoat) such as SiO2.
  • the transparent conductive element 1 is formed by forming a transparent conductive layer 12 on the surface of the substrate 11 (in this example, the bonding layer 5 side).
  • the transparent conductive element 2 is formed by forming a transparent conductive layer 22 on the surface of the base material 21 (in this case, the bonding layer 6 side).
  • this display device 4 is not particularly limited, for example, a liquid crystal display, a CRT (Cathode Ray Tube) display, a plasma display (PDP), an electroluminescence (EL) display, Various display devices such as a surface-conduction electron-emitter display (SED) may be used.
  • a display device 4 is not particularly limited, for example, a liquid crystal display, a CRT (Cathode Ray Tube) display, a plasma display (PDP), an electroluminescence (EL) display, Various display devices such as a surface-conduction electron-emitter display (SED) may be used.
  • a surface-conduction electron-emitter display SED
  • the transparent conductive element 1 includes a substrate 11 having a surface and a transparent conductive layer 12 formed on the surface.
  • the transparent conductive layer 12 includes a transparent electrode pattern portion 13 and a transparent insulating pattern portion 14.
  • the transparent electrode pattern portion 13 is an X electrode pattern portion that extends in the X-axis direction.
  • the transparent insulating pattern portion 14 is a so-called dummy electrode pattern portion, extends in the X-axis direction, and is interposed between the transparent electrode pattern portions 13 to insulate between the adjacent transparent electrode pattern portions 13. It is a pattern part.
  • transparent electrode pattern portions 13 and transparent insulating pattern portions 14 are alternately laid on the surface of the substrate 11 in the Y-axis direction. 2A to 2C, a region R1 indicates a formation region of the transparent electrode pattern portion 13, and a region R2 indicates a formation region of the transparent insulating pattern portion 14.
  • the shapes of the transparent electrode pattern portion 13 and the transparent insulating pattern portion 14 are preferably selected as appropriate according to the screen shape, the drive circuit, etc. For example, a straight line shape or a plurality of rhombus shapes (diamond shape) are linearly connected However, it is not particularly limited to these shapes. In the first embodiment, the transparent electrode pattern portion 13 and the transparent insulating pattern portion 14 are linear patterns.
  • the transparent electrode pattern portion 13 is a transparent conductive layer formed by randomly separating a plurality of hole portions 13a, and a conductive portion 13b is interposed between adjacent hole portions 13a.
  • the conductive portion 13b is a conductive material portion in which a conductive material is coated on the surface of the substrate 11, and the hole portion 13a is a portion that is not covered with the conductive material, that is, a nonconductive portion. Therefore, in the transparent electrode pattern portion 13, a plurality of non-conductive portions (hole portions 13a) are formed at random in the formation surface of the conductive material portion (conductive portion 13b).
  • the transparent insulating pattern portion 14 is a transparent conductive layer composed of a plurality of island portions 14a that are randomly formed apart from each other, and a gap portion 14b as an insulating portion is interposed between adjacent island portions 14a.
  • the island portion 14a is a conductive material portion in which the surface of the base material 11 is coated with a conductive material
  • the gap portion 14b is a portion that is not covered with the conductive material, that is, a non-conductive portion. Accordingly, the transparent insulating pattern portion 14 is formed at random in the formation surface of the non-conductive portion (gap portion 14b) with the conductive material portion (island portion 14a) spaced apart.
  • the transparent electrode pattern portion 13 and the transparent insulating pattern portion 14 are formed in different random patterns. Specifically, the patterns formed by the boundary between the conductive material part and the non-conductive part are different random patterns. Different random patterns are formed by arranging conductive material portions and non-conductive portions based on random patterns generated under different generation conditions. That is, a random pattern for the transparent electrode pattern portion 13 is formed, and the hole portion 13a and the conductive portion 13b are formed based on the random pattern. Further, a random pattern for the transparent insulating pattern portion 14 is formed, and an island portion 14a and a gap portion 14b are formed based on the random pattern. In the gap portion 14b of the transparent insulating pattern portion 14, it is preferable that the conductive material is completely removed.
  • FIG. 3A is an enlarged plan view showing the vicinity of the boundary line between the transparent electrode pattern portion 13 and the transparent insulating pattern portion 14.
  • 3B is a cross-sectional view taken along line bb shown in FIG.
  • the conductive portion 13b and the island portion 14a become a portion coated with the conductive material on the base material 11, and the hole portion 13a and the gap portion 14b are removed of the conductive material and the surface of the base material is exposed. It is a part to do.
  • the transparent electrode pattern portion 13 and the transparent insulating pattern portion 14 are formed with conductive material portions and non-conductive portions in different random patterns, and on the boundary line L1, there are simply two types of random The pattern is cut and pasted as it is. For this reason, the boundary line between the conductive material portion and the non-conductive portion in the vicinity of the boundary line L1 becomes irregular, and the visual recognition of the boundary line L1 can be suppressed.
  • FIG. 3B the conductive portion 13b and the island portion 14a become a portion coated with the conductive material on the base material 11, and the hole portion 13a and the gap portion 14b are removed of the conductive material and the surface of the base material is exposed. It is a part to do.
  • FIG. 4 shows the transparent conductive element 2 forming the Y electrode.
  • 4A is a plan view showing an example of the configuration of the transparent conductive element 2
  • FIG. 4B is a cross-sectional view taken along the line cc shown in FIG. 4A.
  • FIG. 4C is an enlarged plan view showing a region C2 shown in FIG. 4A.
  • the transparent conductive element 2 includes a base material 21 having a surface and a transparent conductive layer 22 formed on the surface.
  • the transparent conductive layer 22 includes a transparent electrode pattern portion 23 and a transparent insulating pattern portion 24.
  • the transparent electrode pattern portion 23 is a Y electrode pattern portion that extends in the Y-axis direction.
  • the transparent insulating pattern portion 24 is a so-called dummy electrode pattern portion, extends in the Y-axis direction, is interposed between the transparent electrode pattern portions 23, and insulates the adjacent transparent electrode pattern portions 23 from each other. It is a pattern part. These transparent electrode pattern portions 23 and transparent insulating pattern portions 24 are alternately laid on the surface of the substrate 21 in the X-axis direction.
  • the transparent electrode pattern portion 13 and the transparent insulating pattern portion 14 included in the transparent conductive element 1 described above and the transparent electrode pattern portion 23 and the transparent insulating pattern portion 24 included in the transparent conductive element 2 are, for example, in a relationship orthogonal to each other. is there.
  • a region R1 indicates a formation region of the transparent electrode pattern portion 23, and a region R2 indicates a formation region of the transparent insulating pattern portion 24.
  • the transparent electrode pattern portion 23 is a transparent conductive layer formed by randomly separating a plurality of hole portions 23a, and a conductive portion 23b is interposed between adjacent hole portions 23a. Yes. Therefore, in the transparent electrode pattern portion 23, a plurality of non-conductive portions (hole portions 23a) are formed at random in the formation surface of the conductive material portion (conductive portion 23b).
  • the transparent insulating pattern portion 24 is a transparent conductive layer composed of a plurality of island portions 24a that are randomly spaced apart, and a gap portion 24b as an insulating portion is interposed between adjacent island portions 24a. Yes. Therefore, the transparent insulating pattern portion 24 is formed at random in the formation surface of the non-conductive portion (gap portion 24b) with the conductive material portion (island portion 24a) spaced apart. And the transparent electrode pattern part 23 and the transparent insulation pattern part 24 are formed in the mutually different random pattern similarly to the transparent conductive element 1 of the X electrode mentioned above. Specifically, the patterns formed by the boundary between the conductive material portion and the non-conductive portion are different random patterns.
  • glass or plastic can be used as a material of the base materials 11 and 21 in the transparent conductive elements 1 and 2 described above.
  • glass for example, known glass can be used. Specific examples of the known glass include soda lime glass, lead glass, hard glass, quartz glass, and liquid crystal glass.
  • plastic for example, a known polymer material can be used. Specific examples of known polymer materials include triacetyl cellulose (TAC), polyester (TPEE), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide (PI), polyamide (PA), and aramid.
  • the thickness of the glass substrate is preferably 20 ⁇ m to 10 mm, but is not particularly limited to this range.
  • the thickness of the plastic substrate is preferably 20 ⁇ m to 500 ⁇ m, but is not particularly limited to this range.
  • Examples of the conductive material for forming the transparent conductive layers 12 and 22 include indium tin oxide (ITO), zinc oxide, indium oxide, antimony-added tin oxide, fluorine-added tin oxide, aluminum-added zinc oxide, gallium-added zinc oxide, Metal oxide such as silicon-doped zinc oxide, zinc oxide-tin oxide, indium oxide-tin oxide, zinc oxide-indium oxide-magnesium oxide, or copper, silver, gold, platinum, palladium, nickel, tin, cobalt , Rhodium, iridium, iron, ruthenium, osmium, manganese, molybdenum, tungsten, niobium, tantel, titanium, bismuth, antimony, lead, and other metals, or alloys thereof.
  • ITO indium tin oxide
  • Metal oxide such as silicon-doped zinc oxide, zinc oxide-tin oxide, indium oxide-tin oxide, zinc oxide-indium oxide-magnesium oxide, or copper
  • a conductive material for forming the transparent conductive layers 12 and 22 a composite material in which carbon nanotubes are dispersed in a binder material may be used. Substituted or unsubstituted polyaniline, polypyrrole, polythiophene, and one or two (co) polymer conductive polymers selected from these may be used. Two or more of these may be used in combination. The configuration using metal nanowires as the conductive material will be described in detail later.
  • a PVD method such as a sputtering method, a vacuum deposition method, or an ion plating method, a CVD method, a coating method, a printing method, or the like can be used.
  • the thickness of the transparent conductive layers 12 and 22 is a surface resistance of 1000 ⁇ / ⁇ (ohm / square) or less in a state before patterning (a state where the transparent conductive layers 12 and 22 are formed on the entire surfaces of the base materials 11 and 21). It is preferable to select as appropriate.
  • the conductive material coating of the transparent electrode pattern portions 13 and 23 and the transparent insulating pattern portions 14 and 24 in the transparent conductive elements 1 and 2 having the above structure will be described. In the following description, the transparent electrode pattern portion 13 and the transparent insulating pattern portion 14 mainly on the X electrode side will be described, but the same applies to the transparent electrode pattern portion 23 and the transparent insulating pattern portion 24 on the Y electrode side. is there.
  • Electrode width W.
  • the average electrode width W ⁇ 0.5. Therefore, when the film thickness of the conductive material is the same, the electrical resistance of the transparent electrode pattern portion 13 in FIG.
  • FIG. 5B is twice that in the case of the coverage rate of 100% in FIG. 5A. If the electrical resistance of the transparent electrode pattern portion 13 is large, there is a possibility that the response speed and the position detection accuracy will be lowered when used for a capacitive touch panel. Of course, even if the hole 13a is formed as shown in FIG. 5B, the electrical resistance can be made equivalent to that shown in FIG. 5A if the thickness of the conductive material is doubled. However, in that case, problems such as an increase in material cost and a decrease in production line speed occur, which is not preferable. On the other hand, providing the hole 13a has the meaning of improving the invisibility between the transparent electrode pattern portion 13 and the transparent insulating pattern portion 14. For example, FIG.
  • 5C shows a random pattern in which dots of various diameters are randomly arranged, and based on this, the hole 13a of the transparent electrode pattern portion 13 and the island portion 14a of the transparent insulating pattern portion 14 are formed. is there.
  • one random pattern is used in common by the transparent electrode pattern portion 13 and the transparent insulating pattern portion 14, and is inverted at the boundary line L1. That is, the dot portion in the random pattern is the hole portion 13a (non-conductive portion) in the transparent electrode pattern portion 13 and the island portion 14a (conductive material portion) in the transparent insulating pattern portion 14.
  • the problem of the previous resistance value occurs.
  • a random pattern is introduced into the transparent electrode pattern portion 13 as shown in FIG. 5C
  • the electrical resistance is increased.
  • the area ratio of the island portion 14a is reduced on the transparent insulating pattern portion 14 side, and the area of the gap portion 14b is reduced. The proportion increases.
  • FIG. 6 shows the change in sheet resistance with respect to the coverage of the conductive portion 13b.
  • the sheet resistance is 135 ⁇ / ⁇ , 100 ⁇ / ⁇ , 75 ⁇ / ⁇ , 50 ⁇ / ⁇ .
  • the change in sheet resistance when the coverage is lowered is shown. As illustrated, the sheet resistance increases as the coverage of the conductive portion 13b decreases.
  • the standard is about 150 ⁇ / ⁇ or less.
  • the coverage of the conductive portion 13b is 67% or more (roughly from the figure). It is understood that it is preferable to set it to about 65% or more. That is, by providing the holes 13a and the islands 14a in a random pattern, it is advantageous for non-visibility, but in order to improve the non-visibility, the area ratio of the holes 13a in the transparent electrode pattern portion 13, It is preferable that the area ratio of the island part 14a in the transparent insulating pattern part 14 is substantially equal. For this purpose, a random pattern is formed so that the coverage of the conductive material as shown in FIG.
  • the coverage of the conductive portion 13b in the transparent electrode pattern portion 13 is about 50%, and the sheet resistance is increased.
  • the coverage of the conductive portion 13b in the transparent electrode pattern portion 13 is, for example, about 65% or more, the sheet resistance can be suppressed, but this time the area ratio of the gap portion 14b in the transparent insulating pattern portion 14 is reduced. This increases the non-visibility.
  • the transparent electrode pattern portion 13 is a solid coating pattern in which the coverage of the conductive material is 100%, and the transparent insulating pattern portion 14 is a random pattern.
  • the entire transparent electrode pattern portion 13 is the conductive portion 13b, and the hole portion 13a does not exist.
  • the transparent insulating pattern portion 14 island portions 14a and gap portions 14b are randomly arranged.
  • the transparent electrode pattern portion 13 and the transparent insulating pattern portion 14 are an example in which each of the conductive material portions is formed in a different pattern while having at least the conductive material portion. Furthermore, the transparent electrode pattern part 13 and the transparent insulating pattern part 14 have an example in which the conductive material part and the non-conductive part are formed in different random patterns. For example, the transparent electrode pattern portion 13 is randomly formed with a plurality of hole portions 13a (non-conductive portions) separated from each other within the conductive material portion formation surface, and the transparent insulating pattern portion 14 is within the non-conductive portion formation surface. Thus, the conductive material portion (island portion 14a) is formed at a distance from each other at random.
  • the patterns formed by the boundary between the conductive material portion and the non-conductive portion are different random patterns.
  • the transparent electrode pattern portion 13 and the transparent insulating pattern portion 14 are formed by using different random patterns as described above.
  • a different random pattern is a pattern generated under different random pattern generation conditions (radius range, graphic drawing conditions in a generated circle, weighting of random numbers described later, etc.).
  • the resistance value reduction of the transparent electrode pattern part 13 and non-visibility can be made compatible. For example, in the case of forming the conductive portion 13b having the sheet resistance of 100 ⁇ / ⁇ in FIG.
  • the coverage of the conductive portion 13b is approximately 65. Since it may be about% or more, a random pattern in which the area ratio of the holes 13a is 35% or less may be used. At this time, the transparent insulating pattern portion 14 may use a random pattern in which the area ratio of the gap portion 14b is not so different from the area ratio of the hole portion 13a. Thereby, non-visibility can be maintained. For example, when the coverage of the conductive material portion (conductive portion 13b) in the transparent electrode pattern portion 13 is 65% or more and 100 or less, the coverage of the conductive material portion (gap portion 14b) in the transparent insulating pattern portion 14 is also 65% or more and 100.
  • the transparent conductive elements 1 and 2 constituting the input device 10 of the present embodiment have a transparent electrode pattern portion 13 (23) and a transparent insulating pattern portion 14 (24), respectively, having a conductive material portion and a non-conductive portion. They are formed with different random patterns.
  • FIG. 7A shows the state of FIG. 1, that is, the state where the transparent conductive elements 1 and 2 are stacked, and FIG. 7B shows a partial enlarged view.
  • the area AR1 is an area where the transparent electrode pattern portions 13 and 23 overlap.
  • the area AR2 is an area where the transparent insulating pattern portions 14 and 24 overlap.
  • the area AR3 is an area where the transparent electrode pattern portion 13 and the transparent insulating pattern portion 24 overlap or the transparent insulating pattern portion 14 and the transparent electrode pattern portion 23 overlap.
  • the transparent conductive element 1 in a state where the transparent conductive element 1 and the transparent conductive element 2 are overlapped, in all the regions AR1, AR2, AR3 viewed from the input surface direction, the transparent conductive element 1
  • the difference of the addition value between the coverage of the conductive material portion and the coverage of the conductive material portion in the transparent conductive element 2 is set to be 0 or more and 60 or less. Furthermore, the difference between the addition values is preferably 0 or more and 30 or less.
  • the coverage of the conductive material portions (conductive portions 13b and 23b) in the transparent electrode pattern portions 13 and 23 is set to 80%. Further, the coverage of the conductive material portions (island portions 14a, 24a) in the transparent insulating pattern portions 14, 24 is set to 50%.
  • the added value of the coverage of the conductive material portion of the transparent conductive element 1 and the coverage of the conductive material portion of the transparent conductive element 2 in the regions AR1, AR2, AR3 is as follows.
  • Area AR1: 80 + 80 160
  • Area AR2: 50 + 50 100
  • Area AR3: 80 + 50 130
  • the added value is the largest in the area AR1 and the smallest in the area AR2, but the difference between the added values is 60. If the difference between the addition values is 60 or less, it can be said that the non-visibility is good.
  • the reason for using the added value as an index is to consider non-visibility according to the user's vision.
  • the actual diameter of the hole 13a and the island 14a is, for example, 10 ⁇ m to 100 ⁇ m, or 100 ⁇ m to 500 ⁇ m, depending on the parameter setting at the time of random pattern generation. It is a minute hole. There is almost no case where the user can visually recognize each of the hole 13a and the island 14a on the transparent electrode.
  • the transparent conductive elements 1 and 2 are overlapped, the coverage of the conductive material portion in the transparent conductive element 1 and the transparent conductive element 2 The sum of the coverage of the conductive material portion is regarded as the average coverage of the region.
  • the inventors have found that non-visibility can be maintained when the difference between the addition values is 0 or more and 60 or less in all regions viewed from the input surface direction.
  • reducing the difference between the addition values is more suitable for non-visibility. For example, in the above example, if the addition value in the area AR2 is increased, the difference between the addition values in each area can be further reduced. Therefore, the coverage of the conductive material portions (island portions 14a, 24a) in the transparent insulating pattern portions 14, 24 is set to 65%.
  • the added value of the coverage of the conductive material portion of the transparent conductive element 1 and the coverage of the conductive material portion of the transparent conductive element 2 in the regions AR1, AR2, AR3 is as follows.
  • Area AR1: 80 + 80 160
  • Area AR2: 65 + 65 130
  • Area AR3: 80 + 65 145
  • the difference between the added values is 30, which is more preferable in terms of non-visibility.
  • increasing the coverage of the conductive material portions (islands 14a and 24a) in the transparent insulating pattern portions 14 and 24, for example, in the case of print formation described later the amount of the conductive material used is increased accordingly, and the material cost is increased. Get higher.
  • the conductive material portion (island portion 14a, The coverage of 24a) may be set.
  • different random patterns are used for the transparent electrode pattern portion 13 (23) and the transparent insulating pattern portion 14 (24). By using different random patterns, the transparent electrode pattern portion 13 (23) and the transparent insulating pattern portion 14 (24) can increase the degree of freedom in setting the coverage of the conductive material portion.
  • the resistance value in the transparent electrode pattern portion 13 (23) is set to an appropriate value (for example, 150 ⁇ or less), and the conductive material portion on the transparent insulating pattern portion 14 (24) side is considered in view of invisibility and material cost. Coverage can be set. As described above, it is possible to realize the non-visualization of the electrode configuration in the entire region viewed from the input surface side while realizing the reduction of the resistance value in the transparent electrode pattern portion 13 (23). As a result, it is possible to realize a high-performance input device 10 that is hardly visible.
  • the coverage of the conductive material portion in the transparent electrode pattern portion 13 (23) and the transparent insulating pattern portion 14 (24) is preferably 65% or more and less than 100.
  • the difference in the added value of the coverage ratio of the conductive material is set to 0 or more and 60 or less in any region when the transparent conductive elements 1 and 2 are overlapped.
  • the difference between the added values is set to 0 or more and 30 or more.
  • two types of random patterns are present on the boundary line L1 (L2) between the transparent electrode pattern portion 13 (23) and the transparent insulating pattern portion 14 (24). It is in the state of being cut and pasted as it is (pattern cutting). This is preferable in that a boundary line with a random shape that is difficult to be visually recognized is formed.
  • the transparent electrode pattern portion 13 may have a coverage of the hole 13a of 0%, that is, a coverage of the conductive portion 13b of 100%. Moreover, you may form the transparent electrode pattern part 13 with the mix of 2 or more types of area
  • the hole 13a and the island 14a have a circular shape, but an elliptical shape, a shape obtained by cutting a part of the circular shape, a shape obtained by cutting a part of the elliptical shape, a polygonal shape, and a corner are taken.
  • Polygon shape, indefinite shape, etc. may be sufficient.
  • those types of shapes may be used. From the viewpoint of easy generation of a random pattern, a circular shape is preferable.
  • the elliptical shape includes not only a perfect ellipse defined mathematically but also an ellipse (for example, an ellipse, an egg shape, etc.) with some distortion.
  • the circle includes not only a perfect circle (perfect circle) defined mathematically but also a circle with some distortion.
  • Polygons are not only full polygons defined mathematically, but also polygons with distortion on the sides, polygons with rounded corners, and distortions on the sides and corners. Also included are rounded polygons. Examples of the strain applied to the side include a curved shape such as a convex shape or a concave shape. Moreover, you may use the random mesh pattern which is illustrated to FIG. 10 and FIG.
  • the plurality of hole portions 13a are preferably formed apart from each other, but a part of the plurality of hole portions 13a is brought into contact with each other as long as the non-visibility and the conductivity are not deteriorated. Alternatively, they may be overlapped. In addition, it is preferable to form all of the plurality of islands 14a apart from each other, but if the range does not cause a decrease in invisibility and a decrease in insulation, a part of the plurality of islands 14a are brought into contact with each other. Or you may make it overlap. ⁇ 3.
  • Transparent Conductive Element of Second Embodiment Diamond Pattern Electrode>
  • FIG. 8A and 8B show electrode patterns in the transparent conductive elements 1 and 2.
  • the transparent electrode pattern portion 13 and the transparent insulating pattern portion 14 are formed on the transparent conductive layer 12.
  • the transparent electrode pattern part 13 is made into the shape where the site
  • the transparent electrode pattern portion 13 and the transparent insulating pattern portion 14 are alternately laid on the surface of the base material 11 in the Y-axis direction.
  • the transparent conductive element 2 has a transparent conductive layer 22 having a transparent electrode pattern portion 23 and a transparent insulating pattern portion 24 formed thereon.
  • the transparent electrode pattern part 23 is made into the shape where the site
  • the transparent electrode pattern portions 23 and the transparent insulating pattern portions 24 are alternately laid on the surface of the base material 21 in the X-axis direction.
  • the transparent electrode pattern portion 13 (23) and the transparent insulating pattern portion 14 (24) may be formed by using different random patterns to form the conductive material portion. This is the same as in the first embodiment.
  • FIG. 9A shows the case where the transparent electrode pattern portions 13 and 23 are in a diamond shape in a state where the transparent conductive elements 1 and 2 are overlapped like FIG. 7A, and FIG. Yes.
  • the transparent conductive element 2 side is indicated by a broken line.
  • the area AR ⁇ b> 1 is an area where the transparent electrode pattern portions 13 and 23 overlap
  • the area AR ⁇ b> 2 is an area where the transparent insulating pattern portions 14 and 24 overlap
  • the area AR3 is an area where the transparent electrode pattern portion 13 and the transparent insulating pattern portion 24 overlap, or the transparent insulating pattern portion 14 and the transparent electrode pattern portion 23 overlap.
  • all of the portions where the transparent conductive elements 1 and 2 overlap are classified into these regions AR1, AR2, and AR3.
  • the shapes and ranges of the regions AR1, AR2, AR3 are also different.
  • the conductive material portions conductive portions 13b, The coverage of 23b) is 80%, and the coverage of the conductive material portions (islands 14a, 24a) in the transparent insulating pattern portions 14, 24 is 50%. If the difference between the coverage of the conductive material portion of the transparent conductive element 1 and the coverage of the conductive material portion of the transparent conductive element 2 in the regions AR1, AR2, AR3 is 60 or less, non-visibility Is good. Furthermore, when the difference between the added values is 30 or less, the non-visibility is extremely good.
  • the transparent electrode pattern portion 13 having a diamond-shaped pattern is divided into a region A and a region B.
  • a portion corresponding to the transparent insulating pattern portion 14 is defined as a region C.
  • the width of the area A is WA and the length is LA.
  • LB is the length of the region B.
  • the region A has a larger L (x) / W (x) value than the region B, and the resistance value is large in the first place.
  • the coverage of the conductive portion 13b is 79% (the hole 13a is 21%), and in the region A, the coverage of the conductive portion 13b is 100% (the hole 13a is 0%). It is possible to do. This coverage is only an example.
  • the coverage of the conductive material portion is set so as to meet the above-described condition of the added value difference of the coverage when the X and Y electrodes are overlapped. You only have to set it.
  • a random mesh pattern may be used instead of a random dot pattern.
  • the difference in coverage of the conductive material in the regions A to C is preferably 0% or more and 30% or less.
  • step F101 a random pattern used for the transparent electrode pattern unit 13 is generated.
  • step F102 a random pattern used for the transparent insulating pattern portion 14 is generated.
  • the random pattern for the transparent electrode pattern part and the random pattern for the transparent insulating pattern part are such that the pattern generation conditions (radius range, graphic drawing condition in the generated circle, random number weighting described later, etc.) are different from each other. Set to and generate.
  • steps F101 and F102 may be reversed or performed in parallel. Further, it may be executed away from the actual production line.
  • FIG. 11A for convenience of explanation, a single flowchart is shown.
  • step F103 the transparent conductive layer 12 is formed.
  • the transparent conductive layer 12 is formed on the surface of the substrate 11 as shown in FIG. 12A.
  • the base material 11 may be heated.
  • a CVD method Chemical Vapor Deposition: a technique for depositing a thin film from a gas phase using a chemical reaction, such as thermal CVD, plasma CVD, or photo-CVD.
  • PVD methods Physical Vapor Deposition
  • vacuum deposition plasma-assisted deposition
  • sputtering ion plating
  • etc . A technology that forms a thin film by agglomerating materials that have been physically vaporized in a vacuum on a substrate. ) Can be used.
  • the transparent conductive layer 12 is annealed as necessary. Thereby, the transparent conductive layer 12 becomes, for example, a mixed state of amorphous and polycrystalline or a polycrystalline state, and the conductivity of the transparent conductive layer 12 is improved.
  • Step F104 a resist layer is formed. As shown in FIG.
  • a resist layer 41 having openings 33 at portions corresponding to the above-described hole portions 13a and the gap portions 14b is patterned by a lithography technique.
  • the resist layer 41 corresponding to the hole portion 13a is formed based on the random pattern for the transparent electrode pattern portion formed in step F101.
  • the resist layer 41 corresponding to the gap portion 14b is formed based on the random pattern for the transparent insulating pattern portion formed in step F102.
  • a material of the resist layer 41 for example, either an organic resist or an inorganic resist may be used.
  • the organic resist for example, a novolac resist or a chemically amplified resist can be used.
  • the metal compound which consists of 1 type, or 2 or more types of transition metals can be used, for example.
  • Development is performed as step F105.
  • the transparent conductive layer 12 is etched using the resist layer 41 in which the plurality of openings 33 are formed as an etching mask.
  • the hole 13a and the conductive portion 13b are formed in the transparent conductive layer 12 in the region R1
  • the island portion 14a and the gap portion 14b are formed in the transparent conductive layer 12 in the region R2.
  • the etching for example, both dry etching and wet etching can be used. From the viewpoint of simple equipment, it is preferable to use wet etching.
  • step F106 the resist layer is peeled off.
  • the resist layer 41 formed on the transparent conductive layer 12 is removed by ashing or the like.
  • the intended transparent conductive element 1 is obtained.
  • step F106 a manufacturing method II of the transparent conductive elements 1 and 2 using a printing method will be described with reference to FIGS. 11B, 13, and 14.
  • step F201 a random pattern used for the transparent electrode pattern unit 13 is generated.
  • step F202 a random pattern used for the transparent insulating pattern portion 14 is generated.
  • the random pattern for the transparent electrode pattern part and the random pattern for the transparent insulating pattern part are such that the pattern generation conditions (radius range, graphic drawing condition in the generated circle, random number weighting described later, etc.) are different from each other.
  • the points related to steps F201 and F202 are the same as steps F101 and F102 of FIG. 11A.
  • a master is formed.
  • FIG. 13A is a perspective view showing an example of the shape of the master.
  • FIG. 13B is an enlarged plan view illustrating a part of the region R1 and the region R2 illustrated in FIG. 13A.
  • the master 100 is, for example, a roll master having a cylindrical surface as a transfer surface, and regions R1 and R2 are alternately laid on the cylindrical surface.
  • a plurality of concave holes 113a are formed apart from each other, and the holes 113a are separated from each other by convex parts 113b.
  • the hole portion 113a is for forming the hole portion 13a of the transparent electrode pattern portion 13 by printing
  • the convex portion 113b is for forming the conductive portion 13b of the transparent electrode pattern portion 13 by printing.
  • the arrangement of the hole 113a and the convex 113b is based on the random pattern generated in step F201.
  • a plurality of island portions 114a having a convex shape are formed apart from each other, and the island portions 114a are separated from each other by a recess 114b.
  • the island portion 114a is for forming the island portion 14a of the transparent insulating pattern portion 14 by printing
  • the concave portion 114b is for forming the gap portion 14b of the transparent insulating pattern portion 14 by printing.
  • the arrangement of the islands 114a and the recesses 114b is based on the random pattern generated in step F202.
  • the conductive ink is printed using the master 100 described above.
  • conductive ink is applied to the transfer surface of the master 100, and the applied conductive ink is printed on the surface of the substrate 11.
  • the printing method for example, screen printing, waterless flat printing, flexographic printing, gravure printing, gravure offset printing, reverse offset printing, and the like can be used.
  • step F205 drying or baking is performed in step F205.
  • the conductive ink printed on the surface of the substrate 11 is heated and dried and / or baked as necessary.
  • the intended transparent conductive element 1 can be obtained.
  • the conductive material portion is formed based on the random patterns that are different between the transparent electrode pattern portions 13 and 23 and the transparent insulating pattern portions 14 and 24.
  • an example of a method of forming a random pattern itself that is the basis for forming such a conductive material portion will be described.
  • a method of generating a random pattern for forming the circular holes 13a and 23a and the islands 14a and 24a will be described, but the shape of the random pattern is not limited to this.
  • the center coordinates of the circle are calculated and arranged so that the adjacent circle is always in contact with each other.
  • Generated random pattern the following (1) and (2) algorithms can obtain a random pattern with a small amount of calculation and a uniform random arrangement with high density.
  • Xmax X coordinate maximum value of a region for generating a circle
  • Yw Setting of the maximum value of Y coordinate that can be taken by the center of the circle when placing the circle on the X axis
  • Rmin Minimum radius of the circle to be generated
  • Rmax Circle to be generated Maximum radius
  • Rnd a random value Pn obtained in a range of 0.0 to 1.0: a circle defined by an X coordinate value xn, a Y coordinate value yn, and a radius rn
  • FIG. 15 is a schematic diagram illustrating the algorithm (1).
  • the Y coordinate value is randomly determined in the range of 0.0 to approximately Rmin on the X axis, and the circle whose radius is determined randomly in the range of Rmin to Rmax Arrangement so as to touch the circle is repeated, and one row of circles is randomly arranged on the X axis.
  • the radius of the circle Pn is also set at random by using the random number value Rnd as a coefficient.
  • the center Y coordinate value yn is also set at random within the range of Yw.
  • step S4 it is determined whether or not Xn> Xmax.
  • step S4 If it is determined in step S4 that Xn> Xmax, the process ends. If it is determined in step S4 that Xn> Xmax is not satisfied, the process proceeds to step S5. In step S5, the circle Pn (xn, yn, rn) is stored. Next, in step S6, the value of n is incremented, and the process proceeds to step S3. That is, the next circle Pn (xn, yn, rn) is determined. (2) “Random radius circle” is determined, stacked in order from the bottom so as to touch two existing circles and not overlap other circles. The necessary parameters are shown below.
  • FIG. 17 is a schematic diagram illustrating the algorithm (2).
  • step S12 a circle Pi having the smallest Y coordinate value yi is obtained from the circles P0 to Pn generated in (1).
  • step S13 it is determined whether yi ⁇ Ymax. If it is determined in step S13 that yi ⁇ Ymax is not satisfied (No), the process ends. That is, it is determined that the stacking of the circles up to the Y coordinate maximum value has been completed, and the processing ends. If it is determined in step S13 that yi ⁇ Ymax (Yes), the process proceeds to step S14 and subsequent steps, and processing for adding circles is performed.
  • step S15 a circle Pj having a minimum Y coordinate value yi is obtained in the vicinity of the circle Pi, excluding the circle Pi.
  • step S16 it is determined whether or not a minimum circle Pi exists. If it is determined in step S16 that the minimum circle Pi does not exist, Pi is invalidated in step S17. If it is determined in step S16 that the minimum circle Pi exists, in step S18, it is determined whether or not there is a circle Pk having a radius rk in contact with the circle Pi and the circle Pj.
  • step S19 shows how to obtain the coordinates when arranging so that a circle with an arbitrary radius is in contact with two circles in contact with each other in step S18. That is, according to the equation shown in the figure, cos ⁇ i is obtained using the coordinates (xi, yi) and radius ri of the circle Pi, the coordinates (xj, yj) and radius rj of the circle Pj, and the radius rk of the circle Pk to be added, The coordinates (xk, yk) of the circle Pk to be added are calculated using ⁇ i. Next, in step S19, it is determined whether or not there is a circle Pk having a radius rk in contact with the circle Pi and the circle Pj.
  • step S22 If it is determined in step S21 that overlapping circles exist, it is determined in step S22 whether or not overlapping can be avoided by reducing the radius rk of the circle Pk within a range equal to or greater than Rfill. If it is determined in step S22 that the overlap cannot be avoided, the combination of the circle Pi and the circle Pj is excluded in step S20. If it is determined in step S22 that the overlap can be avoided, the radius rk is set to the maximum value that can avoid the overlap in step S23. Next, in step S24, the circle Pk (xk, yk, rk) is stored.
  • n is incremented in step S25
  • Pn Pk is set in step S26
  • the value of k is incremented in step S27, and the process proceeds to step S12.
  • circles are randomly arranged on a plane as shown in FIG.
  • a random pattern corresponding to the arrangement of the holes 13a and the islands 14a can be formed.
  • a circle T reduced at a certain reduction rate is indicated by a wavy line.
  • the radius ranges of random circles generated as shown in FIG. 20 are different.
  • the reduction rate from the state shown in FIG. 20 to the circle T (or another figure arranged in the circle) may be different.
  • positioned at random differ.
  • one is a circle and the other is a square.
  • One may be a random dot pattern, and the other may be a random mesh pattern.
  • Rnd a random value obtained in the range of 0.0 to 1.0 is used as the random value Rnd, it is also conceivable to assign different weights thereto. Of course, these may be combined.
  • the random pattern used for the transparent electrode pattern portion 13 and the random pattern used for the transparent insulating pattern portion 14 are different from each other, thereby realizing a desired coverage of the conductive material portion.
  • the weighting of random numbers will be described.
  • the radius of the circle generated as shown in FIG. Circle radius minimum radius Rmin + (maximum radius Rmax ⁇ minimum radius Rmin) ⁇ random number value Rnd.
  • the random value Rnd is a random number obtained in the range of 0.0 to 1.0. By assigning this random number to a calculation formula in which the calculation result is in the range of 0 to 1, weight distribution can be weighted. For example, random value [Rnd] 3 By doing so, the distribution of small circle radii can be increased.
  • Random value [Rnd] 1/3 By doing so, the distribution of large circle radii can be increased, and the filling rate of circles (dots) can be increased.
  • y x 1/3
  • Y x 3
  • the random numbers after weighting are shown.
  • FIG. 21B shows the frequency of the diameter of the circle (dot) when the random number is weighted in this way. This is a case where a circular random pattern is generated under the following conditions as the generated random pattern.
  • -Radius reduction value 10 ⁇ m
  • the frequency distribution when the above weighting is performed is shown by a 1 ⁇ m diameter pitch. It can be seen that it is possible to increase the dot filling rate by increasing the frequency of occurrence of large diameter circles by weighting random numbers. Conversely, it is possible to increase the frequency of small diameters and reduce the dot filling rate. However, if the frequency of the arbitrary diameter is increased too much, the randomness decreases, and moire or diffracted light may be generated. In the frequency distribution with a 1 ⁇ m diameter pitch, the frequency of the arbitrary diameter is preferably 35% or less.
  • a random mesh pattern such as a dot shape or a polygonal shape in a circle has been described so far, but generation of a random mesh pattern as shown in FIG. 22A will also be described.
  • a random circle arrangement pattern as shown in FIG. 22B
  • a mesh pattern is formed by drawing lines at random angles with respect to this random circle pattern. That is, using the center coordinates of each circle as they are, a straight line passing through the center of each circle is drawn. At this time, by randomly determining the rotation angle of each straight line in the range of 0 to 180 degrees, a line having a random inclination is formed as shown in the figure. By doing so, a random mesh pattern can be generated.
  • FIG. 22C may be used. Also in the case of FIG. 22C, a random circle arrangement pattern generated as shown in FIG. 20 is used. In this case, a line segment connecting the center coordinates of adjacent circles is subtracted from the center coordinates of each circle. That is, the centers of neighboring circles are connected. By doing so, a random mesh pattern can be generated. 22B and 22C, two different types of random patterns can be generated by changing parameter settings or changing the weighting of random values. In addition, it is possible to easily form random patterns having different coverage ratios of the conductive material portions by changing the thickness of the straight lines formed at random. ⁇ 7.
  • Transparent conductive element using metal nanowire> When the transparent conductive layer 12 is formed of metal nanowires, if the transparent electrode pattern portion 13 is subjected to random pattern processing, the metal nanowire coating area is reduced, thereby reducing the reflection L value of the conductive portion. As a result, the black display on the screen of the conductive material portion sinks further, and the display characteristics (contrast) of the display are improved as compared with the case where a linear pattern or a diamond pattern is used. Further, by combining a predetermined surface treatment, the reflection L value can be kept lower in both the conductive material portion and the non-conductive portion, and the contrast is further improved.
  • a transparent conductive film using metal nanowires as a conductive material can be formed using a coating process instead of sputtering like a transparent conductive film using ITO. Since the coating process does not require a vacuum environment unlike sputtering, it can be expected to reduce manufacturing costs. Moreover, the transparent conductive film using the metal nanowire has been attracting attention as a next-generation transparent conductive film that does not use indium which is a rare metal.
  • FIG. 23A shows a structural example of a transparent conductive element using metal nanowires.
  • a transparent conductive film 81 using metal nanowires is formed on the substrate 80.
  • surface treatment dyes, dispersants, binders and the like are also used.
  • the base material 80 is, for example, a transparent inorganic base material or plastic base material.
  • a transparent film, sheet, substrate or the like can be used.
  • the material of the inorganic base material include quartz, sapphire, and glass.
  • a material for the plastic substrate for example, a known polymer material can be used. Specific examples of known polymer materials include triacetyl cellulose (TAC), polyester (TPEE), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide (PI), polyamide (PA), and aramid.
  • the thickness of the plastic substrate is preferably 38 to 500 ⁇ m from the viewpoint of productivity, but is not particularly limited to this range.
  • the constituent element of the metal nanowire is composed of one or more selected from Ag, Au, Ni, Cu, Pd, Pt, Rh, Ir, Ru, Os, Fe, Co, and Sn.
  • the average minor axis diameter of the nanowire is preferably larger than 1 nm and not larger than 500 nm, and the average major axis length is preferably larger than 1 ⁇ m and not larger than 1000 ⁇ m.
  • the average minor axis diameter is smaller than 1 nm, the conductivity of the wire is deteriorated and it is difficult to function as a conductive film after coating. Further, when the average minor axis diameter is larger than 500 nm, the total light transmittance is deteriorated.
  • the average major axis length is shorter than 1 ⁇ m, the wires are not easily connected to each other and do not function as a conductive film after application.
  • the metal nanowires when formed into a paint tends to deteriorate.
  • the metal nanowires may be surface-treated with an amino group-containing compound such as PVP or polyethyleneimine. It is preferable to make the addition amount so that the conductivity is not deteriorated when the coating is formed.
  • sulfo group including sulfonate), sulfonyl group, sulfonamide group, carboxylic acid group (including carboxylate), amide group, phosphate group (including phosphate and phosphate ester), phosphino group, silanol group
  • a compound having a functional group such as an epoxy group, an isocyanate group, a cyano group, a vinyl group, a thiol group, or a carbinol group that can be adsorbed to a metal may be used as a dispersant.
  • the solvent a solvent in which metal nanowires are dispersed is used.
  • a high boiling point solvent can be further added to control the evaporation rate of the solvent.
  • Applicable binder materials can be widely selected from known transparent natural polymer resins or synthetic polymer resins.
  • a transparent thermoplastic resin for example, polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, polymethyl methacrylate, nitrocellulose, chlorinated polyethylene, chlorinated polypropylene, vinylidene fluoride, ethyl cellulose, hydroxypropyl methyl cellulose
  • a transparent curable resin for example, a melamine acrylate, urethane acrylate, isocyanate, epoxy resin, polyimide resin, silicon resin such as acrylic-modified silicate
  • heat, light, electron beam, or radiation can be used.
  • examples of the additive include a surfactant, a viscosity modifier, a dispersant, a curing accelerating catalyst, a plasticizer, a stabilizer such as an antioxidant and an antisulfurizing agent, and the like.
  • an overcoat layer 82 may be separately provided after the metal nanowire is applied as shown in FIG. 23B.
  • hydrolysis / dehydration condensate such as polyacrylic, polyamide, polyester, cellulose or metal alkoxide can be used.
  • the thickness of the overcoat layer 82 is a thickness that does not significantly deteriorate the optical characteristics.
  • an anchor layer 83 may be separately provided on the substrate 80 before applying the metal nanowires as shown in FIG. 23C.
  • the anchor layer 83 may be hydrolyzed / dehydrated condensate such as polyacrylic, polyamide, polyester, cellulose, or metal alkoxide. It is desirable that the anchor layer 83 has a thickness that does not significantly deteriorate the optical characteristics. Both the overcoat layer and the anchor layer may be used in combination.
  • the transparent conductive film 81 using metal nanowires is manufactured through the following steps. (Step 1) Disperse metal nanowires in a solvent.
  • the compounding amount of the nanowire is 0.01 to 10 parts by weight when the weight of the coating is 100 parts by weight. When the amount is less than 0.01 part by weight, a sufficient basis weight cannot be obtained when a film is formed by coating. On the other hand, when larger than 10 weight part, it exists in the tendency for the dispersibility of nanowire to deteriorate.
  • an amino group-containing compound such as PVP or polyethyleneimine may be added as a dispersant to the metal nanowire dispersion.
  • sulfo group including sulfonate
  • sulfonyl group sulfonamide group
  • carboxylic acid group including carboxylate
  • amide group phosphate group (including phosphate and phosphate ester)
  • phosphino group silanol group
  • a compound having a functional group such as an epoxy group, an isocyanate group, a cyano group, a vinyl group, a thiol group, or a carbinol group that can be adsorbed to a metal may be used as a dispersant.
  • Step 2 A transparent conductive film made of metal nanowires on a substrate is prepared.
  • a wet film-forming method is preferable in consideration of physical properties, convenience, production costs, and the like, and examples of known methods include coating, spraying, and printing.
  • the coating method is not particularly limited, and a known coating method can be used.
  • Known coating methods include, for example, micro gravure coating method, wire bar coating method, direct gravure coating method, die coating method, dip method, spray coating method, reverse roll coating method, curtain coating method, comma coating method, knife coating method. And spin coating method.
  • Step 3 After coating, the solvent is dried. Either natural drying or heat drying may be used. Further, when the binder is cured, it is cured by UV or heat. Further, in order to reduce the sheet resistance value, a pressurizing process using a calendar may be performed.
  • the basis weight (g / m 2) of the metal nanowires in the metal nanowire layer in FIG. 23A is preferably 0.001 g to 1 g. When it is less than 0.001 g, metal nanowires are not sufficiently present in the coating film, and the performance as a transparent conductive film is deteriorated.
  • Position detection marker> A position detection marker for improving the efficiency of the manufacturing process of the input device 10 of the present embodiment will be described.
  • the invisibility of the transparent conductive elements 1 and 2 is improved.
  • FIG. 24 shows a state where a large number of transparent conductive layers 12 are formed on the sheet of the base material 11 before cutting.
  • a position detection marker MP is formed at a predetermined position on the sheet.
  • the position detection marker MP is preferably arranged outside the region where the pattern of the transparent conductive layer 12 is formed. Since the position detection marker MP is not required after the input device 10 (touch panel) is assembled, if the position detection marker MP is disposed at the above position, the position detection marker MP can be easily removed after the touch panel is assembled. However, the position detection marker MP is not necessarily outside the pattern of the transparent conductive layer 12.
  • FIG. 25A shows the transparent conductive element 1
  • FIG. 25B shows a part thereof enlarged
  • the area AR10 is an area where the silver wiring 18 is formed.
  • FIG. 25C a part of the area AR10 is enlarged as an island part 14a is arranged in the area AR10.
  • the area AR10 is an area hidden by the frame of the input device 10 (touch panel) and does not affect the non-visibility effect. Therefore, it is not necessary to arrange a random pattern in such a silver wiring area AR10, or in an area hidden by a frame regardless of the presence or absence of silver wiring. ⁇ 10. Modification of input device structure> Here, a modified example of the structure of the transparent conductive elements 1 and 2 in the input device 10 shown in FIG. 1 will be described. As shown in FIG.
  • the transparent conductive layer 12 may be formed on one surface of the substrate 21 of the transparent conductive element 2, and the transparent conductive layer 22 may be formed on the other surface.
  • the formation of the base material 11 can be omitted.
  • a hard coat layer 61 may be formed on at least one of the two surfaces of the transparent conductive element 1.
  • a photosensitive resin for example, acrylate resins such as urethane acrylate, epoxy acrylate, polyester acrylate, polyol acrylate, polyether acrylate, and melamine acrylate can be used.
  • a urethane acrylate resin is obtained by reacting a polyester polyol with an isocyanate monomer or a prepolymer, and reacting the resulting product with an acrylate or methacrylate monomer having a hydroxyl group.
  • the thickness of the hard coat layer 61 is preferably 1 ⁇ m to 20 ⁇ m, but is not particularly limited to this range.
  • the hard coat layer 61 is formed by applying a hard coat paint to the substrate 11.
  • the coating method is not particularly limited, and a known coating method can be used. Known coating methods include, for example, micro gravure coating method, wire bar coating method, direct gravure coating method, die coating method, dip method, spray coating method, reverse roll coating method, curtain coating method, comma coating method, knife coating. Method, spin coating method and the like.
  • the hard coat paint contains, for example, a resin raw material such as a bifunctional or higher functional monomer and / or oligomer, a photopolymerization initiator, and a solvent.
  • the solvent is volatilized by drying the hard coat paint applied on the substrate 11. Thereafter, the hard coat paint dried on the substrate 11 is cured, for example, by irradiation with ionizing radiation or heating.
  • the hard coat layer 61 may be formed on at least one of the two surfaces of the transparent conductive element 2. As shown in FIG. 26C, it is preferable to interpose the optical adjustment layer 62 between the base material 11 and the transparent conductive layer 12 of the transparent conductive element 1. Thereby, the invisibility of the pattern shape of the transparent electrode pattern part 13 can be assisted.
  • the optical adjustment layer 62 is composed of, for example, a laminate of two or more layers having different refractive indexes, and the transparent conductive layer 12 is formed on the low refractive index layer side. More specifically, as the optical adjustment layer 62, for example, a conventionally known optical adjustment layer can be used. As such an optical adjustment layer, for example, those described in Japanese Patent Application Laid-Open Nos. 2008-98169, 2010-15861, 2010-23282, and 2010-27294 are used. be able to. Note that, similarly to the transparent conductive element 1 described above, the optical adjustment layer 62 may be interposed between the base 21 and the transparent conductive layer 22 of the transparent conductive element 2. As shown in FIG.
  • a close adhesion auxiliary layer 63 as a base layer of the transparent conductive layer 12 of the transparent conductive element 1.
  • the adhesiveness of the transparent conductive layer 12 with respect to the base material 11 can be improved.
  • the material of the adhesion auxiliary layer 63 include polyacrylic resins, polyamide resins, polyamideimide resins, polyester resins, and hydrolysis / dehydration condensation products such as metal element chlorides, peroxides, and alkoxides. Etc. can be used.
  • a discharge treatment in which a surface on which the transparent conductive layer 12 is provided is irradiated with glow discharge or corona discharge may be used.
  • the adhesion auxiliary layer 63 may be provided in the same manner as the transparent conductive element 1. Moreover, you may make it perform the process for the above-mentioned adhesive improvement. As shown in FIG. 26E, it is preferable to form a shield layer 64 on the transparent conductive element 1. For example, a film provided with the shield layer 64 may be bonded to the first transparent conductive element 1 via a transparent adhesive layer.
  • the shield layer 64 may be directly formed on the opposite side.
  • the material of the shield layer 64 the same material as that of the transparent conductive layer 12 can be used.
  • a method for forming the shield layer 64 a method similar to that for the transparent conductive layer 12 can be used.
  • the shield layer 64 is used in a state where it is formed on the entire surface of the substrate 11 without patterning. By forming the shield layer 64 on the transparent conductive element 1, noise caused by electromagnetic waves emitted from the display device 4 can be reduced, and the position detection accuracy of the input device 10 can be improved. Note that, similarly to the transparent conductive element 1, the shield layer 64 may be formed on the transparent conductive element 2.
  • FIG. 27 is a perspective view illustrating a television to which the present technology is applied.
  • the television 200 according to this application example includes a display unit 201 including a front panel 202, a filter glass 203, and the like, and the display device described above is applied as the display unit 201.
  • FIG. 28 is a diagram illustrating a digital camera to which the present technology is applied.
  • FIG. 28A is a perspective view seen from the front side, and FIG.
  • a digital camera 210 includes a light emitting unit 211 for flash, a display unit 212, a menu switch 213, a shutter button 214, and the like, and the display device described above is applied as the display unit 212.
  • FIG. 29 is a perspective view illustrating a notebook personal computer to which the present technology is applied.
  • the notebook personal computer 220 according to this application example includes a keyboard 222 that is operated when a character or the like is input, a display unit 223 that displays an image, and the like on the main body 221, and the display device described above as the display unit 223.
  • FIG. 30 is a perspective view illustrating a video camera to which the present technology is applied.
  • the video camera 230 includes a main body 231, a subject shooting lens 232 on the side facing forward, a start / stop switch 233 at the time of shooting, a display unit 234, and the like. Apply the described display device.
  • FIG. 31 is a perspective view illustrating a mobile terminal device to which the present technology is applied.
  • the mobile terminal device 240 according to this application example includes a display unit 241 provided in the center of the front panel, a sensor 242 provided in the periphery thereof, a speaker 243, and an operation switch 244, and the display device described above as the display unit 241 Apply.
  • the display device including the input device according to the present embodiment on the display surface is used for the display unit.
  • the apparatus is not obstructed and a high-definition display can be performed.
  • the sheet resistance of this transparent conductive film was 150 ⁇ / ⁇ .
  • a resist layer was formed on the transparent conductive layer made of ITO, and the resist layer was exposed using a Cr photomask on which a random pattern was formed. At this time, a circular random pattern was adopted as the random pattern of the Cr photomask.
  • the resist layer was developed to form a resist pattern. ITO was wet etched using the resist pattern as a mask, and then the resist layer was removed by ashing.
  • the resist pattern used here was based on the parameters of each example shown in FIG.
  • an example of the transparent conductive element in the present embodiment is shown in FIG.
  • FIG. 1 an example of a transparent conductive element employing a circular random pattern
  • FIG. 35A shows an X electrode transparent conductive element
  • FIG. 35B shows a Y electrode transparent conductive element.
  • the two transparent conductive elements having the transparent electrode pattern portion and the transparent insulating pattern portion on which different random patterns are formed that is, the transparent conductivity of the X electrode
  • the transparent conductive element of the conductive element and the Y electrode was produced.
  • a laminate (X electrode + Y electrode) in which the two transparent conductive elements thus produced were overlapped so that the respective transparent electrode pattern portions were crossed was produced.
  • FIG. 32 also shows the evaluation results of the non-visibility of the transparent electrode pattern portion, moire / interference light, and glare. From the evaluation results shown in FIG.
  • the sheet resistance of this transparent conductive film was 100 ⁇ / ⁇ . Thereafter, the same procedure as in Examples # 1 to # 12 was performed based on the parameters of the examples shown in FIGS. However, in the transparent insulating pattern portions in Examples # 19 and # 20, a random mesh pattern was adopted as a random pattern of the Cr photomask. In the transparent electrode pattern portions in Examples # 14, # 19, and # 20, a random pattern was not provided, and a solid coating pattern with a conductive material coverage of 100% was used.
  • FIG. an example of a transparent conductive element employing a random mesh pattern is shown in FIG. In the transparent conductive element shown in FIG.
  • the transparent electrode pattern portion 13 is a solid coating pattern with a conductive material coverage of 100%
  • the transparent insulating pattern portion 14 is a random mesh pattern.
  • two transparent conductive elements having a transparent electrode pattern portion and a transparent insulating pattern portion on which different random patterns are formed that is, the X electrode A transparent conductive element and a transparent conductive element of a Y electrode were produced.
  • a laminate (X electrode + Y electrode) in which the two transparent conductive elements thus produced were overlapped so that the respective transparent electrode pattern portions were crossed was produced. Further, FIGS.
  • FIGS. 33 and 34 also show the evaluation results of the non-visibility of the transparent electrode pattern portion, moire / interference light, and glare. From the evaluation results shown in FIGS. 33 and 34, the same effects as in Examples # 1 to 12 were confirmed even when a silver nanowire layer was used as the transparent conductive layer. That is, for both the transparent conductive element and the laminate, it was confirmed that good invisibility could be obtained even when the transparent electrode pattern portion and the transparent insulating pattern portion were formed by different random patterns. In particular, when the coverage difference due to the conductive material is 60% or less, good non-visibility is obtained. Furthermore, when the coverage difference due to the conductive material is 30% or less, extremely good non-visibility is obtained.
  • the moire / interference light and the glare were extremely good. Furthermore, in the case of the transparent conductive film which consists of a silver nanowire layer, when the transparent electrode pattern part was subjected to random pattern processing, the coverage of the conductive material was lowered and the area covered by the silver nanowire layer was reduced. Therefore, irregular reflection of external light on the surface of the silver nanowire is suppressed, and the value of the reflection L value of the conductive portion in the transparent electrode pattern portion is small.
  • the colored compound is selectively adsorbed on the surface of the silver nanowire by immersing a transparent conductive film made of a silver nanowire layer subjected to random pattern treatment in a solution in which the colored compound is dissolved. Processing was performed. By this process, it was confirmed that the reflection L value becomes smaller in both the transparent electrode pattern portion and the transparent insulating pattern portion.
  • a transparent conductive film in which a colored compound is adsorbed on metal nanowires and using a transparent conductive element subjected to random pattern processing as a touch panel a display panel is provided while providing a touch panel on the surface. It was confirmed that the display characteristics can be maintained.
  • the present technology is not limited to the above-described embodiments, and various modifications can be made.
  • the configurations, methods, steps, shapes, materials, numerical values, and the like given in the above-described embodiments are merely examples, and different configurations, methods, steps, shapes, materials, numerical values, and the like are used as necessary. May be.
  • the configurations, methods, steps, shapes, materials, numerical values, and the like of the above-described embodiments can be combined with each other without departing from the gist of the present technology.
  • the substrate surface may be exposed in a region where the conductive material formed by patterning does not exist, or an intermediate layer (for example, hard coat) formed on the substrate surface. Layer, optical adjustment layer, adhesion auxiliary layer) may be exposed.
  • the transparent conductive layer is formed of a conductive material and a binder material, the binder material may remain.
  • both the X electrode pattern portion and the Y electrode pattern portion may be formed on one of the first surface and the second surface of a single substrate. In this case, it is preferable to employ a configuration in which one of the X electrode pattern portion and the Y electrode pattern portion is electrically connected via a relay electrode at the intersection of the two.
  • the configuration of the X electrode pattern portion and the Y electrode pattern portion using such a relay electrode for example, a conventionally known configuration disclosed in Japanese Patent Application Laid-Open No. 2008-310550 can be employed.
  • this technique can also take the following structures.
  • the transparent electrode pattern portion is randomly formed with a plurality of nonconductive portions spaced apart from each other within the formation surface of the conductive material portion,
  • the transparent insulating pattern portion is formed randomly in the formation surface of the non-conductive portion with the conductive material portion being spaced apart,
  • Conductive element (4)
  • the transparent electrode pattern portion and the transparent insulating pattern portion are arranged in different random patterns by arranging the conductive material portion and the non-conductive portion based on random patterns generated under different generation conditions. (1) The transparent conductive element according to any one of (3).
  • a first transparent conductive element having a transparent electrode pattern portion and a transparent insulating pattern portion formed by alternately spreading on the surface of the substrate in a predetermined direction;
  • a transparent electrode pattern portion and a transparent insulating pattern portion formed by alternately spreading on the surface of the base material in a direction orthogonal to the predetermined direction, and the first transparent conductivity as viewed from the input surface direction;
  • a second transparent conductive element disposed in a positional relationship superimposed with the element; With In the first and second transparent conductive elements, the transparent electrode pattern portion and the transparent insulating pattern portion each have at least a conductive material portion, and the conductive material portions are formed in different patterns.
  • the transparent electrode pattern portion and the transparent insulating pattern portion are formed such that the conductive material portion and the nonconductive portion are different from each other in a random pattern.
  • Input device. (8) The coverage ratio of the conductive material portion of the first transparent conductive element in all regions viewed from the input surface direction in a state where the first transparent conductive element and the second transparent conductive element are overlapped with each other.
  • the input device according to (6) or (7), wherein a difference in addition value from the coverage of the conductive material portion in the second transparent conductive element is 0 or more and 60 or less.
  • a display device On the display surface of the display device, a first transparent conductive element having a transparent electrode pattern part and a transparent insulating pattern part formed by alternately spreading in a predetermined direction;
  • the display surface of the display device includes a transparent electrode pattern portion and a transparent insulating pattern portion formed by alternately spreading in a direction orthogonal to the predetermined direction, and the first surface as viewed from the input surface direction.
  • a second transparent conductive element disposed in a positional relationship superimposed on the transparent conductive element of With In the first and second transparent conductive elements, the transparent electrode pattern portion and the transparent insulating pattern portion each have at least a conductive material portion, and the conductive material portions are formed in different patterns.
  • a method for producing a transparent conductive element comprising a base material and a transparent electrode pattern portion and a transparent insulating pattern portion formed by alternately laying in a predetermined direction on the surface of the base material, Generating a first random pattern used for the transparent electrode pattern portion; Generating a second random pattern to be used for the transparent insulating pattern part under a generation condition different from the first random pattern; Forming a conductive material part in the transparent electrode pattern part and a conductive material part in the transparent insulating pattern part on the substrate based on the first and second random patterns;
  • a method for producing a transparent conductive element comprising:

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  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
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  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Position Input By Displaying (AREA)

Abstract

Selon l'invention, des parties de motifs d'électrodes transparents et des parties de motifs isolants transparents comprennent chacune au moins une partie matérielle conductrice et sont conçues de sorte que les parties matérielles conductrices soient formées pour être de motifs mutuellement différents. Par exemple, les parties de motifs d'électrodes transparents et les parties de motifs isolants transparents sont chacune pourvues de parties matérielles conductrices et de parties matérielles non conductrices de sorte que les motifs des parties matérielles conductrices (parties conductrices) et les parties non conductrices (parties creuses) des parties de motifs d'électrodes transparents, et les motifs des parties matérielles conductrices (parties insulaires) et les parties non conductrices (parties d'espaces) des parties de motifs isolants transparents, soient formés pour être de motifs aléatoires mutuellement différents.
PCT/JP2012/060802 2011-04-19 2012-04-16 Élément conducteur transparent, dispositif d'entrée, appareil électronique et procédé de fabrication pour élément conducteur transparent WO2012144643A1 (fr)

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JP6698291B2 (ja) * 2014-08-13 2020-05-27 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． タッチパネル及びこれを含む表示装置
US9927939B2 (en) 2014-08-13 2018-03-27 Samsung Display Co., Ltd. Touch panel and display apparatus including the same
JP2016162633A (ja) * 2015-03-03 2016-09-05 凸版印刷株式会社 透明電極、及び有機エレクトロルミネッセンス素子
JP2016028335A (ja) * 2015-09-28 2016-02-25 デクセリアルズ株式会社 透明電極素子、情報入力装置、および電子機器

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WO2009108758A2 (fr) * 2008-02-28 2009-09-03 3M Innovative Properties Company Capteur d'écran tactile à conducteurs faiblement visibles
JP2010253813A (ja) * 2009-04-24 2010-11-11 Nissha Printing Co Ltd 艶消し状導電性ナノファイバーシート及びその製造方法
WO2011033907A1 (fr) * 2009-09-15 2011-03-24 シャープ株式会社 Panneau tactile et dispositif d'affichage le comprenant

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