WO2012135988A1 - 一种led散热器 - Google Patents

一种led散热器 Download PDF

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Publication number
WO2012135988A1
WO2012135988A1 PCT/CN2011/001785 CN2011001785W WO2012135988A1 WO 2012135988 A1 WO2012135988 A1 WO 2012135988A1 CN 2011001785 W CN2011001785 W CN 2011001785W WO 2012135988 A1 WO2012135988 A1 WO 2012135988A1
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Prior art keywords
heat sink
led
heat
gap
leds
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PCT/CN2011/001785
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English (en)
French (fr)
Inventor
唐林涛
李旭亮
Original Assignee
东莞勤上光电股份有限公司
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Publication of WO2012135988A1 publication Critical patent/WO2012135988A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention belongs to the field of LED technologies, and in particular, to an LED heat sink.
  • LEDs Light Emitting Diodes
  • the heat generated by the LED is mainly transmitted through a transmission method, including heat conduction, heat convection, and heat radiation.
  • a transmission method including heat conduction, heat convection, and heat radiation.
  • the heat generated by the LED chip is conducted to the heat sink by heat conduction through a gold wire, a circuit board, a substrate (such as an aluminum base, a ceramic base, etc.), a thermal conductive adhesive (such as a pad), and the heat sink is exposed to the air. Heat is exchanged by convection of air to dissipate heat.
  • the heat sink is the final interface for heat exchange between the high-power LED and the air, and the heat exchange efficiency of the heat sink directly affects the performance of the LED product.
  • the heat exchange between the heat sink and the air includes active switching and passive switching.
  • the active switching mainly uses a device such as a fan to accelerate the air flow speed around the heat sink, thereby increasing the heat exchange rate.
  • a device such as a fan to accelerate the air flow speed around the heat sink, thereby increasing the heat exchange rate.
  • the heat dissipation of commonly used CPUs and memory modules are commonly used.
  • the advantage of active switching is high efficiency. The disadvantage is that it requires a fan and other equipment, and the power consumption is large and the noise is large;
  • Passive exchange relies mainly on the material and structure of the radiator itself to optimize the heat exchange between the flow rate of the air and the surface of the radiator.
  • Prior art heat sink production processes mainly include aluminum extruded heat sinks, C-type clasp heat sinks, stripped heat sinks, and cold extruded heat sinks.
  • aluminum extrusion type radiators are widely used.
  • a common disadvantage of the above four types of heat sinks is the neglect of the importance of air flow.
  • FIG. 1 is a typical representative of a prior art heat sink.
  • the heat sink 12' extends over the heat sink base 1 .
  • the top between each heat sink 12 ′ is a gap, and the bottom is a base.
  • the bottom of the radiator due to the pressure difference formed by cold and hot air, the bottom of the radiator The air flows upwards, but if the cold air cannot be replenished near the heat source in time, air convection cannot be formed, so that the temperature at the top of the heat sink 12' is low, and the temperature at the bottom of the heat sink 12' is high, which will form a "heat island effect", resulting in The heat dissipation effect is poor, which in turn leads to an increase in the temperature of the LED chip, which affects the service life of the LED and reduces the light extraction rate of the LED.
  • An object of the embodiments of the present invention is to provide an LED heat sink, which aims to improve the heat dissipation effect of the LED heat sink, prolong the service life of the LED, and improve the light extraction rate of the LED.
  • an LED heat sink comprising: a pedestal, the pedestal is provided with an LED, and is further disposed corresponding to the LED, for using the LED
  • the generated heat dissipates the heat sink, wherein the heat sinks corresponding to the adjacent LEDs form a transparent gap with each other, and when the heat sink emits heat, the cold air in the gap and the heat around the heat sink The air forms convection, and the cold air carries away the heat of the heat sink
  • the heat sink and the LED are spaced apart from each other.
  • a horizontal plane of the heat sink is parallel to a horizontal plane of the susceptor, and both ends of the heat sink extend out of the susceptor.
  • the heat sinks corresponding to the adjacent LEDs are disposed in parallel with each other.
  • the heat sink corresponding to the LED includes two fins, and the two fins cross each other. Further, the cross sections of the two fins may be of the "X" type.
  • the heat sink corresponding to the LED is at least one straight fin.
  • the heat sink and the material of the base are all pure aluminum for industrial use.
  • the surface of the heat sink and the pedestal are both coated in black.
  • the surface of the heat sink and the pedestal are all sprayed with nano lacquer.
  • each set of LEDs corresponds to a set of heat sinks, wherein the heat sinks corresponding to the adjacent LEDs form a transparent gap with each other, and the heat sink is used to dissipate heat.
  • the air in the gap forms convection, which takes away the heat of the heat sink, effectively avoids the "heat island effect", improves the heat dissipation effect of the LED heat sink, prolongs the service life of the LED, and improves the light output rate of the LED, which is beneficial to the LED.
  • FIG. 1 is a schematic view of a heat sink in the prior art
  • 2A-2C are structural views of one embodiment of a heat sink according to an embodiment of the present invention
  • 3A-3B are structural views of one embodiment of a heat sink according to an embodiment of the present invention
  • FIGS. 4A-4B are structural views of one embodiment of a heat sink according to an embodiment of the present invention.
  • FIG. 2 shows a schematic diagram of an embodiment of an LED heat sink provided by the present invention.
  • the LED heat sink provided by the present invention comprises a pedestal 11 on which a heat sink 12 and an LED 13 are disposed.
  • Each set of heat sinks 12 corresponds to a group of LEDs 13 for heat generation by the LEDs 13. Distribute.
  • the heat sinks 12 corresponding to the adjacent LEDs 13 form a transparent gap 21 therebetween. Under the passive heat dissipation, the heat sink 12 emits heat, the cold air and the heat sink in the gap 21 The hot air around 12 forms convection, which in turn carries away the heat from the fins 12.
  • FIG. 2A is a general effect view
  • FIG. 2B is a front view
  • FIG. 2C is a rear view.
  • the LED 13 and the heat sink 12 are spaced apart from each other, and the horizontal plane D1 of the heat sink 12 is parallel to the horizontal plane D2 of the susceptor 11, and both ends of the heat sink 12 extend out of the susceptor 11, that is, Both ends of the heat sink 12 are at an angle to the base 11.
  • the structure shown in Fig. 1 ensures that a transparent gap 21 is formed between the fins 12 corresponding to the adjacent LEDs 13, so that cold air can flow unimpeded in the gap 21.
  • FIG. 3A in FIG. 3A, the heat sink 12 corresponding to the LED 13 is a strip-shaped heat sink 12, and FIG. 3B is a side view corresponding to FIG. 3A, and FIG. 4A and FIG. 4B are similar.
  • the fins 12 corresponding to the adjacent LEDs 13 may be disposed in parallel with each other to ensure that the cold air can flow unimpeded in the gap 21.
  • the heat sink corresponding to the LED 13 is at least one strip-shaped heat sink 12 to ensure that the heat sink 12 corresponding to the adjacent LED 13 can form a gap 21 (refer to FIG. 3 and FIG. 4).
  • the heat sink corresponding to the LED 13 can be provided with two or more heat sinks 12 ( FIG. 2 ) according to actual conditions, as long as the heat sinks 12 corresponding to the adjacent LEDs 13 can form a transparent through each other.
  • the clearance 21 and the flow of the cold air in the gap 21 can be unimpeded, which are all within the protection scope of the embodiments of the present invention, and will not be described in detail herein.
  • two fins 12 are disposed between adjacent LEDs 13, and the two fins 12 are provided.
  • the "X" shaped heat sink 12 has the advantages of a large surface area and a significant heat dissipation advantage.
  • the "X"-shaped heat sink 12 still needs to ensure that the fins 12 constituting the gap 21 are disposed in parallel with each other, thereby ensuring that the cold air can flow unimpeded in the gap 21.
  • the heat sink 12 and the base 11 are made of pure aluminum for industrial use, and the industrial pure aluminum used is produced by a cold extrusion aluminum production process, and the industrial pure aluminum heat is used. High conductivity, which is good for heat dissipation.
  • the surface coating of the heat sink 12 and the susceptor 11 is black, which can increase the radiation heat dissipation function of the heat sink 12 and the susceptor 11, which is advantageous for heat dissipation.
  • the surface of the heat sink 12 and the susceptor 11 is sprayed with a nano lacquer, and the nano lacquer can maximize the area through the microstructure of the surface to facilitate heat dissipation.
  • the heat generated by the operation of the LED 13 is first guided to the gap 21 between the fins 12 by the "X" shaped heat sink 12.
  • the gap 21 during the heat exchange of the fins 13 with the cold air passing through the gap 21, the cold air passing through the gap 21 forms convection with the hot air around the fins 13.
  • the cold air passing through the gap 21 quickly replenishes the rising hot air to form a relatively high air velocity field, and the continuous cold air carries away the heat, thereby making the heat sink 13 sufficiently hot with the cold air. exchange.
  • each group of LEDs 13 is surrounded by a transparent gap 21, and each of the transparent gaps 21 is surrounded by LEDs 13, thus forming a uniformly distributed velocity field.
  • the amount of ventilation makes the air flow up and down faster, which eliminates the "heat island effect" around the heat sink 12, and achieves the optimal heat dissipation.
  • each set of LEDs corresponds to a set of heat sinks, wherein the heat sinks corresponding to the adjacent LEDs form a transparent gap with each other, and the heat sink is used to dissipate heat.
  • the air in the gap forms convection, which takes away the heat of the heat sink, effectively avoids the "heat island effect", improves the heat dissipation effect of the LED heat sink, prolongs the service life of the LED, and improves the light output rate of the LED, which is beneficial to the LED.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Description

一种 LED散热器 技术领域
[0001] 本发明属于 LED技术领域， 尤其涉及一种 LED散热器。
背景技术
[0002] 随着发光二极管 （Light Emitting Diode, LED) 的不断普及， 用户对 LED各项指标 的要求越来越高， 尤其是大功率 LED。
[0003] 现有的 LED 在工作过程中， 输入电能的 70%~80%转变成为无法借助辐射释放的热 量， 而且 LED芯片尺寸小， 如果散热不良， 则会使 LED芯片温度升高， 引起热应力分布不 均， 进而导致芯片发光效率降低以及荧光粉激射效率下降等问题， 为保障 LED 的使用寿 命， 提高 LED发光效率， 一般都需要对 LED进行散热处理。
[0004] 现有技术中， 对 LED 产生的热量进行散发主要通过传递方式进行， 包括热传导传 递、 热对流传递以及热辐射传递。 对于大功率 LED 热量的传递， 一般需经过热传导和热对 流两个过程。 首先， LED 芯片产生的热量以热传导的方式， 通过金线、 电路板、 基板 （譬 如铝基、 陶瓷基等）、 导热胶 （譬如垫） 等， 传导至散热器， 散热器裸露在空气中， 通过空 气的对流发生热交换， 将热量散发。
[0005] 从上面的描述不难看出， 散热器是大功率 LED 与空气进行热交换的最终界面， 散热 器的热交换效率将直接影响 LED产品的性能。
[0006] 现有技术中， 散热器与空气的热交换包括主动式交换与被动式交换两种方式： 主动式交换主要是通过风扇等设备， 加速散热器周围空气流动速度， 进而提高热交换速率， 譬如常用的 CPU、 内存条的散热。 主动式交换的优点是效率高， 缺点是需风扇等设备， 而 且电能消耗大， 噪声也大；
被动式交换主要是依靠散热器自身材料和结构， 使得空气的流速与散热器表面的热交换达到 最佳。
[0007] 现有技术的散热器的生产工艺主要包括铝挤型散热器、 C 型扣片散热器、 剥片散热 片以及冷挤压散热器。 其中， 被广泛使用的是铝挤压型散热器。 上述四种类型的散热器的共 同缺点就是忽略了空气流动的重要性。
[0008] 请参阅图 1， 图 1 为现有技术的散热器的典型代表， 散热器基座 1Γ上延伸出散热片 12', 各个散热片 12'之间的顶部为空隙， 底部是基座， 相当于散热片 12'之间为半开口形状， 根据空气动力学原理， 根据图中箭头所示， 由于冷、 热空气形成的压力差， 使得散热器底部 的空气向上流动， 但是此时冷空气若不能及时补充到热源附近， 不能形成空气对流， 使得散 热片 12'顶部温度低， 而散热片 12'底部温度高， 则会形成 "热岛效应"， 导致散热效果较 差， 进而导致 LED芯片温度升高， 影响 LED的使用寿命， 降低了 LED的出光率。
[0009] 综上， 如何提高 LED散热器的散热效果， 延长 LED的使用寿命， 提高 LED的出光 率， 是 LED技术领域研究的方向之一。
发明内容
[0010] 本发明实施例的目的在于提供一种 LED散热器， 旨在提高 LED散热器的散热效果， 延长 LED的使用寿命， 提高 LED的出光率。
[0011] 本发明实施例是这样实现的， 一种 LED 散热器， 其特征在于， 包括基座， 所述基座 上设置有 LED, 还设置有对应于所述 LED、 用于将所述 LED 产生的热量进行散发的散热 片， 其中， 相邻 LED 对应的散热片相互形成一通透的间隙， 所述散热片在散发热量时， 所 述间隙内的冷空气与所述散热片周围的热空气形成对流， 所述冷空气带走所述散热片的热
[0012] 作为本发明一优选实施例， 所述散热片与所述 LED相互间隔设置。
[0013] 作为本发明一优选实施例， 所述散热片的水平面平行于所述基座的水平面， 且所述 散热片的两端均延伸出所述基座。
[0014] 作为本发明一优选实施例， 相邻 LED对应的散热片相互平行设置。
[0015] 作为本发明一优选实施例， 与所述 LED 对应的散热片包括两片散热片， 且该两片散 热片相互交叉穿过。 更近一步地， 所述两片散热片之截面可以为 "X"型。
[0016] 作为本发明一优选实施例， 与所述 LED对应的散热片为至少一片直条状的散热片。
[0017] 作为本发明一优选实施例， 所述散热片和所述基座的材料均为工业用纯铝。
[0018] 作为本发明一优选实施例， 所述散热片和所述基座的表面均涂层为黑色。
[0019] 作为本发明一优选实施例， 所述散热片和所述基座的表面均采用纳米漆喷涂而成。
[0020] 本发明实施例提供的 LED散热器， 每组 LED对应于一组散热片， 其中， 相邻 LED 对应的散热片相互形成一通透的间隙， 所述散热片在散发热量时， 所述间隙内的空气形成对 流， 进而带走散热片的热量， 有效地避免了 "热岛效应"， 提高了 LED散热器的散热效果， 延长了 LED的使用寿命， 还提高了 LED的出光率， 利于 LED的推广普及。
附图说明
[0021] 图 1是现有技术中的散热器的示意图；
图 2A-图 2C是本发明实施例提供的散热器实施例之一的结构图； 图 3A-3B是本发明实施例提供的散热器实施例之一的结构图；
图 4A-4B是本发明实施例提供的散热器实施例之一的结构图。
具体实施方式
[0022] 为了使本发明的目的、 技术方案及优点更加清楚明白， 以下结合附图及实施例， 对 本发明进行进一步详细说明。 应当理解， 此处所描述的具体实施例仅仅用以解释本发明， 并 不用于限定本发明。
[0023] 图 2示出了本发明提供的 LED散热器的实施例示意图。
[0024] 本发明提供的 LED散热器包括基座 11， 基座 11上设置散热片 12和 LED13, 每组散 热片 12均一一对应一组 LED13, 散热片 12用于将 LED13产生的热量进行散发。
[0025] 本发明实施例中， 相邻 LED13对应的散热片 12相互形成一通透的间隙 21， 在被动 式散热下， 散热片 12在散发热量时， 所述间隙 21 内的冷空气与散热片 12周围的热空气形 成对流， 冷空气进而带走散热片 12的热量。
[0026] 请参阅图 2， 其中， 图 2A为总体效果图， 图 2B为前视图， 图 2C为后视图。 在图 2 所示的结构中， LED13和散热片 12相互间隔设置， 散热片 12的水平面 D1平行于基座 11 的水平面 D2， 且散热片 12的两端均延伸出所述基座 11， 即所述散热片 12的两端均与所述 基座 11呈一定角度。 图 1所示的结构保证了相邻 LED13对应的散热片 12之间相互形成一 通透的间隙 21， 使得冷空气可以在间隙 21畅通无阻的流通。 在具体实施过程中， 还可以是 其他的结构， 只要能够使得相邻 LED13对应的散热片 12相互形成一通透的间隙 21、 且使 得冷空气可以在间隙 21 畅通无阻的流通即可， 均在本发明实施例保护范围之内， 譬如图 3 至图 4所示的结构。
[0027] 其中， 图 3A俯视图， 在图 3A 中， LED13 对应的散热片 12 为一直条状的散热片 12， 图 3B为对应图 3A的侧视图， 图 4A和图 4B类似。
[0028] 在本发明实施例中， 相邻 LED13对应的散热片 12可相互平行设置， 以保证冷空气可 以在间隙 21畅通无阻的流通。
[0029] 在本发明实施例中， 与所述 LED13对应的散热片为至少一片直条状的散热片 12， 以 保证相邻 LED13对应的散热片 12可形成间隙 21 (请参阅图 3和图 4)。 在具体实施过程 中， 与所述 LED13对应的散热片可根据实际情况设置两片或者更多片散热片 12 (图 2)， 只 要能够使得相邻 LED13对应的散热片 12相互形成一通透的间隙 21、 且使得冷空气可以在 间隙 21畅通无阻的流通即可， 均在本发明实施例保护范围之内， 此处不再一一详述。
[0030] 在图 2所示的实施例中， 相邻的 LED13之间设置两片散热片 12， 且该两片散热片 12 相互交叉穿过， 呈 "X"形， 该 "X"形状的散热片 12 的优点是表面积较大， 散热优势明 显。 当然， 该 "X"形状散热片 12仍需保证构成间隙 21 的散热片 12相互平行设置， 进而 保障冷空气可以在间隙 21畅通无阻的流通。
[0031] 作为本发明一优选的实施例， 散热片 12和基座 11的材料为工业用纯铝， 且使用的工 业用纯铝采用冷挤压铝的生产工艺生产， 工业用纯铝的热导系数高， 利于散热。
[0032] 作为本发明一优选的实施例， 散热片 12和基座 11的表面涂层为黑色， 可增加散热片 12和基座 11的辐射散热功能， 利于散热。
[0033] 作为本发明一优选的实施例， 散热片 12和基座 11的表面采用纳米漆喷涂而成， 纳米 漆可以通过表面的微结构实现面积的最大化， 利于散热。
[0034] 本发明实施例的工作原理为：
请参阅图 2， LED13工作产生的热量， 先通过 "X"形的散热片 12导向散热片 12间的间隙 21。 在间隙 21 内， 散热片 13在与通过间隙 21的冷空气进行热交换的过程中， 通过间隙 21 的冷空气与散热片 13周围的热空气形成对流。 在被动式散热情况下， 通过间隙 21的冷空气 迅速的补充上升的热空气， 形成比较高的空气流速场， 持续不断的冷空气进而带走热量， 进 而使得散热片 13充分的与冷空气进行热交换。
[0035] 而且， 在图 2所示的结构中， 每一组 LED13的四周都是通透的间隙 21， 而每一个通 透的间隙 21 的四周都是 LED13, 这样形成了均匀分布的流速场和通风量， 使得空气的上下 流动加快， 很好的消除了散热片 12周围的 "热岛效应"， 实现了被动式散热的最优。
[0036] 本发明实施例提供的 LED散热器， 每组 LED对应于一组散热片， 其中， 相邻 LED 对应的散热片相互形成一通透的间隙， 所述散热片在散发热量时， 所述间隙内的空气形成对 流， 进而带走散热片的热量， 有效地避免了 "热岛效应"， 提高了 LED散热器的散热效果， 延长了 LED的使用寿命， 还提高了 LED的出光率， 利于 LED的推广普及。
[0037] 以上所述仅为本发明的较佳实施例而已， 并不用以限制本发明， 凡在本发明的精神 和原则之内所作的任何修改、 等同替换和改进等， 均应包含在本发明的保护范围之内。

Claims

权 利 要 求 书
1. 一种 LED散热器， 其特征在于， 包括基座， 所述基座上设置有 LED, 还设置有对应于所 述 LED、 且用于将所述 LED产生的热量进行散发的散热片， 其中， 相邻 LED对应的散热片 相互形成一通透的间隙， 所述散热片在散发热量时， 所述间隙内的冷空气与所述散热片周围 的热空气形成对流， 所述冷空气带走所述散热片的热量。
2. 如权利要求 1 所述的 LED 散热器， 其特征在于， 所述散热片与所述 LED 相互间隔设 置。
3. 如权利要求 1所述的 LED散热器， 其特征在于， 所述散热片的水平面平行于所述基座的 水平面， 且所述散热片的两端均延伸出所述基座。
4. 如权利要求 1所述的 LED散热器， 其特征在于， 相邻 LED对应的散热片相互平行设置。
5. 如权利要求 1所述的 LED散热器， 其特征在于， 与所述 LED对应的散热片包括两片散热 片， 且该两片散热片相互交叉穿过。
6. 如权利要求 5所述的 LED散热器， 其特征在于， 所述两片散热片之截面构成 "X"型。
7. 如权利要求 1所述的 LED散热器， 其特征在于， 与所述 LED对应的散热片为至少一片直 条状的散热片。
8. 如权利要求 1所述的 LED散热器， 其特征在于， 所述散热片和所述基座的材料均为工业 用纯铝。
9. 如权利要求 1所述的 LED散热器， 其特征在于， 所述散热片和所述基座的表面均涂层为 黑色。
10. 如权利要求 1 所述的 LED 散热器， 其特征在于， 所述散热片和所述基座的表面均采用 纳米漆喷涂而成。
PCT/CN2011/001785 2011-04-03 2011-10-25 一种led散热器 WO2012135988A1 (zh)

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CN103453501B (zh) * 2013-09-22 2016-02-10 陈云芽 一种led散热器
CN104696925A (zh) * 2013-12-06 2015-06-10 苏州浩华光电科技有限公司 Led散热模组
CN107023879A (zh) * 2017-04-28 2017-08-08 宁波和乐科斯国际贸易有限公司 一种取暖器

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