WO2012140744A1 - Composant de circuit moulé - Google Patents

Composant de circuit moulé Download PDF

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Publication number
WO2012140744A1
WO2012140744A1 PCT/JP2011/059135 JP2011059135W WO2012140744A1 WO 2012140744 A1 WO2012140744 A1 WO 2012140744A1 JP 2011059135 W JP2011059135 W JP 2011059135W WO 2012140744 A1 WO2012140744 A1 WO 2012140744A1
Authority
WO
WIPO (PCT)
Prior art keywords
insulating substrate
zinc oxide
circuit component
filler
crystal grains
Prior art date
Application number
PCT/JP2011/059135
Other languages
English (en)
Japanese (ja)
Inventor
湯本哲男
Original Assignee
三共化成株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三共化成株式会社 filed Critical 三共化成株式会社
Priority to PCT/JP2011/059135 priority Critical patent/WO2012140744A1/fr
Priority to DE112011105153.0T priority patent/DE112011105153T5/de
Publication of WO2012140744A1 publication Critical patent/WO2012140744A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0248—Needles or elongated particles; Elongated cluster of chemically bonded particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0753—Insulation
    • H05K2201/0769—Anti metal-migration, e.g. avoiding tin whisker growth
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2072—Anchoring, i.e. one structure gripping into another
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0773—Dissolving the filler without dissolving the matrix material; Dissolving the matrix material without dissolving the filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks

Definitions

  • the present invention relates to a molded circuit component in which an electroless plating layer is selectively formed on the surface of an insulating substrate.
  • a molded circuit component in which a conductive circuit is formed by selectively performing electroless plating on the surface of an insulating substrate has been provided.
  • the surface of the insulating substrate is usually roughened in advance for the portion to be subjected to electroless plating.
  • the adhesiveness of electroless plating is ensured (for example, refer patent document 1).
  • the insulating substrate is mixed with a filler of, for example, a rubber substance that is easily dissolved by the etching solution, and the etching solution is applied to the surface layer portion of the insulating substrate.
  • a filler for example, a rubber substance that is easily dissolved by the etching solution, and the etching solution is applied to the surface layer portion of the insulating substrate.
  • a filler for example, a rubber substance that is easily dissolved by the etching solution
  • the etching solution is applied to the surface layer portion of the insulating substrate.
  • fillers have also been used to improve the strength and rigidity of insulating substrates.
  • inorganic fillers such as glass fibers, glass beads, carbon fibers, metal fibers, or zinc oxide whiskers have been proposed (for example, Patent Document 3). reference.).
  • zinc oxide multi-needle crystal grains that is, zinc oxide crystal grains having a shape in which a large number of needle crystals grow radially from the center have been developed and commercialized.
  • a product “Panatetra” registered trademark
  • Amtec Corporation is commercially available. It is said that by mixing this “Panatetra” with a synthetic resin, excellent moldability, wear resistance, antistatic properties, and radio wave shielding properties can be obtained.
  • the zinc oxide multi-needle crystal grains have a large number of needle crystals grown radially from the center, it is ideal for obtaining an anchor effect for ensuring the adhesion of electroless plating.
  • the target can be thought of as the target.
  • the multi-needle crystals of zinc oxide are mixed in an insulating substrate and the zinc oxide multi-needle crystals existing on the surface of the insulating substrate can be removed, the multi-needle crystals are removed. Since the cavities are radially branched in all directions, if electroless plating penetrates into these cavities, extremely good adhesion can be obtained.
  • an object of the present invention is to provide a molded circuit component that prevents the occurrence of ion migration and secures the insulation of a non-circuit portion and that is extremely excellent in the electroless plating adhesion.
  • the inventors of the present application have removed the zinc oxide multi-needle crystal particles mixed in the surface layer by etching the surface of the thermoplastic resin mixed with zinc oxide multi-needle crystal particles with an etching solution. As a result, it was found that an ideal anchoring effect for electroless plating can be obtained, the occurrence of ion migrainin can be prevented, and the electrical insulation of a non-circuit portion can be secured. It was.
  • the feature of the molded circuit component according to the present invention is a molded circuit component in which an electroless plating layer is selectively formed on the surface of the insulating substrate, and this insulating substrate is formed of a multi-needle of zinc oxide on a thermoplastic resin.
  • the filler mixed in the surface layer of the insulating substrate is removed by the etching solution, and the insulating substrate is mixed.
  • the electrical insulation resistance of the non-circuit portion is at least 10E9 ⁇ .
  • the mixing ratio of the filler is preferably 5 to 45 parts by weight. In addition, 5 to 20 parts by weight of another inorganic filler that dissolves in the etching solution may be mixed with the insulating substrate.
  • the “molded circuit component” is not limited to a planar two-dimensional shape, but includes a three-dimensional three-dimensional shape and a hollow shape.
  • “Selectively forming an electroless plating layer” is a non-circuit in which an electroless plating layer is formed only on a portion of a conductive circuit having a predetermined path shape and the surface of the insulating substrate is exposed in the remaining portion. It means to become a part.
  • the “thermoplastic resin” preferably has acid resistance and alkali resistance, such as polyetherimide, polysulfone, polyethylene terephthalate, polybutylene terephthalate, polyphthalamide, aromatic polyester liquid crystal polymer, and polyether ether ketone.
  • multi-needle crystal grains of zinc oxide means a shape in which a large number of needle crystals grow radially from the central portion.
  • a product “Panatetra” (amtec Co., Ltd.) ( Registered trademark).
  • Electroless plating means so-called normal chemical plating. Electroless copper plating, electroless nickel plating, electroless gold plating, electroless silver plating, or electroless plating with different plating metals, Also includes multi-layered ones.
  • “Etching solution” means a solution for dissolving and removing zinc needle multi-needle crystal grains mixed in the surface layer of an insulating substrate, and includes both an acidic solution and an alkaline solution.
  • 10E9 ⁇ means that the surface resistivity is 10 9 ohms.
  • the reason that “the electrical insulation resistance of the non-circuit portion is at least 10E9 ⁇ ” is that conduction is established at 10E8 ⁇ or less.
  • “other inorganic fillers soluble in the etching solution” include calcium carbonate, calcium silicate, and calcium pyrophosphate.
  • the cavity formed by mixing the zinc oxide multi-needle crystal grains in the insulating substrate and removing the zinc oxide multi-needle crystal grains mixed in the surface layer of the insulating substrate with the etching solution is in all directions. Since it becomes a thing branched radially, if electroless plating penetrate
  • the electrical insulation of the non-circuit portion can be ensured by setting the mixing ratio of the zinc oxide multi-needle crystal grains within a predetermined range. Furthermore, by mixing a material that dissolves in the etching solution, such as calcium carbonate, as an inorganic filler, the cavity from which the calcium carbonate has been removed is connected to the cavity from which the multi-needle crystals of zinc oxide have been removed.
  • a material that dissolves in the etching solution such as calcium carbonate
  • the anchor effect for electrolytic plating can be improved.
  • the block-shaped insulating substrate 1 is formed by injection molding.
  • the material of the insulating substrate 1 is 50.1% by weight of polyether ether ketone (for example, product “1000G” manufactured by Daicel Evonik Co., Ltd.), which is a thermoplastic resin, and multi-needle crystal grains of zinc oxide (for example, Amtec Co., Ltd. product “Panatetra (registered trademark) WZ-0501”) 32.6% by weight and calcium carbonate as an inorganic filler (for example, Shiraishi Kogyo Co., Ltd. product “Whiten P-10”) 12.3% by weight To make.
  • polyether ether ketone for example, product “1000G” manufactured by Daicel Evonik Co., Ltd.
  • multi-needle crystal grains of zinc oxide for example, Amtec Co., Ltd. product “Panatetra (registered trademark) WZ-0501”
  • calcium carbonate for example, Shiraishi Kogyo Co., Ltd. product “Whiten P-10”
  • the surface of the insulating substrate is etched with an etchant in the step (C).
  • an etching solution for example, an acidic aqueous solution of 400 g of concentrated sulfuric acid and 400 g / liter of chromic anhydride is used, and the insulating substrate 1 is immersed at a temperature of 70 ° C. for 10 minutes.
  • step (D) the surface of the insulating substrate 1 is covered with the masking 2 on the portion 1b that becomes a non-circuit portion, leaving the portion 1a that becomes a circuit.
  • the masking 2 is molded by injecting an oxyalkylene group-containing polyvinyl alcohol resin (for example, “Ecomati AX” manufactured by Nippon Synthetic Chemical Industry Co., Ltd.) that is water-soluble and easily dissolved in warm water.
  • an oxyalkylene group-containing polyvinyl alcohol resin for example, “Ecomati AX” manufactured by Nippon Synthetic Chemical Industry Co., Ltd.
  • polylactic acid for example, “Lacia # H-100J / F” manufactured by Mitsui Chemicals, Inc.
  • polyglycolic acid for example “Kureha Co., Ltd.“ # KSK08 ”
  • a catalyst is applied to the insulating substrate 1 covered with the masking 2 to form nuclei for depositing electroless plating.
  • the insulating substrate 1 is immersed in a mixed catalyst solution of tin and palladium, and then activated with an acid such as hydrochloric acid or sulfuric acid to deposit palladium on the surface.
  • an acid such as hydrochloric acid or sulfuric acid
  • a relatively strong reducing agent such as stannous chloride is adsorbed on the surface and immersed in a catalyst solution containing noble metal ions such as gold to deposit gold on the surface.
  • the temperature of the liquid may be immersed at 15 to 23 ° C. for 5 minutes.
  • the masking 2 covering the insulating substrate 1 is removed.
  • the masking 2 is an oxyalkylene group-containing polyvinyl alcohol resin
  • the insulating substrate 1 covered with the masking 2 is immersed in warm water at 80 ° C. for about 10 minutes to elute the masking in hot water.
  • the masking 2 is polylactic acid or polyglycolic acid
  • it is immersed for about 1 to 120 minutes in a caustic (NaOH, KOH, etc.) aqueous solution having a concentration of 2 to 15% by weight and a temperature of 25 to 70 ° C.
  • a caustic (NaOH, KOH, etc.) aqueous solution having a concentration of 2 to 15% by weight and a temperature of 25 to 70 ° C.
  • the electroless copper plating layer 3 is formed on the surface 1a of the insulating substrate 1 and on the portion 1a that becomes the circuit that is not covered with the masking 2. That is, as will be described later, since the cavity from which the multi-needle crystal grains of zinc oxide are removed and the catalyst is applied to the portion 1a to be a circuit, the electroless copper plating layer 3 is formed on the surface and the cavity. It precipitates inside and firmly adheres to this insulating substrate.
  • an insulating substrate 1 coated with masking 2 is applied to a plating solution having an acidic bath composition, for example, 5 to 15 g / L of copper sulfate as a metal salt and 8 to 37% by volume of formalin as a reducing agent. It is immersed in a solution at a temperature of 20 ° C. mixed with 12 mL / L, 20-25 g / L of Rochelle salt as a complexing agent, and 5-12 g / L of sodium hydroxide as an alkaline agent.
  • an acidic bath composition for example, 5 to 15 g / L of copper sulfate as a metal salt and 8 to 37% by volume of formalin as a reducing agent. It is immersed in a solution at a temperature of 20 ° C. mixed with 12 mL / L, 20-25 g / L of Rochelle salt as a complexing agent, and 5-12 g / L of sodium hydroxide as an alkaline agent.
  • FIG. 2A shows a cross section of the surface layer of the insulating substrate 1 injection-molded in the step (A) of FIG. 1 described above. That is, the insulating substrate 1 is obtained by mixing a thermoplastic resin 11 with multi-needle crystal grains 12 of zinc oxide and fine calcium carbonate 13 and one of the multi-needle crystal grains of zinc oxide. The part protrudes from the surface. Therefore, when a voltage is applied in this state, the portion protruding from the surface of the zinc oxide multi-needle crystal grains 12 is ionized by moisture in the air, ion migrasin is generated, and a short circuit between the circuits is generated. There is a risk of inviting.
  • FIG. 2B shows a cross section of the surface layer of the insulating substrate 1 after the etching in the step (C) of FIG. 1 described above. That is, in the zinc oxide multi-needle crystal grains 12, not only a portion protruding from the surface of the insulating substrate 1 but also a portion inside the surface of the insulating substrate is dissolved and removed, and a cavity 14 extending in all directions is formed. The Also, the calcium carbonate 13 in contact with the zinc oxide multi-needle crystal grains 12 is dissolved and removed, and a granular cavity 15 communicating with the cavity 14 is formed.
  • FIG. 2B shows a cross section of the surface layer of the insulating substrate 1 on which the electroless copper plating layer 3 is formed in the step (G) of FIG. 1 described above. That is, the electroless copper plating layer 3 is provided not only in the surface portion 31 of the insulating substrate 1 but also in the cavities 14 and granular cavities 15 in which the zinc oxide multi-needle crystal grains 12 and the calcium carbonate 13 are dissolved and removed. Is also formed. Therefore, the electroless copper plating layer 3 is firmly fixed to the surface layer of the insulating substrate 1.
  • the zinc oxide multi-needle crystal grains 12 and calcium carbonate 13 mixed in the surface layer of the insulating substrate 1 are dissolved and removed. The generation of ion migrainin can be prevented.
  • the three layers of electroless copper plating can be easily formed not only in the steps described above but also in other steps.
  • the step (D) (masking) and the step (E) (catalyst application) in FIG. 1 can be interchanged.
  • the step (F) (masking removal) and the step (G) (electroless copper plating) can be interchanged.
  • the step (E) (providing the catalyst) in FIG. 1 can be omitted. In this case, it is necessary to interchange the step (F) (masking removal) and the step (G) (electroless copper plating).
  • the insulating substrate 1 is formed of a material that is difficult to plate, and the masking 2 is formed on the surface by a material in which the above-described thermoplastic resin 11 is mixed with the multi-needle crystal grains 12 of zinc oxide and calcium carbonate 13. It is also possible to selectively form the electroless copper plating layer 3 on the surface of the masking 2. Furthermore, an electroless nickel layer or an electrolytic copper plating layer can be easily stacked on the electroless copper plating layer 3.
  • thermoplastic resin 11 polyether ether ketone (PEEK) (product “# 1000G” manufactured by Daicel-Evonik Co., Ltd.) 50.1 parts by mass, as multi-needle crystal grains of zinc oxide (product of Amtec Co., Ltd. “ #Panatetra WZ-0501 ”) 32.6 parts by weight and inorganic filler calcium carbonate (CaCO 3 ) (product of Shiraishi Kogyo Co., Ltd.”# Whiten P-10 ”) 12.3 parts by weight An insulating substrate 1 is formed using a material, and after degreasing and cleaning, etching is performed at 70 ° C.
  • thermoplastic resin 11 polyether ether ketone (PEEK) (product “# 1000G” manufactured by Daicel-Evonik Co., Ltd.) 62.8% by weight, as zinc oxide needle crystal grains (product of Amtec Co., Ltd. “ #Panatetra WZ-0501 ”)
  • Insulating substrate 1 is formed using a composite material containing 37.2 parts by weight, and after degreasing and cleaning, in an aqueous solution of 400 g of concentrated sulfuric acid and 400 g of chromic anhydride as a chemical etching agent. Then, etching is performed at 70 ° C.
  • the adhesion strength of the electroless copper plating layer 3 was 1.5 KN / m in a peel test.
  • thermoplastic resin 11 polyphthalamide (PPA) (Kuraray Co., Ltd. product “#Genesta N1000 M42”) 41.45 parts by weight is used as zinc oxide needle-like crystal grains 12 manufactured by Amtec Co., Ltd. #Panatetra WZ-0501 ”) 38.55 parts by weight and calcium carbonate (CaCO 3 ) (product of Shiraishi Kogyo Co., Ltd.”# Whiten P-10 ”) 20 parts by weight as an inorganic filler Insulating substrate 1 is molded using degreasing, and after degreasing and cleaning, etching is performed at 50 ° C.
  • PPA polyphthalamide
  • CaCO 3 calcium carbonate
  • liquid crystal polymer (LCP) product “Vectra # C820” manufactured by Polyplastics Co., Ltd.) is 40% by weight
  • liquid crystal polymer (LCP) product “Vectra # A950” manufactured by Polyplastics Co., Ltd.) is used.
  • Insulating substrate 1 was molded using a composite material containing 40 parts by weight and 20 parts by weight of Amtec Co., Ltd. product “#Panatetra WZ-0501” as multi-needle crystal grains 12 of zinc oxide. After degreasing and cleaning, this insulating substrate was immersed in an alkaline aqueous solution at a temperature of 70 ° C.
  • the multi-needle crystal grains 12 and calcium pyrophosphate are completely removed, and the laser patterning is performed. Subjected to circuit formation, a result of the insulation resistance was measured in the non-circuit portion 1b, it was verified to be 10 10 square ⁇ or more.
  • the adhesion strength of the electroless copper plating layer 3 was 1.0 KN / m in a peel test.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

L'invention concerne un composant de circuit moulé permettant d'éviter la migration d'ions et par conséquent de garantir des propriétés isolantes dans une zone ne comportant pas de circuits et d'améliorer l'adhérence d'un plaquage non électrolytique. Le composant de circuit moulé comprend un substrat isolant (1) et une couche de plaquage de cuivre non électrolytique (3) sélectivement formée sur la surface dudit substrat isolant. Un mélange d'une résine thermoplastique et d'une charge, ladite charge comprenant des cristaux de trichite d'oxyde de zinc, étant utilisé en tant que substrat isolant, et la charge se trouvant sur la couche de surface du substrat isolant étant enlevée à l'aide d'un agent d'attaque avant de former la couche de plaquage non électrolytique. La couche de surface du substrat isolant (1) dont les cristaux de trichite d'oxyde de zinc ont été éliminés, peut exercer un excellent effet d'ancrage sur la couche de plaquage de cuivre non électrolytique (3) et empêcher en même temps la migration d'ions dans une partie ne comportant pas de circuits (1b).
PCT/JP2011/059135 2011-04-13 2011-04-13 Composant de circuit moulé WO2012140744A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2011/059135 WO2012140744A1 (fr) 2011-04-13 2011-04-13 Composant de circuit moulé
DE112011105153.0T DE112011105153T5 (de) 2011-04-13 2011-04-13 Im Spritzgussverfahren hergestellte Schaltkreiskomponente

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2011/059135 WO2012140744A1 (fr) 2011-04-13 2011-04-13 Composant de circuit moulé

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WO2012140744A1 true WO2012140744A1 (fr) 2012-10-18

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0455555B2 (fr) * 1986-11-14 1992-09-03 Ibiden Co Ltd
JPH06180443A (ja) * 1992-12-11 1994-06-28 Alps Electric Co Ltd 基板およびその製造方法
JP2000239422A (ja) * 1999-02-22 2000-09-05 Idemitsu Petrochem Co Ltd 無電解メッキ品の製造方法およびそれに用いる樹脂組成物
JP2005234447A (ja) * 2004-02-23 2005-09-02 Canon Inc 表面に微細な凹凸を有する膜、透明反射防止膜、それらの製造方法および光学部材
JP2005289054A (ja) * 2004-03-11 2005-10-20 Canon Inc 基板、導電性基板、微細構造基板、有機電界効果型トランジスタおよびそれらの製造方法
JP2008300382A (ja) * 2007-05-29 2008-12-11 Kyocera Corp 配線基板の製造方法
JP2009126968A (ja) * 2007-11-26 2009-06-11 Sumitomo Rubber Ind Ltd タイヤ用ゴム組成物
JP2011099157A (ja) * 2009-11-09 2011-05-19 Sankyo Kasei Co Ltd 成形回路部品

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0455555B2 (fr) * 1986-11-14 1992-09-03 Ibiden Co Ltd
JPH06180443A (ja) * 1992-12-11 1994-06-28 Alps Electric Co Ltd 基板およびその製造方法
JP2000239422A (ja) * 1999-02-22 2000-09-05 Idemitsu Petrochem Co Ltd 無電解メッキ品の製造方法およびそれに用いる樹脂組成物
JP2005234447A (ja) * 2004-02-23 2005-09-02 Canon Inc 表面に微細な凹凸を有する膜、透明反射防止膜、それらの製造方法および光学部材
JP2005289054A (ja) * 2004-03-11 2005-10-20 Canon Inc 基板、導電性基板、微細構造基板、有機電界効果型トランジスタおよびそれらの製造方法
JP2008300382A (ja) * 2007-05-29 2008-12-11 Kyocera Corp 配線基板の製造方法
JP2009126968A (ja) * 2007-11-26 2009-06-11 Sumitomo Rubber Ind Ltd タイヤ用ゴム組成物
JP2011099157A (ja) * 2009-11-09 2011-05-19 Sankyo Kasei Co Ltd 成形回路部品

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