WO2012137027A1 - Surface acoustic wave resonator - Google Patents
Surface acoustic wave resonator Download PDFInfo
- Publication number
- WO2012137027A1 WO2012137027A1 PCT/IB2011/000814 IB2011000814W WO2012137027A1 WO 2012137027 A1 WO2012137027 A1 WO 2012137027A1 IB 2011000814 W IB2011000814 W IB 2011000814W WO 2012137027 A1 WO2012137027 A1 WO 2012137027A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- idt
- acoustic wave
- surface acoustic
- grooves
- frequency
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
- H03H9/14538—Formation
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02543—Characteristics of substrate, e.g. cutting angles
- H03H9/02551—Characteristics of substrate, e.g. cutting angles of quartz substrates
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02637—Details concerning reflective or coupling arrays
- H03H9/02653—Grooves or arrays buried in the substrate
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02818—Means for compensation or elimination of undesirable effects
- H03H9/02834—Means for compensation or elimination of undesirable effects of temperature influence
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02818—Means for compensation or elimination of undesirable effects
- H03H9/02929—Means for compensation or elimination of undesirable effects of ageing changes of characteristics, e.g. electro-acousto-migration
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
- H03H9/6423—Means for obtaining a particular transfer characteristic
- H03H9/643—Means for obtaining a particular transfer characteristic the transfer characteristic being determined by reflective or coupling array characteristics
Definitions
- the present invention relates to an electronic device, such as a surface acoustic wave (SAW) resonator and a surface acoustic wave oscillator having the surface acoustic wave resonator, and more particularly, to a surface acoustic wave resonator in which grooves are formed in a substrate surface and fingers of an IDT are positioned at the groove bottoms.
- SAW surface acoustic wave
- Frequency stable and compact generators of electrical sinusoidal signals are applied in a large variety of electronic systems.
- Electronic generators often include quartz resonators to obtain the high short-term frequency stability. Additionally, in the most of applications the high temperature stability is necessary to provide small frequency deviations due to changes of ambient temperature.
- a variation in frequency temperature characteristics is greatly affected by a cut angle of a quartz crystal substrate, by a stop band of the SAW, and a configuration of an interdigital transducer (IDT).
- SAW surface acoustic wave
- Recent Japanese Patent JP-A-11-214958 discloses a configuration of a SAW resonator, in which and upper mode and a lower mode of a SAW as well as a standing wave distribution in the upper mode and the lower mode of the stop band exist.
- Another Japanese Patent No.3851336 discloses that a configuration for setting a curve representing the frequency temperature characteristic as a third-order polynomial curve is used in the SAW device employing so-called "LST-cut" quartz crystal substrate. It is also disclosed that any substrate with a cut angle having a frequency-temperature characteristic represented by a third-order polynomial curve could not be discovered in a SAW device employing Rayleigh waves.
- Japanese patent JP-A-2002-100959 discloses that a rotational Y-cut X- propagation quartz crystal substrate is employed and that the frequency-temperature characteristic is more improved than that in the case where the resonance in the lower mode of the stop band is used, by using the resonance in the upper end of the stop band.
- Japanese patents JP-A-2006-148622, JP-A-2007-208871 , JP-A-2007-267033, and JP-A-2002-100959 disclose that the upper mode of the stop band has a frequency-temperature characteristic more excellent than that in the lower mode of the stop band of the Rayleigh SAW.
- Japanese patents No.2009-045359, No.2009-050112, and No.2009-285224, and the Patent US-2010/0219913 A1 disclose that the upper mode of the stop band of Rayleigh waves has a frequency-temperature characteristic that is described by a third order polynomial curve with maximum relative frequency deviations ⁇ 20 ppm in a SAW resonator with grooves disposed between electrode fingers of an IDT or between conductor strips of a reflector.
- the present invention seeks to provide an improved SAW device from the point of view of an excellent frequency-temperature characteristic that is described by a third order-polynomial curve, obtaining a high Q-factor, high power handling capability, low sensitivity to electrostatic discharge (ESD), and the convenience of fabrication to obtain higher resonance frequencies using the modern optical lift-off
- a SAW resonator fabricated on a quartz crystal substrate , and more particularly, a surface acoustic wave resonator in which grooves are formed in a substrate surface, and fingers of an IDT as well as conducting strips of reflectors are positioned at the groove bottoms in such a way that the fingers mechanically contact the left, the right side walls of the grooves, and contact the groove bottoms, and a surface acoustic wave oscillator exploiting said surface acoustic wave resonator.
- FIGs.lA, 1B, and 1C are diagrams illustrating a configuration of a SAW device according to an embodiment of the invention.
- FIG.2 is a graph illustrating the dependence of the first and second temperature coefficients of frequency on the duty factor for a SAW resonator with recessed electrodes.
- FIG.3 is a graph illustrating the frequency dependence of the admittance of a SAW resonator at the upper mode and a lower mode of a stop band.
- FIG.4 is an example of a frequency-temperature dependence of the resonance frequency of proposed resonator that is described by a third order polynomial curve.
- FIG.5 is diagram illustrating the SAW reflection characteristics of the IDT and the reflector.
- FIG.6 is diagram illustrating the configuration of a SAW oscillator according to an embodiment of the invention. 3.2 Detailed description of the preferred embodiment
- FIG.1A is a plan view of the SAW resonator
- FIG.1 B is a partially enlarged sectional view
- FIG.1C is an enlarged view illustrating the details of FIG.1 B.
- the SAW resonator 1 basically includes a quartz crystal substrate 2, an IDT 3, and two reflectors 4.
- the quartz crystal substrate 2 has crystal axes which are expressed by an X axis (electrical axis), a Y axis (mechanical axis), and a Z axis (optical axis).
- ⁇ 50°) is employed as the quartz crystal substrate 2.
- the Euler angles, which define an orientation of the crystal substrate, will be described now.
- a substrate with the Euler angles of (0°, 0°, 0°) is a Z-cut substrate having a main plane perpendicular to the Z-axis.
- the first angle ⁇ of the Euler angles ( ⁇ , ⁇ , ⁇ ) is associated with a first rotation of the Z- cut substrate.
- the Z-cut substrate is rotated about the Z-axis from the +X-axis direction to the +Y-axis, if the angle ⁇ is positive.
- the Euler angle ⁇ is associated with a second rotation which is carried out after the first rotation of the Z-cut substrate.
- the second rotation angle ⁇ assumes a rotation direction about the X -axis after the first rotation from the +Y'-axis after the first rotation to the direction of +Z-axis, if the angle ⁇ is positive,
- the cut plane of a piezoelectric substrate is determined by the first rotation angle ⁇ and the second rotation angle ⁇ .
- the Euler angle ⁇ is associated with a third rotation which is carried out after the second rotation of the Z-cut substrate.
- the angle ⁇ describes a rotating direction about the Z'-axis after the second rotation from the +X'-axis after the second rotation to the +Y'-axis after the second rotation, if the angle ⁇ is a positive rotating angle.
- the propagation direction of the SAW is determined by the third rotation angle ⁇ about the Z'-axis after the second rotation.
- the IDT 3 includes a pair of bas bars 5 and electrodes 6, which are connected periodically and alternatively to the bas bars.
- the electrode fingers 6 are arranged in a direction perpendicular to the X'-axis in which the surface acoustic wave is propagated.
- the SAW excited in the SAW resonator 1 having the above- mentioned configuration is a Rayleigh type SAW and has a vibration displacement component in both the Z'-axis after the third rotation and the X -axis after the third rotation.
- a pair of reflectors 4 is disposed on the substrate 2 so as to insert the IDT 3 between the reflectors 4 in the propagation direction of the SAW.
- both ends of periodically positioned conductor strips 8 disposed parallel to the electrode fingers 6 of the IDT 3 are connected to each other by means of connectors 7.
- the electrodes 6 of the IDT 3 or the conductor strips 8 of the reflectors 4 having the above-mentioned configuration can be made of aluminum (Al) or an alloy containing Al as a main component.
- grooves 9 are formed (FIG.1 B), and the electrode fingers 6 of the IDT 3 and the conductor strips 8 of the reflectors 6 are positioned into the grooves 9.
- the duty factor ⁇ determined in the range expressed by the following expression (3). 0.50 ⁇ ⁇ 0.75 (3)
- the thickness of the electrode film material (of the IDT 3 or the reflectors 4) in the SAW resonator 1 according to this embodiment can be preferably in the range expressed by the following expressions (4) and (5).
- the 1 st order and the second order temperature coefficients are coefficients in an approximate polynomial curve representing the frequency- temperature characteristic of the SAW resonator.
- the small absolute value of the 1 st order and the second order temperature coefficients means a small frequency variation and that the frequency-temperature characteristic is improved.
- the frequency variation AF/F 0 in the operating temperature range is about 125 ppm and the secondary temperature coefficient (TF2 is about -0.032 ppm/°C 2 .
- the frequency variation AF/F 0 is about 63 ppm and the secondary temperature coefficient (TF2 is about -0.016 ppm/°C 2 .
- the primary temperature coefficient is close to zero.
- the variation in frequency-temperature characteristic of the SAW resonator 1 is affected by the duty factor ⁇ of the electrode fingers 5 or the electrode thickness h A i of the IDT 3 and the groove depth h G R.
- the SAW resonator 1 according to this embodiment employs the excitation in the upper mode of the stop band.
- FIG.2 is a graph illustrating the variation of the primary and the secondary temperature coefficients TF1 and TF2 in the resonance of the upper mode when the duty factor ⁇ is varied and the SAW is propagated by the quartz crystal substrate 2. In the simulation shown in FIG.2, the SAW is propagated on the quartz crystal substrate 2 with an electrode film of
- the Euler angle (0°, 123°, 40.6°) is used as the cut angle of the quartz crystal.
- the secondary temperature coefficient TF2 greatly varies from the plus side to the minus side in the vicinity of the duty factor ⁇ of 0.5 to 0.75 in the upper mode of the stop band.
- FIG.3 is a graph illustrating the resonant behavior in the lower mode and in the upper mode of the stop band in the present embodiment. It can be seen from FIG.3 that the left resonance corresponding to the lower mode is much less pronounced than the right resonance that corresponds to the upper mode.
- FIG.4 is a graph in which the simulated frequency-temperature characteristic of the present embodiment is plotted. It can be seen from FIG.4 that the relative frequency variation AF/F 0 in the operating temperature range is equal to or less than about 25ppm. The point of inflection is situated at about the room temperature.
- FIG.5 illustrates a possible way of embodiment of a SAW resonator in which only the upper mode is used.
- a SAW On a periodically non-uniform crystal surface a SAW is reflected in a frequency band with a lower end frequency f1 and an upper end frequency f2.
- the frequency band from f1 to f2 is usually called as a stop band.
- the upper end frequency f2iDT of the stop band of the IDT 3 can be set between the lower end frequency f1 RE F of the stop band of the reflector 4 and the upper end frequency f2 RE F of the stop band of the reflector 4, as shown in FIG. 5. That is, the frequencies can be set to satisfy the following expression (6).
- the reflectors 4 provide high reflectivity, and the energy of the SAW is efficiently trapped in the region between the reflectors 4.
- the arrangement period of the conductor strips 8 of the reflector 4 can be smaller than the arrangement period of the electrode fingers 6 of the IDT 3.
- the thickness or the duty factor of the conductor strips 8 of the reflector 4 can be set to be different from the thickness or the duty factor of the electrodes 6 of the IDT 3.
- the depth of grooves 9 of the IDT 3 can be set different from the depth of grooves 9 of the reflectors 4. Two or more of the methods can be combined.
- FIG.6 A SAW oscillator according to an embodiment of the invention is shown in FIG.6.
Abstract
Surface acoustic wave resonator and surface acoustic wave oscillator. A surface acoustic wave resonator includes: an IDT (3) which is disposed on a quartz crystal substrate (2) with orientation described by Euler angles of (-1°<φ<1°, 110°<θ<145°, 35°<|ψ|<50°) and which excites a surface acoustic wave in an upper mode of a stop band; and grooves(2) are formed by recessing the quartz crystal substrate; and the IDT fingers (6) are positioned at bottoms of the grooves in such a way that the fingers contact the left and the right side walls of the grooves, and contact the groove bottoms, wherein the following expressions: 0<hAl/λ<0.05, hGR>hAI, where hGR represents a depth of the grooves (9), hAl represents a thickness of the IDT fingers (6), are satisfied and when a duty factor of the IDT is η and set to satisfy the following expression 0.5≤η≤0.75.
Description
Surface acoustic wave resonator
Description
Background
1. Technical field to which invention relates
The present invention relates to an electronic device, such as a surface acoustic wave (SAW) resonator and a surface acoustic wave oscillator having the surface acoustic wave resonator, and more particularly, to a surface acoustic wave resonator in which grooves are formed in a substrate surface and fingers of an IDT are positioned at the groove bottoms.
2. Indication of the background art
Frequency stable and compact generators of electrical sinusoidal signals are applied in a large variety of electronic systems. Electronic generators often include quartz resonators to obtain the high short-term frequency stability. Additionally, in the most of applications the high temperature stability is necessary to provide small frequency deviations due to changes of ambient temperature.
In a surface acoustic wave (SAW) device (such as a SAW resonator), a variation in frequency temperature characteristics is greatly affected by a cut angle of a quartz crystal substrate, by a stop band of the SAW, and a configuration of an interdigital transducer (IDT).
2.1 Specific documents reflecting background art
Recent Japanese Patent JP-A-11-214958 discloses a configuration of a SAW resonator, in which and upper mode and a lower mode of a SAW as well as a standing wave distribution in the upper mode and the lower mode of the stop band exist.
A SAW device employing an ST-cut of quartz crystal substrate, in which grooves are disposed between electrode fingers of an IDT or between conductor strips of a reflector, which is described in Japanese Patent JP-A-57-5418.
Another Japanese Patent No.3851336 discloses that a configuration for setting a curve representing the frequency temperature characteristic as a third-order polynomial curve is used in the SAW device employing so-called "LST-cut" quartz crystal substrate. It is also disclosed that any substrate with a cut angle having a frequency-temperature characteristic represented by a third-order polynomial curve could not be discovered in a SAW device employing Rayleigh waves.
However, Japanese patent JP-A-2002-100959 discloses that a rotational Y-cut X- propagation quartz crystal substrate is employed and that the frequency-temperature characteristic is more improved than that in the case where the resonance in the lower mode of the stop band is used, by using the resonance in the upper end of the stop band.
Also Japanese patents JP-A-2006-148622, JP-A-2007-208871 , JP-A-2007-267033, and JP-A-2002-100959 disclose that the upper mode of the stop band has a frequency-temperature characteristic more excellent than that in the lower mode of the stop band of the Rayleigh SAW.
Finally, Japanese patents No.2009-045359, No.2009-050112, and No.2009-285224, and the Patent US-2010/0219913 A1 disclose that the upper mode of the stop band of Rayleigh waves has a frequency-temperature characteristic that is described by a third order polynomial curve with maximum relative frequency deviations ±20 ppm in a SAW resonator with grooves disposed between electrode fingers of an IDT or between conductor strips of a reflector.
2.2 Technical problem to be solved
The present invention seeks to provide an improved SAW device from the point of view of an excellent frequency-temperature characteristic that is described by a third order-polynomial curve, obtaining a high Q-factor, high power handling capability, low sensitivity to electrostatic discharge (ESD), and the convenience of fabrication to obtain higher resonance frequencies using the modern optical lift-off
photolithography.
3. Summary of the invention
According to the present invention there is provided a SAW resonator fabricated on a quartz crystal substrate , and more particularly, a surface acoustic wave resonator in which grooves are formed in a substrate surface, and fingers of an IDT as well as conducting strips of reflectors are positioned at the groove bottoms in such a way that the fingers mechanically contact the left, the right side walls of the grooves, and contact the groove bottoms, and a surface acoustic wave oscillator exploiting said surface acoustic wave resonator.
3.1 Brief description of drawings
Embodiments of the present invention which now is described, by way of example, with reference to the accompanying drawings in which:
FIGs.lA, 1B, and 1C are diagrams illustrating a configuration of a SAW device according to an embodiment of the invention.
FIG.2 is a graph illustrating the dependence of the first and second temperature coefficients of frequency on the duty factor for a SAW resonator with recessed electrodes.
FIG.3 is a graph illustrating the frequency dependence of the admittance of a SAW resonator at the upper mode and a lower mode of a stop band.
FIG.4 is an example of a frequency-temperature dependence of the resonance frequency of proposed resonator that is described by a third order polynomial curve.
FIG.5 is diagram illustrating the SAW reflection characteristics of the IDT and the reflector.
FIG.6 is diagram illustrating the configuration of a SAW oscillator according to an embodiment of the invention.
3.2 Detailed description of the preferred embodiment
First, a surface acoustic wave (SAW) resonator according to a first embodiment of the invention will be described with reference to FIGs. 1A, 1B, and 1C. FIG.1A is a plan view of the SAW resonator, FIG.1 B is a partially enlarged sectional view, and FIG.1C is an enlarged view illustrating the details of FIG.1 B.
The SAW resonator 1 according to this embodiment basically includes a quartz crystal substrate 2, an IDT 3, and two reflectors 4. The quartz crystal substrate 2 has crystal axes which are expressed by an X axis (electrical axis), a Y axis (mechanical axis), and a Z axis (optical axis).
In this embodiment, an Y-rotated and in-plane rotational cut quartz crystal substrate with Euler angles of (-1°<φ<1°, 110°<θ<145°, 35°<|ψ|<50°) is employed as the quartz crystal substrate 2. The Euler angles, which define an orientation of the crystal substrate, will be described now. A substrate with the Euler angles of (0°, 0°, 0°) is a Z-cut substrate having a main plane perpendicular to the Z-axis. Here, the first angle φ of the Euler angles (φ, θ, ψ), is associated with a first rotation of the Z- cut substrate. The Z-cut substrate is rotated about the Z-axis from the +X-axis direction to the +Y-axis, if the angle φ is positive.
The Euler angle Θ is associated with a second rotation which is carried out after the first rotation of the Z-cut substrate. The second rotation angle Θ assumes a rotation direction about the X -axis after the first rotation from the +Y'-axis after the first rotation to the direction of +Z-axis, if the angle Θ is positive,
The cut plane of a piezoelectric substrate is determined by the first rotation angle φ and the second rotation angle Θ.
The Euler angle ψ is associated with a third rotation which is carried out after the second rotation of the Z-cut substrate. The angle ψ describes a rotating direction about the Z'-axis after the second rotation from the +X'-axis after the second rotation to the +Y'-axis after the second rotation, if the angle ψ is a positive rotating angle. The propagation direction of the SAW is determined by the third rotation angle ψ about the Z'-axis after the second rotation.
The IDT 3 includes a pair of bas bars 5 and electrodes 6, which are connected periodically and alternatively to the bas bars. Here, the electrode fingers 6 are arranged in a direction perpendicular to the X'-axis in which the surface acoustic
wave is propagated. The SAW excited in the SAW resonator 1 having the above- mentioned configuration is a Rayleigh type SAW and has a vibration displacement component in both the Z'-axis after the third rotation and the X -axis after the third rotation. In this way, by deviation of the propagation direction of the SAW from the X- axis which is the crystal axis of quartz crystal, one can change the phase of the reflection coefficient of the recessed electrodes and, thus, it is possible to excite the SAW in the upper mode of the stop band.
A pair of reflectors 4 is disposed on the substrate 2 so as to insert the IDT 3 between the reflectors 4 in the propagation direction of the SAW. In the reflectors both ends of periodically positioned conductor strips 8 disposed parallel to the electrode fingers 6 of the IDT 3 are connected to each other by means of connectors 7.
The electrodes 6 of the IDT 3 or the conductor strips 8 of the reflectors 4 having the above-mentioned configuration can be made of aluminum (Al) or an alloy containing Al as a main component.
In the quartz crystal substrate 2 of the SAW resonator 1 having the above-mentioned basic configuration, grooves 9 are formed (FIG.1 B), and the electrode fingers 6 of the IDT 3 and the conductor strips 8 of the reflectors 6 are positioned into the grooves 9.
As to the grooves 9 formed in the quartz crystal substrate 2, it is preferred that the following expression (1 ):
0.01< hGR/ <0.1 (1 ) where the wavelength of the SAW in the upper mode of the stop band is λ, and the groove depth is hGR, is satisfied. By setting the groove depth hGR to this range, the frequency variation in the operating temperature range (-40° C. to +85° C.) can be suppressed to 25 ppm or less as a target value.
The duty factor η is a value obtained by dividing a line width L of each electrode finger 6 by a pitch X/2=L+S between the electrode fingers 6, as shown in FIG.1C. Therefore, the duty factor η can be expressed by the following expression (2). n=lJ(L+S) (2)
In the SAW resonator 1 according to this embodiment, the duty factor η determined in the range expressed by the following expression (3).
0.50 <η < 0.75 (3)
The thickness of the electrode film material (of the IDT 3 or the reflectors 4) in the SAW resonator 1 according to this embodiment can be preferably in the range expressed by the following expressions (4) and (5).
It is a goal to improve the frequency-temperature characteristic until the relative frequency variation AF/F0 to 25 ppm or less in the operating temperature range from -40°C to +85°C for the SAW resonator 1 according to this embodiment having the above-mentioned configuration.
The 1st order and the second order temperature coefficients (TF1 and TF2) are coefficients in an approximate polynomial curve representing the frequency- temperature characteristic of the SAW resonator. The small absolute value of the 1st order and the second order temperature coefficients means a small frequency variation and that the frequency-temperature characteristic is improved. Hereinafter, it is shown by simulation that the SAW device having the above-mentioned configuration is able to accomplish the subject of the invention.
In the SAW resonator whose propagation direction is the direction of the crystal X axis using a quartz crystal substrate called an "ST cut", when the operating temperature range is (-40°C +85°C) , the frequency variation AF/F0 in the operating temperature range is about 125 ppm and the secondary temperature coefficient (TF2 is about -0.032 ppm/°C2. In the SAW resonator which is formed using an in-plane rotation ST-cut quartz crystal substrate in which the cut angle of the quartz crystal substrate and the SAW propagation direction are described by Euler angles (0°, 123°, 45°) and the operating temperature range is the same as above, the frequency variation AF/F0 is about 63 ppm and the secondary temperature coefficient (TF2 is about -0.016 ppm/°C2. The primary temperature coefficient is close to zero.
The variation in frequency-temperature characteristic of the SAW resonator 1 is affected by the duty factor η of the electrode fingers 5 or the electrode thickness hAi of the IDT 3 and the groove depth hGR. The SAW resonator 1 according to this embodiment employs the excitation in the upper mode of the stop band.
FIG.2 is a graph illustrating the variation of the primary and the secondary temperature coefficients TF1 and TF2 in the resonance of the upper mode when the duty factor η is varied and the SAW is propagated by the quartz crystal substrate 2. In the simulation shown in FIG.2, the SAW is propagated on the quartz crystal substrate 2 with an electrode film of
The Euler angle (0°, 123°, 40.6°) is used as the cut angle of the quartz crystal.
It can be seen from FIG.2 that the secondary temperature coefficient TF2 greatly varies from the plus side to the minus side in the vicinity of the duty factor η of 0.5 to 0.75 in the upper mode of the stop band. The primary temperature coefficient TF1 in the upper mode of the stop band shows a similar behavior that is shifted from the plus side to a minus side, and at the duty factor η=0.63 the frequency temperature characteristic is significantly improved.
FIG.3 is a graph illustrating the resonant behavior in the lower mode and in the upper mode of the stop band in the present embodiment. It can be seen from FIG.3 that the left resonance corresponding to the lower mode is much less pronounced than the right resonance that corresponds to the upper mode.
FIG.4 is a graph in which the simulated frequency-temperature characteristic of the present embodiment is plotted. It can be seen from FIG.4 that the relative frequency variation AF/F0 in the operating temperature range is equal to or less than about 25ppm. The point of inflection is situated at about the room temperature.
FIG.5 illustrates a possible way of embodiment of a SAW resonator in which only the upper mode is used. On a periodically non-uniform crystal surface a SAW is reflected in a frequency band with a lower end frequency f1 and an upper end frequency f2. The frequency band from f1 to f2 is usually called as a stop band. In this embodiment in order to efficiently trap the energy of the surface acoustic wave excited predominantly in the upper mode of the stop band, the upper end frequency f2iDT of the stop band of the IDT 3 can be set between the lower end frequency f1REF of the stop band of the reflector 4 and the upper end frequency f2REF of the stop band of the reflector 4, as shown in FIG. 5. That is, the frequencies can be set to satisfy the following expression (6).
In the case described by expression (6) the reflectors 4 provide high reflectivity, and the energy of the SAW is efficiently trapped in the region between the reflectors 4. In
order to fulfill the expression (6), it is necessary to shift the stop band of the reflector 4 to a higher frequency as compared to the stop band of the IDT 3. Specifically, to implement this shift the arrangement period of the conductor strips 8 of the reflector 4 can be smaller than the arrangement period of the electrode fingers 6 of the IDT 3. As another method, the thickness or the duty factor of the conductor strips 8 of the reflector 4 can be set to be different from the thickness or the duty factor of the electrodes 6 of the IDT 3. Additionally, the depth of grooves 9 of the IDT 3 can be set different from the depth of grooves 9 of the reflectors 4. Two or more of the methods can be combined.
A SAW oscillator according to an embodiment of the invention is shown in FIG.6.
It should be clear to the person skilled in the art that other embodiments of this invention are possible, such as using reflectors with the same electrode and groove dimensions as in the IDT, or using long IDT with no reflectors at all. The device can be used not only for stabilization of frequency of oscillator, but as 2-port resonator or a narrow band filter, or as a sensor of physical values, etc. All such embodiments are included in the patent.
Claims
1. A surface acoustic wave resonator comprising:
an IDT which is disposed on a quartz crystal substrate with an Euler angle of (- Γ<φ<Γ, 110°<θ<145°, 35°<|ψ|<50°) and which excites a surface acoustic wave in an upper mode of a stop band; and grooves are formed by recessing the quartz crystal substrate; and the said IDT fingers are positioned at bottoms of the grooves in such a way that the fingers mechanically attached to the left, the right side walls of the grooves, and to the the groove bottoms, wherein the following expressions:
0<hA <0.05
where IIGR represents a depth of the grooves, IIAI represents a thickness of the IDT fingers, are satisfied and when a duty factor of the IDT is η and set to satisfy the following expression
0.5<η<0.75
where f2|DT represents a frequency of the upper mode of the stop band in the IDT, f1 REF represents a frequency of the lower mode of the stop band in reflectors disposed to interpose the IDT there between in a propagation direction of the surface acoustic wave, and f2REF represents a frequency of the upper mode of the stop band in the reflectors, is satisfied.
3. The surface acoustic wave resonator according to claim 1 , wherein conductor strips of the reflectors are disposed inside grooves, and wherein the depth of the groove is smaller than the depth of the grooves in the IDT providing the high power handling capability of the device and reduced sensitivity to ESD.
4. The surface acoustic wave resonator according to claim 1 , wherein the duty factor of IDT fingers is smaller than the duty factor of conductor strips in reflector.
5. A surface acoustic wave oscillator comprising the surface acoustic wave resonator according to claim 1 and an IC driving the IDT.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/IB2011/000814 WO2012137027A1 (en) | 2011-04-07 | 2011-04-07 | Surface acoustic wave resonator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/IB2011/000814 WO2012137027A1 (en) | 2011-04-07 | 2011-04-07 | Surface acoustic wave resonator |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2012137027A1 true WO2012137027A1 (en) | 2012-10-11 |
Family
ID=44626449
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IB2011/000814 WO2012137027A1 (en) | 2011-04-07 | 2011-04-07 | Surface acoustic wave resonator |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2012137027A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150042408A1 (en) * | 2009-02-27 | 2015-02-12 | Seiko Epson Corporation | Surface acoustic wave resonator, surface acoustic wave oscillator, and electronic instrument |
US20210273632A1 (en) * | 2018-06-15 | 2021-09-02 | Resonant Inc. | Solidly-mounted transversely-excited film bulk acoustic resonator with recessed interdigital transducer fingers using rotated y-x cut lithium niobate |
Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1372067A (en) * | 1971-03-06 | 1974-10-30 | Marconi Co Ltd | Acoustic surface wave transducers |
JPS575418A (en) | 1980-06-13 | 1982-01-12 | Nippon Telegr & Teleph Corp <Ntt> | Cavity type surface elastic wave resonator |
EP0744830A1 (en) * | 1994-10-20 | 1996-11-27 | Japan Energy Corporation | Surface acoustic wave device and production method thereof |
JPH11214958A (en) | 1998-01-20 | 1999-08-06 | Toyo Commun Equip Co Ltd | Reflection inverting type surface-acoustic-wave device and filter |
JP2002100959A (en) | 2000-09-25 | 2002-04-05 | Toyo Commun Equip Co Ltd | Surface acoustic wave device |
US20020079987A1 (en) * | 2000-12-21 | 2002-06-27 | Yip David S. | Recessed reflector single phase unidirectional transducer |
DE10236003A1 (en) * | 2002-08-06 | 2004-02-19 | Epcos Ag | Acoustic wave component e.g. for use as filter for GHz frequencies, with metallic electrodes embedded in surface of component substrate |
JP2006148622A (en) | 2004-11-22 | 2006-06-08 | Seiko Epson Corp | Surface acoustic wave device and electronic equipment |
JP3851336B1 (en) | 2005-05-31 | 2006-11-29 | 隆彌 渡邊 | Surface acoustic wave device |
JP2007208871A (en) | 2006-02-06 | 2007-08-16 | Seiko Epson Corp | Surface acoustic wave device and electronic equipment |
JP2007267033A (en) | 2006-03-28 | 2007-10-11 | Epson Toyocom Corp | Surface acoustic wave element and surface acoustic wave device |
JP2009045359A (en) | 2007-08-22 | 2009-03-05 | Shu's Selection Co Ltd | Runner fixing structure in umbrella |
JP2009050112A (en) | 2007-08-21 | 2009-03-05 | Fuji Electric Systems Co Ltd | Control system of reactive power compensator |
JP2009285224A (en) | 2008-05-29 | 2009-12-10 | Aruze Corp | Game machine |
US20100219913A1 (en) | 2009-02-27 | 2010-09-02 | Epson Toyocom Corporation | Surface acoustic wave resonator and surface acoustic wave oscillator |
-
2011
- 2011-04-07 WO PCT/IB2011/000814 patent/WO2012137027A1/en active Application Filing
Patent Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1372067A (en) * | 1971-03-06 | 1974-10-30 | Marconi Co Ltd | Acoustic surface wave transducers |
JPS575418A (en) | 1980-06-13 | 1982-01-12 | Nippon Telegr & Teleph Corp <Ntt> | Cavity type surface elastic wave resonator |
EP0744830A1 (en) * | 1994-10-20 | 1996-11-27 | Japan Energy Corporation | Surface acoustic wave device and production method thereof |
JPH11214958A (en) | 1998-01-20 | 1999-08-06 | Toyo Commun Equip Co Ltd | Reflection inverting type surface-acoustic-wave device and filter |
JP2002100959A (en) | 2000-09-25 | 2002-04-05 | Toyo Commun Equip Co Ltd | Surface acoustic wave device |
US20020079987A1 (en) * | 2000-12-21 | 2002-06-27 | Yip David S. | Recessed reflector single phase unidirectional transducer |
DE10236003A1 (en) * | 2002-08-06 | 2004-02-19 | Epcos Ag | Acoustic wave component e.g. for use as filter for GHz frequencies, with metallic electrodes embedded in surface of component substrate |
JP2006148622A (en) | 2004-11-22 | 2006-06-08 | Seiko Epson Corp | Surface acoustic wave device and electronic equipment |
JP3851336B1 (en) | 2005-05-31 | 2006-11-29 | 隆彌 渡邊 | Surface acoustic wave device |
JP2007208871A (en) | 2006-02-06 | 2007-08-16 | Seiko Epson Corp | Surface acoustic wave device and electronic equipment |
JP2007267033A (en) | 2006-03-28 | 2007-10-11 | Epson Toyocom Corp | Surface acoustic wave element and surface acoustic wave device |
JP2009050112A (en) | 2007-08-21 | 2009-03-05 | Fuji Electric Systems Co Ltd | Control system of reactive power compensator |
JP2009045359A (en) | 2007-08-22 | 2009-03-05 | Shu's Selection Co Ltd | Runner fixing structure in umbrella |
JP2009285224A (en) | 2008-05-29 | 2009-12-10 | Aruze Corp | Game machine |
US20100219913A1 (en) | 2009-02-27 | 2010-09-02 | Epson Toyocom Corporation | Surface acoustic wave resonator and surface acoustic wave oscillator |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150042408A1 (en) * | 2009-02-27 | 2015-02-12 | Seiko Epson Corporation | Surface acoustic wave resonator, surface acoustic wave oscillator, and electronic instrument |
US9762207B2 (en) * | 2009-02-27 | 2017-09-12 | Seiko Epson Corporation | Surface acoustic wave resonator, surface acoustic wave oscillator, and electronic instrument |
US20210273632A1 (en) * | 2018-06-15 | 2021-09-02 | Resonant Inc. | Solidly-mounted transversely-excited film bulk acoustic resonator with recessed interdigital transducer fingers using rotated y-x cut lithium niobate |
US11689185B2 (en) * | 2018-06-15 | 2023-06-27 | Murata Manufacturing Co., Ltd. | Solidly-mounted transversely-excited film bulk acoustic resonator with recessed interdigital transducer fingers using rotated y-x cut lithium niobate |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP2224591B1 (en) | Surface acoustic wave resonator and surface acoustic wave oscillator | |
TWI481189B (en) | Surface acoustic wave resonator, surface acoustic wave oscillator and electronic machine | |
JP5488825B2 (en) | Surface acoustic wave resonator and surface acoustic wave oscillator | |
US8928432B2 (en) | Surface acoustic wave resonator, surface acoustic wave oscillator, and electronic apparatus | |
US8476984B2 (en) | Vibration device, oscillator, and electronic apparatus | |
US8791621B2 (en) | Surface acoustic wave resonator, surface acoustic wave oscillator, and electronic apparatus | |
JP2006217566A (en) | Lamb-wave high-frequency resonator | |
JP2007267033A (en) | Surface acoustic wave element and surface acoustic wave device | |
US8692439B2 (en) | Surface acoustic wave resonator, surface acoustic wave oscillator, and electronic device | |
JP2004215227A (en) | Surface acoustic wave device and manufacturing method thereof, and electronic equipment | |
JPS632414A (en) | Elastic surface wave resonator | |
JP2000188521A (en) | Surface acoustic wave device and two port surface acoustic wave resonator | |
US20100289379A1 (en) | Surface acoustic wave (saw) device | |
WO2012137027A1 (en) | Surface acoustic wave resonator | |
US8471434B2 (en) | Surface acoustic wave device, surface acoustic wave oscillator, and electronic apparatus | |
US20230117944A1 (en) | Bonded substrate and its manufacturing method | |
JP5737491B2 (en) | Surface acoustic wave filters, electronic equipment | |
JP5737490B2 (en) | Transversal surface acoustic wave device, surface acoustic wave oscillator and electronic equipment | |
JP2015084534A (en) | Two-terminal pair surface acoustic wave resonator, surface acoustic wave oscillator, and electronic apparatus | |
JP2005184340A (en) | Surface acoustic wave chip | |
JP5750683B2 (en) | Two-terminal-pair surface acoustic wave resonator, surface acoustic wave oscillator and electronic device | |
JP2015084535A (en) | Transversal type surface acoustic wave device, surface acoustic wave oscillator, and electronic apparatus | |
JP2012049631A (en) | Surface acoustic wave resonator, surface acoustic wave oscillator, electronic apparatus | |
JP2008301020A (en) | Surface-acoustic wave device | |
JP2011171886A (en) | Lamb wave resonator and oscillator |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 11720176 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
32PN | Ep: public notification in the ep bulletin as address of the adressee cannot be established |
Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 13.02.2014) |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 11720176 Country of ref document: EP Kind code of ref document: A1 |