WO2012142799A1 - 背光模组及其发光二极管光条组件 - Google Patents

背光模组及其发光二极管光条组件 Download PDF

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Publication number
WO2012142799A1
WO2012142799A1 PCT/CN2011/077399 CN2011077399W WO2012142799A1 WO 2012142799 A1 WO2012142799 A1 WO 2012142799A1 CN 2011077399 W CN2011077399 W CN 2011077399W WO 2012142799 A1 WO2012142799 A1 WO 2012142799A1
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WIPO (PCT)
Prior art keywords
circuit board
fixing screws
light emitting
emitting diodes
strip assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2011/077399
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English (en)
French (fr)
Inventor
张光耀
贺虎
胡哲彰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Application filed by Shenzhen China Star Optoelectronics Technology Co Ltd filed Critical Shenzhen China Star Optoelectronics Technology Co Ltd
Priority to US13/375,779 priority Critical patent/US20140036535A1/en
Publication of WO2012142799A1 publication Critical patent/WO2012142799A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0085—Means for removing heat created by the light source from the package
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0068—Arrangements of plural sources, e.g. multi-colour light sources
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0073—Light emitting diode [LED]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0086—Positioning aspects
    • G02B6/009—Positioning aspects of the light source in the package

Definitions

  • the present invention relates to a backlight module and an LED strip assembly thereof, and more particularly to a non-uniform (unequal pitch) arrangement of fixing screws on an LED strip assembly.
  • an LED strip assembly carrying a light-emitting diode is used as a light source component of a display backlight module, and structural changes thereof have a considerable influence on the image quality of the display.
  • the temperature distribution on the LED strip assembly is one of the key points in determining the image quality of the display. Referring to the partial structure diagram of the conventional display 1 shown in FIG.
  • the outer casing 3 and the optical diaphragm 5 of the existing display 1 may be Uneven heating, causing warpage and wave deformation, especially if the luminous efficiency of the LED is not high, it will also cause deformation of each device such as the temperature of the circuit board, which will affect the life of the component;
  • Another problem caused by uneven temperature of the LED strip assembly of the display 1 is that in the image displayed by the conventional display 1, most of the area 6 indicated by oblique lines is a normal image, but the four corner areas of the image 7 There is a problem of whiteness, which is a kind of light leakage. Therefore, how to improve the temperature distribution unevenness on the LED strip assembly and improve the image quality has become the focus of research and development.
  • FIG 3 is a cross-sectional view of a preferred combination of the LED strip assembly and the heat sink of the conventional display 58.
  • the circuit board 14 of the LED strip assembly and the heat sink 16 are screwed together by the left and right fixing screws 12.
  • FIG. 4 is a structural diagram of another conventional LED strip assembly 60 and a temperature distribution graph thereof.
  • the vertical axis 40 represents the temperature
  • the horizontal axis 45 represents the length of the LED strip assembly 60 (or the circuit board 14).
  • the LEDs 10 are released. The accumulation of heat causes the temperature in the middle portion of the curve 20 to be the highest, but the temperature at both ends of the curve 20 is a decreasing temperature gradient.
  • FIG. 5 is a structural diagram of another conventional LED strip assembly 65 and a temperature distribution graph thereof for explaining the influence of the density and position of the fixing screws on the temperature distribution. It can be seen from the temperature distribution curve 23 that the temperature corresponding to each fixing screw 12 is lower than the temperature corresponding to the two fixing screws 12, so the position of the fixing screw 12 can affect the temperature on the LED strip assembly 65. distributed.
  • FIG. 6 is a structural diagram of another conventional LED strip assembly 70 and a temperature distribution graph thereof for explaining the influence of temperature distribution on two rows of circuit boards 14 in a conventional LED strip assembly 70. From the temperature distribution curve 22, since there is an air gap 30 relationship between the two circuit boards 14 in this row, the corresponding temperature drops.
  • the temperature distribution of the LED strip assembly can be uniform, which contributes to the improvement of the image quality of the display.
  • the object of the present invention is to provide a backlight module and an LED strip assembly thereof, which can achieve the purpose of improving the image quality by uniformizing the temperature distribution of the LED strip assembly through the arrangement of the fixing screws.
  • the present invention provides an LED strip assembly comprising: a plurality of LEDs, at least one circuit board, a heat sink, and a plurality of fixing screws.
  • the structure of the at least one circuit board further includes three types of a first circuit board, first and second circuit boards, and a plurality of circuit boards.
  • the plurality of light emitting diodes are for emitting light.
  • the at least one circuit board has a surface for arranging the plurality of light emitting diodes, and at least one trace for electrically connecting and driving the plurality of light emitting diodes.
  • the at least one circuit board further includes a plurality of circuit boards for respectively arranging the plurality of light emitting diodes, wherein the plurality of light emitting diodes are arranged along a direction parallel to the surface of the at least one circuit board.
  • the heat dissipating member is disposed on the back surface of the at least one circuit board, and includes an intermediate portion and two end portions at opposite ends of the intermediate portion for reinforcing the heat dissipation capability of the LED, and the plurality of fixing screws are respectively inserted in the Between the plurality of light-emitting diodes, the arrangement of the plurality of fixing screws is unequal.
  • the plurality of fixing screws are configured to fix the at least one circuit board to the heat sink.
  • the fixing screws are arranged on the at least one circuit board at an unequal spacing, and the spacing between the adjacent two fixing screws is two along the middle portion of the heat dissipating member. The direction of the end portion is gradually increased, wherein a part of the fixing screws located at the intermediate portion of the heat dissipating member is densely arranged, and another portion of the fixing screws located at both ends of the heat dissipating member is arranged sparsely.
  • the at least one circuit board is two adjacent first and second circuit boards, and the plurality of fixing screws are arranged on the first and second circuit boards to make the The fixing screws are arranged, and the spacing between the two adjacent fixing screws gradually increases along the middle portion of the heat dissipating member toward the two end portions, that is, the first circuit board and the second circuit board are located therein.
  • the arrangement spacing of a part of the fixing screws in the adjacent circuit is smaller than the arrangement spacing of the other fixing screws on the first circuit board and the second circuit board.
  • the present invention provides a backlight module, which is provided on a backplane of a display, and includes: a plurality of light emitting diodes, at least one circuit board, a heat sink, a plurality of fixing screws, and a light guide plate.
  • the plurality of light emitting diodes are for emitting light.
  • the at least one circuit board (including a plurality of circuit boards) has a surface for arranging the plurality of light emitting diodes and at least one trace for connecting the plurality of light emitting diodes.
  • the heat dissipating member is disposed on a back surface of the at least one circuit board, and includes an intermediate portion and two end portions at opposite ends of the intermediate portion.
  • the plurality of fixing screws fix the at least one circuit board on the heat dissipating member, and the plurality of fixing screws are arranged in an unequal spacing.
  • the light guide plate is configured to guide the light emitted by the plurality of light emitting diodes to provide a display light source, wherein the light emitted by the plurality of light emitting diodes is introduced from a side of the light guide plate.
  • the plurality of light emitting diodes are arranged along a direction parallel to the surface of the at least one circuit board, and the plurality of fixing screws are inserted into the plurality of light emitting diodes, and the spacing between the adjacent two fixing screws is along the heat dissipation
  • the intermediate portion of the piece gradually increases in the direction of both ends.
  • the present invention adopts the above technical solution. That is, the position of the plurality of fixing screws is designed and arranged according to the temperature distribution at different positions on the LED strip assembly, instead of the arrangement of the equally spaced fixing screws of the known art. Through such a matching arrangement, the temperature distribution on the LED strip assembly is relatively uniform.
  • the arrangement of the plurality of fixing screws, when the two sets of circuit boards are combined (the first and second circuit boards), the position of the fixing screws can also be designed according to the temperature distribution.
  • the method is the same as the above method, with unequal spacing fixing screws to achieve uniform distribution of the overall temperature.
  • a plurality of sets of fixing screws are arranged.
  • the position of the fixing screws can also be designed according to the temperature distribution, the design method and the above The same method, with unequal spacing fixing screws to achieve an even distribution of the overall temperature .
  • FIG. 1 is a partial structural diagram of a conventional display.
  • FIG. 2 is a schematic diagram of illumination of a conventional display.
  • FIG. 3 is a schematic diagram of an optimal combination of an LED strip assembly and a back panel of a conventional display.
  • FIG. 4 is a structural diagram of another conventional LED strip assembly and a temperature distribution graph thereof.
  • FIG. 5 is a structural diagram of another conventional LED strip assembly and a temperature distribution graph thereof.
  • FIG. 6 is a structural diagram of another conventional LED strip assembly and a temperature distribution graph thereof.
  • FIG. 7 is a block diagram of a first embodiment of an LED strip assembly in accordance with the present invention.
  • Figure 8 is a block diagram of a second embodiment of an LED strip assembly in accordance with the present invention.
  • Figure 9 is a structural view of a first embodiment of an LED strip assembly in accordance with the present invention and a temperature profile thereof.
  • Figure 10 is a structural view of a second embodiment of an LED strip assembly in accordance with the present invention and a temperature profile thereof.
  • Figure 11 is a block diagram of a third embodiment of a backlight module and its LED strip assembly in accordance with the present invention.
  • the LED strip assembly 50 is a light source assembly of a display backlight module (not shown) and is disposed on a heat sink. (not shown), the main structure includes a plurality of light emitting diodes 10, a circuit board 14, a heat sink (not shown), and a plurality of fixing screws 12.
  • the display backlight module of the present invention is an edge-lit backlight module
  • the LED strip assembly 50 is disposed on a side of a light guide plate of the backlight module, so that The plurality of light emitting diodes 10 receive light from the side of the light guide plate, and the light guide plate guides the light emitted by the plurality of light emitting diodes 10 to serve as a light source of the overall display.
  • the circuit board 14 is a first circuit board having a surface for arranging the plurality of light emitting diodes 10 and at least one trace for driving the plurality of light emitting diodes 10, wherein the plurality of light emitting diodes 14 are along a Arranged parallel to the direction of the board surface 14.
  • the at least one trace is used for electrically connecting the plurality of light emitting diodes 10, and a plurality of light emitting diodes 10 are caused to emit light by applying a voltage. Because the circuit board 14 carries the plurality of LEDs 10, the thermal energy generated by the operation of the LEDs 10 directly affects the circuit board 14. Therefore, the material of the circuit board 14 can be a general fiberglass board FR4 or an aluminum base with high heat dissipation capability. Printed circuit board (MCPCB Meal Core Printed Circuit Board) or ceramic materials. A heat dissipating member is disposed on the back surface of the first circuit board 14, and includes an intermediate portion and two end portions at both ends of the intermediate portion.
  • the plurality of fixing screws 12 can be a heat conductive material (such as metal) or a non-thermal conductive material for fixing the circuit board 14 on the back board (not shown), so it is disposed on the same surface of the circuit board 14.
  • the plurality of fixing screws 12 are inserted between the plurality of light emitting diodes 10, and the plurality of fixing screws 12 are arranged at different intervals.
  • a portion of the fixing screws 12 located at the intermediate portion of the heat dissipating member (not shown) is densely arranged, and another portion of the fixing screws 12 located at both ends of the heat dissipating member (not shown) is arranged sparsely. .
  • the spacing between the adjacent two fixing screws 12 gradually increases toward the two end portions along the intermediate portion of the heat dissipating member. (for example, from the left to the right of Figure 7,
  • the number of the light emitting diodes 10 arranged between the plurality of fixing screws 12 is 9, 5, 3, 5, and 9 respectively.
  • the arrangement interval between the plurality of LEDs 10 is basically arranged at equal intervals, in order to obtain a uniform surface source.
  • the temperature of the intermediate position of the circuit board 14 may be higher due to the accumulation of the heat sources of the plurality of LEDs 10, and the temperature at both sides is lower (the temperature gradient is lowered).
  • the uneven distribution of the plurality of fixing screws 12 on the circuit board 14, such as the density of the plurality of fixing screws 12 arranged on the middle portion of the circuit board 14, is dense, and the fixing screws 12 arranged on both sides are arranged.
  • the density is relatively small, and the temperature distribution of the entire LED strip assembly 50 can be directly improved, that is, the different densities of the fixing screws 12 are determined according to different temperature gradients. For example, Pi and Pj shown in FIG.
  • FIG. 7 represent the number of LEDs 10 between each two fixing screws 12, and i and j represent adjacent fixing screws 12 at any position on the LED strip assembly 50.
  • the number of light-emitting diodes 10 between two adjacent fixing screws 12 in the middle of the circuit board 14 is less (representing that the fixing screws 12 are denser in density), and two adjacent fixed positions on both sides of the circuit board 14 are fixed.
  • Screw 12, the number of light-emitting diodes in the middle 10 is more Pi (representing the fixed screw 12 arrangement density is sparse).
  • the overall LED strip assembly 50 can be uniformly temperature distributed.
  • FIG. 9 is a structural diagram of a light-emitting diode strip assembly according to a first embodiment of the present invention and a temperature distribution coordinate diagram 50 thereof.
  • FIG. 8 is a light-emitting diode strip assembly 85 according to a second embodiment of the present invention, which is different from the LED strip assembly 50 of FIG. 7 in the LED strip of FIG. 8 .
  • the assembly 85 is arranged in a row by using two adjacent circuit boards, such as a first circuit board and a second circuit board 14, and disposed on a heat sink (not shown), and the two circuit boards 14 are separated by an air.
  • the gap 30 isolates the heat transfer, and the heat generated by the light-emitting diode 10 transfers heat through the heat sink under the circuit board 14, so that the temperature distribution corresponding to the air layer 30 is reduced.
  • the plurality of LEDs 10 are arranged along a direction parallel to the surfaces of the first circuit board and the second circuit board 14, and the plurality of fixing screws 12 are inserted in the plurality of LEDs 10, and the two adjacent ones are fixed.
  • the spacing between the screws 12 gradually increases along the intermediate portion of the heat dissipating member toward the two end portions, that is, a portion of the fixing screws 12 located adjacent to the first circuit board and the second circuit board 14
  • the arrangement pitch is smaller than the arrangement pitch of the other fixing screws 12 on the first circuit board and the second circuit board 14.
  • FIG. 10 is a structural diagram of a light-emitting diode strip assembly according to a second embodiment of the present invention and a temperature distribution graph 85 thereof.
  • the method and the composition principle of arranging the fixing screws 12 on the circuit board 14 are similar, and therefore will not be described below.
  • the LED strip assembly of the present invention can improve the temperature distribution of the LED strip assembly by improving the arrangement density and position of the fixing screws, thereby achieving the purpose of improving the image quality of the display.
  • a backlight module according to a third embodiment of the present invention is disposed on a heat sink 16 of a display.
  • the main structure includes: an LED strip assembly 50 and a reflector 100. a light guide plate 95 and at least one optical layer such as a diffusion sheet 110, wherein the light guide plate 95 is located below the at least one optical layer 110 but above the reflection plate 100, and the LED strip assembly 50 adopts the first
  • the same structure of the LED strip assembly of the embodiment or the second embodiment includes: a plurality of LEDs 10, at least one circuit board 14 (including a plurality of circuit boards), a heat sink 16 and a plurality of fixing screws 12 (not Graphic).
  • the plurality of light emitting diodes 10 are for emitting light.
  • the at least one circuit board 14 has a surface for arranging the plurality of light emitting diodes 10 and at least one trace for connecting the plurality of light emitting diodes 10, and the at least one circuit board 14 can be fixed to the heat sink 16 or a vertical wall of a backing plate 90.
  • the plurality of fixing screws 12 fix the at least one circuit board 14 on the heat dissipating member 16, and the plurality of fixing screws 12 are arranged at an unequal spacing, wherein the plurality of LEDs 10 are parallel along the parallel
  • the direction of the surface of a circuit board 14 is arranged, and the plurality of fixing screws 12 are inserted into the plurality of light emitting diodes 10.
  • the spacing between the adjacent two fixing screws 12 is two along the middle portion of the heat sink.
  • the backlight module of the present invention is an edge-lit backlight module, so the LED strip assembly 50 is fixed to the vertical wall of the heat sink 16 or the back plate 90 by fixing the at least one circuit board 14.
  • the LED strip assembly 50 is disposed on the side of the light guide plate 95, so that the plurality of LEDs 10 receive light from the side of the light guide plate 95, and the guide of the light guide plate 95 and the reflection of the reflector 100 are more
  • the light emitted by the LEDs 10 is converted into a high-brightness and uniform luminance surface source as a light source for the overall display.
  • the technical solution adopted by the present invention is to design and arrange the positions of a plurality of fixing screws according to the temperature distribution at different positions on the LED strip assembly, instead of the equally known techniques of the prior art. How to arrange the fixing screws. Through such a matching arrangement method, the temperature distribution on the LED strip assembly is relatively uniform, thereby achieving the purpose of improving the image quality of the display.

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  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Planar Illumination Modules (AREA)
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Description

背光模组及其发光二极管光条组件 技术领域
本发明是关于一种背光模组及其发光二极管光条组件，且特别是关于一种发光二极管光条组件上固定螺丝的非均匀性(不等间距性)排布。
背景技术
众所周知，载有发光二极管的发光二极管光条组件是作为显示器背光模组的光源组件，其结构设计上的变化对于显示器的影像品质影响相当大。例如，发光二极管光条组件上的温度分布，是决定显示器影像品质的重点之一。请参阅图1所示的现有显示器1的部份结构示意图，当现有显示器1的发光二极管光条组件上温度分布不均匀时，会使现有显示器1的外壳3和光学膜片5因受热不均匀，造成翘曲和波浪的变形，特别是若发光二极管的发光效率不高，相对也会使各装置如电路板温度升高而产生变形，影响组件的寿命；见图2所示现有显示器1的发光二极管光条组件温度不均匀引发的另一问题，在这现有显示器1显示的影像中，以斜线表示的大部份区域6为正常影像，但影像的四个角落区域7出现偏白的问题，这是一种漏光现象。因此，如何改善发光二极管光条组件上温度分布不均匀的问题，进而提高影像品质，已成为研发的重点。
从现有技术可了解，影响发光二极管光条组件温度分布的因素有三点:1.空气层的影响。2. 发光二极管光条组件上的发光二极管分布的密度。 3. 发光二极管光条组件上的固定螺丝的密度与位置。
图3为现有显示器58的发光二极管光条组件与散热件的优选组合剖视图，发光二极管光条组件的电路板14与散热件16通过左右两固定螺丝12螺固结合。
请参考图4所示，为另一种现有发光二极管光条组件60的结构图及其温度分布坐标图。在图4的温度分布坐标图中，纵轴40代表温度，横轴45代表发光二极管光条组件60(或电路板14)的长度，从温度分布曲线20来看，由于各发光二极管10释出热量的积累，使曲线20中间部分的温度最高，但曲线20两端呈下降的温度梯度。
请参考图5所示，为另一种现有发光二极管光条组件65的结构图及其温度分布坐标图，用于说明固定螺丝的密度与位置对温度分布的影响。从温度分布曲线23可看出，每一固定螺丝12所处位置对应的温度要比两固定螺丝12间对应的温度低，所以设置固定螺丝12的位置可以影响发光二极管光条组件65上的温度分布。
图6为另一种现有发光二极管光条组件70的结构图及其温度分布坐标图，用于说明现有发光二极管光条组件70中两组电路板14排成一列时对温度分布的影响，其中从温度分布曲线22来看，因为这成列的两电路板14间存在一空气间隙30的关系，其对应的温度有下降情形。
因此，若能通过改良发光二极管光条组件的固定螺丝排布，即能达到发光二极管光条组件温度分布均匀的效果，有助于显示器影像品质之提高。
 技术问题
本发明的目的在于提供一种背光模组及其发光二极管光条组件，通过固定螺丝的排布，使发光二极管光条组件的温度分布均匀，达到提高影像品质的目的。
 技术解决方案
为达到上述发明目的，本发明提供一种发光二极管光条组件，其结构包含：多个发光二极管、至少一个电路板、一散热件以及多个固定螺丝。而该至少一个电路板其结构还包含第一电路板、第一及第二电路板以及多个电路板三种型式。该多个发光二极管，用于发出光线。该至少一个电路板，具有一表面用于设置该多个发光二极管，以及至少一走线，用于电性连接及驱动该多个发光二极管。该至少一个电路板更包含多个电路板用于分别设置该多个发光二极管，其中该多个发光二极管沿着一平行于该至少一个电路板表面的方向排布。该散热件，设置于至少一电路板的背面，其包括一中间部及位于该中间部两端的两个端部，用于加强发光二极管的散热能力，且该多个固定螺丝各别穿插于该多个发光二极管间，使该多个固定螺丝的排布方法为不等间距。
该多个固定螺丝，用于固定这至少一个电路板于该散热件上。依据本发明的一实施例，所述固定螺丝排布于这至少一个电路板上的间距为不等间距，相邻的两个固定螺丝之间的间距，沿该散热件的中间部向两个端部的方向逐渐增大，其中位于该散热件中间部的一部份固定螺丝的排布较密，以及位于该散热件两端部的另一部份固定螺丝的排布较疏。
依据本发明的另一实施例，该至少一个电路板为两相邻排列的第一及第二电路板，所述若干个固定螺丝的排布于该第一及第二电路板，使该多个固定螺丝间排布，相邻的两个固定螺丝之间的间距，沿该散热件的中间部向两个端部的方向逐渐增大，即是其中位于第一电路板及第二电路板相邻处的一部份固定螺丝的排布间距小于第一电路板及第二电路板上其它固定螺丝的排布间距。
此外，本发明提供一种背光模组，用于设置于显示器的一背板上，其特征在于，包括: 多个发光二极管、至少一个电路板、一散热件、多个固定螺丝以及一导光板。
该多个发光二极管，用于发出光线。该至少一个电路板(包括多个电路板)，具有一表面用于设置该多个发光二极管以及至少一走线，该走线用于连接该多个发光二极管。该散热件，设置于该至少一个电路板的背面，其包括一中间部及位于该中间部两端的两个端部。该多个固定螺丝，固定该至少一个电路板于该散热件上，且该多个固定螺丝的排布方法为不等间距。该导光板，用于导引该多个发光二极管发出的光线，以提供显示器光源，其中该多个发光二极管发出的光线，从导光板的侧边导入。该多个发光二极管沿着一平行该至少一个电路板表面的方向排布，且该多个固定螺丝穿插于该多个发光二极管中，相邻的两个固定螺丝之间的间距，沿该散热件的中间部向两个端部的方向逐渐增大。
为达到温度分布均匀的目的，本发明采取以上之技术方案。也就是，根据发光二极管光条组件上之不同位置的温度分布情况来设计与排布多个固定螺丝的位置，取代一般已知技术的等间距的固定螺丝的排布。通过如此搭配的排布，使发光二极管光条组件上的温度分布较为均匀。
 有益效果
依据本发明的发光二极管光条组件，多个固定螺丝的排布，当两组电路板组合时(第一及第二电路板)，同样可以根据温度的分布情况设计固定螺丝的位置，设计的方法和上述方法相同，搭配不等间距的固定螺丝，以实现整体温度的均匀分布。依据本发明的发光二极管光条组件，若干个固定螺丝的排布，当多组电路板组合时(多个电路板)，同样可以根据温度的分布情况设计固定螺丝的位置，设计的方法和上述方法相同，搭配不等间距的固定螺丝，以实现整体温度的均匀分布 。
附图说明
图1为现有显示器的部份结构示意图。
图2为现有显示器的发光示意图。
图3为现有显示器的发光二极管光条组件与背板的最优组合示意图。
图4为另一种现有发光二极管光条组件的结构图及其温度分布坐标图。
图5为另一种现有发光二极管光条组件的结构图及其温度分布坐标图。
图6为另一种现有发光二极管光条组件的结构图及其温度分布坐标图。
图7为根据本发明的发光二极管光条组件的第一实施例的结构图。
图8为根据本发明的发光二极管光条组件的第二实施例的结构图。
图9为根据本发明的发光二极管光条组件的第一实施例的结构图及其温度分布坐标图。
图10为根据本发明的发光二极管光条组件的第二实施例的结构图及其温度分布坐标图。
图11根据本发明的背光模组及其及其发光二极管光条组件的第三实施例的结构图。
 本发明的最佳实施方式
本发明说明书提供不同的实施例来说明本发明不同实施方式的技术特征。实施例中的各组件的配置是为了清楚说明本发明揭示的内容，并非用以限制本发明。同实施例中图式标号的部分重复，是为了简化说明，并非意指不同实施例间的关联性。
请先参阅图7所示，为依据本发明第一实施例的发光二极管光条组件50，为一种显示器背光模组(未图示)的光源组件并设于一散热件 (未图示)上，其主要结构包含：多个发光二极管10、一个电路板14、一散热件(未图示)以及多个固定螺丝12。需注意的是，于本实施例中，本发明的显示器背光模组是一种侧光式背光模组，该发光二极管光条组件50是设置在背光模组的一导光板侧边，使该多个发光二极管10从导光板侧边入光，该导光板导引该多个发光二极管10发出的光线，以作为整体显示器的光源。该电路板14，为第一电路板，具有一表面用于设置该多个发光二极管10以及至少一走线，用于驱动该多个发光二极管10，其中该多个发光二极管14是沿着一平行于该电路板表面14的方向排布。该至少一走线，用于电性连接该多个发光二极管10，经过施加电压，使多个发光二极管10发光。因为该电路板14承载上述多个发光二极管10，所以发光二极管10工作时产生的热能直接影响该电路板14，因此电路板14的材质可以是一般的玻璃纤维板FR4或散热能力较高的铝基印刷电路板（MCPCB Meal Core Printed Circuit Board）或陶瓷材料等。一散热件，设置于第一电路板14的背面，其包括一中间部及位于该中间部两端的两个端部。该多个固定螺丝12可为一种导热材质(如金属)或非导热材质，用于固定该电路板14于该背板上(未图示)，所以设置于该电路板14的同一表面上，且该多个固定螺丝12各别穿插于该多个发光二极管10间，多个固定螺丝12的排布方法为不等间距。位于该散热件(未图示)中间部的一部份固定螺丝12的排布较密，以及位于该散热件(未图示)两端部的另一部份固定螺丝12的排布较疏。或者相邻的两个固定螺丝12之间的间距，沿该散热件的中间部向两个端部的方向逐渐增大， (例如从图7左边至右边数来, 该多个固定螺丝12间排布的发光二极管10数量分别为9个、5个、3个、5个、9个)。为了考虑该多个发光二极管10发光的均匀度，虽然该多个固定螺丝12排布于该电路板14上的间距是呈非等间距排列，但是该多个发光二极管10之间的排布间隔基本上为等间距排列，如此才能得到一均匀的面光源。
如先前所述，发光二极管光条组件50中，可能因该多个发光二极管10热源的积累，使该电路板14的中间位置的温度较高，而于两旁位置的温度较低(温度梯度下降)。但本发明通过该多个固定螺丝12于该电路板14上的不均匀分布，如电路板14上中间部分排布的多个固定螺丝12的密度较密，而于两旁排布的固定螺丝12的密度较疏，可直接改善整体发光二极管光条组件50的温度分布均匀，也就是依照不同的温度梯度来决定排布固定螺丝12的不同密度。例如图7所示Pi和Pj代表的是相邻每两颗固定螺丝12之间发光二极管10的颗数，i和j代表发光二极管光条组件50上任意位置的相邻固定螺丝12，其中位于电路板14中间位置的两颗相邻固定螺丝12间的发光二极管10颗数Pj较少(代表固定螺丝12的排布密度较密)，而其中位于电路板14两旁位置的两颗相邻固定螺丝12，中间的发光二极管10颗数Pi较多(代表固定螺丝12排布密度较疏)。以此排布方式，可使整体发光二极管光条组件50得到均匀的温度分布。请参阅图9所示，为根据本发明的第一实施例的发光二极管光条组件的结构图及其温度分布坐标图50。
请参阅图8所示，为一种依据本发明第二实施例的发光二极管光条组件85，其相较于图7的发光二极管光条组件50的不同处在于：图8的发光二极管光条组件85，使用两相邻排列的两组电路板如第一电路板及第二电路板14排成一列并设置于一散热件(未图示)上，且该两电路板14间隔着一空气间隙30隔离热传，发光二极管10产生的热量经过电路板14底下的散热件传热，因此空气层30对应的温度分布是呈现降低的现象。
该多个发光二极管10沿着一平行该第一电路板及第二电路板14表面的方向排布，且该多个固定螺丝12穿插于该多个发光二极管10中，相邻的两个固定螺丝12之间的间距，沿该散热件的中间部向两个端部的方向逐渐增大，即是其中位于第一电路板及第二电路板14相邻处的一部份固定螺丝12的排布间距小于第一电路板及第二电路板14上其它固定螺丝12的排布间距。
请参阅图10所示，为根据本发明的第二实施例的发光二极管光条组件的结构图及其温度分布坐标图85。至于该第一及第二实施例于该电路板14上排布固定螺丝12的方法及组成原理皆近似，因此以下不再累述。
由上可知，本发明的发光二极管光条组件是通过改善固定螺丝的排布密度与位置，将可使发光二极管光条组件的温度分布均匀化，进而达到提高显示器影像品质的目的。
请先参阅图11所示，为依据本发明第三实施例的背光模组，设置于一显示器的一散热件16上，其主要结构包含：一发光二极管光条组件50、一反射板100、一导光板95及至少一光学层如扩散片110，其中该导光板95位于该至少一光学层110的下方但在反射板100的上方，且该发光二极管光条组件50采用了与上述第一实施例或第二实施例的发光二极管光条组件的相同结构，包含：多个发光二极管10、至少一个电路板14(包括多个电路板)、一散热件16以及多个固定螺丝12(未图示)。该多个发光二极管10，用于发出光线。该至少一个电路板14，具有一表面用于设置该多个发光二极管10以及至少一走线，该走线用于连接该多个发光二极管10，且该至少一个电路板14可以固定于散热件16或一背板90的一垂直壁上。该多个固定螺丝12，固定该至少一个电路板14于该散热件16上，且该多个固定螺丝12的排布方法为不等间距，其中该多个发光二极管10沿着一平行该至少一个电路板14表面的方向排布，且该多个固定螺丝12穿插于该多个发光二极管10中，相邻的两个固定螺丝12之间的间距，沿该散热件的中间部向两个端部的方向逐渐增大。于本实施例中，本发明的背光模组是一种侧光式背光模组，所以发光二极管光条组件50是通过固定该至少一个电路板14于散热件16或背板90的垂直壁上，使发光二极管光条组件50设置在该导光板95侧边，使该多个发光二极管10从导光板95侧边入光，通过该导光板95的导引及反射板100的反射，该多个发光二极管10发出的光线会转化成高亮度且均一辉度的面光源，作为整体显示器的光源。
为达到温度分布均匀的目的，本发明采取的技术方案是根据发光二极管光条组件上之不同位置的温度分布情况来设计与排布多个固定螺丝的位置，取代一般已知技术的等间距的固定螺丝的排布方法。通过如此搭配的排布方法，使发光二极管光条组件上的温度分布较为均匀，进而达到提高显示器影像品质的目的。
虽然本发明已用较佳实施例揭露如上，然其
Figure 5e77
非用以限定本发明，本发明所属技术领域中具有通常知识者，在不脱离本发明的精神和范围内，当可作各种的更动与润饰，因此本发明的保护范围当视后附的申请专利范围所界定者为准。
 本发明的实施方式
工业实用性
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Claims (15)

  1. 一种背光模组，设置于一显示器的一背板上，包括一导光板及至少一发光二极管光条组件，该导光板包括一入光面，该发光二极管光条组件与该入光面相邻设置， 其特征在于，该发光二极管光条组件包括:
    多个发光二极管，用于发出光线；
    一第一电路板，具有一表面用于设置该多个发光二极管以及至少一走线，该走线用于驱动该多个发光二极管；
    一散热件，设置于该至少一个电路板的背面，其包括一中间部及位于该中间部两端的两个端部；以及
    多个固定螺丝，固定该至少一个电路板于该散热件上，且该多个固定螺丝的排布方法为不等间距。
  2. 根据权利要求1所述的背光模组，其特征在于，其中该多个发光二极管沿着一平行该第一电路板表面的方向排布，且该多个固定螺丝穿插于该多个发光二极管中，相邻的两个固定螺丝之间的间距，沿该散热件的中间部向两个端部的方向逐渐增大。
  3. 根据权利要求1所述的背光模组，其特征在于，其中该多个发光二极管沿着一平行这第一电路板表面的方向排布，且该多个固定螺丝穿插于该多个发光二极管中，其中位于该散热件中间部的一部份固定螺丝的排布较密，以及位于该散热件两端部的另一部份固定螺丝的排布较疏。
  4. 根据权利要求1所述的背光模组，其特征在于，该背光模组还包括一第二电路板，与第一电路板相邻排列，使该多个发光二极管平均设置于该第一及第二电路板的表面上。
  5. 根据权利要求4所述的背光模组，其特征在于，其中该多个发光二极管沿着一平行该第一电路板及第二电路板表面的方向排布，且该多个固定螺丝穿插于该多个发光二极管中，相邻的两个固定螺丝之间的间距，沿该散热件的中间部向两个端部的方向逐渐增大。
  6. 根据权利要求4所述的背光模组，其特征在于，其中该多个发光二极管沿着一平行该第一电路板及第二电路板表面的方向排布，且该多个固定螺丝穿插于该多个发光二极管中，其中位于第一电路板及第二电路板相邻处的一部份固定螺丝的排布间距小于第一电路板及第二电路板上其它固定螺丝的排布间距。
  7. 一种发光二极管光条组件，包括：
    多个发光二极管，用于发出光线；
    一第一电路板，具有一表面用于设置该多个发光二极管以及至少一走线，该走线用于驱动该多个发光二极管；
    一散热件，设置于第一电路板的背面，其包括一中间部及位于该中间部两端的两个端部；以及
    多个固定螺丝，固定该第一电路板于该散热件上，其特征在于：多个固定螺丝的排布方法为不等间距。
  8. 根据权利要求7所述的发光二极管光条组件，其特征在于，其中该多个发光二极管沿着一平行这第一电路板表面的方向排布，且该多个固定螺丝穿插于该多个发光二极管中，相邻的两个固定螺丝之间的间距，沿该散热件的中间部向两个端部的方向逐渐增大。
  9. 根据权利要求7所述的发光二极管光条组件，其特征在于，其中该多个发光二极管沿着一平行这第一电路板表面的方向排布，且该多个固定螺丝穿插于该多个发光二极管中，其中位于该散热件中间部的一部份固定螺丝的排布较密，以及位于该散热件两端部的另一部份固定螺丝的排布较疏。
  10. 根据权利要求7所述的发光二极管光条组件，其特征在于，该组件还包括一第二电路板，与第一电路板相邻排列，使该多个发光二极管平均设置于该第一及第二电路板的表面上。
  11. 根据权利要求7所述的发光二极管光条组件，其特征在于，其中该多个发光二极管沿着一平行该第一电路板及第二电路板表面的方向排布，且该多个固定螺丝穿插于该多个发光二极管中，相邻的两个固定螺丝之间的间距，沿该散热件的中间部向两个端部的方向逐渐增大。
  12. 根据权利要求7所述的发光二极管光条组件，其特征在于，其中该多个发光二极管沿着一平行该第一电路板及第二电路板表面的方向排布，且该多个固定螺丝穿插于该多个发光二极管中，其中位于第一电路板及第二电路板相邻处的一部份固定螺丝的排布间距小于第一电路板及第二电路板上其它固定螺丝的排布间距。
  13. 一种发光二极管光条组件，包括：
    多个发光二极管，用于发出光线；
    多个电路板，两两相邻排列，具有一表面用于设置该多个发光二极管以及至少一走线，该走线用于驱动该多个发光二极管；
    一散热件，设置于该多个电路板的背面，其包括一中间部及位于该中间部两端的两个端部；以及
    多个固定螺丝，固定多个电路板于该散热件上，其特征在于：该多个固定螺丝的排布方法为不等间距。
  14. 根据权利要求13所述的发光二极管光条组件，其特征在于，其中该多个发光二极管沿着多个电路板表面的方向排布，且该多个固定螺丝穿插于该多个发光二极管中，相邻的两个固定螺丝之间的间距，沿该散热件的中间部向两个端部的方向逐渐增大。
  15. 根据权利要求13所述的发光二极管光条组件，其特征在于，其中该多个发光二极管沿着多个电路板表面的方向排布，且该多个固定螺丝穿插于该多个发光二极管中，其中位于该散热件中间部的一部份固定螺丝的排布较密，以及位于该散热件两端部的另一部份固定螺丝的排布较疏。
PCT/CN2011/077399 2011-04-20 2011-07-20 背光模组及其发光二极管光条组件 Ceased WO2012142799A1 (zh)

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