WO2011134121A1 - 一种led光源模组 - Google Patents

一种led光源模组 Download PDF

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Publication number
WO2011134121A1
WO2011134121A1 PCT/CN2010/000820 CN2010000820W WO2011134121A1 WO 2011134121 A1 WO2011134121 A1 WO 2011134121A1 CN 2010000820 W CN2010000820 W CN 2010000820W WO 2011134121 A1 WO2011134121 A1 WO 2011134121A1
Authority
WO
WIPO (PCT)
Prior art keywords
fins
light source
led
led matrix
source module
Prior art date
Application number
PCT/CN2010/000820
Other languages
English (en)
French (fr)
Inventor
李文雄
Original Assignee
Li Wenxiong
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Li Wenxiong filed Critical Li Wenxiong
Publication of WO2011134121A1 publication Critical patent/WO2011134121A1/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the utility model relates to the technical field of illumination, in particular to an LED light source module.
  • LED As an energy-saving light source, LED is widely used for lighting.
  • LED The fundamental difference between LED and traditional light source is:
  • Traditional light source belongs to the light-emitting process and needs to gather heat as much as possible (for example, when the weather is cold, the start-up is slower than the hot weather. After the start-up, the brightness of the lamp is also hotter than the heat.
  • the LED is a kind of semiconductor lighting technology, the main cause of the failure of the lighting function is overheating damage, so the LED light source must dissipate heat as quickly as possible.
  • LED light source has good development prospects because of its energy-saving type.
  • the light source structure of LED is a large number of die-cast aluminum alloy heat sinks and high-purity aluminum alloy extrusion heat sinks, which have low heat dissipation efficiency and can only meet the heat dissipation requirements of some high-power LED light sources by increasing the amount of metal.
  • the die-cast aluminum alloy radiator and the high-purity aluminum alloy extrusion heat sink used have an aluminum weight of more than 1 OKg, which is 2 to 3 times that of the conventional lamp, and the cost is high, which is not conducive to popularization.
  • the object of the present invention is to provide an LED light source module, which has relatively light weight and low cost under the premise of good heat dissipation. Easy to use.
  • An LM) light source module comprising at least one LED matrix board, or an LED matrix board combined with a driving power of an LED matrix, wherein a surface of the LED matrix board is provided with a heat dissipating component, which comprises a base block connected to the LED matrix board, A plurality of fins are arranged side by side on the base block, and at least one heat dissipation hole extending in a direction in which the plurality of fins are arranged is further disposed between the plurality of fins and the base block.
  • the fins may be flat plates or tiled plates, or zigzag plates.
  • the thickness of the fin is 0. 2-2. 0mm.
  • the plurality of fins and the base block are integrally formed.
  • the weight is relatively light, the cost is low, and it is easy to use and promote.
  • FIG. 1 is a schematic structural view of an LED light source module according to the present invention.
  • Figure 2 is a view taken along line A of Figure 1;
  • FIG. 3 is a schematic structural view of another LED light source module of the present invention.
  • the LED light source module of the present invention includes multiple An LED matrix board 1 composed of LED units, and a power connector (not shown) connected to the LED matrix board 1.
  • a heat dissipation made of aluminum is mounted on the upper surface thereof.
  • the base block 2 is connected to the LED matrix board 1.
  • a plurality of fins 3 are arranged side by side along the longitudinal direction thereof (the X direction in the drawing), which are parallel to each other, and the fins 3 are 5 ⁇ The flat aluminum, the thickness of 0. 6mm.
  • the plurality of fins 3 and the base block 2 are integrally molded by using aluminum material.
  • the inventors of the present invention arrange the fins 3 and the base block 2 in the direction along which the plurality of fins 3 are arranged. (X direction in the drawing)
  • a plurality of through holes 4 are provided, and the through holes 4 are connected to the ends of the plurality of fins 3 in the longitudinal direction of the block 2.
  • the through hole 4 serves as a heat dissipating gas guiding hole, which intersects the fin 3 to form a heat dissipating passage, which greatly increases the heat dissipating area, enhances the heat dissipating effect, and reduces the weight of the heat dissipating.
  • the above fins may also be in the shape of a corrugated board, which may further increase the heat dissipating area, and may also be a zigzag type plate structure; of course, according to the actual situation, the thickness of the fin of the present invention may be 0. 2-2. Select within 0 leg range.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)

Description

—种 LED光源模组 技术领域
本实用新型涉及照明技术领域， 具体涉及一种 LED光源模组。 技术背景
LED作为节省能源的光源， 正广泛应于照明。
LED与传统光源根本的区别是： 传统光源属于发光过程需要尽量 聚热（例如， 日光灯在天气冷的时候， 启动比天气热时慢， 启动后由 于灯管不够热， 开始阶段亮度也比热的时候暗）； 而 LED作为一种半 导体照明技术， 其照明功能失效的主要原因是过热损伤， 因此 LED光 源必需尽量尽快地散热。
以道路照明常用 400W高压钠灯为例， 与其达到相同的照明效果 则只需要 160W的 LED光源， 所以， LED光源以其节能型， 决定了其 具有良好的发展前景。
目前 LED 的光源结构是大量地应用压铸铝合金散热器和高纯度 铝合金挤压成型散热器， 其散热效率低， 只能用加大金属用量来满足 一些大功率的 LED光源的散热要求， 目前应用的压铸铝合金散热器和 高纯度铝合金挤压成型散热器使用铝重量达 l OKg以上， 是传统灯具 的 2- 3倍， 成本较高， 不利于推广使用。
发明内容
针对现有技术的不足，本实用新型的目的旨在于提供一种 LED光 源模组， 在具备良好散热性的前提下， 其重量相对较轻， 成本较低， 便于使用。
为实现上述目的， 本实用新型采用如下技术方案:
一种 LM)光源模组， 其至少包括一 LED矩阵板， 或者 LED矩阵板 结合 LED矩阵的驱动电源，所述 LED矩阵板上表面设置有一散热组件， 其包括与 LED矩阵板连接的基块， 位于所述基块上并排的多个翅片， 所述多个翅片与基块之间还设置有沿多个翅片排列方向延伸的至少 一个散热孔。
所述翅片可以为平板或瓦榜板、 或锯齿型板。
所述翅片厚度为 0. 2-2. 0mm。
所述多个翅片与所述基块为一体成型结构。
本实用新型所阐述的 LED光源模组， 其有益效果在于：
1、 增加散热气体导流孔， 并与翅片交叉， 提高了散热性能；
2、 重量相对较轻， 成本较低， 便于使用推广。
附图说明
图 1为本实用新型一种 LED光源模组的结构示意图；
图 2为图 1的 A向视图；
图 3为本实用新型另一种 LED光源模组的结构示意图。
'具体实施方式
下面， 结合附图以及具体实施方式，对本实用新型的 LED光源模 组做进一步说明，以便于更清楚的理解本实用新型的所要求保护的技 术思想。
如图 1所示， 为本实用新型的一种 LED光源模组， 其包括由多个 LED单元组成的 LED矩阵板 1 , 以及连接于 LED矩阵板 1上的电源接 头（图未示），在 LED矩阵板 1的背光面上， 也就是其上表面安装有一 由铝材制成的散热器， 其包括连接在 LED矩阵板 1上的基块 2, 在基 块 2上部， 沿其长度方向 （图示中的 X向）并排有多个翅片 3， 其互 相平行， 翅片 3为平板铝材， 其厚度为 0. 6mm。
上述多个翅片 3与基块 2是采用铝材一体铸造成型，为了具有更 好的散热效果， 本发明人在翅片 3和基块 2连接的部分， 沿多个翅片 3排列的方向 （图示中的 X向）设置有多个通孔 4， 通孔 4导通多个 翅片 3以 ^块 2长度方向的两端。
通孔 4作为散热气体导流孔， 其与翅片 3交叉， 形成散热通道， 大大增加了散热面积， 增强了散热效果， 同时降低了散热其的重量。
如图 3所示， 以上翅片还可以是瓦楞板状， 其可以进一步增大了 散热面积， 其也可以是锯齿型板结构； 当然根据实际情况， 本实用新 型翅片的厚度可以在 0. 2-2. 0腿范围内选择。
对于本领域的技术人员来说， 可根据以上描述的技术方案以及构思， 做出其它各种相应的改变以及变形，而所有的这些改变以及变形都应 该属于本发明权利要求的保护范围之内。

Claims

权 利 要 求 书
1、 一种 LED光源模组， 其至少包括一 LED矩阵板， 或者 LED矩阵板 结合 LED矩阵的驱动电源， 其特征在于， 所述 LED矩阵板上表面设置 有一散热組件，其包括与 LED矩阵板连接的基块，位于所述基块上并 排的多个翅片，所述多个翅片与基块之间还设置有沿多个翅片排列方 向延伸的至少一个散热孔。
2、 如权利要求 1所述的 LED光源模组， 其特征在于， 所述翅片可以 为平板或瓦楞板、 或锯齿型板。
3、 如权利要求 2所述的 LED光源模块， 其特征在于， 所述翅片厚度 为 0. 2-2. Omm。
4、 如权利要求 1所述的 LED光源模组， 其特征在于， 所述多个翅片 与所述基块为一体成型结构。
PCT/CN2010/000820 2010-04-30 2010-06-10 一种led光源模组 WO2011134121A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201020187196.7 2010-04-30
CN 201020187196 CN201672306U (zh) 2010-04-30 2010-04-30 一种led光源模组

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WO2011134121A1 true WO2011134121A1 (zh) 2011-11-03

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019018867A1 (de) * 2017-07-28 2019-01-31 Zkw Group Gmbh Kühlkörper und fahrzeugscheinwerfer

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103256491A (zh) * 2012-02-21 2013-08-21 黄子晋 Led长寿节能灯
CN104930465A (zh) * 2014-03-21 2015-09-23 深圳市海洋王照明工程有限公司 隔爆型巷道灯壳及灯具
CN107461637A (zh) * 2017-08-14 2017-12-12 广东聚科照明股份有限公司 一种散热性良好的灯条
CN113382613B (zh) * 2021-06-25 2022-10-25 深圳安科高技术股份有限公司 一种探测器模块组件和探测器

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2671125Y (zh) * 2003-07-02 2005-01-12 汎振股份有限公司 散热器结构
CN201137902Y (zh) * 2007-12-20 2008-10-22 宁波安迪光电科技有限公司 Led灯光源模组

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2671125Y (zh) * 2003-07-02 2005-01-12 汎振股份有限公司 散热器结构
CN201137902Y (zh) * 2007-12-20 2008-10-22 宁波安迪光电科技有限公司 Led灯光源模组

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019018867A1 (de) * 2017-07-28 2019-01-31 Zkw Group Gmbh Kühlkörper und fahrzeugscheinwerfer
US11085606B2 (en) 2017-07-28 2021-08-10 Zkw Group Gmbh Heat sink and vehicle headlight

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