WO2012122739A1 - 背光模组及其液晶显示器 - Google Patents

背光模组及其液晶显示器 Download PDF

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Publication number
WO2012122739A1
WO2012122739A1 PCT/CN2011/074321 CN2011074321W WO2012122739A1 WO 2012122739 A1 WO2012122739 A1 WO 2012122739A1 CN 2011074321 W CN2011074321 W CN 2011074321W WO 2012122739 A1 WO2012122739 A1 WO 2012122739A1
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WO
WIPO (PCT)
Prior art keywords
backlight module
hole
pcb board
elastic
light guide
Prior art date
Application number
PCT/CN2011/074321
Other languages
English (en)
French (fr)
Inventor
唐国富
Original Assignee
深圳市华星光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US13/145,523 priority Critical patent/US8520162B2/en
Application filed by 深圳市华星光电技术有限公司 filed Critical 深圳市华星光电技术有限公司
Publication of WO2012122739A1 publication Critical patent/WO2012122739A1/zh

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0086—Positioning aspects
    • G02B6/0088—Positioning aspects of the light guide or other optical sheets in the package
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0086—Positioning aspects
    • G02B6/009—Positioning aspects of the light source in the package
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133612—Electrical details
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/46—Fixing elements
    • G02F2201/465—Snap -fit

Definitions

  • the present invention relates to a backlight module and a liquid crystal display thereof, and more particularly to an edge-lit backlight module and a liquid crystal display including the edge-lit backlight module.
  • the existing backlight module usually includes a light guide plate, a back plate, and a PCB board (PrintedCircuitBoard, Printed circuit board) and multiple LEDs fixed on the PCB (Light Emitting Diode, LED).
  • the fixing method of the printed circuit board generally has the following two types: a, the thermal conductive tape is adhered between the PCB board and the back board; b, and the PCB board and the back board are locked by screws.
  • the advantage of the a mode is that the thermal conductive tape can fill the gap between the two interfaces, but the thermal tape has high cost.
  • the b method can achieve close contact between the two interfaces, and the cost is lower than that of the thermal conductive tape.
  • the PCB board is generally narrow, the screws used are relatively small, which makes the locking operation difficult.
  • the light guide plate often only positions the left and right ends through the back plate to ensure the distance between the light guide plate and the LED surface.
  • the guide is located at the center of the module.
  • the light plate has the largest amount of expansion, so that the light-incident surface of the light guide plate directly opposes the surface of the LED. Since the surface temperature of the LED is extremely high, the light guide plate is easily melted.
  • the backlight module of the prior art has technical problems of difficulty in assembly, high cost, and easy melting of the light guide plate.
  • the main object of the present invention is to provide a backlight module that is easy to assemble, low in cost, and can prevent the light guide plate from being melted by the LED.
  • the present invention also provides a liquid crystal display including the above backlight module.
  • a backlight module includes a back plate, a light guide plate, a PCB board and a plurality of LEDs, the back plate includes a bottom plate and at least one sidewall, the light guide plate is located on the bottom plate, the PCB The plurality of LEDs are disposed on the sidewall of the backplane, and the plurality of LEDs are disposed on the PCB.
  • the backlight module further includes at least one elastic fastener, and the at least one elastic fastener passes through the The backplane and the PCB board fix the backplane to the PCB board, and the top of the elastic fastener is raised above the LED surface.
  • the sidewall of the backboard is provided with at least one first through hole
  • the PCB board is provided with at least one second through hole corresponding to the first through hole
  • the elastic card fastener passes through The first through hole and the second through hole fix the back plate and the PCB board.
  • the elastic card fastener comprises a chassis, a buckle and a long rod connecting the chassis and the buckle, the chassis is located at one side of the side wall of the backboard, and the long pole is located at the first through hole and the PCB board In the second through hole, the buckle is located on one side of the PCB.
  • the light guide plate comprises a light incident surface
  • the buckle comprises a top portion
  • the surface of the top portion is higher than the surface of the LED, and is a plane parallel to the light incident surface of the light guide plate.
  • the buckle further comprises at least one elastic wedge-shaped protrusion, a first end of the at least one elastic wedge-shaped protrusion is connected to the top, and a second end is a freely bendable free end.
  • the number of the above-mentioned elastic wedge-shaped protrusions is two and is symmetrical about the top.
  • the outer side surface of the elastic wedge-shaped protrusion is a sloped surface, and the inclined surface forms an acute angle with the long rod, and a gap is formed between the inner side surface of the elastic wedge-shaped protrusion and the long rod, and the gap is Used to provide a bending space for the elastic wedge protrusions.
  • the second end of the elastic wedge protrusion extends to form a bump that is inserted into the second through hole of the PCB board.
  • the long rod includes a first portion and a second portion having unequal diameters, the diameter of the first portion being equal to the diameter of the first through hole and the second through hole, and the diameter of the second portion being smaller than the first portion diameter of.
  • the outer side surface of the elastic wedge protrusion is a plane parallel to the long rod, and the distance between the outer side surfaces of the two bent elastic wedge protrusions It is equal to the diameter of the first through hole and the second through hole.
  • the distance between the outer sides of the bumps of the two elastic wedge-shaped protrusions is larger than the diameter of the second through hole of the PCB board.
  • the elastic card fastener is spaced apart from every two of the LEDs.
  • the bottom plate of the backboard is provided with a protrusion supporting the light guide plate for positioning the light guide plate at a height opposite to the LED.
  • a heat sink is disposed between the PCB board and the back board, and the elastic card fastener sequentially passes through the back board, the heat sink and the PCB board to fix the PCB board and the back board.
  • the bottom plate of the backboard is a flat plate, and a protrusion on the bottom of the heat sink is provided with a protrusion for supporting the light guide plate so that the light guide plate is located at a height opposite to the LED.
  • a liquid crystal display comprising a liquid crystal display panel and a backlight module
  • the backlight module comprising a back plate, a light guide plate, a PCB board and a plurality of LEDs
  • the back plate comprising a bottom plate and at least one side a wall
  • the light guide plate is located on the bottom plate
  • the corresponding light guide plate is disposed on the sidewall of the back plate
  • the plurality of LEDs are disposed on the PCB
  • the backlight module is Further comprising at least one elastic card fastener, the at least one elastic card fastener sequentially passing the back plate and the PCB board to fix the back plate and the PCB board, and the top of the elastic card fastener is higher than the LED surface .
  • the sidewall of the backboard is provided with at least one first through hole
  • the PCB board is provided with at least one second through hole corresponding to the first through hole
  • the elastic card fastener passes through The first through hole and the second through hole fix the back plate and the PCB board.
  • the elastic card fastener comprises a chassis, a buckle and a long rod connecting the chassis and the buckle, the chassis is located at one side of the side wall of the backboard, and the long pole is located at the first through hole and the PCB board In the second through hole, the buckle is located on one side of the PCB.
  • the light guide plate comprises a light incident surface
  • the buckle comprises a top portion
  • the surface of the top portion is higher than the surface of the LED, and is a plane parallel to the light incident surface of the light guide plate.
  • the buckle further comprises at least one elastic wedge-shaped protrusion, a first end of the at least one elastic wedge-shaped protrusion is connected to the top, and a second end is a freely bendable free end.
  • a backlight module and a liquid crystal display thereof use an elastic card to clamp the PCB board and the back board, and at the same time, since the top of the elastic card is higher than the LED surface, when the light guide plate is When the thermal expansion or assembly tolerance is deformed, the light guide plate first contacts the top of the elastic fastener, and the top is pressed against the light guide plate to prevent the light guide plate from being melted by contact with the high temperature surface of the LED.
  • the backlight module of the present invention is simple to assemble and cost. Low and prevents the light guide from melting.
  • FIG. 1 is a cross-sectional enlarged view of a first embodiment of a backlight module of the present invention
  • FIG. 2 is a top plan view of the backlight module shown in FIG. 1;
  • FIG. 3 is a perspective enlarged view of the elastic card fastener in the first embodiment of the backlight module of the present invention
  • Figure 4 is a front elevational view of the elastic fastener of Figure 3;
  • Figure 5 is a cross-sectional enlarged view of a second embodiment of the backlight module of the present invention.
  • FIG. 6 is a perspective enlarged view of a resilient card fastener in a second embodiment of the backlight module of the present invention.
  • Figure 7 is a front elevational view of the elastic fastener shown in Figure 6;
  • Figure 8 is a cross-sectional enlarged view of a third embodiment of the backlight module of the present invention.
  • FIG. 9 is a front elevational view showing the elastic fastener in the third embodiment of the backlight module of the present invention.
  • Figure 10 is a front elevational view showing the elastic fastener in the fourth embodiment of the backlight module of the present invention.
  • a backlight module includes: a light guide plate 40, a PCB board 30, a back board 20, a plurality of LEDs 50, and at least one elastic card holder 10, wherein the back board 20 includes a bottom plate 201 and a side wall 202.
  • the light guide plate 40 is located on the bottom plate 201.
  • the light guide plate 40 includes a light incident surface 401, a bottom surface (not labeled), and a light exit surface (not labeled) opposite to the bottom surface.
  • the PCB board 30 is located on the inner surface of the side wall 202 of the back board 20, opposite to the light incident surface 401 of the light guide plate 40.
  • the plurality of LEDs 50 are disposed on the PCB board 30 opposite to the light incident surface 401 of the light guide plate 40.
  • a protrusion 2011 supporting the light guide plate 40 is disposed on the bottom plate 201 of the back plate 20 such that the light guide plate 40 is located at a height opposite to the LED 50.
  • the elastic fastener 10 is spaced apart from each of the two LEDs 50, and the material thereof may be a plastic material or a metal material.
  • a plurality of first through holes are disposed on the sidewall 202 of the backboard 20, and the PCB board 30 is provided with a plurality of second through holes (not labeled) corresponding to the first through holes; the elastic fastener 10
  • the back plate 10 and the PCB board 30 are fixed by sequentially passing through the first through holes of the back board 10 and the second through holes of the PCB board 30.
  • the first through hole and the second through hole are circular through holes having the same radius.
  • the elastic fastener 10 of the first embodiment includes a chassis 101 , a buckle 103 , and a long rod 102 connecting the chassis 101 and the buckle 103 .
  • the chassis 101 is located on the outer surface of the side wall 202 of the backboard 20; the long rod 102 is located in the first through hole of the side wall 202 and the second through hole of the PCB board 30; the buckle 103 is located on the surface of the PCB board 30.
  • the long rod 102 is a cylinder having a smaller radius than the first through hole and the second through hole.
  • the buckle 103 includes a top portion 1033 and two resilient wedge-shaped protrusions 1032.
  • the top portion 1033 is substantially in the shape of a disk, and the surface (not labeled) is higher than the surface of the LED 50, and is a plane parallel to the light incident surface 401 of the light guide plate 40, so as to resist the light guide plate 40 when the light guide plate expands, without damaging. It enters the light surface 401.
  • the two elastic wedge-shaped protrusions 1032 are symmetrical about the top portion 1033.
  • the first end 121 of the elastic wedge-shaped protrusion 1032 is connected to the top portion 1033, and the second end 122 is a freely bendable free end.
  • the outer surface 123 of the elastic wedge-shaped protrusion 1032 is a sloped surface, and the inclined surface forms an acute angle ⁇ with the long rod 102.
  • the inner surface 124 of the elastic wedge-shaped protrusion 1032 has a gap 1034 between the long rod 102 and the long rod 102.
  • the gap 1034 is used to provide an elastically bendable space for the elastic wedge protrusions 1032 so that the elastic wedge protrusions 1032 pass through the first through holes and the second through holes.
  • the outer side surface 123 of the elastic wedge-shaped protrusion 1032 is substantially parallel to the plane of the long rod 102. At this time, the outer side surface 123 of the two bent elastic wedge-shaped protrusions 1032 The distance between them is substantially equal to the diameters of the first through hole and the second through hole described above.
  • the backlight module of the present invention clamps the PCB board 30 and the back board 20 by the elastic fastener 10, and at the same time, since the top 1033 of the elastic fastener 10 is higher than the surface of the LED 50, when the light guide plate 40 is thermally expanded or assembled When the tolerance or the like is deformed, the light guide plate 40 first contacts the top portion 1033 of the elastic fastener 10, and the top portion 1033 is pressed against the light guide plate 40, so that the light guide plate 40 can be prevented from being melted by contacting the high temperature surface of the LED 50, and the backlight module of the present invention is assembled. It is simple, low in cost and can prevent the light guide plate 40 from melting.
  • the backlight module of the second embodiment of the present invention is similar to the first embodiment described above, except that the elastic fasteners 210 have different structures.
  • the elastic fastener 210 of the present embodiment is similar to the elastic fastener 10 of the first embodiment, except that the second end 222 of the elastic wedge protrusion 2032 is extended to form a protrusion 2031, and two of the two elastic wedge protrusions 2032.
  • the distance between the outer sides of the bumps 2031 is slightly larger than the diameter of the second through holes (not labeled) of the PCB board 230, so that the bumps 2031 are caught inside the second through holes (not labeled) for better positioning. .
  • the backlight module of the third embodiment of the present invention is similar to the backlight module of the first embodiment, and the difference is that the backlight module further has a heat sink disposed between the PCB board 330 and the back board 320 . 360.
  • the elastic card fastener 310 sequentially passes through the back plate 320, the heat sink 360, and the PCB board 330 to fix the PCB board 330 and the back board 320.
  • the bottom plate of the back plate 320 is a flat plate, and a protrusion supporting the light guide plate 340 is disposed at a corresponding position on the bottom of the heat sink 360 such that the light guide plate 340 is located at a height opposite to the LED.
  • the elastic fastener 310 of the backlight module of the third embodiment of the present invention is similar to the elastic fastener 210 of the second embodiment, except that the long rod 3102 includes a first portion 311 having unequal diameters. And a second portion 312, the first portion 311 is located in the first through hole of the sidewall (not labeled) of the back plate 320 and the second through hole (not labeled) of the PCB board 330, and the diameter of the first portion 311 is substantially equal to the first pass The diameter of the hole and the diameter of the second through hole are such that the elastic card fastener securely fixes the back plate 320 and the PCB board 330.
  • the second portion 312 is located on one side of the PCB board 330, and the diameter of the second portion 312 is smaller than the diameter of the first portion 311 so as to form a resilient wedge-shaped protrusion 3032 between the second portion 312 and the inner side surface 324 of the elastic wedge-shaped protrusion 3032. Folded gap 3034.
  • the elastic fastener 410 of the backlight module of the fourth embodiment of the present invention is similar to the elastic fastener 10 of the first embodiment, except that the long rod 4102 includes a first portion 411 having unequal diameters. And a second portion 412, the first portion 411 is located in a first through hole (not shown) of the sidewall of the backplane (not shown) and a second through hole (not shown) of the PCB board (not shown).
  • the diameter of the first portion 411 is substantially equal to the diameter of the first through hole and the diameter of the second through hole, so that the elastic fastener 410 securely fixes the back plate and the PCB board.
  • the second portion 412 is located on one side of the PCB board, and the second portion 412 has a smaller diameter than the first portion 411 so as to form a resilient wedge-shaped protrusion 4032 between the second portion 412 and the inner side surface 424 of the resilient wedge-shaped protrusion 4032.
  • the gap is 4034.
  • the backlight module of the present invention is not limited to the above embodiments.
  • the elastic card firmware of each embodiment can be used in the backlight module of the third embodiment; in the above embodiments, the chassis 101 can be circular. As shown in FIG. 3, it is also possible to have squares, rectangles, polygons, and the like.
  • the number of the elastic wedge-shaped protrusions 1032, 2032, 3032, and 4032 may be one or three or more.
  • the long rod 102 of the elastic fastener 10 of the first embodiment may also be a rectangular parallelepiped or the like.
  • the first through hole of the side wall 202 of the back plate 20 and the second through hole of the PCB board 30 may also be rectangular or the like.
  • the present invention also provides a liquid crystal display, which includes a liquid crystal display panel and the backlight module in the above embodiments, and details are not described herein again.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Planar Illumination Modules (AREA)
  • Liquid Crystal (AREA)

Description

背光模组及其液晶显示器
技术领域
本发明涉及一种背光模组及其液晶显示器，尤其涉及一种侧光式背光模组以及包含有该侧光式背光模组的液晶显示器。
背景技术
现有的背光模组通常包括一导光板、一背板、一PCB板(PrintedCircuitBoard, 印刷电路板)和多个固定在PCB板上的LED（Light Emitting Diode，发光二极管）。印刷电路板的固定方式通常有如下两种：a、PCB板与背板之间贴导热胶带黏贴；b、PCB板与背板之间用螺丝锁附。其中，a方式的优点在于导热胶带可填充两界面间的空隙，但导热胶带成本高。b方式可达到两界面接触紧密，成本较导热胶带低，但由于PCB板一般较窄，采用的螺丝比较小，从而造成锁附作业困难。
另外，在已知的侧光式背光模组中，导光板往往只通过背板定位左右端部以确保导光板与LED表面的距离，当导光板受热膨胀后，位于模组中心位置处的导光板膨胀量最大，使得导光板入光面直接顶住LED表面，由于LED表面温度极高，容易将导光板熔化。
因此现有技术的背光模组存在组装困难、成本高且导光板易融化的技术问题。
发明内容
本发明的主要目的在于提供一种组装方便、成本低廉且可防止导光板被LED熔化的背光模组；本发明还提供一种包含有上述背光模组的液晶显示器。
一种背光模组，其包括一背板、一导光板、一PCB板以及多个LED，所述背板包括一底板和至少一侧壁，所述导光板位于所述底板上，所述PCB板对应导光板设置于背板的侧壁上，所述多个LED设置于所述PCB板上，所述背光模组进一步包括至少一弹性卡固件，上述至少一弹性卡固件依次穿过所述背板与所述PCB板将该背板与该PCB板固定，且所述弹性卡固件的顶部高出所述LED表面。
优选的，所述背板的侧壁上设有至少一第一通孔，所述PCB板上设有至少一对应所述第一通孔的第二通孔，所述弹性卡固件依次穿过所述第一通孔及第二通孔将所述背板与PCB板固定。
优选的，所述弹性卡固件包括一底盘、一卡扣以及一连接该底盘与卡扣的长杆，所述底盘位于背板侧壁的一侧，长杆位于上述第一通孔和PCB板的第二通孔中，卡扣位于PCB板的一侧。
优选的，所述导光板包括一入光面，所述卡扣包括一顶部，所述顶部的表面高出LED表面，为一与导光板入光面平行的平面。
优选的，所述卡扣进一步包括至少一弹性楔形突起，所述至少一弹性楔形突起的一第一端与顶部连接，一第二端为可弹性弯折的自由端。
优选的，上述弹性楔形突起的数量为两个，且关于顶部对称。
优选的，所述弹性楔形突起的外侧表面为一斜面，所述斜面与所述长杆之间形成一锐角，所述弹性楔形突起的内侧表面与所述长杆之间具有一间隙，上述间隙用于为弹性楔形突起提供弯折空间。
优选的，所述弹性楔形突起的第二端延伸形成有一卡入所述PCB板的第二通孔的凸块。
优选的，所述长杆包括直径不等的第一部分和第二部分，第一部分的直径等于所述第一通孔和第二通孔的直径，所述第二部分的直径小于所述第一部分的直径。
优选的，所述第二端弯折至最大限度的状态下，所述弹性楔形突起的外侧表面为一平行于所述长杆的平面，两弯折的弹性楔形突起的外侧表面之间的距离等于所述第一通孔和第二通孔的直径。
优选的，两所述弹性楔形突起的凸块的外侧之间的距离大于所述PCB板的第二通孔的直径。
优选的，所述弹性卡固件与每两个所述LED间隔设置。
优选的，所述背板的底板上设有支撑导光板的凸起，其用于使导光板位于与LED相对的高度。
优选的，所述PCB板与背板之间设置有一散热片，所述弹性卡固件依次穿过所述背板、散热片以及PCB板，将所述PCB板与所述背板固定。
优选的，所述背板的底板为平板，所述散热片的底部上相应的位置设有支撑导光板的突起，以使导光板位于与LED相对的高度。
一种液晶显示器，其包括一液晶显示面板及一背光模组，所述背光模组包括一背板、一导光板、一PCB板以及多个LED，所述背板包括一底板和至少一侧壁，所述导光板位于所述底板上，所述PCB板对应导光板设置于背板的侧壁上，所述多个LED设置于所述PCB板上，其特征在于，所述背光模组进一步包括至少一弹性卡固件，上述至少一弹性卡固件依次穿过所述背板与所述PCB板将该背板与该PCB板固定，且所述弹性卡固件的顶部高出所述LED表面。
优选的，所述背板的侧壁上设有至少一第一通孔，所述PCB板上设有至少一对应所述第一通孔的第二通孔，所述弹性卡固件依次穿过所述第一通孔及第二通孔将所述背板与PCB板固定。
优选的，所述弹性卡固件包括一底盘、一卡扣以及一连接该底盘与卡扣的长杆，所述底盘位于背板侧壁的一侧，长杆位于上述第一通孔和PCB板的第二通孔中，卡扣位于PCB板的一侧。
优选的，所述导光板包括一入光面，所述卡扣包括一顶部，所述顶部的表面高出LED表面，为一与导光板入光面平行的平面。
优选的，所述卡扣进一步包括至少一弹性楔形突起，所述至少一弹性楔形突起的一第一端与顶部连接，一第二端为可弹性弯折的自由端。
相较于现有技术，本发明提出的一种背光模组及其液晶显示器，采用弹性卡固件卡紧PCB板与背板，同时，由于弹性卡固件顶部高出LED表面，因此当导光板由于热膨胀或组装公差等原因变形时，导光板最先接触到弹性卡固件的顶部，由顶部抵住导光板，可避免导光板与LED高温表面接触而被熔化，本发明背光模组组装简单、成本低且可防止导光板熔化。
附图说明
图1是本发明背光模组第一实施例的剖视放大图；
图2是图1所示背光模组的俯视图；
图3是本发明背光模组的第一实施例中弹性卡固件的立体放大图；
图4是图3所示弹性卡固件的主视放大图；
图5是本发明背光模组第二实施例的剖视放大图；
图6是本发明背光模组的第二实施例中弹性卡固件的立体放大图；
图7是图6所示的弹性卡固件的主视放大图；
图8是本发明背光模组的第三实施例的剖视放大图；
图9是本发明背光模组的第三实施例中弹性卡固件的主视放大图；
图10是本发明背光模组的第四实施例中弹性卡固件的主视放大图。
本发明目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。
具体实施方式
如图1及图2所示，本发明一实施例的背光模组包括：一导光板40、一PCB板30、一背板20、多个LED50以及至少一弹性卡固件10，其中，背板20包括底板201和侧壁202，导光板40位于底板201上，导光板40包括一入光面401、一底面（未标号）以及一与底面相对的出光面(未标号)。PCB板30位于背板20的侧壁202的内表面，与导光板40的入光面401相对。
多个LED50设置于PCB板30上，与导光板40的入光面401相对。背板20的底板201上设有支撑导光板40的凸起2011，以使导光板40位于与LED50相对的高度。弹性卡固件10与每两个LED50间隔设置，其材料可为塑胶材料或金属材料。
背板20的侧壁202上设有多个第一通孔（未标号），PCB板30上设有多个位置对应于第一通孔的第二通孔（未标号）；弹性卡固件10依次穿过背板10的第一通孔与PCB板30的第二通孔，将背板10与PCB板30固定。上述第一通孔和第二通孔为半径相等的圆形通孔。
具体地，请一并参阅图3及图4，第一实施例的弹性卡固件10包括一底盘101、一卡扣103以及一连接底盘101与卡扣103的长杆102。底盘101位于背板20的侧壁202的外表面；长杆102位于侧壁202的第一通孔和PCB板30的第二通孔中；卡扣103位于PCB板30的表面。上述长杆102为一圆柱体，其半径小于上述第一通孔和第二通孔。
卡扣103包括一顶部1033和两个弹性楔形突起1032。上述顶部1033大致为一圆盘形状，其表面（未标号）高出LED50表面，为一与导光板40入光面401平行的平面，以在导光板膨胀时抵压导光板40，又不损坏其入光面401。上述两个弹性楔形突起1032关于顶部1033对称。上述弹性楔形突起1032的第一端121与顶部1033连接，第二端122为可弹性弯折的自由端。自然状态下，上述弹性楔形突起1032的外侧表面123为一斜面，上述斜面与长杆102之间形成一锐角α，上述弹性楔形突起1032的内侧表面124与长杆102之间具有一间隙1034，上述间隙1034用于为弹性楔形突起1032提供一可弹性弯折的空间，以便弹性楔形突起1032穿过上述第一通孔和第二通孔。
上述第二端122弯折至最大限度的状态下，上述弹性楔形突起1032的外侧表面123大致为一平行于长杆102的平面，此时，两个弯折的弹性楔形突起1032的外侧表面123之间的距离基本等于上述第一通孔和第二通孔的直径。
相较于现有技术，本发明背光模组通过弹性卡固件10卡紧PCB板30与背板20，同时，由于弹性卡固件10顶部1033高出LED50表面，因此当导光板40由于热膨胀或组装公差等原因变形时，导光板40最先接触到弹性卡固件10的顶部1033，由顶部1033抵住导光板40，可避免导光板40与LED50高温表面接触而被熔化，本发明背光模组组装简单、成本低且可防止导光板40熔化。
请一并参阅图5、图6及图7，本发明第二实施例的背光模组与上述第一实施例相似，其区别在于弹性卡固件210结构不同。本实施例的弹性卡固件210与第一实施例的弹性卡固件10相似，其区别之处在于：弹性楔形突起2032的第二端222延伸形成有一凸块2031，两个弹性楔形突起2032的两个凸块2031的外侧之间的距离略大于PCB板230的第二通孔（未标号）的直径，以便凸块2031卡入第二通孔（未标号）内部，起到更好的定位作用。
请参阅图8，本发明第三实施例的背光模组与第一实施例的背光模组相似，其区别之处在于：背光模组进一步在PCB板330与背板320之间设置有一散热片360。弹性卡固件310依次穿过背板320、散热片360以及PCB板330，将PCB板330与背板320固定。上述背板320的底板为平板，而在散热片360的底部上相应的位置设有支撑导光板340的突起，以使导光板340位于与LED相对的高度。
请参阅图9，本发明第三实施例的背光模组的弹性卡固件310与第二实施例的弹性卡固件210相似，其区别之处在于：长杆3102包括直径不等的一第一部分311和一第二部分312，第一部分311位于背板320侧壁（未标号）的第一通孔和PCB板330的第二通孔（未标号）中，第一部分311的直径基本等于第一通孔的直径和第二通孔的直径，以便弹性卡固件更稳固的固定背板320和PCB板330。第二部分312位于PCB板330的一侧，第二部分312的直径小于第一部分311的直径，以便在第二部分312和弹性楔形突起3032的内侧表面324之间形成一供弹性楔形突起3032弯折的间隙3034。
请参阅图10，本发明第四实施例的背光模组的弹性卡固件410与第一实施例的弹性卡固件10相似，其区别之处在于：长杆4102包括直径不等的一第一部分411和一第二部分412，第一部分411位于背板（图未示）侧壁的第一通孔（图未示）和PCB板（图未示）的第二通孔（图未示）中，第一部分411的直径基本等于的第一通孔的直径和第二通孔的直径，以便弹性卡固件410更稳固的固定背板和PCB板。第二部分412位于PCB板的一侧，第二部分412的直径小于第一部分411的直径，以便在第二部分412和弹性楔形突起4032的内侧表面424之间形成一供弹性楔形突起4032弯折的间隙4034。
本发明背光模组并不限于以上实施方式所述，例如：各个实施例的弹性卡固件都可用于第三实施例的背光模组中；在上述各实施例中，底盘101可以为圆形，如图3所示，还可以方形、矩形和多边形等。
在上述各实施例中，弹性楔形突起1032、2032、3032、4032的个数还可为一个或三个以上。第一实施例的弹性卡固件10的长杆102也可以为长方体等，相应的，背板20侧壁202的第一通孔和PCB板30的第二通孔也可以为矩形等。
进一步的，本发明还提出一种液晶显示器，该液晶显示器包括一液晶显示面板和上述各实施例中的背光模组，在此不再赘述。
以上所述仅为本发明的优选实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (20)

  1. 一种背光模组，其包括一背板、一导光板、一PCB板以及多个LED，所述背板包括一底板和至少一侧壁，所述导光板位于所述底板上，所述PCB板对应导光板设置于背板的侧壁上，所述多个LED设置于所述PCB板上，其特征在于，所述背光模组进一步包括至少一弹性卡固件，上述至少一弹性卡固件依次穿过所述背板与所述PCB板将该背板与该PCB板固定，且所述弹性卡固件的顶部高出所述LED表面。
  2. 根据权利要求1所述的背光模组，其特征在于，所述背板的侧壁上设有至少一第一通孔，所述PCB板上设有至少一对应所述第一通孔的第二通孔，所述弹性卡固件依次穿过所述第一通孔及第二通孔将所述背板与PCB板固定。
  3. 根据权利要求2所述的背光模组，其特征在于，所述弹性卡固件包括一底盘、一卡扣以及一连接该底盘与卡扣的长杆，所述底盘位于背板侧壁的一侧，长杆位于上述第一通孔和PCB板的第二通孔中，卡扣位于PCB板的一侧。
  4. 根据权利要求3所述的背光模组，其特征在于，所述导光板包括一入光面，所述卡扣包括一顶部，所述顶部的表面高出LED表面，为一与导光板入光面平行的平面。
  5. 根据权利要求4所述的背光模组，其特征在于，所述卡扣进一步包括至少一弹性楔形突起，所述至少一弹性楔形突起的一第一端与顶部连接，一第二端为可弹性弯折的自由端。
  6. 根据权利要求5所述的背光模组，其特征在于，上述弹性楔形突起的数量为两个，且关于顶部对称。
  7. 根据权利要求5所述的背光模组，其特征在于，所述弹性楔形突起的外侧表面为一斜面，所述斜面与所述长杆之间形成一锐角，所述弹性楔形突起的内侧表面与所述长杆之间具有一间隙，上述间隙用于为弹性楔形突起提供弯折空间。
  8. 根据权利要求5所述的背光模组，其特征在于，所述弹性楔形突起的第二端延伸形成有一卡入所述PCB板的第二通孔的凸块。
  9. 根据权利要求3或8所述的背光模组，其特征在于，所述长杆包括直径不等的第一部分和第二部分，第一部分的直径等于所述第一通孔和第二通孔的直径，所述第二部分的直径小于所述第一部分的直径。
  10. 根据权利要求8所述的背光模组，其特征在于，所述第二端弯折至最大限度的状态下，所述弹性楔形突起的外侧表面为一平行于所述长杆的平面，两弯折的弹性楔形突起的外侧表面之间的距离等于所述第一通孔和第二通孔的直径。
  11. 根据权利要求10所述的背光模组，其特征在于，两所述弹性楔形突起的凸块的外侧之间的距离大于所述PCB板的第二通孔的直径。
  12. 根据权利要求1所述的背光模组，其特征在于，所述弹性卡固件与每两个所述LED间隔设置。
  13. 根据权利要求1所述的背光模组，其特征在于，所述背板的底板上设有支撑导光板的凸起，其用于使导光板位于与LED相对的高度。
  14. 根据权利要求1所述的背光模组，其特征在于，所述PCB板与背板之间设置有一散热片，所述弹性卡固件依次穿过所述背板、散热片以及PCB板，将所述PCB板与所述背板固定。
  15. 根据权利要求14所述的背光模组，其特征在于，所述背板的底板为平板，所述散热片的底部上相应的位置设有支撑导光板的突起，以使导光板位于与LED相对的高度。
  16. 一种液晶显示器，其包括一液晶显示面板及一背光模组，其特征在于，所述背光模组包括一背板、一导光板、一PCB板以及多个LED，所述背板包括一底板和至少一侧壁，所述导光板位于所述底板上，所述PCB板对应导光板设置于背板的侧壁上，所述多个LED设置于所述PCB板上，其特征在于，所述背光模组进一步包括至少一弹性卡固件，上述至少一弹性卡固件依次穿过所述背板与所述PCB板将该背板与该PCB板固定，且所述弹性卡固件的顶部高出所述LED表面。
  17. 根据权利要求16所述的液晶显示器，其特征在于，所述背板的侧壁上设有至少一第一通孔，所述PCB板上设有至少一对应所述第一通孔的第二通孔，所述弹性卡固件依次穿过所述第一通孔及第二通孔将所述背板与PCB板固定。
  18. 根据权利要求17所述的液晶显示器，其特征在于，所述弹性卡固件包括一底盘、一卡扣以及一连接该底盘与卡扣的长杆，所述底盘位于背板侧壁的一侧，长杆位于上述第一通孔和PCB板的第二通孔中，卡扣位于PCB板的一侧。
  19. 根据权利要求18所述的液晶显示器，其特征在于，所述导光板包括一入光面，所述卡扣包括一顶部，所述顶部的表面高出LED表面，为一与导光板入光面平行的平面。
  20. 根据权利要求19所述的液晶显示器，其特征在于，所述卡扣进一步包括至少一弹性楔形突起，所述至少一弹性楔形突起的一第一端与顶部连接，一第二端为可弹性弯折的自由端。
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